Display panel and manufacturing method thereof, and display device
By providing the first insulating layer and the second insulating layer in the display panel, the problems of residual light-shielding layer and damage to the light-emitting element are solved, and the effect of protecting the light-emitting element is achieved.
Patent Information
- Application Number
- CN202411718130.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-04-04
AI Technical Summary
In the prior art, there is a problem that the light-shielding layer remains or the light-emitting element is damaged, especially when the light-shielding layer remains are removed, which can easily lead to damage to the light-emitting element.
By providing the first insulating layer and the second insulating layer, the first insulating layer includes a plurality of first insulating portions and a first insulating layer opening, the first insulating portion at least partially surrounds the side wall of the light emitting element and contacts, and the second insulating layer covers the top surface of the light emitting element away from the base side. The first insulating layer forms a relatively smooth transition open side wall, carrying the second insulating layer to avoid breakage or cracks; the second insulating layer protects the light-emitting element when removing the residual light-shielding layer.
The second insulating layer is effectively avoided to break or crack at the side wall of the light emitting element, protect the light emitting element, and prevent damage to the light emitting element caused by removing residues of the light shading layer.
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Figure CN119767898A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art
[0002] Micro-component technology refers to the high-density integration of micro-sized component arrays on a substrate. As an emerging display technology, micro-component display has many advantages over liquid crystal display (LCD) and organic light-emitting diode (OLED) display, such as lower power consumption, higher color gamut, faster response rate, etc., and does not require high water and oxygen isolation in packaging. Therefore, mini light-emitting diodes (Mini Light-Emitting Diode, Mini LED) and micro light-emitting diodes (Micro Light-Emitting Diode, MicroLED) are regarded as a display technology with great development prospects.
[0003] However, there are problems in the related art that the light shielding layer remains or the light emitting element is damaged. Summary of the invention
[0004] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device, aiming to solve the problems of residual light-shielding layer or damaged light-emitting elements in the related art.
[0005] In a first aspect, an embodiment of the present application provides a display panel, including:
[0006] substrate;
[0007] A plurality of light-emitting elements are located on one side of the substrate;
[0008] A first insulating layer, comprising a plurality of first insulating portions, and a first insulating layer opening located between two adjacent first insulating portions, wherein the first insulating portion at least partially surrounds a side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element;
[0009] The second insulating layer is located on a side of the first insulating layer away from the substrate, and the second insulating layer at least covers a top surface of the light emitting element away from the substrate.
[0010] In a second aspect, an embodiment of the present application further provides a display device, comprising any one of the display panels described above.
[0011] In a third aspect, an embodiment of the present application further provides a method for manufacturing a display panel, comprising:
[0012] providing a substrate;
[0013] Forming a plurality of light-emitting elements on one side of the substrate by a transfer method;
[0014] forming a first insulating layer, wherein the first insulating layer comprises a plurality of first insulating portions and a first insulating layer opening located between two adjacent first insulating portions, wherein the first insulating portion at least partially surrounds a side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element, and the first insulating layer comprises an organic material;
[0015] A second insulating layer is formed, the second insulating layer is located on a side of the first insulating layer away from the substrate, the second insulating layer at least covers a top surface of the light emitting element away from the substrate, and the second insulating layer comprises an inorganic material.
[0016] In some embodiments, after forming the second insulating layer, the method further includes:
[0017] forming a light shielding layer, the light shielding layer being located on a side of the second insulating layer away from the substrate, the light shielding layer comprising a plurality of light shielding layer openings, the light shielding layer openings exposing the second insulating layer located on a top surface of the light emitting element away from the substrate
[0018] In the embodiments of the present application, on the first aspect, by setting a first insulating layer, the first insulating layer includes a plurality of first insulating parts, and a first insulating layer opening located between two adjacent first insulating parts, the first insulating part at least partially surrounds the side wall of the corresponding light-emitting element, and the first insulating part contacts the side wall of the corresponding light-emitting element, the first insulating layer plays a role in forming a side wall of the first insulating layer opening with a relatively smooth transition, the second insulating layer is located on the side of the first insulating layer away from the substrate, the side wall of the first insulating layer opening can support the second insulating layer, thereby avoiding the second insulating layer from breaking or cracking at the side wall of the light-emitting element; on the second aspect, by setting a second insulating layer, the second insulating layer at least covers the top surface of the light-emitting element away from the substrate, when the residual shading layer is further removed by overexposure, development, etc. in order to remove the residual shading layer, the second insulating layer can protect the light-emitting element and avoid damage to the light-emitting element. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 A schematic top view of a display panel provided for some embodiments of the present application.
[0021] Figure 2 A schematic diagram of a first cross-sectional structure of a display panel provided in some embodiments of the present application.
[0022] Figure 3 A schematic diagram of a second cross-sectional structure of a display panel provided in some embodiments of the present application.
[0023] Figure 4 A schematic diagram of a third cross-sectional structure of a display panel provided in some embodiments of the present application.
[0024] Figure 5 A schematic diagram of a fourth cross-sectional structure of a display panel provided in some embodiments of the present application.
[0025] Figure 6 A schematic diagram of a fifth cross-sectional structure of a display panel provided in some embodiments of the present application.
[0026] Figure 7 A schematic diagram of a sixth cross-sectional structure of a display panel provided in some embodiments of the present application.
[0027] Figure 8 A schematic diagram of a display device 200 provided in some embodiments of the present application.
[0028] Fig. 9 A schematic diagram of a first process step of a method for manufacturing a display panel provided in some embodiments of the present application.
[0029] Fig.10 A schematic diagram of a second driving process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0030] Fig.11 A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0031] Fig.12 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0032] Fig.13 A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0033] Fig.14 A schematic diagram of a fourth intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0034] Description of reference numerals:
[0035] Display device 200; display panel 100; substrate 11; light emitting element 20; first insulating layer 51; second insulating layer 61; first insulating portion 511; first insulating layer opening 51K; first color light emitting element 21; second color light emitting element 22; third color light emitting element 23; light shielding layer 71; light shielding layer opening 71K; first light shielding portion 711; second insulating portion 512;
[0036] first angle α; first side wall 51B; first distance d1; second distance d2; first insulating material body 51a; scattering particles 51b; microstructure 201; first surface 2011; sub-transparent area TA; first sub-display area AA1; second sub-display area AA2; third sub-display area AA3; bonding metal 18; first sub-insulating portion 611; second sub-insulating portion 612;
[0037] First interlayer insulating layer 12; first conductive layer 13; second interlayer insulating layer 14; second conductive layer 15; third interlayer insulating layer 16; third conductive layer 17; source or drain 131; first drive wiring 132; first signal wiring 151; middle connecting electrode 152; second drive wiring 153; first connecting electrode 171; second connecting electrode 172; first through hole 71T; third insulating layer 19. DETAILED DESCRIPTION
[0038] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.
[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0040] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there may be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly under or there may be one or more intervening elements. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there may be one or more intervening elements.
[0041] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.
[0042] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.
[0043] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.
[0044] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.
[0045] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.
[0046] There are problems of residual light-shielding layer or damaged light-emitting elements in the related art. The inventor found that the reason for the above phenomenon is that in the display panel provided by the inventor during the research process, a light-shielding layer is arranged between the light-emitting elements in order to improve the display effect of the display panel. The manufactured light-shielding layer will remain on the surface of the light-emitting element, affecting the display effect. In addition, in order to further improve the light extraction efficiency of the light-emitting element, the light-emitting element provided by the inventor includes a microstructure located on the top surface of the light-emitting element away from the substrate. Due to the presence of the microstructure, when the light-shielding layer is patterned by exposure, development, etc., the light-shielding layer will remain in the microstructure. For example, the light-shielding layer remains in the depression of the microstructure. The residual light-shielding layer will cause the light extraction efficiency of the light-emitting element to decrease. In order to remove the residual light-shielding layer, overexposure, development, etc. are used to further remove the residual light-shielding layer, but this will cause the problem of damage to the light-emitting element.
[0047] Based on the above technical problems, the inventors have found that by setting a second insulating layer, the second insulating layer at least covers the top surface of the light-emitting element away from the substrate. When the residual light-shielding layer is further removed by overexposure, development, etc. in order to remove the residual light-shielding layer, the second insulating layer can protect the light-emitting element and avoid damage to the light-emitting element. However, if the second insulating layer is set alone, the second insulating layer is prone to fracture or cracks at the side wall of the light-emitting element, especially when the cross section of the light-emitting element 20 is as shown in FIG. Figure 2 When the inverted trapezoid is shown, the second insulating layer is more likely to break or crack at the side wall of the light-emitting element, so a first insulating layer is provided, the first insulating layer includes a plurality of first insulating portions, and a first insulating layer opening located between two adjacent first insulating portions, the first insulating portion at least partially surrounds the side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element, the first insulating layer plays a role in forming a relatively smooth transition of the side wall of the first insulating layer opening, the second insulating layer is located on the side of the first insulating layer away from the substrate, the side wall of the first insulating layer opening can support the second insulating layer, thereby avoiding the second insulating layer from breaking or cracking at the side wall of the light-emitting element. Therefore, in the embodiments of the present application, on the first aspect, by setting a first insulating layer, the first insulating layer includes a plurality of first insulating portions, and a first insulating layer opening located between two adjacent first insulating portions, the first insulating portion at least partially surrounds the side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element, the first insulating layer plays a role in forming a side wall of the first insulating layer opening with a relatively smooth transition, the second insulating layer is located on the side of the first insulating layer away from the substrate, the side wall of the first insulating layer opening can support the second insulating layer, thereby avoiding the second insulating layer from breaking or cracking at the side wall of the light-emitting element; on the second aspect, by setting a second insulating layer, the second insulating layer at least covers the top surface of the light-emitting element away from the substrate, when the residual shading layer is further removed by overexposure, development, etc. in order to remove the residual shading layer, the second insulating layer can protect the light-emitting element and avoid damage to the light-emitting element.
[0048] The above is the core idea of this application. The technical solutions in the embodiments of this application will be described clearly and completely below in conjunction with the drawings in the embodiments of this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0049] See also Figures 1 to 7 . Figure 1 A schematic top view of a display panel provided for some embodiments of the present application. Figure 2 A schematic diagram of a first cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 3 A schematic diagram of a second cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 4 A schematic diagram of a third cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 5 A schematic diagram of a fourth cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 6 A schematic diagram of a fifth cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 7 A schematic diagram of a sixth cross-sectional structure of a display panel provided in some embodiments of the present application.
[0050] Figures 2 to 7 for Figure 1 Schematic diagram of the cross-sectional structure of part of the membrane layer at the middle dotted line CC. Figure 2 , Figure 3 and Figure 4 The different shapes of the sidewalls of the first insulating layer opening are shown. Figure 2 , Figure 3 and Figure 4 , Figure 5 by Figure 4 The light shielding layer is further illustrated by taking the example as an example. Figure 6 , an implementation in which the first insulating layer includes a light-shielding material is illustrated. Figure 7 , an implementation in which the first insulating layer includes a first insulating material body and a plurality of scattering particles dispersed in the first insulating material body is illustrated.
[0051] The present application provides a display panel 100, which includes a substrate 11, a plurality of light-emitting elements 20, a first insulating layer 51, and a second insulating layer 61. The plurality of light-emitting elements 20 are located on one side of the substrate 11; the first insulating layer 51 includes a plurality of first insulating portions 511, and a first insulating layer opening 51K located between two adjacent first insulating portions 511, the first insulating portion 511 at least partially surrounds the side wall of the corresponding light-emitting element 20, and the first insulating portion 511 is in contact with the side wall of the corresponding light-emitting element 20; the second insulating layer 61 is located on a side of the first insulating layer 51 away from the substrate 11, and the second insulating layer 61 at least covers the top surface of the light-emitting element 20 away from the substrate 11.
[0052] For example, the substrate 11 may be a glass substrate, a flexible substrate or a silicon-based substrate, which is not limited here.
[0053] For example, the light-emitting diode 20 may be a mini light-emitting diode (Mini Light-Emitting Diode, Mini LED), the light-emitting diode 20 may be a micro light-emitting diode (Micro Light-Emitting Diode, MicroLED), or the light-emitting diode 20 may be a nano light-emitting diode (NanoLED), which is not limited here.
[0054] For example, please combine Figure 1 and Figure 2 The first insulating layer 51 includes a plurality of first insulating portions 511 and a first insulating layer opening 51K located between two adjacent first insulating portions 511 . The first insulating portion 511 at least partially surrounds the side wall of the corresponding light-emitting element 20 , and the first insulating portion 511 contacts the side wall of the corresponding light-emitting element 20 .
[0055] It should be noted that the first insulating layer opening 51K is located between two adjacent first insulating portions 511 , and the side of the first insulating portion 511 away from the light emitting element 20 surrounded by the first insulating portion 511 is the first insulating layer opening 51K.
[0056] For example, please combine Figure 1 and Figure 2 , Figure 1 The figure shows that a plurality of light emitting elements 20 include a first color light emitting element 21, a second color light emitting element 22 and a third color light emitting element 23. The first color light emitting element 21, the second color light emitting element 22 and the third color light emitting element 23 can be different ones of a red light emitting element, a green light emitting element and a blue light emitting element, respectively.
[0057] For example, please combine Figure 1 and Figure 2 A first insulating portion 511 is arranged around the first color light-emitting element 21, and the first insulating portion 511 is arranged in contact with the side wall of the first color light-emitting element 21; a first insulating portion 511 is arranged around the second color light-emitting element 22, and the first insulating portion 511 is arranged in contact with the side wall of the second color light-emitting element 22; a first insulating portion 511 is arranged around the third color light-emitting element 23, and the first insulating portion 511 is arranged in contact with the side wall of the third color light-emitting element 23.
[0058] Optionally, in some embodiments, in the cross-sectional structure of the display panel 100, the cross-sectional structure of the light emitting element 20 is as follows: Figure 2When the inverted trapezoidal shape is shown, the first insulating layer 51 plays a better role in forming a side wall of the first insulating layer opening 51K with a relatively gentle transition. The side wall of the first insulating layer opening 51K can well support the second insulating layer 61, thereby preventing the second insulating layer 61 from breaking or cracking at the inverted trapezoidal side wall of the light emitting element 20. For example, please combine Figure 1 and Figure 2 A first insulating portion 511 surrounding the first color light-emitting element 21 has a first insulating layer opening 51K between it and a first insulating portion 511 surrounding the second color light-emitting element 22; a first insulating portion 511 surrounding the second color light-emitting element 22 has a first insulating layer opening 51K between it and a first insulating portion 511 surrounding the third color light-emitting element 23.
[0059] For example, the second insulating layer 61 covers at least the top surface of the light emitting element 20 away from the substrate 11. Figures 1 to 7 As shown in FIG. 1 , the second insulating layer 61 covers the top surface of the light emitting element 20 away from the substrate 11 , the sidewalls of the first insulating layer opening 51K, and the bottom wall of the first insulating layer opening 51K.
[0060] For example, the second insulating layer 61 is a light-transmitting film layer, so that the light emitted by the light-emitting element 20 can be emitted through the second insulating layer 61 on the top surface of the light-emitting element 20 away from the substrate 11 .
[0061] In the embodiment of the present application, in the first aspect, by providing a first insulating layer 51, the first insulating layer 51 includes a plurality of first insulating portions 511, and a first insulating layer opening 51K located between two adjacent first insulating portions 511, the first insulating portion 511 at least partially surrounds the side wall of the corresponding light-emitting element 20, and the first insulating portion 511 is in contact with the side wall of the corresponding light-emitting element 20, the first insulating layer 51 plays a role in forming a side wall of the first insulating layer opening 51K with a relatively gentle transition, the second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, the side wall of the first insulating layer opening can support the second insulating layer, thereby preventing the second insulating layer 61 from breaking or cracking at the side wall of the light-emitting element 20, and in particular, the cross section of the light-emitting element 20 is as shown in FIG. Figure 2 In the case of the inverted trapezoid shown in FIG. 2 , the first insulating portion 511 can fill the inverted trapezoidal side walls of the light-emitting element 20, thereby preventing the second insulating layer 61 from breaking or cracking at the side walls of the light-emitting element 20; secondly, by providing the second insulating layer 61, the second insulating layer 61 at least covers the top surface of the light-emitting element 20 away from the substrate. In order to remove the remaining shading layer, when overexposure, development, etc. are used to further remove the remaining shading layer in the subsequent manufacturing process, the second insulating layer 61 can protect the light-emitting element 20 and prevent the light-emitting element 20 from being damaged.
[0062] In some embodiments, Figure 1 , Figures 5 to 7 As shown, the display panel 100 also includes a light-shielding layer 71, which is arranged on the side of the second insulating layer 61 away from the substrate 11. The light-shielding layer 71 includes a plurality of light-shielding layer openings 71K, and the light-shielding layer openings 71K expose the second insulating layer 61 on the top surface of the light-emitting element 20 away from the substrate 11.
[0063] It should be noted that Figure 1 In the embodiment, the light shielding layer 71 surrounds the light emitting element 20, and the light emitting element 20 is at least partially located in the light shielding layer opening 71K. The side of the light shielding layer 71 close to the light emitting element 20 surrounded by the light shielding layer 71 is the light shielding layer opening 71K.
[0064] For example, Figure 1 As shown, in the top view, the light shielding layer 71 surrounds the second insulating layer 61 , that is, part of the second insulating layer 61 , the first insulating layer 51 and the light emitting element 20 are located in the light shielding layer opening 71K.
[0065] For example, in the manufacturing process of the display panel, the manufacturing sequence can be as follows: 1) firstly, a plurality of light-emitting elements 20 are formed on one side of the substrate 11 by a transfer method; 2) then, a first insulating layer is formed, and the first insulating layer 51 can be formed by inkjet printing or other methods, the first insulating layer 51 includes an organic material, the first insulating layer 51 includes a plurality of first insulating portions 511, the first insulating portions 511 at least partially surround the side wall of the corresponding light-emitting element 20, and the first insulating portions 511 are in contact with the side wall of the corresponding light-emitting element 20; 3) then, a second insulating layer is formed, and a second insulating layer 61 is formed on the side of the first insulating layer 51 away from the substrate 11, the second insulating layer 61 at least covers the top surface of the light-emitting element 20 away from the substrate 11, and the second insulating layer 61 covers the top surface of the light-emitting element 20 away from the substrate 11. The insulating layer 61 includes an inorganic material; 4) Then, a light-shielding layer is formed, and a material film layer of a light-shielding layer 71 is formed on the side of the second insulating layer 61 away from the substrate 11, and then the material film layer of the light-shielding layer 71 is patterned, and the light-shielding layer 71 includes a plurality of light-shielding layer openings 71K, and the light-shielding layer openings 71K expose the second insulating layer 61 located on the top surface of the light-emitting element 20 away from the substrate 11. At this time, in order to remove the residual light-shielding layer, overexposure, development, etc. are used to further remove the residual light-shielding layer on the top surface of the light-emitting element 20 away from the substrate 11 (for example, the residue of the light-shielding layer 71 in the recess of the microstructure is removed), and the second insulating layer 61 can protect the light-emitting element 20 and prevent the light-emitting element 20 from being damaged.
[0066] For example, Figure 1 , Figures 5 to 7As shown, the light shielding layer opening 71K exposes the second insulating layer 61 located on the top surface of the light emitting element 20 away from the substrate 11, so that the light emitted by the light emitting element 20 can be emitted through the second insulating layer 61 on the top surface of the light emitting element 20 away from the substrate 11.
[0067] By way of example, the second insulating layer 61 includes a first sub-insulating portion 611 and a second sub-insulating portion 612 . The first sub-insulating portion 611 covers the first insulating portion 511 , and the second sub-insulating portion 612 covers the top surface of the light emitting element 20 away from the substrate 11 .
[0068] In some embodiments, Figures 1 to 7 As shown, the first insulating layer 51 includes an organic material; and / or, the second insulating layer 61 includes an inorganic material; and / or, the light shielding layer 71 includes an organic material.
[0069] For example, the first insulating layer 51 includes an organic material, the first insulating portion 511 contacts the side wall of the corresponding light-emitting element 20, and the first insulating layer 51 serves to form a side wall of the first insulating layer opening 51K with a relatively smooth transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, and the side wall of the first insulating layer opening can support the second insulating layer, thereby preventing the second insulating layer 61 from easily breaking or cracking at the side wall of the light-emitting element 20.
[0070] For example, the second insulating layer 61 includes an inorganic material, for example, the light-shielding layer 71 is an organic material such as black photoresist. In order to remove the remaining light-shielding layer 71, when overexposure, development, etc. are used to further remove the remaining light-shielding layer 71 in the subsequent manufacturing process, the second insulating layer 61 will not be etched. The second insulating layer 61 can protect the light-emitting element 20 and prevent the light-emitting element 20 from being damaged.
[0071] For example, the light shielding layer 71 includes an organic material, such as a black photoresist or other organic material. The light shielding layer 71 can well fill the first insulating layer opening 51K to form a light shielding layer 71 with a relatively large thickness.
[0072] In some embodiments, Figure 2 and Figure 3 As shown, the angle between the side wall of the first insulating layer opening 51K and the portion of the substrate 11 covered by the adjacent first insulating portion 511 is an acute angle; the second insulating layer 61 covers the side wall of the first insulating layer opening 51K.
[0073] For example, Figure 2 and Figure 3 As shown, the angle between the side wall of the first insulating layer opening 51K and the portion of the substrate 11 covered by the adjacent first insulating portion 511 is a first angle α ( Figure 2 and Figure 3 In the figure, dotted lines indicate a reference line parallel to the substrate 11 and a first angle α), the first angle α is an acute angle, and the side wall of the first insulating layer opening 51K is the first side wall 51B, which prevents the first insulating layer 51 from forming an inverted trapezoidal first side wall 51B, so that the first insulating layer 51 plays a role in forming a first side wall 51B with a relatively smooth transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, and the side wall of the first insulating layer opening can support the second insulating layer, so as to prevent the second insulating layer 61 from being easily broken or cracked at the side wall of the light-emitting element 20.
[0074] It should be noted that the first angle α is located on the side of the sidewall of the first insulating layer opening 51K facing the first insulating layer.
[0075] For example, Figure 2 and Figure 3 As shown, along the direction from the substrate 11 to the light emitting element 20, the sidewall of the first insulating layer opening 51K is inclined toward the inside of the first insulating layer 51. Alternatively, along the direction from the substrate 11 to the light emitting element 20, the sidewall of the first insulating layer opening 51K is inclined toward the adjacent light emitting element 20.
[0076] In some embodiments, Figure 1 , Figures 5 to 7 As shown, the light shielding layer 71 includes a first light shielding portion 711 located between at least two adjacent light shielding layer openings 71K, and the first light shielding portion 711 is located in the first insulating layer opening 51K.
[0077] For example, the first light shielding portion 711 is located in the first insulating layer opening 51K, and a light shielding layer 71 having a relatively large thickness may be formed, thereby improving the contrast of the display panel 100 .
[0078] In some embodiments, Figure 1 , Figures 5 to 7 As shown, the first insulating layer 51 further includes a plurality of second insulating portions 512 . The second insulating portions 512 are arranged corresponding to the first insulating portions 511 . The second insulating portions 512 are located between the bottom surface of the light emitting element 20 close to the substrate 11 and the substrate 11 .
[0079] For example, Figures 2 to 7 As shown, the second insulating portion 512 is located between the bottom surface of the light emitting element 20 close to the substrate 11 and the substrate 11, which can prevent the light emitting element 20 from being suspended in the air, avoid the light emitting element 20 from being easily damaged, and improve the reliability of the display panel.
[0080] In some embodiments, Figure 1 , Figures 5 to 7As shown, the display panel 100 also includes an array composite layer, which is arranged between the substrate 11 and the first insulating layer 51, and the array composite layer includes a plurality of driving circuits; wherein the first insulating portion 511 and the corresponding second insulating portion 512 are an integrated structure, and the second insulating portion 512 also includes a through hole, and the light-emitting element 20 is electrically connected to the corresponding driving circuit through the through hole.
[0081] For example, during the manufacturing process of the first insulating layer 51 , the first insulating portion 511 and the corresponding second insulating portion 512 may be formed through the same process step, so that the first insulating portion 511 and the corresponding second insulating portion 512 are an integrated structure.
[0082] For example, Figure 1 , Figures 5 to 7 As shown, the display panel 100 further includes an array composite layer, which includes: a first interlayer insulating layer 12, a first conductive layer 13, a second interlayer insulating layer 14, a second conductive layer 15, a third interlayer insulating layer 16, and a third conductive layer 17, which are sequentially stacked on the substrate 11. The array composite layer may include a plurality of thin film transistors and signal traces, and the structure of the array composite layer is not limited herein.
[0083] For example, Figure 1 , Figures 5 to 7 As shown, the first conductive layer 13 includes a source or drain 131 of a thin film transistor (not shown) and some first driving wires 132, the second conductive layer 15 includes a first signal wire 151 and an intermediate connecting electrode 152, and some second driving wires 153, and the third conductive layer 17 includes a first connecting electrode 171 and a second connecting electrode 172. One of the anode and cathode of the light-emitting element 20 is connected to the first connecting electrode 171 through a bonding metal 18 (for example, solder) through a first through hole 71T in the second insulating portion 512, the first connecting electrode 171 is connected to the intermediate connecting electrode 152, and the intermediate connecting electrode 152 is connected to the source or drain 131 of the thin film transistor in the driving circuit. The other of the anode and cathode of the light-emitting element 20 is connected to the second connecting electrode 172 through a bonding metal 18 (for example, solder) through a first through hole 71T in the second insulating portion 512, and the second connecting electrode 172 is connected to the first signal wire 151.
[0084] For example, both the first driving wiring 132 and the second driving wiring 153 are covered by the light shielding layer 71 to increase the contrast.
[0085] In some embodiments, Figure 4 As shown, the distance from the top surface of the light emitting element 20 away from the substrate 11 to the substrate 11 is greater than or equal to the distance from the surface of the first insulating layer 51 away from the substrate 11 to the substrate 11 .
[0086] For example, Figure 4 As shown, the distance from the top surface of the light-emitting element 20 away from the substrate 11 to the substrate 11 is a first distance d1, and the distance from the surface of the first insulating layer 51 away from the substrate 11 to the substrate 11 is a second distance d2. The first distance d1 is greater than or equal to the second distance d2, so that the opening 51K of the first insulating layer is larger, and the shading layer 71 is closer to the light-emitting element 20, which can improve the contrast of the display panel 100.
[0087] In some embodiments, Figure 3 and Figure 4 As shown, the sidewall of the first insulating layer opening 51K is in an arc shape or a step shape.
[0088] For example, Figure 2 As shown in the figure, the side wall of the first insulating layer opening 51K is in the shape of an oblique line. The side wall of the first insulating layer opening 51K is the first side wall 51B. The first insulating layer 51 plays a role in forming a first side wall 51B with a relatively smooth transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, thereby avoiding the second insulating layer 61 from being easily broken or cracked at the side wall of the light-emitting element 20.
[0089] For example, Figure 3 As shown in the figure, the side wall of the first insulating layer opening 51K is stepped, for example, the first side wall 51B is stepped with multiple steps, and the first insulating layer 51 plays a better role in forming a first side wall 51B with a smooth transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, thereby avoiding the second insulating layer 61 from being easily broken or cracked at the side wall of the light-emitting element 20.
[0090] For example, Figure 4 As shown in the figure, the side wall of the first insulating layer opening 51K is in an arc shape, for example, the first side wall 51B is in a convex arc shape (the first side wall 51B protrudes toward the first insulating layer opening 51K), and the first insulating layer 51 plays a role in forming a first side wall 51B with a relatively gentle transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, so that the second insulating layer 61 is prevented from being easily broken or cracked at the side wall of the light-emitting element 20. The first side wall 51B is in a convex arc shape, and the first side wall 51B protrudes toward the connected first insulating layer opening 51K, so that the transition of the first side wall 51B is smoother, which can better prevent the second insulating layer 61 from being easily broken or cracked at the side wall of the light-emitting element 20.
[0091] In some embodiments, Figures 2 to 4As shown, in the side wall of the first insulating layer opening 51K, the slope angle of any portion inclined relative to the plane where the substrate 11 is located is greater than or equal to 45 degrees and less than 90 degrees, and the slope angle is the angle between the tangent line of the side wall of the first insulating layer opening 51K and the plane where the substrate 11 is located.
[0092] For example, in the sidewall of the first insulating layer opening 51K, the slope angle (also referred to as the first angle α, Figure 3 The figure shows that the slope angle of the first side wall 51B near the bottom of the substrate 11 is greater than or equal to 45 degrees and less than 90 degrees, which means that the first insulating layer 51 plays a role in forming a first side wall 51B with a relatively smooth transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11, thereby preventing the second insulating layer 61 from being easily broken or cracked at the side wall of the light-emitting element 20.
[0093] In some embodiments, Figure 6 As shown, the first insulating layer 51 includes a light shielding material.
[0094] For example, Figure 6 As shown, the first insulating layer 51 includes a light-shielding material. For example, the material of the first insulating layer 51 is an organic material such as black photoresist. The first insulating layer 51 not only forms a first side wall 51B with a relatively smooth transition, but also shields and absorbs ambient light, thereby improving the contrast of the display panel.
[0095] For example, Figure 6 As shown, the first insulating layer 51 includes a light-shielding material, which, together with the setting of the light-shielding layer 71, is equivalent to greatly increasing the thickness of the light-shielding layer 71, thereby avoiding a decrease in the contrast of the display panel when the thickness of the light-shielding layer 71 is reduced at the edge of the first insulating layer opening 51K.
[0096] In some embodiments, Figure 7 As shown, the first insulating layer 51 includes a first insulating material body 51 a and a plurality of scattering particles 51 b dispersed in the first insulating material body 51 a .
[0097] For example, Figure 7 As shown, multiple scattering particles 51b can scatter light, and multiple scattering particles 51b can change the propagation direction of light, so that a part of the light emitted downward by the light-emitting element 20 is scattered by the scattering particles 51b in the first insulating layer 51 and then emitted from the first surface 2011 (the top surface of the light-emitting element 20 away from the substrate 11 is the first surface 2011) away from the substrate 11, thereby improving the light extraction efficiency of the light-emitting element 20 and improving the brightness of the display panel 100.
[0098] In some embodiments, Figures 2 to 7 As shown, the light emitting element 20 includes a microstructure 201 located on the top surface of the light emitting element 20 away from the substrate 11 .
[0099] For example, the microstructure 201 may include a plurality of alternately arranged depressions and protrusions, and the depressions and protrusions are alternately arranged on the top surface of the light-emitting element 20 away from the substrate 11 (the top surface of the light-emitting element 20 away from the substrate 11 is the first surface 2011). The microstructure 201 is equivalent to a prism or a lens. The microstructure 201 has a focusing effect, which can improve the light output efficiency of the light-emitting element 20 and improve the brightness of the display panel 100 at a positive viewing angle.
[0100] In some embodiments, Figures 2 to 7 As shown, the display panel 100 includes a display area AA, the display area AA includes a plurality of sub-display areas and a plurality of sub-transparent areas TA, the sub-transparent area TA is located between at least some of the sub-display areas; and a plurality of light emitting elements 20 are disposed in the plurality of sub-display areas.
[0101] For example, any one of the above display panels 100 may be a non-transparent display panel, and any one of the above display panels 100 may also be a transparent display panel. Figures 1 to 7 A transparent display panel is shown.
[0102] For example, when the display panel 100 is a transparent display panel, the display panel 100 includes a plurality of sub-transparent areas TA, and the sub-transparent areas TA are arranged in the display area AA of the display panel. Figure 1 An example is given in which a light emitting element 20 is a sub-display area. Figure 1 , the first sub display area AA1, the second sub display area AA2 and the third sub display area AA3 are illustrated as examples.
[0103] For example, in some embodiments, one sub-display area may be provided with one light emitting element 20 ; in other embodiments, one sub-display area may be provided with a plurality of light emitting elements 20 .
[0104] In some embodiments, Figures 5 to 7 As shown, the second insulating layer 61 extends and covers the sub-transparent area TA.
[0105] For example, Figures 5 to 7 As shown, the second insulating layer 61 extends and covers the sub-transparent area. The second insulating layer 61 is an inorganic material, which can protect the sub-transparent area TA and prevent water and oxygen from intruding.
[0106] For example, Figures 5 to 7 As shown, the first insulating layer 51 is hollowed out in the sub-transparent area TA, which can improve the transmittance of the sub-transparent area TA.
[0107] In some embodiments, Figures 5 to 7 As shown, the display panel 100 further includes a third insulating layer 19 , which is located on a side of the second insulating layer 61 and the light shielding layer 71 away from the substrate 11 , fills the sub-transparent area TA, and includes an organic material.
[0108] For example, the third insulating layer 19 can protect film layers such as the light shielding layer 71 , and the third insulating layer 19 can fill the planarized sub-transparent area TA. The third insulating layer 19 is a transparent material.
[0109] See also Figure 8 , Figure 8 A schematic diagram of a display device 200 provided in some embodiments of the present application.
[0110] On the second aspect, based on the same application concept, the present application also provides a display device 200, the display device 200 includes any one of the display panels 100 described above, or the display device 200 includes a display panel 100 that combines any several of the features described above.
[0111] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel 100 and will not be described in detail below.
[0112] For example, the display device 200 provided in the embodiment of the present application can be Figure 8 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of the present application do not specifically limit this.
[0113] See also Fig. 9 and Fig.10 , Fig. 9 A schematic diagram of a first process step of a method for manufacturing a display panel provided in some embodiments of the present application. Fig.10 A schematic diagram of a second driving process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0114] See also Figures 11 to 14 , Figure 5 . Fig.11 A schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application. Fig.12 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application. Fig.13A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application. Fig.14 A schematic diagram of a fourth intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application. Figure 5 It is also a schematic diagram of a fifth intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.
[0115] Any of the display panels or display devices mentioned above can be manufactured by using the manufacturing method of the display panel. The manufacturing method of the display panel includes: step S100, step S200, step S300 and step S400.
[0116] Step S100, providing a substrate.
[0117] Illustratively, a substrate 11 is provided.
[0118] Step S200, forming a plurality of light emitting elements on one side of the substrate by a transfer method.
[0119] For example, Fig.11 As shown, a plurality of light emitting elements 20 are formed on one side of a substrate 11 by a transfer method.
[0120] For example, Fig.11 As shown, before a plurality of light emitting elements 20 are formed on one side of the substrate 11 by a transfer method, an array composite layer is formed on the substrate 11, and the array composite layer includes a plurality of driving circuits.
[0121] For example, Fig.11 As shown, after the array composite layer is formed, a plurality of light-emitting elements are formed on the side of the array composite layer away from the substrate by a transfer method (mass transfer), and the light-emitting elements 20 are electrically connected to corresponding driving circuits.
[0122] For example, Fig.11 As shown, one of the anode and cathode of the light-emitting element 20 is connected to the first connection electrode 171 through the bonding metal 18 (for example, solder) through the first through hole 71T in the second insulating part 512, the first connection electrode 171 is connected to the intermediate connection electrode 152, and the intermediate connection electrode 152 is connected to the source or drain 131 of the thin film transistor in the driving circuit. The other of the anode and cathode of the light-emitting element 20 is connected to the second connection electrode 172 through the bonding metal 18 (for example, solder) through the first through hole 71T in the second insulating part 512, and the second connection electrode 172 is connected to the first signal wiring 151.
[0123] Step S300, forming a first insulating layer, wherein the first insulating layer includes a plurality of first insulating portions, and a first insulating layer opening located between two adjacent first insulating portions, wherein the first insulating portion at least partially surrounds the side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element, and the first insulating layer includes an organic material.
[0124] For example, Fig.12 As shown, the first insulating layer 51 is formed by inkjet printing or other methods, the first insulating layer 51 includes an organic material, and the first insulating layer 51 includes a plurality of first insulating portions 511, the first insulating portions 511 at least partially surround the sidewalls of the corresponding light-emitting element 20, and the first insulating portions 511 are in contact with the sidewalls of the corresponding light-emitting element 20. At the same time, the material of the first insulating layer 51 also flows to between the bottom surface of the light-emitting element 20 close to the substrate 11 and the substrate 11 to form a second insulating portion 512.
[0125] Step S400, forming a second insulating layer, wherein the second insulating layer is located on a side of the first insulating layer away from the substrate, the second insulating layer at least covers a top surface of the light emitting element away from the substrate, and the second insulating layer comprises an inorganic material.
[0126] For example, Fig.13 As shown, a second insulating layer 61 is formed on a side of the first insulating layer 51 away from the substrate 11 , and the second insulating layer 61 at least covers a top surface of the light emitting element 20 away from the substrate 11 , and the second insulating layer 61 includes an inorganic material.
[0127] For example, Fig.13 As shown, the first insulating layer 51 serves to form a side wall of the first insulating layer opening 51K with a relatively smooth transition. The second insulating layer 61 is located on the side of the first insulating layer 51 away from the substrate 11. The side wall of the first insulating layer opening can support the second insulating layer, thereby preventing the second insulating layer 61 from breaking or cracking at the side wall of the light-emitting element 20.
[0128] In some embodiments, Fig.10 As shown, after forming the second insulating layer 61 (step S400 ), step S500 is further included.
[0129] Step S500, forming a light shielding layer, wherein the light shielding layer is located on a side of the second insulating layer away from the substrate, and the light shielding layer includes a plurality of light shielding layer openings, wherein the light shielding layer openings expose the second insulating layer on the top surface of the light emitting element away from the substrate.
[0130] For example, Fig.14As shown, a material film layer of the light shielding layer 71 is formed on a side of the second insulating layer 61 away from the substrate 11, and then the material film layer of the light shielding layer 71 is patterned, as shown in FIG. Figure 5 As shown, the light shielding layer 71 includes a plurality of light shielding layer openings 71K, and the light shielding layer openings 71K expose the second insulating layer 61 on the top surface of the light emitting element 20 away from the substrate 11 .
[0131] For example, in the manufacturing process of the light shielding layer 71, Figure 14 to Figure 5 During the process, the second insulating layer 61 at least covers the top surface of the light-emitting element 20 away from the substrate. When the residual light-shielding layer is further removed by overexposure, development, etc. in order to remove the residual light-shielding layer in the subsequent manufacturing process (for example, the residue of the light-shielding layer 71 in the depression of the microstructure is removed), the second insulating layer 61 can protect the light-emitting element 20 and avoid damage to the light-emitting element 20.
[0132] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0133] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A display panel, characterized in that: include: substrate; A plurality of light-emitting elements are located on one side of the substrate; A first insulating layer, comprising a plurality of first insulating portions, and a first insulating layer opening located between two adjacent first insulating portions, wherein the first insulating portion at least partially surrounds a side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element; The second insulating layer is located on a side of the first insulating layer away from the substrate, and the second insulating layer at least covers a top surface of the light emitting element away from the substrate.
2. The display panel according to claim 1, characterized in that: Also includes: The light shielding layer is arranged on the side of the second insulating layer away from the substrate, and the light shielding layer includes a plurality of light shielding layer openings, and the light shielding layer openings expose the second insulating layer on the top surface of the light emitting element away from the substrate.
3. The display panel according to claim 2, characterized in that: The first insulating layer comprises an organic material; and / or, The second insulating layer comprises an inorganic material; and / or, The light shielding layer includes an organic material.
4. The display panel according to claim 2, characterized in that: The angle between the side wall of the opening of the first insulating layer and the adjacent base portion covered by the first insulating portion is an acute angle; The second insulating layer covers side walls of the opening of the first insulating layer.
5. The display panel according to claim 2, characterized in that: The light shielding layer includes a first light shielding portion located between at least two adjacent light shielding layer openings, and the first light shielding portion is located in the first insulating layer opening.
6. The display panel according to claim 2, characterized in that: The first insulating layer further includes a plurality of second insulating portions, wherein the second insulating portions are arranged corresponding to the first insulating portions, and the second insulating portions are located between the bottom surface of the light emitting element close to the substrate and the substrate.
7. The display panel according to claim 6, characterized in that: Also includes: An array composite layer is disposed between the substrate and the first insulating layer, and the array composite layer includes a plurality of driving circuits; The first insulating portion and the corresponding second insulating portion are an integral structure, and the second insulating portion further includes a through hole, and the light-emitting element is electrically connected to the corresponding driving circuit through the through hole.
8. The display panel according to claim 2, characterized in that: The distance from the top surface of the light emitting element away from the substrate to the substrate is greater than or equal to the distance from the surface of the first insulating layer away from the substrate to the substrate.
9. The display panel according to claim 2, characterized in that: The sidewall of the opening of the first insulating layer is in an arc shape or a step shape.
10. The display panel according to claim 9, characterized in that: In the side wall of the first insulating layer opening, the slope angle of any part inclined relative to the plane where the substrate is located is greater than or equal to 45 degrees and less than 90 degrees, and the slope angle is the angle between the tangent of the side wall of the first insulating layer opening and the plane where the substrate is located.
11. The display panel according to claim 1, characterized in that: The first insulating layer includes a light shielding material.
12. The display panel according to claim 1, characterized in that: The first insulating layer includes a first insulating material body and a plurality of scattering particles dispersed in the first insulating material body.
13. The display panel according to claim 1, characterized in that: The light emitting element includes a microstructure located on a top surface of the light emitting element remote from the substrate.
14. The display panel according to any one of claims 2 to 10, characterized in that: The display panel comprises a display area, the display area comprises a plurality of sub-display areas and a plurality of sub-transparent areas, and the sub-transparent areas are located between at least part of the sub-display areas; The plurality of light emitting elements are disposed in the plurality of sub-display areas.
15. The display panel according to claim 14, characterized in that: The second insulating layer extends and covers the sub-transparent area.
16. The display panel according to claim 14, characterized in that: Also includes: The third insulating layer is located on a side of the second insulating layer and the light shielding layer away from the substrate, the third insulating layer fills the sub-transparent area, and the third insulating layer comprises an organic material.
17. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 16.
18. A method for manufacturing a display panel, characterized in that: include: providing a substrate; Forming a plurality of light-emitting elements on one side of the substrate by a transfer method; forming a first insulating layer, wherein the first insulating layer comprises a plurality of first insulating portions and a first insulating layer opening located between two adjacent first insulating portions, wherein the first insulating portion at least partially surrounds a side wall of the corresponding light-emitting element, and the first insulating portion contacts the side wall of the corresponding light-emitting element, and the first insulating layer comprises an organic material; A second insulating layer is formed, the second insulating layer is located on a side of the first insulating layer away from the substrate, the second insulating layer at least covers a top surface of the light emitting element away from the substrate, and the second insulating layer comprises an inorganic material.
19. The display panel according to claim 18, characterized in that: After forming the second insulating layer, the method further includes: A light shielding layer is formed, the light shielding layer is located on a side of the second insulating layer away from the substrate, the light shielding layer includes a plurality of light shielding layer openings, and the light shielding layer openings expose the second insulating layer on the top surface of the light emitting element away from the substrate.