Earmuff type earphone and its installation and debugging method

Abstract

The present invention provides an earmuff headset and an installation and debugging method thereof. The earmuff headset comprises an acoustic part and an application part. The acoustic part comprises a middle frame, a first circuit board, an earmuff assembly and a speaker module. The earmuff assembly and the first circuit board are arranged at two ends of the middle frame, and an earmuff front cavity is formed between the middle frame, the first circuit board and the earmuff assembly; the speaker module is arranged on the first circuit board and is electrically connected to the first circuit board; the application part comprises a shell cover, a second circuit board and a functional component; the open end of the shell cover and the second end of the middle frame are detachably connected; the second circuit board and the functional component are arranged on the shell cover, and the second circuit board and the functional component are electrically connected; an earmuff back cavity is formed between the shell cover, the first circuit board and the second circuit board; the first circuit board and the second circuit board are communicatively connected, the speaker module emits sound toward the earmuff front cavity, and the earmuff front cavity and the earmuff back cavity are connected. The present invention facilitates the maintenance and debugging of the earmuff headset and can integrate more application functions on the headset.

Description

Technical Field

[0001] The present invention relates to the technical field of earphones, and in particular to an earmuff type earphone and an installation and debugging method thereof. Background Art

[0002] Earmuff headphones are widely used in daily life, business office, aviation and other fields. In different application scenarios, earmuff headphones have different installation forms. Earmuff headphones can be divided into head-mounted headphones, helmet-type headphones, industrial protective headphones, etc. according to the installation form. Earmuff headphones mainly include an acoustic part and an application part. The acoustic part is used to realize the most basic sound playback function of the headphones, and the application part is used to realize various application functions of the headphones, such as microphone pickup, sound effect processing, voice signal processing, impedance matching with communication equipment, wireless communication, etc.

[0003] However, in actual applications, it is found that the acoustic part and the application part of most existing earmuff headphones are not separated. When repairing the headphones, the acoustic part is often damaged during the disassembly process, resulting in the need to re-debug the headphones after assembly. Although some earmuff headphones are equipped with relatively independent acoustic systems, the acoustic systems of such headphones only achieve the independence of the front and rear sound cavities of the speaker, and their circuit boards are still shared with the application part of the headphones, so the available area of ​​the circuit board is limited, and neither the acoustic part nor the application part can integrate more functions, and the acoustic part and the application part cannot be reused, which does not enable the development and iterative upgrade of earmuff headphones. Summary of the invention

[0004] The invention provides an earmuff type headset and an installation and debugging method thereof, which are used to at least solve or improve the problem that the existing earmuff type headset is inconvenient to repair and debug and it is difficult to integrate more application functions on the headset.

[0005] The present invention provides an earmuff type headset, comprising: an acoustic part and an application part; The acoustic part includes a middle frame, a first circuit board, an earmuff assembly and a speaker module, wherein the earmuff assembly is arranged at a first end of the middle frame, and the first circuit board is arranged at a second end of the middle frame; an earphone front cavity is formed between the middle frame, the first circuit board and the earmuff assembly; the speaker module is arranged on the first circuit board and is electrically connected to the first circuit board; The application part includes a shell, a second circuit board and a functional component; the open end of the shell and the second end of the middle frame are detachably connected; the second circuit board and the functional component are respectively arranged in the shell, and the second circuit board and the functional component are electrically connected; the shell, the first circuit board and the second circuit board form a headphone back cavity; The first circuit board and the second circuit board are communicatively connected, the speaker module is configured to emit sound toward the front cavity of the earphone, and the front cavity of the earphone is connected to the rear cavity of the earphone.

[0006] According to an earmuff type headset provided by the present invention, the speaker module includes a front shell, a rear shell and a speaker; the front shell and the rear shell are detachably connected, a accommodating space for accommodating the speaker is formed between the front shell and the rear shell, and the speaker is electrically connected to the first circuit board; the accommodating space between the front shell and the speaker is formed as a front sound cavity, and the front sound cavity is connected to the front cavity of the headset; the accommodating space between the rear shell and the speaker is formed as a rear sound cavity, and the rear sound cavity is connected to the rear cavity of the headset.

[0007] According to an earmuff type headset provided by the present invention, the front shell comprises a sound outlet area and a mounting area extending along the circumference of the sound outlet area; The first circuit board is provided with a mounting opening, the sound output area is accommodated in the mounting opening, a limiting ring is provided on a side of the sound output area facing the speaker, and the limiting ring and the voice coil of the speaker are arranged opposite to each other to limit the maximum amplitude of vibration of the voice coil; A side of the installation area facing away from the speaker is connected to the first circuit board, and a side of the installation area facing the speaker is provided with a first structure and a second structure, the first structure is used to install the speaker, and the second structure is used to install the rear shell.

[0008] According to the earmuff type earphone provided by the present invention, the sound outlet area is provided with a sound outlet, and the limiting ring is extended along the circumference of the sound outlet; The sound emitted by the speaker is output through the sound outlet.

[0009] According to an earmuff type headphone provided by the present invention, the limiting ring comprises a plurality of limiting ribs, and the plurality of limiting ribs are sequentially spaced and arranged along the circumferential direction, so that the limiting ring divides the front sound cavity into a first area and a second area which are connected to each other; The sound outlet area is provided with a plurality of tuning holes, a part of the plurality of tuning holes is arranged opposite to the first area, and another part of the plurality of tuning holes is arranged opposite to the second area; The sound emitted by the speaker is output through at least part of the plurality of tuning holes.

[0010] According to the earmuff type earphone provided by the present invention, a first bracket and a second bracket are provided on a side of the sound output area away from the speaker; The first bracket is provided with a first pickup, and the first pickup is electrically connected to the first circuit board; the second bracket is provided with a metal mesh cover, and the first pickup is built in the area covered by the metal mesh cover.

[0011] According to an earmuff type headset provided by the present invention, the earmuff assembly and the first end of the middle frame are sealed and connected along the circumference of the middle frame, and the first circuit board and the second end of the middle frame are sealed and connected along the circumference of the middle frame.

[0012] According to an earmuff-type headset provided by the present invention, the housing comprises a main housing and a cover; The main shell is annular, the first end of the main shell is detachably connected to the second end of the middle frame, and the second end of the main shell is connected to the cover; The second circuit board is arranged in the main housing; a mounting groove is arranged in the main housing, and the mounting groove is located on a side of the second circuit board facing the cover; The functional component includes a battery module, which is disposed in the mounting slot and electrically connected to the second circuit board.

[0013] According to the earmuff type headset provided by the present invention, a control module and a wireless communication module are provided on the second circuit board, and the wireless communication module is electrically connected to the control module; The functional component further includes a microphone and an antenna, wherein the microphone and the antenna are respectively arranged outside the housing, the microphone is electrically connected to the control module, and the antenna is electrically connected to the wireless communication module; The microphone is rotatably arranged on the shell cover and can reach a position corresponding to the mouth of the headphone wearer.

[0014] According to the earmuff type headset provided by the present invention, a rotary encoder is further provided on the second circuit board, and the rotary encoder is electrically connected to the control module; An adjusting knob is rotatably provided on the outer wall surface of the housing, and the adjusting knob is connected to the handle of the rotary encoder; The adjusting knob is used to control the rotation of the handle of the rotary encoder, the rotary encoder is used to feed back an adjusting instruction to the control module, and the control module is used to configure the wireless communication channel of the wireless communication module according to the adjusting instruction.

[0015] According to the earmuff type earphone provided by the present invention, the shell cover is further provided with a second pickup, and the second pickup is electrically connected to the control module; Wherein, the second microphone is used to collect sound signals of the environment where the earmuff-type headphones are located.

[0016] The present invention also provides a method for installing and debugging an earmuff type headset, comprising: Assembling the speaker and the front shell to obtain a semi-finished speaker; The speaker semi-finished product is mounted at the mounting opening of the first circuit board, a tuning material is arranged in the middle frame, an earmuff assembly is mounted at the first end of the middle frame, a first circuit board is mounted at the second end of the middle frame, an earphone front cavity is constructed between the middle frame, the first circuit board and the earmuff assembly, a frequency response test is performed on the speaker, and according to the test result, the sealing performance of the earphone front cavity is checked to determine the type of the tuning structure on the speaker and the type of the front shell; The rear housing is mounted on the front housing, a frequency response test is performed on the speaker, and the type of the tuning structure on the rear housing is determined according to the test result; The second circuit board and the functional component are respectively installed on the shell cover, the second circuit board is electrically connected to the first circuit board, and the open end of the shell cover is connected to the second end of the middle frame, and an earphone back cavity is constructed between the shell cover, the first circuit board and the second circuit board, and a frequency response test is performed on the speaker. According to the test results, the type of the tuning structure on the shell cover is determined.

[0017] According to the method for installing and debugging an earmuff type headset provided by the present invention, the step of assembling the speaker and the front shell to obtain a semi-finished speaker comprises: Installing the loudspeaker on the plurality of front shells in sequence, controlling the operation of the loudspeaker according to the resonance frequency of the loudspeaker, and performing resonance tests on the loudspeaker in sequence; On the premise that the voice coil of the speaker does not touch the limiting coil of the front shell, if the spacing between the voice coils with the maximum vibration amplitude among the multiple front shells is the smallest, the speaker is assembled with the front shell having the voice coil.

[0018] According to an installation and debugging method for an earmuff type headset provided by the present invention, the steps of performing a frequency response test on the speaker, checking the sealing of the front cavity of the headset according to the test result, and determining the type of the tuning structure on the speaker and the type of the front shell include: Performing a low-frequency test on the speaker in a frequency band of 10 Hz to 200 Hz, comparing the frequency response test curve of the speaker with the standard frequency response curve, and if the difference in comparison is greater than a first preset value, checking the sealing of the front cavity of the earphone, replacing the tuning net on the speaker, and ensuring that the frequency response of the speaker in the frequency band of 10 Hz to 200 Hz is enhanced; A high-frequency test is performed on the speaker in a frequency band of 1kHz to 4kHz, and a frequency response test curve of the speaker is compared with a standard frequency response curve. If a difference in the comparison is greater than a second preset value, the number of tuning holes on the front shell is adjusted, and the front shell is replaced to adjust the volume of the front sound cavity, so as to ensure that the frequency response of the speaker in the frequency band of 1kHz to 4kHz is enhanced, and the frequency response in the frequency band greater than 4kHz is lowered.

[0019] According to an installation and debugging method for an earmuff type headset provided by the present invention, the step of performing a frequency response test on the speaker and determining the type of the tuning structure on the rear housing according to the test result comprises: Performing a frequency response test on the speaker in a frequency band of 10 Hz to 20 kHz, comparing the test frequency response curve of the speaker with a standard frequency response curve, and if the difference between the comparisons is greater than a third preset value, adjusting the tuning tube and the tuning net on the rear housing to ensure that the frequency response of the speaker in a frequency band of 10 Hz to 100 Hz is not depressed, the frequency response in a frequency band of 200 Hz to 800 Hz is depressed, and the frequency response in a frequency band greater than 1 kHz is enhanced; The step of performing a frequency response test on the speaker and determining the type of the tuning structure on the housing according to the test result comprises: A frequency response test is performed on the speaker in a frequency band of 10 Hz to 20 kHz, and a frequency response test curve of the speaker is compared with a standard frequency response curve. If a difference in the comparison is greater than a fourth preset value, the tuning net protruding from the exhaust hole on the shell cover is adjusted while ensuring that the frequency response of the speaker in the frequency band of 10 Hz to 100 Hz is not depressed, and the tuning net is checked to see whether it is well pasted.

[0020] According to the present invention, a method for installing and debugging an earmuff type headphone further comprises: installing a first pickup on a first bracket of the front shell, electrically connecting the first pickup and the first circuit board, and installing a metal mesh cover on a second bracket of the front shell so that the first pickup is covered in the metal mesh cover; And / or, it also includes: installing a second pickup on the shell cover, and electrically connecting the second pickup and the control module on the second circuit board.

[0021] The present invention provides an earmuff headset and an installation and debugging method thereof. The earmuff headset includes an acoustic part and an application part. The acoustic part and the application part are independent of each other and each realizes a modular design. This design realizes the reuse of the acoustic part and the application part, which is beneficial to improving the research and development, debugging and iterative upgrade efficiency of the earmuff headset. When the headset fails, the acoustic part and the application part can be directly disassembled, and the disassembly operation will not damage the acoustic structure of the headset, which is convenient for separately repairing the acoustic part and the application part. At the same time, since the acoustic part and the application part are both equipped with independent circuit boards, the integrated design of more application functions can be realized on the corresponding circuit boards of the acoustic part and the application part. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a schematic diagram of the exploded structure of the earmuff type earphone provided by the present invention; Figure 2 This is one of the cross-sectional structural schematic diagrams of the earmuff type earphone provided by the present invention; Figure 3 This is the second schematic cross-sectional view of the earmuff type earphone provided by the present invention; Figure 4 The present invention provides Figure 2 Schematic diagram of the exploded structure of the middle speaker module; Figure 5 The present invention provides Figure 2 A schematic cross-sectional view of the structure of the middle speaker module; Figure 6 The present invention provides Figure 4 A schematic diagram of the structure of the front shell of the middle speaker module; Figure 7 The present invention provides Figure 2 A schematic diagram of the structure of the middle front shell and the first circuit board matching each other; Figure 8 The present invention provides Figure 3 Schematic diagram of the exploded structure of the middle speaker module; Fig. 9 The present invention provides Figure 3 A schematic cross-sectional view of the structure of the middle speaker module; Fig.10 The present invention provides Figure 8 A schematic diagram of the structure of the front shell of the middle speaker module; Fig.11 The present invention provides Figure 3 A schematic diagram of the structure of the middle front shell and the first circuit board matching each other; Fig.12 It is a structural schematic diagram of the middle frame provided by the present invention; Fig.13 It is a schematic diagram of the structure of the middle frame and the earmuff assembly provided by the present invention; Fig.14 This is one of the structural schematic diagrams of the middle frame and the first circuit board provided by the present invention; Fig.15 This is the second structural schematic diagram of the middle frame and the first circuit board provided by the present invention; Fig.16 This is one of the exploded structural diagrams of the middle frame and the first shell cover provided by the present invention; Fig.17 This is the second schematic diagram of the explosion structure of the middle frame and the first shell cover provided by the present invention; Fig.18 It is a structural schematic diagram of a battery module provided by the present invention installed in a mounting groove of a main housing; Fig.19 It is a schematic diagram of the installation structure of the main housing and the cover provided by the present invention; Fig. 20 The present invention provides Figure 2 A schematic diagram of the top view of the structure of the middle shell; Fig.21 The present invention provides Figure 3 A schematic diagram of the side structure of the middle shell; Fig. 22 The present invention provides Figure 3 One of the exploded structural diagrams of the mid-ear headphones; Fig.23 The present invention provides Figure 3 Schematic diagram of the explosion structure of the mid-ear headphones (part 2); Fig.24 This is one of the schematic diagrams of the installation structure of the adjustment knob provided by the present invention relative to the housing; Fig.25 This is the second schematic diagram of the installation structure of the adjustment knob relative to the housing provided by the present invention; Fig.26 It is a flow chart of the installation and debugging method of the earmuff type headphones provided by the present invention; Reference numerals: 1. middle frame; 11. clamping head; 12. clamping slot; 13. first fixing ear; 14. second fixing ear; 2. first circuit board; 21. mounting opening; 3. earmuff assembly; 31. earmuff body; 32. earmuff bracket; 4. Tuning materials; 5. Speaker module; 51. front shell; 52. rear shell; 53. speaker; 511. sound outlet; 512. installation area; 5111. limiting circle; 5112. first bracket; 5113. second bracket; 5121. first structure; 5122. second structure; 51101. sound outlet; 51102. tuning hole; 501. front sound cavity; 502. rear sound cavity; 6, shell cover; 61, main shell; 62, cover; 63, locking member; 611, mounting groove; 612, rectangular bayonet; 621, hook; 601, adjustment knob; 602, first mounting hole; 603, second mounting hole; 60, waterproof socket; 60a, slot body; 60b, plug sleeve; 6101, first through hole; 6102, second through hole; 6103, third through hole; 6104, fourth through hole; 6105, fifth through hole; 6106, exhaust hole; 7. Second circuit board; 701. Rotary encoder; 702. Antenna base; 8. Flexible circuit board; 101. battery module; 102. microphone; 103. antenna; 100. front chamber of earphone; 200. rear chamber of earphone. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Combine the following Figure 1-Figure 26 , the earmuff type headphones and the installation and debugging methods thereof provided by the embodiments of the invention are described in detail through specific embodiments and their application scenarios.

[0026] like Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present invention provides an earmuff type headset, comprising: an acoustic part and an application part; The acoustic part includes a middle frame 1, a first circuit board 2, an earmuff assembly 3 and a speaker module 5. The earmuff assembly 3 is arranged at a first end of the middle frame 1, and the first circuit board 2 is arranged at a second end of the middle frame 1. An earphone front cavity 100 is formed between the middle frame 1, the first circuit board 2 and the earmuff assembly 3. The speaker module 5 is arranged on the first circuit board 2 and is electrically connected to the first circuit board 2. The application part includes a shell cover 6, a second circuit board 7 and a functional component; the open end of the shell cover 6 and the second end of the middle frame 1 are detachably connected; the second circuit board 7 and the functional component are respectively arranged in the shell cover 6, and the second circuit board 7 and the functional component are electrically connected; the shell cover 6, the first circuit board 2 and the second circuit board 7 form an earphone back cavity 200; The first circuit board 2 and the second circuit board 7 are communicatively connected, the speaker module 5 is configured to emit sound toward the earphone front cavity 100 , and the earphone front cavity 100 and the earphone rear cavity 200 are connected.

[0027] It is understandable that both the first circuit board 2 and the second circuit board 2 can be printed circuit boards (PCB) known in the art, and the first circuit board 2 and the second circuit board 7 are communicatively connected via a detachable communication link.

[0028] Exemplarily, the earmuff-type headset is configured with a flexible circuit board 8 , one end of the flexible circuit board 8 is plugged into the communication port on the first circuit board 2 , and the other end of the flexible circuit board 8 is plugged into the communication port on the second circuit board 7 .

[0029] The speaker module 5 is configured with a speaker 53 and a sound cavity structure matching the speaker 53; when the speaker module 5 is installed on the first circuit board 2, at least part of the speaker module 5 is located in the front cavity 100 of the earphone, so that the speaker module 5 can emit sound toward the front cavity 100 of the earphone; since the acoustic part is used to realize the most basic sound playback function of the earphone, the first circuit board 2 can integrate circuits such as the speaker 53 driving circuit, audio amplification circuit, active noise reduction control circuit and power supply circuit corresponding to the speaker module 5.

[0030] At the same time, the first circuit board 2 is used as a partition inside the earmuff type earphone to separate the earphone front cavity 100 and the earphone rear cavity 200 inside the earmuff type earphone; a tuning structure such as a tuning tube or a tuning port is provided on the first circuit board 2 to balance the air pressure between the earphone front cavity 100 and the earphone rear cavity 200 based on the tuning structure. Since the earphone rear cavity 200 is formed between the first circuit board 2 and the second circuit board 7, this design can make the volume (air permeability) of the earphone rear cavity 200 sufficiently large, and this design can effectively ensure the frequency response effect of the earmuff type earphone in the frequency band of 10Hz to 100Hz.

[0031] When the human body wears the earmuff-type earphone, the front cavity 100 of the earphone forms a closed shape, a sound leakage hole can be set on the shell cover 6 of the application part, and the rear cavity 200 of the earphone can be connected to the external environment through the sound leakage hole.

[0032] Since the application part is used to realize various application functions of the headset, the second circuit board 7 can integrate functional modules such as a processor, a wireless communication module, an impedance matching circuit and a voice signal processing module.

[0033] In actual applications, the earphone front cavity 100 is usually filled with tuning material 4, which may be sponge. After the sound emitted by the speaker module 5 enters the earphone front cavity 100, it may be processed by the tuning material 4 and then reach the human ear.

[0034] It can be seen from the above that the acoustic part and the application part of the earmuff headphones shown in this embodiment are independent of each other, and each implements a modular design. This design realizes the reuse of the acoustic part and the application part, which is beneficial to improving the research and development, debugging and iterative upgrade efficiency of the earmuff headphones, and when the headphones fail, the acoustic part and the application part can be directly disassembled, and the disassembly operation will not damage the acoustic structure of the headphones, which is convenient for the separate inspection and repair of the acoustic part and the application part; at the same time, since the acoustic part and the application part are both equipped with independent circuit boards, the integrated design of more application functions can be implemented on the corresponding circuit boards of the acoustic part and the application part.

[0035] In some embodiments, Figure 4 , Figure 5 , Figure 8 and Fig. 9 As shown, the speaker module 5 includes a front shell 51, a rear shell 52 and a speaker 53; the front shell 51 and the rear shell 52 are detachably connected, and an accommodating space for accommodating the speaker 53 is formed between the front shell 51 and the rear shell 52, and the speaker 53 is electrically connected to the first circuit board 2; the accommodating space between the front shell 51 and the speaker 53 is formed as a front acoustic cavity 501, and the front acoustic cavity 501 is connected to the front cavity 100 of the earphone; the accommodating space between the rear shell 52 and the speaker 53 is formed as a rear acoustic cavity 502, and the rear acoustic cavity 502 is connected to the rear cavity 200 of the earphone.

[0036] It is understandable that, along the sound output direction of the speaker 53 , the front sound cavity 501 is located at the front side of the speaker 53 , and the rear sound cavity 502 is located at the rear side of the speaker 53 .

[0037] In actual applications, the front acoustic cavity 501 of the speaker module 5 is used to allow the voice coil (diaphragm) of the speaker 53 to radiate sound. The design of this part directly affects the clarity and directionality of the sound.

[0038] Since the speaker 53 not only emits sound from the front when it is working, but also generates sound waves with opposite phases (called back waves) from the back, the rear sound cavity 502 of the speaker module 5 is used to manage and absorb this part of the back waves.

[0039] Among them, the rear shell 52 of the speaker module 5 can be provided with tuning structures such as tuning tubes and tuning nets to tune the sound of the speaker module 5.

[0040] Furthermore, if Figure 6 and Fig.10As shown, the embodiment of the present invention realizes the installation of the speaker module 5 on the first circuit board 2 based on the front shell 51, and the front shell 51 includes a sound output area 511 and a mounting area 512 extending along the circumference of the sound output area 511; Figure 7 and Fig.11 As shown, the first circuit board 2 is provided with a mounting opening 21, and the sound output area 511 is accommodated in the mounting opening 21. A limiting coil 5111 is provided on one side of the sound output area 511 facing the speaker 53. The limiting coil 5111 and the voice coil of the speaker 53 are arranged relative to each other to limit the maximum amplitude of vibration of the voice coil.

[0041] like Figure 5 and Fig. 9 As shown, the side of the installation area 512 facing away from the speaker 53 is connected to the first circuit board 2, and the side of the installation area 512 facing the speaker 53 is provided with a first structure 5121 and a second structure 5122. The first structure 5121 is used to install the speaker 53, and the second structure 5122 is used to install the rear shell 52.

[0042] Specifically, in order to facilitate the sealed connection between the front shell 51 and the first circuit board 2, a mounting surface extending along its circumference is formed on the side of the mounting area 512 facing away from the speaker 53. The mounting surface and the side of the first circuit board 2 facing the second circuit board 7 can be connected by a sealing ring to ensure a good seal between the front shell 51 and the first circuit board 2.

[0043] At the same time, the front shell 51 is provided with a plurality of fixing ears, and the plurality of fixing ears are arranged along the circumference of the mounting area 512 . Each fixing ear of the front shell 51 can be connected to the first circuit board 2 by means of screws.

[0044] The limiting coil 5111 is annular, and is used to prevent the voice coil of the speaker 53 from excessively moving outward. In the process of wearing the earmuff headphones, the wearer's rapid pressing or releasing of the earmuff headphones will cause a drastic change in the air pressure in the front chamber 100 of the headphones, which will cause the voice coil of the speaker 53 to move outward; if the voice coil of the speaker 53 deviates too much from the equilibrium position, the speaker 53 will enter a nonlinear working state, causing the feedback control system of the active noise reduction headphones to howl; therefore, the limiting coil 5111 is used to prevent the voice coil of the speaker 53 from excessively moving outward, which can effectively reduce such howling. Among them, the smaller the distance from the limiting coil 5111 to the voice coil of the speaker 53, the more it can prevent the voice coil of the speaker 53 from excessively moving outward, but it cannot be less than the maximum amplitude of the normal operation of the voice coil of the speaker 53 to avoid affecting the normal operation of the speaker 53.

[0045] Furthermore, since the speaker 53 is usually disc-shaped, the rear shell 52 of the speaker 53 is usually designed as a hood-like structure, so that the first structure 5121 and the second structure 5122 can both be configured as annular grooves, the periphery of the speaker 53 is connected to the first structure 5121, and the hood end of the rear shell 52 is connected to the second structure 5122.

[0046] Furthermore, in actual application requirements, the front shell 51 of the speaker module 5 can be designed into two structures. The structures of the two front shells 51 can be specifically described below.

[0047] In one embodiment, Figure 4 and Figure 5 As shown, the sound outlet area 511 is provided with a sound outlet 51101 , and a limiting ring 5111 is extended along the circumference of the sound outlet 51101 ; wherein the sound emitted by the speaker 53 is outputted through the sound outlet 51101 .

[0048] In another embodiment, Figure 8 , Fig. 9 and Fig.10 As shown, the limiting ring 5111 includes a plurality of limiting ribs, and the plurality of limiting ribs are arranged in sequence along the circumferential direction, so that the limiting ring 5111 divides the front sound cavity 501 into a first area and a second area which are connected to each other, thereby ensuring the smooth flow of air in the front sound cavity 501; the sound output area 511 is provided with a plurality of tuning holes 51102, a part of the plurality of tuning holes 51102 is arranged opposite to the first area, and another part of the plurality of tuning holes 51102 is arranged opposite to the second area; the sound emitted by the speaker 53 is output through at least a part of the plurality of tuning holes 51102.

[0049] In practical applications, since the front acoustic cavity 501 of the present embodiment is connected to the front cavity 100 of the earphone through various tuning holes 51102, the front acoustic cavity 501 can be used to lower the high-frequency frequency response of the earphone above 4 kHz and improve the frequency response in the 1 kHz to 4 kHz frequency band. By adjusting the number of tuning holes 51102 on the front shell 51 and the volume of the front acoustic cavity 501 of the speaker 53 (replacing front shells of different specifications), the frequency response of the earmuff type earphone in these two frequency bands can be adjusted.

[0050] Furthermore, if Figure 5 and Figure 6 As shown, a first bracket 5112 and a second bracket 5113 are provided on a side of the sound output area 511 away from the speaker 53; a first pickup is provided on the first bracket 5112, and the first pickup is electrically connected to the first circuit board 2; a metal mesh cover is provided on the second bracket 5113, and the first pickup is built into the area covered by the metal mesh cover.

[0051] It is understandable that the first microphone is used to collect voice information emitted by the speaker module 5, and the first circuit board 2 is used to perform active noise reduction processing on the sound emitted by the speaker 53 according to the voice information fed back by the first microphone.

[0052] Since the first bracket 5112 is located on the side of the sound output area 511 away from the speaker 53, the first bracket 5112 not only provides a mounting support for the first pickup, but also supports the tuning material 4 in the front cavity 100 of the earphone, thereby preventing the tuning material 4 near the first pickup from undergoing a large deformation under the action of sound waves and causing howling in the feedback control system.

[0053] At the same time, the second bracket 5113 can be composed of a plurality of columns, which are arranged around the first bracket 5112, and the metal mesh cover is installed on the plurality of columns, so as to realize that the first pickup is built into the area covered by the metal mesh cover. The metal mesh cover is used to improve the stability of the acoustic transmission path from the speaker 53 to the first pickup, making the feedback noise reduction more stable.

[0054] like Figure 2 and Figure 3 As shown, when wearing the earmuff headphones, in order to ensure the sealing of the front cavity 100 of the earphone, the earmuff assembly 3 and the first end of the middle frame 1 are sealed and connected along the circumference of the middle frame 1, the first circuit board 2 and the second end of the middle frame 1 are sealed and connected along the circumference of the middle frame 1, and the speaker module 5 and the first circuit board 2 are sealed and connected along the circumference of the mounting opening 21.

[0055] Specifically, the earmuff assembly 3 includes an earmuff body 31 and an earmuff bracket 32. The earmuff body 31 is ring-shaped, and the earmuff bracket 32 ​​is extended along the circumference of the earmuff body 31. The first side of the earmuff bracket 32 ​​is connected to the first end of the middle frame 1, and the second side of the earmuff bracket 32 ​​is connected to the earmuff body 31. The side of the earmuff body 31 facing away from the earmuff bracket 32 ​​is suitable for flexible contact with the human head.

[0056] like Fig.12 and Fig.13 As shown, a slot 12 is provided on the inner wall of the middle frame 1 near its first end, the earmuff bracket 32 ​​is snap-fitted to the slot 12, and the first side surface of the earmuff bracket 32 ​​and the end surface of the first end of the middle frame 1 are sealed and connected via a sealing ring.

[0057] like Fig.12 , Fig.13 , Fig.14 and Fig.15As shown, the inner wall of the middle frame 1 near its second end is provided with a plurality of first fixing ears 13 and a plurality of second fixing ears 14, the plurality of first fixing ears 13 and the plurality of second fixing ears 14 are arranged along the circumference of the middle frame 1, and the first fixing ears 13 and the second fixing ears 14 are arranged alternately, the first circuit board 2 is connected to the first fixing ears 13 by screws, and the first circuit board 2 and the end surface of the second end of the middle frame 1 are sealed and connected by a sealing ring. Among them, the first circuit board 2 is provided with a first hole position adapted to the first fixing ear 13 and a second hole position adapted to the second fixing ear 14.

[0058] In addition, the shell cover 6 of the earmuff type earphone is connected to the second fixing ear 14 through screws, and the cover opening end of the shell cover 6 and the end surface of the second end of the middle frame 1 can also be sealed and connected through a sealing ring.

[0059] Furthermore, in actual application, a clamping head 11 is also provided on the outer side surface of the middle frame 1. There are two clamping heads 11, which are located on opposite sides of the middle frame 1. The clamping heads 11 are configured to be connected to a head beam or a helmet bracket.

[0060] like Fig.16 and Fig.17 As shown, the shell cover 6 includes a main shell 61 and a cover 62; the main shell 61 is ring-shaped, the first end of the main shell 61 and the second end of the middle frame 1 are detachably connected, and the second end of the main shell 61 is connected to the cover 62; the second circuit board 7 is arranged in the main shell 61.

[0061] A mounting groove 611 is provided in the main shell 61 , and the mounting groove 611 is located on the side of the second circuit board 7 facing the cover 62 ; the functional component includes a battery module 101 , and the battery module 101 is provided in the mounting groove 611 and electrically connected to the second circuit board 7 .

[0062] It is understandable that, in actual applications, by configuring the shell cover 6 as a main shell 61 and a cover 62 , the battery module 101 can be replaced by installing or removing the cover 62 alone.

[0063] A conductive connector may be provided on the second circuit board 7 , and when the battery module 101 is disposed in the mounting groove 611 , the conductive connector may be electrically connected to a contact on the battery module 101 ; the battery module 101 may be a lithium battery.

[0064] The cover 62 is covered on the second end of the main shell 61 , a sealing ring is provided between the periphery of the cover 62 and the second end of the main shell 61 , and the cover 62 and the main shell 61 can be detachably connected via a locking member 63 .

[0065] For example, Fig.18 and Fig.19As shown, the main housing 61 is provided with a plurality of rectangular bayonet holes 612, which are arranged around the mounting groove 611; the shell cover 6 is provided with a plurality of hooks 621 on one side facing the main housing 61, and the plurality of hooks 621 are arranged one by one opposite to the plurality of rectangular bayonet holes 612. The shell cover 6 is provided with a first locking ear at one end along the length direction of the rectangular bayonet holes 612, and the main housing 61 is provided with a second locking ear adapted to the first locking ear.

[0066] When installing the shell cover 6, control the shell cover 6 to move toward the main shell body 61 along the sound-emitting direction of the speaker 53 until each hook 621 is embedded into each rectangular slot 612 one by one; then, drive the shell cover 6 to move relative to the main shell body 61 along the length direction of the rectangular slot 612 until the first locking ear and the second locking ear are fitted, and at this time the hook 621 and the main shell body 61 are abutted along the sound-emitting direction of the speaker 53, which can prevent the hook 621 and the main shell body 61 from being separated along the sound-emitting direction of the speaker 53; finally, use the locking piece 63 to connect the first locking ear and the second locking ear.

[0067] Furthermore, if Fig.16 and Fig.17 As shown, the main shell 61 is provided with a first through hole 6101, a second through hole 6102, a third through hole 6103, a fourth through hole 6104, a fifth through hole 6105 and an exhaust hole 6106; the first through hole 6101 is used to install a switch, and the switch is electrically connected to the control module on the second circuit board 7; the second through hole 6102 is used for the headband line on the earmuff type earphone to pass through, so as to realize the communication connection between the left earphone and the right earphone based on the headband line; the third through hole 6103 is extended along the sound emission direction of the speaker 53, and the main shell 61 can be connected to the second fixing ear 14 on the middle frame 1 by a screw passing through the third through hole 6103; in this way, when the cover 62 is covered on the second end of the main shell 61, the screws for fixing the main shell 61 are hidden, see Fig. 20 ; The fourth through hole 6104 is used to install a button, and the button is electrically connected to the control module on the second circuit board 7; the fifth through hole 6105 is used to install a USB interface, and the USB interface is electrically connected to the control module on the second circuit board 7; a plurality of exhaust holes 6106 are provided, and the plurality of exhaust holes 6106 are respectively connected to the earphone back cavity 200 to achieve connectivity between the earphone back cavity 200 and the external environment.

[0068] like Fig.21 , Fig. 22 and Fig.23As shown, a control module and a wireless communication module are provided on the second circuit board 7, and the wireless communication module and the control module are electrically connected; the functional components also include a microphone 102 and an antenna 103, and the microphone 102 and the antenna 103 are respectively provided outside the shell cover 6, the microphone 102 and the control module are electrically connected, and the antenna 103 and the wireless communication module are electrically connected; wherein, the microphone 102 is rotatably provided on the shell cover 6, and can reach a position corresponding to the mouth of the headphone wearer.

[0069] Specifically, the control module may be a central processing unit (CPU), and the wireless communication module may be a Bluetooth module, a WiFi module, a 4G module or a 5G module.

[0070] An antenna base 702 is provided on the second circuit board 7 , and the wireless communication module is electrically connected to the antenna 103 via the antenna base 702 ; a first mounting hole 602 is provided on the shell cover 6 , and one end of the microphone 102 is rotatably mounted in the first mounting hole 602 .

[0071] like Fig.23 As shown, a rotary encoder 701 is also provided on the second circuit board 7, and the rotary encoder 701 is electrically connected to the control module; Fig.24 and Fig.25 As shown, the outer wall surface of the shell cover 6 is rotatably provided with an adjusting knob 601, and the adjusting knob 601 is connected to the handle of the rotary encoder 701; the adjusting knob 601 is used to control the rotation of the handle of the rotary encoder 701, and the rotary encoder 701 is used to feed back adjusting instructions to the control module, and the control module is used to configure the wireless communication channel of the wireless communication module according to the adjusting instructions.

[0072] Specifically, the outer wall of the shell 6 is provided with a waterproof socket 60, which includes a groove 60a and a plug sleeve 60b, the inner cavity of the groove 60a is cylindrical, and the plug sleeve 60b is coaxially arranged in the groove 60a. The outer wall of the shell 6 is also provided with angle marks, which are arranged along the circumference of the groove 60a.

[0073] Correspondingly, an end of the adjusting knob 601 facing the shell cover 6 is provided with a plug-in groove and a plug-in rod coaxially arranged in the plug-in groove; when the adjusting knob 601 is installed, the plug-in rod can be rotatably inserted into the plug-in sleeve 60b and connected to the handle of the rotary encoder 701, and the plug-in sleeve 60b is embedded between the inner wall surface of the plug-in groove and the outer wall surface of the plug-in rod.

[0074] In this way, by rotating the end of the adjusting knob 601 away from the shell cover 6, the plug-in rod of the adjusting knob 601 can drive the handle of the rotary encoder 701 to rotate, and the rotation angle of the adjusting knob 601 can be finely adjusted with reference to the angle mark; at the same time, when rain falls on the surface of the shell cover 6, only the part between the groove 60a of the waterproof socket 60 and the plug sleeve 60b may accumulate a certain amount of rainwater, and the rainwater cannot enter the plug sleeve 60b; this design not only effectively prevents rainwater from entering the earphone through the gap between the waterproof socket 60 and the adjusting knob 601, but also improves the structural stability of the adjusting knob 601, making the handle of the rotary encoder 701 not easily broken.

[0075] like Fig.17 and Fig.23 As shown, a second microphone is also provided on the shell cover 6, and the second microphone is electrically connected to the control module. Specifically, a second mounting hole 603 is provided on the top of the shell cover 6, and the second microphone is installed in the second mounting hole 603. The second microphone can be used to collect sound signals in the environment where the earmuff type headphones are located. The control module can eliminate environmental noise according to the sound signals fed back by the second microphone, and ensure the sound effect of the sound played by the speaker module 5.

[0076] In the second aspect, Fig.26 As shown, an embodiment of the present invention further provides a method for installing and debugging the earmuff type headphones as described above, comprising the following steps.

[0077] Step 261, assemble the speaker and the front shell to obtain a semi-finished speaker.

[0078] Specifically, the speaker is mounted on the first structure of the front housing by using glue or ultrasonic welding.

[0079] In practical applications, the speakers can be installed on multiple front shells in sequence, and the speakers can be excited by sinusoidal signals respectively. The operation of the speakers can be controlled according to the resonant frequency of the speakers, and the resonance tests can be performed on the speakers in sequence. During the test, by replacing the front shells with voice coils of different heights, and under the premise that the voice coil of the speaker does not touch the limiting coil of the front shell, if the spacing between the voice coils with the maximum vibration amplitude among the multiple front shells is the smallest, the front shell with the voice coil is determined to be the final selected model, and the speaker is assembled with the front shell with the voice coil to obtain a semi-finished speaker.

[0080] Step 262, install the semi-finished speaker at the installation opening on the first circuit board, set the tuning material in the middle frame, install the earmuff assembly at the first end of the middle frame, install the first circuit board at the second end of the middle frame, construct the earphone front cavity between the middle frame, the first circuit board and the earmuff assembly, perform a frequency response test on the speaker, check the sealing of the earphone front cavity based on the test results, and determine the type of the tuning structure on the speaker and the type of the front shell.

[0081] Specifically, when installing the semi-finished speaker, the front shell is installed at the installation opening on the first circuit board, and a sealing ring is used to ensure the sealing effect between the front shell and the first circuit board.

[0082] When installing the earmuff assembly, the earmuff body can be installed on the earmuff bracket by glue first, and then the earmuff bracket is snapped into the slot on the middle frame, and a sealing ring is used to ensure the sealing between the earmuff bracket and the middle frame.

[0083] When conducting a frequency response test on a speaker, obtain in advance a standard frequency response curve of a frequency sweep of the finished speaker (a speaker that has been tested and meets factory standards), compare the frequency response parameters of each frequency band of the speaker tested on site with the frequency response parameters of the corresponding frequency band of the standard frequency response curve, and based on the comparison results, check the sealing of the front cavity of the earphone and determine the type of tuning structure and front shell on the speaker to ensure that the frequency response test curve of the speaker tested on site is close to the standard frequency response curve.

[0084] Specifically, a low-frequency test can be performed on the speaker in a frequency band of 10Hz to 200Hz, and the frequency response test curve of the speaker is compared with the standard frequency response curve. If the difference in the comparison is greater than a first preset value, that is, the sound production ability of the speaker in the frequency band of 10Hz to 200Hz is poor, then check the sealing of the front cavity of the earphone, replace the tuning net on the speaker, or replace the speaker with a stronger sound production ability in the frequency band of 10Hz to 200Hz, to ensure that the frequency response of the speaker in the frequency band of 10Hz to 200Hz is enhanced.

[0085] At the same time, a high-frequency test is performed on the speaker in a frequency band of 1kHz to 4kHz, and the frequency response test curve of the speaker is compared with the standard frequency response curve. If the difference in comparison is greater than a second preset value, that is, the sound production ability of the speaker in the frequency band of 1kHz to 4kHz is poor, and the sound production ability in the frequency band greater than 4kHz is too strong, then the number of tuning holes on the front shell is adjusted, and the front shell is replaced to adjust the volume of the front sound cavity, ensuring that the frequency response of the speaker in the frequency band of 1kHz to 4kHz is enhanced, and the frequency response in the frequency band greater than 4kHz is lowered, so that the frequency response of the speaker in the frequency band above 1kHz is flatter.

[0086] Step 263, installing the rear housing on the front housing, performing a frequency response test on the speaker, and determining the type of the tuning structure on the rear housing based on the test results.

[0087] Specifically, the rear shell is mounted on the second structure of the front shell by using glue or ultrasonic welding, and tuning structures such as tuning tubes and tuning nets are installed on the rear shell.

[0088] When performing a frequency response test on a speaker, the frequency response test is performed on the speaker in a frequency band of 10 Hz to 20 kHz, and the frequency response test curve of the speaker is compared with the standard frequency response curve. If the difference in the comparison is greater than a third preset value, the tuning tube and the tuning net on the rear shell are adjusted, and the acoustic resistance of the tuning net attached to the tuning hole is adjusted to ensure that the frequency response of the speaker in the frequency band of 10 Hz to 100 Hz is not depressed, the frequency response in the frequency band of 200 Hz to 800 Hz is depressed, and the frequency response in the frequency band greater than 1 kHz is enhanced.

[0089] Step 264, respectively install the second circuit board and the functional component on the shell cover, electrically connect the second circuit board and the first circuit board, and connect the open end of the shell cover and the second end of the middle frame, construct an earphone back cavity between the shell cover, the first circuit board and the second circuit board, perform a frequency response test on the speaker, and determine the type of tuning structure on the shell cover based on the test results.

[0090] Specifically, when installing the shell cover, it is necessary to install tuning structures such as a tuning tube and a tuning net at the exhaust hole of the shell cover.

[0091] When performing a frequency response test on the speaker, the frequency response test is performed on the speaker in a frequency band of 10 Hz to 20 kHz, and the frequency response test curve of the speaker is compared with the standard frequency response curve. If the difference in the comparison is greater than the fourth preset value, the tuning net at the exhaust hole on the shell cover is adjusted while ensuring that the frequency response of the speaker in the frequency band of 10 Hz to 100 Hz is not depressed, and at the same time, check whether the tuning net is well pasted.

[0092] Among them, when debugging the tuning net, the main thing is to adjust the density of the tuning net, and you can try to use a tuning net with a higher density.

[0093] In some embodiments, the method for installing and debugging an earmuff-type headphone further includes: installing a first pickup on a first bracket of a front shell, electrically connecting the first pickup to a first circuit board, and installing a metal mesh cover on a second bracket of the front shell so that the first pickup cover is disposed inside the metal mesh cover.

[0094] Specifically, during the installation and debugging process, metal mesh covers of different densities can be replaced to ensure better stability of the frequency response from the speaker to the first pickup in the 3kHz to 8kHz frequency band. The method for judging the stability of the frequency response in this frequency band is to compare the difference in the frequency response between the normal wearing state of the headphones and the pressing of the tuning material near the first pickup. The smaller the difference, the more stable it is.

[0095] In some embodiments, the method for installing and debugging the earmuff-type headphones further includes: installing a second pickup on the shell, and electrically connecting the second pickup to a control module on a second circuit board.

[0096] Among them, the installation setting of the second pickup in the above step 264 can firstly install the second pickup at the second installation hole of the shell, then install the second circuit board in the shell, and finally install the shell on the middle frame with screws.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An earmuff type headset, characterized in that: include: Acoustic part and applied part; The acoustic part includes a middle frame, a first circuit board, an earmuff assembly and a speaker module, wherein the earmuff assembly is arranged at a first end of the middle frame, and the first circuit board is arranged at a second end of the middle frame; an earphone front cavity is formed between the middle frame, the first circuit board and the earmuff assembly; the speaker module is arranged on the first circuit board and is electrically connected to the first circuit board; The application part includes a shell, a second circuit board and a functional component; the open end of the shell and the second end of the middle frame are detachably connected; the second circuit board and the functional component are respectively arranged in the shell, and the second circuit board and the functional component are electrically connected; the shell, the first circuit board and the second circuit board form a headphone back cavity; The first circuit board and the second circuit board are communicatively connected, the speaker module is configured to emit sound toward the front cavity of the earphone, and the front cavity of the earphone is connected to the rear cavity of the earphone.

2. The earmuff-type headphone according to claim 1, characterized in that: The speaker module comprises a front shell, a rear shell and a speaker; The front shell and the rear shell are detachably connected, an accommodation space for accommodating the speaker is formed between the front shell and the rear shell, and the speaker is electrically connected to the first circuit board; The accommodating space between the front shell and the speaker forms a front sound cavity, which is connected to the front cavity of the earphone; the accommodating space between the rear shell and the speaker forms a rear sound cavity, which is connected to the rear cavity of the earphone.

3. The earmuff-type headphone according to claim 2, characterized in that: The front shell includes a sound outlet area and a mounting area extending along the circumference of the sound outlet area; The first circuit board is provided with a mounting opening, the sound output area is accommodated in the mounting opening, a limiting ring is provided on a side of the sound output area facing the speaker, and the limiting ring and the voice coil of the speaker are arranged opposite to each other to limit the maximum amplitude of vibration of the voice coil; A side of the installation area facing away from the speaker is connected to the first circuit board, and a side of the installation area facing the speaker is provided with a first structure and a second structure, the first structure is used to install the speaker, and the second structure is used to install the rear shell.

4. The earmuff-type headphone according to claim 3, characterized in that: The sound outlet area is provided with a sound outlet, and the limiting ring is extended along the circumference of the sound outlet; The sound emitted by the speaker is output through the sound outlet.

5. The earmuff-type headphone according to claim 3, characterized in that: The limiting ring includes a plurality of limiting ribs, and the plurality of limiting ribs are sequentially spaced and arranged along the circumferential direction, so that the limiting ring divides the front sound cavity into a first area and a second area that are connected to each other; The sound outlet area is provided with a plurality of tuning holes, a part of the plurality of tuning holes is arranged opposite to the first area, and another part of the plurality of tuning holes is arranged opposite to the second area; The sound emitted by the speaker is output through at least part of the plurality of tuning holes.

6. The earmuff-type headphone according to claim 3, characterized in that: A first bracket and a second bracket are provided on a side of the sound output area away from the speaker; The first bracket is provided with a first pickup, and the first pickup is electrically connected to the first circuit board; the second bracket is provided with a metal mesh cover, and the first pickup is built in the area covered by the metal mesh cover.

7. The earmuff-type headphone according to claim 1, characterized in that: The earmuff assembly and the first end of the middle frame are sealed and connected along the circumference of the middle frame, and the first circuit board and the second end of the middle frame are sealed and connected along the circumference of the middle frame.

8. The earmuff-type headphone according to any one of claims 1 to 7, characterized in that: The housing comprises a main housing and a cover; The main shell is annular, the first end of the main shell is detachably connected to the second end of the middle frame, and the second end of the main shell is connected to the cover; The second circuit board is arranged in the main housing; a mounting groove is arranged in the main housing, and the mounting groove is located on a side of the second circuit board facing the cover; The functional component includes a battery module, which is disposed in the mounting slot and electrically connected to the second circuit board.

9. The earmuff-type headphone according to any one of claims 1 to 7, characterized in that: The second circuit board is provided with a control module and a wireless communication module, and the wireless communication module is electrically connected to the control module; The functional component further includes a microphone and an antenna, wherein the microphone and the antenna are respectively arranged outside the housing, the microphone is electrically connected to the control module, and the antenna is electrically connected to the wireless communication module; The microphone is rotatably arranged on the shell cover and can reach a position corresponding to the mouth of the headphone wearer.

10. The earmuff-type headphone according to claim 9, characterized in that: The second circuit board is also provided with a rotary encoder, and the rotary encoder is electrically connected to the control module; An adjusting knob is rotatably provided on the outer wall surface of the housing, and the adjusting knob is connected to the handle of the rotary encoder; The adjusting knob is used to control the rotation of the handle of the rotary encoder, the rotary encoder is used to feed back an adjusting instruction to the control module, and the control module is used to configure the wireless communication channel of the wireless communication module according to the adjusting instruction.

11. The earmuff-type headphone according to claim 10, characterized in that: The housing is also provided with a second pickup, and the second pickup is electrically connected to the control module; Wherein, the second microphone is used to collect sound signals of the environment where the earmuff-type headphones are located.

12. A method for installing and debugging an earmuff type headphone according to any one of claims 1 to 11, characterized in that: include: Assembling the speaker and the front shell to obtain a semi-finished speaker; The speaker semi-finished product is mounted at the mounting opening of the first circuit board, a tuning material is arranged in the middle frame, an earmuff assembly is mounted at the first end of the middle frame, a first circuit board is mounted at the second end of the middle frame, an earphone front cavity is constructed between the middle frame, the first circuit board and the earmuff assembly, a frequency response test is performed on the speaker, and according to the test result, the sealing performance of the earphone front cavity is checked to determine the type of the tuning structure on the speaker and the type of the front shell; The rear housing is mounted on the front housing, a frequency response test is performed on the speaker, and the type of the tuning structure on the rear housing is determined according to the test result; The second circuit board and the functional component are respectively installed on the shell cover, the second circuit board is electrically connected to the first circuit board, and the open end of the shell cover is connected to the second end of the middle frame, and an earphone back cavity is constructed between the shell cover, the first circuit board and the second circuit board, and a frequency response test is performed on the speaker. According to the test results, the type of the tuning structure on the shell cover is determined.

13. The method for installing and debugging an earmuff type headset according to claim 12, characterized in that: The step of assembling the speaker and the front housing to obtain a semi-finished speaker comprises: Installing the loudspeaker on the plurality of front shells in sequence, controlling the operation of the loudspeaker according to the resonance frequency of the loudspeaker, and performing resonance tests on the loudspeaker in sequence; On the premise that the voice coil of the speaker does not touch the limiting coil of the front shell, if the spacing between the voice coils with the maximum vibration amplitude among the multiple front shells is the smallest, the speaker is assembled with the front shell having the voice coil.

14. The method for installing and debugging an earmuff type headset according to claim 12, characterized in that: The step of performing a frequency response test on the speaker, checking the sealing of the front cavity of the earphone according to the test result, and determining the type of the tuning structure on the speaker and the type of the front shell includes: Performing a low-frequency test on the speaker in a frequency band of 10 Hz to 200 Hz, comparing the frequency response test curve of the speaker with the standard frequency response curve, and if the difference in comparison is greater than a first preset value, checking the sealing of the front cavity of the earphone, replacing the tuning net on the speaker, and ensuring that the frequency response of the speaker in the frequency band of 10 Hz to 200 Hz is enhanced; A high-frequency test is performed on the speaker in a frequency band of 1kHz to 4kHz, and a frequency response test curve of the speaker is compared with a standard frequency response curve. If a difference in the comparison is greater than a second preset value, the number of tuning holes on the front shell is adjusted, and the front shell is replaced to adjust the volume of the front sound cavity, so as to ensure that the frequency response of the speaker in the frequency band of 1kHz to 4kHz is enhanced, and the frequency response in the frequency band greater than 4kHz is lowered.

15. The method for installing and debugging an earmuff type headset according to claim 12, characterized in that: The step of performing a frequency response test on the speaker and determining the type of the tuning structure on the rear housing according to the test result comprises: Performing a frequency response test on the speaker in a frequency band of 10 Hz to 20 kHz, comparing the test frequency response curve of the speaker with a standard frequency response curve, and if the difference between the comparisons is greater than a third preset value, adjusting the tuning tube and the tuning net on the rear housing to ensure that the frequency response of the speaker in a frequency band of 10 Hz to 100 Hz is not depressed, the frequency response in a frequency band of 200 Hz to 800 Hz is depressed, and the frequency response in a frequency band greater than 1 kHz is enhanced; The step of performing a frequency response test on the speaker and determining the type of the tuning structure on the housing according to the test result comprises: A frequency response test is performed on the speaker in a frequency band of 10 Hz to 20 kHz, and a frequency response test curve of the speaker is compared with a standard frequency response curve. If a difference in the comparison is greater than a fourth preset value, the tuning net protruding from the exhaust hole on the shell cover is adjusted while ensuring that the frequency response of the speaker in the frequency band of 10 Hz to 100 Hz is not depressed, and the tuning net is checked to see whether it is well pasted.

16. The method for installing and debugging an earmuff type headset according to claim 12, characterized in that: Also includes: Installing a first pickup on the first bracket of the front shell, electrically connecting the first pickup to the first circuit board, and installing a metal mesh cover on the second bracket of the front shell so that the first pickup is covered in the metal mesh cover; And / or, it also includes: installing a second pickup on the shell cover, and electrically connecting the second pickup and the control module on the second circuit board.

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