A hot stamping film based on digital printing technology and a preparation method and application thereof

Abstract

This invention relates to a hot stamping film based on digital printing technology, its preparation method, and its application, belonging to the field of hot stamping film technology. The hot stamping film of this invention comprises, from bottom to top, a substrate, a release layer, a protective layer, and an adhesive layer. The release layer comprises the following raw materials in parts by weight: 20-30 parts thermoplastic polyurethane resin and 2-4 parts micronized polyethylene wax. The protective layer comprises the following raw materials in parts by weight: 10-20 parts silicone-modified acrylic resin, 5-9 parts fluorine-modified silicone resin, 0.1-0.3 parts drying agent, 0.5-1 part light stabilizer, 0.5-1 part light absorber, and 1-3 parts curing agent. The hot stamping film prepared by this invention has water resistance, shatter resistance, and stain resistance. It offers higher production efficiency and eliminates flowing liquid, ensuring high quality and environmental protection, while also reducing production costs. The hot stamping film based on digital printing of this invention allows for personalized customization, is easy to operate, possesses exquisite patterns printed by thermal sublimation, and also has excellent substrate applicability and adhesion.

Description

Technical Field

[0001] This invention relates to the field of hot stamping film technology, specifically to a hot stamping film based on digital printing technology, its preparation method, and its application. Background Technology

[0002] Hot stamping film is a composite film made by coating a plastic film with a release agent, pigment, and heat-sensitive resin. This coating can be transferred to a substrate under certain temperature and pressure. Therefore, hot stamping film can replace widely used methods such as screen printing, roller printing, spraying, and brushing. For example, the coating of protective layers on furniture and appliances can be replaced by hot stamping technology. The advantages of hot stamping technology include a significantly improved operating environment. Unlike traditional printing techniques, it does not emit large amounts of VOCs and does not require ink drying during the protective adhesion and transfer process.

[0003] Recently, a method for forming acrylonitrile-styrene-acrylate (ASA) thermal transfer film has been used to achieve high-quality finishes on vehicle interior and exterior components. However, using only ASA film during the thermal transfer process makes it difficult to ensure durability, such as water resistance, shatter resistance, and weather resistance. Furthermore, compared to conventional ABS resin, the adhesion between the film and coating is significantly reduced, and the weather resistance is also poor. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention aims to provide a hot stamping film based on digital printing technology, its preparation method, and its application. The hot stamping film prepared by this invention exhibits enhanced water resistance, shatter resistance, and stain resistance, higher production efficiency, and the absence of flowing liquid, ensuring high quality and environmental protection. Furthermore, it can reduce production costs. The digital printing-based hot stamping film of this invention allows for personalized customization, is easy to operate, possesses exquisite sublimation printing patterns, and also exhibits excellent substrate applicability and adhesion.

[0005] The technical solution of the present invention to solve the above-mentioned technical problems is as follows:

[0006] The first objective of this invention is to provide a hot stamping film based on digital printing technology, the hot stamping film comprising, from bottom to top, a substrate, a release layer, a protective layer, and an adhesive layer;

[0007] The release layer comprises the following raw materials in parts by weight: 20-30 parts of thermoplastic polyurethane resin and 2-4 parts of micronized polyethylene wax;

[0008] The protective layer comprises the following raw materials in parts by weight: 10-20 parts of silicone-modified acrylic resin, 5-9 parts of fluorine-modified silicone resin, 0.1-0.3 parts of drying agent, 0.5-1 part of light stabilizer, 0.5-1 part of light absorber, and 1-3 parts of curing agent.

[0009] The beneficial effects of this invention are: it utilizes light stabilizers and light absorbers to simultaneously block short wavelengths to increase weather resistance. Finally, it uses silicone-modified acrylic resin, fluorine-modified silicone resin, and curing agent to enhance the shatter resistance, stain resistance, and water resistance of the hot stamping film.

[0010] Based on the above technical solution, the present invention can be further improved as follows.

[0011] Furthermore, the substrate includes at least one of BOPP film and BOPET film.

[0012] Furthermore, the adhesive layer comprises the following raw materials in parts by weight: 13-15 parts of acrylate-modified chloroacetic acid resin and 5-8 parts of maleic anhydride-modified polypropylene.

[0013] The beneficial effects of adopting the above-mentioned further solution are: the present invention enhances adhesion by mixing maleic anhydride modified polypropylene and acrylate modified chloroacetic acid resin; the adhesive layer will melt at high temperature, so that the hot stamping film can be easily heat-transferred onto the transfer substrate.

[0014] The advantages of adopting the above-mentioned further solution are: the above-mentioned material has low viscosity and stable structure, and the structure on both sides of the release layer can be separated with a small force.

[0015] Furthermore, the organosilicon-modified acrylic resin has an acid value of 3-8 mg KOH / g, a hydroxyl content of 1-4%, a weight-average molecular weight of 10,000-25,000, a glass transition temperature of 55-65℃, and a solid content of 50%-60%.

[0016] Furthermore, the fluorinated silicone resin has an acid value of 0.01~0.04 mg KOH / g; a hydroxyl content of 0.1~0.4%; a weight-average molecular weight of 10000~14000; a glass transition temperature of 75~85℃; and a solid content of 10%~15%.

[0017] The beneficial effects of adopting the above-mentioned further solutions are: silicone-modified acrylic resins within the aforementioned range can minimize membrane tackiness, thereby improving membrane reliability, adhesion, and water resistance. Furthermore, when the solid content of the silicone-modified acrylic resin is less than 50%, it is difficult to achieve membrane reliability. When the content is greater than 60%, adhesion and water resistance may decrease.

[0018] Furthermore, the light stabilizer includes a hindered amine light stabilizer; the light absorber includes a hydroxyphenyl triazine ultraviolet absorber; the drying agent includes at least one of dibutyltin dilaurate and cobalt isooctanoate; and the curing agent is at least one of isophorone diisocyanate trimer and hexamethylene diisocyanate trimer.

[0019] The beneficial effects of adopting the above-mentioned further solutions are: light stabilizers can simultaneously block short wavelengths, thereby enhancing weather resistance. Reactive catalysts increase the reaction rate between the main materials and the curing agent; however, when the light stabilizer content is low, the reaction rate between the main materials and the curing agent may decrease. When the light stabilizer content is high, the pot life is reduced, and therefore processability may deteriorate. The curing agent exhibits excellent non-fading properties and excellent weather resistance.

[0020] The thickness of the substrate is 12~25μm; the thickness of the release layer is 0.1~0.5μm; the thickness of the protective layer is 3~8μm; and the thickness of the adhesive layer is 1.5~3μm.

[0021] The beneficial effects of adopting the above-mentioned further solution are: (1) The substrate layer serves as the basis for hot stamping film coating. During use, it is separated from other structures of the hot stamping film by the release layer, and then the remaining part is attached to the label. If the substrate layer is too thin, it is easy to break and deform during release, which affects the use of the hot stamping film; conversely, if the substrate layer is too thick, the thermal conductivity of the entire hot stamping film is insufficient, resulting in excessively high hot stamping temperature. A substrate layer with a thickness of 12-25μm has uniform adhesion to other parts of the hot stamping film, which can quickly and effectively achieve the above-mentioned release process without affecting the use of the hot stamping film;

[0022] (2) A release layer that is too thin or too thick is not only not conducive to release, but also affects the aesthetics of the hot stamping film itself.

[0023] The second objective of this invention is to provide a method for preparing a hot stamping film based on digital printing technology, comprising the following steps:

[0024] S1: Liquid preparation:

[0025] Release solution: Thermoplastic polyurethane and micronized polyethylene wax are mixed and dissolved together to prepare a release solution for later use; Protective solution: Organosilicon-modified acrylic resin, fluorine-modified organosilicon resin, drier, light stabilizer, light absorber, and curing agent are dissolved in a solvent and mixed together to prepare a protective solution for later use; Adhesive solution: Acrylic ester-modified chloroacetic acid resin and maleic anhydride-modified polypropylene are dissolved in a solvent to prepare an adhesive solution for later use;

[0026] S2: Preparation of release layer: Apply release liquid to one side of the substrate layer and then dry to form release layer; Preparation of protective layer: Apply protective liquid to one side of the release layer away from the substrate layer and then dry to form protective layer; Apply adhesive liquid to one side of the protective layer away from the substrate layer and then dry to form adhesive layer; thereby obtaining hot stamping film.

[0027] The third objective of this invention is to provide an application of hot stamping film based on digital printing technology, which is used for pattern transfer in printed products, plastic products, electronic appliances, etc.

[0028] Furthermore, the specific steps of the transfer are as follows:

[0029] Cover the substrate surface with the hot stamping film, with the patterned side facing up (if it is a blank hot stamping film, the pattern orientation does not need to be considered), start the hot stamping equipment, and perform hot stamping for 1s to 60s at a hot stamping temperature of 130~180℃ and a pressure of 15KN to complete the pattern transfer. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the hot stamping film structure prepared in Example 1 of the present invention.

[0031] The attached diagram lists the components represented by each number as follows:

[0032] 1-Hot stamping film, 10-Release layer, 20-Protective layer, 30-Adhesive layer, 40-Substrate. Detailed Implementation

[0033] The principles and features of this invention are described below. The examples given are for illustrative purposes only and are not intended to limit the scope of the invention. Where specific techniques or conditions are not specified in the embodiments, they should be performed according to the techniques or conditions described in the literature in this field, or according to the product instructions. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased through legitimate channels.

[0034] Example 1: Preparation of Hot Stamping Film

[0035] S1: Preparation Solution: Release Solution: Dissolve 20 parts thermoplastic polyurethane resin (Desmopan 487; Bayer, Germany) and 2 parts micronized polyethylene wax (Honeywell, USA; AC 6A) in 39 parts 2-butanone and 39 parts toluene to prepare a release solution for later use; Protective Solution: Mix 10 parts silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.1 parts drying agent (Cobalt Octoate 8% AkzoNobel, Netherlands), 0.5 parts light stabilizer (BASF; Tinuvin 460), 0.5 parts light absorber (BASF; Tinuvin 479), and 1 part curing agent (Desmodur Z). 4470 (Bayer, Germany) was dissolved in 34.25 parts of 2-butanone and 34.25 parts of toluene to prepare a protective solution for later use; Adhesive solution: 15 parts of acrylate-modified chloroacetic acid resin (Paraloid B-44; Rohm and Haas, USA) and 5 parts of maleic anhydride-modified polypropylene (F-2P; Toyobo, Japan) were dissolved in 40 parts of 2-butanone and 40 parts of toluene to prepare an adhesive solution for later use;

[0036] S2: Preparation of release layer: Apply release liquid to one side of substrate 40 (12.5μm BOPET film (Guangdong Shunming)), and then dry to form a 0.1~0.5μm release layer 10; Preparation of protective layer: Apply protective liquid to one side of release layer 10 away from substrate layer, and then dry to form a 3~8μm protective layer 20; Apply adhesive liquid to one side of protective layer 20 away from substrate layer, and then dry to form a 1.5~3μm adhesive layer 30; thereby obtaining hot stamping film 1.

[0037] Example 2: Preparation of Hot Stamping Film

[0038] In this embodiment, the only difference from Example 1 in preparing the hot stamping film 1 is the change in the amount of raw material for the protective layer 20. The remaining preparation steps, preparation conditions, and material sources are the same as in Example 1. S1 is as follows:

[0039] S1: Preparation solutions: Release solution: Dissolve 20 parts thermoplastic polyurethane resin (Desmopan 487; Bayer, Germany) and 2 parts micronized polyethylene wax (Honeywell, USA; AC 6A) in 39 parts 2-butanone and 39 parts toluene to prepare a release solution for later use; Protective solution: Dissolve 10 parts silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.5 parts light stabilizer (BASF; Tinuvin 460), 0.5 parts light absorber (BASF; Tinuvin 479), and 1 part curing agent (Desmodur Z 4470; Bayer, Germany) in 34.25 parts 2-butanone and 34.25 parts toluene to prepare a protective solution for later use; Adhesive solution: Dissolve 15 parts acrylate-modified chloroacetic acid resin (Paraloid) in 34.25 parts 2-butanone and 34.25 parts toluene to prepare a protective solution for later use; B-44 (Rohm and Haas, USA), 5 parts maleic anhydride modified polypropylene (F-2P (Toyobo, Japan)) were dissolved in 40 parts 2-butanone and 40 parts toluene to prepare an adhesive solution for later use.

[0040] Example 3: Preparation of Hot Stamping Film

[0041] In this embodiment, the only difference from Example 1 in preparing the hot stamping film 1 is the change in the adhesive layer material. The remaining preparation steps, preparation conditions, and material sources are the same as in Example 1. S1 is as follows:

[0042] S1: Preparation Solution: Release Solution: Dissolve 20 parts thermoplastic acrylic resin (MB-2 Boril Chemical) and 2 parts micronized polyethylene wax (Honeywell, USA; AC 6A) in 39 parts 2-butanone and 39 parts toluene to prepare a release solution for later use; Protective Solution: Mix 10 parts silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.1 parts drying agent (Cobalt Octoate 8% AkzoNobel, Netherlands), 0.5 parts light stabilizer (BASF Tinuvin 460), 0.5 parts light absorber (BASF Tinuvin 479), and 1 part curing agent (Desmodur Z). 4470 (Bayer, Germany) is dissolved in 36.5 parts of 2-butanone and 36.5 parts of toluene to prepare a protective solution for later use; Adhesive solution: 20 parts of ternary chloroacetic acid resin (H15 / 45M Wacker, Germany), 5 parts of acrylic modified epoxy resin (A-102 Xieyu New Materials), and 1 part of polyisocyanate curing agent (MHG-80B Asahi Kasei Donade) are dissolved in 37 parts of 2-butanone and 37 parts of toluene to prepare an adhesive solution for later use.

[0043] Example 4: Preparation of Hot Stamping Film

[0044] In this embodiment, the only difference from Example 1 in preparing the hot stamping film 1 is the change in the raw material of the release layer 10. The remaining preparation steps, preparation conditions, and material sources are the same as in Example 1. S1 is as follows:

[0045] S1: Preparation Solution: Release Solution: Dissolve 20 parts thermoplastic polyurethane resin (Desmopan 487; Bayer, Germany) and 2 parts micronized polyethylene wax (Honeywell, USA; AC 6A) in 39 parts 2-butanone and 39 parts toluene to prepare a release solution for later use; Protective Solution: Dissolve 10 parts silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.1 parts drying agent (Dabco T12 Gas Chemical), 0.5 parts light stabilizer (Tinuvin 460), 0.5 parts light absorber (Tinuvin 479), and 1 part curing agent (Desmodur Z 4470; Bayer, Germany) in 36.5 parts 2-butanone and 36.5 parts toluene to prepare a protective solution for later use; Adhesive Solution: Dissolve 15 parts acrylate-modified chloroprene resin (Paraloid) in 36.5 parts 2-butanone and 36.5 parts toluene to prepare a protective solution for later use; B-44 (Rohm and Haas, USA), 5 parts maleic anhydride modified polypropylene (F-2P (Toyobo, Japan)) were dissolved in 40 parts 2-butanone and 40 parts toluene to prepare an adhesive solution for later use.

[0046] Example 5: Preparation of Hot Stamping Film

[0047] In this embodiment, the only difference from Example 1 in preparing the hot stamping film 1 is the change in the raw material of the protective layer 20. The remaining preparation steps, preparation conditions, and material sources are the same as in Example 1. S1 is specifically shown below:

[0048] S1: Preparation Solution: Release Solution: Dissolve 20 parts thermoplastic polyurethane resin (Desmopan 487; Bayer, Germany) and 2 parts micronized polyethylene wax (Honeywell, USA; AC 6A) in 39 parts 2-butanone and 39 parts toluene to prepare a release solution for later use; Protective Solution: Dissolve 10 parts hydroxyl acrylic resin (BA870 Zhanxin), 5 parts fluorine-modified silicone resin (Teflon AF1600; DuPont, USA), 0.1 parts drying agent (Cobalt Octoate 8% AkzoNobel, Netherlands), 0.5 parts light stabilizer (BASF; Tinuvin 460), 0.5 parts light absorber (BASF; Tinuvin 479), and 1 part curing agent (Desmodur Z4470; Bayer, Germany) in 34.25 parts 2-butanone and 34.25 parts toluene to prepare a protective solution for later use; Adhesive Solution: Dissolve 15 parts acrylate-modified chloroacetic acid resin (Paraloid) in 34.25 parts 2-butanone and 34.25 parts toluene to prepare a protective solution for later use; B-44 (Rohm and Haas, USA), 5 parts maleic anhydride modified polypropylene (F-2P (Toyobo, Japan)) were dissolved in 40 parts 2-butanone and 40 parts toluene to prepare an adhesive solution for later use.

[0049] Comparative Example 1: Preparation of Hot Stamping Film

[0050] In this comparative example, the only difference between the hot stamping film 1 and Example 1 is that the release layer 10 and the adhesive layer 30 were not prepared. All other preparation steps, preparation conditions, and material sources are the same as in Example 1.

[0051] Comparative Example 2: Preparation of Hot Stamping Film

[0052] The only difference between this comparative example and Example 1 in preparing the hot stamping film is that the protective layer 20 and the adhesive layer 30 were not prepared. All other preparation steps, preparation conditions, and material sources are the same as in Example 1.

[0053] Comparative Example 3: Preparation of Hot Stamping Film

[0054] In this comparative example, the only difference between the hot stamping film 1 and Example 1 is that the release layer 10 and the protective layer 20 were not prepared. All other preparation steps, preparation conditions, and material sources are the same as in Example 1.

[0055] Comparative Example 4: Preparation of Hot Stamping Film

[0056] In this comparative example, the only difference between the hot stamping film 1 and Example 1 is the raw material of the protective layer 20. The other preparation steps, preparation conditions, and material sources are the same as in Example 1. S1 is shown in detail below:

[0057] S1: Preparation solutions: Release solution: Mix 20 parts of thermoplastic polyurethane resin (Desmopan 487; Bayer, Germany) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) together in 39 parts of 2-butanone and 39 parts of toluene to prepare a release solution for later use; Protective solution: Dissolve 20 parts of ternary chloroacetic acid (H15 / 45M Wacker, Germany), 0.3 parts of plasticizer (A110 Maoheng Chemical), and 0.5 parts of epoxy modified silicone oil (KF-105 Shin-Etsu silicone) together in 39.6 parts of 2-butanone and 39.6 parts of toluene to prepare a protective solution for later use; Adhesive solution: Dissolve 15 parts of acrylate modified chloroacetic acid resin (Paraloid B-44; Rohm and Haas, USA) and 5 parts of maleic anhydride modified polypropylene (F-2P; Toyobo, Japan) in 40 parts of 2-butanone and 40 parts of toluene to prepare an adhesive solution for later use.

[0058] Performance testing:

[0059] Printing tests were conducted using the hot stamping films prepared in Examples 1-5 and Comparative Examples 1-4. The pattern film was transferred to the surface of the substrate by hot stamping transfer under conditions of high temperature (130-180°C) and pressure (15KN).

[0060] (1) Adhesion test: The German BYK cross-cut test was used, and the grade was based on the ISO 2409 cross-cut test standard, as shown in Table 1:

[0061] Table 1 Evaluation Criteria

[0062]

[0063] ② Alcohol resistance friction test

[0064] Referring to GB17497.1-2012, the abrasion resistance of the hot stamping films prepared in Examples 1-5 and Comparative Examples 1-5 was tested using the MCJ-01A abrasion testing machine independently developed and manufactured by Jinan Langguang Electromechanical Technology Co., Ltd. The friction pressure was 20±0.2N, the friction speed was 43 times / min, and the number of abrasion cycles was 40. A lint-free cloth was wrapped around the tip, and alcohol was used to wet the lint-free cloth along the pipeline. The abrasion resistance of the samples was judged visually, and the judgment criteria are shown in Table 2.

[0065] Table 2 Evaluation Criteria

[0066]

[0067] ③ Fracture resistance test

[0068] At a launch distance of 100 mm, a launch angle of 45°, and a launch rate of 5.0 kg f / cm², 2Under the condition of firing pressure, 50g of conditioned gravel (JIS Crushed Gravel No. 7 Stone, 2.5-5mm, 350-400 stone) and a gravel fragmentation tester (Gravelo Meter: Standardized Product SAF J 400) were used for testing, and the judgment criteria are shown in Table 3:

[0069] Table 3 Evaluation Criteria

[0070]

[0071] ④ Water resistance:

[0072] The hot stamping films prepared in Examples 1-5 and Comparative Examples 1-5 were immersed in a water bath at 40±2℃ for 12 hours, and then their appearance was evaluated and their adhesion performance was tested.

[0073] ⑤ Color density:

[0074] The hot stamping film prepared in this embodiment is used to transfer patterns onto white stickers. After printing, the color density of the pattern is measured using an X-Rite i1PRO3 colorimeter, and the color density is taken as the average of 256 points.

[0075] ⑥ Scale resistance test:

[0076] The test sample is fixed on a test rack and exposed to conditions that simulate actual use and are prone to contamination. For example, a mixture of dust, oil, and other common contaminants is placed in a closed container, and the temperature and humidity are controlled within a certain range (temperature 25-35°C, relative humidity 40%-60%), allowing the test sample to be in contact with the contaminants for a certain period of time (e.g., 72 hours).

[0077] After the specified time, remove the test sample and gently wipe its surface with a mild detergent and a soft cloth to simulate a routine cleaning process. Observe and record the amount of dirt residue remaining on the sample surface. The scale resistance performance standards are shown in Table 4:

[0078] Table 4

[0079]

[0080] The above test was repeated three times, and the results are shown in Table 5:

[0081] Table 5

[0082]

[0083] From Table 5, we can obtain:

[0084] The overall performance of the hot stamping films in Examples 1-5 is superior to that of the hot stamping films in Comparative Examples 1-4. The hot stamping films in Comparative Examples 1-3 cannot be transferred. This is because Comparative Example 1 lacks a release layer and an adhesive layer during the preparation of the hot stamping film; Comparative Example 2 lacks a protective layer and an adhesive layer; and Comparative Example 3 lacks a protective layer and a release layer. Therefore, the release layer, protective layer, and adhesive layer in the embodiments of this invention can better improve the adhesion between the hot stamping film layers. The protective layer of the hot stamping film in Comparative Example 4 did not contain a drying agent or a curing agent, resulting in poor resistance to breakage and water.

[0085] In summary, the hot stamping film provided by this invention, when lacking any of its layer structures, exhibits poor performance in terms of coating structure transferability to the substrate, or poor resistance to abrasion, adhesion, alcohol resistance, shatter resistance, and water resistance. Furthermore, it has been confirmed that alcohol resistance significantly deteriorates without the use of curing agents and drying agents.

[0086] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A hot stamping film based on digital printing technology, characterized in that, The hot stamping film includes, from bottom to top, a substrate, a release layer, a protective layer, and an adhesive layer; The release layer comprises the following raw materials in parts by weight: 20-30 parts of thermoplastic polyurethane resin and 2-4 parts of micronized polyethylene wax; The protective layer comprises the following raw materials in parts by weight: 10-20 parts of silicone-modified acrylic resin, 5-9 parts of fluorine-modified silicone resin, 0.1-0.3 parts of drying agent, 0.5-1 part of light stabilizer, 0.5-1 part of light absorber, and 1-3 parts of curing agent. The substrate includes at least one of BOPP film and BOPET film; The adhesive layer comprises the following raw materials in parts by weight: 13-15 parts of acrylate-modified chloroacetic acid resin and 5-8 parts of maleic anhydride-modified polypropylene. The organosilicon-modified acrylic resin has an acid value of 3–8 mg KOH / g, a hydroxyl content of 1–4%, a weight-average molecular weight of 10,000–25,000, a glass transition temperature of 55–65°C, and a solid content of 50%–60%.

2. The hot stamping film based on digital printing technology according to claim 1, characterized in that, The fluorinated modified silicone resin has an acid value of 0.01–0.04 mg KOH / g, a hydroxyl content of 0.1–0.4%, a weight-average molecular weight of 10,000–14,000, a glass transition temperature of 75–85°C, and a solid content of 10%–15%.

3. The hot stamping film based on digital printing technology according to claim 1, characterized in that, The light stabilizer includes hindered amine light stabilizers; the light absorber includes hydroxyphenyl triazine ultraviolet absorbers; the drying agent includes at least one of dibutyltin dilaurate and cobalt isooctanoate; and the curing agent is at least one of isophorone diisocyanate trimer and hexamethylene diisocyanate trimer.

4. The hot stamping film based on digital printing technology according to claim 1, characterized in that, The thickness of the substrate is 12–25 μm; the thickness of the release layer is 0.1–0.5 μm; the thickness of the protective layer is 3–8 μm; and the thickness of the adhesive layer is 1.5–3 μm.

5. A method for preparing a hot stamping film based on digital printing technology according to any one of claims 1 to 4, characterized in that, The preparation method includes the following steps: S1: Liquid preparation: Release solution: Thermoplastic polyurethane and micronized polyethylene wax are mixed and dissolved together to prepare a release solution for later use; Protective solution: Organosilicon-modified acrylic resin, fluorine-modified organosilicon resin, drier, light stabilizer, light absorber, and curing agent are dissolved in a solvent and mixed together to prepare a protective solution for later use; Adhesive solution: Acrylic ester-modified chloroacetic acid resin and maleic anhydride-modified polypropylene are dissolved in a solvent to prepare an adhesive solution for later use; S2: Preparation of release layer: Apply release liquid to one side of the substrate layer and then dry to form release layer; Preparation of protective layer: Apply protective liquid to one side of the release layer away from the substrate layer and then dry to form protective layer; Apply adhesive liquid to one side of the protective layer away from the substrate layer and then dry to form adhesive layer; thereby obtaining hot stamping film.

6. An application of hot stamping film based on digital printing technology, characterized in that, The hot stamping film according to any one of claims 1 to 4 is used in pattern transfer.

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