A high-voltage electrostatic precipitator for removing fine particles from a gas stream

Abstract

The application discloses a high-voltage electrostatic micro-particle removing device suitable for semiconductor manufacturing industry, which comprises a base, a moving removing assembly arranged on the surface of the base, a particle removing adjusting assembly arranged in the base and a clamping assembly arranged in the base. The semiconductor raw material is moved and removed in the chute, the semiconductor raw material is self-rotated to remove particles, the semiconductor raw material can be quickly installed and dismounted in the chute, the semiconductor raw material is effectively clamped to remove particles, the time loss of personnel is reduced in the process of removing particles, the first particle removing plate and the second particle removing plate can be adjusted and extended in height through the hydraulic pump matched and connected at the bottom, the semiconductor raw material is required to remove particles in different ways, the particle removing position can be conveniently installed with different particle removing plates, and efficient adjusting intervention measures are provided for the next stage control after the semiconductor raw material is removed from particles.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor manufacturing production equipment, in particular to a high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing. BACKGROUND

[0002] Semiconductor refers to a material with electrical conductivity between conductor and insulator at room temperature, and the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power power conversion and the like, and a diode is a device made of semiconductor, and the importance of the semiconductor is very great from the perspectives of science and technology or economic development. The core units in most electronic products, such as computers, mobile phones or digital recorders, are closely related to the semiconductor, and common semiconductor materials are silicon, germanium, gallium arsenide and the like, and silicon is the most influential one in various semiconductor material applications.

[0003] Patent No. (CN114196900A) discloses a surface treatment method for a stainless steel component in semiconductor chip manufacturing, and the mixed solution with a volume ratio of ammonia water, hydrogen peroxide and water being 1:3:4 can chemically react with Ti-containing materials frequently used in semiconductor chip manufacturing and will not corrode the stainless steel component itself, and has high chemical selectivity. The electric arc aluminum blasting process adopted in the blasting process further increases the roughness of the component surface on the basis of sand blasting, ensures that the attachment is combined more closely during use, and will not affect the product itself due to the falling of the attachment. At the same time, the difficulty of cleaning the attachment after the component can be reduced, and the cleaning cost can be reduced. The surface treatment method for the stainless steel component can meet the surface roughness and roughness conditions, and improve the precision and qualification rate of the chip product

[0004] However, there are some problems in the use process of the existing semiconductor manufacturing equipment, 1. The semiconductor manufacturing industry on the market is not convenient to remove the surface particles, which increases the time loss of personnel in the removal process, and the operation is not convenient; 2. The semiconductor manufacturing industry on the market is not convenient to adjust the degree control of the whole when removing the surface particles, and lacks efficient adjustment intervention measures for the next stage control after removing the particles in the process of removing the particles of the semiconductor raw material, thereby reducing the overall particle removal quality and process convenience, 3. The semiconductor manufacturing industry on the market lacks a good clamping stability measure when removing the micro-particles of the semiconductor raw material, which is not convenient for quick removal. Therefore, we propose a high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing; SUMMARY

[0005] The present application aims to provide a high-voltage electrostatic micro-particle removal device suitable for semiconductor manufacturing industry to solve the problems in the background art.

[0006] To solve the above technical problems, the present application provides the following technical solutions: a base, a mobile removal assembly arranged on the surface of the base, a particle removal adjustment assembly arranged in the base, and a clamping assembly arranged in the base.

[0007] The base is provided with fixed blocks on both sides, and movable blocks are arranged on both sides of the base.

[0008] The mobile removal assembly comprises an inclined opening arranged on one side of the fixed block, an electric telescopic rod arranged in the inclined opening, a spring column connected to one end of the electric telescopic rod, and a movable block arranged at one end of the spring column.

[0009] The particle removal adjustment assembly comprises a hydraulic pump arranged in the base, a fixed plate arranged at one end of the hydraulic pump, a first particle removal plate connected to the surface of the fixed plate, and a second particle removal plate connected to the surface of the fixed plate.

[0010] The clamping assembly comprises a placement block arranged on one side of the movable block, a placement opening arranged in the placement block, a clamping plate connected to the placement opening, and a semiconductor raw material connected to the placement opening.

[0011] Preferably, the mobile removal assembly further comprises an installation groove arranged on the inclined surface in the inclined opening, an electric telescopic rod connected to the installation groove, a connecting head detachably connected to one end of the electric telescopic rod, an installation plate fixedly connected to one side of the movable block, a circular groove arranged on the surface of the installation plate, a spring column detachably connected to the inside of the circular groove, and a connecting head detachably connected to one end of the spring column.

[0012] Preferably, the particle removal adjustment assembly further comprises a first installation plate detachably connected to one end of the hydraulic pump, a second installation plate detachably connected to the other end of the hydraulic pump, an inclined groove arranged on the surface of the housing, and the first installation plate detachably connected to the bottom of the inclined groove.

[0013] Preferably, the second installation plate is detachably connected to the bottom of the fixed plate, the fixed plate is a plurality of plates, and the first particle removal plate and the second particle removal plate have different mesh numbers.

[0014] Preferably, openings are arranged on the surfaces of both sides of the base, an inclined groove is arranged in the opening, an embedded block is connected to the inclined groove, a movable plate is fixedly connected to one end of the embedded block, a connecting opening is arranged on the surface of the base, and the connecting opening is in communication with the embedded groove.

[0015] Preferably, the clamping assembly further comprises a vertical plate arranged in the chute, and a placement block is embeddedly connected in the vertical plate, a clamping block is movably connected in a placement opening in the placement block, a first screw hole is formed in the surface of the clamping block, and a second screw hole is formed in the bottom of the inner side of the placement opening.

[0016] Preferably, the first and second degranulation plates are connected with side plates on the outer sides, the surface of the side plate is provided with a first connecting hole, the outer side surface of the fixed plate is provided with a second connecting hole, the first connecting hole and the second connecting hole are aligned inside, and the first connecting hole and the second connecting hole are connected with a bolt.

[0017] Preferably, the movable block is detachably connected with an inclined plate on one side, the inclined plate is detachably connected with a motor at one end, the motor is connected with a rotating shaft input end at the output end, the rotating shaft is detachably connected with a connecting column at one end, and the connecting column is detachably connected with a vertical plate at one end.

[0018] Preferably, the base is provided with a cooling groove at one end, the cooling groove is provided with a liquid discharge opening on both sides inside, and the liquid discharge opening is embeddedly connected with a conduit at one end.

[0019] Preferably, the surface of the conduit is connected with a valve, the base is provided with a chip discharge opening at one end, the chip discharge opening is in communication with the inside of the chute, and the surface of the base is detachably connected with a controller, and the power current of the motor and the electric telescopic rod is controlled through the controller.

[0020] Compared with the prior art, the beneficial effects of the present application are:

[0021] 1. In the technical solution, when the semiconductor raw material is removed from the surface of the granular material, it is moved in the chute to remove the granular material, so that it can be conveniently placed in different degranulation positions, and the semiconductor raw material is self-rotated to remove the granular material, which increases the degranulation efficiency, the semiconductor raw material can be quickly installed and removed in the chute, and the semiconductor raw material is effectively clamped to remove the granular material, the time loss of personnel is reduced during the degranulation process, and the operation is convenient.

[0022] 2. In the technical solution, during the degranulation process, the first and second degranulation plates can be adjusted in height by the hydraulic pump connected at the bottom, and the semiconductor raw material can be degranulated according to different requirements and needs, and the degranulation position can be conveniently installed with different degranulation plates, which is beneficial to increase the degranulation efficiency of the semiconductor raw material, reduces the collision loss caused by carrying due to the need to replace the degranulation position, and has efficient adjustment intervention measures for the next stage control after degranulation of the semiconductor raw material, thereby improving the overall degranulation quality and process convenience.

[0023] 3、The technical scheme, first, the movable block one end fixedly connected with the insert block is inserted into the slot through the opening of the base surface, so that the insert block moves in the slot, the slot is opened in the inner groove of the two sides of the base, so that the insert block can move in the slot, the extension angle of the opening and the slot is consistent with the extension angle of the inclined slot, which facilitates the horizontal movement of the movable block to the slot and the base, the inclined end of the base is fixedly connected with the fixed block outside the top, the fixed block is provided with an installation slot through the inclined opening on one side, the installation opening is located on the inclined surface of the inclined opening, the electric telescopic rod is installed and connected through the installation opening, one end of the electric telescopic rod is installed with the spring column through the connector, the spring column is installed in the circular groove of the installation block, one end of the installation block is fixedly connected with the movable block, and the spring column provides a small angle adjustment for the electric telescopic rod during extension and retraction, so as to facilitate the installation of the electric telescopic rod in an inclined manner, at this time, the power supply of the electric telescopic rod can be connected through the controller to drive the movable block to move horizontally and obliquely outside the base plate and the inclined slot. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0025] Figure 1 The overall structure diagram of the high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0026] Figure 2 The particle removal adjusting assembly structure diagram of the high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0027] Figure 3 The internal structure diagram of the movable block of the high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0028] Figure 4 The clamping assembly structure diagram of the high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0029] Figure 5 The fixed plate bottom structure diagram of the high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0030] Figure 6 The fixed block structure diagram of the high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0031] Figure 7 It is a cooling tank internal structure diagram of a high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application;

[0032] Figure 8 It is a cooling tank internal structure diagram of a high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry of the present application; Figure 3 It is a structure enlarged view diagram of the structure at A in the figure.

[0033] In the figure: 1, base; 2, inclined chute; 3, opening; 4, embedded groove; 5, connecting port; 6, embedded block; 7, mounting block; 8, movable block; 9, fixed block; 101, inclined port; 102, mounting groove; 103, electric telescopic rod; 104, connecting head; 105, spring column; 106, circular groove; 111, first mounting plate; 112, hydraulic pump; 113, second mounting plate; 114, fixed plate; 115, first particle removal plate; 116, second particle removal plate; 12, side plate; 13, first connecting hole; 14, second connecting hole; 15, bolt; 16, inclined plate; 17, motor; 18, rotating shaft; 19, connecting column; 201, vertical plate; 202, placing block; 203, placing port; 204, clamping plate; 205, first screw hole; 206, second screw hole; 21, cooling tank; 22, liquid discharge port; 23, conduit; 24, valve; 25, chip removal port; 26, semiconductor raw material; 27, controller. DETAILED DESCRIPTION

[0034] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings.

[0035] Please refer to Figures 1-8 The whole structure diagram of a high-voltage electrostatic pole micro-particle removal device suitable for semiconductor manufacturing industry is shown, which includes a base 1, a mobile removal assembly arranged on the surface of the base 1, a particle removal adjusting assembly arranged in the interior of the base 1, and a clamping assembly arranged in the interior of the base 1.

[0036] The fixed blocks 9 are arranged on both sides of the base 1, and the movable blocks 8 are arranged on both sides of the base 1.

[0037] The mobile removal assembly includes an inclined port 101 arranged on one side of the fixed block 9, and the electric telescopic rod 103 is arranged in the interior of the inclined port 101. The spring column 105 is connected with one end of the electric telescopic rod 103, and the movable block 8 is arranged at one end of the spring column 105.

[0038] The clamping assembly includes the placing block 202 arranged on one side of the movable block 8, and the placing port 203 is arranged in the interior of the placing block 202. The clamping plate 204 is connected with the interior of the placing port 203. The semiconductor raw material 26 is connected with the interior of the placing port 203.

[0039] The mobile removing assembly further comprises a mounting groove 102 formed in the inclined surface inside the inclined opening 101, and an electric telescopic rod 103 is connected in the mounting groove 102, one end of the electric telescopic rod 103 is detachably connected with a connecting head 104, one side of the movable block 8 is fixedly connected with a mounting plate, a circular groove 106 is formed in the surface of the mounting plate, a spring column 105 is detachably connected in the circular groove 106, and one end of the spring column 105 is detachably connected with the connecting head 104.

[0040] Openings 3 are formed in the surfaces of the base 1, and inclined grooves 2 are formed in the openings 3, the inclined grooves 2 are connected with the embedded blocks 6, one end of the embedded blocks 6 is fixedly connected with the movable plates, and connecting openings 5 are formed in the surface of the base 1 and communicate with the embedded grooves 4.

[0041] The clamping assembly further comprises a vertical plate 201 arranged in the inclined groove 2, and the vertical plate 201 is embeddedly connected with a placing block 202, the placing block 202 is movably connected with a clamping block in a placing opening 203, a first screw hole 205 is formed in the surface of the clamping block, and a second screw hole 206 is formed in the bottom of the inner side of the placing opening 203.

[0042] In the embodiment, first, the embedded block 6 fixedly connected with one end of the movable block 8 is inserted into the embedded groove 4 through the opening 3 formed in the surface of the base 1, so that the embedded block 6 moves in the embedded groove 4, the embedded groove 4 is formed in the inner groove formed in the two sides of the base 1, so that the embedded block 6 can move in the embedded groove 4, the extension angle of the opening 3 and the embedded groove 4 is consistent with the extension angle of the inclined groove 2, so that the movable block 8 can move horizontally in the embedded groove 4 and the base 1, the fixed block 9 is fixedly connected with the top of the inclined end of the base 1, the mounting groove 102 is formed in the embedded groove 4 through the inclined opening 101 formed in one side of the fixed block 9, the mounting opening is located on the surface of the inclined surface of the inner side of the inclined opening 101, the electric telescopic rod 103 is mounted and connected through the mounting opening, one end of the electric telescopic rod 103 is mounted with the spring column 105 through the connecting head 104, the spring column 105 is mounted in the circular groove 106 formed in the mounting block 7, one end of the mounting block 7 is fixedly connected with the movable block 8, and the spring column 105 provides a micro-angle adjustment for the electric telescopic rod 103 during extension and retraction, so that the electric telescopic rod 103 can be mounted in an inclined state, at this time, the power supply of the electric telescopic rod 103 is connected through the controller 27 to drive the movable block 8 to move horizontally and obliquely outside the base plate and the inclined groove 2.

[0043] Subsequently, the inner side of the movable block 8 is installed through the inclined plate 16 to the motor 17, and the input end of the rotating shaft 18 connected with the output end of the motor 17 is connected with the vertical plate 201 through the connecting column 19. The vertical plate 201 is internally installed with a placing block 202, and the two ends of the semiconductor raw material 26 are placed through the placing opening 203 opened in the inner side of the placing block 202. After the semiconductor raw material 26 is placed into the placing opening 203, the clamping plate 204 is installed on the top of the placing opening 203, and the first screw hole 205 opened on the surface of the clamping plate 204 is aligned with the second screw hole 206 opened on the top of the placing opening 203. The screw bolt 15 is screwed therein, so that the semiconductor raw material 26 can be stably installed. The movable block 8 is located on both sides of the base 1, and the clamping mechanism and the motor 17 on both sides are connected and controlled to the semiconductor raw material 26.

[0044] Then, when removing the surface particles, the power supply current output end of the two motors 17 is connected through the controller 27. The motor 17 drives the rotating shaft 18 connected with the output end to rotate. The rotating shaft 18 drives the vertical plate 201 connected with one end of the connecting column 19 to rotate. Finally, the semiconductor raw material 26 is driven to rotate through the vertical plate 201 and the clamping mechanism in the inner side thereof. The particle removing mechanism (see embodiment two) for different particle removing effects is installed in the inclined groove 2. The semiconductor raw material 26 can be moved to different particle removing plate surfaces through the movement of the electric telescopic rod 103 for removal.

[0045] It should be noted that when removing the surface particles of the semiconductor raw material 26, the semiconductor raw material 26 is moved in the inclined groove 2 for removal, so that it can be conveniently placed at different particle removing positions. The semiconductor raw material 26 is self-rotated for particle removal, which increases the particle removal efficiency. The semiconductor raw material 26 can be quickly installed and disassembled in the inclined groove 2, effectively clamped for particle removal, and the time loss of personnel is reduced during the particle removal process. Moreover, the operation is convenient.

[0046] Embodiment two: please refer to Figure 1 , Figure 2 , Figure 5 and Figure 7 This embodiment further illustrates embodiment one. The particle removing adjusting assembly in the diagram includes a hydraulic pump 112 arranged in the inner side of the base 1. One end of the hydraulic pump 112 is provided with a fixed plate 114. The surface of the fixed plate 114 is connected with a first particle removing plate 115 and a second particle removing plate 116.

[0047] The particle removing adjusting assembly further includes a first mounting plate 111 detachably connected with one end of the hydraulic pump 112. The other end of the hydraulic pump 112 is detachably connected with a second mounting plate 113. The surface of the shell is provided with an inclined groove 2. The first mounting plate 111 is detachably connected with the bottom of the inclined groove 2.

[0048] The second mounting plate 113 is detachably connected to the bottom of the fixing plate 114, the fixing plate 114 is multiple, the first and second particle removal plates 115 and 116 have different mesh numbers, so that different sizes of particles can be removed.

[0049] The base 1 is provided with a cooling groove 21 at one end, and the cooling groove 21 is provided with a liquid outlet 22 at both sides. The liquid outlet 22 is embeddedly connected with a conduit 23 at one end, and the conduit 23 is surface-connected with a valve 24. The base 1 is provided with a chip outlet 25 at one end, and the chip outlet 25 is in communication with the inside of the chute 2. The surface of the base 1 is detachably connected with a controller 27, and the power current of the motor 17 and the electric telescopic rod 103 is controlled by the controller 27.

[0050] In this embodiment, the hydraulic pump 112 is installed inside the chute 2 through the first mounting plate 111, and the first mounting plate 111 is multiple, and the hydraulic pump 112 is also multiple. The first mounting plate 111 and the hydraulic pump 112 increase the installation of the fixing plate 114, increase the stability when removing surface particles, and prevent the force from falling off. The hydraulic pump 112 is installed at the bottom of the fixing plate 114 through the second mounting plate 113 detachably connected to the top. The hydraulic pump 112 is multiple, and the fixing plate 114 is also multiple. The first and second particle removal plates 115 and 116 are installed through the multiple fixing plates 114, and the multiple fixing plates 114 increase the selection of removing particles. When the semiconductor raw material 26 rotates, the controller 27 connects the power current output end of different groups of hydraulic pumps 112, so that the hydraulic pump 112 works to lift the fixing plate 114, so that the required particle removal surface of the fixing plate 114 installed on the surface is lifted to contact the surface of the semiconductor raw material 26, and the particles are removed.

[0051] When the first and second particle removal plates 115 and 116 need to be replaced due to wear, the user can loosen the bolt 15 connected in the first and second connecting holes 13 and 14 to separate the side plate 12 from the fixing plate 114. The first and second particle removal plates 115 and 116 are provided with a bendable side plate 12 on the outside, and the side plate 12 is connected to the second connecting hole 14 on the outside of the fixing plate 114 through the first connecting hole 13 on the surface and the bolt 15. The first and second particle removal plates 115 and 116 are connected to the fixing plate 114, and are also convenient to disassemble, so that the whole is convenient to replace.

[0052] Then the granular object after granular material is discharged through the bottom opening of the base 1 25 granular object, its discharge opening 25 inside and chute 2 inside, after the semiconductor raw material 26 is placed in the cooling groove 21 of the top of the base 1 after the granular material is removed, through the liquid in the cooling groove 21 on its surface cooling, oxidation prevention treatment, improve the quality and performance of the material surface, cooling groove 21 inside opening of the liquid outlet 22 through the pipe 23 to discharge waste liquid, increase the use of convenience, pipe 23 is controlled by the valve 24 through the surface of the cooperation connection.

[0053] Need to be explained, in the process of granular material removal, the first granular material removal plate 115 and the second granular material removal plate 116 can be adjusted by the hydraulic pump 112 connected at the bottom to extend the height, the semiconductor raw material 26 is required to remove granular material with different requirements, and the granular material removal position can be conveniently installed different granular material removal plate, which is beneficial to the semiconductor raw material 26 to increase the granular material removal efficiency, reduces the collision loss caused by the need to replace the granular material removal position and transport, in the process of granular material removal of semiconductor raw material, the next stage control after granular material removal has efficient adjustment intervention measures, thereby improving the overall granular material removal quality and process convenience.

[0054] The above only describes certain exemplary embodiments of the application by way of illustration, without doubt, for those skilled in the art, without departing from the spirit and scope of the present application, the described embodiments can be modified in various ways. Therefore, the above figures and description are illustrative in nature and should not be construed as limiting the scope of the claims of the present application.

Claims

1. A high-voltage electrostatic electrode microparticle removal device suitable for the semiconductor manufacturing industry, characterized by: Including base (1), remove the mobile component arranged on the surface of base (1), the granule removal adjustment component arranged in the inside of base (1) and the clamping component arranged in the inside of base (1); The both sides of base (1) are provided with fixed blocks (9), and the both sides of base (1) are provided with movable blocks (8); The mobile removal component includes an inclined mouth (101) opened on one side of the fixed block (9), and an electric telescopic rod (103) is arranged in the inclined mouth (101), one end of the electric telescopic rod (103) is connected with a spring column (105), and one end of the spring column (105) is provided with a movable block (8); The granule removal adjustment component includes a hydraulic pump (112) arranged in the inside of base (1), one end of the hydraulic pump (112) is provided with a fixed plate (114), the surface of the fixed plate (114) is connected with a first granule removal plate (115), and the surface of the fixed plate (114) is connected with a second granule removal plate (116); The clamping component includes a placing block (202) arranged on one side of the movable block (8), a placing opening (203) is opened in the inside of the placing block (202), a clamping plate (204) is connected in the inside of the placing opening (203), and a semiconductor raw material (26) is connected in the inside of the placing opening (203); The mobile removal component further includes an installation groove (102) opened in the inclined surface in the inside of the inclined mouth (101), the electric telescopic rod (103) is connected in the inside of the installation groove (102), one end of the electric telescopic rod (103) is detachably connected with a connecting head (104), one side of the movable block (8) is fixedly connected with an installation plate, a circular groove (106) is opened on the surface of the installation plate, the spring column (105) is detachably connected in the inside of the circular groove (106), and one end of the spring column (105) is detachably connected with the connecting head (104).

2. The high-voltage electrostatic precipitator for removing fine particles from a process gas in a semiconductor manufacturing plant according to claim 1, wherein: The granule removal adjustment component further includes a first installation plate (111) detachably connected with one end of the hydraulic pump (112), the other end of the hydraulic pump (112) is detachably connected with a second installation plate (113), an inclined groove (2) is opened on the surface of base (1), and the first installation plate (111) is detachably connected at the bottom of the inclined groove (2).

3. The high-voltage electrostatic precipitator according to claim 2, wherein: The surface of the second installation plate (113) is detachably connected at the bottom of the fixed plate (114), the fixed plate (114) is a plurality of, and the mesh number of the first granule removal plate (115) and the second granule removal plate (116) is different.

4. The high-voltage electrostatic precipitator according to claim 3, wherein: The surface of the both sides of base (1) is provided with an opening (3), the inside of the opening (3) is provided with an embedding groove (4), the embedding groove (4) is connected with an embedding block (6) in the inside, one end of the embedding block (6) is fixedly connected with a movable plate, the surface of base (1) is provided with a connecting opening (5), and the inside of the connecting opening (5) is communicated with the inside of the embedding groove (4).

5. The high-voltage electrostatic precipitator according to claim 1, wherein: The clamping assembly further includes a vertical plate (201) arranged inside the chute (2), the vertical plate (201) is inlaidly connected with a placing block (202) inside, the placing block (202) is movably connected with a clamping block inside a placing opening (203), the surface of the clamping block is provided with a first screw hole (205), and the bottom of the inside of the placing opening (203) is provided with a second screw hole (206).

6. The high-voltage electrostatic precipitator according to claim 1, wherein: The first and second degranulation plates (115, 116) are connected with side plates (12) on the outside, the surface of the side plates (12) is provided with first connecting holes (13), the outside surface of the fixed plate (114) is provided with second connecting holes (14), the first and second connecting holes (13, 14) are aligned inside, and the first and second connecting holes (13, 14) are connected with bolts (15) inside.

7. The high-voltage electrostatic precipitator according to claim 5, wherein: The movable block (8) is detachably connected with an inclined plate (16) on one side, the inclined plate (16) is detachably connected with a motor (17) at one end, the output end of the motor (17) is connected with the input end of a rotating shaft (18), one end of the rotating shaft (18) is detachably connected with a connecting column (19), and one end of the connecting column (19) is detachably connected with a vertical plate (201).

8. The high-voltage electrostatic precipitator according to claim 1, wherein: One end of the base (1) is provided with a cooling groove (21), the inside of the cooling groove (21) is provided with drainage openings (22) on both sides, and one end of the drainage openings (22) is inlaidly connected with a conduit (23).

9. The high-voltage electrostatic precipitator according to claim 8, wherein: The surface of the conduit (23) is connected with a valve (24), one end of the base (1) is provided with a chip removal opening (25), the inside of the chip removal opening (25) is communicated with the inside of the chute (2), and the surface of the base (1) is detachably connected with a controller (27). The power supply current of the motor (17) and the electric telescopic rod (103) is controlled through the controller (27).

Images