A server and a main board

Abstract

Embodiments of the present application provide a server and a main control board. The server comprises the main control board, a fan board, a hard disk module and an expansion module. The main control board comprises a processor and a first high-speed connector group and a second high-speed connector group located on two sides of the processor. The first high-speed connector group comprises more high-speed connectors than the second high-speed connector group, and each high-speed connector is connected to the processor. The hard disk module is located on a side of the fan board away from the main control board, and the expansion module is located on a side of the main board away from the fan board. The main control board is installed at a first position or a second position. At the first position, the first high-speed connector group is connected to the hard disk module, and at the second position, the first high-speed connector group is connected to the expansion module. Thus, by adjusting the installation position of the main control board of the server, the position of the high-speed connector on the main control board does not need to be modified, and the requirements of different business configurations, deployments and applications can be flexibly adapted.

Description

Technical Field

[0001] This application relates to the field of server technology, and more particularly to a server and a main control board. Background Technology

[0002] A server consists of a motherboard, baseboard management controller (BMC), network interface card (NIC), hard drives, and power supply. The motherboard includes core components such as the processor and memory, as well as components like high-speed connectors and fan modules. Currently, server designs feature a fixed component layout on the motherboard, a fixed placement of the motherboard within the server, and fixed connections to the power supply, NIC, hard drives, and BMC. This fixed connection method makes it difficult for servers to flexibly adapt to the needs of different business configurations, deployments, and applications. Summary of the Invention

[0003] This application provides a server and a main control board. The main control board of the server can be flexibly adjusted to adapt to the needs of different business configurations, deployments and applications.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] Firstly, embodiments of this application provide a server. The server includes a main control board, a fan board, a hard disk module, and an expansion module. The hard disk module includes multiple hard disks, and the expansion module can be a network interface card module, a data processing unit module, and a neural processing unit (NPU) module, or other components such as a power supply; this application does not specifically limit the type of expansion module.

[0006] The main control board includes a processor, memory, a first signal connector, and a first high-speed connector group and a second high-speed connector group located on either side of the processor. The first high-speed connector group includes a greater number of high-speed connectors than the second high-speed connector group, and each high-speed connector is connected to the processor. A fan board is adjacent to one side of the main control board. The fan board includes a fan and a second signal connector. The first signal connector connects to the server's BMC, and the second signal connector connects to the first signal connector. Thus, the BMC can communicate with the fan and monitor and manage its operating status. The hard drive module is located on the side of the fan board opposite to the main control board, and the expansion module is located on the side of the motherboard opposite to the fan board. The main control board is installed in either a first or second position. In the first position, the first high-speed connector group is positioned close to the fan board and connected to the hard drive module, and the second high-speed connector group is positioned close to the expansion module and connected to it. In the second position, the first high-speed connector group is positioned close to the expansion module and connected to it, and the second high-speed connector group is positioned close to the fan board and connected to the hard drive module.

[0007] In this embodiment, the server can adjust the installation position of the main control board as needed. For example, when expanding the server's storage capacity requires configuring more hard drive modules, the main control board is installed in the first position, with the side having more high-speed connectors connected to the hard drives. When more or stronger expansion capabilities are needed, the main control board is installed in the second position, with the side having more high-speed connectors connected to the network interface card (NIC). Therefore, by adjusting the installation position of the server's main control board, the positions of the high-speed connectors on the main control board do not need to be modified, allowing for flexible adaptation to the needs of different service configurations, deployments, and applications.

[0008] In one specific implementation, the server further includes an expansion board disposed between the main control board and the expansion module; the expansion board includes a baseboard management controller and a third signal connector; the main control board further includes a fourth signal connector; the third signal connector is connected to the baseboard management controller; the third signal connector is connected to the fourth signal connector. That is, in this embodiment, the baseboard management controller is located on the expansion board, and the baseboard management controller can communicate with devices on the main control board and devices on the fan board through the third signal connector and the fourth signal connector.

[0009] In another specific implementation, the main control board also includes a first logic device; for example, the first logic device is a programmable logic device. A first signal connector connects to a second signal connector via the first logic device; the first logic device acquires management signals sent by the baseboard management controller via the first signal connector, and sends these management signals to the fan board via the second signal connector to control the operation of the fan in the fan board; the first logic device acquires fan operation information via the second signal connector, and sends this fan operation information to the baseboard management controller via the first signal connector. By introducing the first logic device, the path length between the baseboard management controller and the fan board can be reduced, signal attenuation and noise interference can be avoided, and the integrity and reliability of signal transmission can be improved.

[0010] In another specific implementation, the main control board also includes a second logic device. This second logic device is connected to a fourth signal connector. It connects to devices on the motherboard, sends operational information from these devices to the baseboard management controller (BMC), and receives control information from the BMC to control the operation of devices on the main control board. Introducing the second logic device enhances communication between the main control board and the BMC, effectively manages and schedules resources on the main control board, ensures coordinated operation between components, avoids resource conflicts or waste, and enables efficient server operation.

[0011] In another specific implementation, the main control board has a third side and a fourth side, with a power connector provided on both sides. In a first position, the power connector on the third side is connected to the power supply; in a second position, the power connector on the fourth side is connected to the power supply. This ensures that the connection between the power supply and the power connector remains constant regardless of the main control board's position, guaranteeing its normal operation.

[0012] Furthermore, the power connectors on the third and fourth sides are interconnected using L-shaped copper busbars.

[0013] In another specific implementation, the server also includes an expansion board positioned between the main control board and the expansion module. The expansion board includes a power connector. In a first position, the power supply is connected to a power connector on a third side via the expansion board's power connector. In a second position, the power supply is connected to a power connector on a fourth side via the expansion board's power connector. The main control board's connection to the power supply via the expansion board allows for easier disconnection when the power supply needs to be replaced or upgraded, without requiring the disassembly of the entire server or main control board. Furthermore, the presence of the expansion board allows for the addition of one or more backup power supplies, improving the server's fault tolerance and reliability.

[0014] In another implementation, the main control board also includes a heatsink, which is located on top of the processor and is at a consistent relative distance to each side of the processor, thereby ensuring consistent heat dissipation from the heatsink.

[0015] Secondly, embodiments of this application provide a server main control board, including a processor, memory, a first signal connector, and a first high-speed connector group and a second high-speed connector group located on opposite sides of the processor.

[0016] The first high-speed connector group contains a greater number of high-speed connectors than the second high-speed connector group; each high-speed connector is connected to the processor.

[0017] A fan board is provided on one side of the main control board, adjacent to the main control board. The fan board includes a fan and a second signal connector. The first signal connector is connected to the baseboard management controller of the server, and the second signal connector is connected to the first signal connector to transmit communication signals between the baseboard management controller and the fan.

[0018] The hard drive module is located on the side of the fan board away from the main control board;

[0019] The expansion module is located on the side of the main control board away from the fan board.

[0020] Depending on the configuration of the hard drive modules and expansion modules in the server, the main control board can be installed in either the first or the second position. In the first position, the first high-speed connector group is located near the fan board and connected to the hard drive module, and the second high-speed connector group is located near the expansion module and connected to the expansion module.

[0021] In the second position, the first high-speed connector group is located near the expansion module and connected to the expansion module, while the second high-speed connector group is located near the fan plate and connected to the hard drive module.

[0022] In one specific implementation, the main control board is connected to the server's expansion board, which is positioned between the main control board and the expansion module. The expansion board includes a baseboard management controller and a third signal connector. The main control board also includes a fourth signal connector, which is connected to the baseboard management controller.

[0023] The third signal connector connects to the fourth signal connector to transmit communication signals between the baseboard management controller and the devices on the main control board and the devices on the fan board. Attached Figure Description

[0024] Figure 1 This application provides a schematic diagram of the structure of a server according to an embodiment of the present application.

[0025] Figure 2 This is a schematic diagram of another server structure provided in an embodiment of this application;

[0026] Figure 3 A schematic diagram of the main control board located in the second position according to an embodiment of this application;

[0027] Figure 4A This is a schematic diagram of the structure of another server provided in an embodiment of this application;

[0028] Figure 4B This is a schematic diagram of another server structure provided in an embodiment of this application;

[0029] Figure 4C A schematic diagram of the structure of a server is provided for an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the structure of another server provided in an embodiment of this application;

[0031] Figure 6 This is a schematic diagram of another server main control board provided in an embodiment of this application. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be described below with reference to the accompanying drawings.

[0033] In the description of the embodiments of this application, the words "exemplary," "for example," or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplary," "for example," or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the words "exemplary," "for example," or "for instance" is intended to present the relevant concepts in a specific manner.

[0034] In the description of the embodiments in this application, the term "and / or" is merely a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, B existing alone, and A and B existing simultaneously. Furthermore, unless otherwise stated, the term "multiple" means two or more. For example, multiple systems refer to two or more systems, and multiple terminals refer to two or more terminals.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The terms "comprising," "including," "having," and their variations all mean "including but not limited to," unless otherwise specifically emphasized.

[0036] As mentioned earlier, a server's motherboard includes core components such as a processor, memory, and high-speed connectors. The processor connects to hard drive modules or expansion modules like network interface cards (NICs) via high-speed connectors. Because the processor's high-speed interfaces are fixed and unevenly distributed across the processor, the positions of the high-speed connectors connecting to these interfaces are also fixed. Furthermore, the main control board's placement within the server is fixed; that is, the motherboard is fixedly connected to the power supply, NIC modules, hard drives, and BMC. This fixed connection method makes it difficult for servers to flexibly adapt to the needs of different business configurations, deployments, and applications.

[0037] In view of the above problems, this application provides a server that is divided into a main control board, a fan board, a hard disk module, and an expansion module. The main control board includes a processor, memory, a high-speed connector, and a signal connector, while the fan board includes a fan and a second signal connector. This decouples the main control board from other components. This decoupling method, on the one hand, allows for adjustment of the main control board's position to adapt to different scenarios, thereby accommodating diverse design requirements and improving design flexibility. On the other hand, rotating the main control board in this application embodiment can reduce the impact on other links.

[0038] The server main control board provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0039] Example 1

[0040] Appendix Figure 1 This is a schematic diagram of the structure of a server provided in an embodiment of this application.

[0041] like Figure 1 As shown, server 100 includes main control board 101, hard disk module 102, expansion module 103 and fan board 104.

[0042] The hard drive module 102 is located on the side of the fan board 104 opposite to the main control board 101. The expansion module 103 is located on the side of the main control board 101 opposite to the fan board 104.

[0043] The hard disk module 102 includes at least one hard disk, which provides storage space for the server 100 to store the server's operating system files, bootloaders, and system files.

[0044] The expansion module 103 includes one or more expansion devices, such as network interface cards (NICs), data processing units (DPUs), or neural processing units (NPUs), etc., which are not specifically limited in this embodiment. The server 100 can add or replace various expansion devices as needed.

[0045] The main control board 101 is the core of the server 100, integrating key components such as processor and memory, and is responsible for coordinating and managing the hardware resources of the server 100.

[0046] In this embodiment of the application, the main control board 101 includes a processor 101-4, a memory 101-3, a first signal connector 101-5, and a first high-speed connector group 101-1 and a second high-speed connector group 101-2 located on opposite sides of the processor 101-4.

[0047] It is understood that the processor 101-4, memory 101-3, first signal connector 101-5, and first high-speed connector group 101-1 and second high-speed connector group 101-2 located on opposite sides of the processor 101-4 are mounted on the main control board 101. When the main control board 101 rotates, the processor 101-4, memory 101-3, first signal connector 101-5, and first high-speed connector group 101-1 and second high-speed connector group 101-2 located on opposite sides of the processor 101-4 also rotate synchronously.

[0048] In this embodiment, the fan board 104 provides heat dissipation for the server 100. The fan board 104 is adjacent to the main control board 101 and directly dissipates heat from key components on the main control board 101, such as the processor 101-4 and memory 101-3, to ensure that the key components of the main control board 101 can still work normally at high temperatures.

[0049] The fan board 104 includes a fan (not shown) and a second signal connector 104-1. The first signal connector 101-5 of the main control board 101 is connected to the second signal connector 104-1, and the first signal connector 101-5 is connected to the server's BMC 106. Thus, communication signals can be transmitted between the BMC 106 and the fan.

[0050] Specifically, the BMC 106 can transmit management signals to the fan through the first signal connector 101-5 and the second signal connector 104-1. These management signals can be fan speed control signals to control the fan speed. They can also be switch control signals to control the fan's start and stop. Furthermore, the management signals can be other signals, such as fault recovery signals. When the BMC 106 detects a fan fault, it sends a fault reset signal to attempt to restore the fan to normal operation. This application does not specifically limit the embodiments.

[0051] The fan can report operating information to the BMC 106 via communication signals from the second signal connector 104-1 and the first signal connector 101-5. This operating information can include temperature, speed, fault information, and status information, etc. This application does not specifically limit the scope of the embodiments.

[0052] It should be noted that the first signal connector 101-5 and the second signal connector 104-1 can be an inter-integrated circuit (I2C) connector or a serial peripheral interface (SPI) connector, etc., which are not specifically limited in this application embodiment.

[0053] Furthermore, such as Figure 2 As shown, the main control board 101 also includes a first logic device 101-6. The first logic device 101-6 is connected to the BMC 106 through a first signal connector 101-5 and a second signal connector 104-1 to transmit communication signals between the BMC and the devices on the fan board.

[0054] The first logic device 101-6 can be a complex programmable logic device (CPLD) or a field-programmable gate array (FPGA), or other control devices such as a controller. This application embodiment does not specifically limit the specific device.

[0055] At this time, BMC 106 can transmit management signals to the fan through the first signal connector 101-5, the first logic device 101-6, and the second signal connector 104-1. The fan reports operating information to BMC 106 through the second signal connector 104-1, the first logic device 101-6, and the first signal connector 101-5. By introducing the first logic device, signal attenuation and noise interference can be reduced, improving the integrity and reliability of signal transmission.

[0056] In the embodiments of this application, the first signal connector and the second signal connector can be the same signal connector or different signal connectors; the embodiments of this application do not specifically limit this.

[0057] The high-speed connector assembly is described below.

[0058] In this embodiment, the first high-speed connector group 101-1 includes n high-speed connectors, and the second high-speed connector group 101-2 includes m high-speed connectors. m > 1, and m is an integer; n > m, and n is an integer. The high-speed connectors in both the first high-speed connector group 101-1 and the second high-speed connector group 101-2 are connected to the processor 101-4. For example, Figure 1 Let's take n=2 and m=4 as an example for illustration.

[0059] Understandable. Figure 1 In the two high-speed connector groups, the number of high-speed connectors can be even, odd, or one odd and one even. The specific number is determined according to the processor design specifications, and this application embodiment does not specifically limit it.

[0060] It should be noted that the distribution of high-speed connectors connected to the processor is determined by the processor's high-speed interfaces. The processor's high-speed interfaces are fixed and unevenly distributed, therefore the relative positions of the high-speed connectors on the main control board 101 are fixed.

[0061] High-speed connectors refer to physical interfaces for transmitting high-speed data signals. High-speed connectors include, but are not limited to, the following connectors: Peripheral Component Interconnect Express (PCIe) connectors, Serial Advanced Technology Attachment (Serial ATA) connectors, etc.

[0062] In this embodiment of the application, the main control board 101 can be installed in two positions, namely the first position and the second position.

[0063] like Figure 1 As shown, at the first position, the first high-speed connector group 101-1 is located near the fan plate 104, and the second high-speed connector group 101-2 is located near the expansion module 103. The high-speed connector in the first high-speed connector group 101-1 is connected to the hard disk module 102, and the high-speed connector in the second high-speed connector group 101-1 is connected to the expansion module 103.

[0064] like Figure 3 The diagram shown is a structural schematic of the main control board located in the second position according to an embodiment of this application. In the second position, the second high-speed connector group 101-2 is disposed near the fan plate 104, and the first high-speed connector group 101-1 is disposed near the expansion module 103. The high-speed connector in the second high-speed connector group 101-1 is connected to the hard disk module 102. The high-speed connector in the first high-speed connector group 101-1 is connected to the expansion module 103. Specifically... Figure 2 As shown.

[0065] It needs to be explained that, Figure 1 The first position shown is where the relative distance between the first high-speed connector group 101-1 of the main control board 101 and the fan board 104 is the smallest, and the relative distance between the second high-speed connector group 101-2 and the expansion module 103 is the smallest. This is only an illustrative representation and can be adjusted as needed in actual use.

[0066] Figure 3 The second position shown is Figure 1 The first position shown is rotated 180°. At this time, the relative distance between the second high-speed connector group 101-2 of the main control board 101 and the fan board 104 is the smallest. The relative distance between the first high-speed connector group 101-1 and the expansion module 103 is also the smallest.

[0067] It needs to be explained that, Figure 3The second position shown is only for illustrative purposes. In actual use, the second position can also be the first position rotated by other angles, such as 120°, 240°, 360°, etc. The specific position can be adjusted according to the needs. This application embodiment does not specifically limit the position.

[0068] In this embodiment, the high-speed connector connects to the expansion module 103 or the hard disk module 102 via a high-speed cable. By connecting the high-speed connector closer to the hard disk module to the hard disk module and the high-speed connector closer to the expansion module to the expansion module, the length of the high-speed cable can be reduced, the high-speed signal transmission path can be shortened, and thus signal transmission delay and signal interference can be reduced.

[0069] In this embodiment of the application, the side where the first high-speed connector group is located is the first side S1, and the side where the second high-speed connector group is located is the second side S2. The first side S1 and the second side S2 are located on the main control board 101, and the first side S1 and the second side S2 are opposite to each other.

[0070] It should be noted that in actual use, the main control board 101 can be installed in either the first or the second position.

[0071] Furthermore, in this embodiment, the main control board 101 also includes a plurality of interconnected power connectors.

[0072] Figure 4A This is a schematic diagram of another server structure provided in an embodiment of this application. Figure 4A As shown, the power connector includes a power connector A on the third side and a power connector B on the fourth side. When the main control board 101 is in the first position, as... Figure 4A As shown, power connector A is connected to power supply 401. When the main control board 101 is in the second position, as... Figure 4B As shown, power connector B is connected to power supply 401. Wherein, Figure 4B This is a schematic diagram of another server structure provided in an embodiment of this application. This ensures the normal operation of the main control board by maintaining the connection between the power supply and the power connector when the main control board is in different locations.

[0073] It should be noted that the first and third sides may be the same or different. The second and fourth sides may be the same or different, and this application does not specifically limit this.

[0074] It needs to be explained that, Figure 4A The number of power connectors shown is two for illustrative purposes only. In actual use, the number can be adjusted as needed, such as four, etc. This application embodiment does not specifically limit the number.

[0075] Power connector A and power connector B can be interconnected using copper busbars. The copper busbars can be cut and bent according to actual needs to adapt to the layout and space constraints of different servers. Furthermore, the number of power connectors can be easily increased or decreased through copper busbar interconnection, improving the scalability of the server main control board 101.

[0076] Furthermore, power connector A and power connector B are interconnected using L-shaped copper busbars.

[0077] In addition, power connectors can also be interconnected using flexible flat cables or multi-core cables, etc. The embodiments of this application do not specifically limit the interconnection method between power connectors.

[0078] In this embodiment, the processor 101-4 and the memory 101-3 are adjacent and can be located in the middle area of ​​the main control board 101 or in other areas, such as the surrounding area. This embodiment does not specifically limit their location. The proximity of the processor 101-4 and the memory 101-3 helps to minimize the signal path between the memory and the processor. A shorter signal path helps reduce signal transmission latency, improves memory access speed, and enhances overall server performance. Furthermore, it facilitates the design and implementation of centralized heat dissipation.

[0079] Furthermore, the server also includes an expansion board for expanding the server's functionality. The expansion board is positioned between the main control board and the expansion module, with the BMC 106 mounted on it. Additionally, the expansion board includes a third signal connector, and the main control board includes a fourth signal connector. The third signal connector connects to the fourth signal connector and is also connected to the baseboard management controller, thereby enabling communication signals between the baseboard management controller and the devices on the main control board and the devices on the fan board.

[0080] Appendix Figure 4C This is a schematic diagram of another server structure provided in an embodiment of this application.

[0081] The server also includes an expansion board 501. The main control board 101 also includes a fourth signal connector 501-2. A third signal connector 501-1 is provided on the expansion board 501. The BMC 106 is located on the expansion board 501.

[0082] In this embodiment of the application, the fourth signal connector 501-2 is connected to the third signal connector 501-1, and the third signal connector 501-1 is connected to the BMC 106.

[0083] The fourth signal connector 501-2 is used to transmit communication signals between the BMC 106 and the components on the motherboard and the components on the fan board.

[0084] For example, the fourth signal connector can send operating information of other devices on the main control board to the BMC 106, and can also receive management signals sent by the BMC 106 to adjust the operation of other devices. The operating information of other devices includes, for example, the operating temperature, operating voltage, and operating current of the processor 101-4.

[0085] For example, the fourth signal connector can directly transmit the operating information collected by the temperature sensor, wind speed sensor, and other acquisition devices on the fan board to the BMC 106. The BMC 106 then sends acquisition commands to the acquisition devices on the fan board via the fourth signal connector.

[0086] Furthermore, the main control board 101 also includes a second logic device. This second logic device is connected to a fourth signal connector. Thus, it sends the operating information of the devices on the main board to the baseboard management controller, and receives control information sent by the baseboard management controller to control the operation of the devices on the main control board.

[0087] It should be noted that the BMC may or may not be located on the expansion board, and this application embodiment does not specifically limit this.

[0088] In this embodiment, the server can adjust the installation position of the main control board as needed. For example, when the server's memory needs to be expanded, the main control board is installed in a first position, with the side with more high-speed connectors connected to the hard drive. When the network speed needs to be increased, the main control board is installed in a second position, with the side with more high-speed connectors connected to the network card module. Thus, by adjusting the server's main control board, the processor can be modified without modifying it, allowing for flexible adaptation to the needs of different service configurations, deployments, and applications.

[0089] In summary, the server provided in this application embodiment is divided into a main control board, a fan board, hard drive modules, and expansion modules. The main control board includes a processor, memory, high-speed connectors, and signal connectors, while the fan board includes a fan and a second signal connector. This decouples core components such as the processor, memory, and high-speed connectors from other components. When expanding the server's storage capacity requires configuring more hard drive modules, the main control board is installed in a first position, with the side with more high-speed connectors connected to the hard drives. When more or stronger expansion capabilities are needed, the main control board is installed in a second position, with the side with more high-speed connectors connected to the network interface card (NIC). Therefore, by adjusting the installation position of the server's main control board, the position of the high-speed connectors on the main control board does not need to be modified, allowing for flexible adaptation to different service configurations, deployments, and application requirements. Furthermore, in this application embodiment, rotating the main control board minimizes the impact on other links.

[0090] Example 2

[0091] In this embodiment, the expansion board may also integrate a power connector or multiple signal connectors, each of which connects to an expansion device. The following description, in conjunction with the accompanying drawings, provides a detailed explanation.

[0092] For ease of explanation, in this embodiment, the main control board 101 includes two processors and three memory modules. The main control board 101 also integrates two power connectors, a first high-speed connector group, and a second high-speed connector group. The first high-speed connector group includes four high-speed connectors, and the second high-speed connector group includes eight high-speed connectors. It also includes three signal connectors (also referred to as signal connectors) for illustration. The expansion module is illustrated using a network card module as an example. Specifically, the example illustrates the need to rotate 180° to switch from the first position to the second position.

[0093] Appendix Figure 5 This is a schematic diagram of another server structure provided in an embodiment of this application. Figure 5 The main control board 101 shown is in the first position.

[0094] In this embodiment, the server 100 includes a main control board 101, an expansion board, a fan board 104, a hard disk module 102, and an expansion module.

[0095] The main control board 101 includes a rotatable substrate 201, a power connector, a high-speed connector, a signal connector, a processor 101-4, and a memory 101-3. The power connector, high-speed connector, signal connector, processor 101-4, and memory 101-3 are all located on the rotatable substrate 201. The rotatable substrate 201 is a centrally symmetrical substrate that can rotate around its center.

[0096] It needs to be explained that, Figure 5 The rectangular rotatable substrate shown is for illustrative purposes only and can be adjusted as needed in actual use. Thus, when the rotatable substrate 201 rotates, it can drive the power connector, high-speed connector, signal connector, processor 101-4, and memory 101-3 to rotate synchronously.

[0097] To better utilize the space on the rotatable substrate and disperse heat sources, the memory 101-3 and processor 101-4 are staggered. Furthermore, this staggered placement minimizes the signal paths between the memory and processor, reducing signal transmission latency and improving memory access speed and overall server performance. It also simplifies the design and implementation of centralized heat dissipation.

[0098] The rotatable base plate 201 is also provided with signal connector K1 (i.e., the first signal connector) and signal connector K2 (i.e., the fourth signal connector). Signal connector K1 is connected to the signal connector (i.e., the second signal connector) of the fan board 104 via an extension cable X1, which is used to connect the main control board 101 and the fan board 104. Through this signal connector, the fan board 104 can receive signals sent by the devices on the main control board 101, specifically management signals of the fan 503, such as adjusting the speed of the fan 503.

[0099] Signal connector K2 connects to the signal connector (i.e., the third signal connector) on the expansion board via extension cable X1, and then connects to BMC 106 via the signal connector on the expansion board. At this point, the main control board 101 can communicate with the BMC 106. For example, the main control board 101 can send information about other devices on the motherboard, such as the processor's operating environment information, and information about the devices on the fan, to the BMC 106. Furthermore, the BMC 106 can also send management information about the devices to the main control board 101 to manage the devices on the main control board 101 and the devices on the fan.

[0100] For example, the main control board 101 receives fan management information sent by the BMC 106, and sends it to the fan board via signal connector K1, extension cable X1, and the signal connector of the fan board 104 to manage the fan. The main control board 101 can also receive fan operation information sent by the fan board 104 via signal connector K1, extension cable X1, and the signal connector of the fan board 104, and send the fan operation information to the BMC 106 via signal connector K2, extension cable X1, and the signal connector of the extension board.

[0101] In this embodiment, the expansion board may have multiple signal connectors, and the main control board 101 includes multiple signal connectors adjacent to the signal connectors of the expansion board. Therefore, the main control board 101 can add expansion modules through the multiple signal connectors on the expansion board.

[0102] For example, Figure 5 Two signal connectors K2 are shown. One signal connector K2 connects to the BMC 106, and the other signal connector K2 connects to other expansion modules. By deploying multiple signal connectors, the main control board 101 supports connection to multiple expansion boards, increasing the scalability and flexibility of the server 100 and enabling it to adapt to diverse application scenarios.

[0103] In this embodiment, the top surface of the main control board 101 includes a central region P0 and two peripheral regions surrounding the central region, namely a first side P1 and a second side P2. Multiple processors 101-4 and multiple memory modules 101-3 are located in the central region P0 of the main control board 101. This design ensures that the signal paths between the processors and memory components and other devices are as short as possible. Short signal paths help reduce signal transmission latency, improve memory access speed, and enhance overall server performance. Furthermore, it facilitates the design and implementation of centralized heat dissipation.

[0104] The first side P1 is located on the first side of the main control board 101, and the second side P2 is located on the third side M3 of the main control board 101. The first side and the third side M3 are opposite sides.

[0105] The first high-speed connector group includes four high-speed connectors C2 located on the first side P1. The second high-speed connector group includes eight high-speed connectors C1 located on the second side P2. Power connector A is located on the third side, and power connector B is located on the fourth side. The third side is the first apex position of the first side P1, and the second side is the second apex position of the second side. The first apex and the second apex are opposite apex angles.

[0106] The server has three power connectors: power connector A, power connector B, and power connector C. Figure 5 The power connector A shown is located near the power connector C on the expansion board, and the power connector C on the expansion board is connected to the power source. Power connector A and power connector B are interconnected using an L-shaped copper busbar 504. Power connector A is located near the power connector C on the expansion board. Power connector A and power connector C are interconnected using a copper busbar 504.

[0107] Therefore, when the rotatable substrate 201 rotates 180°, power connector B and power connector C are interconnected via copper busbar 504. This means that power connector C on the expansion board can be interconnected with either power connector A or B on the main control board to achieve unified power supply. Furthermore, the use of L-shaped copper busbar 504 interconnection reduces mechanical stress and prevents damage to the power connectors. In addition, the L-shaped copper busbar 504 interconnection effectively disperses current and improves system stability.

[0108] In this embodiment, signal connector K1 is located on the first side P1 of the rotatable substrate 201, near the fourth side M4, and signal connector K2 is located on the second side P3 of the rotatable substrate 201, near the third side M3. In this embodiment, when the rotatable substrate 201 is rotated, signal connector K1 remains connected to the signal connector of the fan board 104, and signal connector K2 remains connected to the signal connector of the expansion board. At this time, the length of the expansion cable X1 needs to be adjusted.

[0109] Furthermore, high-speed connector C2 is located on the first side P1, wherein the rotatable substrate 201 is connected to the hard disk module 102 via high-speed connector C2 and high-speed cable XH1. High-speed connector C1 is located on the second side P2, wherein the main control board 101 is connected to the network card module via high-speed connector C1 and high-speed cable XH2.

[0110] For example, if each high-speed connector can achieve 1x high-speed bandwidth, then eight high-speed connectors C1 connect to multiple network interface cards (NICs), enabling high-speed connections between the processor and NICs, thus achieving an overall 8x bandwidth for the server's external network interface. Four high-speed connectors C2 connect to hard drives, enabling processor-hard drive connectivity and providing storage functionality for the entire server, achieving a 4x bandwidth for the overall storage interface.

[0111] In this embodiment of the application, the expansion module includes a BMC 106, a power supply 505, and a network card module.

[0112] The expansion module includes a first sub-expansion module and a second sub-expansion module, wherein the first sub-expansion module is located on top of the second sub-expansion module. For the first sub-expansion module located at the top, the main control board 101 can be directly connected to the first sub-expansion module via a cable. For the second sub-expansion module located at the bottom, the main control board 101 is connected to the second sub-expansion module via an expansion board.

[0113] Exemplary illustration, such as Figure 5 As shown, the first sub-expansion module includes four upper-layer network card modules 103-1. The main control board 101 is connected to the four upper-layer network card modules 103-1 through four high-speed connectors C2 in the second high-speed connector group, and the high-speed cable XH1 corresponding to each high-speed connector C2.

[0114] The second sub-expansion module includes a first lower-layer network interface card (NIC) module 103-3, a second lower-layer NIC module 103-4, a BMC 106, and a power supply module 105. The remaining two high-speed connectors in the second high-speed connector group connect to two high-speed connectors in the expansion board. The two high-speed connectors in the expansion board connect to the first lower-layer NIC module 103-3 and the second lower-layer NIC module 103-4, respectively.

[0115] It needs to be explained that, Figure 5 The high-speed connectors C1 shown are arranged in parallel on the first side P1 and at the same distance from the first side. The high-speed connectors C2 are arranged in parallel on the second side P2 and at the same distance from the third side M3. This is only an illustrative representation. In actual use, they can be adjusted as needed.

[0116] Therefore, high-speed connectors C1 and C2 are located on the first side P1 and the second side P2, respectively, ensuring that the signal paths between them and their corresponding devices (hard drives and network cards) are as short as possible. Short signal paths reduce the risk of signal reflection, crosstalk, and attenuation, improving signal integrity and stability. The parallel arrangement of high-speed connectors C1 and C2 within their respective areas, with equidistant edges, helps ensure neatness and consistency of signal lines, reducing mutual interference between signals. The parallel arrangement of high-speed connectors simplifies PCB routing, reducing routing conflicts and complexity.

[0117] In one example, the main control board 101 also includes a heat sink (not shown in the figure), which is located above the processor 101-4 and is in close contact with the processor 202. A thermally conductive component, such as thermal grease, is typically applied between them to ensure good thermal conductivity. It should be noted that "above" for the processor 101-4 refers to the side facing away from the rotatable substrate 201. Therefore, the heat sink rotates together with the processor 101-4.

[0118] It should be noted that one heatsink is placed above each processor 101-4. In multiple processors 101-4, one heatsink is placed above each processor 101-4 to ensure heat dissipation performance.

[0119] Furthermore, the heatsink is equidistant from each side of the processor 101-4, meaning that the heatsink is located at the very center above the processor, thus ensuring consistent heat dissipation.

[0120] Furthermore, the outgoing directions of high-speed cables XH1 and XH2 are different from those perpendicular to the rotatable substrate 201. Therefore, when the rotatable substrate 201 is rotated, the cable outgoing method remains consistent.

[0121] Regarding the appendix Figure 5 As shown, when the rotatable substrate is rotated 180°, the attached... Figure 6 Appendix Figure 6 This is a schematic diagram of another server main control board provided in an embodiment of this application. The positions of the first side P1 and the second side P2 of the server main control board are interchanged.

[0122] At this point, power connector B is connected to power connector C. High-speed connector C1 is connected to the hard drive via high-speed cable XH1, and high-speed connector C2 is connected to the network card via high-speed cable XH2. At this point, the four high-speed connectors C2 on the first side are connected to the four network cards via high-speed cables XH1. The overall network interface achieves 4 times the bandwidth. The eight high-speed interfaces of machine A in the third zone are connected to the hard drive via high-speed cables XH2, achieving 8 times the bandwidth of the overall storage interface. That is, at this point, the server main control board 101 changes the number of high-speed interfaces connecting to the hard drive and the number of high-speed interfaces connecting to the network card.

[0123] In summary, the server provided in this application embodiment, by setting a rotatable substrate and fixing the processor, memory, high-speed connectors, power connectors, and signal connectors on the rotatable substrate, enables the rotatable substrate to rotate, driving the processor, memory, high-speed connectors, and power connectors to rotate synchronously. By setting multiple high-speed connectors, and arranging them on opposite sides with a different number on each side, the number of high-speed connectors connecting the hard disk module and expansion module can be adjusted when the rotatable main control board rotates to the first and second positions, adapting to different scenarios and thus meeting diverse design requirements and improving design flexibility. Furthermore, by setting two power connectors on the main control board, located at opposite corners, the power supply can still be connected to the power connectors with fewer power connectors when the rotatable main control board rotates 180°, ensuring the normal operation of the main control board. Moreover, by decoupling core components such as the processor, memory, high-speed connectors connected to the processor, and power connectors from other components, this application embodiment reduces the impact on other links when the rotatable substrate rotates.

[0124] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented using software programs, it can be implemented, in whole or in part, as a computer program product. This computer program product includes one or more computer instructions. When these computer instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated.

[0125] The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access, or a data storage device such as a server or data center that integrates one or more available media. The available medium can be magnetic media (e.g., floppy disk, hard disk, magnetic tape), optical media (e.g., digital video disc (DVD)), or semiconductor media (e.g., solid-state drives (SSD)).

[0126] The above are merely preferred embodiments of this application and are not intended to limit the application in any way. Although this application has disclosed preferred embodiments above, it is not intended to limit the application. Any person skilled in the art can make many possible variations and modifications to the technical solutions of this application using the methods and techniques disclosed above, or modify them into equivalent embodiments with equivalent changes, without departing from the scope of the technical solutions of this application. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall still fall within the protection scope of the technical solutions of this application.

Claims

1. A server, characterized in that, include: Main control board, fan board, hard drive module and expansion module; The main control board includes a processor, memory, a first signal connector, and a first high-speed connector group and a second high-speed connector group located on opposite sides of the processor. The first high-speed connector group contains a greater number of high-speed connectors than the second high-speed connector group; each of the high-speed connectors is connected to the processor. The fan board is disposed adjacent to one side of the main control board. The fan board includes a fan and a second signal connector. The first signal connector is connected to the baseboard management controller of the server, and the second signal connector is connected to the first signal connector to transmit communication signals between the baseboard management controller and the fan. The hard disk module is located on the side of the fan plate opposite to the main control board; The expansion module is located on the side of the main control board away from the fan board; The main control board is installed in a first position or a second position. In the first position, the first high-speed connector group is located near the fan board and connected to the hard disk module, and the second high-speed connector group is located near the expansion module and connected to the expansion module. In the second position, the first high-speed connector group is located near the expansion module and connected to the expansion module, and the second high-speed connector group is located near the fan board and connected to the hard disk module.

2. The server according to claim 1, characterized in that, The server further includes an expansion board disposed between the main control board and the expansion module; the expansion board includes the baseboard management controller and a third signal connector; the main control board further includes a fourth signal connector; the third signal connector is connected to the baseboard management controller; The third signal connector is connected to the fourth signal connector to transmit communication signals between the baseboard management controller and the devices on the main control board and the devices on the fan board.

3. The server according to claim 1, characterized in that, The main control board also includes a first logic device; The first signal connector is connected to the second signal connector through the first logic device; The first logic device obtains the management signal sent by the baseboard management controller through the first signal connector, and sends the management signal to the fan board through the second signal connector to control the operation of the fan in the fan board; the first logic device obtains the operation information of the fan through the second signal connector, and sends the operation information of the fan to the baseboard management controller through the first signal connector.

4. The server according to claim 2, characterized in that, The main control board also includes a second logic device; the second logic device is connected to the fourth signal connector; The second logic device is used to connect to the devices on the main control board, send the operating information of the devices on the main control board to the baseboard management controller, and receive the control information sent by the baseboard management controller to control the operation of the devices on the main control board.

5. The server according to claim 1, characterized in that, The main control board has a third side and a fourth side, with a power connector provided on the third side and a power connector provided on the fourth side. In the first position, the power connector on the third side is connected to the power source; in the second position, the power connector on the fourth side is connected to the power source.

6. The server according to claim 5, characterized in that, The power connectors on the third and fourth sides are interconnected using L-shaped copper busbars.

7. The server according to claim 5, characterized in that, The server also includes an expansion board, which is disposed between the main control board and the expansion module, and the expansion board includes a power connector; In the first position, the power supply is connected to the power connector on the third side via the power connector on the expansion board. In the second position, the power supply is connected to the power connector on the fourth side via the power connector on the expansion board.

8. The server according to claim 1, characterized in that, The main control board also includes a heat sink, which is located on top of the processor and is at the same relative distance to each side of the processor.

9. A server main control board, characterized in that, It includes a processor, memory, a first signal connector, and a first high-speed connector group and a second high-speed connector group located on opposite sides of the processor, respectively; The first high-speed connector group contains a greater number of high-speed connectors than the second high-speed connector group; each of the high-speed connectors is connected to the processor. A fan board is provided on one side of the main control board, and the fan board is adjacent to the main control board. The fan board includes a fan and a second signal connector. The first signal connector is connected to the baseboard management controller of the server, and the second signal connector is connected to the first signal connector to transmit communication signals between the baseboard management controller and the fan. The hard disk module is located on the side of the fan board away from the main control board; The main control board has an expansion module on the side opposite to the fan board; The main control board is installed in a first position or a second position. In the first position, the first high-speed connector group is located close to the fan board and connected to the hard disk module, and the second high-speed connector group is located close to the expansion module and connected to the expansion module. In the second position, the first high-speed connector group is located close to the expansion module and connected to the expansion module, and the second high-speed connector group is located close to the fan plate and connected to the hard disk module.

10. The main control board according to claim 9, characterized in that, The main control board is connected to the expansion board of the server, and the expansion board is disposed between the main control board and the expansion module; the expansion board includes the baseboard management controller and a third signal connector; the main control board also includes a fourth signal connector; the third signal connector is connected to the baseboard management controller; The third signal connector is connected to the fourth signal connector to transmit communication signals between the baseboard management controller and the devices on the main control board and the devices on the fan board.

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