Manufacturing method of display panel, display panel and display device

Abstract

This application discloses a method for manufacturing a display panel, a display panel, and a display device, relating to the field of display technology. The method for manufacturing the display panel includes: providing an array substrate, the array substrate including a first substrate and a driving circuit layer located on one side of the first substrate, the driving circuit layer including a driving unit; forming a liquid crystal layer and a conductive sealant on the surface of the array substrate away from the first substrate, the conductive sealant containing a charged material, a first orthographic projection of the driving unit on the first substrate covering a second orthographic projection of the conductive sealant on the first substrate; pressing a color filter substrate onto the surface of the liquid crystal layer and the conductive sealant away from the first substrate, wherein the color filter substrate includes a common electrode layer, a third orthographic projection of the common electrode layer on the first substrate covering the second orthographic projection; controlling the driving unit and the common electrode layer to sequentially form electric fields in different directions. Using the above-described method for manufacturing the display panel can eliminate the gaps between the conductive sealant and the array substrate and the color filter substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Technology

[0002] As technology advances, consumers are no longer just looking at the functionality of display products; they are also paying close attention to their appearance. In addition to the color and material of the display itself, the bezel and the thickness of the body have also become factors that consumers consider when purchasing display products.

[0003] Currently, display products often use narrow bezel or bezel-less display panels. However, the sides of narrow bezel or bezel-less display panels are more easily exposed. The frame adhesive of the display panel with related technologies cannot effectively block moisture. Therefore, external moisture can easily enter the interior of the display panel through the frame adhesive, causing corrosion of the internal circuitry and affecting the normal display of the display panel. Summary of the Invention

[0004] The main purpose of this application is to provide a method for manufacturing a display panel, a display panel, and a display device, which aims to solve the problem that the frame adhesive is difficult to effectively block moisture.

[0005] To achieve the above objectives, this application proposes a method for manufacturing a display panel, the method comprising:

[0006] An array substrate is provided, wherein the array substrate includes a first substrate and a driving circuit layer located on one side of the first substrate, the driving circuit layer including driving units;

[0007] A liquid crystal layer and a conductive sealant are formed on the surface of the array substrate away from the first substrate, wherein the conductive sealant is located at the edge of the array substrate and contains charged material inside, and the first orthographic projection of the driving unit on the first substrate covers the second orthographic projection of the conductive sealant on the first substrate;

[0008] A color filter substrate is pressed onto the surface of the liquid crystal layer and the conductive sealant away from the first substrate, wherein the color filter substrate includes a common electrode layer, and the third orthographic projection of the common electrode layer on the first substrate covers the second orthographic projection;

[0009] The driving unit and the common electrode layer are controlled to form electric fields in different directions in sequence, so as to drive the charged material to move in different directions in sequence, thereby eliminating the gaps between the conductive frame adhesive and the array substrate and the color filter substrate respectively.

[0010] In one embodiment, controlling the driving unit and the common electrode layer to sequentially form electric fields in different directions includes:

[0011] A vertical positive electric field is formed between the driving unit and the common electrode layer to drive the charged material to move toward the common electrode layer, thereby eliminating the gap between the conductive frame adhesive and the color filter substrate.

[0012] A vertical reverse electric field is formed between the driving unit and the common electrode layer to drive the charged material to move toward the driving unit, thereby eliminating the gap between the conductive frame adhesive and the array substrate.

[0013] In one embodiment, the method for manufacturing the display panel further includes:

[0014] The driving unit and the common electrode layer are controlled to form a vertical positive electric field to drive the charged material to spread out uniformly.

[0015] In one embodiment, the array substrate includes a first substrate, a driving circuit layer, a planarization layer, conductive electrodes, and a first alignment film; prior to providing the array substrate, the method for manufacturing the display panel further includes:

[0016] Provide the first substrate;

[0017] The driving circuit layer is formed on one side of the first substrate;

[0018] The planarization layer is formed on the side of the driving circuit layer away from the first substrate, wherein the planarization layer has a first opening and a second opening that expose different conductive layers of the driving circuit layer.

[0019] The conductive electrodes are formed on the exposed surfaces of the planarization layer and the driving circuit layer, and the first alignment film is formed on the surface of the planarization layer away from the first substrate, wherein the conductive electrodes are located at adjacent first openings and second openings, respectively.

[0020] In one embodiment, the driving circuit layer includes a first conductive layer, an insulating layer, and a second conductive layer; forming the driving circuit layer on one side of the first substrate includes:

[0021] The first conductive layer is formed on one side of the first substrate, wherein the driving unit is located in the first conductive layer;

[0022] The insulating layer is formed on the exposed surfaces of the first substrate and the first conductive layer;

[0023] A second conductive layer is formed on the side of the insulating layer away from the first substrate.

[0024] In one embodiment, forming a liquid crystal layer and a conductive sealant on the surface of the array substrate away from the first substrate includes:

[0025] A liquid crystal layer is formed on the side of the first alignment mold away from the first substrate;

[0026] A conductive sealant is applied to the surface edge of the planarization layer away from the first substrate.

[0027] In one embodiment, the color filter substrate includes a second substrate, a black matrix layer, a common electrode layer, and a second alignment film; before pressing the color filter substrate onto the surface of the liquid crystal layer and the conductive sealant away from the substrate, the method for manufacturing the display panel further includes:

[0028] Provide the second substrate;

[0029] The black matrix layer is formed on one side of the second substrate;

[0030] The common electrode layer is formed on the side of the black matrix layer away from the second substrate;

[0031] A second alignment film is formed on the surface of the common electrode layer away from the second substrate.

[0032] In one embodiment, the method for manufacturing the display panel further includes:

[0033] After eliminating the gaps between the conductive sealant and the array substrate and the color filter substrate, the conductive sealant is irradiated with ultraviolet light to cool and solidify.

[0034] Secondly, this application also provides a display panel, which is manufactured using the display panel manufacturing method described in the first aspect.

[0035] Thirdly, this application also provides a display device, including a display panel as described in the second aspect.

[0036] The above-described method for manufacturing a display panel first provides an array substrate, and forms a liquid crystal layer and a conductive sealant on the surface of the array substrate away from the first substrate. Then, a color filter substrate is laminated onto the surface of the liquid crystal layer and conductive sealant away from the first substrate to form the overall frame of the display panel. Since the array substrate includes a driving unit, the conductive sealant contains charged material, and the color filter substrate includes a common electrode layer, the first orthographic projection of the driving unit on the first substrate covers the second orthographic projection of the conductive sealant on the first substrate, and the third orthographic projection of the common electrode layer on the first substrate covers the second orthographic projection. Therefore, an electric field can be formed between the driving unit and the common electrode layer, acting on the conductive sealant, to drive the charged material inside the conductive sealant to move. Thus, by controlling the driving unit and the common electrode layer to sequentially form electric fields in different directions, the charged material can be driven to move sequentially in different directions, causing the conductive sealant to move sequentially towards the conductive sealant and the array substrate, respectively eliminating the gaps between the conductive sealant and the array substrate and the color filter substrate, improving the sealing effect of the conductive sealant, and thus preventing external moisture from entering the display panel through the conductive sealant.

[0037] Since the display panel is manufactured using the aforementioned display panel manufacturing method, the conductive frame adhesive has a good sealing effect, which can prevent external moisture from entering the interior of the display panel through the conductive frame adhesive. Therefore, even when the display panel adopts a narrow bezel or bezel-less design, it can still effectively block moisture and ensure the normal display of the display panel. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the cross-sectional structure of the bezel area of ​​a display panel in related technologies;

[0040] Figure 2 This is a flowchart illustrating a method for manufacturing a display panel according to one embodiment of this application;

[0041] Figure 3 This is a schematic diagram of the structure of the array substrate in one embodiment of this application;

[0042] Figure 4 This is a schematic cross-sectional view of the intermediate structure corresponding to step S202 in one embodiment of this application;

[0043] Figure 5This is a schematic cross-sectional view of the intermediate structure corresponding to step S203 in one embodiment of this application;

[0044] Figure 6 This is one of the cross-sectional structural diagrams of the structure corresponding to step S204 in one embodiment of this application;

[0045] Figure 7 This is a second schematic diagram of the cross-sectional structure corresponding to step S204 in one embodiment of this application;

[0046] Figure 8 This is a schematic diagram of the structure of the first large plate in one embodiment of this application;

[0047] Figure 9 This is a schematic cross-sectional view of the display panel in one embodiment of this application;

[0048] Figure 10 This is a schematic diagram of the fabrication process of the array substrate in one embodiment of this application;

[0049] Figure 11 This is a flowchart illustrating step S1002 in one embodiment of this application;

[0050] Figure 12 This is a schematic diagram of the structure of a display device in one embodiment of this application.

[0051] Explanation of icon numbers:

[0052] 11-Water vapor, 20-First large plate, 21-Array substrate, 211-First substrate, 212-Driving circuit layer, 2121-First conductive layer, 21211-Driving unit, 2122-Insulating layer, 2123-Second conductive layer, 213-Planarization layer, 214-Conductive electrode, 215-First alignment film, 22-Liquid crystal layer, 23-Conductive frame adhesive, 23'-Frame adhesive, 231-Adhesive, 232-Charged material, 24-Color filter substrate, 241-Second substrate, 242-Black matrix layer, 243-Common electrode layer, 244-Second alignment film, 25-Driving circuit board, 100-Touch display panel, 1000-Display device.

[0053] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0054] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0055] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0056] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0057] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0058] As described in the background section, with the development of technology to a certain extent, consumers are not only considering the function of display products, but also attach great importance to their appearance. In addition to the color and material of the display product itself, the bezel and the thickness of the body have also become one of the factors that consumers pay attention to when purchasing display products.

[0059] Currently, display products often use narrow bezel or borderless display panels, but the sides of narrow bezel or borderless display panels are more easily exposed, such as... Figure 1 As shown, the display panel of the related technology includes an array substrate 21, a liquid crystal layer 22, a frame adhesive 23', and a color filter substrate 24. Gaps may easily exist between the frame adhesive 23' and the array substrate 21 and the color filter substrate 24. The frame adhesive 23' is difficult to effectively block moisture 11. Therefore, external moisture 11 can easily enter the interior of the display panel through the gap between the frame adhesive 23' and the array substrate 21 or the color filter substrate 24, causing corrosion of the internal circuits of the display panel and resulting in abnormal display of the image on the display panel.

[0060] Based on the aforementioned technical problems, the inventors discovered that by adding a charged material inside the frame adhesive and applying an electric field to the frame adhesive, driving the charged material to move the frame adhesive, the frame adhesive can fill the gaps between the frame adhesive and the array substrate and the color filter substrate, thereby improving the sealing effect of the frame adhesive. Based on this, the inventors further developed the technical solution of the embodiments of this application. Specifically, this application provides a method for manufacturing a display panel, which includes: providing an array substrate, the array substrate including a first substrate and a driving circuit layer located on one side of the first substrate, the driving circuit layer including a driving unit; forming a liquid crystal layer and a conductive sealant on the surface of the array substrate away from the first substrate, the conductive sealant being located at the edge of the array substrate, the conductive sealant containing charged material inside, and a first orthographic projection of the driving unit on the first substrate covering a second orthographic projection of the conductive sealant on the first substrate; pressing a color filter substrate onto the surface of the liquid crystal layer and the conductive sealant away from the first substrate, wherein the color filter substrate includes a common electrode layer, and a third orthographic projection of the common electrode layer on the first substrate covering the second orthographic projection; controlling the driving unit and the common electrode layer to sequentially form electric fields in different directions to drive the charged material to move sequentially in different directions, thereby eliminating the gaps between the conductive sealant and the array substrate and the color filter substrate respectively.

[0061] Since the array substrate includes a driving unit, the conductive frame adhesive contains charged materials, and the color filter substrate includes a common electrode layer, the first orthographic projection of the driving unit on the first substrate covers the second orthographic projection of the conductive frame adhesive on the first substrate, and the third orthographic projection of the common electrode layer on the first substrate covers the second orthographic projection. Therefore, an electric field can be formed between the driving unit and the common electrode layer to act on the conductive frame adhesive, thereby driving the charged materials inside the conductive frame adhesive to move. Thus, by controlling the driving unit and the common electrode layer to form electric fields in different directions in sequence, the charged materials can be driven to move in different directions in sequence, causing the conductive frame adhesive to move in sequence towards the conductive frame adhesive and the array substrate, thereby eliminating the gaps between the conductive frame adhesive and the array substrate and the color filter substrate, improving the sealing effect of the conductive frame adhesive, and thus preventing external moisture from entering the display panel through the conductive frame adhesive.

[0062] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0063] In one embodiment, this application provides a method for manufacturing a display panel. For example... Figure 2 As shown, the method for manufacturing the display panel includes the following steps S201 to S204.

[0064] S201: An array substrate is provided, wherein the array substrate includes a first substrate and a driving circuit layer located on one side of the first substrate, the driving circuit layer including driving units. Related structures can be found in [reference needed]. Figure 3 .

[0065] In applications, the material of the first substrate 211 can be a transparent insulating material; for example, the material of the first substrate 211 can be glass. The first substrate 211 can be a rigid substrate or a flexible substrate.

[0066] The driving circuit layer 212 may include multiple conductive layers, and the driving unit 21211 may be located in one of the conductive layers. Further, the conductive layer may be a conductive metal layer.

[0067] S202: A liquid crystal layer and a conductive sealant are formed on the surface of the array substrate away from the first substrate. The conductive sealant is located at the edge of the array substrate and contains charged material. The first orthographic projection of the driving unit on the first substrate covers the second orthographic projection of the conductive sealant on the first substrate. (See related structure for reference.) Figure 4 .

[0068] It should be noted that a liquid crystal layer 22 can be formed first on the surface of the array substrate 21 away from the first substrate 211, and then a conductive sealant 23 can be formed at the edge of the array substrate 21, so that the conductive sealant 23 surrounds the liquid crystal layer 22. The first orthographic projection covers the second orthographic projection, that is, the first orthographic projection and the second orthographic projection overlap, and the area of ​​the first orthographic projection is not less than the area of ​​the second orthographic projection.

[0069] The conductive frame adhesive 23 may include an adhesive 231 and a charged material 232. The adhesive 231 enables the conductive optical adhesive to have adhesive properties. The adhesive 231 may be a polymer adhesive material, which may include materials based on polyester, polyurethane, epoxy resin, polyether, or siloxane systems. The polymer adhesive material may also include polymers containing fluorine, sulfur, or thiophene. The charged material 232 may be a material that is inherently charged, such as charged particles, or a conductive material that is energized. The charged material 232 may include at least one of conductive particles, conductive polymers, or ionically conductive materials.

[0070] For example, the charged material 232 includes transparent conductive particles, which may include antimony tin oxide, indium tin oxide (ITO), carbon nanotubes, graphene, etc. As another example, the charged material 232 includes a conductive polymer, such as poly(3,4-ethylenedioxythiophene) monomer (PEDOT) or polystyrene sulfonate (PSS). Still as an example, the ionic conductive material may include ionic compounds, such as sodium hydroxide, sodium sulfide, etc.

[0071] S203: A color filter substrate is laminated onto the surface of the liquid crystal layer and conductive sealant away from the first substrate, wherein the color filter substrate includes a common electrode layer, and the third orthographic projection of the common electrode layer on the first substrate covers the second orthographic projection. Related structures can be found in [reference needed]. Figure 5 .

[0072] The common electrode layer 243 is made of a conductive material, which may include indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), indium fluoride oxide (IFO), etc. For example, the common electrode layer 243 is made of ITO.

[0073] S204: The control drive unit and the common electrode layer sequentially form electric fields in different directions to drive the charged materials to move sequentially in different directions, thereby eliminating the gaps between the conductive frame adhesive and the array substrate and the color filter substrate, respectively. The process of eliminating the gaps between the conductive frame adhesive 23 and the array substrate 21 can be found in [reference needed]. Figure 6 For the process of eliminating the conductive frame adhesive 23 from the color filter substrate 24, please refer to [link to relevant documentation]. Figure 7 .

[0074] The driving unit 21211 can be connected to an external driving device. The driving device outputs a control signal to the driving unit 21211, so that the driving unit 21211 and the common electrode layer 243 form a corresponding electric field.

[0075] It is understood that since both the driving unit 21211 and the common electrode layer 243 are conductive, an electric field can be formed between the driving unit 21211 and the common electrode layer 243. Since the first orthographic projection of the driving unit 21211 on the first substrate 211 covers the second orthographic projection of the conductive frame adhesive 23 on the first substrate 211, and the third orthographic projection of the common electrode layer 243 on the first substrate 211 covers the second orthographic projection, an electric field covering the conductive frame adhesive 23 can be formed between the driving unit 21211 and the common electrode layer 243. Since the conductive frame adhesive 23 contains charged material 232, applying an electric field to the conductive frame adhesive 23 can drive the charged material 232 inside the conductive frame adhesive 23 to move. The charged material 232 can drive the colloid of the conductive frame adhesive 23 to move. Thus, by controlling the driving unit 21211 and the common electrode layer 243 to form electric fields in different directions in sequence, the charged material 232 is driven to move in different directions in sequence, and the conductive frame adhesive 23 is driven to move in sequence towards the conductive frame adhesive 23 and the array substrate 21, respectively eliminating the gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24, improving the sealing effect of the conductive frame adhesive 23, and thus preventing external moisture from entering the display panel through the frame adhesive.

[0076] It should be noted that in the application, a first large board comprising multiple array substrates 21 can be fabricated first. Then, a frame adhesive and a liquid crystal layer 22 for each array substrate 21 are formed on the surface of the first large board. A second large board comprising multiple color filter substrates 24 is then pressed onto the conductive frame adhesive 23 and the liquid crystal layer 22 to form a general frame. The driving units 21211 of each array substrate 21 can be connected to the same driving control board. The driving control board provides driving signals to the driving units 21211 of each array substrate 21 to implement the steps of S204 above. After eliminating the gaps between the conductive frame adhesive 23 and the array substrates 21 and the color filter substrates 24, the driving circuit board can be disconnected, and finally, multiple display panels are formed by segmentation. For example, as shown... Figure 8 As shown, the first large plate 20, which is 2600mm long and 2250mm wide, can be cut into three 65-inch and two 55-inch array substrates 21. The driving units 21211 of the five array substrates 21 can be connected to the same driving control board 25. Based on the above steps, five display panels can be formed.

[0077] The above-described method for manufacturing a display panel first provides an array substrate 21, and forms a liquid crystal layer 22 and a conductive sealant 23 on the surface of the array substrate 21 away from the first substrate 211. Then, a color filter substrate 24 is laminated onto the surface of the liquid crystal layer 22 and the conductive sealant 23 away from the first substrate 211 to form the overall frame of the display panel. Since the array substrate 21 includes a driving unit 21211, the conductive sealant 23 contains a charged material 232, and the color filter substrate 24 includes a common electrode layer 243, the first orthographic projection of the driving unit 21211 on the first substrate 211 covers the second orthographic projection of the conductive sealant 23 on the first substrate 211, and the third orthographic projection of the common electrode layer 243 on the first substrate 211 covers the second orthographic projection, an electric field acting on the conductive sealant 23 can be formed between the driving unit 21211 and the common electrode layer 243 to drive the conductive sealant. The charged material 232 inside 23 drives the conductive frame adhesive 23 to move. Therefore, by controlling the driving unit 21211 and the common electrode layer 243 to form electric fields in different directions, the charged material 232 can be driven to move in different directions in sequence, driving the conductive frame adhesive 23 to move in sequence towards the conductive frame adhesive 23 and the array substrate 21, respectively eliminating the gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24, improving the sealing effect of the conductive frame adhesive 23, thereby preventing external moisture from entering the display panel through the conductive frame adhesive 23.

[0078] In one embodiment, such as Figure 6 and Figure 7 As shown, in step S104, the driving unit and the common electrode layer sequentially form electric fields in different directions, including: controlling the driving unit and the common electrode layer to form a vertical positive electric field to drive the charged material to move towards the common electrode layer and eliminate the gap between the conductive frame adhesive and the color filter substrate; and controlling the driving unit and the common electrode layer to form a vertical reverse electric field to drive the charged material to move towards the driving unit and eliminate the gap between the conductive frame adhesive and the array substrate.

[0079] The electric field between the driving unit 21211 and the common electrode layer 243 can be controlled by controlling the control signal transmitted to the driving unit 21211. The electric field parameters can be adjusted by adjusting the control signal.

[0080] It is understandable that since the first orthographic projection covers the second orthographic projection, and the third orthographic projection also covers the second orthographic projection, there is an overlap between the first and third orthographic projections. That is, the driving unit 21211 and the common electrode layer 243 overlap in the vertical direction, and the driving unit 21211 and the common electrode layer 243 can form a vertical electric field. Since the conductive sealant 23 is located between the driving unit 21211 and the common electrode layer 243, the vertical electric field formed by the driving unit 21211 and the common electrode layer 243 can act on the charged material 232 inside the conductive sealant 23. The vertical positive electric field formed between the driving unit 21211 and the common electrode layer 243 can cause the charged material 232 to move in the direction of the common electrode layer 243, thereby driving the sealant to move in the direction of the common electrode layer 243, thus filling the air bubble gap between the conductive sealant 23 and the color filter substrate 24. A vertical reverse electric field is formed between the driving unit 21211 and the common electrode layer 243, which can cause the charged material 232 to move in the direction of the driving unit 21211, thereby driving the colloid to move in the direction of the driving unit 21211, thereby filling the air bubble gap between the conductive frame adhesive 23 and the array substrate 21.

[0081] It should be noted that, in the application, a vertical reverse electric field can also be formed between the driving unit 21211 and the common electrode layer 243 to drive the charged material 232 to move towards the driving unit 21211 and eliminate the gap between the conductive frame adhesive 23 and the array substrate 21; then, a vertical positive electric field can be formed between the driving unit 21211 and the common electrode layer 243 to drive the charged material 232 to move towards the common electrode layer 243 and eliminate the gap between the conductive frame adhesive 23 and the color filter substrate 24.

[0082] In one embodiment, the method for manufacturing the display panel further includes: controlling the formation of a vertical positive electric field between the driving unit and the common electrode layer to drive the charged material to spread uniformly. The relevant structure after the charged material 232 is uniformly spread can be found in [reference needed]. Figure 9 .

[0083] It is understandable that the movement of the colloid driven by the charged material 232 will cause a change in the shape of the conductive colloid. After a perpendicular positive electric field is formed between the control drive unit 21211 and the common electrode layer 243, the positive electric field drives the charged material 232 to move the colloid towards the common electrode layer 243. The colloid will then aggregate towards the common electrode layer 243, forming, for example... Figure 6 The inverted trapezoidal conductive adhesive 23 is shown. After a vertical reverse electric field is formed between the control drive unit 21211 and the common electrode layer 243, the reverse electric field drives the charged material 232 to move the adhesive towards the drive unit 21211. The adhesive then aggregates towards the drive unit 21211, forming, for example... Figure 7The trapezoidal conductive sealant 23 is shown. In the previous embodiment, a vertical positive electric field was first formed between the driving unit 21211 and the common electrode layer 243, and then a vertical reverse electric field was formed between the driving unit 21211 and the common electrode layer 243. Therefore, the adhesive of the conductive sealant 23 would aggregate towards the driving unit 21211. By again controlling the formation of a vertical positive electric field between the driving unit 21211 and the common electrode layer 243, and reasonably controlling the magnitude of the electric field strength and the duration of the electric field, the charged material 232 can be evenly dispersed, driving the conductive sealant 23 to be uniformly distributed as a whole, without being biased towards one side and ultimately forming, for example... Figure 9 The oval-shaped conductive frame adhesive 23 is shown.

[0084] It should be noted that, in the process of eliminating the gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24, if the approach is to first control the driving unit 21211 and the common electrode layer 243 to form a vertical reverse electric field, and then control the driving unit 21211 and the common electrode layer 243 to form a vertical forward electric field, then, correspondingly, this embodiment needs to control the driving unit 21211 and the common electrode layer 243 to form a vertical reverse electric field again, so as to drive the charged material 232 to spread evenly, so that the conductive frame adhesive 23 is uniformly distributed throughout.

[0085] In one embodiment, such as Figure 5 As shown, the array substrate 21 includes a first substrate 211, a driving circuit layer 212, a planarization layer 213, a conductive electrode 214, and a first alignment film 215. Figure 10 As shown, before step S201, the method for manufacturing the display panel further includes the following steps S1001 to S1004.

[0086] S1001: Provides a first substrate.

[0087] S1002: A driving circuit layer is formed on one side of the first substrate.

[0088] The driving circuit layer 212 includes multiple conductive layers. The driving unit 21211 is located in one of the conductive layers, and each signal transmission line is also located in the corresponding conductive layer. The driving unit 21211 and the structure located in the same conductive layer as the driving unit 21211 can be fabricated using the same mask.

[0089] S1003: A planarization layer is formed on the side of the driving circuit layer away from the first substrate, wherein the planarization layer has a first opening and a second opening that expose different conductive layers of the driving circuit layer.

[0090] The planarization layer 213 may be made of an insulating material, for example. The planarization layer 213 is used to planarize and fill the drive circuit layer 212.

[0091] S1004: Conductive electrodes are formed on the exposed surfaces of the planarization layer and the driving circuit layer, and a first alignment film is formed on the surface of the planarization layer away from the first substrate, wherein the conductive electrodes are located at adjacent first openings and second openings, respectively.

[0092] The material of the conductive electrode 214 may include indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), indium fluoride oxide (IFO), etc., and more specifically, the material of the conductive electrode 214 may be ITO. It should be noted that... Figures 5 to 7 as well as Figure 9 The cross-sectional structure shown is a cross-sectional view of the border area. Therefore, the planarization layer 213 has a first opening and a second opening, which expose different conductive layers of the driving circuit layer 212. Continuous conductive electrodes 214 are then formed at the first and second openings, allowing connection between different conductive layers of the driving circuit layer 212, i.e., connecting different signal transmission lines. A first alignment material layer is formed on the surface of the planarization layer 213 away from the substrate. The first alignment material layer is then patterned to form a first alignment film 215, on which a liquid crystal layer 22 can be formed.

[0093] In one embodiment, such as Figure 5 As shown, the driving circuit layer 212 includes a first conductive layer 2121, an insulating layer 2122, and a second conductive layer 2123. Figure 11 As shown, in step S1002, a driving circuit layer 212 is formed on one side of the first substrate 211, including the following steps S1101 to S1103.

[0094] S1101: A first conductive layer is formed on one side of the first substrate, wherein the driving unit is located in the first conductive layer.

[0095] Specifically, a first conductive material layer can be formed on one side of the first substrate 211, and then the first conductive material layer is patterned to form a first conductive layer 2121. The driving unit 21211 and the corresponding signal transmission line are located in the first conductive layer 2121.

[0096] S1102: An insulating layer is formed on the exposed surfaces of the first substrate and the first conductive layer.

[0097] The insulating layer 2122 can be made of inorganic insulating material, such as SiNx.

[0098] S1103: A second conductive layer is formed on the side of the insulating layer away from the first substrate.

[0099] Specifically, a second conductive material layer can be formed on the surface of the insulating layer 2122 away from the substrate, and then the second conductive material layer is patterned to form a second conductive layer 2123. A first opening can expose the first conductive layer 2121, and a second opening can expose the second conductive layer 2123. A signal transmission line located on the first conductive layer 2121 and the second conductive layer 2123 can be connected through a conductive electrode 214. The gate signal line can be located on the first conductive layer 2121, and the data signal line can be located on the second conductive layer 2123.

[0100] In one embodiment, forming a liquid crystal layer and a conductive sealant on the surface of the array substrate away from the substrate includes the steps of: forming a liquid crystal layer on the side of the first alignment mold away from the first substrate; and applying a conductive sealant to the edge of the planarization layer away from the first substrate.

[0101] It should be noted that, in applications, conductive adhesive 23 can also be formed on the surface edge of the planarization layer 213 away from the first substrate 211 by means of film application.

[0102] The first alignment film 215 is made of polyimide, and the polyimide alignment film is coated on the color filter substrate 24 and the array substrate 21 to form an alignment layer. These alignment layers control the alignment direction of liquid crystal molecules through the angle between the branches and the main chain in their polymer molecules, i.e., the so-called pretilt angle. In addition, the interaction between the branched groups of the polymer and the liquid crystal molecules is strong, which has an anchoring effect on the liquid crystal molecules, allowing the liquid crystals to align in the pretilt angle direction, thereby making the display effect more uniform.

[0103] The conductive frame adhesive 23 is applied to the surface edge of the planarization layer 213 away from the substrate. The conductive frame adhesive 23 can seal the edge of the display panel. In the absence of gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24, the conductive frame adhesive 23 can effectively prevent moisture from entering the interior of the display panel.

[0104] In one embodiment, the color filter substrate 24 includes a second substrate 241, a black matrix layer 242, a common electrode layer 243, and a second alignment film 244. Before laminating the color filter substrate onto the surface of the liquid crystal layer and the conductive sealant away from the first substrate, the method for manufacturing the display panel further includes: providing the second substrate 241; forming the black matrix layer 242 on one side of the second substrate 241; forming the common electrode layer 243 on one side of the black matrix layer 242; and forming the second alignment film 244 on the surface of the common electrode layer 243 away from the second substrate.

[0105] The material of the second substrate 241 can also be a transparent insulating material; for example, the material of the second substrate 241 can be glass. The second substrate 241 can be a rigid substrate or a flexible substrate.

[0106] It should be noted that, Figure 7 The border area is a cross-sectional structure, and since the border area is not displayed, a black matrix layer 242 is set in the border area.

[0107] In applications, the common electrode layer 243 can be formed by magnetron sputtering or vapor deposition. The common electrode layer 243 may include multiple interconnected block structures, or it may be a single-layer structure.

[0108] The common electrode layer 243 can be made of a transparent conductive material. For example, the material of the common electrode layer 243 includes indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), indium fluoride oxide (IFO), etc., and further, the material of the common electrode layer 243 can be ITO.

[0109] It is understood that after the color filter substrate 24 is pressed onto the conductive sealant 23 and the liquid crystal layer 22, the common electrode layer 243 will face the conductive sealant 23. An electric field can be formed between the common electrode layer 243 and the driving unit 21211. The electric field is applied to the conductive sealant 23 between the common electrode layer 243 and the driving unit 21211 to drive the conductive sealant 23 to fill the gap between the array substrate 21 and the color filter substrate 24, thereby improving the sealing effect of the conductive sealant 23 and enabling the conductive sealant 23 to effectively prevent moisture from entering the display panel. A second alignment film 244 is formed on the surface of the common electrode layer 243 away from the substrate, with the position of the second alignment film 244 corresponding to the liquid crystal layer 22. This allows the other side of the liquid crystal layer 22 to contact the second alignment film 244. As an alignment layer, the second alignment film 244 can align the liquid crystals according to the pretilt angle direction, thereby making the display effect more uniform.

[0110] It should be noted that the material of the second alignment film 244 can also be polyimide.

[0111] In one embodiment, the method for manufacturing a display panel further includes: after eliminating the gaps between the conductive frame adhesive and the array substrate and the color filter substrate, irradiating the conductive frame adhesive with ultraviolet (UV) light to cool and solidify the conductive frame adhesive.

[0112] It is understandable that during the process of eliminating the gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24, the conductive frame adhesive 23 needs to be kept in a liquid state so that the charged material 232 inside the conductive frame adhesive 23 can drive the movement of the adhesive, causing the adhesive to fill the gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24. After eliminating the gaps between the conductive frame adhesive 23 and the array substrate 21 and the color filter substrate 24, the conductive frame adhesive 23 needs to be maintained in its current state or in its homogenized state, that is, the conductive frame adhesive 23 needs to be cured to ensure that the conductive frame adhesive 23 adheres to the array substrate 21 and the color filter substrate 24, so that the conductive frame adhesive 23 can prevent moisture from entering the interior of the display panel.

[0113] It should be noted that, in applications, thermal curing or photothermal dual curing methods can also be used to cure the conductive frame adhesive 23.

[0114] In one embodiment, this application also provides a display panel, which is manufactured using the display panel manufacturing method of any of the above-described schemes.

[0115] The display panel may include an array substrate 21, a liquid crystal layer 22, a conductive sealant 23, and a color filter substrate 24. The conductive sealant 23 and the liquid crystal layer 22 are located between the array substrate 21 and the color filter substrate 24, respectively. The array substrate 21 includes a first substrate 211 and a driving circuit layer 212 located on one side of the first substrate 211. The driving circuit layer 212 includes a driving unit 21211. The conductive sealant 23 includes a charged material 232. The color filter substrate 24 includes a common electrode layer 243. The first orthographic projection of the driving unit 21211 on the first substrate 211 covers the second orthographic projection of the conductive sealant 23 on the first substrate 211. The third orthographic projection of the common electrode layer 243 on the first substrate 211 covers the second orthographic projection. There is no gap between the conductive sealant 23 and the array substrate 21 and the color filter substrate 24.

[0116] Since the display panel is manufactured using any of the above-mentioned display panel manufacturing methods, the conductive frame adhesive has a good sealing effect, which can prevent external moisture from entering the interior of the display panel through the conductive frame adhesive. Therefore, even when the display panel adopts a narrow bezel or bezel-less design, it can still effectively block moisture and ensure the normal display of the display panel.

[0117] In one embodiment, such as Figure 12As shown, this application also provides a display device 1000, including the display panel 100 as described above. The display device 1000 includes the display panel 100 as described in any of the above embodiments. Therefore, the display device 1000 also has the beneficial effects of the display panel 100 in the above embodiments. The similarities can be understood with reference to the explanation of the display panel 100 above, and will not be repeated below.

[0118] The display device provided in this application embodiment can be... Figure 12 The mobile phone shown can also be any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet, digital camera, smart bracelet, smart glasses, vehicle display, industrial control equipment, medical display, touch interactive terminal, etc. This application embodiment does not make any special limitation in this regard.

[0119] The above description is merely an exemplary embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, The method for manufacturing the display panel includes: An array substrate is provided, wherein the array substrate includes a first substrate and a driving circuit layer located on one side of the first substrate, the driving circuit layer including driving units; A liquid crystal layer and a conductive sealant are formed on the surface of the array substrate away from the first substrate, wherein the conductive sealant is located at the edge of the array substrate and contains charged material inside, and the first orthographic projection of the driving unit on the first substrate covers the second orthographic projection of the conductive sealant on the first substrate; A color filter substrate is pressed onto the surface of the liquid crystal layer and the conductive sealant away from the first substrate, wherein the color filter substrate includes a common electrode layer, and the third orthographic projection of the common electrode layer on the first substrate covers the second orthographic projection; The driving unit and the common electrode layer are controlled to form electric fields in different directions in sequence, so as to drive the charged material to move in different directions in sequence, thereby eliminating the gaps between the conductive frame adhesive and the array substrate and the color filter substrate respectively.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The method of controlling the driving unit and the common electrode layer to sequentially form electric fields in different directions includes: A vertical positive electric field is formed between the driving unit and the common electrode layer to drive the charged material to move toward the common electrode layer, thereby eliminating the gap between the conductive frame adhesive and the color filter substrate. A vertical reverse electric field is formed between the driving unit and the common electrode layer to drive the charged material to move toward the driving unit, thereby eliminating the gap between the conductive frame adhesive and the array substrate.

3. The method for manufacturing a display panel according to claim 2, characterized in that, The method for manufacturing the display panel further includes: The driving unit and the common electrode layer are controlled to form a vertical positive electric field to drive the charged material to spread out uniformly.

4. The method for manufacturing a display panel according to claim 1, characterized in that, The array substrate includes the first substrate, a driving circuit layer, a planarization layer, a conductive electrode, and a first alignment film; Before providing the array substrate, the method for manufacturing the display panel further includes: Provide the first substrate; The driving circuit layer is formed on one side of the first substrate; The planarization layer is formed on the side of the driving circuit layer away from the first substrate, wherein the planarization layer has a first opening and a second opening that expose different conductive layers of the driving circuit layer. The conductive electrodes are formed on the exposed surfaces of the planarization layer and the driving circuit layer, and the first alignment film is formed on the surface of the planarization layer away from the first substrate, wherein the conductive electrodes are located at adjacent first openings and second openings, respectively.

5. The method for manufacturing a display panel according to claim 4, characterized in that, The driving circuit layer includes a first conductive layer, an insulating layer, and a second conductive layer; forming the driving circuit layer on one side of the first substrate includes: The first conductive layer is formed on one side of the first substrate, wherein the driving unit is located in the first conductive layer; The insulating layer is formed on the exposed surfaces of the first substrate and the first conductive layer; A second conductive layer is formed on the side of the insulating layer away from the first substrate.

6. The method for manufacturing a display panel according to claim 4, characterized in that, The process of forming a liquid crystal layer and a conductive sealant on the surface of the array substrate away from the first substrate includes: A liquid crystal layer is formed on the side of the first alignment film away from the first substrate; A conductive sealant is applied to the surface edge of the planarization layer away from the first substrate.

7. The method for manufacturing a display panel according to claim 1, characterized in that, The color filter substrate includes a second substrate, a black matrix layer, a common electrode layer, and a second alignment film; Before bonding the color filter substrate to the liquid crystal layer and the conductive sealant on the surface away from the substrate, the method for manufacturing the display panel further includes: Provide the second substrate; A black matrix layer is formed on one side of the second substrate; The common electrode layer is formed on the side of the black matrix layer away from the second substrate; A second alignment film is formed on the surface of the common electrode layer away from the second substrate.

8. The method for manufacturing a display panel according to claim 1, characterized in that, The method for manufacturing the display panel further includes: After eliminating the gaps between the conductive sealant and the array substrate and the color filter substrate, the conductive sealant is irradiated with ultraviolet light to cool and solidify.

9. A display panel, characterized in that, The display panel is manufactured using the method described in any one of claims 1 to 8.

10. A display device, characterized in that, Includes the display panel as described in claim 9.

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