Monitoring method, system and device in production process of IC (integrated circuit) support plate and storage medium

Through image processing and distance calculation methods, the uniformity of the IC carrier plate electroplating layer is judged, and the problems of low detection efficiency and complexity in the prior art are solved, and high-precision electroplating layer uniformity detection is achieved.

CN119671948AActive Publication Date: 2025-03-21SHENZHEN TECHSTAR PRECISION IND CO LTD
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Patent Information

Application Number
CN202411656249.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-19
Publication Date
2025-03-21
Estimated Expiration
2044-11-19

AI Technical Summary

Technical Problem

The prior art has problems of low efficiency and complex detection in the uniformity detection of IC carrier plate electroplating layer, and it is difficult to meet the needs of efficient and high-precision detection.

Method used

By obtaining the IC carrier plate image data, image contour extraction, contour center point calculation, contour discrete point fitting, the actual and standard distances of the electroplating layer are calculated, and finally the uniformity of the electroplating layer is judged based on the electroplating uniformity coefficient.

Benefits of technology

It realizes efficient detection of uniformity of the IC carrier plate electroplating layer, improves detection accuracy and efficiency, and can accurately identify subtle defects of the electroplating layer.

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Abstract

The invention relates to the field of IC support plates, and discloses a monitoring method, system and device in the IC support plate production process and a storage medium, and the method comprises the steps: obtaining IC support plate image data, carrying out image contour extraction according to the IC support plate image data, obtaining an IC support plate electroplated layer contour, carrying out contour center point calculation according to the IC support plate electroplated layer contour, and obtaining a contour center point; according to the contour center point, contour discrete point fitting is carried out to obtain a contour discrete point set, and according to the contour discrete point set, first electroplated layer distance calculation is carried out to obtain an actual electroplated layer distance; and according to the contour discrete point set, carrying out second electroplated layer distance calculation to obtain an electroplated layer standard distance, according to the actual electroplated layer distance and the electroplated layer standard distance, carrying out electroplating uniformity system calculation to obtain an electroplating uniformity coefficient, and according to the electroplating uniformity coefficient, judging whether the electroplated layer of the IC support plate is uniform or not. According to the method, efficient and accurate uniformity detection of the electroplated layer of the IC support plate can be realized.
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