Electroplating device for conducting layer of printed circuit board

Abstract

The invention discloses a printed circuit board conducting layer electroplating device, and particularly relates to the technical field of printed circuit board conducting layer electroplating, the printed circuit board conducting layer electroplating device comprises a base, a mounting rack, an electroplating bath used for containing electroplating liquid and a circuit board fixing rack used for placing a circuit board, and one side of the mounting rack is provided with a central processing unit; a moving mechanism is arranged at the top of the mounting frame and used for controlling the circuit board fixing frame to move up and down, an electroplating liquid adding mechanism and a cooling mechanism are arranged at the top of the base, and the electroplating liquid adding mechanism is used for adding electroplating liquid into the electroplating bath. The cooling mechanism is used for reducing the temperature of electroplating liquid in the electroplating bath; the device further comprises an electroplating liquid height acquisition module, a fixing frame distance acquisition module and a volatilization amount acquisition module. The problem of liquid level drop caused by evaporation of the electroplating liquid is solved, the thickness uniformity of an electroplated layer is ensured, and the electroplating quality stability is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating of a conductive layer of a printed circuit board, and more specifically, to a device for electroplating a conductive layer of a printed circuit board. Background Art

[0002] Printed circuit board (PCB) is a widely used substrate in electronic devices, used to support and connect electronic components. Its function is to transmit electrical signals through a preset conductive path, so that the various components can be electrically connected. The conductive layer on the PCB is usually made of copper, which constitutes the key path for the transmission of electrical signals. However, the copper conductive layer is easily oxidized and corroded when exposed to the air, which affects its conductivity and welding performance. Therefore, the conductive layer needs to be electroplated. Electroplating can not only prevent oxidation, but also improve conductivity, enhance its corrosion resistance and welding reliability, and extend the service life of the circuit board. Common electroplating methods include tin plating, gold plating, silver plating, nickel plating, etc. These metals have excellent corrosion resistance and conductivity. Through electrolytic reaction, metal ions are deposited on the surface of the conductive layer from the electroplating solution to form a uniform protective coating, so that the PCB can maintain excellent electrical properties and mechanical strength in long-term use, thereby ensuring the reliable operation of the equipment.

[0003] The prior art has the following deficiencies: During the long-term electroplating operation, the temperature of the electroplating solution gradually increases, and part of the electroplating solution will evaporate due to the high temperature. Due to the evaporation of the electroplating solution, the liquid level in the electroplating tank drops, making the immersion depth of the circuit board in the electroplating solution shallower, thereby affecting the thickness of the electroplating layer. Especially in the case of high-precision electroplating, the drop in the electroplating liquid level will lead to insufficient electroplating in the upper area of ​​the circuit board, forming a conductive layer with uneven thickness. However, the existing electroplating device for the conductive layer of a printed circuit board does not have an effective liquid level automatic replenishment and evaporation control mechanism, and cannot replenish the evaporated electroplating solution in time, which will cause inconsistent thickness of the electroplating layer, affecting the conductivity and surface quality of the circuit board, and may even cause poor welding of electronic components or reduced electrical performance, increasing the rework rate and scrap rate.

[0004] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0005] In order to overcome the above defects of the prior art, the present invention provides a printed circuit board conductive layer electroplating device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: A printed circuit board conductive layer electroplating device comprises a base, a mounting frame, an electroplating tank for containing electroplating liquid, and a circuit board fixing frame for placing the circuit board, a central processing unit is installed on one side of the mounting frame, a moving mechanism is arranged on the top of the mounting frame, the moving mechanism is used to control the circuit board fixing frame to move up and down, and an electroplating liquid adding mechanism and a cooling mechanism are arranged on the top of the base, the electroplating liquid adding mechanism is used to add electroplating liquid into the electroplating tank, and the cooling mechanism is used to reduce the temperature of the electroplating liquid in the electroplating tank; Also includes: The electroplating liquid height acquisition module is set on the inner wall of the electroplating tank to obtain the actual height of the electroplating liquid inside the electroplating tank in real time and transmit it to the central processing unit after acquisition; The fixture distance acquisition module is arranged on one side of the circuit board fixture, and is used to obtain in real time the actual distance between the top of the circuit board fixture and the bottom wall of the electroplating tank when the circuit board is immersed in the electroplating liquid, and to generate a coefficient of the liquid level change relative to the fixture distance through the central processor; The volatilization amount collection module is arranged at the top of the electroplating tank, and is used to obtain the actual volatilization amount of the electroplating solution contained in the electroplating tank in real time, and generate the volatilization rate coefficient of the electroplating solution through the central processing unit; The central processing unit performs a comprehensive analysis on the generated liquid level change relative fixed frame distance coefficient and the plating liquid volatilization rate coefficient to generate an evaluation coefficient. The evaluation coefficient is compared with a preset evaluation coefficient reference threshold to determine whether the volatilization rate of the plating liquid contained in the plating tank will affect the electroplating of the conductive layer of the circuit board, and the working states of the moving mechanism, the plating liquid adding mechanism and the cooling mechanism are controlled according to the comparison results.

[0007] Preferably, the moving mechanism includes a motor, a motor fixing block, a gear transmission box, a connecting column, a screw rod, a slider, a connecting plate, a cylinder and a telescopic rod. The bottom of the motor is fixedly connected to the top of the mounting frame through the motor fixing block, the output shaft of the motor is transmission-connected to the input shaft of the gear transmission box, the top of the gear transmission box is fixedly connected to the bottom of the mounting frame through the connecting column, the output shaft of the gear transmission box is transmission-connected to one end of the screw rod, the outer wall of the screw rod is transmission-connected to the inner wall of the slider, one side of the slider is fixedly connected to one side of the connecting plate, the top of the connecting plate is fixedly connected to the bottom of the cylinder, the output shaft of the cylinder is transmission-connected to one end of the telescopic rod, and the other end of the telescopic rod is fixedly connected to the top of the circuit board fixing frame.

[0008] Preferably, the plating liquid adding mechanism includes a plating liquid supply box, a plating liquid transmission pipe, an extraction pump, a plating liquid supply pipe and a fixed block, the bottom of the plating liquid supply box is fixedly connected to the top of the base, the output port of the plating liquid supply box is fixedly connected to one end of the plating liquid transmission pipe, the other end of the plating liquid transmission pipe is fixedly connected to the input port of the extraction pump, the output port of the extraction pump is fixedly connected to one end of the plating liquid supply pipe, and the outer wall of the plating liquid supply pipe is fixedly connected to the inner wall of the fixed block.

[0009] Preferably, the cooling mechanism includes a coolant storage tank, a coolant transmission pipe, a circulation pump and a coolant circulation pipe, the bottom of the coolant storage tank is fixedly connected to the top of the base, the output port of the coolant storage tank is fixedly connected to one end of the coolant transmission pipe, the other end of the coolant transmission pipe is fixedly connected to the input port of the circulation pump, the output port of the circulation pump is fixedly connected to one end of the coolant circulation pipe, and the other end of the coolant circulation pipe is fixedly connected to the input port of the coolant storage tank.

[0010] Preferably, the output end of the central processing unit is electrically connected to the input end of the motor, the input end of the cylinder, the input end of the extraction pump and the input end of the circulation pump, respectively, and the output end and input end of the plating liquid height acquisition module, the output end and input end of the fixed frame distance acquisition module, and the output end and input end of the volatile amount acquisition module are electrically connected to the input end and output end of the central processing unit, respectively.

[0011] Preferably, the logic for obtaining the distance coefficient of the liquid level change relative to the fixed frame is: S1. The actual height of the plating solution in the plating tank at different times within the time T is obtained through the plating solution height acquisition module, and the actual height of the plating solution in the plating tank at different times within the time T is calibrated as , Indicates that within T time The actual height of the plating solution inside the plating tank at the moment, , is a positive integer; S2, the actual distance between the top of the circuit board fixing frame and the bottom wall of the electroplating tank when the circuit board is immersed in the electroplating solution is obtained by the fixing frame distance acquisition module, and after obtaining, it is calibrated as ; S3, the actual height of the electroplating solution inside the electroplating tank at different times within T time. Create a collection and label it as , then the set , will be collected Greater than The actual height of the plating solution inside the plating tank is recalibrated to , Representing a collection Greater than The actual height of the plating solution inside the plating tank. , ,and is a positive integer; S4. Calculate the coefficient of liquid level change relative to the fixed frame distance. The calculation expression is: In the formula, is the coefficient of liquid level change relative to the fixed frame distance.

[0012] Preferably, the logic for obtaining the electroplating solution volatilization rate coefficient is: S1. The actual volatilization amount of the plating solution contained in the plating tank at different times within the time T is obtained through the volatilization amount collection module, and the actual volatilization amount of the plating solution contained in the plating tank at different times within the time T is calibrated as , is the number of the actual volatilization amount of the plating solution contained in the plating tank at different times within the time T, , is a positive integer; S2. Calculate the volatilization rate coefficient of the plating solution. The calculation expression is: In the formula, is the evaporation rate coefficient of the plating solution.

[0013] Preferably, the evaluation coefficient is expressed as: Formula analysis is performed through the central processing unit according to the formula: In the formula, is the evaluation coefficient, and are preset proportional coefficients of the liquid level change relative to the fixed frame distance coefficient and the plating liquid evaporation rate coefficient, respectively, and and Both are greater than 0.

[0014] Preferably, the preset evaluation coefficient reference threshold is set to , the central processor calculates the evaluation coefficient and the pre-set reference threshold of the evaluation coefficient Compare and determine whether the volatilization rate of the plating solution contained in the plating tank will affect the plating of the conductive layer of the circuit board, and control the working state of the moving mechanism, the plating solution adding mechanism and the cooling mechanism according to the comparison results. The specific judgment is as follows: when When the evaporation rate of the plating solution contained in the plating tank does not affect the plating of the conductive layer of the circuit board, a normal signal is generated. After receiving the normal signal, the central processing unit generates a holding signal and a standby signal respectively, and transmits the holding signal to the motor and the cylinder respectively. After the motor and the cylinder receive the holding signal, they control the moving mechanism to perform the holding work, and transmit the standby signal to the extraction pump and the circulation pump respectively. After receiving the standby signal, the extraction pump and the circulation pump respectively control the plating solution adding mechanism and the cooling mechanism to perform the standby work; when When the electroplating liquid in the electroplating tank evaporates, the evaporation rate will affect the electroplating of the conductive layer of the circuit board and generate an abnormal signal. After receiving the abnormal signal, the central processing unit will generate a movement signal, an addition signal and a cooling signal respectively, and transmit the movement signal to the motor and the cylinder respectively. After receiving the movement signal, the motor and the cylinder control the movement mechanism to move, and transmit the addition signal to the extraction pump. After receiving the addition signal, the extraction pump controls the electroplating liquid adding mechanism to add, and transmits the cooling signal to the circulation pump. After receiving the cooling signal, the circulation pump controls the cooling mechanism to cool.

[0015] Technical effects and advantages of the present invention: 1. The present invention realizes real-time monitoring and adjustment of the temperature and liquid level of the electroplating solution by introducing a variety of automatic control mechanisms, effectively solving the problem of liquid level drop due to evaporation during the electroplating process. By setting a moving mechanism, an electroplating solution adding mechanism, and a cooling mechanism, the system can automatically adjust the immersion depth of the circuit board, replenish the electroplating solution, and adjust the temperature of the electroplating solution according to the volatilization rate and liquid level change of the electroplating solution, thereby ensuring that the circuit board is always under the best electroplating conditions. This fully automatic adjustment mechanism reduces manual intervention and improves the stability and accuracy of the electroplating process.

[0016] 2. The present invention can accurately determine the influence of the liquid level and temperature in the electroplating tank on the electroplating process through real-time data collection and analysis of the sensor module, including the calculation of the electroplating solution volatilization rate coefficient and the liquid level change relative to the fixed frame distance coefficient. This real-time feedback mechanism can dynamically adjust the key parameters in the electroplating process according to the changes in the electroplating solution through the control of the central processor, ensuring that measures are taken immediately when the electroplating solution evaporates too quickly or the liquid level drops, so as to ensure the thickness consistency and surface quality of the electroplated layer.

[0017] 3. The present invention significantly improves the automation level of the electroplating process and solves the problem of uneven thickness of the electroplating layer through precise data monitoring and feedback mechanism. It can not only maintain the stability of electroplating quality, but also reduce rework and scrap rate, improve production efficiency, and extend the service life of the equipment. It is particularly suitable for high-precision electroplating occasions, ensuring the uniformity and high-quality output of the conductive layer of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings; Figure 1 A schematic diagram of the three-dimensional structure of a printed circuit board conductive layer electroplating device proposed by the present invention; Figure 2 A schematic diagram of the top structure of a printed circuit board conductive layer electroplating device proposed by the present invention; Figure 3 This is a schematic diagram of the front structure of a printed circuit board conductive layer electroplating device proposed by the present invention; Figure 4 This is a schematic diagram of the installation structure of a circuit board fixing frame, a moving mechanism and a fixing frame distance acquisition module of a printed circuit board conductive layer electroplating device proposed by the present invention; Figure 5 A schematic diagram of the structure of a plating solution adding mechanism of a printed circuit board conductive layer electroplating device proposed by the present invention; Figure 6 This is a schematic diagram of the installation structure of the electroplating liquid adding mechanism and the cooling mechanism of the electroplating device for the conductive layer of a printed circuit board proposed by the present invention; Figure 7 The present invention is a schematic diagram of a module of a printed circuit board conductive layer electroplating device.

[0019] In the figure: 1. base; 2. mounting frame; 3. plating tank; 4. circuit board fixing frame; 5. central processing unit; 6. moving mechanism; 601. motor; 602. motor fixing block; 603. gear transmission box; 604. connecting column; 605. screw rod; 606. slider; 607. connecting plate; 608. cylinder; 609. telescopic rod; 7. plating liquid adding mechanism; 701. plating liquid supply box; 702. plating liquid transmission pipe; 703. extraction pump; 704. plating liquid supply pipe; 705. fixing block; 8. cooling mechanism; 801. coolant storage box; 802. coolant transmission pipe; 803. circulation pump; 804. coolant circulation pipe; 9. plating liquid height acquisition module; 10. fixed frame distance acquisition module; 11. volatile amount acquisition module. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example like Figure 1-7As shown, a conductive layer electroplating device for a printed circuit board comprises a base 1, a mounting frame 2, a plating tank 3 for containing a plating solution, and a circuit board fixing frame 4 for placing a circuit board, a central processing unit 5 is installed on one side of the mounting frame 2, a moving mechanism 6 is arranged on the top of the mounting frame 2, and the moving mechanism 6 is used to control the circuit board fixing frame 4 to move up and down, and a plating solution adding mechanism 7 and a cooling mechanism 8 are respectively arranged on the top of the base 1, and the plating solution adding mechanism 7 is used to add plating solution into the plating tank 3, and the cooling mechanism 8 is used to reduce the temperature of the plating solution in the plating tank 3; Also includes: The electroplating liquid height acquisition module 9 is provided on the inner wall of the electroplating tank 3 and is used to obtain the actual height of the electroplating liquid inside the electroplating tank 3 in real time and transmit it to the central processor 5 after obtaining; It should be noted that the plating liquid height acquisition module 9 can be an ultrasonic liquid level sensor or other equipment that can obtain the actual height of the plating liquid inside the plating tank 3 in real time. The plating liquid height acquisition module 9 is not specifically limited here and can be selected according to actual needs.

[0022] The fixed frame distance acquisition module 10 is arranged on one side of the circuit board fixed frame 4, and is used to obtain in real time the actual distance between the top of the circuit board fixed frame 4 and the inner bottom wall of the electroplating tank 3 when the circuit board is immersed in the electroplating liquid, and generate a liquid level change relative fixed frame distance coefficient through the central processor 5; It should be noted that the fixed frame distance acquisition module 10 can be a laser ranging sensor or other equipment that can obtain in real time the actual distance between the top of the circuit board fixing frame 4 and the bottom wall of the electroplating tank 3 when the circuit board is immersed in the plating solution. The fixed frame distance acquisition module 10 is not specifically limited here and can be selected according to actual needs.

[0023] The volatilization amount acquisition module 11 is arranged at the top of the electroplating tank 3, and is used to obtain the actual volatilization amount of the plating solution contained in the electroplating tank 3 in real time, and generate the volatilization rate coefficient of the plating solution through the central processor 5; It should be noted that the volatile amount collection module 11 can be a humidity sensor combined with a temperature sensor or other equipment that can obtain the actual volatile amount of the plating liquid contained in the plating tank 3 in real time. The volatile amount collection module 11 is not specifically limited here and can be selected according to actual needs.

[0024] The central processing unit 5 performs a comprehensive analysis on the generated liquid level change relative fixed frame distance coefficient and the plating liquid volatilization rate coefficient to generate an evaluation coefficient. The evaluation coefficient is compared with a preset evaluation coefficient reference threshold to determine whether the volatilization rate of the plating liquid contained in the plating tank 3 will affect the electroplating of the conductive layer of the circuit board, and the working states of the moving mechanism 6, the plating liquid adding mechanism 7 and the cooling mechanism 8 are controlled according to the comparison result.

[0025] In this embodiment, the moving mechanism 6 includes a motor 601, a motor fixing block 602, a gear transmission box 603, a connecting column 604, a screw rod 605, a slider 606, a connecting plate 607, a cylinder 608 and a telescopic rod 609. The bottom of the motor 601 is fixedly connected to the top of the mounting frame 2 through the motor fixing block 602, the output shaft of the motor 601 is transmission-connected to the input shaft of the gear transmission box 603, the top of the gear transmission box 603 is fixedly connected to the bottom of the mounting frame 2 through the connecting column 604, the output shaft of the gear transmission box 603 is transmission-connected to one end of the screw rod 605, the outer wall of the screw rod 605 is transmission-connected to the inner wall of the slider 606, one side of the slider 606 is fixedly connected to one side of the connecting plate 607, the top of the connecting plate 607 is fixedly connected to the bottom of the cylinder 608, the output shaft of the cylinder 608 is transmission-connected to one end of the telescopic rod 609, and the other end of the telescopic rod 609 is fixedly connected to the top of the circuit board fixing frame 4.

[0026] It should be noted that the gear transmission box 603 can transmit the rotational kinetic energy output by the motor 601 to the screw 605 through the cooperation of its internal gears. The specific way of cooperation of its internal gears is not specifically limited here, as long as it can meet specific needs. The moving mechanism 6 is used to control the circuit board fixing frame 4 to move up and down, and the specific implementation method is as follows: since the output shaft of the motor 601 is connected to the input shaft of the gear transmission box 603, the motor 601 can transmit the output rotational kinetic energy to the gear transmission box 603 through its output shaft, and the gear transmission box 603 can transmit the output rotational kinetic energy of the motor 601 to the screw rod 605 through the cooperation of its internal gears, thereby driving the screw rod 605 to rotate, and the outer wall of the screw rod 605 is connected to the inner wall of the slider 606, thereby driving the slider 60 6 moves up and down, because one side of the slider 606 is fixedly connected to one side of the connecting plate 607 and the top of the connecting plate 607 is fixedly connected to the bottom of the cylinder 608, the cylinder 608 can be driven to move up and down, and the output shaft of the cylinder 608 is transmission-connected to one end of the telescopic rod 609 and the other end of the telescopic rod 609 is fixedly connected to the top of the circuit board fixing frame 4, so that the circuit board fixing frame 4 can be driven to move up and down, and the cylinder 608 can also drive the circuit board fixing frame 4 to move up and down by controlling the telescopic rod 609 to extend and retract.

[0027] The significance of this arrangement is that the mobile mechanism 6 arranged in this way has the function of accurately controlling the up and down movement of the circuit board fixing frame 4, which is of great significance for solving the problem that the liquid level drops due to the evaporation of the plating solution during the electroplating process, thereby affecting the immersion depth of the circuit board and the uneven thickness of the electroplating layer. The motor 601 drives the screw rod 605 to rotate, and the slider 606 can move up and down along the screw rod 605, further driving the connecting plate 607, the cylinder 608 and the telescopic rod 609 to adjust the height of the circuit board fixing frame 4. When the liquid level of the electroplating solution drops due to evaporation, the mobile mechanism 6 can quickly adjust the depth of the circuit board immersion to ensure that the circuit board is always in the appropriate electroplating solution. At the same time, the cylinder 608 can adjust the height of the circuit board more finely through the telescopic rod 609 to ensure that the consistency of the electroplating quality is maintained when the thickness of the electroplating layer is required to be high. Through such an arrangement, the mobile mechanism 6 can dynamically respond to the change of the electroplating liquid level, and cooperate to realize the control mechanism of automatic liquid replenishment and cooling, so as to ensure that the problem of uneven thickness of the electroplating layer and decreased conductivity in the technical problem is solved, and further improve the accuracy and reliability of the overall electroplating process.

[0028] In this embodiment, the plating liquid adding mechanism 7 includes a plating liquid supply box 701, a plating liquid transmission pipe 702, an extraction pump 703, a plating liquid supply pipe 704 and a fixed block 705. The bottom of the plating liquid supply box 701 is fixedly connected to the top of the base 1, the output port of the plating liquid supply box 701 is fixedly connected to one end of the plating liquid transmission pipe 702, the other end of the plating liquid transmission pipe 702 is fixedly connected to the input port of the extraction pump 703, the output port of the extraction pump 703 is fixedly connected to one end of the plating liquid supply pipe 704, and the outer wall of the plating liquid supply pipe 704 is fixedly connected to the inner wall of the fixed block 705.

[0029] It should be noted that several fixing blocks 705 are provided here, which are mainly used to fix the plating liquid supply pipe 704 to ensure that the plating liquid supply pipe 704 can maintain a stable state when the extraction pump 703 adds plating liquid into the plating tank 3 through the plating liquid supply pipe 704, so as to avoid the plating liquid splashing around the plating tank 3 due to shaking, thereby avoiding unnecessary cost losses.

[0030] The plating liquid adding mechanism 7 is used to add plating liquid into the plating tank 3, and the specific implementation method is as follows: since the output port of the plating liquid supply box 701 is fixedly connected to one end of the plating liquid transmission pipe 702 and the other end of the plating liquid transmission pipe 702 is fixedly connected to the input port of the extraction pump 703, the extraction pump 703 can extract the plating liquid inside the plating liquid supply box 701 through the plating liquid transmission pipe 702, and then spray the plating liquid into the plating tank 3 through the plating liquid supply pipe 704 fixedly connected to its output port, thereby realizing the addition of plating liquid into the plating tank 3.

[0031] The significance of this arrangement is that the significance of the electroplating liquid adding mechanism 7 arranged in this way is that it can automatically and accurately add electroplating liquid to the inside of the electroplating tank 3, solving the problem of liquid level drop caused by liquid evaporation during the electroplating process. The evaporation of the electroplating liquid will cause the liquid level to drop, making the circuit board immersion depth shallower, affecting the uniformity and thickness of the electroplating layer, especially in high-precision electroplating occasions, causing the problem of uneven conductive layer. Through the coordinated action of the electroplating liquid supply box 701, the extraction pump 703, the electroplating liquid transmission pipe 702 and the electroplating liquid supply pipe 704, the electroplating liquid can be automatically extracted from the electroplating liquid supply box 701 and accurately transported to the electroplating tank 3, replenishing the electroplating liquid lost due to evaporation in real time, and maintaining the stability of the liquid level. At the same time, the mechanism is used in conjunction with other control modules such as temperature control, liquid level monitoring, and moving mechanisms, and can quickly and automatically add electroplating liquid when the liquid level drops or the temperature rises to cause evaporation, ensuring that the circuit board is always at the optimal electroplating depth, thereby improving the electroplating quality, reducing rework and scrap rate, and solving the problems of uneven thickness of the electroplating layer and decreased conductivity.

[0032] In this embodiment, the cooling mechanism 8 includes a coolant storage tank 801, a coolant transmission pipe 802, a circulation pump 803 and a coolant circulation pipe 804. The bottom of the coolant storage tank 801 is fixedly connected to the top of the base 1, the output port of the coolant storage tank 801 is fixedly connected to one end of the coolant transmission pipe 802, the other end of the coolant transmission pipe 802 is fixedly connected to the input port of the circulation pump 803, the output port of the circulation pump 803 is fixedly connected to one end of the coolant circulation pipe 804, and the other end of the coolant circulation pipe 804 is fixedly connected to the input port of the coolant storage tank 801.

[0033] The cooling mechanism 8 is used to reduce the temperature of the electroplating liquid inside the electroplating tank 3. The specific implementation method is as follows: since the output port of the coolant storage tank 801 is fixedly connected to one end of the coolant transmission pipe 802 and the other end of the coolant transmission pipe 802 is fixedly connected to the input port of the circulation pump 803, the circulation pump 803 can extract the coolant stored in the coolant storage tank 801, and then transmit the extracted coolant to the coolant circulation pipe 804 through the coolant circulation pipe 804 fixedly connected to its output port. Since the other end of the coolant circulation pipe 804 is fixedly connected to the input port of the coolant storage tank 801, the coolant passing through the coolant circulation pipe 804 can be returned to the coolant storage tank 801, thereby achieving the circulation flow of the coolant, thereby realizing the low temperature of the coolant to reduce the temperature of the electroplating liquid inside the electroplating tank 3.

[0034] The significance of this arrangement is that the cooling mechanism 8 arranged in this way is that it can reduce the temperature of the electroplating solution inside the electroplating tank 3 through the circulation of the coolant, and prevent the electroplating solution from evaporating rapidly due to the increase in temperature during the long-term electroplating operation. Evaporation will cause the level of the electroplating solution to drop, thereby affecting the immersion depth of the circuit board, especially in high-precision electroplating occasions, which will cause uneven thickness of the electroplating layer, affecting the conductivity and surface quality. Through the cooperation of the coolant storage box 801, the circulating pump 803 and the coolant circulation pipe 804, the coolant can circulate between the coolant storage box 801 and the electroplating tank 3, continuously taking away the heat in the electroplating solution, maintaining the stability of the temperature of the electroplating solution, and avoiding the occurrence of excessive evaporation. This cooling mechanism 8 works in coordination with other modules such as liquid level monitoring, electroplating solution adding mechanism, etc., and can dynamically respond to the temperature change of the electroplating solution, ensuring that the electroplating process is carried out at the optimal temperature, thereby effectively solving the problems of uneven thickness of the electroplating layer and decreased conductivity, reducing the rework rate and scrap rate, and further improving the accuracy and reliability of the electroplating process.

[0035] In this embodiment, the output end of the central processor 5 is electrically connected to the input end of the motor 601, the input end of the cylinder 608, the input end of the extraction pump 703, and the input end of the circulation pump 803, respectively. The output end and input end of the plating liquid height acquisition module 9, the output end and input end of the fixed frame distance acquisition module 10, and the output end and input end of the volatile amount acquisition module 11 are electrically connected to the input end and output end of the central processor 5 respectively. It should be noted that electrical connection refers to the process of transmitting electric current from one part of an electronic device or circuit to another part through conductive materials or conductive elements. This connection is a key component of the operation of electronic devices and circuits. It ensures the effective transmission and connection of electron flow in electronic devices. Electrical connection can be made using wires. The electrical connection method between the central processing unit 5 and the motor 601, cylinder 608, extraction pump 703, circulation pump 803, plating liquid height acquisition module 9, fixed frame distance acquisition module 10 and volatile amount acquisition module 11 is not specifically limited and can be selected according to actual needs.

[0036] During the long-term electroplating operation, the temperature of the electroplating solution gradually increases, and part of the electroplating solution will evaporate due to the high temperature. Due to the evaporation of the electroplating solution, the liquid level in the electroplating tank 3 drops, making the immersion depth of the circuit board in the electroplating solution shallower, thereby affecting the thickness of the electroplating layer. Especially in the case of high-precision electroplating, the drop in the electroplating liquid level will lead to insufficient electroplating in the upper area of ​​the circuit board, forming a conductive layer with uneven thickness. However, the existing electroplating device for the conductive layer of a printed circuit board does not have an effective liquid level automatic replenishment and evaporation control mechanism, and cannot replenish the evaporated electroplating solution in time, which will cause inconsistent thickness of the electroplating layer, affecting the conductivity and surface quality of the circuit board, and may even cause poor welding of electronic components or reduced electrical performance, increasing the rework rate and scrap rate. In order to solve the above problems, it is necessary to detect in real time whether the volatilization speed of the plating solution contained in the plating tank 3 will affect the plating of the conductive layer of the circuit board. Once it is detected that the volatilization speed of the plating solution contained in the plating tank 3 will affect the plating of the conductive layer of the circuit board, the system can start the control mechanism in time, automatically adjust the moving mechanism 6 to maintain the appropriate immersion depth of the circuit board, start the plating solution adding mechanism 7 to replenish the plating solution, and reduce the plating solution temperature through the cooling mechanism 8 to slow down the evaporation rate. This setting can dynamically respond to changes in temperature and liquid level during the electroplating process, ensure the thickness consistency of the plating layer, improve the quality of the conductive layer, and reduce the rework rate and scrap rate.

[0037] In this embodiment, the coefficient of liquid level change relative to the fixed frame distance is a quantitative indicator used to measure the change in the height of the electroplating liquid level relative to the height of the circuit board fixing frame 4. By obtaining the difference in the distance between the height of the electroplating liquid and the top of the circuit board fixing frame 4 in real time, the coefficient of liquid level change relative to the fixed frame distance reflects the degree of change of the liquid level relative to the circuit board fixing frame 4. The magnitude of the coefficient of liquid level change relative to the fixed frame distance means the rate of drop in the electroplating liquid level and the change in the immersion depth of the circuit board. A larger coefficient of liquid level change relative to the fixed frame distance indicates that the electroplating liquid level drops faster, which may cause insufficient immersion of the upper area of ​​the circuit board, thereby affecting the thickness uniformity and quality of the electroplated layer. By measuring the coefficient of liquid level change relative to the fixed frame distance, it is possible to evaluate whether the evaporation rate of the electroplating liquid has reached a level that has a negative impact on the electroplating of the conductive layer of the circuit board, and help determine whether it is necessary to start the moving mechanism 6, the electroplating liquid adding mechanism 7 and the cooling mechanism 8 to ensure the stability and consistency of the electroplating process.

[0038] The logic for obtaining the coefficient of the liquid level change relative to the fixed frame distance is: S1, the actual height of the electroplating solution in the electroplating tank 3 at different times within the time T is obtained by the electroplating solution height acquisition module 9, and the actual height of the electroplating solution in the electroplating tank 3 at different times within the time T is calibrated as , Indicates that within T time The actual height of the electroplating solution inside the electroplating tank 3 at the moment, , is a positive integer; S2, the actual distance between the top of the circuit board fixing frame 4 and the inner bottom wall of the electroplating tank 3 when the circuit board is immersed in the electroplating solution is obtained by the fixing frame distance acquisition module 10, and after the acquisition, it is calibrated as ; S3, the actual height of the electroplating solution in the electroplating tank 3 at different times during the time T Create a collection and label it as , then the set , the collection Greater than The actual height of the plating solution inside the plating tank 3 is recalibrated as , Representing a collection Greater than The actual height of the electroplating solution inside the electroplating tank 3 is numbered, , ,and is a positive integer; S4. Calculate the coefficient of liquid level change relative to the fixed frame distance. The calculation expression is: In the formula, is the coefficient of liquid level change relative to the fixed frame distance.

[0039] Liquid level change relative to the fixed frame distance coefficient The calculation formula is to accurately measure the change in the plating liquid level relative to the circuit board fixture 4, so as to evaluate the impact of the liquid level drop on the electroplating process. In the formula, all data differences greater than the distance to the circuit board fixture 4 are used. , these differences reflect the changes in the level of the plating solution above the top of the circuit board fixture 4. By summing these differences and weighting them with an exponential function, it is possible to amplify situations where the level changes are large, ensuring that more attention is paid to those level changes that may have a significant impact on the electroplating quality. The use of an exponential function reflects the sensitivity to large level changes and can react quickly to faster level fluctuations. The overall calculation method accurately reflects the impact of the liquid level on the immersion depth of the circuit board during the electroplating process by comprehensively considering the time and the amplitude of the liquid level change, thereby helping to make timely adjustments and ensure the uniformity of the electroplating layer.

[0040] In this embodiment, the plating solution volatilization rate coefficient is a quantitative index used to measure the change in the volatilization speed of the plating solution in the plating tank 3. It calculates the volatilization rate by comparing the actual volatilization amount change of the plating solution at different time points. The size of the volatilization rate coefficient directly reflects the volatilization of the plating solution. A larger value of the plating solution volatilization rate coefficient means that the plating solution evaporates faster in a short time and the liquid level drops more significantly. An increase in the volatilization rate will cause the plating solution level to drop too quickly, thereby affecting the immersion depth of the circuit board, especially in high-precision electroplating, which will cause uneven thickness of the electroplating layer and affect the quality of electroplating. The calculation logic of the plating solution volatilization rate coefficient captures the volatilization trend through the change in volatilization amount at different time points, and determines whether it is necessary to start the moving mechanism 6, the plating solution adding mechanism 7 and the cooling mechanism 8 to prevent electroplating quality problems caused by too low a liquid level.

[0041] The logic for obtaining the evaporation rate coefficient of the plating solution is: S1, obtaining the actual volatilization amount of the plating solution contained in the plating tank 3 at different times within the time T through the volatilization amount collection module 11, and calibrating the actual volatilization amount of the plating solution contained in the plating tank 3 at different times within the time T as , is the number of the actual volatilization amount of the plating solution contained in the plating tank 3 at different times during the time T, , is a positive integer; S2. Calculate the volatilization rate coefficient of the plating solution. The calculation expression is: In the formula, is the evaporation rate coefficient of the plating solution.

[0042] Evaporation rate coefficient of plating solution The calculation formula is designed to accurately evaluate the change in the evaporation rate of the plating solution at different times and smooth the fluctuation of the evaporation amount. Each calculation step in the formula helps to better capture the true situation of the evaporation rate. First, by calculating each time point That is, the actual volatilization amount of the plating solution and the initial time point The differences in the initial values ​​capture the changes in the volatilization rate. Standardization is performed to ensure that the calculated results are relative to the initial state, so that the volatilization rates at different time points can be compared. Then, the square operation is used to eliminate the impact of positive and negative changes, ensuring that all changes are correctly measured and avoid offsetting each other. Finally, by averaging these values ​​and calculating the square root, the impact of data fluctuations on the results can be reduced, resulting in a more stable and overall trend-reflecting electroplating solution volatilization rate coefficient. This calculation method can fully and accurately reflect the changes in the volatilization rate of the electroplating solution, and then help determine whether volatilization affects the quality of the electroplated layer.

[0043] In this embodiment, the expression formula of the evaluation coefficient is: Will and After dimensionless processing, the central processing unit 5 performs a formula analysis according to the formula: In the formula, is the evaluation coefficient, and are preset proportional coefficients of the liquid level change relative to the fixed frame distance coefficient and the plating liquid evaporation rate coefficient, respectively, and and All are greater than 0; From the calculated expression, it can be seen that the larger the liquid level change relative to the fixed frame distance coefficient and the plating solution evaporation rate coefficient are, the greater the evaluation coefficient is. the bigger it is; It should be noted that dimensionless is a process of expressing physical quantities in dimensionless form. This method can eliminate the influence of units on physical problems, making the problem more concise and universal; the preset proportional coefficients of the relative distance coefficient of the liquid level change to the fixed frame and the evaporation rate coefficient of the electroplating solution and In order to more flexibly adapt to different working conditions and environmental changes in actual monitoring, these deviation coefficients can be adjusted according to specific circumstances to improve the performance and applicability of the monitoring system.

[0044] In this embodiment, the preset evaluation coefficient reference threshold is set to , the central processor 5 calculates the evaluation coefficient and the pre-set reference threshold of the evaluation coefficient By comparison, it is determined whether the volatilization rate of the plating solution contained in the plating tank 3 will affect the plating of the conductive layer of the circuit board, and the working states of the moving mechanism 6, the plating solution adding mechanism 7 and the cooling mechanism 8 are controlled according to the comparison result. The specific determination is as follows: when When the evaporation rate of the plating solution contained in the plating tank 3 does not affect the plating of the conductive layer of the circuit board, a normal signal is generated. After receiving the normal signal, the central processing unit 5 generates a holding signal and a standby signal respectively, and transmits the holding signal to the motor 601 and the cylinder 608 respectively. After the motor 601 and the cylinder 608 receive the holding signal, they control the moving mechanism 6 to perform the holding work, and transmit the standby signal to the extraction pump 703 and the circulation pump 803 respectively. After receiving the standby signal, the extraction pump 703 and the circulation pump 803 respectively control the plating solution adding mechanism 7 and the cooling mechanism 8 to perform the standby work; Holding work means that after receiving the holding signal, the motor 601 and the cylinder 608 both stop working, that is, they no longer output kinetic energy, ensuring that the circuit board fixing frame 4 no longer moves and remains in the current position, thereby ensuring that the circuit board placed inside the circuit board fixing frame 4 remains in the current position, that is, controlling the moving mechanism 6 to perform the holding work.

[0045] The purpose of the design of the holding operation is to avoid unnecessary adjustments and movements when the evaporation rate of the plating solution is not enough to affect the electroplating process. By allowing the motor 601 and the cylinder 608 to suspend operation after receiving the holding signal, it is possible to ensure that the circuit board holder 4 remains at the current height and position, and to prevent unnecessary movement from interfering with the accuracy of the electroplating process. This can avoid frequent movement of the circuit board holder 4 when no adjustment is required, ensure uniform thickness of the electroplating layer, reduce mechanical wear and save energy, and maintain the stability of the electroplating process.

[0046] Standby operation means that after receiving the standby signal, the extraction pump 703 and the circulation pump 803 do not work, and then control the plating solution adding mechanism 7 and the cooling mechanism 8 to perform standby operation respectively.

[0047] The standby mode is set to put the extraction pump 703 and the circulation pump 803 into standby mode and stop the operation of the related mechanisms when the plating solution does not need to be replenished or cooled. This design can prevent the plating solution adding mechanism 7 and the cooling mechanism 8 from being started unnecessarily when the plating solution evaporation rate is normal and the liquid level has not dropped to a level that affects the electroplating, thereby reducing energy consumption, extending the life of the equipment, and keeping the entire system running in the best working state. Through such a standby working mode, the system can improve the efficiency of energy and resource utilization while ensuring the quality of electroplating.

[0048] when When the evaporation rate of the plating liquid contained in the plating tank 3 will affect the plating of the conductive layer of the circuit board, generating an abnormal signal. After receiving the abnormal signal, the central processing unit 5 generates a movement signal, an addition signal and a cooling signal respectively, and transmits the movement signal to the motor 601 and the cylinder 608 respectively. After the motor 601 and the cylinder 608 receive the movement signal, they control the moving mechanism 6 to move, and transmit the addition signal to the extraction pump 703. After the extraction pump 703 receives the addition signal, it controls the plating liquid addition mechanism 7 to add, and transmits the cooling signal to the circulation pump 803. After receiving the cooling signal, the circulation pump 803 controls the cooling mechanism 8 to cool.

[0049] Moving work means that after receiving the moving signal, the motor 601 and the cylinder 608 continue to output kinetic energy, and through the mutual cooperation and kinetic energy transmission between the gear transmission box 603, the screw 605, the slider 606, the connecting plate 607 and the telescopic rod 609, the circuit board fixing frame 4 can be controlled to continue to move downward to increase the distance between the circuit board fixing frame 4 and the upper surface of the electroplating liquid inside the electroplating tank 3, that is, the moving mechanism 6 is controlled to perform moving work.

[0050] The significance of the movement is that when the plating liquid evaporates too quickly and the liquid level drops to affect the immersion depth of the circuit board, it is necessary to control the moving mechanism 6 to move the circuit board holder 4 downward to maintain the appropriate immersion depth of the circuit board in the plating liquid. The purpose of this is to ensure that all parts of the circuit board, especially the upper area, can continue to contact sufficient plating liquid to prevent problems such as uneven plating layer thickness and reduced conductivity caused by the drop in liquid level. This adjustment helps to maintain the effect of high-precision electroplating in the case of changes in liquid level.

[0051] The adding work means that after the extraction pump 703 receives the adding signal, the plating liquid inside the plating liquid supply box 701 is extracted through the plating liquid transmission pipe 702, and then the plating liquid is sprayed into the plating tank 3 through the plating liquid supply pipe 704 fixedly connected to its output port, thereby realizing the addition of plating liquid into the plating tank 3, that is, controlling the plating liquid adding mechanism 7 to perform the adding work.

[0052] The purpose of the adding operation is to automatically start the plating solution adding mechanism 7 to replenish the plating solution in the plating tank 3 when it is detected that the plating solution level has dropped significantly due to evaporation. The plating solution level can be quickly restored by extracting the plating solution from the plating solution supply tank 701 and injecting it into the plating tank 3, thereby maintaining the appropriate immersion depth of the circuit board in the plating solution. This process can prevent problems such as uneven plating layer and reduced product quality due to too low a liquid level, and effectively improve the stability and efficiency of the electroplating process.

[0053] Cooling work means: after the circulation pump 803 receives the cooling signal, the coolant stored in the coolant storage tank 801 is extracted, and then the extracted coolant is transmitted to the coolant circulation pipe 804 through the coolant circulation pipe 804 fixedly connected to its output port. Since the other end of the coolant circulation pipe 804 is fixedly connected to the input port of the coolant storage tank 801, the coolant passing through the coolant circulation pipe 804 can be returned to the coolant storage tank 801, thereby achieving the circulation flow of the coolant, so that the temperature of the electroplating liquid inside the electroplating tank 3 can be reduced by the low temperature of the coolant, that is, the cooling mechanism 8 is controlled to perform cooling work.

[0054] The purpose of the cooling operation is to start the cooling mechanism 8 to lower the temperature of the plating solution when it is detected that the temperature of the plating solution is too high and the evaporation rate increases. The circulation of the coolant removes the heat in the plating solution, which can effectively control the temperature and slow down the evaporation rate of the plating solution. This can prevent the plating solution from evaporating too quickly due to the increase in temperature, ensure the stability of the liquid level, and maintain the optimal working temperature of the plating solution, thereby ensuring the quality and consistency of the electroplating process.

[0055] The "pre-set reference threshold of the evaluation coefficient" can be determined by experimental testing, historical data analysis, and process requirements. First, through the electroplating data collected multiple times in actual operation, the corresponding relationship between the volatilization rate and the electroplating quality can be established. For example, under different temperature, humidity, and electroplating time conditions, by comparing the uniformity of the electroplating layer thickness with the volatilization rate coefficient or the liquid level change relative to the fixed frame distance coefficient, the critical point is found, at which the volatilization rate or liquid level change begins to significantly affect the quality of the electroplating layer. Secondly, using historical data analysis, the statistical correlation between the volatilization rate coefficient and the liquid level change coefficient and the electroplating failure cases is summarized to determine a reasonable safety threshold. In addition, the threshold can also be set according to the process requirements. For example, for high-precision electroplating products, the threshold will be set lower to ensure that the electroplating process always remains within a relatively strict control range. Finally, this reference threshold should be calibrated through multiple experiments to ensure that it can be stably applied under different production conditions.

[0056] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters in the formula are set by technicians in this field according to actual conditions.

[0057] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0058] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0059] In the several embodiments provided in the present application, it should be understood that the disclosed overall system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another overall system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0060] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0061] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0062] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A printed circuit board conductive layer electroplating device, comprising a base (1), a mounting frame (2), an electroplating tank (3) for containing an electroplating solution, and a circuit board fixing frame (4) for placing the circuit board, characterized in that: A central processing unit (5) is installed on one side of the mounting frame (2); a moving mechanism (6) is arranged on the top of the mounting frame (2); the moving mechanism (6) is used to control the circuit board fixing frame (4) to move up and down; and a plating liquid adding mechanism (7) and a cooling mechanism (8) are arranged on the top of the base (1); the plating liquid adding mechanism (7) is used to add plating liquid into the plating tank (3); and the cooling mechanism (8) is used to reduce the temperature of the plating liquid in the plating tank (3); Also includes: An electroplating liquid height acquisition module (9) is provided on the inner wall of the electroplating tank (3) and is used to acquire the actual height of the electroplating liquid inside the electroplating tank (3) in real time and transmit the acquired height to the central processing unit (5); A fixed frame distance acquisition module (10) is arranged on one side of the circuit board fixed frame (4) and is used to obtain in real time the actual distance between the top of the circuit board fixed frame (4) and the inner bottom wall of the electroplating tank (3) when the circuit board is immersed in the electroplating liquid, and to generate a liquid level change relative fixed frame distance coefficient through a central processing unit (5); A volatilization amount acquisition module (11) is arranged at the top of the electroplating tank (3) and is used to obtain the actual volatilization amount of the electroplating solution contained in the electroplating tank (3) in real time, and to generate a volatilization rate coefficient of the electroplating solution through a central processing unit (5); The central processing unit (5) performs a comprehensive analysis on the generated liquid level change relative fixed frame distance coefficient and the plating liquid volatilization rate coefficient to generate an evaluation coefficient. The evaluation coefficient is compared with a preset evaluation coefficient reference threshold to determine whether the volatilization rate of the plating liquid contained in the plating tank (3) will affect the plating of the conductive layer of the circuit board, and the working states of the moving mechanism (6), the plating liquid adding mechanism (7) and the cooling mechanism (8) are controlled according to the comparison result.

2. A printed circuit board conductive layer electroplating device according to claim 1, characterized in that: The moving mechanism (6) comprises a motor (601), a motor fixing block (602), a gear transmission box (603), a connecting column (604), a screw rod (605), a slider (606), a connecting plate (607), a cylinder (608) and a telescopic rod (609); the bottom of the motor (601) is fixedly connected to the top of the mounting frame (2) via the motor fixing block (602); the output shaft of the motor (601) is drivingly connected to the input shaft of the gear transmission box (603); the top of the gear transmission box (603) is connected to the mounting frame (2) via the connecting column (604). The bottom of the frame (2) is fixedly connected, the output shaft of the gear transmission box (603) is transmission-connected to one end of the screw rod (605), the outer wall of the screw rod (605) is transmission-connected to the inner wall of the slider (606), one side of the slider (606) is fixedly connected to one side of the connecting plate (607), the top of the connecting plate (607) is fixedly connected to the bottom of the cylinder (608), the output shaft of the cylinder (608) is transmission-connected to one end of the telescopic rod (609), and the other end of the telescopic rod (609) is fixedly connected to the top of the circuit board fixing frame (4).

3. A printed circuit board conductive layer electroplating device according to claim 2, characterized in that: The plating liquid adding mechanism (7) comprises a plating liquid supply box (701), a plating liquid transmission pipe (702), an extraction pump (703), a plating liquid supply pipe (704) and a fixed block (705); the bottom of the plating liquid supply box (701) is fixedly connected to the top of the base (1); the output port of the plating liquid supply box (701) is fixedly connected to one end of the plating liquid transmission pipe (702); the other end of the plating liquid transmission pipe (702) is fixedly connected to the input port of the extraction pump (703); the output port of the extraction pump (703) is fixedly connected to one end of the plating liquid supply pipe (704); and the outer wall of the plating liquid supply pipe (704) is fixedly connected to the inner wall of the fixed block (705).

4. A printed circuit board conductive layer electroplating device according to claim 3, characterized in that: The cooling mechanism (8) comprises a coolant storage box (801), a coolant transmission pipe (802), a circulation pump (803) and a coolant circulation pipe (804); the bottom of the coolant storage box (801) is fixedly connected to the top of the base (1); the output port of the coolant storage box (801) is fixedly connected to one end of the coolant transmission pipe (802); the other end of the coolant transmission pipe (802) is fixedly connected to the input port of the circulation pump (803); the output port of the circulation pump (803) is fixedly connected to one end of the coolant circulation pipe (804); and the other end of the coolant circulation pipe (804) is fixedly connected to the input port of the coolant storage box (801).

5. A printed circuit board conductive layer electroplating device according to claim 4, characterized in that: The output end of the central processing unit (5) is electrically connected to the input end of the motor (601), the input end of the cylinder (608), the input end of the extraction pump (703), and the input end of the circulation pump (803), respectively; the output end and input end of the plating liquid height acquisition module (9), the output end and input end of the fixed frame distance acquisition module (10), and the output end and input end of the volatile amount acquisition module (11) are electrically connected to the input end and output end of the central processing unit (5), respectively.

6. A printed circuit board conductive layer electroplating device according to claim 5, characterized in that: The logic for obtaining the distance coefficient of the liquid level change relative to the fixed frame is: S1. The actual height of the electroplating solution in the electroplating tank (3) at different times within a time T is obtained through the electroplating solution height acquisition module (9), and the actual height of the electroplating solution in the electroplating tank (3) at different times within a time T is calibrated as , Indicates that within T time The actual height of the plating solution inside the plating tank (3) at that moment, , is a positive integer; S2, obtaining the actual distance between the top of the circuit board fixing frame (4) and the inner bottom wall of the electroplating tank (3) when the circuit board is immersed in the electroplating solution through the fixing frame distance acquisition module (10), and calibrating it as ; S3, calculate the actual height of the electroplating solution in the electroplating tank (3) at different times during the time T. Create a collection and label it as , then the set , will be collected Greater than The actual height of the plating solution in the plating tank (3) is recalibrated as , Representing a collection Greater than The actual height of the plating solution inside the plating tank (3), , ,and is a positive integer; S4. Calculate the coefficient of liquid level change relative to the fixed frame distance. The calculation expression is: In the formula, is the coefficient of liquid level change relative to the fixed frame distance.

7. A printed circuit board conductive layer electroplating device according to claim 6, characterized in that: The logic for obtaining the electroplating solution volatilization rate coefficient is: S1. The actual volatilization amount of the plating solution contained in the plating tank (3) at different times within a time T is obtained by using a volatilization amount acquisition module (11), and the actual volatilization amount of the plating solution contained in the plating tank (3) at different times within a time T is calibrated as , is the number of the actual volatilization amount of the plating solution contained in the plating tank (3) at different times during the time T, , is a positive integer; S2. Calculate the volatilization rate coefficient of the plating solution. The calculation expression is: In the formula, is the evaporation rate coefficient of the plating solution.

8. A printed circuit board conductive layer electroplating device according to claim 7, characterized in that: The expression formula of the evaluation coefficient is: The central processing unit (5) performs a formula analysis according to the formula: In the formula, is the evaluation coefficient, and are preset proportional coefficients of the liquid level change relative to the fixed frame distance coefficient and the plating liquid evaporation rate coefficient, respectively, and and Both are greater than 0.

9. A printed circuit board conductive layer electroplating device according to claim 8, characterized in that: The pre-set evaluation coefficient reference threshold is set to , the evaluation coefficient calculated by the central processing unit (5) and the pre-set reference threshold of the evaluation coefficient A comparison is performed to determine whether the volatilization rate of the plating solution contained in the plating tank (3) will affect the plating of the conductive layer of the circuit board, and the working states of the moving mechanism (6), the plating solution adding mechanism (7) and the cooling mechanism (8) are controlled according to the comparison result. The specific determination is as follows: when When the evaporation rate of the plating solution contained in the plating tank (3) does not affect the plating of the conductive layer of the circuit board, a normal signal is generated, and after receiving the normal signal, the central processing unit (5) generates a holding signal and a standby signal respectively, and transmits the holding signal to the motor (601) and the cylinder (608) respectively. After receiving the holding signal, the motor (601) and the cylinder (608) control the moving mechanism (6) to perform the holding operation, and transmit the standby signal to the extraction pump (703) and the circulation pump (803) respectively. After receiving the standby signal, the extraction pump (703) and the circulation pump (803) respectively control the plating solution adding mechanism (7) and the cooling mechanism (8) to perform the standby operation; when When the evaporation rate of the plating solution contained in the plating tank (3) affects the plating of the conductive layer of the circuit board, generating an abnormal signal. After receiving the abnormal signal, the central processing unit (5) generates a movement signal, an addition signal and a cooling signal respectively, and transmits the movement signal to the motor (601) and the cylinder (608) respectively. After receiving the movement signal, the motor (601) and the cylinder (608) control the movement mechanism (6) to move, and transmit the addition signal to the extraction pump (703). After receiving the addition signal, the extraction pump (703) controls the plating solution addition mechanism (7) to add, and transmits the cooling signal to the circulation pump (803). After receiving the cooling signal, the circulation pump (803) controls the cooling mechanism (8) to cool.

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