Chip test task determination method and device and storage medium

Abstract

The embodiment of the invention provides a chip test task determination method and device and a storage medium, the method is automatically executed on a third-party chip evaluation platform, and the method comprises the following steps: obtaining enterprise qualification, a detection report and product information from a manufacturer to which a chip to be evaluated belongs; after the enterprise qualification passes the detection, a standard task is determined according to the product information and a preset vehicle factory standard database, and the standard task is used for indicating a test task which must be completed by a corresponding type of chip; determining whether the detection report is matched with the standard task or not; and when the detection report is not matched with the standard task, taking the standard task as a test task. According to the technical scheme provided by the invention, the problem that the chip test result and the test item of a chip factory may not be accepted by a vehicle factory due to poor information in the prior art is solved. According to the technical scheme, the chip evaluation efficiency can be improved.

Description

Technical Field

[0001] This document relates to the field of inspection and certification of semiconductor chip products, and in particular to a chip test task determination method, device and storage medium. Background Art

[0002] Automotive chips need to undergo a series of relevant tests and certifications before they can be installed in vehicles. They need to undergo chip production company qualification review, production company quality management system review, functional safety testing, information security testing, reliability testing, performance evaluation, etc., and involve many relevant technical standards.

[0003] In the current industry, chip factories usually produce chips according to their own understanding of chips and based on their own technology, and conduct relevant tests.

[0004] However, in reality, every automaker has its own requirements, which are not easily accessible to chip manufacturers. Due to this information gap, the chip test results and test items obtained by the above method may not be recognized by automakers, thus reducing the efficiency of chip evaluation. Summary of the Invention

[0005] In view of the above scheme, the present application aims to propose a chip test task determination method, device and storage medium to solve the problem of reduced chip evaluation efficiency caused by information asymmetry.

[0006] In a first aspect, one or more embodiments of this specification provide a chip test task determination method, which is automatically executed on a third-party chip evaluation platform, and the method includes:

[0007] Obtain enterprise qualifications, test reports, and product information from the manufacturer of the chip to be evaluated;

[0008] After the enterprise qualification passes the test, the standard tasks are determined based on the product information and the preset car manufacturer standard database. The standard tasks are used to indicate the test tasks that must be completed for the corresponding type of chip;

[0009] Determining whether the test report matches the standard task; and

[0010] When the test report does not match the standard task, the standard task is used as the test task.

[0011] Furthermore, the enterprise qualifications are tested by the following methods, including:

[0012] Check whether the manufacturer to be evaluated has ISO9001 certification and / or IATF16949 certification documents;

[0013] and / or,

[0014] Check whether the manufacturer to be evaluated meets the VDA6.3 quality system requirements;

[0015] and / or,

[0016] Check whether the FIT test evaluation results of the manufacturer to be evaluated meet the zero-defect requirement;

[0017] and / or,

[0018] Check whether the zero-defect management process of the manufacturer to be evaluated meets the requirements;

[0019] and / or

[0020] Check whether the manufacturer to be evaluated needs to be certified by the China National Accreditation Service for Conformity Assessment or the Inspection and Testing Agency Qualification Accreditation Mark certification.

[0021] Furthermore, standard tasks include:

[0022] Determine the chip's operating position information and application areas based on the product information;

[0023] Determining a temperature level according to the working condition location information and the application field;

[0024] Determining the test items, test conditions, test requirements, and test standards required for the corresponding chip based on the temperature level and the vehicle manufacturer standard database; and

[0025] The standard task is determined according to the test items, the test conditions, the test requirements, the test standards and the test objectives.

[0026] Furthermore, the test report includes: test items, test conditions, test requirements, test standards and test results; and

[0027] Determining whether the test report matches the standard task includes:

[0028] respectively determining whether the detection item and the test item, the detection condition and the test condition, the detection requirement and the test requirement, the detection standard and the test standard, and the test target and the detection result match; and

[0029] When all items match, it is determined that the test report matches the standard task.

[0030] Furthermore, the method further comprises:

[0031] When the test report does not match the standard task, re-determine the temperature level;

[0032] determining new standard tasks according to the redefined temperature level; and

[0033] The standard task is used as the test task.

[0034] Furthermore, it also includes:

[0035] Obtaining the test result of the test task;

[0036] Calculating a chip score based on the test results, the company qualifications, the test report, and the product information; and

[0037] The chip scores are stored.

[0038] In a second aspect, an embodiment of the present application provides a chip test task determination device, which is automatically executed on a third-party chip evaluation platform, and the device further includes: an acquisition module, a task determination module, a detection module, and a data processing module;

[0039] The acquisition module is used to obtain enterprise qualifications, test reports and product information from the manufacturer of the chip to be evaluated;

[0040] The task determination module is used to determine standard tasks based on the product information and a preset car manufacturer standard database after the enterprise qualification passes the test. The standard tasks are used to indicate the test tasks that must be completed for the corresponding type of chip;

[0041] The detection module is used to determine whether the detection report matches the standard task; and

[0042] The data processing module is used to use the standard task as the test task when the detection report does not match the standard task.

[0043] Furthermore, the task determination module is used to determine the operating position information and application field of the chip based on the product information; determine the temperature level based on the operating position information and the application field; determine the test items, test conditions, test requirements and test standards that need to be performed on the corresponding chip based on the temperature level and the vehicle manufacturer standard database; and determine the standard task based on the test items, the test conditions, the test requirements, the test standards and the test objectives.

[0044] Furthermore, the data processing module is used to redetermine the temperature level when the detection report does not match the standard task; determine a new standard task based on the redetermined temperature level; and use the standard task as the test task.

[0045] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, it implements the chip test task determination method as described in any one of the first aspects.

[0046] Compared with the existing technology, this application can at least achieve the following technical effects:

[0047] As specialized chip evaluation organizations, third-party chip evaluation platforms facilitate the collection of test sheet standards from various automakers, thereby forming an automaker standard database. Based on this database and the chip design cycle, chip manufacturers undergo a two-step screening process. The first step involves screening the company's qualifications. Then, based on product information, test reports, and a pre-set automaker standard database, chip testing strategies are screened. For chips whose testing strategies don't meet automaker requirements, new testing tasks are proposed, enabling chip manufacturers to demonstrate that their chip performance parameters meet automaker requirements, thereby improving chip evaluation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate one or more embodiments of this specification or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0049] Figure 1 A flow chart of a chip test task determination method provided in one or more embodiments of this specification;

[0050] Figure 2 A schematic diagram of the structure of the examination system provided for one or more embodiments of this specification;

[0051] Figure 3 A schematic diagram of the structure of a chip test task determination device provided in one or more embodiments of this specification. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the technical solutions in one or more embodiments of this specification, the technical solutions in one or more embodiments of this specification will be clearly and completely described below in conjunction with the drawings in one or more embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on one or more embodiments of this specification, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this document.

[0053] In the current scenario, a chip manufacturer that makes mobile phone chips wants to enter the automotive chip market. However, due to information barriers, it cannot obtain the chip requirements of various automakers. Therefore, its test items, test methods, and test standards can only be based on the mobile phone chip model and some experience with automotive chips. This approach ultimately prevents automakers from choosing chips from this chip manufacturer.

[0054] Automakers face a wide variety of chips on the market, many of which don't meet their needs. Information gaps between automakers and chip manufacturers mean they spend a significant amount of time screening chips, and they may not always find the right ones.

[0055] To solve the above problems, an embodiment of the present application provides a chip test task determination method, which is automatically executed on a third-party chip evaluation platform, comprising the following steps:

[0056] Step 1: Obtain the company qualifications, test reports and product information from the manufacturer to be evaluated.

[0057] In the embodiment of the present application, it is necessary to authenticate the relevant information of the manufacturer of the chip to be evaluated. The manufacturer of the chip to be evaluated is the manufacturer to be evaluated. The enterprise qualifications include the following:

[0058] (1) Chip product suppliers

[0059] Chip product supplier companies should have ISO9001 certification and provide IATF16949 certification materials to the production companies entrusted by chip design companies for outsourced product manufacturing.

[0060] (2) Enterprise management system review

[0061] a. Quality system review: Review whether the quality systems of chip suppliers and commissioned manufacturers meet the industry's general VDA6.3 quality system requirements.

[0062] b. Zero defect review

[0063] The company's own zero-defect management system documents: review the company's product quality manual documents and determine whether the zero-defect requirements are met based on its quality objectives;

[0064] FIT time failure rate (applicable to products in the R&D process): Review whether the product FIT theoretical evaluation results issued by the R&D and design department meet the zero defect requirements;

[0065] Product zero-defect management process records (applicable to mass-produced products): Review the inspection records of mass-produced products and the PPM (Product Portfolio Management) monitoring and management records of the products that have been put on the vehicle, compare the FIT with the actual situation of the products on the vehicle, and determine whether the product's zero-defect management process meets the requirements.

[0066] (3) Laboratory system review

[0067] For chip products that are certified by supplier companies, the first-party or third-party testing laboratories and testing must be certified by the China National Accreditation Service for Conformity Assessment (CNAS) or China Inspection Body and Laboratory Mandatory Approval (CMA). The review involves the following: personnel, who must have the testing capabilities and relevant qualification materials required by CNAS or CMA; laboratory environment, equipment, and laboratory environment must meet the corresponding automotive-grade chip standards and be approved by CNAS;

[0068] Relevant testing institutions need to obtain national CNAS or CMA certification. The requirements for the laboratory system and third-party institutions for the enterprise's automotive-grade chips should be consistent, mainly including personnel and environmental requirements (for example, the laboratory can complete the AEC-Q series and AQG-324 standard task profile-related test equipment and capabilities, and the laboratory environment meets the temperature of 25±5℃ and the humidity of 45-60RH%).

[0069] The test report is the result of various tests on the chip conducted by the chip factory itself.

[0070] Product information includes:

[0071] Production: Review whether the supplier name and production location of the chip product are consistent with the product chip, whether it is the actual production location, and whether it has semiconductor production qualifications;

[0072] Manufacturing process: Review the wafer process category and process maturity. High maturity can be demonstrated by the number of years the process has been used in mass production (process maturity is evaluated based on the wafer realese that the process has completed and the number of wafers produced annually by the production line using this process);

[0073] Packaging: Review the packaging process category and process maturity. High maturity can be demonstrated by the process being used in mass production for many years. (The process maturity evaluation is based on whether the packaging process production line has completed realese and has produced automotive-grade chip products. It is rated based on the number of packages produced annually by the production line using this process).

[0074] Step 2: After the enterprise qualifications have passed the inspection, determine the standard tasks based on the product information and the preset car factory standard database.

[0075] In this embodiment of the present application, to address the needs of both chip manufacturers and automakers, exclusion is performed only during the qualification testing phase. That is, chip manufacturers with inappropriate qualifications will not be further reviewed. Once the chip manufacturer has verified the relevant qualifications, step 1 can be performed again. For chip manufacturers that meet the enterprise qualifications, subsequent evaluation will begin.

[0076] It's important to note that third-party chip evaluation platforms assist automakers with chip testing. Therefore, they can obtain various automakers' chip standards through legal channels. Based on these chip standards, third-party chip evaluation platforms can build an automaker standard database. Based on the data in this database and the product information provided by chip manufacturers, third-party chip evaluation platforms can generate standard tasks according to automaker standards. Standard tasks specify the required test tasks for a specific chip type.

[0077] Step 3: Determine whether the test report matches the standard task.

[0078] In the embodiments of this application, the test report provided by the chip manufacturer specifies the chip manufacturer's test items, test methods, and test standards. Similarly, the standard task specifies the car manufacturer's test items, test methods, and test standards. Therefore, by determining whether the test report matches the standard task, it can be determined whether the chip manufacturer's test results meet the car manufacturer's requirements.

[0079] Step 4: When the test report does not match the standard task, the standard task is used as the test task.

[0080] In the embodiment of the present application, there are two cases of mismatch.

[0081] In the first case, the chip company provided a report corresponding to the standard task, but the testing methods and standards were different. For example, the standard task required testing chip stability. Although the chip manufacturer provided a stability test report, the testing methods and standards did not meet the requirements of the car manufacturer.

[0082] The second situation is that the chip company does not provide a report corresponding to the standard task. For example, the standard task requires testing chip stability, but the chip manufacturer does not provide a qualitative test report.

[0083] In the first case, the test task requires the chip manufacturer to retest according to the car manufacturer's standards. In the second case, the test task requires the chip manufacturer to add corresponding test items.

[0084] In summary, as an organization specialized in chip evaluation, third-party chip evaluation platforms facilitate the collection of test sheet standards from various automakers, thereby forming an automaker standard database. Based on the automaker standard database and the chip design cycle, chip manufacturers are screened in two steps. The first step is to screen the company's qualifications. Then, based on product information, test reports, and the pre-set automaker standard database, the chip's test strategy is screened. New test tasks are proposed for chips whose test strategies do not meet the automaker's requirements. This increases the chip manufacturer's success rate in winning bids and reduces the time it takes automakers to find suitable chips, thereby improving chip evaluation efficiency.

[0085] In the embodiment of the present application, the following methods may be used to detect the qualifications of an enterprise:

[0086] Check whether the manufacturer to be evaluated has ISO9001 certification and / or IATF16949 certification documents; among them, chip product supplier companies should have ISO9001 certification, and for chip design companies, the production companies entrusted by them for outsourced production should provide IATF16949 certification documents.

[0087] and / or,

[0088] Check whether the manufacturer to be evaluated meets the VDA6.3 quality system requirements;

[0089] and / or,

[0090] Check whether the FIT test evaluation results of the manufacturer to be evaluated meet the zero-defect requirement; the FIT test evaluation results refer to the FIT time failure rate (applicable to products in the R&D process);

[0091] and / or,

[0092] Check whether the zero-defect management process of the manufacturer to be evaluated meets the requirements; specifically, review the inspection records of the measured products and the PPM monitoring management records of the vehicles, compare the FIT with the actual situation on the vehicles, and determine whether the zero-defect management process of the products meets the requirements.

[0093] and / or,

[0094] Check whether the manufacturer to be evaluated needs to be certified by the China National Accreditation Service for Conformity Assessment or the Inspection and Testing Agency Qualification Accreditation Mark certification.

[0095] In the embodiment of the present application, the process of determining the standard task is as follows:

[0096] A1. Determine the chip's operating position information and application areas based on product information.

[0097] A2. Determine the temperature level based on the working location information and application field.

[0098] In the embodiment of the present application, the working condition location information, application field, temperature level and the relationship between the three are shown in Tables 1 to 3:

[0099] Table 1 Temperature grade and temperature range

[0100]

[0101] Table 2 Definition of chip operating position and operating temperature (fuel vehicle)

[0102]

[0103]

[0104] Table 3 Definition of working position and working temperature (electric vehicle)

[0105]

[0106] A3. Determine the test items, test conditions, test requirements, and test standards required for the corresponding chip based on the temperature level and the vehicle manufacturer's standard database.

[0107] In the embodiments of this application, in actual situations, the test items, test conditions, test requirements, and test standards are usually a whole. For the sake of convenience, only some examples are given here. Other situations can be added by those skilled in the art according to actual situations. Specific examples are as follows:

[0108] The reliability report must meet the following requirements: product model, product packaging form, photos of the product before and after sample delivery, etc. Reliability test samples must be sampled from three discontinuous batches (batches can be three discontinuous batches of wafers or three discontinuous batches of packaging from the same production line). Depending on the different testing tasks, at least 300 samples must be provided from the three batches, and the client must provide supporting materials such as product numbers.

[0109] Commercial vehicle-grade chip reliability testing includes accelerated environmental stress testing, accelerated life simulation testing, package assembly integrity testing, electrical characteristics testing, and cavity package integrity testing. Based on the standards, the required test items are automatically matched, and each test result report has the following requirements:

[0110] a) Conduct optical appearance inspection on the test samples before and after the test, and compare the data before and after the test;

[0111] b) Necessary mission profile tests require non-destructive analysis of the test sample package;

[0112] c) The number of samples used in each test link should at least meet the sample quantity requirements of the corresponding reliability level;

[0113] d) The test conditions of each test link should at least meet the test condition requirements of the corresponding reliability level;

[0114] e) The equipment in the reliability test report must meet the CNAS certification laboratory equipment management requirements, such as the equipment must have completed device verification and calibration within one year before the test and have a third-party calibration report;

[0115] f) Product electrical parameter tests should be conducted before and after each test, and the electrical parameter drift before and after the test should be compared as parameter data. For some integrated circuit chips, functional test review is required. Please conduct the review based on the test content.

[0116] g) The results of each reliability test should be passed. If sample failure or damage occurs during the test due to reasons other than testing, it will not be included in the results but must be reflected in the report and the reasons must be explained.

[0117] The functional test report needs to provide information about the circuit or circuit module in the tested chip product, as well as the software and algorithm description used during the test, and give the functional test fault coverage.

[0118] Conduct electrical testing on products, mainly including electrical performance testing and functional testing.

[0119] Electrical tests should include open and short circuit tests, power supply short circuit tests, leakage current tests, output level and current tests. Functional tests and parameter tests should be determined in conjunction with product specifications or instruction manuals, and should cover the functions and parameters of all modules of the chip.

[0120] Electrical performance testing and functional testing should be determined in conjunction with the product specification or instruction manual. Electrical parameter testing includes static test parameters and dynamic test parameters. Functional testing should cover all module functions of the chip.

[0121] For digital circuits, the chip product can have built-in testability design and be tested during electrical testing. Testability design includes scan link circuit testing (Scan), built-in self-test (BIST), boundary scan testing (JTAG-BSD), etc. The scan link circuit test coverage of digital circuits should be based on AEC-Q100-007 as a reference. This review only grades the coverage for reference.

[0122] For analog circuits, key performance parameters should be examined. Scan link circuit test coverage of digital circuits should be based on AEC-Q100-007 as a reference. This review only grades coverage for reference. ATE test procedures should be checked for consistency with the functional test list.

[0123] Failure or damage of test samples caused by incorrect operation during the test or problems unrelated to the test will not be included in the test results, but must be explained in the test demerit report.

[0124] The reports of various test items include but are not limited to the following:

[0125] a) Basic product information

[0126] Including product name, product model, manufacturer, packaging type, and quantity.

[0127] b) Report information

[0128] Including report number, report issuance date, name of testing organization, test specifications, test environment, test date, test requirements, basis documents, and test conclusions.

[0129] c) Summary of test results

[0130] Including test items, reference standards, test conditions, minimum sample size, batch size, total quantity, and test results.

[0131] d) Single test report

[0132] Including test items, testing personnel, sample number, testing method, testing conditions, testing equipment, testing process, test results, appearance inspection, electrical test results, and judgment criteria.

[0133] A4. Determine standard tasks based on test items, test conditions, test requirements, test standards and test objectives.

[0134] In the embodiment of the present application, after determining the standard task, it is necessary to compare it with the test report provided by the chip manufacturer to determine whether its test method meets the standards of the automobile manufacturer. The comparison process is as follows:

[0135] Determine whether the test items match the test items, the test conditions match the test conditions, the test requirements match the test requirements, the test standards match the test standards, and the test objectives match the test results. If all items match, determine that the test report matches the standard task. The test report includes: test items, test conditions, test requirements, test standards, and test results.

[0136] Preferably, in order to take into account the needs of chip manufacturers and automobile manufacturers, in an embodiment of the present application, for the first case of the aforementioned mismatch, the temperature level is re-determined, and a new standard task is determined based on the re-determined temperature level; the standard task is used as the test task. That is, the chip manufacturer is asked to retest according to the requirements of the automobile manufacturer. In this way, the chip manufacturer can retain the opportunity to cooperate with the automobile manufacturer and allow the automobile manufacturer to have more choices in chips with different performance. For example, after comparison, if the chip performance provided by the chip manufacturer does not meet the temperature level Grade 0, the chip manufacturer is informed through the test task to conduct a test for temperature level Grade 1. If the chip manufacturer can pass the test of temperature level Grade 1, it means that the chip manufacturer's chips can still be purchased by the automobile manufacturer. At the same time, this approach also indirectly increases the choices of automobile manufacturers in temperature level Grade 1.

[0137] Preferably, after determining that all reports from the chip factory are the same as the standard tasks, the third-party chip evaluation platform can calculate the chip score based on the final test report and combined with the corporate qualifications and product information provided by the manufacturer to be evaluated; and store the chip score. The stored score can be posted on the third-party chip evaluation platform to facilitate automobile manufacturers to screen chips that meet their own needs. That is, through the third-party chip platform of this application, automobile manufacturers can save time in screening chips. Specifically, requirements and restrictions are imposed on all indicators and parameters of chip products, including the AEC-Q series standards, Jedec standards, and AQG324 standards. The above standards are still industry-leading and benchmark. Testing and certification in accordance with relevant standards are conducive to the healthy development of the domestic automobile industry. Taking into account the development history of joint ventures of domestic automobile manufacturers, the above standards are deeply explored from multiple angles, and a complete review and evaluation system is formulated to grade and certify chip products to meet the needs of various car manufacturers. Among them, the review system is as follows: Figure 2 As shown in the figure, a review indicator system is established based on the dimensions of design enterprise capabilities and product quality. In addition, the review activities are carried out by a team of technical experts or industry experts with experience in reliability testing and research, through a combination of document review and on-site review. The review focuses on enterprise capabilities and product quality.

[0138] The embodiment of the present application provides a chip test task determination device, which is automatically executed on a third-party chip evaluation platform, such as Figure 3 As shown, it includes: an acquisition module 301, a task determination module 302, a detection module 303 and a data processing module 304;

[0139] The acquisition module 301 is used to obtain the enterprise qualifications, test reports and product information from the manufacturer of the chip to be evaluated;

[0140] The task determination module 302 is used to determine the standard tasks after the enterprise qualification passes the test based on the product information and the preset car manufacturer standard database. The standard tasks are used to indicate the test tasks that must be completed for the corresponding type of chip;

[0141] The detection module 303 is used to determine whether the detection report matches the standard task; and

[0142] The data processing module 304 is configured to use the standard task as the test task when the detection report does not match the standard task.

[0143] In an embodiment of the present application, the task determination module 302 is used to determine the operating position information and application field of the chip based on product information; determine the temperature level based on the operating position information and application field; determine the test items, test conditions, test requirements and test standards that need to be performed on the corresponding chip based on the temperature level and the vehicle manufacturer's standard database; and determine the standard tasks based on the test items, test conditions, test requirements, test standards and test objectives.

[0144] In an embodiment of the present application, the data processing module 304 is used to redetermine the temperature level when the detection report does not match the standard task; determine a new standard task based on the redetermined temperature level; and use the standard task as the test task.

[0145] An embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the chip test task determination method described in any one of the above embodiments is implemented.

[0146] It should be noted that the embodiment of the storage medium in this specification and the embodiment of the blockchain-based service provision method in this specification are based on the same inventive concept. Therefore, the specific implementation of this embodiment can refer to the implementation of the corresponding blockchain-based service provision method mentioned above, and the repeated parts will not be repeated.

[0147] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or the sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0148] In the 1930s, technological improvements could be clearly distinguished as either hardware improvements (for example, improvements to circuit structures like diodes, transistors, and switches) or software improvements (improvements to process flows). However, with the advancement of technology, many process flow improvements today can now be considered direct improvements to hardware circuit structures. Designers almost always create the corresponding hardware circuit structure by programming the improved process flow into the hardware circuit. Therefore, it cannot be said that a process flow improvement cannot be implemented using hardware modules. For example, a programmable logic device (PLD), such as a field programmable gate array (FPGA), is an integrated circuit whose logical function is determined by user programming. Designers can "integrate" a digital system on a PLD by programming it themselves, without having to hire a chip manufacturer to design and manufacture a dedicated integrated circuit chip. Moreover, nowadays, instead of manually fabricating integrated circuit chips, this programming is mostly done using "logic compiler" software. This is similar to the software compiler used when developing programs. Before compilation, the original code must also be written in a specific programming language, called a hardware description language (HDL). There is not just one HDL, but many, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones are VHDL (Very-High-Speed ​​Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art will also understand that by simply programming the method flow in one of these hardware description languages ​​and then programming it into an integrated circuit, a hardware circuit that implements the logic method flow can be easily obtained.

[0149] The controller can be implemented in any suitable manner. For example, the controller can take the form of a microprocessor or processor and a computer-readable medium storing computer-readable program code (e.g., software or firmware) executable by the (micro)processor, logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers, and embedded microcontrollers. Examples of controllers include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320. The memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art will also know that in addition to implementing the controller in a purely computer-readable program code format, the controller can be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, such a controller can be considered a hardware component, and the devices included therein for implementing various functions can also be considered as structures within the hardware component. Or even, the devices for implementing various functions can be considered as both software modules that implement the method and structures within the hardware component.

[0150] The systems, devices, modules, or units described in the above embodiments may be implemented by computer chips or entities, or by products having certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0151] For the convenience of description, the above devices are described as being divided into various units according to their functions. Of course, when implementing the embodiments of this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0152] Those skilled in the art will appreciate that one or more embodiments of this specification may be provided as a method, system, or computer program product. Thus, one or more embodiments of this specification may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0153] This specification is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of this specification. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0154] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0155] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0156] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0157] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.

[0158] Computer-readable media includes permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media (transitory media), such as modulated data signals and carrier waves.

[0159] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0160] One or more embodiments of this specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, and the like that perform specific tasks or implement specific abstract data types. One or more embodiments of this specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communications network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0161] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiments are generally similar to the method embodiments, so the description is relatively simple. For relevant parts, refer to the description of the method embodiments.

[0162] The foregoing description is merely an example of the present invention and is not intended to limit the present invention. Persons skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be included within the scope of the claims herein.

Claims

1. A chip test task determination method, characterized in that: The method is automatically performed on a third-party chip evaluation platform, and includes: Obtain the enterprise qualifications, test reports and product information from the manufacturer of the chip to be evaluated; After the enterprise qualification passes the test, the standard tasks are determined according to the product information and the preset car factory standard database, and the standard tasks are used to indicate the test tasks that must be completed for the corresponding type of chip; Determining whether the test report matches the standard task; and When the detection report does not match the standard task, the standard task is used as the test task.

2. The method according to claim 1, characterized in that: The qualifications of the enterprise are tested by the following methods, including: Check whether the manufacturer to be evaluated has ISO9001 certification and / or IATF16949 certification materials; and / or, Check whether the manufacturer to be evaluated meets the VDA6.3 quality system requirements; and / or, Check whether the FIT test evaluation results of the manufacturer to be evaluated meet the zero-defect requirement; and / or, Check whether the zero-defect management process of the manufacturer to be evaluated meets the requirements; and / or Check whether the manufacturer to be evaluated needs to be certified by the China National Accreditation Service for Conformity Assessment or the Inspection and Testing Agency Qualification Recognition Mark certification.

3. The method according to claim 1, characterized in that Determine the standard tasks include: Determine the working position information and application field of the chip according to the product information; Determining a temperature level according to the working condition location information and the application field; Determine the test items, test conditions, test requirements and test standards required for the corresponding chip according to the temperature level and the car factory standard database; and The standard task is determined according to the test items, the test conditions, the test requirements, the test standards and the test objectives.

4. The method according to claim 3, characterized in that The test report includes: test items, test conditions, test requirements, test standards and test results; and Determining whether the test report matches the standard task includes: respectively determining whether the detection item and the test item, the detection condition and the test condition, the detection requirement and the test requirement, the detection standard and the test standard, and the test target and the detection result match; and When all items match, it is determined that the detection report matches the standard task.

5. The method according to claim 4, characterized in that The method further comprises: When the test report does not match the standard task, the temperature level is re-determined; determining new standard tasks according to the redefined temperature level; and The standard task is used as the test task.

6. The method according to claim 1, characterized in that Also includes: Obtaining the test result of the test task; Calculate the chip score according to the test results, the enterprise qualifications, the test report and the product information; as well as The score of the chip is stored.

7. A chip test task determination device, characterized in that: The device is automatically executed on a third-party chip evaluation platform, and the device further comprises: an acquisition module, a task determination module, a detection module and a data processing module; The acquisition module is used to obtain enterprise qualifications, test reports and product information from the manufacturer of the chip to be evaluated; The task determination module is used to determine the standard tasks according to the product information and the preset car factory standard database after the enterprise qualification passes the test, and the standard tasks are used to indicate the test tasks that must be completed for the corresponding type of chips; The detection module is used to determine whether the detection report matches the standard task; and The data processing module is used to use the standard task as the test task when the detection report does not match the standard task.

8. The device according to claim 7, characterized in that The task determination module is used to determine the operating position information and application field of the chip based on the product information; determine the temperature level based on the operating position information and the application field; determine the test items, test conditions, test requirements and test standards required for the corresponding chip based on the temperature level and the vehicle manufacturer's standard database; and determine the standard task based on the test items, the test conditions, the test requirements, the test standards and the test objectives.

9. The device according to claim 8, characterized in that The data processing module is used to redefine the temperature level when the detection report does not match the standard task; determine a new standard task based on the redetermined temperature level; and use the standard task as the test task.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the chip test task determination method according to any one of claims 1 to 6 is implemented.

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