Display panel manufacturing method, display panel and display device

Abstract

The invention discloses a manufacturing method of a display panel, the display panel and a display device. The manufacturing method comprises the steps that a display substrate is provided, the display substrate comprises a driving substrate, a pixel definition layer and a plurality of anodes, the pixel definition layer is located on the driving substrate, a plurality of opening areas are formed in the pixel definition layer, and the anodes are arranged in the opening areas; a partition structure is formed on the side, away from the driving substrate, of part of the pixel defining layer, so that part of the opening area and the partition structure are matched to form a first pixel containing area; depositing in the first pixel accommodating area to form a first pixel unit; a partition structure is formed on the side, away from the driving substrate, of at least part of the remaining pixel defining layer, so that at least part of the remaining opening area and the partition structure are matched to form a second pixel containing area; depositing in the second pixel accommodating area to form a second pixel unit; the partition structure comprises a conductive part and a shielding part. Therefore, the risk that the partition structure is corroded is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel and a display device. Background Art

[0002] OLED (Organic Light Emitting Display) is the current mainstream display technology. OLED display panels include active OLED display panels (AMOLED) and passive OLED display panels (PMOLED). Currently, it is increasingly common for AMOLED to be produced using non-evaporation mask technology.

[0003] However, existing display panel manufacturing methods often complete the production of all partition structures first, and then form individual pixel units in different areas through evaporation or other methods. In the process of forming the pixel units, the partition structures in the areas where the pixel units have not yet been formed will be corroded. For example, the conductive parts of the partition structures will be corroded, resulting in the pixel units being unable to be normally connected to the conductive parts, thereby creating the risk of short circuits, etc. Summary of the invention

[0004] The main purpose of the present application is to provide a method for manufacturing a display panel, a display panel and a display device, aiming to solve the above-mentioned technical problems existing in the prior art.

[0005] To solve the above problems, the present application provides a method for manufacturing a display panel, the manufacturing method comprising: providing a display substrate, the display substrate comprising a driving substrate, a pixel definition layer and a plurality of anodes, the pixel definition layer being located on the driving substrate, the pixel definition layer being formed with a plurality of opening areas, and the plurality of anodes being arranged in the plurality of opening areas; forming a partition structure on a side of a portion of the pixel definition layer away from the driving substrate, so that the portion of the opening areas and the partition structure cooperate to form a first pixel accommodating area; depositing a first pixel unit in the first pixel accommodating area; forming a partition structure on a side of at least a portion of the remaining pixel definition layer away from the driving substrate, so that the portion of the remaining opening areas and the partition structure cooperate to form a second pixel accommodating area; depositing a second pixel unit in the second pixel accommodating area; wherein the partition structure comprises a conductive portion and a shielding portion, the conductive portion protrudingly arranged on a side of the pixel definition layer away from the driving substrate, the shielding portion being arranged on a side of the conductive portion away from the pixel definition layer, and the orthographic projection of the conductive portion on the driving substrate being located in the orthographic projection of the shielding portion on the driving substrate.

[0006] In some embodiments, the step of depositing a first pixel unit in the first pixel accommodating area includes: forming a first pixel material layer by evaporating on a side of the pixel definition layer facing away from the driving substrate and in the opening area; depositing a first encapsulation material layer on a side of the first pixel material layer facing away from the driving substrate; and removing the first pixel material layer and the first encapsulation material layer outside the first pixel accommodating area by etching to form a first pixel unit in the first pixel accommodating area.

[0007] In some embodiments, the step of forming a partition structure on the side of the remaining at least part of the pixel definition layer away from the driving substrate so that the remaining at least part of the opening area and the partition structure cooperate to form a second pixel accommodating area includes: forming a partition structure on the side of the remaining pixel definition layer away from the driving substrate so that the remaining at least part of the opening area and the partition structure cooperate to form a second pixel accommodating area; after the step of depositing a second pixel unit in the second pixel accommodating area, the manufacturing method also includes: forming a partition structure on the side of the remaining pixel definition layer away from the driving substrate so that the remaining part of the opening area and the partition structure cooperate to form a third pixel accommodating area; depositing a third pixel unit in the third pixel accommodating area.

[0008] In some embodiments, the first pixel accommodating area includes a first sub-accommodating area and a second sub-accommodating area spaced apart from each other; the step of depositing and forming a first pixel unit in the first pixel accommodating area includes: depositing and forming a first sub-pixel unit in the first sub-accommodating area; and depositing and forming a second sub-pixel unit in the second sub-accommodating area.

[0009] In some embodiments, the step of forming a partition structure on the side of the remaining at least part of the pixel definition layer away from the driving substrate so that the remaining at least part of the opening area and the partition structure cooperate to form a second pixel accommodating area includes: forming a partition structure on the side of the remaining pixel definition layer away from the driving substrate so that the remaining part of the opening area and the partition structure cooperate to form a second pixel accommodating area; the second pixel accommodating area includes a third sub-accommodating area and a fourth sub-accommodating area spaced apart from each other; the step of depositing a second pixel unit in the second pixel accommodating area includes: depositing a third sub-pixel unit in the third sub-accommodating area; and depositing a fourth sub-pixel unit in the fourth sub-accommodating area.

[0010] In some embodiments, each anode has a light-emitting layer, a cathode and a packaging layer stacked on a side facing away from the driving substrate, and the cathode overlaps the conductive parts of two adjacent partition structures.

[0011] In some embodiments, the height of the conductive portion protruding from the pixel definition layer is a preset height, the difference between the orthographic projection length of the blocking portion and the orthographic projection length of the conductive portion is a preset length, and the preset ratio of the preset height to the preset length is greater than or equal to 0.6 and less than or equal to 1.2.

[0012] In some embodiments, each anode corresponds to one of a red pixel unit, a green pixel unit, and a blue pixel unit, respectively, and the preset ratio of the partition structure corresponding to the blue pixel unit is a first preset ratio; the preset ratio of the partition structure corresponding to the red pixel unit and the green pixel unit is a second preset ratio; the first preset ratio is less than the second preset ratio, and the difference between the second preset ratio and the first preset ratio is greater than or equal to 0.1, and less than or equal to 0.2.

[0013] In order to solve the above problems, the present application provides a display panel, which is manufactured by the above-mentioned method for manufacturing a display panel.

[0014] In order to solve the above problems, the present application provides a display device, which includes the above display panel.

[0015] The beneficial effects of the present invention are as follows: Different from the prior art, the present application provides a method for manufacturing a display panel, the manufacturing method comprising: providing a display substrate, the display substrate comprising a driving substrate, a pixel definition layer and a plurality of anodes, the pixel definition layer being located on the driving substrate, the pixel definition layer being formed with a plurality of opening areas, and the plurality of anodes being arranged in the plurality of opening areas; forming a partition structure on a side of a portion of the pixel definition layer away from the driving substrate, so that the portion of the opening area and the partition structure cooperate to form a first pixel accommodating area; depositing a first pixel unit in the first pixel accommodating area; forming a partition structure on a side of at least a portion of the remaining pixel definition layer away from the driving substrate, so that the portion of the remaining opening area and the partition structure cooperate to form a second pixel accommodating area; depositing a second pixel unit in the second pixel accommodating area; wherein the partition structure comprises a conductive portion and a shielding portion, the conductive portion protrudingly arranged on a side of the pixel definition layer away from the driving substrate, the shielding portion being arranged on a side of the conductive portion away from the pixel definition layer, and the orthographic projection of the conductive portion on the driving substrate being located in the orthographic projection of the shielding portion on the driving substrate. Through the above-mentioned implementation mode, a part of the partition structure is formed first, and the partition structure corresponding to the second pixel accommodating area is formed only after the first pixel unit is formed in the first pixel accommodating area. This reduces the risk of corrosion of the conductive part of the partition structure corresponding to the second pixel accommodating area during the formation of the first pixel unit, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a schematic structural diagram of a display device according to one or more embodiments;

[0018] Figure 2 is a first schematic diagram of a method for manufacturing a display panel according to one or more embodiments;

[0019] Figure 3 is a second schematic flow chart of a method for manufacturing a display panel according to one or more embodiments;

[0020] Figure 4 is a third schematic flow chart of a method for manufacturing a display panel according to one or more embodiments;

[0021] Figure 5 is a fourth process diagram of a method for manufacturing a display panel according to one or more embodiments;

[0022] Figure 6a is a first structural schematic diagram of a display panel according to one or more embodiments;

[0023] Figure 6b is based on Figure 6a A second structural schematic diagram of a display panel shown;

[0024] Figure 6c is based on Figure 6a A third structural schematic diagram of a display panel shown;

[0025] Figure 6d is based on Figure 6a A fourth structural schematic diagram of a display panel shown;

[0026] Figure 6e is based on Figure 6a A fifth structural schematic diagram of a display panel shown;

[0027] Figure 6f is based on Figure 6a A sixth structural schematic diagram of a display panel shown;

[0028] Figure 6g is based on Figure 6a A seventh structural schematic diagram of a display panel shown;

[0029] Figure 7 is a fifth process diagram of a method for manufacturing a display panel according to one or more embodiments;

[0030] Figure 8 is a sixth process diagram of a method for manufacturing a display panel according to one or more embodiments;

[0031] Figure 9a is an eighth structural schematic diagram of a display panel according to one or more embodiments;

[0032] Figure 9b is based on Figure 9a A ninth structural schematic diagram of a display panel shown;

[0033] Fig.9c is based on Figure 9a A tenth structural schematic diagram of a display panel shown;

[0034] Figure 9d is based on Figure 9a An eleventh structural schematic diagram of a display panel shown;

[0035] Fig.9e is based on Figure 9a A twelfth structural schematic diagram of a display panel shown;

[0036] Fig.10 is a seventh process diagram of a method for manufacturing a display panel according to one or more embodiments;

[0037] Fig.11a is a thirteenth structural schematic diagram of a display panel according to one or more embodiments;

[0038] Fig.11b is based on Fig.11a A fourteenth structural schematic diagram of a display panel shown;

[0039] Fig.11c is based on Fig.11a A fifteenth structural schematic diagram of a display panel shown;

[0040] Fig.11d is based on Fig.11a A sixteenth structural schematic diagram of a display panel shown;

[0041] Fig.11e is based on Fig.11a A seventeenth structural schematic diagram of a display panel shown;

[0042] Fig.12 is a schematic structural diagram of a partition structure of a display panel according to one or more embodiments.

[0043] Figure numbers: display device 1; display panel 2; display substrate 10; driving substrate 11; pixel definition layer 12; opening area 121; anode 13; partition structure 20; conductive portion 21; shielding portion 22; first partition structure 23; second partition structure 24; third partition structure 25; first pixel accommodating area 30; first sub-accommodating area 31; second sub-accommodating area 32; first pixel unit 300; first sub-pixel unit 310; second sub-pixel unit 320; second pixel accommodating area 40; third sub-accommodating area 41; fourth sub-accommodating area 42; second pixel unit 400; third sub-pixel unit 410; fourth sub-pixel unit 420; third pixel accommodating area 50; third pixel unit 500; light-emitting layer 60; cathode 70; encapsulation layer 80; preset height H; preset length D. DETAILED DESCRIPTION

[0044] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0046] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0047] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0048] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0049] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0050] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0051] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0052] OLED (Organic Light Emitting Display) is the current mainstream display technology. OLED display panels include active OLED display panels (AMOLED) and passive OLED display panels (PMOLED). Currently, it is increasingly common for AMOLED to be produced using non-evaporation mask technology.

[0053] However, existing display panel manufacturing methods often complete the production of all partition structures first, and then form individual pixel units in different areas through evaporation or other methods. In the process of forming the pixel units, the partition structures in the areas where the pixel units have not yet been formed will be corroded. For example, the conductive parts of the partition structures will be corroded, resulting in the pixel units being unable to be normally connected to the conductive parts, thereby creating the risk of short circuits, etc.

[0054] The present application provides a display device, which may include but is not limited to mobile phones, tablets, laptops, desktops, terminals, interactive displays, digital audio and video devices, Internet of Things devices, etc. Among them, interactive displays may include interactive whiteboards, digital advertising interactive screens, and game interactive displays, etc., and Internet of Things devices may include smart home devices and smart wearable devices, etc. Among them, the display device may include a display panel, and the display device may provide a display interface through the display panel to realize the corresponding function.

[0055] Please refer to Figure 1 , Figure 1 is a schematic structural diagram of a display device according to one or more embodiments.

[0056] The display device 1 may be an ordinary mobile phone, a feature phone or a smart phone, etc. The smart phone may be a flat screen phone, a curved screen phone or a foldable phone, etc. The display device 1 is provided with a display panel 2, which may be provided at the head, middle or tail of the display device 1. The display panel 2 may be used to display information of the display device 1, for example, the display panel 2 may be used as the visual information display part of the display device 1. In some application scenarios, the display panel 2 may also be used as a touch information input part, which is used to facilitate the user to operate the display device 1 by touching the display panel 2, for example, for display and input requirements during interface navigation and function switching of the display device 1.

[0057] The present application provides a method for manufacturing a display panel to solve the above-mentioned problem.

[0058] In order to solve the above problems, the present application provides a display panel 2, which can be used to display pictures, etc. The display panel 2 is prepared by the above-mentioned display panel manufacturing method.

[0059] Please refer to Figure 2-Figure 6g , Figure 2 is a first schematic diagram of a method for manufacturing a display panel according to one or more embodiments; Figure 3 is a second schematic flow chart of a method for manufacturing a display panel according to one or more embodiments; Figure 4 is a third schematic flow chart of a method for manufacturing a display panel according to one or more embodiments; Figure 5 is a fourth process diagram of a method for manufacturing a display panel according to one or more embodiments; Figure 6a is a first structural schematic diagram of a display panel according to one or more embodiments; Figure 6b is based on Figure 6a A second structural schematic diagram of a display panel shown; Figure 6c is based on Figure 6a A third structural schematic diagram of a display panel shown; Figure 6dis based on Figure 6a A fourth structural schematic diagram of a display panel shown; Figure 6e is based on Figure 6a A fifth structural schematic diagram of a display panel shown; Figure 6f is based on Figure 6a A sixth structural schematic diagram of a display panel shown; Figure 6g is based on Figure 6a A seventh structural schematic diagram of a display panel is shown.

[0060] To solve the above problems, the present application provides a method for manufacturing a display panel, comprising the following steps:

[0061] Step S11: providing a display substrate 10 , the display substrate 10 comprises a driving substrate 11 , a pixel definition layer 12 and a plurality of anodes 13 , the pixel definition layer 12 is located on the driving substrate 11 , the pixel definition layer 12 is formed with a plurality of opening regions 121 , and the plurality of anodes 13 are disposed in the plurality of opening regions 121 .

[0062] The driving substrate 11 can be used to drive the anode 13. The driving substrate 11 may include a substrate and a driving circuit layer, wherein the substrate may be a glass substrate; or a flexible substrate, wherein the material of the flexible substrate is polyimide (PI). The driving circuit layer may be a TFT circuit layer, and the TFT circuit layer is used to drive the anode 13. The specific TFT circuit layer includes a plurality of driving circuit units arranged in an array, and each driving circuit unit may include a thin film transistor (TFT) device and a capacitor. Each driving circuit unit corresponds to an anode 13. The TFT device is a low temperature polysilicon (LTPS) type or a metal oxide semiconductor (MOS) type, such as a metal oxide semiconductor type of indium gallium zinc oxide (IGZO).

[0063] The pixel definition layer 12 may define the position of the anode 13 through an opening area 121, and a plurality of anodes 13 are disposed in a plurality of opening areas 121. Exemplarily, one anode 13 is disposed corresponding to one opening area 121, and the anode 13 is exposed through the opening area 121 on the side of the pixel definition layer 12 away from the driving substrate 11. The material of the pixel definition layer 12 may be an organic material, an organic material having an inorganic coating disposed thereon, or one of inorganic materials. The organic material of the pixel definition layer 12 includes, but is not limited to, polyimide. The inorganic material of the pixel definition layer 12 includes, but is not limited to, silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiNO), magnesium fluoride (MgF), or a combination thereof. Here, the specific material of the pixel definition layer 12 is not limited, and is selected according to actual needs.

[0064] Step S12 : forming a partition structure 20 on a side of a portion of the pixel definition layer 12 away from the driving substrate 11 , so that a portion of the opening area 121 and the partition structure 20 cooperate to form a first pixel accommodating area 30 .

[0065] The partition structure 20 is protrudingly disposed on the side of the pixel definition layer 12 away from the driving substrate 11, wherein the partition structure 20 includes a conductive portion 21 and a shielding portion 22, wherein the conductive portion 21 is protrudingly disposed on the side of the pixel definition layer 12 away from the driving substrate 11, and the shielding portion 22 is disposed on the side of the conductive portion 21 away from the pixel definition layer 12, and the orthographic projection of the conductive portion 21 on the driving substrate 11 is located in the orthographic projection of the shielding portion 22 on the driving substrate 11. It can be understood that the shielding portion 22 can be used to block the evaporated material, and the shielding portion 22 can be insulated from the conductive portion 21. The partition structure 20 cooperates with the opening area 121 to form the first pixel accommodating area 30, which can refer to forming the first pixel accommodating area 30 between the partition structures 20 on both sides of the opening area 121.

[0066] Step S13 : forming the first pixel unit 300 by deposition in the first pixel accommodating area 30 .

[0067] The method of depositing materials in the first pixel accommodating area 30 to form the first pixel unit 300 may include evaporation and chemical vapor deposition. For example, the material for forming the first pixel unit 300 is deposited on the display substrate 10 to form the first pixel unit 300. It should be noted that since the partition structure 20 is protrudingly arranged on the side of the pixel definition layer 12 away from the drive substrate 11, when depositing the material for forming the first pixel unit 300, the deposited material will be blocked by the blocking portion 22 of the partition structure 20. The deposited material outside the first pixel accommodating area 30 is removed by etching or the like, so that the deposited material in the first pixel accommodating area 30 forms the first pixel unit 300. It should be noted that the first pixel unit 300 may include one or both of a red pixel unit, a green pixel unit and a blue pixel unit.

[0068] Step S14 : forming a partition structure 20 on the side of the remaining at least part of the pixel definition layer 12 away from the driving substrate 11 , so that the remaining at least part of the opening area 121 and the partition structure 20 cooperate to form a second pixel accommodating area 40 .

[0069] Forming the partition structure 20 on the side of the remaining at least part of the pixel definition layer 12 away from the driving substrate 11 may mean that the partition structure 20 is formed on the side of the part or all of the pixel definition layer 12 outside the first pixel accommodating area 30 away from the driving substrate 11, and these partition structures 20 cooperate with part or all of the opening area 121 outside the first pixel accommodating area 30 to form the second pixel accommodating area 40. For the convenience of description and distinction, the partition structure 20 forming the first pixel accommodating area 30 is recorded as the first partition structure 23, and the partition structure 20 forming the second pixel accommodating area 40 is recorded as the second partition structure 24. The second partition structure 24 cooperates with the opening area 121 to form the second pixel accommodating area 40 may mean that the second pixel accommodating area 40 is formed between the second partition structures 24 on both sides of the opening area 121. For example, when a second partition structure 24 is formed on the side of all remaining pixel definition layers 12 outside the first pixel accommodating area 30 that is away from the driving substrate 11, the second partition structure 24 can cooperate with all remaining opening areas 121 outside the first pixel accommodating area 30 to form a second pixel accommodating area 40.

[0070] Step S15 : forming a second pixel unit 400 by deposition in the second pixel accommodating area 40 .

[0071] The method of depositing materials in the second pixel accommodating area 40 to form the second pixel unit 400 may include evaporation and chemical vapor deposition. For example, the material for forming the second pixel unit 400 is deposited on the display substrate 10 by evaporation to form the second pixel unit 400. It should be noted that since the second partition structure 24 is protrudingly arranged on the side of the pixel definition layer 12 away from the drive substrate 11, when depositing the material for forming the second pixel unit 400, the deposited material will be blocked by the blocking portion 22 of the second partition structure 24. The deposited material outside the second pixel accommodating area 40 is removed by etching or the like, so that the deposited material in the second pixel accommodating area 40 forms the second pixel unit 400. It should be noted that the second pixel unit 400 may include one or both of a red pixel unit, a green pixel unit and a blue pixel unit, and the second pixel unit 400 has a different color from the first pixel unit 300. Further, when the first pixel unit 300 includes two of a red pixel unit, a green pixel unit and a blue pixel unit, the second pixel unit 400 is one of the remaining ones. Exemplarily, when the first pixel unit 300 includes a red pixel unit and a green pixel unit, the second pixel unit 400 is a blue pixel unit.

[0072] Through the above-mentioned embodiment, a part of the partition structure 20 is formed first, and the partition structure 20 corresponding to the second pixel accommodating area 40 is formed only after the first pixel unit 300 is formed in the first pixel accommodating area 30. This reduces the risk of corrosion of the conductive portion 21 of the partition structure 20 corresponding to the second pixel accommodating area 40 during the formation of the first pixel unit 300, thereby improving the reliability of the display panel 2.

[0073] In some embodiments, Figure 3 As shown, step S13 also includes: step S131: forming a first pixel material layer by evaporation on the side of the pixel definition layer 12 away from the driving substrate 11 and the opening area 121; step S132: depositing a first encapsulation material layer on the side of the first pixel material layer away from the driving substrate 11; step S133: removing the first pixel material layer and the first encapsulation material layer outside the first pixel accommodating area 30 by etching, so as to form a first pixel unit 300 in the first pixel accommodating area 30. The first pixel material layer may include a first light-emitting material layer and a first cathode 70 material layer. It can be understood that the first light-emitting material layer is used to form the light-emitting layer 60 of the first pixel unit 300, and the first cathode 70 material layer is used to form the cathode 70 layer of the first pixel unit 300. The first encapsulation material layer is used to form the encapsulation layer 80 of the first pixel unit 300, and the first encapsulation material layer is usually deposited by chemical vapor deposition (CVD). The etching method may include one or more of dry etching and wet etching, which are not limited here. For example, the first pixel material layer outside the first pixel accommodating area 30 may be removed by dry etching, and the first packaging material layer outside the first pixel accommodating area 30 may be removed by wet etching. It should be noted that when the first pixel material layer and the first pixel packaging layer 80 are removed by etching, the conductive layer material of the partition structure 20 is easily corroded. It should be noted that, compared with the solution of forming the first pixel unit 300 by deposition and etching after forming the second partition structure 24, the second partition structure 24 is not formed when the first pixel unit 300 is formed in this solution. Therefore, the conductive part 21 of the second partition structure 24 will not be corroded in the process of forming the first pixel unit 300, thereby improving the reliability of the display panel 2.

[0074] In some embodiments, Figure 4As shown, step S15 also includes: step S151: forming a second pixel material layer by evaporation on the side of the pixel definition layer 12 away from the drive substrate 11 and the opening area 121; step S152: depositing a second packaging material layer on the side of the second pixel material layer away from the drive substrate 11; step S153: removing the second pixel material layer and the second packaging material layer outside the second pixel accommodating area 40 by etching, so as to form a second pixel unit 400 in the second pixel accommodating area 40. The specific method of forming the second pixel unit 400 in step S15 is the same as the specific method of forming the first pixel unit 300 in step S13, which will not be repeated here.

[0075] In some embodiments, Figure 5-6g As shown, step S14 includes: forming a partition structure 20 on a side of the remaining pixel definition layer 12 away from the driving substrate 11, so that the remaining opening area 121 and the partition structure 20 cooperate to form a second pixel accommodating area 40. After step S15, the manufacturing method further includes: step S16: forming a partition structure 20 on a side of the remaining pixel definition layer 12 away from the driving substrate 11, so that the remaining opening area 121 and the partition structure 20 cooperate to form a third pixel accommodating area 50. Step S17: depositing in the third pixel accommodating area 50 to form a third pixel unit 500.

[0076] When in step S14, the second partition structure 24 is formed only on the side of a portion of the pixel definition layer 12 outside the first pixel accommodating area 30 away from the driving substrate 11, and the second partition structure 24 and a portion of the opening area 121 outside the first pixel accommodating area 30 form the second pixel accommodating area 40, step S15 may further include steps S16 and S17. The forming of the partition structure 20 on the side of the remaining portion of the pixel definition layer 12 away from the driving substrate 11 may mean that the partition structure 20 is formed on the side of the pixel definition layer 12 outside the first pixel accommodating area 30 and the second pixel accommodating area 40 away from the driving substrate 11, and these partition structures 20 cooperate with the opening area 121 outside the first pixel accommodating area 30 and the second pixel accommodating area 40 to form the third pixel accommodating area 50. For the convenience of description and distinction, the partition structure 20 forming the third pixel accommodating area 50 is recorded as the third partition structure 25. In this embodiment, step S17 may further include step S171: forming a third pixel material layer by evaporation on the side of the pixel definition layer 12 away from the drive substrate 11 and the opening area 121; step S172: depositing a third encapsulation material layer on the side of the third pixel material layer away from the drive substrate 11; step S173: removing the third pixel material layer and the third encapsulation material layer outside the third pixel accommodating area 50 by etching to form a third pixel unit 500 in the third pixel accommodating area 50. The specific manner of forming the third pixel unit 500 in step S17 is the same as the specific manner of forming the first pixel unit 300 in step S13, which will not be repeated here. It should be noted that, in this embodiment, the first pixel unit 300, the second pixel unit 400 and the third pixel unit 500 may each be one of a red pixel unit, a green pixel unit and a blue pixel unit. For example, the first pixel unit 300 is a red pixel unit, the second pixel unit 400 is a green pixel unit, and the third pixel unit 500 is a blue pixel unit.

[0077] It is understandable that when forming the first pixel unit 300 and the second pixel unit 400, the conductive layer material of the partition structure 20 is easily corroded. It is to be noted that, compared with the solution of forming the first pixel unit 300 and the second pixel unit 400 by deposition and etching after forming the third partition structure 25, the third partition structure 25 is not formed when forming the first pixel unit 300 and the second pixel unit 400 in this solution. Therefore, the third partition structure 25 will not be corroded in the process of forming the first pixel unit 300 and the second pixel unit 400. 5. The conductive portion 21 of the display panel 2 is corroded. Specifically, in a scheme in which the first pixel unit 300, the second pixel unit 400 and the third pixel unit 500 are formed in sequence after the first partition structure 23, the second partition structure 24 and the third partition structure 25 are formed, the first partition structure 23 is not corroded, the second partition structure 24 is corroded once, and the third partition structure 25 is corroded twice. In the present embodiment, the first partition structure 23, the second partition structure 24 and the third partition structure 25 are not corroded, thereby significantly improving the reliability of the display panel 2.

[0078] Please refer to Figure 7-9e , Figure 7 is a fifth process diagram of a method for manufacturing a display panel according to one or more embodiments; Figure 8 is a sixth process diagram of a method for manufacturing a display panel according to one or more embodiments; Figure 9a is an eighth structural schematic diagram of a display panel according to one or more embodiments; Figure 9b is based on Figure 9a A ninth structural schematic diagram of a display panel shown;

[0079] Fig.9c is based on Figure 9a A tenth structural schematic diagram of a display panel shown; Figure 9d is based on Figure 9a An eleventh structural schematic diagram of a display panel shown; Fig.9e is based on Figure 9a The twelfth structural schematic diagram of the display panel is shown.

[0080] In some embodiments, the first pixel accommodating area 30 includes a first sub-accommodating area 31 and a second sub-accommodating area 32 spaced apart from each other; step S13 includes: step S134: depositing a first sub-pixel unit 310 in the first sub-accommodating area 31. Step S135: depositing a second sub-pixel unit 320 in the second sub-accommodating area 32. In this embodiment, the first sub-pixel unit 310, the second sub-pixel unit 320 and the second pixel unit 400 are respectively one of a red pixel unit, a green pixel unit and a blue pixel unit. For example, the first sub-pixel unit 310 may be a red pixel unit, the second sub-pixel unit 320 may be a green pixel unit, and the second pixel unit 400 may be a blue pixel unit. It should be noted that in this embodiment, when depositing the first sub-pixel unit 310 in the first sub-accommodating area 31, the partition structure 20 forming the second sub-accommodating area 32 will be corroded once, while the partition structure 20 forming the first sub-accommodating area 31 and the second partition structure 24 forming the second pixel accommodating area 40 will not be corroded. It can be understood that, in the scheme in which the first sub-pixel unit 310, the second sub-pixel unit 320 and the second pixel unit 400 are formed in sequence after the first partition structure 23 and the second partition structure 24 are formed, the portion of the first partition structure 23 corresponding to the first sub-accommodating area 31 is not corroded, the portion of the first partition structure 23 corresponding to the second sub-accommodating area 32 is corroded once, and the second partition structure 24 is corroded twice. In the present embodiment, only the portion of the first partition structure 23 forming the second sub-accommodating area 32 is corroded once, and the portion of the first partition structure 23 and the second partition structure 24 forming the first sub-accommodating area 31 are not corroded, thereby improving the reliability of the display panel 2.

[0081] Please refer to Figure 10-11e , Fig.10 is a seventh process diagram of a method for manufacturing a display panel according to one or more embodiments; Fig.11a is a thirteenth structural schematic diagram of a display panel according to one or more embodiments; Fig.11b is based on Fig.11a A fourteenth structural schematic diagram of a display panel shown; Fig.11c is based on Fig.11a A fifteenth structural schematic diagram of a display panel shown;

[0082] Fig.11d is based on Fig.11a A sixteenth structural schematic diagram of a display panel shown; Fig.11e is based on Fig.11a The seventeenth structural schematic diagram of the display panel is shown.

[0083] In some embodiments, step S14 includes: forming a partition structure 20 on the side of the remaining pixel definition layer 12 away from the driving substrate 11, so that the remaining opening area 121 and the partition structure 20 cooperate to form a second pixel accommodating area 40, and the second pixel accommodating area 40 includes a third sub-accommodating area 41 and a fourth sub-accommodating area 42 that are spaced apart from each other. Step S15 includes: step S154: depositing in the third sub-accommodating area 41 to form a third sub-pixel unit 410. Step S155: depositing in the fourth sub-accommodating area 42 to form a fourth sub-pixel unit 420.

[0084] In this embodiment, the first pixel unit 300, the third sub-pixel unit 410 and the fourth sub-pixel unit 420 are respectively one of a red pixel unit, a green pixel unit and a blue pixel unit. For example, the first pixel unit 300 may be a red pixel unit, the third sub-pixel unit 410 may be a green pixel unit, and the fourth sub-pixel unit 420 may be a blue pixel unit. It should be noted that in this embodiment, when the third sub-pixel unit 410 is deposited in the third sub-accommodating area 41 to form the third sub-accommodating area, the partition structure 20 forming the fourth sub-accommodating area 42 will be corroded once, while the first partition structure 23 forming the first pixel accommodating area 30 and the partition structure 20 forming the third sub-accommodating area 41 will not be corroded. It can be understood that, in the scheme in which the first pixel unit 300, the third sub-pixel unit 410 and the fourth sub-pixel unit 420 are formed in sequence after the first partition structure 23 and the second partition structure 24 are formed, the first partition structure 23 is not corroded, the portion of the second partition structure 24 corresponding to the third sub-accommodating area 41 is corroded once, and the portion of the second partition structure 24 corresponding to the fourth sub-accommodating area 42 is corroded twice. In the present embodiment, only the portion of the second partition structure 24 forming the fourth sub-accommodating area 42 is corroded once, and the first partition structure 23 and the portion of the second partition structure 24 forming the third sub-accommodating area 41 are not corroded, thereby improving the reliability of the display panel 2.

[0085] In some embodiments, each anode 13 has a light-emitting layer 60, a cathode 70, and an encapsulation layer 80 stacked on one side away from the driving substrate 11, and the cathode 70 overlaps the conductive portions 21 of two adjacent partition structures 20. The anode 13 and the cathode 70 can cooperate to drive the light-emitting layer 60 so that the light-emitting layer 60 emits at least one of red light, green light, and blue light, and the cathode 70 overlaps the conductive portions 21 of two adjacent partition structures 20. It can be understood that the multiple cathodes 70 corresponding to the multiple anodes 13 are electrically connected to each other through the conductive portions 21 of the partition structure 20.

[0086] Please refer to Figure 1-Figure 12 , Fig.12 is a schematic structural diagram of a partition structure of a display panel according to one or more embodiments.

[0087] In some embodiments, the height of the conductive portion 21 protruding from the pixel definition layer 12 is a preset height H, the difference between the orthographic projection length of the shielding portion 22 and the orthographic projection length of the conductive portion 21 is a preset length D, and the preset ratio of the preset height H to the preset length D is greater than or equal to 0.6, and less than or equal to 1.2. It should be noted that the more times the conductive portion 21 of the partition structure 20 is corroded, the larger the preset length D, and the smaller the ratio of the preset height H to the preset length D, the more difficult it is for the cathode 70 to overlap with the conductive portion 21. Therefore, this solution can reduce the number of times the partition structure 20 is corroded, so that the preset ratio is between 0.6-1.2, reducing the risk that the preset ratio is too small, resulting in difficulty in overlapping the cathode 70, and then causing the cathode 70 to be broken, so that the light-emitting layer 60 cannot be lit.

[0088] In some embodiments, each anode 13 corresponds to one of the red pixel unit, the green pixel unit and the blue pixel unit, respectively, and the preset ratio of the partition structure 20 corresponding to the blue pixel unit is a first preset ratio; the preset ratio of the partition structure 20 corresponding to the red pixel unit and the green pixel unit is a second preset ratio; the first preset ratio is less than the second preset ratio, and the difference between the second preset ratio and the first preset ratio is greater than or equal to 0.1, and less than or equal to 0.2. It should be noted that, relative to the blue pixel unit, the thickness of the organic film layer of the red pixel unit and the green pixel unit is greater, and under the same preset ratio, the overlap range of the cathode 70 of the red pixel unit and the green pixel unit is smaller, and the risk of overlap failure is greater. Specifically, the first preset ratio may be between 0.8-1.2, and illustratively, the first preset ratio may be 0.8, 0.9, 1.0, 1.1, 1.2, and so on. The second preset ratio may be between 0.6 and 1.1, and illustratively, the second preset ratio may be 0.6, 0.7, 0.8, 0.9, 1.0, 1.2, etc. Thus, when the difference between the second preset ratio and the first preset ratio is greater than or equal to 0.1 and less than or equal to 0.2, the overlap effect of the cathode 70 of the red pixel unit and the green pixel unit is more consistent with the overlap effect of the cathode 70 of the blue pixel unit.

[0089] In summary, the present application provides a method for manufacturing a display panel, the manufacturing method comprising: providing a display substrate 10, the display substrate 10 comprising a driving substrate 11, a pixel definition layer 12 and a plurality of anodes 13, the pixel definition layer 12 being located on the driving substrate 11, the pixel definition layer 12 being formed with a plurality of opening regions 121, and the plurality of anodes 13 being disposed in the plurality of opening regions 121; forming a partition structure 20 on a side of a portion of the pixel definition layer 12 away from the driving substrate 11, so that a portion of the opening regions 121 and the partition structure 20 cooperate to form a first pixel accommodating region 30; and depositing a first pixel unit 300 in the first pixel accommodating region 30; A partition structure 20 is formed on the side of the remaining at least part of the pixel definition layer 12 away from the drive substrate 11, so that the remaining at least part of the opening area 121 and the partition structure 20 cooperate to form a second pixel accommodating area 40; a second pixel unit 400 is deposited in the second pixel accommodating area 40; wherein the partition structure 20 includes a conductive portion 21 and a shielding portion 22, the conductive portion 21 is protrudingly arranged on the side of the pixel definition layer 12 away from the drive substrate 11, the shielding portion 22 is arranged on the side of the conductive portion 21 away from the pixel definition layer 12, and the orthographic projection of the conductive portion 21 on the drive substrate 11 is located in the orthographic projection of the shielding portion 22 on the drive substrate 11. Through the above embodiment, a part of the partition structure 20 is formed first, and the partition structure 20 corresponding to the second pixel accommodating area 40 is formed only after the first pixel unit 300 is formed in the first pixel accommodating area 30, thereby reducing the risk of corrosion of the conductive portion 21 of the partition structure 20 corresponding to the second pixel accommodating area 40 in the process of forming the first pixel unit 300, thereby improving the reliability of the display panel 2.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A method for manufacturing a display panel, characterized in that: The manufacturing method comprises: A display substrate is provided, the display substrate comprising a driving substrate, a pixel definition layer and a plurality of anodes, the pixel definition layer is located on the driving substrate, the pixel definition layer is formed with a plurality of opening regions, and the plurality of anodes are arranged in the plurality of opening regions; A partition structure is formed on a side of a portion of the pixel definition layer away from the drive substrate, so that a portion of the opening area and the partition structure cooperate to form a first pixel accommodating area; Depositing a first pixel unit in the first pixel accommodating area; The partition structure is formed on a side of at least a portion of the remaining pixel definition layer away from the driving substrate, so that at least a portion of the remaining opening area and the partition structure cooperate to form a second pixel accommodating area; Depositing a second pixel unit in the second pixel accommodating area; Among them, the partition structure includes a conductive part and a shielding part, the conductive part is protrudingly arranged on the side of the pixel definition layer away from the driving substrate, the shielding part is arranged on the side of the conductive part away from the pixel definition layer, and the orthographic projection of the conductive part on the driving substrate is located in the orthographic projection of the shielding part on the driving substrate.

2. The manufacturing method according to claim 1, characterized in that: The step of depositing the first pixel unit in the first pixel accommodating area comprises: Forming a first pixel material layer by evaporation on a side of the pixel definition layer away from the drive substrate and the opening area; depositing a first packaging material layer on a side of the first pixel material layer away from the driving substrate; The first pixel material layer and the first encapsulation material layer outside the first pixel accommodating area are removed by etching to form the first pixel unit in the first pixel accommodating area.

3. The manufacturing method according to claim 1, characterized in that: The step of forming the partition structure on the side of at least a portion of the remaining pixel definition layer away from the driving substrate so that at least a portion of the remaining opening area and the partition structure cooperate to form a second pixel accommodating area comprises: The partition structure is formed on a side of the remaining pixel definition layer away from the driving substrate, so that the remaining opening area and the partition structure cooperate to form a second pixel accommodating area; After the step of depositing a second pixel unit in the second pixel accommodating area, the manufacturing method further comprises: The partition structure is formed on the side of the remaining portion of the pixel definition layer away from the driving substrate, so that the remaining portion of the opening area and the partition structure cooperate to form a third pixel accommodating area; A third pixel unit is formed by deposition in the third pixel accommodating area.

4. The manufacturing method according to claim 1, characterized in that: The first pixel accommodating area includes a first sub-accommodating area and a second sub-accommodating area spaced apart from each other; The step of depositing a first pixel unit in the first pixel accommodating area comprises: Depositing a first sub-pixel unit in the first sub-accommodating area; A second sub-pixel unit is formed by deposition in the first sub-accommodating area.

5. The manufacturing method according to claim 1, characterized in that: The step of forming the partition structure on the side of at least a portion of the remaining pixel definition layer away from the driving substrate so that at least a portion of the remaining opening area and the partition structure cooperate to form a second pixel accommodating area comprises: The partition structure is formed on the side of the remaining pixel definition layer away from the driving substrate, so that the remaining opening area and the partition structure cooperate to form a second pixel accommodating area; The second pixel accommodating area includes a third sub-accommodating area and a fourth sub-accommodating area which are spaced apart from each other; The step of depositing a second pixel unit in the second pixel accommodating area comprises: Depositing a third sub-pixel unit in the third sub-accommodating area; A fourth sub-pixel unit is formed by deposition in the fourth sub-accommodating area.

6. The manufacturing method according to claim 1, characterized in that: Each anode has a light-emitting layer, a cathode and a packaging layer stacked on one side away from the drive substrate, and the cathode overlaps the conductive parts of two adjacent partition structures.

7. The manufacturing method according to claim 6, characterized in that: The height of the conductive portion protruding from the pixel definition layer is a preset height, the difference between the orthographic projection length of the shielding portion and the orthographic projection length of the conductive portion is a preset length, and a preset ratio of the preset height to the preset length is greater than or equal to 0.6 and less than or equal to 1.

2.

8. The manufacturing method according to claim 7, characterized in that: Each of the anodes corresponds to one of a red pixel unit, a green pixel unit and a blue pixel unit, and the preset ratio of the partition structure arranged corresponding to the blue pixel unit is a first preset ratio; The preset ratio of the partition structure arranged corresponding to the red pixel unit and the green pixel unit is a second preset ratio; The first preset ratio is smaller than the second preset ratio, and a difference between the second preset ratio and the first preset ratio is greater than or equal to 0.1 and less than or equal to 0.

2.

9. A display panel, characterized in that: The display panel is manufactured by the method for manufacturing a display panel according to any one of claims 1 to 8.

10. A display device, characterized in that: The display device comprises the display panel as claimed in claim 9.

Images