Display panel and method for preparing the same

Abstract

The present invention discloses a display panel and a method for preparing the display panel, and relates to the field of display technology. The display panel includes at least one display screen, a support plate and a control chip. The display screen includes a display layer, a control line group and a substrate. The substrate is arranged on the backlight side of the display layer. The first end of the control line group is connected to the display layer. The second end of at least part of the control line group extends to the side of the substrate away from the display layer through the side wall of the substrate. The support plate is arranged on the side of the control line group away from the display layer. A conductive structure is arranged in the area where the support plate contacts the control line group. The conductive structure is electrically connected to the control line group on the side away from the display layer. The control chip is arranged on the side of the support plate away from the display screen, and the control chip is electrically connected to the conductive structure. The display panel can avoid the influence of high temperature and high pressure processes on the display screen, protect TFT switches and light-emitting devices, and improve product yield.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a method for preparing the display panel. Background Art

[0002] With the development of display technology, the application of super-large display panels is becoming more and more extensive. Super-large display panels can meet people's needs for long-distance viewing and large information display. Due to cost considerations, current super-large display panels are usually realized by splicing technology, that is, multiple display screens are spliced ​​together to form a super-large display panel.

[0003] In order to improve the display effect, the display screen requires a borderless or narrow border design, which means that the control chip of the display screen can only be set on the back of the display screen. However, the product yield of the display screen needs to be improved. Summary of the invention

[0004] The purpose of the present invention is to provide a display panel and a method for preparing the display panel, which can avoid the influence of high temperature and high pressure processes on the display screen, protect TFT switches and light-emitting devices, and improve product yield.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A display panel, comprising:

[0007] At least one display screen, the display screen comprising a display layer, a control line group and a substrate, the substrate being disposed on a backlight side of the display layer, a first end of the control line group being connected to the display layer, and a second end of at least part of the control line group extending around a side wall of the substrate to a side of the substrate away from the display layer;

[0008] A support plate, arranged on a side of the control line group away from the display layer, wherein a conductive structure is arranged in a region where the support plate contacts the control line group, and the conductive structure is electrically connected to the control line group on a side away from the display layer;

[0009] At least one control chip is disposed on a side of the support plate away from the display screen, and the control chip is electrically connected to the conductive structure.

[0010] As a preferred solution of the above display panel, at least one connection hole is formed on the support plate, the connection hole penetrates the support plate along the thickness direction of the support plate, and the control chip is electrically connected to the conductive structure through the connection hole.

[0011] As a preferred solution of the above display panel, the control chip is connected to the conductive structure via a connecting wire, one end of the connecting wire is electrically connected to the control chip, and the other end extends along the connecting hole and is electrically connected to the conductive structure; and / or,

[0012] The connection hole is filled with conductive material, the position of the connection hole corresponds to the position of the conductive structure, one end of the connection hole close to the substrate is electrically connected to the conductive structure, and one end of the connection hole away from the substrate is electrically connected to the control chip through a connecting wire.

[0013] As a preferred solution of the above-mentioned display panel, there are multiple connecting holes and multiple connecting wires, the multiple connecting wires extend along a first direction, the first direction forms an angle with the arrangement direction of the multiple connecting wires, and the multiple connecting wires are arranged one-to-one with the multiple connecting holes.

[0014] As a preferred solution of the above display panel, the plurality of connection holes are staggered along the first direction.

[0015] Preferably, the diameter of the connecting hole is larger than the width of the connecting line.

[0016] As a preferred solution of the above-mentioned display panel, any two adjacent connection holes along the second direction are staggered along the first direction, and the connection holes on both sides of any three connection holes arranged continuously are on the same side of the connection hole in the middle, and the second direction is perpendicular to the first direction.

[0017] As a preferred solution of the above-mentioned display panel, an alignment structure is provided on the side of the substrate facing away from the display layer and on the side of the support plate close to the substrate, and the alignment structure is configured to limit the relative position between the substrate and the support plate to achieve electrical connection between the conductive structure on the support plate and the control line group on the substrate.

[0018] As a preferred solution of the above-mentioned display panel, among the alignment structures of the substrate and the support plate, one is an insertion part and the other is an insertion slot, and the insertion part is inserted into the insertion slot to limit the relative position between the substrate and the support plate.

[0019] As a preferred solution of the above display panel, a connecting layer is provided between the substrate and the support plate;

[0020] Preferably, a packaging layer is provided on a side of the display layer facing away from the substrate.

[0021] A method for preparing a display panel comprises the following steps:

[0022] Provide at least one display screen, the display screen comprising a display layer, a control line group and a substrate, the substrate being disposed on a backlight side of the display layer, a first end of the control line group being connected to the display layer, and a second end of at least part of the control line group extending around a side wall of the substrate to a side of the substrate away from the display layer;

[0023] A support plate is provided, wherein a conductive structure is disposed on one side of the support plate, and a control chip electrically connected to the conductive structure is disposed on the other side of the support plate;

[0024] The side of the support plate provided with the conductive structure is arranged on the side of the substrate away from the display layer, and it is ensured that the conductive structure is electrically connected to the control line group on the side away from the display layer.

[0025] Beneficial effects of the present invention:

[0026] The present invention provides a display panel and a method for preparing the display panel. In the display panel, a support plate is a support structure of the display panel, and a display screen and a control chip are respectively arranged on both sides of the support plate. During the production process, the conductive structure of the support plate can be electrically connected to the control chip first, and then the display screen and the support plate can be fixed, so that the control line group on the side of the substrate of the display screen away from the display layer abuts against the conductive structure of the support plate, thereby realizing the electrical connection between the control chip and the display screen. Moreover, the second end of part of the control line group passes through the side wall of the substrate, and the contact area between the control line group and the air is large, which can effectively improve the heat dissipation effect of the control line group, avoid heating of the circuit, reduce energy consumption, and also improve the stability and safety of the display panel.

[0027] The display panel can avoid the impact of high temperature and high pressure processes on the display screen, protect TFT switches and light-emitting devices, and improve product yield and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a bottom view of the display panel provided by the present invention;

[0029] Figure 2 yes Figure 1 Sectional view at AA in the middle;

[0030] Figure 3 yes Figure 1 Sectional view at the middle BB;

[0031] Figure 4 It is a schematic diagram of the structure of the display panel provided by the present invention.

[0032] In the figure:

[0033] 1. Display screen; 2. Support board; 3. Control chip; 4. Connection layer; 5. FPC board;

[0034] 11. Display layer; 12. Control line group; 13. Substrate; 21. Connection hole; 22. Conductive structure; 31. Connection line. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0037] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0040] With the development of display technology, the application of super-large-size display panels is becoming more and more widespread. Super-large-size display panels can meet people's needs for long-distance viewing, large information display, etc. This embodiment provides a display device, which includes a display panel. The display panel is relatively large in size. For cost considerations, the current super-large-size display panel is usually realized by splicing technology, that is, multiple display screens are spliced ​​together to form a super-large-size display panel.

[0041] In order to improve the display effect, the display screen requires a borderless or narrow border design, which means that the control chip of the display screen can only be set on the back of the display screen. However, in the existing related technology, the control chip needs to go through a high temperature and high pressure process to complete the electrical connection with the control line group of the display screen. The high temperature and high pressure environment can easily cause damage to TFT switches and light-emitting devices, causing display abnormalities on the display screen, which restricts the product yield.

[0042] like Figure 1 to Figure 3 As shown, in this embodiment, the display panel includes a display screen 1 and a control chip 3, wherein the display screen 1 includes a display layer 11, a control line group 12 and a substrate 13, the substrate 13 is arranged on the backlight side of the display layer 11, and is a supporting structure of the display screen 1, and the control line group 12 needs to be electrically connected to the control chip 3 so that the control chip 3 can drive the display layer 11 to display images.

[0043] In order to avoid abnormal display of the display screen 1 caused by a high temperature and high pressure environment, the display panel provided in this embodiment also includes at least one display screen 1 and a support plate 2, and the control chip 3 corresponds to the display screen 1, and is also at least one. The first end of the control line group 12 of the display screen 1 is connected to the display layer 11, and the second end of at least part of the control line group 12 is extended to the side of the substrate 13 away from the display layer 11 through the side wall of the substrate 13, and the support plate 2 is arranged on the side of the control line group 12 away from the display layer 11, and a conductive structure 22 is arranged in the area where the support plate 2 contacts the control line group 12, and the conductive structure 22 is electrically connected to the control line group 12 on the side away from the display layer 11, and the control chip 3 is arranged on the side of the support plate 2 away from the display screen 1, and the control chip 3 is electrically connected to the conductive structure 22.

[0044] In the display panel, the support plate 2 is the support structure of the display panel, and the display screen 1 and the control chip 3 are respectively arranged on both sides of the support plate 2. During the production process, the conductive structure 22 of the support plate 2 can be electrically connected to the control chip 3 first, and then the display screen 1 and the support plate 2 are fixed, so that the control line group 12 on the side of the substrate 13 of the display screen 1 away from the display layer 11 abuts against the conductive structure 22 of the support plate 2, thereby realizing the electrical connection between the control chip 3 and the display screen 1. Moreover, the second end of part of the control line group 12 passes through the side wall of the substrate 13, and the contact area between the control line group 12 and the air is large, which can effectively improve the heat dissipation effect of the control line group 12, avoid the control line group 12 from heating, reduce energy consumption, and improve the stability and safety of the display panel.

[0045] In the present invention, the display panel is provided with a conductive structure 22 on the support plate 2, the control chip 3 is electrically connected to the conductive structure 22, and the wire structure is electrically connected to the control wire group 12 on the display screen 1, thereby realizing the control chip 3 to control the display screen 1. In the display panel of the present invention, the electrical connection between the control chip 3 and the conductive structure 22 does not need to go through a high temperature and high pressure process, which can protect the TFT switch and the light-emitting device, and improve the product yield and safety.

[0046] It is understandable that the second ends of the control line group 12 may also all extend around the side wall of the substrate 13 to the side of the substrate 13 away from the display layer 11 to improve the heat dissipation effect.

[0047] It is worth noting that, since the thickness of the control line group 12 is relatively thin, the control line group 12 extending to the side wall of the substrate 13 will not affect the splicing effect between two adjacent display screens 1. In addition, the display layer 11 can also protrude from the substrate 13 on the side where the control line group 12 bypasses the substrate 13 to cover the control line group 12 on the side wall of the substrate 13, thereby further reducing the influence of the control line group 12 on the splicing effect of the display screen 1.

[0048] like Figure 1 to Figure 3 As shown, the display panel may include a display screen 1, and the support plate 2 only supports the single display screen 1; Figure 4 As shown, the display panel may also include multiple display screens 1, in which case the support plate 2 supports the multiple display screens 1. The multiple display screens 1 may be fixed to the support plate 2 in an array according to actual splicing needs, or other arrangements may be selected. Among them, the control chip 3 corresponding to each display screen 1 is connected to the external circuit of the display panel through an FPC board 5 (Flexible Printed Circuit) to power the display screen 1 and control the overall display content.

[0049] Among them, the support plate 2 is a glass plate. The glass material has no freely moving charges, has excellent dielectric properties, and does not require the deposition of an insulating layer. Large-sized glass panels are easy to obtain, so the cost of the glass plate is low. Moreover, due to the high strength and strong mechanical stability of the glass plate, even when the thickness of the support plate 2 is small, the warping is still very small. In this embodiment, at least one connection hole 21 is opened on the support plate 2, and the connection hole 21 passes through the support plate 2 along the thickness direction of the support plate 2. The control chip 3 is electrically connected to the conductive structure 22 through the connection hole 21.

[0050] As an implementation mode, after a hole is opened on the support plate 2, the electrical connection between the control chip 3 and the control line group 12 can be completed by filling the conductive material in the connection hole 21. Among them, the connection hole 21 is opened by TGV (Through-GlassVia) technology. Specifically, in this embodiment, the position of the connection hole 21 corresponds to the position of the wire structure set on the support plate 2, and the end of the connection hole 21 close to the substrate 13 is electrically connected to the conductive structure 22, and the end of the connection hole 21 away from the substrate 13 is electrically connected to the control chip 3 through the connecting wire 31, thereby realizing the electrical connection between the control line group 12 and the control chip 3. Among them, the electrical connection between the connection hole 21 and the conductive structure 22 and the connecting wire 31 is realized by the conductive material in the connection hole 21.

[0051] As another embodiment, one end of the connecting wire 31 is electrically connected to the control chip 3, and the other end extends along the connecting hole 21 to the conductive structure 22 of the support plate 2 and is electrically connected thereto, that is, the control chip 3 is electrically connected to the control wire group 12 through the connecting wire 31 passing through the connecting hole 21.

[0052] like Figure 1 and Figure 3 As shown, in order to complete complex image display, there are multiple connection holes 21, multiple connection lines 31, and multiple connection lines 31 extend along a first direction. The first direction forms an angle with the arrangement direction of the multiple connection lines 31, and the multiple connection lines 31 correspond one by one to the multiple connection holes 21. The multiple connection lines 31 correspond to the conductive structure 22 of the support plate 2 and the control line group 12 of the display screen 1, so that the control chip 3 can control the display content and display effect of the display layer 11 through different lines, and the multiple connection lines 31 all extend along the first direction, which can effectively avoid mutual interference between the connection lines 31, and is convenient for design and simplifies the structure.

[0053] In this embodiment, a plurality of connection holes 21 are staggered along the first direction. The staggered arrangement means that the distances between the connection holes 21 and the control chip 3 are not equal, that is, the lengths of the connection wires 31 connected to different connection holes 21 are different, or the lengths of the connection wires 31 passing through different connection holes 21 are different, so that the connection holes 21 are arranged too densely, resulting in a low fault tolerance of the connection wires 31, which is easy to interfere with each other and cause a short circuit, so that the requirements for precision in the production process are too high, which will lead to an increase in cost.

[0054] Furthermore, the diameter of the connection hole 21 is larger than the width of the connection line 31. The multiple connection holes 21 are staggered, which also provides an aperture for increasing the diameter of the connection hole 21. The connection hole 21 has a larger diameter, which can ensure that the connection line 31 can be connected to or penetrated to the corresponding connection hole 21 when the connection line 31 is connected to the connection hole 21, or when the connection line 31 penetrates the connection hole 21 and connects to the conductive structure 22. In this way, when connecting the control chip 3 and the support plate 2, even if the alignment accuracy of the control chip 3 and the support plate 2 is not high, and there is a certain degree of deviation in the relative position of the control chip 3 and the support plate 2, as long as the deviation value of the connecting wire 31 in the second direction (the second direction is perpendicular to the first direction) is less than half of the difference between the aperture of the connecting hole 21 and the width of the connecting wire 31, it is possible to ensure that the connecting wire 31 is electrically connected to the connecting hole 21, or to ensure that the connecting wire 31 can smoothly pass through the connecting hole 21 to achieve electrical connection with the conductive structure 22, and then achieve electrical connection with the control wire group 12, which greatly reduces the requirements for precision in the production process, thereby improving production efficiency and reducing costs.

[0055] In this embodiment, any two adjacent connection holes 21 along the second direction are staggered along the first direction, and any three connection holes 21 arranged continuously, the connection holes 21 located on both sides are on the same side of the connection hole 21 located in the middle. In other words, the connection holes 21 are divided into two groups. Along the second direction, the connection holes 21 of the odd-numbered sequence are one group, and the connection holes 21 of the even-numbered sequence are another group. Therefore, the two adjacent connection holes 21 along the second direction belong to different groups. Figure 1 The connection holes 21 of the same group are arranged along the second direction. This arrangement can ensure that the connection holes 21 are staggered, thereby providing space for expanding the aperture of the connection holes 21, and make the arrangement of the connection holes 21 more regular, which is convenient for design and electrical connection between the connection wires 31 and the connection holes 21.

[0056] In order to further improve the accuracy of the relative position between the display screen 1 and the support plate 2, an alignment structure is provided on the side of the substrate 13 facing away from the display layer 11 and on the side of the support plate 2 close to the substrate 13. The alignment structure is configured to limit the relative position between the substrate 13 and the support plate 2 to achieve electrical connection between the conductive structure 22 on the support plate 2 and the control line group 12 on the substrate 13.

[0057] Specifically, the alignment structure of the substrate 13 is a plug-in portion, and the alignment structure of the support plate 2 is a plug-in slot, and the plug-in portion is inserted into the plug-in slot to limit the relative position between the substrate 13 and the support plate 2. When the display screen 1 and the support plate 2 are aligned, first ensure that the positions of the conductive structure 22 on the support plate 2 correspond to the control line group 12, that is, after the conductive structure 22 and the control line group 12 are electrically connected, the plug-in portion is inserted into the plug-in slot, so that the accuracy of the relative position of the display screen 1 and the support plate 2 can be ensured, thereby ensuring the electrical connection between the control line group 12 and the corresponding conductive structure 22, and then the display screen 1 and the support plate 2 can be fixed.

[0058] It is understandable that the alignment structure of the substrate 13 may be a plug-in slot, and the alignment structure of the support plate 2 may be a plug-in portion, which can also limit the relative position between the display screen 1 and the support plate 2.

[0059] In this embodiment, a connection layer 4 is provided between the substrate 13 and the support plate 2, and the connection layer 4 is configured to connect the substrate 13 and the support plate 2 so that the display panel forms a whole. Specifically, the connection layer 4 is formed by gluing with an adhesive, which has a simple process and a reliable structure. The electrical connection between the connection hole 21 of the support plate 2 and the control line group 12 of the display screen 1 can be performed by materials such as solder, nano silver, nano copper, and conductive glue.

[0060] In this embodiment, a packaging layer is disposed on the side of the display layer 11 facing away from the substrate 13. The packaging layer can protect the internal structure of the display panel from moisture and dust, thereby reducing the aging speed, improving the service life and user experience.

[0061] This embodiment further provides a method for preparing a display panel, which is used to prepare the above-mentioned display panel. The method for preparing the display panel includes:

[0062] At least one display screen 1 is provided, the display screen 1 comprises a display layer 11, a control line group 12 and a substrate 13, the substrate 13 is arranged on the backlight side of the display layer 11, a first end of the control line group 12 is connected to the display layer 11, and a second end of at least part of the control line group 12 is extended around the side wall of the substrate 13 to a side of the substrate 13 away from the display layer 11;

[0063] A support plate 2 is provided, a conductive structure 22 is disposed on one side of the support plate 2, and a control chip 3 electrically connected to the conductive structure 22 is disposed on the other side;

[0064] The side of the support plate 2 provided with the conductive structure 22 is arranged on the side of the substrate 13 away from the display layer 11 , and the conductive structure 22 is ensured to be electrically connected to the control line group 12 on the side away from the display layer 11 .

[0065] When preparing the display panel, first confirm how many display screens 1 need to be arranged on the support plate 2, and the arrangement of the display screens 1, and then arrange the side of the support plate 2 provided with the conductive structure 22 on the side of the substrate 13 away from the display layer 11, and ensure that the conductive structure 22 is electrically connected to the control line group 12 on the side away from the display layer 11, and then arrange the control chip 3 on the side of the support plate 2 away from the display screen 1, and electrically connect the control chip 3 to the conductive structure 22. The display screen 1 of the present invention can realize the electrical connection between the control chip 3 and the conductive structure 22 without going through a high temperature and high pressure process, can protect TFT switches and light-emitting devices, and improve product yield and safety.

[0066] In this embodiment, in order to protect the display screen 1, the electrical connection between the conductive structure 22 of the support plate 2 and the control line group 12 of the display screen 1 can be made by using materials such as solder, nano silver, nano copper, conductive glue, etc. with low temperature and low pressure.

[0067] Preferably, a plurality of connection holes 21 are provided on the support plate 2, and the connection holes 21 penetrate the support plate 2 along the thickness direction of the support plate 2, and the control chip 3 is electrically connected to the conductive structure 22 through the connection holes 21, thereby achieving electrical connection between the control chip 3 and the control line group 12 on the display screen 1. The specific arrangement of the connection holes 21 can refer to the above embodiment.

[0068] Among them, the support plate 2 is a glass plate. The glass material has no freely moving charges, has excellent dielectric properties, and does not require the deposition of an insulating layer. Large-sized glass panels are easy to obtain, so the cost of the glass plate is low. Moreover, due to the high strength and strong mechanical stability of the glass plate, even when the thickness of the support plate 2 is small, the warping is still very small. Specifically, the connection hole 21 is opened by TGV (Through-Glass Via) technology.

[0069] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The content of this specification should not be understood as limiting the present invention.

Claims

1. A display panel, characterized in that: include: At least one display screen, the display screen comprising a display layer, a control line group and a substrate, the substrate being disposed on a backlight side of the display layer, a first end of the control line group being connected to the display layer, and a second end of at least part of the control line group extending around a side wall of the substrate to a side of the substrate away from the display layer; A support plate, arranged on a side of the control line group away from the display layer, wherein a conductive structure is arranged in a region where the support plate contacts the control line group, and the conductive structure is electrically connected to the control line group on a side away from the display layer; At least one control chip is disposed on a side of the support plate away from the display screen, and the control chip is electrically connected to the conductive structure.

2. The display panel according to claim 1, characterized in that: At least one connection hole is formed on the support plate, and the connection hole penetrates the support plate along the thickness direction of the support plate. The control chip is electrically connected to the conductive structure through the connection hole.

3. The display panel according to claim 2, characterized in that: The control chip is connected to the conductive structure via a connecting wire, one end of the connecting wire is electrically connected to the control chip, and the other end of the connecting wire extends along the connecting hole and is electrically connected to the conductive structure; and / or, The connection hole is filled with conductive material, the position of the connection hole corresponds to the position of the conductive structure, one end of the connection hole close to the substrate is electrically connected to the conductive structure, and one end of the connection hole away from the substrate is electrically connected to the control chip through a connecting wire.

4. The display panel according to claim 3, characterized in that: There are a plurality of connection holes and a plurality of connection wires, the plurality of connection wires extend along a first direction, the first direction forms an angle with an arrangement direction of the plurality of connection wires, and the plurality of connection wires are arranged in a one-to-one correspondence with the plurality of connection holes.

5. The display panel according to claim 4, characterized in that: The plurality of connecting holes are staggered along the first direction; Preferably, the diameter of the connecting hole is larger than the width of the connecting line.

6. The display panel according to claim 4, characterized in that: Any two adjacent connection holes along the second direction are staggered along the first direction, and the connection holes on both sides of any three connection holes arranged continuously are on the same side of the connection hole in the middle, and the second direction is perpendicular to the first direction.

7. The display panel according to claim 1, characterized in that: An alignment structure is provided on the side of the substrate facing away from the display layer and on the side of the support plate close to the substrate. The alignment structure is configured to limit the relative position between the substrate and the support plate to achieve electrical connection between the conductive structure on the support plate and the control line group on the substrate.

8. The display panel according to claim 7, characterized in that: Among the alignment structures of the substrate and the support plate, one is an inserting portion and the other is an inserting slot, and the inserting portion is inserted into the inserting slot to limit the relative position between the substrate and the support plate.

9. The display panel according to claim 1, characterized in that: A connecting layer is provided between the substrate and the support plate; Preferably, a packaging layer is provided on a side of the display layer facing away from the substrate.

10. A method for preparing a display panel, characterized in that: The following steps are involved: Provide at least one display screen, the display screen comprising a display layer, a control line group and a substrate, the substrate being disposed on a backlight side of the display layer, a first end of the control line group being connected to the display layer, and a second end of at least part of the control line group extending around a side wall of the substrate to a side of the substrate away from the display layer; A support plate is provided, wherein a conductive structure is disposed on one side of the support plate, and a control chip electrically connected to the conductive structure is disposed on the other side of the support plate; The side of the support plate provided with the conductive structure is arranged on the side of the substrate away from the display layer, and it is ensured that the conductive structure is electrically connected to the control line group on the side away from the display layer.

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