Inductance type pressure touch panel module

Abstract

The invention discloses an inductance type pressure touchpad module, belongs to the technical field of touch equipment, and aims to solve the problem that an inductance touchpad is complex in design, the inductance type pressure touchpad module comprises a cover plate, a PCB is installed at the top of the cover plate, a plurality of external coils are installed at the top of the PCB, a motor is installed at the top of the PCB, a plurality of silica gel gaskets are fixedly connected to the top of the PCB, and the silica gel gaskets are fixedly connected to the top of the PCB. According to the invention, through the cooperation of the gaskets and the metal support, when an external force acts on the cover plate, the inductance coil moves downwards along with the whole PCB, only the gasket area of the metal support moves downwards along with the whole PCB, and the overall height is not changed. Therefore, the distance between the inductance coil and the metal support is changed, the magnetic field is changed, the magnitude of induction current is further influenced, and then the magnitude of pressed eddy current is sampled and detected through an ADC to be returned to an inductance chip to be processed.

Description

Technical Field

[0001] The present invention belongs to the technical field of touch devices, and in particular relates to an inductive pressure touch panel module. Background Art

[0002] As a new type of touchpad, the full-range pressure touchpad adds pressure detection units and vibration feedback units to replace traditional mechanical buttons. The current market share is gradually increasing. Various terminal brands are gradually introducing pressure touchpads. For example, Apple notebooks have been fully switched to pressure touchpads, and some mid-to-high-end models of other terminal brands have also been introduced. However, due to the high cost of pressure touchpads and the more complicated assembly, calibration and debugging, the current market share is still very small. Generally, only high-end flagship terminals are equipped with pressure-sensitive touchpad modules. At present, there are various pressure detection methods for pressure touchpads, including resistance strain gauge type, capacitance type, piezoelectric ceramic type, and piezoelectric film type pressure detection methods. This solution is to provide a new type of inductive pressure detection pressure touchpad module. This inductive detection solution has low material cost, simple assembly and calibration, and has a higher cost-effectiveness. It is expected to increase the rapid penetration of low-end products of terminal customers. Summary of the invention

[0003] The object of the present invention is to provide an inductive pressure touch panel module to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solution: an inductive pressure touch panel module, comprising a cover plate, a PCB board is installed on the top of the cover plate, a plurality of external coils are installed on the top of the PCB board, a motor is installed on the top of the PCB board, a plurality of silicone gaskets are fixedly connected to the top of the PCB board, a metal bracket is fixedly connected to the top of the plurality of silicone gaskets, and a plurality of elastic arms are arranged on the top of the metal bracket.

[0005] It should be noted in the solution that the cover plate is made of glass or PC.

[0006] It is further worth noting that the cover plate is attached to the PCB board by double-sided tape.

[0007] It should be further explained that the metal bracket is fixedly connected to the silicone gasket using double-sided tape.

[0008] As a preferred implementation, a pressure sensing IC, a touch control IC, an MCU and a pressure sensing coil are welded on the PCB board.

[0009] As a preferred implementation, circular through holes are provided on all four sides of the metal bracket.

[0010] As a preferred implementation, a touch channel pattern layer with a stacked design is provided in the cover plate.

[0011] Compared with the prior art, the inductive pressure touch panel module provided by the present invention has at least the following beneficial effects:

[0012] (1) By arranging the gasket and the metal bracket to cooperate, when an external force acts on the cover, the inductor coil will move down with the PCB board as a whole, and only the gasket area of ​​the metal bracket will move down with it, and the overall height will not change, thereby realizing the change of the distance between the inductor coil and the metal bracket, realizing the change of the magnetic field, and then affecting the size of the induced current. Then, the size of the eddy current after pressing is detected by ADC sampling and returned to the inductor chip for processing. Since the eddy current intensity is proportional to the applied external force, the system can detect tiny pressure changes and provide highly sensitive feedback. Due to the use of the inductive principle, the wear caused by physical contact is reduced and the service life of the touch panel is extended. The relationship between eddy current and pressure is usually relatively linear, which makes the sensing accuracy higher and facilitates subsequent signal processing and calibration. At the same time, the change in the distance between the inductor coil and the metal bracket directly affects the sensing signal. The design is relatively simple and can reduce the need for other complex circuits. The overall height does not change. This design can avoid the influence of environmental factors on the sensing performance and maintain a stable working state.

[0013] (2) By attaching metal electrode sheets to metal sheets, the sensing performance is enhanced. Metal has the property of magnetic conductivity. When the inductor coil is energized, an electromagnetic field will be generated around it. The metal electromagnetic sheet and the inductor coil are placed opposite to each other. When the magnetic flux lines pass through the metal electrode sheet, a corresponding eddy current electric field will be generated inside the electrode sheet. This eddy current electric field will also generate a magnetic field in the opposite direction to the magnetic field excited by the inductor coil, which will offset each other and change the inductance value of the inductor coil. As the inductance value of the inductor coil changes, the overcurrent capability will also change. Through circuit design, the change in overcurrent capability caused by the change in the inductance value of the inductor coil is detected, thereby converting the detection pressure value.

[0014] (3) By setting up an external inductor coil, which is not integrated in the PCB, the inductor coil is separated out separately. The external inductor coil can be selected with different specifications and sensitivities according to specific needs, thereby improving the flexibility of design, simplifying the design of the inductive touch panel, reducing the design complexity of the PCB board, and reducing signal interference. Moreover, if the inductor coil fails, the user can easily replace it without replacing the entire PCB.

[0015] (4) By setting up an inductive pressure detection scheme, the detection channel includes a capacitance detection channel and a pressure detection channel. The routing of the pressure and capacitance detection lines is smooth during the design, which simplifies the design of the inductive touch panel, reduces the design complexity of the PCB board, improves the control ability and performance of the inductive touch panel, and avoids signal interference between the various chips in the touch panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 It is a first partial split diagram of the present invention;

[0018] Figure 3 It is a second partial split diagram of the present invention;

[0019] Figure 4 It is a flow chart of the working principle of the present invention;

[0020] Figure 5 It is a schematic diagram of the eddy current effect of the present invention.

[0021] In the figure: 1. Cover plate; 2. PCB board; 3. External coil; 4. Motor; 5. Silicone gasket; 6. Metal bracket; 7. Elastic arm. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The present invention will be further described below in conjunction with the embodiments.

[0024] See also Figure 1-5 The present invention provides an inductive pressure touch panel module, including a cover plate 1, a PCB board 2 is installed on the top of the cover plate 1, a plurality of external coils 3 are installed on the top of the PCB board 2, a motor 4 is installed on the top of the PCB board 2, a plurality of silicone gaskets 5 are fixedly connected to the top of the PCB board 2, a metal bracket 6 is fixedly connected to the top of the plurality of silicone gaskets 5, and a plurality of elastic arms 7 are arranged on the top of the metal bracket 6.

[0025] Further as Figure 1As shown, it is worth specifying that the cover plate 1 is made of glass or PC. Both glass and PC have good light transmittance, which can ensure that the display effect of the touch screen is clear and bright, which is very important for display screens that require high resolution and high contrast. The smooth surface of glass and PC can provide a better touch experience, reduce the friction between fingers and the touchpad, and improve the smoothness of operation. PC and glass are both non-conductive materials, which are very important for the normal operation of the inductive touch screen and can effectively avoid interference or short circuit caused by conductive materials. Glass and high-quality PC materials can achieve good sealing performance, which can prevent moisture and dust from entering the touchpad and enhance the durability and reliability of the product. At the same time, glass and PC materials can be recycled after use, which helps to reduce environmental impact and is in line with the trend of sustainable development.

[0026] Further as Figure 1 As shown, it is worth specifically explaining that the cover plate 1 is attached to the PCB board 2 through double-sided adhesive. The double-sided adhesive bonding can ensure that the components are firmly bonded to each other, prevent loosening or displacement during use, thereby improving the stability of the overall structure. Through adhesive bonding, each component can be evenly stressed, reduce local stress concentration, and reduce the risk of component damage; the use of double-sided adhesive bonding simplifies the assembly process, does not require the use of complex mechanical fasteners, thereby reducing labor costs and production time, and the double-sided adhesive can help quickly locate components during assembly, reduce the difficulty of alignment and installation, and improve production efficiency; the double-sided adhesive can effectively fill the gaps between components and provide better sealing, thereby reducing the entry of moisture and dust, and improving the durability and reliability of the product. The adhesive layer can play a buffering role, reduce the impact of external vibration or impact on internal components, and protect the touch module; most double-sided adhesives have good electrical insulation properties, which help prevent short circuits or electrical interference and improve the safety and stability of the touch module; at the same time, compared with traditional mechanical fixing methods, the use of double-sided adhesive can reduce additional fasteners and reduce the weight of the overall component, which is suitable for the needs of lightweight design.

[0027] Further as Figure 1 and Figure 2As shown, it is worth explaining in detail that the metal bracket 6 is fixedly connected to the silicone gasket 4 with double-sided tape, and the silicone gasket 4 is slidably installed inside the opening, so that when an external force acts on the cover plate 1, the inductor coil will move down with the PCB board 2 as a whole, and only the silicone gasket 4 area of ​​the metal bracket 6 will move down, and the overall height does not change, thereby realizing the change of the distance between the inductor coil and the metal bracket 6, realizing the change of the magnetic field, and then affecting the size of the induced current, and then the size of the eddy current after pressing is detected by ADC sampling and returned to the inductor chip for processing. Since the eddy current intensity is proportional to the applied external force, the system can detect tiny pressure changes and provide highly sensitive feedback. Due to the use of the inductive principle, the wear caused by physical contact is reduced, and the service life of the touch panel is extended. The relationship between eddy current and pressure is usually more linear, so that the sensing accuracy is higher, which is convenient for subsequent signal processing and calibration. At the same time, the change in the distance between the inductor coil and the metal bracket 6 directly affects the sensing signal. The design is relatively simple, which can reduce the need for other complex circuits. The overall height does not change. This design can avoid the influence of environmental factors on the sensing performance and maintain a stable working state; and the silicone gasket 4 is made of silicone material. Silicone has good elasticity and can effectively absorb and buffer pressure to prevent mechanical shock from damaging the internal components of the touch module. Under different pressures, the silicone gasket can maintain its shape and performance, adapt to various working conditions, and ensure the stability and sensitivity of the touch panel. Silicone can withstand extreme temperature changes and usually maintains stable performance between -60°C and 200°C, which enables the touch panel module to work normally under various environmental conditions. At the same time, the silicone material has excellent electrical insulation properties, which can effectively prevent short circuits or electrical interference and improve the safety of the touch module.

[0028] Further as Figure 1 and Figure 3As shown, it is worth mentioning that the PCB board 2 is welded with a pressure sensing IC, a touch IC, an MCU and a pressure sensing coil. Welding provides reliable mechanical fixation, can withstand vibration and impact, reduces the risk of components loosening or falling off during operation, and improves the durability of the product. The welding connection is usually more stable than other connection methods and can maintain long-term electrical and mechanical connections; welding provides lower contact resistance, ensures the stability and rapid response of signal transmission, and is suitable for high-frequency signals and low-noise applications. Good welding connections can effectively reduce electromagnetic interference and noise, and improve signal integrity and transmission quality; welding connections can better conduct heat, so that heat can be quickly transferred from the chip to the PCB board 2, reducing the risk of overheating and extending the service life of components; welding can achieve a more compact layout, save space, and make the design more miniaturized and integrated, meeting the miniaturization requirements of modern electronic products. Through welding connections, there is no need to use additional connectors, thereby simplifying the design and reducing material costs; welding connections can improve the module's anti-vibration ability during transportation and use, and are particularly suitable for equipment used in mobile or vibrating environments.

[0029] Further as Figure 1 and Figure 2 As shown, it is worth specifically explaining that the metal bracket 6 is provided with circular through holes on all four sides, and the touch panel is locked in the whole machine by screws, and the touch panel is fixed in the whole machine by screws, ensuring that the connection between the touch panel and the device is more stable. The screw fastening method has a higher fixing force than other methods, which effectively avoids the loosening problem caused by vibration, impact or long-term use, and ensures the long-term stable operation of the touch panel; the through hole and screw design make the touch panel easy to install and disassemble, and the maintenance personnel can easily use tools to disassemble the touch panel for repair, replacement or cleaning, without the need to perform complicated disassembly operations on the equipment, which is This convenience greatly saves maintenance time and reduces equipment downtime; the metal bracket 6 itself has good thermal conductivity. The design of the circular through hole can speed up the heat dissipation around the touch panel, avoiding overheating or performance degradation of the touch panel due to heat accumulation. The metal bracket 6 helps to dissipate heat of the entire module and extend the service life of the equipment; through the design of screws and circular through holes, the locking force can be evenly distributed around the touch panel, avoiding deformation or damage of the touch panel due to excessive local force, which is especially important for inductive pressure touch panels, because any slight deformation may affect the sensitivity and accuracy of its sensor.

[0030] Further as Figure 1As shown, it is worth mentioning that a touch channel pattern layer with a stacked design is provided in the cover plate 1. The stacked design can increase the area of ​​the sensing area, thereby improving the sensitivity of the touch and being able to more accurately detect slight touches and pressure changes; the stacked structure enables the module to support multi-touch technology, allowing multiple fingers to operate simultaneously, improving the convenience and flexibility of user interaction, and through the stacked design, the pressure sensing of different touch areas can be optimized, providing different feedback and responses, and enhancing the user experience; the stacked design can realize a complex touch channel layout in a smaller space, which is suitable for the miniaturization requirements of modern electronic devices and improves space utilization; touch channels at different levels can be isolated from each other, reducing signal interference and crosstalk, and ensuring the clarity and accuracy of the touch signal; at the same time, by optimizing the design and reducing unnecessary materials, the stacked design helps to reduce production costs, especially in large-scale production.

[0031] This solution has the following working process: in actual use, the inductive sensor array inside the touchpad forms a stable electric field through the power supply to establish a reference state. When the user's finger or other conductive objects touch the touchpad, the touch will change the distribution of the electric field, thereby affecting the electric field strength of the inductive sensor. The control circuit monitors these electric field changes in real time, collects electrical signals, reflects the changes in touch position and pressure, processes the electrical signals to determine the specific position and pressure level of the touch, analyzes the electric field changes to identify user input, and the processed data is sent to the main controller. The device makes corresponding operations or feedback based on the user's touch behavior.

[0032] In summary: by arranging the silicone gasket 5 and the metal bracket 6 to cooperate with each other, the distance between the inductor coil and the metal bracket 6 is changed, the magnetic field is changed, and then the size of the induced current is affected. Then, the size of the eddy current after pressing is detected by ADC sampling and returned to the inductor chip for processing. Since the eddy current intensity is proportional to the applied external force, the system can detect tiny pressure changes and provide highly sensitive feedback. Due to the use of the inductive principle, the wear caused by physical contact is reduced and the service life of the touch panel is extended. The relationship between eddy current and pressure is usually relatively linear, so that the sensing accuracy is high and it is convenient for subsequent signal processing and calibration. At the same time, the change in the distance between the inductor coil and the metal bracket 6 directly affects the sensing signal. The design is relatively simple, which can reduce the need for other complex circuits. The overall height does not change. This design can avoid the influence of environmental factors on the sensing performance and maintain a stable working state.

[0033] By attaching metal electrode sheets to metal sheets, the sensing performance is enhanced. Metal has the property of magnetic conductivity. When the inductor coil is energized, an electromagnetic field will be generated around it. The metal electromagnetic sheet and the inductor coil are placed opposite to each other. When the magnetic flux lines pass through the metal electrode sheet, a corresponding eddy current electric field will be generated inside the electrode sheet. This eddy current electric field will also generate a magnetic field in the opposite direction to the magnetic field excited by the inductor coil, which will offset each other and change the inductance value of the inductor coil. As the inductance value of the inductor coil changes, the overcurrent capacity will change. Through circuit design, the overcurrent capacity change caused by the change in the inductance value of the inductor coil is detected, thereby converting the detection pressure value;

[0034] By setting an external inductor coil, which is not integrated in the PCB board 2, the inductor coil is separated separately, and the external inductor coil can be selected with different specifications and sensitivities according to specific needs, thereby improving the flexibility of design, simplifying the design of the inductor touch panel, reducing the design complexity of the PCB board 2, and reducing signal interference. Moreover, if the inductor coil fails, the user can easily replace it without having to replace the entire PCB board 2.

[0035] By setting up an inductive pressure detection scheme, the detection channel includes a capacitance detection channel and a pressure detection channel. The routing of the pressure and capacitance detection lines is smooth during design, which simplifies the design of the inductive touch panel, reduces the design complexity of the PCB board 2, improves the control ability and performance of the inductive touch panel, and avoids signal interference among the chips in the touch panel.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An inductive pressure touch panel module, comprising a cover plate (1), characterized in that: A PCB board (2) is installed on the top of the cover plate (1), a plurality of external coils (3) are installed on the top of the PCB board (2), a motor (4) is installed on the top of the PCB board (2), a plurality of silicone gaskets (5) are fixedly connected to the top of the PCB board (2), a metal bracket (6) is fixedly connected to the top of the plurality of silicone gaskets (5), and a plurality of elastic arms (7) are arranged on the top of the metal bracket (6).

2. The inductive pressure touch panel module according to claim 1, characterized in that: The cover plate (1) is made of glass or PC material.

3. The inductive pressure touch panel module according to claim 1, characterized in that: The cover plate (1) is bonded to the PCB board (2) via double-sided adhesive.

4. The inductive pressure touch panel module according to claim 1, characterized in that: The metal bracket (6) is fixedly connected to the silicone gasket (5) by using double-sided adhesive tape.

5. The inductive pressure touch panel module according to claim 1, characterized in that: The PCB board (2) is welded with a pressure sensing IC, a touch control IC, an MCU and a pressure sensing coil.

6. The inductive pressure touch panel module according to claim 1, characterized in that: The four sides of the metal bracket (6) are all provided with circular through holes.

7. The inductive pressure touch panel module according to claim 1, characterized in that: A touch channel pattern layer of stacked design is arranged inside the cover plate (1).

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