Temperature and pressure sensor resistant to large-scale vibration

Abstract

The invention provides a temperature and pressure sensor resistant to large-scale vibration. The temperature and pressure sensor comprises a temperature and pressure measuring assembly, a connecting plate, a shock absorber I, a lower cover plate, a circuit board assembly, an upper cover plate, a socket, a shock absorber II and a shell. The temperature and pressure measuring assembly and the shock absorber I are fixed to the two sides of the connecting plate through the M3 countersunk head screw and the M4 countersunk head screw. The lower cover plate is fixed on the shock absorber I through M3 sunk screws; the upper cover plate and the lower cover plate are connected, a containing cavity is formed between the upper cover plate and the lower cover plate, and the circuit board assembly is arranged in the containing cavity. The socket penetrates through the upper cover plate to be connected with the circuit board assembly and is welded with the upper cover plate; the shock absorber II is arranged outside the socket in a sleeving mode and fixed to the upper cover plate through M3 countersunk head screws. The connecting plate, the shock absorber I, the lower cover plate, the circuit board assembly, the upper cover plate, the socket and the shock absorber II are sleeved with the shell, the shell is connected with the temperature and pressure measuring assembly in a welded mode, and the socket penetrates out of the top of the shell. The vibration damper is simple in structure, good in vibration damping effect and wide in applicable vibration value range, and can be suitable for vibration tests of different values by adjusting the hardness of the vibration damper (the rubber vibration damper is hardness) or the rigidity of the vibration damper (the spring vibration damper is rigidity).

Description

Technical Field

[0001] The invention belongs to the technical field of vibration-resistant design of sensors, and in particular relates to a temperature and pressure sensor capable of withstanding large-scale vibration. Background Art

[0002] At present, the structure of pressure sensors and temperature and pressure sensors includes: pressure interface (or temperature and pressure interface), core, circuit board assembly, shell, socket, plug (after product installation) and other components. Under large vibration levels, the circuit board assembly (especially components), socket, plug and other components of the sensor are prone to structural damage, resulting in loss of product function.

[0003] The current method for vibration reduction design of sensors is:

[0004] a) By pouring thermal conductive glue, the circuit board assembly, the housing, and the pressure interface (or temperature and pressure interface) form an integrated structure. Advantages: There is a certain vibration reduction effect below the vibration acceleration of 40g (related to the vibration resistance of the connector). Disadvantages: The operability of glue pouring is poor, the thermal conductive glue is affected by high and low temperatures (it is easy to break on the joint surface), it is difficult to repair, the product weight will increase, the socket and plug (installed during installation) have no vibration reduction design, and the vibration reduction effect is not obvious when the vibration level is large (greater than the vibration acceleration of 40g);

[0005] b) Lower the center of gravity of the product. Advantages: It has a certain vibration reduction effect, and the design and process are simple. Disadvantages: Due to the limitations of the product's own structure and product installation structure, the vibration reduction effect is not obvious when the vibration level is large (greater than 40g). Summary of the invention

[0006] The invention provides a temperature and pressure sensor capable of withstanding large-scale vibration, thereby solving the problem that the existing temperature and pressure sensor has poor vibration reduction effect.

[0007] The present invention provides a temperature and pressure sensor resistant to large-scale vibration, comprising: a temperature and pressure measurement component, a connecting plate, a vibration damper I, a lower cover plate, a circuit board component, an upper cover plate, a socket, a vibration damper II, and a housing;

[0008] Fix the temperature and pressure measurement assembly and vibration damper I on both sides of the connecting plate by using M3 countersunk screws and M4 countersunk screws;

[0009] Fix the lower cover plate to the shock absorber I with M3 countersunk screws;

[0010] The upper cover plate and the lower cover plate are connected to form a receiving cavity in the middle, and the circuit board assembly is arranged in the receiving cavity;

[0011] The socket passes through the upper cover plate and is connected to the circuit board assembly and is welded to the upper cover plate;

[0012] The shock absorber II is sleeved outside the socket and fixed to the upper cover plate by M3 countersunk screws;

[0013] The outer shell is mounted on the connecting plate, the shock absorber I, the lower cover, the circuit board assembly, the upper cover, the socket, and the outer side of the shock absorber II, and is welded to the temperature and pressure measuring assembly, and the socket passes through the top of the outer shell.

[0014] Optionally, the shock absorber I is a rubber shock absorber or a metal shock absorber, and the shock absorber II is a rubber shock absorber;

[0015] A threaded bushing is arranged inside the rubber vibration damper for connecting a countersunk screw.

[0016] Optionally, a screw hole is provided on the part through which the countersunk screw is passed;

[0017] An annular protrusion is arranged at the top of the screw hole, an annular groove is arranged in the annular protrusion, a spring retaining ring is arranged in the annular groove, and the annular protrusion is filled with epoxy resin glue.

[0018] Optionally, a through hole is provided at the center of the lower cover plate; the shock absorber I is an annular structure, and a center hole is provided at the center;

[0019] Part of the circuit board assembly passes through the through hole and is arranged in the central hole of the vibration absorber I.

[0020] Optionally, the circuit board assembly includes: a filter protection circuit board assembly, a VI conversion circuit board assembly, a temperature compensation circuit board assembly, a power supply circuit board assembly and a signal processing circuit board assembly;

[0021] The socket is connected to the filter protection circuit board assembly through terminal I, and the filter protection circuit board assembly, the VI conversion circuit board assembly, and the temperature compensation circuit board assembly are fixed to the lower cover plate in sequence through pillars and screws;

[0022] The power circuit board assembly and the signal processing circuit board assembly are fixed to the upper cover plate in sequence through pillars and screws;

[0023] The circuit board components are connected via terminal Ⅱ.

[0024] Optionally, the material used for the threaded bushing is high temperature alloy GH4169, the material used for the connecting plate is TC4 titanium alloy, and the material used for the lower cover plate, the upper cover plate and the support is stainless steel 1Cr18Ni9Ti or TC4 titanium alloy;

[0025] The printed circuit board material used in the circuit board assembly is polyimide VT-901.

[0026] Optionally, the socket and the upper cover are formed into an integrated structure by electron beam welding;

[0027] An O-ring I is provided between the shock absorber II and the upper cover plate;

[0028] An O-ring II is provided between the shock absorber II and the housing;

[0029] An O-ring III is provided between the housing and the socket.

[0030] Optionally, the upper cover plate and the lower cover plate are fixed together by electron beam welding.

[0031] Optionally, the material of the shell is TC4 titanium alloy, and the shell is integrated with the temperature and pressure interface of the temperature and pressure measurement component by electron beam welding, and the welding depth is more than 0.7 mm.

[0032] The present invention provides a temperature and pressure sensor capable of withstanding large-scale vibrations. The sensor has 1) good vibration reduction effect and is applicable to a wide range of vibration values. By adjusting the hardness (hardness for rubber vibration reducer) or stiffness (stiffness for spring vibration reducer), the sensor can be applicable to vibration tests of different values. The sensor is easy to maintain because the vibration reducer and the circuit board assembly are installed by screws. If any problem occurs, the sensor can be replaced and repaired in time. The sensor is effective in protecting the socket and the plug (installed during installation). The series structure of the vibration reducer includes the socket and the plug, and the vibration stress borne by the socket and the plug can be reduced during the vibration process. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the temperature and pressure sensor that can withstand large-scale vibrations;

[0034] Figure 2 This is a schematic diagram of the installation of a temperature and pressure sensor that can withstand large-scale vibrations;

[0035] Figure 3 This is the Z-axis stress distribution diagram of the product endurance vibration of the existing sensor;

[0036] Figure 4 This is the Z-axis stress distribution diagram of the product endurance vibration of the temperature and pressure sensor of the present invention;

[0037] Figure 5 This is the installation diagram of M3 countersunk screws;

[0038] Among them, 1-temperature probe; 2-temperature and pressure interface; 3-pressure sensitive core; 4-M3 countersunk screw; 5-connecting plate; 6-M4 countersunk screw; 7-vibration absorber I; 8-lower cover plate; 9-upper cover plate; 10-terminal I; 11-socket; 12-O-ring I; 13-vibration absorber II; 14-O-ring III; 15-housing; 16-O-ring II; 17-power supply circuit board assembly; 18-signal processing circuit board assembly; 19-temperature compensation circuit assembly; 20-VI conversion circuit board assembly; 21-filter protection circuit board assembly; 22-threaded bushing; 23-spring retaining ring; 24-epoxy resin glue. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] like Figure 1-5 As shown, the present invention provides a temperature and pressure sensor that can withstand large-scale vibrations, with a vibration absorber as the core vibration reduction component. The vibration absorber has a good vibration reduction effect. The vibration absorbers are upper and lower vibration absorbers, and there are two of them. The socket and the circuit board assembly are located between the upper and lower vibration absorbers, forming a series structure. When the sensor vibrates, the circuit board assembly and the socket can be attenuated through the vibration absorber series structure, so that the sensor structure will not be harmfully deformed.

[0041] The lower end shock absorber can be composed of a rubber shock absorber and a metal shock absorber, and the upper end shock absorber is composed of a rubber shock absorber.

[0042] The product uses a temperature and pressure measurement component as a core component, which is divided into a temperature and pressure interface, a pressure sensitive core, and a temperature measurement component (including a temperature probe 1). The temperature and pressure interface 2, the pressure sensitive core 3, and the temperature measurement component are formed into an integrated structure by laser welding or electron beam welding.

[0043] The temperature and pressure interface 2, the connection plate 5, and the vibration damper Ⅰ 7 are fixed together by the connection plate 5, the M3 countersunk screws 4, and the M4 countersunk screws 6. The lower cover is fixed to the vibration damper Ⅰ by the M3 countersunk screws.

[0044] The socket and the upper cover plate 9 are formed into an integrated structure by electron beam welding; the vibration absorber II 13 and the O-ring I 12 are fixed to the upper cover plate by M3 countersunk screws; the socket and the filter protection circuit board assembly are connected through the terminal I, and the filter protection circuit board assembly, the VI conversion circuit board assembly, and the temperature compensation circuit board assembly are fixed to the upper cover plate in turn by pillars and screws, and the circuit boards are connected through the terminal II.

[0045] Pass the wires related to the pressure sensitive core and the temperature measurement component through the through hole of the lower cover plate 8, bundle the wires, and weld the wires to the temperature compensation circuit board component.

[0046] The upper cover plate and the lower cover plate are fixed together by electron beam welding.

[0047] The O-ring II 16 and the housing 15 are fixed to the shock absorber II by means of M3 countersunk screws, so that the relevant components of the product are fixed into an integrated structure, and the housing and the temperature and pressure interface are welded together by electron beam welding.

[0048] An O-ring III 16 is provided between the housing and the socket.

[0049] Exemplarily, the temperature and pressure measurement assembly includes a temperature and pressure interface, a pressure sensitive core, and a temperature probe, and the material selected for the above components is TC4 titanium alloy. The pressure sensitive core is installed to the installation position inside the temperature and pressure interface, and then laser welding is used to form an integrated structure. At the same time, the conversion circuit board and lead wires of the pressure sensitive core are fixed by pouring epoxy resin glue 24 and D05 silicone rubber, and the wires are fixed by cotton thread.

[0050] The temperature probe is designed with a threaded structure. The temperature probe is first installed at the installation position outside the temperature and pressure interface, and then electron beam welding is used to form an integrated structure. The lead wire of the temperature probe at the temperature and pressure interface is fixed by injecting epoxy resin glue.

[0051] The internal vibration-resistant design of the sensor adopts a double-vibration absorber series structure. During the vibration process, the vibration absorber assembly will swing slightly, which will attenuate the vibration stress of the stress position of the temperature and pressure interface (the root of the back-cut groove), the pressure sensitive core and other components. According to the structural simulation, it is roughly attenuated from 111.5Mpa to 11.9Mpa. Figure 3 , Figure 4 .

[0052] Exemplarily, the vibration-resistant design of the circuit board assembly and the socket includes the following:

[0053] The main components involved include: connecting plate, countersunk screws, shock absorber I, shock absorber II, pillars, lower cover plate, upper cover plate, filter protection circuit board assembly 21, VI conversion circuit board assembly 20, temperature compensation circuit assembly 19, socket, cylindrical head screws, terminal I10, terminal II, etc.

[0054] The circuit board assembly includes: a filter protection circuit board assembly, a VI conversion circuit board assembly, a temperature compensation circuit board assembly, a power supply circuit board assembly 17 and a signal processing circuit board assembly 18;

[0055] The socket is connected to the filter protection circuit board assembly through terminal I, and the filter protection circuit board assembly, the VI conversion circuit board assembly, and the temperature compensation circuit board assembly are fixed to the lower cover plate in sequence through pillars and screws;

[0056] The power circuit board assembly and the signal processing circuit board assembly are fixed to the upper cover plate in sequence through pillars and screws;

[0057] The circuit board components are connected via terminal Ⅱ.

[0058] Since the stress on the parts related to the fixed shock absorber is relatively large, the countersunk screw and the internal threaded bushing 22 of the shock absorber are made of the high-temperature alloy GH4169, which has good mechanical properties.

[0059] The material used for the connecting plate is TC4 titanium alloy. The material used for the lower cover plate, upper cover plate, support column and cylindrical head screw is stainless steel 1Cr18Ni9Ti.

[0060] The printed circuit board material used in the filter protection circuit board assembly, VI conversion circuit board assembly, and temperature compensation circuit assembly is polyimide VT-901. Polyimide VT-901 has good mechanical properties.

[0061] The socket 11, the upper cover, the lower cover, and the circuit board assembly are located between the upper and lower vibration dampers, forming a series structure. The stress and deformation of the three circuit board assemblies and the socket can be attenuated by the vibration damper. The material used for the upper and lower vibration dampers is fluorosilicone rubber.

[0062] The filter protection circuit board assembly, VI conversion circuit board assembly, and temperature compensation circuit board assembly are designed according to the volume and weight of electronic components to ensure that the weight of the components is evenly distributed. The components are sprayed with insulating varnish on the outside. At the same time, the components with larger volume and weight are reinforced, and some components are covered with D05 silicone rubber.

[0063] The filter protection circuit board assembly and the socket are connected via terminal Ⅰ (by means of soldering with a soldering iron), and the filter protection circuit board assembly, the VI conversion circuit board assembly, and the temperature compensation circuit assembly are connected via terminal Ⅱ (by means of soldering with a soldering iron). The above design ensures that the socket, the filter protection circuit board assembly, the VI conversion circuit board assembly, the temperature compensation circuit assembly, the upper cover plate, and the lower cover plate are firmly fixed to form an integrated structure, thereby improving the vibration resistance.

[0064] Exemplarily, the material used for the shell is TC4 titanium alloy, which has good vibration resistance. The shell and the temperature pressure interface are formed into an integrated structure by electron beam welding, and the welding depth is more than 0.7 mm.

[0065] For example, the damper I, damper II, and connecting plate are fixed by countersunk screws, spring retaining rings 23, and epoxy resin glue. The connecting plate, upper cover plate, lower cover plate, and housing are designed with ring grooves for installing spring retaining rings. First, countersunk screws are used to fix the damper I, damper II, and connecting plate. The spring retaining ring is installed at the ring groove outside the countersunk screw using a special tool. Epoxy resin glue is poured at the junction of the countersunk screw and the spring retaining ring. The installation diagram is as follows Figure 5 shown.

[0066] The above is only a specific embodiment of the present invention, and the present invention is described in detail. The unexplained part is a conventional technology. However, the protection scope of the present invention is not limited to this. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. The protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A temperature and pressure sensor resistant to large-scale vibration, characterized in that: include: Temperature and pressure measurement components, connecting plate, vibration damper I, lower cover, circuit board assembly, upper cover, socket, vibration damper II, housing; Fix the temperature and pressure measurement assembly and vibration damper I on both sides of the connecting plate by using M3 countersunk screws and M4 countersunk screws; Fix the lower cover plate to the shock absorber I with M3 countersunk screws; The upper cover plate and the lower cover plate are connected to form a receiving cavity in the middle, and the circuit board assembly is arranged in the receiving cavity; The socket passes through the upper cover plate and is connected to the circuit board assembly and is welded to the upper cover plate; The shock absorber II is sleeved outside the socket and fixed to the upper cover plate by M3 countersunk screws; The outer shell is mounted on the connecting plate, the shock absorber I, the lower cover, the circuit board assembly, the upper cover, the socket, and the outer side of the shock absorber II, and is welded to the temperature and pressure measuring assembly, and the socket passes through the top of the outer shell.

2. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1, characterized in that: Shock absorber I is a rubber shock absorber or a metal shock absorber, and shock absorber II is a rubber shock absorber; A threaded bushing is arranged inside the rubber vibration damper for connecting a countersunk screw.

3. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1, characterized in that: The part through which the countersunk screw is passed is provided with a screw hole; An annular protrusion is arranged at the top of the screw hole, an annular groove is arranged in the annular protrusion, a spring retaining ring is arranged in the annular groove, and the annular protrusion is filled with epoxy resin glue.

4. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1, characterized in that: A through hole is arranged at the center of the lower cover plate; the shock absorber I is an annular structure, and a center hole is arranged at the center; Part of the circuit board assembly passes through the through hole and is arranged in the central hole of the vibration absorber I.

5. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1 or 4, characterized in that: The circuit board assembly includes: a filter protection circuit board assembly, a VI conversion circuit board assembly, a temperature compensation circuit board assembly, a power supply circuit board assembly and a signal processing circuit board assembly; The socket is connected to the filter protection circuit board assembly through terminal I, and the filter protection circuit board assembly, the VI conversion circuit board assembly, and the temperature compensation circuit board assembly are fixed to the lower cover plate in sequence through pillars and screws; The power circuit board assembly and the signal processing circuit board assembly are fixed to the upper cover plate in sequence through pillars and screws; The circuit board components are connected via terminal Ⅱ.

6. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 2, characterized in that: The material used for the threaded bushing is high-temperature alloy GH4169, the material used for the connecting plate is TC4 titanium alloy, and the materials used for the lower cover plate, upper cover plate and pillar are stainless steel 1Cr18Ni9Ti or TC4 titanium alloy; The printed circuit board material used in the circuit board assembly is polyimide VT-901.

7. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1, characterized in that: The socket and the upper cover are formed into an integrated structure by electron beam welding; An O-ring I is provided between the shock absorber II and the upper cover plate; An O-ring II is provided between the shock absorber II and the housing; An O-ring III is provided between the housing and the socket.

8. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1, characterized in that: The upper cover plate and the lower cover plate are fixed together by electron beam welding.

9. The temperature and pressure sensor capable of withstanding large-scale vibration according to claim 1, characterized in that: The material used for the shell is TC4 titanium alloy. The shell is integrated with the temperature and pressure interface of the temperature and pressure measurement component by electron beam welding, and the welding depth is more than 0.7mm.

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