Heat dissipation module with high-heat-dissipation condensation plate structure
By designing a heat dissipation module with a high heat dissipation condensation plate structure, condensate is collected and transported using a water accumulation tray and water delivery device, and spray cleaning of the cooling module through a cleaning device, the dust adhesion problem is solved and efficient cleaning and resource conservation is achieved.
Patent Information
- Application Number
- CN202411862337.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-03-21
AI Technical Summary
During the cooling process, dust in the air is easily attached to the condenser and other devices of the cooling module, affecting its normal use.
A heat dissipation module with a high heat dissipation condensation plate structure is designed, including a shell, a water accumulation tray, a water supply device and a cleaning device. The condensing plate is equipped with an inlet and an outlet, and the branch pipelines are all arranged on the condensing plate. The water accumulation tray collects condensate water, the water supply device transports the condensate water to the cleaning device, and uses the condensate water to spray and clean the inside of the shell.
By using condensed water to clean the inside of the shell, water resources can be saved, resource waste can be reduced, and dust can be effectively removed to ensure the normal use of the condenser, fan and condensing plate structures.