PCB board automatic design and monitoring method, device, equipment and storage medium

Abstract

The embodiment of the present application proposes a method, device, equipment and storage medium for automatic design and monitoring of PCB boards. The method for automatic design and monitoring of PCB boards is applied to a PCB preparation system. The PCB preparation system is used to perform the same preparation process on a PCB standard board and a PCB board to be tested. The method for automatic design and monitoring of PCB boards includes: when any preparation process of a PCB standard board is completed, a plurality of standard measurement points are obtained, and the thickness of the PCB standard board is measured based on the standard measurement points to obtain a plurality of PCB standard thicknesses, and a thickness monitoring model is determined according to the PCB standard thickness; when any preparation process of a PCB board to be tested is completed, a plurality of measurement points to be tested are obtained, and the thickness of the PCB board to be tested is measured based on the measurement points to be tested to obtain a plurality of PCB thicknesses to be tested; the thickness of the PCB to be tested is judged by the thickness monitoring model to determine the thickness monitoring result. The method for automatic design and monitoring of PCB boards proposed in the embodiment of the present application can simultaneously improve the efficiency and accuracy of PCB board thickness detection.

Description

Technical Field

[0001] The present application relates to but is not limited to the field of PCB preparation technology, and in particular to a method, device, equipment and storage medium for automatic design and monitoring of PCB boards. Background Art

[0002] In recent years, the tolerance requirements for PCB finished board thickness have become increasingly stringent, gradually tightening from the common ±10% to ±8%, ±6%... The increasingly stringent tolerance for finished board thickness has put forward higher requirements for the design accuracy of the laminate thickness on the engineering side.

[0003] In the related art, after the PCB board is manufactured, the thickness is usually measured at randomly selected points on the PCB board, and whether the PCB board is qualified is judged by the board thickness tolerance. However, for fixed PCB manufacturing equipment, the error generation has certain rules. The above-mentioned random point selection measurement method not only has low detection efficiency, but also easily ignores the areas where errors frequently occur, resulting in low detection accuracy. Summary of the invention

[0004] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0005] The embodiments of the present application provide a method, device, equipment and storage medium for automatic design and monitoring of PCB boards, which can simultaneously improve the efficiency and accuracy of PCB board thickness detection.

[0006] To achieve the above-mentioned purpose, a first aspect of an embodiment of the present application proposes a PCB board automatic design and monitoring method, which is applied to a PCB preparation system. The PCB preparation system is used to perform the same preparation process on a PCB standard board and a PCB to be tested board. The PCB board automatic design and monitoring method comprises: when any one of the preparation processes of the PCB standard board is completed, a plurality of standard measurement points are obtained, and the thickness of the PCB standard board is measured based on the standard measurement points to obtain a plurality of PCB standard thicknesses, and a thickness monitoring model is determined according to the PCB standard thickness; when any one of the preparation processes of the PCB to be tested board is completed, a plurality of to-be-tested measurement points are obtained, and the thickness of the PCB to be tested board is measured based on the to-be-tested measurement points to obtain a plurality of to-be-tested PCB thicknesses; and the to-be-tested thickness of the PCB is discriminated by the thickness monitoring model to determine a thickness monitoring result.

[0007] In some embodiments, after any one preparation process of the PCB standard board is completed, the thickness of the PCB standard board is measured at multiple standard measurement points preset on the PCB standard board to obtain multiple PCB standard thicknesses, and a thickness monitoring model is determined according to the PCB standard thickness, including: after any one of the preparation processes is completed, the thickness of the PCB board is measured based on multiple preset standard measurement points to obtain the PCB standard thickness; the basic thickness of the standard measurement point on the PCB standard board is obtained, and the standard thickness change value after each preparation process is determined in sequence according to the basic thickness and the PCB standard thickness after each preparation process, wherein the standard thickness change value of the current preparation process is equal to the difference between the PCB standard thickness after the current preparation process is completed and the PCB standard thickness at the corresponding standard measurement point before the start of the current preparation process; the standard thickness change mean and standard thickness change standard deviation within the corresponding preparation process are determined in sequence according to the standard thickness change value within each preparation process; the thickness monitoring model is determined according to the basic thickness, and the standard thickness change mean and standard thickness change standard deviation within each preparation process.

[0008] In some embodiments, the thickness monitoring model includes an upper limit of process plate thickness and a lower limit of process plate thickness; the formula for determining the upper limit of process plate thickness is: ; The formula for determining the lower limit of the process plate thickness is: ; in, represents the upper limit of the process board thickness after the mth preparation process is completed, represents the lower limit of the process plate thickness after the mth preparation process is completed, represents the basic mean value obtained by averaging the basic thickness, represents the mean value of the standard thickness change after the i-th preparation process, represents the standard deviation of the standard thickness change after the i-th preparation process, and k represents the preset accuracy coefficient.

[0009] In some embodiments, the thickness monitoring model further includes a stacking thickness design upper limit and a stacking thickness design lower limit of the initial thickness to be measured of the PCB to be tested; The calculation formula for the upper limit of the stack thickness design is as follows: ; The calculation formula for the lower limit of stack thickness design is as follows: ; in, represents the upper limit of stack thickness design, Indicates the lower limit of stack thickness design, Indicates the preset required thickness of the finished plate. Indicates the preset finished plate thickness tolerance requirement value, represents the mean value of the standard thickness change after the i-th preparation process, represents the standard deviation of the standard thickness change after the i-th preparation process, and M represents the number of preparation processes.

[0010] In some embodiments, the thickness of the PCB to be measured is judged by the thickness monitoring model to determine the thickness monitoring result, including: determining the average value of the thickness to be measured after each preparation process is completed according to the thickness of the PCB to be measured at each measurement point to be measured; and judging the average value of the thickness to be measured according to the thickness monitoring model to determine the thickness monitoring result.

[0011] In some embodiments, the thickness of the PCB to be measured is judged by the thickness monitoring model to determine the thickness monitoring result, including: after any one of the preparation processes is completed, determining the mean change of the thickness to be measured corresponding to the current preparation process according to the thickness of the PCB to be measured corresponding to the current preparation process and the thickness of the PCB to be measured corresponding to the measurement point to be measured before the current preparation process is completed; judging the mean change of the thickness to be measured according to the thickness monitoring model to determine the thickness monitoring result.

[0012] In some embodiments, when any one of the preparation processes of the PCB to be tested is completed, a plurality of measurement points to be tested are obtained, and the thickness of the PCB to be tested is measured based on the measurement points to be tested to obtain a plurality of PCB to be tested thicknesses, including: randomly selecting a plurality of measurement points to be tested on the PCB to be tested; when any one of the preparation processes is completed, the thickness of the measurement points to be tested on the PCB to be tested is measured to obtain the PCB to be tested thickness.

[0013] To achieve the above-mentioned purpose, the second aspect of the present application proposes a PCB board automatic design and monitoring device, which is used to execute the PCB board automatic design and monitoring method described in the first aspect.

[0014] To achieve the above-mentioned purpose, the third aspect of an embodiment of the present application proposes an electronic device, which includes a memory and a processor, the memory stores a computer program, and the processor implements the PCB board automatic design and monitoring method described in the first aspect when executing the computer program.

[0015] To achieve the above-mentioned purpose, the fourth aspect of an embodiment of the present application proposes an electronic device and a storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the PCB board automatic design and monitoring device method described in the first aspect is implemented.

[0016] The embodiments of the present application include at least the following beneficial effects: by setting a PCB standard board, before preparing the PCB to be tested board, a high-precision preparation process is performed on the PCB standard board, after any preparation process is completed, the thickness of the PCB standard board is measured based on multiple standard measurement points to obtain the PCB standard thickness, which can reduce the error caused by random point selection, determine the thickness monitoring model according to the PCB standard thickness, and ensure the high-precision requirements of the thickness monitoring model, perform the same sequence of preparation processes on the PCB to be tested board, after any preparation process of the PCB to be tested board is completed, obtain the PCB to be tested thickness based on the to-be-tested measurement point, and judge the PCB to be tested thickness by the thickness monitoring model, so as to know whether the PCB to be tested board obtained after one of the preparation processes is qualified, so that the PCB to be tested board can be distinguished in time, and the yield rate of the PCB to be tested board can be improved; the automatic design and monitoring of PCB boards proposed in the present application In the device method, both the PCB standard board and the PCB to be tested board are obtained based on the same PCB preparation system and the same preparation process. By using the same PCB preparation system to prepare the PCB standard board, the thickness monitoring model obtained from the PCB standard thickness can effectively reflect the precision control level of the PCB preparation system. By distinguishing the PCB to be tested thickness through the thickness monitoring model, the detection efficiency of the PCB to be tested board can be improved, and the detection accuracy of the PCB to be tested board can be improved; and before the preparation process of the PCB to be tested board starts, the initial thickness of the PCB to be tested board is adjusted through the thickness monitoring model obtained from the PCB standard thickness data, so that before the preparation process of the PCB to be tested board starts, the raw material thickness of the PCB to be tested board is as close as possible to the raw material thickness of the PCB standard board, so that the quality of the raw materials for preparing the PCB to be tested board can be effectively controlled, and the qualified rate of the PCB to be tested board is improved from the source.

[0017] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0019] Figure 1 An optional flow chart of the PCB board automatic design and monitoring method provided in the embodiment of the present application; Figure 2 A schematic diagram of an optional process for determining a thickness monitoring model provided in an embodiment of the present application; Figure 3 An optional specific flow chart of determining thickness monitoring results provided in an embodiment of the present application; Figure 4 Another optional specific flow chart for determining thickness monitoring results provided in an embodiment of the present application; Figure 5 An optional specific flow chart of determining thickness monitoring results provided in an embodiment of the present application; Figure 6 An optional structural schematic diagram of a specific structure of a PCB board provided in an embodiment of the present application; Figure 7 An optional structural schematic diagram of a PCB board automatic design and monitoring device provided in an embodiment of the present application; Figure 8 An optional structural schematic diagram of a PCB preparation system provided in this embodiment; Fig. 9 A schematic diagram of an optional hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] In the description of this application, “several” means one or more, “more” means more than two, “greater than”, “less than”, “exceed”, etc. are understood to exclude the number, and “above”, “below”, “within”, etc. are understood to include the number.

[0022] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims or the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0023] In the related art, after the PCB board is manufactured, the thickness is usually measured at randomly selected points on the PCB board, and whether the PCB board is qualified is judged by the board thickness tolerance. However, for fixed PCB manufacturing equipment, the error generation has certain rules. The above-mentioned random point selection measurement method not only has low detection efficiency, but also easily ignores the areas where errors frequently occur, resulting in low detection accuracy.

[0024] Based on this, the embodiments of the present application provide a PCB board automatic design and monitoring method, device, equipment and storage medium, which can simultaneously improve the efficiency and accuracy of PCB board thickness detection.

[0025] The PCB board automatic design and monitoring method, device, equipment and storage medium provided in the embodiments of the present application are specifically illustrated through the following embodiments. First, the PCB board automatic design and monitoring method in the embodiments of the present application is described.

[0026] The automatic design and monitoring method of PCB boards provided in the embodiments of the present application relates to the field of computer technology. The automatic design and monitoring method of PCB boards provided in the embodiments of the present application can be applied to a terminal, can be applied to a server side, or can be software running in a terminal or a server side. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc.; the server side can be configured as an independent physical server, or can be configured as a server cluster or a distributed system composed of multiple physical servers, or can be configured as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application that implements the automatic design and monitoring method of PCB boards, etc., but is not limited to the above forms.

[0027] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0028] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0029] like Figure 1 As shown, Figure 1 An optional flow chart of the automatic design and monitoring method of a PCB board provided in an embodiment of the present application, the automatic design and monitoring method of the PCB board can be executed by a server, or can also be executed by a terminal, or can also be executed by a server in cooperation with a terminal, the automatic design and monitoring method of the PCB board is applied to a PCB preparation system, and the PCB preparation system is used to perform the same preparation process on a PCB standard board and a PCB to be tested board, and the automatic design and monitoring method of the PCB board includes but is not limited to the following steps S110 to S130: Step S110, after any one preparation process of the PCB standard board is completed, a plurality of standard measurement points are obtained, the thickness of the PCB standard board is measured based on the standard measurement points to obtain a plurality of PCB standard thicknesses, and a thickness monitoring model is determined according to the PCB standard thicknesses; Step S120, after any one of the preparation processes of the PCB to be tested is completed, a plurality of measurement points to be tested are obtained, and the thickness of the PCB to be tested is measured based on the measurement points to obtain a plurality of PCB to be tested thicknesses; Step S130, determining the thickness of the PCB to be measured by using the thickness monitoring model to determine the thickness monitoring result.

[0030] It can be understood that by setting a PCB standard board, before preparing the PCB to be tested board, a high-precision preparation process is performed on the PCB standard board. After any preparation process is completed, the thickness of the PCB standard board is measured based on multiple standard measurement points to obtain the PCB standard thickness, which can reduce the error caused by random point selection. The thickness monitoring model is determined according to the PCB standard thickness, which can ensure the high-precision requirements of the thickness monitoring model. The PCB to be tested board is subjected to the same preparation process in the same order. After any preparation process of the PCB to be tested board is completed, the PCB to be tested thickness is obtained based on the measurement point to be tested. The PCB to be tested thickness is judged by the thickness monitoring model, and it can be known whether the PCB to be tested board obtained after one of the preparation processes is qualified, so that the PCB to be tested board can be distinguished in time, and the yield rate of the PCB to be tested board can be improved; in the method for automatic design and monitoring of PCB boards proposed in the present application, The PCB standard board and the PCB to be tested board are both obtained based on the same PCB preparation system and the same preparation process. By using the same PCB preparation system to prepare the PCB standard board, the thickness monitoring model obtained from the PCB standard thickness can effectively reflect the precision control level of the PCB preparation system. By distinguishing the PCB to be tested thickness through the thickness monitoring model, the detection efficiency of the PCB to be tested board can be improved, and the detection accuracy of the PCB to be tested board can be improved; and before the preparation process of the PCB to be tested board begins, the initial thickness of the PCB to be tested board is adjusted through the thickness monitoring model obtained from the PCB standard thickness data, so that before the preparation process of the PCB to be tested board begins, the raw material thickness of the PCB to be tested board is as close as possible to the raw material thickness of the PCB standard board, so that the quality of the raw materials for preparing the PCB to be tested board can be effectively controlled, and the qualified rate of the PCB to be tested board can be improved from the source.

[0031] Specifically, the standard measurement can be performed by randomly selecting points on the surface of the PCB standard board, or by scanning the entire PCB standard board to obtain a high-precision thickness three-dimensional model of the PCB standard board, and selecting appropriate points in the three-dimensional model as standard measurement points according to preset accuracy requirements.

[0032] In addition, the thickness error trend in the PCB production process can be determined based on the high-precision thickness three-dimensional model of the PCB standard board. The range with the largest thickness deviation is defined on the PCB standard board in the high-precision thickness three-dimensional model. Multiple points are randomly selected within the range as measurement points to be tested. The source of the PCB thickness error can be obtained in a targeted manner. The thickness of the PCB to be tested is measured according to the above-mentioned measurement points, and the thickness of the PCB to be tested is judged based on the thickness monitoring model, which can effectively improve the thickness accuracy requirements of the PCB to be tested.

[0033] In addition, refer to Figure 6As shown in the figure, the finished PCB board basically includes 6 layers of materials, which are the basic core board, the core board surface base copper, the PP pressing medium, the outer base copper, the surface processed copper layer and the solder resist from the center to the outside. The thickness of the finished PCB board is composed of the core board medium thickness, the core board base copper thickness, the PP pressing medium thickness, the outer base copper medium thickness, the surface processed copper layer thickness and the solder resist thickness from the center of the finished board to the outside. In the preparation process of PCB, the designed basic core board is laid with the surface base copper, and the PP pressing medium and the outer base copper are laid on the basic core board for lamination; then, the laminated PCB layer is cured under high temperature and high pressure conditions to achieve a firm bond between the layers, thereby completing the lamination process. In the lamination process, the PP pressing medium is heated and pressurized under heat and pressure. The copper layer is then deposited on the outer surface of the outer copper layer to form a surface-processed copper layer, which is usually achieved by chemical copper plating or electroplating. In multi-layer PCB manufacturing, the copper plating process is mainly used to achieve metallization of connections between different layers and ensure electrical connections between different layers. A special material is then coated on the outer surface of the surface-processed copper layer to form a solder resist. The solder resist layer is usually applied to the PCB by screen printing or spraying, and then formed into a stable protective layer by thermal curing. The main function of the solder resist layer is to protect the copper layer from oxidation and corrosion, while preventing solder bridging (short circuit) or unnecessary tinning during the soldering process.

[0034] It can be seen that in the preparation process of PCB, there are raw material stacking design processes and three key preparation processes that have a great influence on the thickness of the finished PCB board, namely, the design process of controlling the raw material thickness when selecting raw materials, the pressing process of curing the laminated PCB layers under high temperature and high pressure conditions to achieve firm adhesion between layers, the electroplating process of depositing a copper layer on the outer surface of the outer base copper layer again to form a surface processed copper layer, and the solder mask process of applying it to the PCB by screen printing or spraying and then forming a stable protective layer by thermal curing. The automatic design and monitoring method of PCB boards proposed in this application will monitor and control the thickness of PCB boards based on the above four processes.

[0035] Specifically, based on the division of the above-mentioned preparation process, the standard thickness of PCB includes basic thickness, first standard thickness, second standard thickness and third standard thickness. In step S110, the staff strictly monitors the preparation process of the PCB standard board. Before the pressing process, the thickness of the PCB standard board is measured based on the standard measuring points to determine the basic thickness. Then, after the pressing process, the electroplating process and the solder mask process are completed, the thickness of the PCB standard board is measured based on the standard measuring points to obtain the first standard thickness, the second standard thickness and the third standard thickness, and the thickness monitoring model is determined based on the first standard thickness, the second standard thickness and the third standard thickness.

[0036] Similarly, based on the division of the above-mentioned preparation process, the PCB thickness to be measured includes an initial thickness to be measured, a first thickness to be measured, a second thickness to be measured and a third thickness to be measured. In step S120, after the PCB preparation system completes the design process, the pressing process, the electroplating process and the solder mask process of the PCB board to be measured, the thickness of the PCB board to be measured is measured based on the measurement points to be measured, and the initial thickness to be measured, the first thickness to be measured, the second thickness to be measured and the third thickness to be measured are obtained respectively. In step S130, the thickness monitoring model is used to analyze the processed data of the initial thickness to be measured, the first thickness to be measured, the second thickness to be measured and the third thickness to be measured, so as to obtain the thickness monitoring result.

[0037] In addition, in one embodiment of the present application, Figure 1 Step S110 in the embodiment includes but is not limited to the following steps S210 to S240: Step S210, after any preparation process is completed, the thickness of the PCB board is measured based on a plurality of preset standard measurement points to obtain the standard thickness of the PCB; Step S220, obtaining the basic thickness of the standard measurement point on the PCB standard board, and determining the standard thickness change value after each preparation process in turn according to the basic thickness and the standard thickness of the PCB after each preparation process, wherein the standard thickness change value of the current preparation process is equal to the difference between the standard thickness of the PCB after the current preparation process is completed and the standard thickness of the PCB at the corresponding standard measurement point before the start of the current preparation process; Step S230, determining the standard thickness change mean and standard thickness change standard deviation in the corresponding preparation process in turn according to the standard thickness change value in each preparation process; Step S240, determining a thickness monitoring model according to the base thickness, and the mean value of standard thickness variation and the standard deviation of standard thickness variation in each preparation process.

[0038] Specifically, after the lamination process, electroplating process and solder mask process of the PCB standard board are completed, the thickness of the PCB standard board is measured by a board thickness meter in the relevant technology, so as to obtain the first standard thickness after the lamination process, the second standard thickness after the electroplating process and the third standard thickness after the solder mask process. The standard thickness change value in each preparation process is determined according to the first standard thickness, the second standard thickness and the third standard thickness. For the convenience of description, the standard thickness change value includes the first standard change value after the lamination process, the second standard change value after the electroplating process and the second standard change value after the solder mask process. The first standard change value is equal to the difference between the first standard thickness and the base thickness at the same standard measurement point, the second standard change value is equal to the difference between the second standard thickness and the first standard thickness at the same standard measurement point, and the third standard change value is equal to the difference between the third standard thickness and the second standard thickness at the same standard measurement point.

[0039] Alternatively, before and after the pressing process of the PCB standard board is executed, the thickness of the PCB standard board is measured by a board thickness gauge to obtain the basic thickness and the first standard thickness respectively, and the first standard change value is determined by calculating the difference between the first standard thickness and the basic thickness at the same standard measuring point; after the electroplating process of the PCB standard board is completed, the second standard change value can be directly obtained by measuring the PCB standard board with a copper thickness measuring instrument in the relevant technology; after the solder mask process of the PCB standard board is completed, the third standard change value can be directly obtained by measuring the PCB standard board with an oil film measuring instrument in the relevant technology.

[0040] After any preparation process is completed, the mean and standard deviation of all standard thickness change values ​​in the current preparation process are calculated respectively, so as to obtain the mean value and standard deviation of standard thickness change corresponding to each preparation process.

[0041] It can be understood that both of the above two methods can obtain the first standard change value, the second standard change value and the third standard change value of the PCB standard board, which will not be limited here.

[0042] In some embodiments of the present application, the thickness monitoring model specifically includes the following multiple implementations: The first implementation method of the thickness monitoring model can be to calculate the upper limit and lower limit of the process board thickness. By judging whether the thickness of the PCB to be tested is between the upper limit and lower limit of the process board thickness after each preparation process is completed, it can be judged whether the PCB to be tested is qualified.

[0043] The calculation formula for the upper limit of process board thickness is as follows: ; The calculation formula for the lower limit of process board thickness is as follows: ; in, It indicates the upper limit of the process board thickness after the mth preparation process is completed. It indicates the lower limit of the process board thickness after the mth preparation process is completed.

[0044] It represents the basic mean value obtained by averaging the basic thickness. represents the mean value of standard thickness change after the i-th preparation process, It represents the standard deviation of the standard thickness change after the i-th preparation process, k represents the preset accuracy coefficient. The staff can set the accuracy coefficient according to actual needs. When k is smaller, the difference between the upper limit and the lower limit of the process board thickness is smaller, and the thickness requirement of the PCB to be tested is higher. When k is larger, the difference between the upper limit and the lower limit of the process board thickness is larger, and the thickness requirement of the PCB to be tested is looser.

[0045] For example, after the lamination process is completed, the upper limit of the process plate thickness is calculated as follows: ; The calculation formula for the lower limit of process board thickness is: .

[0046] After completing the solder mask process, the upper limit of the process board thickness is calculated as follows: ; The calculation formula for the lower limit of process board thickness is: .

[0047] In a specific implementation, after obtaining the standard thickness of the PCB in each preparation process, the average of the standard thickness of the PCB in the same preparation process is obtained to obtain the average of the standard thickness of each preparation process. At this time, the specific calculation method of the upper limit and the lower limit of the process board thickness can also be as shown below.

[0048] Another way to calculate the upper limit of process board thickness is: ; Another way to calculate the lower limit of process board thickness is: .

[0049] in, Represents the mean standard thickness after the i-1th preparation process is completed.

[0050] The thickness monitoring model may also include calculating the upper and lower limits of the thickness change. After completing the preparation process of the PCB to be tested, the thickness change value to be tested is determined according to the PCB to be tested thickness. Whether the PCB to be tested is qualified can also be determined by whether the thickness change value to be tested is between the upper and lower limits of the thickness change.

[0051] The calculation formula for the upper limit of plate thickness variation is as follows: ; The calculation formula for the lower limit of plate thickness change is as follows: .

[0052] in, represents the upper limit of the plate thickness variation obtained by the i-th preparation process, It represents the lower limit of the plate thickness variation obtained in the mth preparation process.

[0053] represents the mean value of the standard thickness variation obtained in the mth preparation process, represents the mean value and standard deviation of the standard thickness variation obtained in the mth preparation process, and k represents the preset accuracy coefficient.

[0054] It can be understood that the PCB board automatic design and monitoring method proposed in the present application is mainly aimed at monitoring the thickness error generated by the PCB during the pressing process, electroplating process and solder mask process. Therefore, by calculating the upper limit and lower limit of the board thickness change based on the standard thickness change value between each preparation process, the influence of the difference in PCB preparation raw materials on the judgment of the precision control ability of the PCB preparation system can be reduced. The upper limit and lower limit of the board thickness change obtained based on the standard thickness change value can effectively reflect the capacity fluctuation in the preparation process of the PCB to be tested, so that the PCB preparation system can be effectively adjusted.

[0055] In addition, the specific implementation method of the thickness monitoring model may also include a stacking thickness design upper limit and a stacking thickness design lower limit. The stacking thickness design upper limit and the stacking thickness design lower limit are used to limit the thickness formed after the stacking of the basic core board before the pressing process, the core board surface base copper, the PP pressing medium, and the outer layer base copper.

[0056] The calculation formula for the upper limit of the stack thickness design is as follows: ; The calculation formula for the lower limit of stack thickness design is as follows: .

[0057] in, represents the upper limit of stack thickness design, Indicates the lower limit of stack thickness design, Indicates the required thickness of the finished plate. represents the required value of the thickness tolerance of the finished plate, M represents the number of preparation processes, and in this application, M is taken as 3.

[0058] In the design process of the PCB to be tested, the initial thickness of the PCB to be tested is controlled by the above-mentioned upper and lower limits of the stacking thickness design, that is, the thickness of the basic core board, the base copper on the core board surface, the PP pressed medium, and the outer base copper after stacking is adjusted and selected so that the sum of the core board medium thickness, the core board base copper thickness, the PP pressed medium thickness, and the outer base copper medium thickness is between the lower limit of the stacking thickness design and the upper limit of the stacking thickness design.

[0059] If in the lamination process, the thickness of the basic core board, the base copper on the core board surface, the PP pressed medium, and the outer base copper after lamination is greater than the upper limit of the designed lamination thickness or less than the lower limit of the designed lamination thickness, first measure the thickness of the basic core board, the base copper on the core board surface, the PP pressed medium, and the outer base copper, and replace the raw materials with larger or smaller thickness. If the raw materials are found to be bent during the thickness measurement, or the initial thickness to be measured is still greater than the upper limit of the designed lamination thickness or less than the lower limit of the designed lamination thickness after the raw materials are replaced, stop the production of the current PCB to be tested, and conduct sampling inspection or comprehensive inspection on the raw materials in the raw material batch.

[0060] It can be understood that in the thickness monitoring model, by calculating and designing the upper and lower limits of the stack thickness design, under the strict monitoring of the staff, the accuracy of the PCB standard board can be understood as the highest capability that the PCB preparation system can achieve. Therefore, by using the data obtained by measuring the PCB standard board to limit the material selection of the initial PCB, and by strictly controlling the material of the PCB board before the PCB board is prepared, the thickness of the PCB board can be effectively controlled from the source, thereby effectively reducing the errors caused by differences in raw materials during the entire PCB production process and improving the monitoring accuracy of the error discrimination model.

[0061] In addition, refer to Figure 3 As shown, Figure 1 Step S130 in the embodiment includes but is not limited to the following steps S310 to S320: Step S310, determining the average value of the thickness to be measured after each preparation process is completed according to the thickness to be measured of the PCB at each measuring point to be measured; Step S320: judging the average value of the thickness to be measured according to the thickness monitoring model to determine the thickness monitoring result.

[0062] Specifically, similar to the PCB standard board, the PCB test board also includes 6 layers of materials, which are the basic core board, the core board surface base copper, the PP pressing medium, the outer base copper, the surface processed copper layer and the solder resist from the middle to the outside. The thickness of the PCB finished board is composed of the core board medium thickness, the core board base copper thickness, the PP pressing medium thickness, the outer base copper medium thickness, the surface processed copper layer thickness and the solder resist thickness from the center of the finished board to the outside. The production process of the PCB test board also includes the design process, the pressing process, the electroplating process and the solder resist process. After the design process, the pressing process, the electroplating process and the solder resist process of the PCB test board are completed, the thickness of the PCB test board is measured by a board thickness meter in the relevant technology, so as to obtain the initial thickness to be measured after the design process, the first thickness to be measured after the pressing process, and the thickness after the electroplating process. The second thickness to be measured and the third thickness to be measured after the solder mask process are measured. After each preparation process is completed and the PCB thickness to be measured is measured at each measurement point to be measured, the average of the PCB thickness to be measured at all measurement points to be measured in the same preparation process is calculated, so as to obtain the average thickness to be measured after each preparation process is completed. The process board thickness upper limit and the process board thickness upper limit obtained in the above embodiment are respectively compared with the average thickness to be measured. When the average thickness to be measured is greater than the process board thickness upper limit and less than the process board thickness lower limit, it means that the PCB to be measured is qualified. If the average thickness to be measured in one of the preparation processes is less than the process board thickness lower limit or greater than the process board thickness upper limit, it means that the PCB to be measured is unqualified. At this time, the operation of the PCB preparation system is stopped and the staff is notified to check and repair the corresponding position of the PCB preparation system.

[0063] In addition, refer to Figure 4 As shown, Figure 1 Step S130 in the embodiment includes but is not limited to steps S410 to S420: Step S410, after any one of the preparation processes is completed, the average change value of the thickness to be measured corresponding to the current preparation process is determined according to the PCB thickness to be measured corresponding to the current preparation process and the PCB thickness to be measured at the corresponding measuring point to be measured before the current preparation process is completed; Step S420: judging the mean value of the thickness change to be measured according to the thickness monitoring model to determine the thickness monitoring result.

[0064] Specifically, after the pressing process, electroplating process and solder resist process of the PCB to be tested are completed, the thickness of the PCB to be tested is measured by a board thickness meter in the relevant technology, so as to obtain a first thickness to be measured after the pressing process, a second thickness to be measured after the electroplating process and a third thickness to be measured after the solder resist process, and the thickness change value to be measured in each preparation process is determined according to the first thickness to be measured, the second thickness to be measured and the third thickness to be measured. For the convenience of description, the thickness change value to be measured includes the first change value to be measured after the pressing process, the second change value to be measured after the electroplating process and the second change value to be measured after the solder resist process. The first change value to be measured is equal to the difference between the first thickness to be measured and the basic thickness at the same measurement point to be measured, the second change value to be measured is equal to the difference between the second thickness to be measured and the first thickness to be measured at the same measurement point to be measured, and the third change value to be measured is equal to the difference between the third thickness to be measured and the second thickness to be measured at the same measurement point to be measured.

[0065] Alternatively, before and after the pressing process of the PCB to be tested is executed, the thickness of the PCB to be tested is measured by a plate thickness meter to obtain a basic thickness and a first thickness to be tested, respectively, and the first change value to be tested is determined by calculating the difference between the first thickness to be tested and the basic thickness at the same measuring point to be tested; after the electroplating process of the PCB to be tested is completed, the second change value to be tested can be directly obtained by measuring the PCB to be tested by a copper thickness measuring instrument in the relevant technology; after the solder mask process of the PCB to be tested is completed, the third change value to be tested can be directly obtained by measuring the PCB to be tested by an oil film measuring instrument in the relevant technology.

[0066] After one of the preparation processes is completed, the average value of the thickness change to be measured is compared with the upper and lower limits of the thickness change. When the average value of the thickness change to be measured is greater than the lower limit of the thickness change and less than the upper limit of the thickness change, it means that the PCB to be tested is qualified. If the average value of the thickness change to be measured is less than the lower limit of the thickness change and greater than the upper limit of the thickness change, it means that the PCB to be tested is unqualified. At this time, the operation of the PCB preparation system is stopped and the staff is notified to inspect and repair the corresponding position of the PCB preparation system.

[0067] In the design process and the lamination process, the thickness of the basic core board, the base copper on the surface of the core board, the PP pressed medium, and the PP pressed medium covered with the outer base copper are measured respectively. The sum of the thickness of the basic core board, the base copper on the surface of the core board, and the PP pressed medium covered with the outer base copper should be between the upper and lower design limits of the lamination thickness design. If the sum of the thickness is outside the upper and lower design limits of the lamination thickness design, the basic core board, the base copper on the surface of the core board, the PP pressed medium, or the PP pressed medium covered with the outer base copper is replaced; if the sum of the thickness of the basic core board, the base copper on the surface of the core board, and the PP pressed medium covered with the outer base copper is between the upper and lower design limits of the lamination thickness design, but after laminating the above materials, the initial measured thickness obtained by lamination is outside the upper and lower design limits of the lamination thickness design, indicating that the initial raw materials may have quality problems such as unevenness, then the current batch of raw materials is inspected.

[0068] It should be noted that the above two methods for obtaining the standard thickness change value and the thickness change value to be measured can be selected and combined according to the actual scenario, and will not be limited here.

[0069] In addition, refer to Figure 5 As shown, Figure 1 Step S120 in the embodiment includes but is not limited to the following steps S510 to S520: Step S510, randomly selecting a plurality of measurement points to be tested on the PCB to be tested; Step S520, when any one of the preparation processes is completed, the thickness of the to-be-measured point on the to-be-measured PCB is measured to obtain the to-be-measured thickness of the PCB.

[0070] A first specific implementation method of randomly selecting the measurement points to be tested may be to set a rectangular coordinate system on the surface of the PCB to be tested, define a range on the rectangular coordinate system according to the length and width of the PCB to be tested, and randomly select a preset number of points in the range defined by the rectangular coordinate system as the measurement points to be tested of the PCB to be tested.

[0071] It can be understood that by completely randomly selecting the measurement points to be measured on the PCB to be tested, the randomness of the PCB thickness to be measured can be ensured, and the mean value of the thickness to be measured and the mean value of the thickness variation to be measured can be ensured to be convincing for accuracy judgment.

[0072] A second specific implementation method of randomly selecting the measurement points to be tested is to divide the surface of the PCB to be tested into a plurality of rectangles of the same size according to the number of the measurement points to be tested, and randomly select a point on each rectangle to determine the measurement points to be tested of the PCB to be tested.

[0073] It can be understood that when selecting the measurement points to be measured, the surface of the PCB to be measured is divided into multiple rectangles of the same size, the rectangles are evenly distributed on the surface of the PCB to be measured, and the measurement points to be measured are randomly selected on the rectangles, so that the randomness of the measurement points to be measured and the uniformity on the PCB surface can be guaranteed at the same time, ensuring that the thickness of the PCB to be measured can be measured in each subdivided area on the PCB to be measured, thereby improving the accuracy of thickness monitoring.

[0074] In addition, the thickness error trend in the PCB production process can be determined based on the high-precision thickness three-dimensional model of the PCB standard board. The range with the largest thickness deviation is defined on the PCB standard board in the high-precision thickness three-dimensional model. Multiple points are randomly selected within the range as measurement points to be tested. The source of the PCB thickness error can be obtained in a targeted manner. The thickness of the PCB to be tested is measured according to the above-mentioned measurement points, and the thickness of the PCB to be tested is judged based on the thickness monitoring model, which can effectively improve the thickness accuracy requirements of the PCB to be tested.

[0075] In addition, refer to Figure 7 As shown, the embodiment of the present application also proposes a PCB board automatic design and monitoring device 700, comprising: The standard acquisition module 701 is used to acquire a plurality of standard measurement points after any preparation process of the PCB standard board is completed, measure the thickness of the PCB standard board based on the standard measurement points, obtain a plurality of PCB standard thicknesses, and determine a thickness monitoring model according to the PCB standard thicknesses; The thickness measurement module 702 is used to obtain a plurality of measurement points to be measured after any preparation process of the PCB to be tested is completed, and measure the thickness of the PCB to be tested based on the measurement points to obtain a plurality of PCB to be tested thicknesses; The determination module 703 is used to determine the thickness of the PCB to be measured by using a thickness monitoring model to determine the thickness monitoring result.

[0076] It can be understood that the specific implementation of the PCB board automatic design and monitoring device is basically the same as the specific implementation of the above-mentioned PCB board automatic design and monitoring method, and will not be repeated here.

[0077] In addition, refer to Figure 8 As shown, the embodiment of the present application also proposes a PCB preparation system, including: A design module 810, configured to select and control the quality of the base material of the PCB board according to a stack thickness design upper limit and a stack thickness design lower limit; A laminating module 820 is used to perform lamination processing on the PCB board; The electroplating module 830 is used to perform electroplating on the PCB board; The solder resist module 840 is used to perform solder resist processing on the PCB board; The control module 850 , the design module 810 , the lamination module 820 , the electroplating module 830 and the solder resist module 840 are respectively connected to the control module 850 for communication.

[0078] Thickness measuring instruments are respectively provided in the lamination module 820, the electroplating module 830 and the solder resist module 840. Specifically, the thickness measuring instrument in the electroplating module 830 may be a copper thickness measuring instrument, and the thickness measuring instrument in the solder resist module 840 may be an oil film measuring instrument, which is used to measure the thickness of the solder resist layer. The PCB preparation system may further include a final inspection module 860, which is communicatively connected to the control module 850, and the final inspection module 860 includes a board thickness measuring instrument, which is used to measure the thickness of the finished board.

[0079] In addition, refer to Fig. 9 , Fig. 9 The hardware structure of an electronic device of another embodiment is illustrated, and the electronic device includes: The processor 901 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory 902 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 902 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 902, and the processor 901 calls and executes the PCB board automatic design and monitoring method of the embodiment of the present application, for example, executing the above-described Figure 1 Steps S110 to S130 of the method, Figure 2 Steps S210 to S240 of the method, Figure 3 Steps S310 to S320 of the method, Figure 4 Steps S410 to S420 of the method, Figure 5 Steps S510 to S520 of the method; Input / output interface 903, used to implement information input and output; Communication interface 904, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.); A bus 905 that transmits information between various components of the device (e.g., the processor 901, the memory 902, the input / output interface 903, and the communication interface 904); The processor 901 , the memory 902 , the input / output interface 903 and the communication interface 904 are connected to each other in communication within the device via a bus 905 .

[0080] The embodiment of the present application also provides a storage medium, which is a computer-readable storage medium for computer-readable storage. The storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the above-mentioned PCB board automatic design and monitoring method, for example, to execute the above-described Figure 1 Steps S110 to S130 of the method, Figure 2 Steps S210 to S240 of the method, Figure 3 Steps S310 to S320 of the method, Figure 4 Steps S410 to S420 of the method, Figure 5 Method steps S510 to S520.

[0081] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0082] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0083] It can be understood by those skilled in the art that Figures 1 to 5 The technical solutions shown in the figure do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than those shown in the figure, or a combination of certain steps, or different steps.

[0084] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0085] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0086] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0087] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0088] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0089] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0090] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0091] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes multiple instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, and other media that can store programs.

[0092] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A PCB board automatic design and monitoring method, characterized in that: Applied to a PCB preparation system, the PCB preparation system is used to perform the same preparation process on a PCB standard board and a PCB to be tested board, and the PCB board automatic design and monitoring method includes: When any one of the preparation processes of the PCB standard board is completed, a plurality of standard measurement points are obtained, the thickness of the PCB standard board is measured based on the standard measurement points to obtain a plurality of PCB standard thicknesses, and a thickness monitoring model is determined according to the PCB standard thicknesses; The initial thickness of the PCB to be tested is adjusted according to the thickness monitoring model, and after any one of the preparation processes of the PCB to be tested is completed, a plurality of measurement points to be tested are obtained, and the thickness of the PCB to be tested is measured based on the measurement points to obtain a plurality of PCB thicknesses to be tested; The thickness of the PCB to be measured is judged by the thickness monitoring model to determine the thickness monitoring result.

2. The PCB board automatic design and monitoring method according to claim 1, characterized in that: After any one preparation process of the PCB standard board is completed, the thickness of the PCB standard board is measured at a plurality of standard measurement points preset on the PCB standard board to obtain a plurality of PCB standard thicknesses, and a thickness monitoring model is determined according to the PCB standard thicknesses, including: After any one of the preparation processes is completed, the thickness of the PCB board is measured based on a plurality of preset standard measurement points to obtain a standard thickness of the PCB; Obtaining the basic thickness of the standard measurement point on the PCB standard board, and determining the standard thickness change value after each preparation process in sequence according to the basic thickness and the standard thickness of the PCB after each preparation process, wherein the standard thickness change value of the current preparation process is equal to the difference between the standard thickness of the PCB after the current preparation process is completed and the standard thickness of the PCB at the corresponding standard measurement point before the start of the current preparation process; Determine the standard thickness change mean and standard thickness change standard deviation in the corresponding preparation process in sequence according to the standard thickness change value in each preparation process; A thickness monitoring model is determined based on the basic thickness, the mean value of the standard thickness variation within each of the preparation processes, and the standard deviation of the standard thickness variation.

3. The PCB board automatic design and monitoring method according to claim 2 is characterized in that: The thickness monitoring model includes an upper limit of process plate thickness and a lower limit of process plate thickness; The formula for determining the upper limit of the process plate thickness is: ； The formula for determining the lower limit of the process plate thickness is: ； in, represents the upper limit of the process board thickness after the mth preparation process is completed, represents the lower limit of the process plate thickness after the mth preparation process is completed, represents the basic mean value obtained by averaging the basic thickness, represents the mean value of the standard thickness change after the i-th preparation process, represents the standard deviation of the standard thickness change after the i-th preparation process, and k represents the preset accuracy coefficient.

4. The PCB board automatic design and monitoring method according to claim 2 is characterized in that: The thickness monitoring model also includes a stacking thickness design upper limit and a stacking thickness design lower limit of the initial thickness to be measured of the PCB to be tested; The calculation formula for the upper limit of the stack thickness design is as follows: ； The calculation formula for the lower limit of stack thickness design is as follows: ； in, represents the upper limit of stack thickness design, Indicates the lower limit of stack thickness design, Indicates the preset required thickness of the finished plate. Indicates the preset finished plate thickness tolerance requirement value, represents the mean value of the standard thickness change after the i-th preparation process, represents the standard deviation of the standard thickness change after the i-th preparation process, and M represents the number of preparation processes.

5. The PCB board automatic design and monitoring method according to claim 1, characterized in that: The step of determining the thickness of the PCB to be measured by using the thickness monitoring model to determine the thickness monitoring result includes: Determine the average value of the thickness to be measured after each of the preparation processes is completed according to the thickness to be measured of the PCB at each of the measurement points to be measured; The thickness mean to be measured is judged according to the thickness monitoring model to determine the thickness monitoring result.

6. The PCB board automatic design and monitoring method according to claim 1, characterized in that: The step of determining the thickness of the PCB to be measured by using the thickness monitoring model to determine the thickness monitoring result includes: After any one of the preparation processes is completed, determining a mean change value of the thickness to be measured corresponding to the current preparation process according to the PCB thickness to be measured corresponding to the current preparation process and the PCB thickness to be measured corresponding to the measurement point to be measured before the current preparation process is completed; The thickness monitoring model is used to determine the thickness change mean to be measured, and the thickness monitoring result is determined.

7. The PCB board automatic design and monitoring method according to claim 1, characterized in that: After any one of the preparation processes of the PCB to be tested is completed, a plurality of measurement points to be tested are obtained, and the thickness of the PCB to be tested is measured based on the measurement points to obtain a plurality of PCB to be tested thicknesses, including: Randomly select a plurality of measurement points to be tested on the PCB to be tested; When any one of the preparation processes is completed, the thickness of the to-be-measured measuring point on the to-be-measured PCB board is measured to obtain the to-be-measured thickness of the PCB.

8. A PCB board automatic design and monitoring device, characterized in that: The PCB board automatic design and monitoring device is used to execute the PCB board automatic design and monitoring method according to any one of claims 1 to 7.

9. An electronic device, characterized in that: The electronic device comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the PCB board automatic design and monitoring method according to any one of claims 1 to 7 when executing the computer program.

10. A storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for automatic design and monitoring of PCB boards according to any one of claims 1 to 7 is implemented.

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