Display panel, spliced ​​display screen, preparation method thereof, and electronic device

Abstract

The present application provides a display panel and a method for preparing the same, a spliced ​​display screen and a method for preparing the same, and an electronic device, and relates to the field of display technology. First, at least the central display area is subjected to bonding processing of the light-emitting elements, and then the driving substrate is edge-grinded, and finally the remaining portion at the edge display area is bonded to the light-emitting elements. Since only part of the light-emitting elements at the edge display area are bonded, or even no light-emitting elements are bonded at the edge display area when the driving substrate is edge-grinded, the problem of damage to the light-emitting elements at the edge of the display panel caused by the edge grinding process can be improved, thereby improving the preparation yield and preparation quality of the device.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel and a method for preparing the same, a spliced ​​display screen and a method for preparing the same, and an electronic device. Background Art

[0002] With the continuous development of display technology, users are paying more and more attention to the visual experience of display products, which promotes the development of display technology towards high-definition intelligence and integration. In particular, with the user's demand for larger screen size and high-definition intelligent display, in some display screen usage scenarios, in order to obtain a larger display range, it is necessary to splice multiple single display panels to form a larger spliced ​​display screen. However, the problem of single display panel damage often occurs during the preparation of existing spliced ​​display screens, which affects the preparation yield and quality of the spliced ​​display screen. Summary of the invention

[0003] In view of this, the present application provides a display panel and a method for preparing the same, a spliced ​​display screen and a method for preparing the same, and an electronic device, which effectively solves the technical problems existing in the prior art, improves the problem of damage to the light-emitting elements at the edge of the display panel caused by the edge grinding process, and improves the preparation yield and preparation quality of the device.

[0004] To achieve the above objectives, the technical solutions provided by this application are as follows:

[0005] A display panel, comprising a display area, wherein the display area comprises a central display area and an edge display area surrounding the central display area;

[0006] The display panel includes a driving substrate and a plurality of light-emitting elements located on the driving substrate and in the display area; the driving substrate includes a plurality of driving electrodes, and the light-emitting elements include external electrodes bonded and electrically connected to the corresponding driving electrodes, wherein the bonding method between at least part of the driving electrodes in the edge display area and the external electrodes is different from the bonding method between the driving electrodes in the central display area and the external electrodes.

[0007] Optionally, in the central display area, a bonding metal layer is included between the driving electrode and the external electrode, and the driving electrode and the external electrode are electrically bonded and connected via the bonding metal layer.

[0008] Optionally, in the edge display area, a conductive adhesive layer is provided between at least a portion of the driving electrodes and the external electrodes, and the driving electrodes and the external electrodes are electrically connected by bonding via the conductive adhesive layer.

[0009] Optionally, the conductive adhesive layer is an anisotropic conductive adhesive layer.

[0010] Based on the same inventive concept, the present application also provides a method for preparing a display panel, the method comprising:

[0011] A driving substrate and a plurality of light-emitting elements are provided, wherein the driving substrate comprises a display area, the display area comprises a central display area, and an edge display area surrounding the central display area; and the driving substrate comprises a plurality of driving electrodes, and the light-emitting elements comprise external electrodes;

[0012] At least in the central display area, the driving electrode is electrically bonded to the external electrode;

[0013] Performing edge grinding on the driving substrate;

[0014] At the edge display area, the remaining driving electrodes are bonded and electrically connected to the external electrodes, wherein the bonding method between at least part of the driving electrodes at the edge display area and the external electrodes is different from the bonding method between the driving electrodes at the central display area and the external electrodes.

[0015] Optionally, at least in the central display area, electrically bonding the driving electrode to the external electrode comprises:

[0016] At least in the central display area, the driving electrode and the external electrode are electrically connected by bonding through a bonding metal layer.

[0017] Optionally, the step of electrically bonding the remaining driving electrodes to the external electrodes at the edge display area includes:

[0018] At the edge display area, the remaining driving electrodes are electrically connected to the external electrodes by bonding through a conductive adhesive layer.

[0019] Optionally, the step of electrically connecting the remaining driving electrodes to the external electrodes by bonding through a conductive adhesive layer includes:

[0020] The remaining driving electrodes are electrically connected to the external electrodes by bonding through an anisotropic conductive adhesive layer.

[0021] Based on the same inventive concept, the present application also provides a spliced ​​display screen, including:

[0022] At least two display panels, the display panels comprising display areas, the display areas comprising a central display area and an edge display area surrounding the central display area, at least one side of the edge display area being a spliced ​​edge display area; the spliced ​​edge display areas of the two adjacent spliced ​​display panels are opposite;

[0023] The display panel includes a driving substrate and a plurality of light-emitting elements located on the driving substrate and located in the display area; the driving substrate includes a plurality of driving electrodes, and the light-emitting elements include external electrodes bonded and electrically connected to the corresponding driving electrodes;

[0024] In the display panel, a bonding method between the driving electrode and the external electrode in the central display area is different from a bonding method between the driving electrode and the external electrode in the splicing edge display area.

[0025] Optionally, in the central display area, a bonding metal layer is included between the driving electrode and the external electrode, and the driving electrode and the external electrode are electrically bonded and connected via the bonding metal layer.

[0026] Optionally, at the splicing edge display area, a conductive adhesive layer is included between the driving electrode and the external electrode, and the driving electrode and the external electrode are bonded and electrically connected via the conductive adhesive layer.

[0027] Optionally, the conductive adhesive layer is a light-shielding conductive adhesive layer;

[0028] At the joint boundary between two adjacent display panels, the light-shielding conductive adhesive layers of the two display panels extend to cover the joint boundary and contact each other.

[0029] Optionally, the conductive adhesive layer is an anisotropic conductive adhesive layer.

[0030] Based on the same inventive concept, the present application also provides a method for preparing a spliced ​​display screen, the method comprising:

[0031] At least two driving substrates and a plurality of light-emitting elements are provided, wherein the driving substrate comprises a display area, the display area comprises a central display area and an edge display area surrounding the central display area, at least one side of the edge display area is a spliced ​​edge display area; and the driving substrate comprises a plurality of driving electrodes, and the light-emitting element comprises an external electrode;

[0032] At least in the central display area, the driving electrode is electrically bonded to the external electrode;

[0033] Performing edge grinding on the driving substrate;

[0034] At the splicing edge display area, the driving electrode is bonded and electrically connected to the external electrode to obtain a display panel, wherein the bonding method of the driving electrode and the external electrode at the central display area is different from the bonding method of the driving electrode and the external electrode at the splicing edge display area;

[0035] At least two of the display panels are spliced ​​together to form a spliced ​​display screen, and the spliced ​​edge display areas of the two adjacent spliced ​​display panels are opposite to each other.

[0036] Optionally, at least in the central display area, electrically bonding the driving electrode to the external electrode comprises:

[0037] At least in the central display area, the driving electrode and the external electrode are electrically connected by bonding through a bonding metal layer.

[0038] Optionally, bonding and electrically connecting the driving electrode to the external electrode at the splicing edge display area includes:

[0039] At the splicing edge display area, the driving electrode and the external electrode are electrically connected by bonding through a conductive adhesive layer.

[0040] Optionally, the step of electrically connecting the driving electrode and the external electrode by bonding through a conductive adhesive layer includes:

[0041] The driving electrode and the external electrode are bonded and electrically connected via a light-shielding conductive adhesive layer, wherein at a splicing boundary between two adjacent display panels, the light-shielding conductive adhesive layers of the two display panels extend to cover and contact the splicing boundary.

[0042] Optionally, the step of electrically connecting the driving electrode and the external electrode by bonding through a conductive adhesive layer includes:

[0043] The driving electrode and the external electrode are electrically connected by bonding through an anisotropic conductive adhesive layer.

[0044] Based on the same inventive concept, the present application also provides an electronic device, which includes the above-mentioned display panel, or includes the above-mentioned spliced ​​display screen.

[0045] Compared with the prior art, the technical solution provided by this application has at least the following advantages:

[0046] The present application provides a display panel and a method for preparing the same, a spliced ​​display screen and a method for preparing the same, and an electronic device, wherein the method for preparing the display panel comprises: providing a driving substrate and a plurality of light-emitting elements, wherein the driving substrate comprises a display area, wherein the display area comprises a central display area, and an edge display area surrounding the central display area; and, the driving substrate comprises a plurality of driving electrodes, and the light-emitting elements comprise external electrodes; at least in the central display area, the driving electrodes are bonded and electrically connected to the external electrodes; the driving substrate is subjected to an edge grinding process; at the edge display area, the remaining driving electrodes are bonded and electrically connected to the external electrodes, wherein the bonding method of at least part of the driving electrodes in the edge display area to the external electrodes is different from the bonding method of the driving electrodes in the central display area to the external electrodes.

[0047] As can be seen from the above content, the technical solution provided by the present application first performs bonding processing of the light-emitting elements on at least the central display area, then performs edge grinding on the driving substrate, and finally performs bonding of the light-emitting elements on the remaining part of the edge display area. Since only part of the light-emitting elements at the edge display area are bonded when the driving substrate is edge ground, or even no light-emitting elements are bonded at the edge display area, the problem of damage to the light-emitting elements at the edge of the display panel caused by the edge grinding process can be improved, thereby improving the preparation yield and preparation quality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0049] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0050] Figure 2 for Figure 1 A cross-sectional view along the BB' direction;

[0051] Figure 3 for Figure 1 Another cross-sectional view along the BB' direction;

[0052] Figure 4 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0053] Figure 5 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0054] Figure 6 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0055] Figure 7 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0056] Figure 8 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0057] Fig. 9 A flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0058] Fig.10 and Fig.11 for Fig. 9 The structural schematic diagram corresponding to some steps in the figure;

[0059] Fig.12 A schematic diagram of the structure of a spliced ​​display screen provided in an embodiment of the present application;

[0060] Fig.13 for Fig.12 A cross-sectional view along CC' direction;

[0061] Fig.14 for Fig.12 Another cross-sectional view along CC' direction;

[0062] Fig.15 A schematic diagram of the structure of another spliced ​​display screen provided in an embodiment of the present application;

[0063] Fig.16 A schematic diagram of the structure of another spliced ​​display screen provided in an embodiment of the present application;

[0064] Fig.17 A schematic diagram of the structure of another spliced ​​display screen provided in an embodiment of the present application;

[0065] Fig.18 A schematic diagram of the structure of another spliced ​​display screen provided in an embodiment of the present application;

[0066] Fig.19 A flow chart of a method for preparing a spliced ​​display screen provided in an embodiment of the present application;

[0067] Figure 20 to Figure 22 for Fig.19 The structural schematic diagram corresponding to some steps in the figure;

[0068] Fig.23 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0069] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0070] As described in the background technology, with the continuous development of display technology, users pay more and more attention to the visual experience of display products, which promotes the development of display technology towards high-definition intelligence and integration. In particular, with the user's demand for the expansion of screen size and high-definition intelligent display, in some display screen usage scenarios, in order to obtain a larger display range, it is necessary to splice multiple single display panels to form a larger spliced ​​display screen. However, the problem of single display panel damage often occurs during the preparation of existing spliced ​​display screens, which affects the preparation yield and quality of the spliced ​​display screen.

[0071] For example, micro-light-emitting diode (such as Micro-LED or Mini-LED) display screens may become the development trend of the future display field because of their advantages such as pure solid-state display, long life, high brightness, and compatibility with flexible substrates. In the current conventional micro-light-emitting diode display screen preparation process, it is necessary to complete the preparation of each film layer of the driving circuit in sequence, and then bind the micro-light-emitting diode to the driving substrate through a mass transfer process to achieve the preparation of the micro-light-emitting diode display screen. However, due to the limitations of process capabilities, large-size micro-light-emitting diode display screens need to be realized by splicing several small-size display panels. When preparing existing spliced ​​display screens based on micro-light-emitting diode display panels, the single small-size display panel is usually edge-grinded. Edge grinding is to grind the edge of the display panel by high-speed rotation of a grinding wheel or a grinding rod to reduce the micro-cracks formed on the edge of the display panel after cutting. However, the edge grinding accuracy that can be achieved by the existing edge grinding process is still relatively low, and the micro-light-emitting diodes at the edge of the display panel are often damaged by bumps, thereby affecting the preparation yield and quality of the spliced ​​display screen.

[0072] Based on this, the embodiments of the present application provide a display panel and a method for preparing the same, a spliced ​​display screen and a method for preparing the same, and an electronic device, which effectively solve the technical problems existing in the prior art, improve the problem of damage to the light-emitting elements at the edge of the display panel caused by the edge grinding process, and improve the preparation yield and preparation quality of the device.

[0073] To achieve the above purpose, the technical solution provided in the embodiment of the present application is as follows, specifically combined with Figures 1 to 23 The technical solution provided in the embodiments of the present application is described in detail.

[0074] Combination Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application is shown in FIG. Figure 2 for Figure 1 A cross-sectional view along the BB' direction. The display panel provided in the embodiment of the present application includes a display area, and the display area includes a central display area AA1, and an edge display area AA2 surrounding the central display area AA1. The display panel includes a driving substrate 10, and a plurality of light-emitting elements 20 located on the driving substrate 10 and located in the display area; the driving substrate 10 includes a plurality of driving electrodes 11, and the light-emitting elements 20 include external electrodes 21 bonded and electrically connected to the corresponding driving electrodes 11, wherein the bonding method of at least part of the driving electrodes 11 at the edge display area AA2 and the external electrodes 21 is different from the bonding method of the driving electrodes 11 at the central display area AA1 and the external electrodes 21. Specifically, Figure 2 As shown, the external electrode 21 of the light-emitting element 20 is electrically bonded to the driving electrode 11 of the driving substrate 10 via a bonding structure 30, and the driving electrode 11 at the central display area AA1 is electrically bonded to the external electrode 21 via a first bonding structure 31, while at least part of the driving electrode 11 at the edge display area AA2 is electrically bonded to the external electrode 21 via a second bonding structure 32, and the first bonding structure 31 and the second bonding structure 32 are different.

[0075] It can be understood that the bonding process of at least part of the light-emitting elements 20 at the edge display area AA2 provided in the embodiment of the present application is performed after the bonding process of the light-emitting elements 20 at the center display area AA1 and the driving substrate 10; more specifically, the bonding process of at least part of the light-emitting elements 20 at the edge display area AA2 is performed after the driving substrate 10 is subjected to edge grinding. That is to say, the technical solution provided in the embodiment of the present application first performs the bonding process of the light-emitting elements 20 at least at the center display area AA1 according to the preparation requirements, then performs edge grinding on the driving substrate 10, and finally performs the bonding of the light-emitting elements 20 at the remaining part of the edge display area AA2. Since only part of the light-emitting elements 20 at the edge display area AA2 are bonded when the driving substrate 20 is edge ground, or even no light-emitting elements 20 are bonded at the edge display area AA2, it is possible to improve the problem of damage to the light-emitting elements 20 at the edge of the display panel caused by the edge grinding process, thereby improving the preparation yield and preparation quality of the device.

[0076] In addition, in the preparation process of the display panel provided in the embodiment of the present application, since at least part of the light-emitting elements 20 at the edge display area AA2 are bonded after the edge grinding process is performed on the driving substrate 10, the problem of damage to the light-emitting elements 20 at the edge of the display panel caused by the edge grinding process can be improved. Therefore, in order to ensure the quality of the panel, the edge grinding chipping area tolerance area and the edge grinding tolerance area reserved at the edge of the display panel can be designed to be smaller in size, thereby expanding the area of ​​the edge display area AA2, which is beneficial to increase the resolution of the display panel. Generally, the external electrode 21 of the light-emitting element 20 includes two electrodes, one input and one output, so the driving electrode 11 has two corresponding electrodes. Reference Figure 3 As shown, Figure 1 Another cross-sectional view along the BB' direction, wherein the external electrode 21 provided in the embodiment of the present application includes an anode 211 and a cathode 212, and the anode 211 and the cathode 212 are both located on the side of the light-emitting element 20 facing the driving substrate 10; similarly, the driving electrode 11 includes a first electrode 111 corresponding to the anode 211 and a first electrode 112 corresponding to the cathode 212, the first electrode 111 is bonded and electrically connected to the anode 211, and the second electrode 112 is bonded and electrically connected to the cathode 212. In some embodiments, the light-emitting element 20 provided in the embodiment of the present application can be a light-emitting diode, specifically a micro light-emitting diode, such as micro-LED, mini-LED, etc.

[0077] The driving substrate 10 provided in the embodiment of the present application is integrated with a circuit structure such as a pixel circuit, and the pixel circuit is electrically connected to the light-emitting element 20. The pixel circuit is used to provide a corresponding driving signal to the light-emitting element 20, wherein the pixel circuit is composed of components such as corresponding transistors and capacitors, which is the same as the prior art, so no redundant description is made. Figure 4As shown, it is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein the driving substrate 10 includes a substrate 101; a semiconductor layer 102 located on the substrate 101, the semiconductor layer 102 including an active area forming a transistor TFT; a gate insulating layer 103 located on the side of the semiconductor layer 102 away from the substrate 101; a gate metal layer 104 located on the side of the gate insulating layer 103 away from the substrate 101, the gate metal layer 104 including a gate electrode forming the transistor TFT; a capacitor insulating layer 105 located on the side of the gate metal layer 104 away from the substrate 101; a capacitor metal layer 106 located on the side of the capacitor insulating layer 105 away from the substrate 101, the capacitor metal layer 106 including a plate forming a capacitor in the circuit, and the other plate forming the capacitor can be located on the gate metal layer 104, or the other plate forming the capacitor can be located on the source-drain metal layer 108; an interlayer insulating layer 107 located on the side of the capacitor metal layer 106 away from the substrate 101; a source-drain metal layer 108 located on the side of the interlayer insulating layer 107 away from the substrate 101 The source-drain metal layer 108 includes a source electrode and a drain electrode forming a transistor TFT, and the source electrode and the drain electrode are in contact with the active area through respective vias; a passivation layer 109 located on the side of the source-drain metal layer 108 facing away from the substrate 101; a circuit metal layer 1010 located on the side of the passivation layer 109 facing away from the substrate 101; a planarization layer 1011 located on the side of the circuit metal layer 1010 facing away from the substrate 101; and an electrode layer 1012 located on the side of the planarization layer 1011 facing away from the substrate 101, wherein the electrode layer 1010 is provided at the side of the planarization layer 1011 facing away from the substrate 101. 012 includes a first electrode 11 and a second electrode 12; wherein the first electrode 11 is electrically connected to the switching electrode 13 in the circuit metal layer 1010 through a via, and the switching electrode 13 is electrically connected to the electrode (which can be the source or the drain, which needs to be specifically selected according to the actual application) of the transistor TFT in the source-drain metal layer 108 through a via, and the second electrode 12 is electrically connected to the power supply electrode 14 in the circuit metal layer 1010 through a via, thereby forming a circuit for providing a driving signal to the light-emitting element 20.

[0078] Figure 4 In the display panel shown, the transistor TFT in the driving substrate 10 is a top-gate transistor, that is, the gate of the transistor TFT is located above the active layer. In some other embodiments of the present application, the transistor TFT in the driving substrate 10 provided in the embodiment of the present application can also be a bottom-gate transistor, that is, the gate of the transistor TFT is located below the active layer. Figure 510 is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein a driving substrate 10 includes a substrate 101; a gate metal layer 104 located on the substrate 101, the gate metal layer 104 includes a gate electrode for forming a transistor TFT; a gate insulating layer 103 located on the side of the gate metal layer 104 away from the substrate 101; a semiconductor layer 102 located on the side of the gate insulating layer 103 away from the substrate 101, the semiconductor layer 102 includes an active region for forming a transistor TFT; a capacitor insulating layer 105 located on the side of the semiconductor layer 102 away from the substrate 101; a capacitor metal layer 106 located on the side of the capacitor insulating layer 105 away from the substrate 101, the capacitor metal layer 106 includes a plate for forming a capacitor in a circuit, and another plate for forming a capacitor can be located on the gate metal layer 104, or another plate for forming a capacitor can be located on the source-drain metal layer 108; an interlayer insulating layer 107 located on the side of the capacitor metal layer 106 away from the substrate 101; a source The drain metal layer 108 includes a source and a drain forming a transistor TFT, and the source and the drain are in contact with the active area through respective vias; a passivation layer 109 located on the side of the source and drain metal layer 108 facing away from the substrate 101; a circuit metal layer 1010 located on the side of the passivation layer 109 facing away from the substrate 101; a planarization layer 1011 located on the side of the circuit metal layer 1010 facing away from the substrate 101; and an electrode layer 1012 located on the side of the planarization layer 1011 facing away from the substrate 101, the electrode layer 1012 includes a first electrode 11 and a second electrode 12; wherein the first electrode 11 is electrically connected to the switching electrode 13 in the circuit metal layer 1010 through a via, and the switching electrode 13 is electrically connected to the electrode (which can be a source electrode or a drain electrode, which needs to be specifically selected according to the actual application) of the transistor TFT in the source-drain metal layer 108 through a via, and the second electrode 12 is electrically connected to the power supply electrode 14 in the circuit metal layer 1010 through a via, thereby forming a circuit for providing a driving signal to the light-emitting element 20.

[0079] In some embodiments, at the central display area AA1, a bonding metal layer is included between the driving electrode 11 and the external electrode 21, and the driving electrode 11 and the external electrode 21 are bonded and electrically connected through the bonding metal layer. That is, the first bonding structure 31 provided in the embodiment of the present application can be a bonding metal layer, and when the light-emitting element 20 is transferred to at least the central display area AA1, the external electrodes 21 of these light-emitting elements 20 are bonded to the driving electrode 11 for the first time through the bonding metal layer; specifically, the driving electrode 11 and the external electrode 21 that need to be electrically connected in the first bonding, the first electrode 111 and the anode 211, and the second electrode 112 and the cathode 212 are bonded and electrically connected using their respective corresponding bonding metal layers. It should be noted that the first bonding provided in the embodiment of the present application is not limited to the bonding of the driving electrode 11 and the external electrode 21 in the central display area AA1, but can also be performed on the set area in the edge display area AA2 to bond the driving electrode 11 and the external electrode 21 of the light-emitting element 20, wherein when the light-emitting element 20 is transferred to the central display area AA1, the light-emitting element 20 is also transferred to the set area of ​​the edge display area AA2 at the same time, and then the light-emitting element 20 that has been transferred to the set area of ​​the central display area AA1 and the edge display area AA2 is subjected to the first bonding of the driving electrode 11 and the external electrode 21, such as using a bonding metal layer to bond and electrically connect the driving electrode 11 and the external electrode 21 in these areas.

[0080] At the edge display area AA2, at least part of the driving electrode 11 and the external electrode 21 include a conductive adhesive layer, and the driving electrode 11 and the external electrode 21 are bonded and electrically connected through the conductive adhesive layer. The conductive adhesive layer bonding method is more convenient and has lower requirements, and is more suitable for the bonding and electrical connection of the driving electrode 11 and the external electrode 21 at the edge display area AA2. That is, the second bonding structure 32 provided in the embodiment of the present application can be a conductive adhesive layer. After the edge grinding process is performed on the driving substrate 10, the light-emitting element 20 is transferred to the remaining position in the edge display area AA2, and then the external electrodes 21 of these light-emitting elements 20 are bonded to the driving electrode 11 for the second time through the conductive adhesive layer; specifically, when the electrically connected driving electrode 11 and the external electrode 21 are bonded in the second bonding, the first electrode 111 and the anode 211, and the second electrode 112 and the cathode 212 can be bonded and electrically connected by using their respective corresponding conductive adhesive layers.

[0081] In some embodiments, the conductive adhesive layer provided in the embodiments of the present application is an anisotropic conductive adhesive layer. It can be understood that the anisotropic conductive adhesive layer is a unidirectional conductive adhesive that conducts electricity only in the vertical direction, but not in the horizontal direction, so it can avoid electrical connection between different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212. Based on the characteristics of the above-mentioned anisotropic conductive adhesive, when the second bonding structure 32 is an anisotropic conductive adhesive layer, different styles of design can be performed. Specifically, Figure 6 , which is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein when the second bonding structure 32 is an anisotropic conductive adhesive layer, the anisotropic conductive adhesive is only arranged between the first electrode 111 and the anode 211, and between the second electrode 112 and the cathode 212, such as a first sub-anisotropic conductive adhesive layer 321 arranged between the first electrode 111 and the anode 211, and a second sub-anisotropic conductive adhesive layer 322 arranged between the second electrode 112 and the cathode 212, and there is no corresponding anisotropic conductive adhesive in the remaining areas. Or as Figure 7 As shown, it is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein, when the second bonding structure 32 is an anisotropic conductive adhesive layer, the anisotropic conductive adhesive is only arranged between the first electrode 111 and the anode 211, and the part arranged between the second electrode 112 and the cathode 212 is connected as a whole, and the anisotropic conductive adhesives between different second bonding structures 32 are independent of each other; because the anisotropic conductive adhesive is only conductive in the vertical direction (the direction perpendicular to the plane where the display panel is located), the second bonding structure 32 cannot electrically connect the different driving electrodes 11 arranged in the horizontal direction (the direction parallel to the plane where the display panel is located), between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212. Or as Figure 8 As shown, it is a structural schematic diagram of another display panel provided in an embodiment of the present application, wherein, when the second bonding structure 32 is an anisotropic conductive adhesive layer, the anisotropic conductive adhesive is only arranged between the first electrode 111 and the anode 211, and the part arranged between the second electrode 112 and the cathode 212 is connected as a whole, and the anisotropic conductive adhesives between different second bonding structures 32 are connected as a whole; similarly, since the anisotropic conductive adhesive is only conductive in the vertical direction, the second bonding structure 32 cannot electrically connect different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212, thereby realizing the diversity of the preparation bonding structure of the second bonding structure 32.

[0082] Based on the same inventive concept, the present application also provides a method for preparing a display panel, and the method is used to prepare the display panel provided by any of the above embodiments. Figures 9 to 11 As shown, Fig. 9 A flowchart of a method for preparing a display panel provided in an embodiment of the present application is provided. Fig.10 and Fig.11 for Fig. 9 The preparation method provided in the embodiment of the present application includes:

[0083] S11. Provide a driving substrate 10 and a plurality of light-emitting elements 20, wherein the driving substrate 10 includes a display area, wherein the display area includes a central display area AA1 and an edge display area AA2 surrounding the central display area AA1; and the driving substrate 10 includes a plurality of driving electrodes 11, and the light-emitting element 20 includes an external electrode. The display area of ​​the driving substrate 10 provided in the embodiment of the present application is the display area of ​​the display panel, and the central display area AA1 of the driving substrate 10 is the central display area AA1 of the display panel, and the edge display area AA2 of the driving substrate 10 is the edge display area AA2 of the display panel. In addition, the transistor in the driving substrate 10 provided in the embodiment of the present application may be a bottom-gate transistor or a top-gate transistor, the light-emitting element 20 may be a micro light-emitting diode, the driving electrode 11 includes a first electrode 111 and a second electrode 112, and the external electrode 21 includes an anode 211 and a cathode 222, which is the same as the technical content described in the above embodiment, so no unnecessary details are given here.

[0084] S12 . At least in the central display area AA1 , electrically connect the driving electrode 11 to the external electrode 21 by bonding.

[0085] like Fig.10 As shown, the light-emitting element 20 is transferred to at least the central display area AA1, and the light-emitting element 20 can be transferred to the set area of ​​the edge display area AA2 according to the design requirements, and then the external electrode 21 of the light-emitting element 21 at the set area of ​​the central display area AA1 and the edge display area AA2 is bonded and electrically connected with the corresponding driving electrode 11 to complete the first bonding. Specifically, the embodiment of the present application provides that at least in the central display area AA1, the driving electrode 11 is bonded and electrically connected with the external electrode 21, including: at least in the central display area AA1, the driving electrode 11 and the external electrode 21 are bonded and electrically connected through a bonding metal layer.

[0086] S13, edge grinding the drive substrate 10. Edge grinding is grinding the edge of the drive substrate 10 by rotating a grinding wheel or a grinding rod at high speed to reduce micro cracks formed on the edge of the drive substrate 10 after cutting. Since the edge of the drive substrate 10 includes a small amount or even no light-emitting elements 20, the problem of damage to the light-emitting elements 20 at the edge of the drive substrate 10 during edge grinding is improved.

[0087] S14. In the edge display area AA2, the remaining driving electrodes 11 are bonded and electrically connected to the external electrodes 21, wherein the bonding method between at least part of the driving electrodes 11 and the external electrodes 21 in the edge display area AA2 is different from the bonding method between the driving electrodes 11 and the external electrodes 21 in the central display area AA1.

[0088] like Fig.11As shown, after the edge grinding process of the driving substrate 10 is completed, the remaining light-emitting element 20 is transferred to the remaining partial area of ​​the edge display area AA2, wherein the driving electrode 11 at the edge display area AA2 and the external electrode 21 of the light-emitting element 20 are not bonded during the first bonding, and the remaining partial area of ​​the edge display area AA2 is the entire edge display area AA2; or the partial driving electrode 11 at the edge display area AA2 and the external electrode 21 of the light-emitting element 20 are bonded during the first bonding, and the remaining partial area of ​​the edge display area AA2 is the area where the light-emitting element 20 is not bonded. After the light-emitting element 20 is transferred to the remaining partial area of ​​the edge display area AA2, the driving electrode 11 at the remaining partial area of ​​the edge display area AA2 and the external electrode 21 of the light-emitting element 20 are bonded for the second time. In some embodiments, the remaining driving electrodes 11 are bonded and electrically connected to the external electrodes 21 at the edge display area AA2, including: the remaining driving electrodes 11 are bonded and electrically connected to the external electrodes 21 at the edge display area AA2 through a conductive adhesive layer. That is to say, in the technical solution provided in the embodiment of the present application, the first bonding can be bonded and electrically connected in the form of a metal bonding layer, and the second bonding can be bonded and electrically connected in the form of a conductive adhesive. In particular, the remaining driving electrodes 11 are bonded and electrically connected to the external electrodes 21 through a conductive adhesive layer, including: the remaining driving electrodes 11 are bonded and electrically connected to the external electrodes 21 through an anisotropic conductive adhesive layer. Among them, the anisotropic conductive adhesive layer is a unidirectional conductive adhesive, which conducts electricity only in the vertical direction but not in the horizontal direction. Therefore, it can avoid electrical connection between different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212. This is the same as the technical content described in the above embodiment, so it will not be repeated here.

[0089] Based on the same inventive concept, the embodiment of the present application further provides a spliced ​​display screen, which includes a display panel provided by any of the above embodiments. Fig.12 and Fig.13 As shown, Fig.12 A schematic diagram of the structure of a spliced ​​display screen provided in an embodiment of the present application is shown in FIG. Fig.13 for Fig.12A cross-sectional view along the CC' direction. Among them, the spliced ​​display screen provided in the embodiment of the present application includes: at least two display panels, the display panel includes a display area, the display area includes a central display area AA1, and an edge display area AA2 surrounding the central display area AA1, at least one side of the edge display area AA2 is a spliced ​​edge display area AA21; the spliced ​​edge display areas AA21 of the two adjacent spliced ​​display panels are opposite; the display panel includes a driving substrate 10, and a plurality of light-emitting elements 20 located on the driving substrate 10 and located in the display area; the driving substrate 10 includes a plurality of driving electrodes 11, and the light-emitting element 20 includes an external electrode 21 bonded and electrically connected to the corresponding driving electrode 11; in the display panel, the bonding method of the driving electrode 11 and the external electrode 21 at the central display area AA1 is different from the bonding method of the driving electrode 11 and the external electrode 21 in the spliced ​​edge display area AA21. Specifically, Fig.13 As shown, the external electrode 21 of the light-emitting element 20 is electrically bonded to the driving electrode 11 of the driving substrate 10 via a bonding structure 30, and the driving electrode 11 at the central display area AA1 is electrically bonded to the external electrode 21 via a first bonding structure 31, while at least part of the driving electrode 11 at the splicing edge display area AA21 is electrically bonded to the external electrode 21 via a second bonding structure 32, and the first bonding structure 31 and the second bonding structure 32 are different.

[0090] It can be understood that the bonding process of the light emitting element 20 at the splicing edge display area AA21 provided in the embodiment of the present application is performed after the bonding process of the light emitting element 20 at the central display area AA1 and the driving substrate 10; more specifically, the bonding process of the light emitting element 20 at the splicing edge display area AA21 is performed after the driving substrate 10 is subjected to edge grinding. That is to say, the technical solution provided in the embodiment of the present application first performs the bonding process of the light emitting element 20 at least on the central display area AA1 according to the preparation requirements, then performs edge grinding on the driving substrate 10, and finally performs the bonding of the light emitting element 20 on the remaining part at the splicing edge display area AA21. Since only part of the light emitting elements 20 at the splicing edge display area AA21 are bonded when the driving substrate 20 is edge ground, or even no light emitting element 20 is bonded at the splicing edge display area AA21, it can improve the problem of damage to the light emitting element 20 at the edge of the display panel caused by the edge grinding process, thereby improving the preparation yield and preparation quality of the device.

[0091] In addition, in the preparation process of the display panel provided in the embodiment of the present application, since the light-emitting element 20 at the splicing edge display area AA21 is bonded after the edge grinding process on the driving substrate 10, the problem of damage to the light-emitting element 20 at the edge of the display panel caused by the edge grinding process can be improved. Therefore, in order to ensure the quality of the panel, the edge grinding chipping area tolerance area, edge grinding tolerance area, etc. reserved at the edge of the display panel can be designed to be smaller in size, thereby expanding the area of ​​the splicing edge display area AA21, which is beneficial to increase the resolution of the display panel, and then improve the resolution of the spliced ​​display screen.

[0092] In some embodiments, the edge grinding process provided in the embodiment of the present application is not only to grind the edge of the driving substrate 10 on the side of the splicing display area AA21, but also to grind the entire edge of the driving substrate 10. Therefore, in the display panel provided in the embodiment of the present application, the bonding method of the driving electrode 11 and the external electrode 21 in the entire edge display area AA2 is different from the bonding method of the driving electrode 11 and the external electrode 21 in the central display area AA1, thereby avoiding damage to the light-emitting element 20 in the edge display area AA2 when the driving panel 10 is subjected to edge grinding.

[0093] Generally, the external electrode 21 of the light emitting element 20 includes two electrodes, one input electrode and one output electrode. Therefore, the driving electrode 11 corresponds to two electrodes. Fig.14 As shown, Fig.12 Another cross-sectional view along the CC' direction, wherein the external electrode 21 provided in the embodiment of the present application includes an anode 211 and a cathode 212, and the anode 211 and the cathode 212 are both located on the side of the light-emitting element 20 facing the driving substrate 10; similarly, the driving electrode 11 includes a first electrode 111 corresponding to the anode 211 and a first electrode 112 corresponding to the cathode 212, the first electrode 111 is bonded and electrically connected to the anode 211, and the second electrode 112 is bonded and electrically connected to the cathode 212. In some embodiments, the light-emitting element 20 provided in the embodiment of the present application can be a light-emitting diode, specifically a micro light-emitting diode, such as micro-LED, mini-LED, etc.

[0094] The driving substrate 10 provided in the embodiment of the present application is integrated with a circuit structure such as a pixel circuit, and the pixel circuit is electrically connected to the light-emitting element 20. The pixel circuit is used to provide a corresponding driving signal to the light-emitting element 20, wherein the pixel circuit is composed of components such as corresponding transistors and capacitors, which is the same as the prior art, so no unnecessary details are given. In some embodiments, the transistor TFT in the driving substrate 10 provided in the embodiment of the present application can be a top-gate transistor or a bottom-gate transistor. Figure 4 and Figure 5The structure and related technical description of the transistor TFT in the driving substrate 10 are the same, and no redundant description is given here.

[0095] In some embodiments, at the central display area AA1, a bonding metal layer is included between the driving electrode 11 and the external electrode 21, and the driving electrode 11 and the external electrode 21 are bonded and electrically connected through the bonding metal layer. That is, the first bonding structure 31 provided in the embodiment of the present application can be a bonding metal layer, and when the light-emitting element 20 is transferred to at least the central display area AA1, the external electrodes 21 of these light-emitting elements 20 are bonded to the driving electrode 11 for the first time through the bonding metal layer; specifically, the driving electrode 11 and the external electrode 21 that need to be electrically connected in the first bonding, the first electrode 111 and the anode 211, and the second electrode 112 and the cathode 212 are bonded and electrically connected using their respective corresponding bonding metal layers. It should be noted that the first bonding provided in the embodiment of the present application is not limited to the bonding of the driving electrode 11 and the external electrode 21 in the central display area AA1, but can also be performed on the set area in the edge display area AA2 (the set area is the area outside the spliced ​​edge display area AA21) to bond the driving electrode 11 and the external electrode 21 of the light-emitting element 20 according to design requirements, wherein when the light-emitting element 20 is transferred to the central display area AA1, the light-emitting element 20 is also transferred to the set area of ​​the edge display area AA2 at the same time, and then the light-emitting element 20 that has been transferred to the set area of ​​the central display area AA1 and the edge display area AA2 is subjected to the first bonding of the driving electrode 11 and the external electrode 21, such as using a bonding metal layer to bond and electrically connect the driving electrode 11 and the external electrode 21 in these areas.

[0096] At the splicing edge display area AA21, a conductive adhesive layer is included between the driving electrode 11 and the external electrode 21, and the driving electrode 11 and the external electrode 21 are bonded and electrically connected through the conductive adhesive layer. The conductive adhesive layer bonding method is more convenient and has lower requirements, and is more suitable for the bonding and electrical connection between the driving electrode 11 and the external electrode 21 at the splicing edge display area AA21. That is, the second bonding structure 32 provided in the embodiment of the present application can be a conductive adhesive layer. After the driving substrate 10 is edge-grinded, the light-emitting element 20 is transferred to the remaining position in the edge display area AA2, and then the external electrodes 21 of these light-emitting elements 20 are bonded to the driving electrode 11 for the second time through the conductive adhesive layer; specifically, when the electrically connected driving electrode 11 and the external electrode 21 are bonded in the second bonding, the first electrode 111 and the anode 211, and the second electrode 112 and the cathode 212 can be bonded and electrically connected by using their respective corresponding conductive adhesive layers.

[0097] In some embodiments, the conductive adhesive layer provided in the embodiments of the present application is an anisotropic conductive adhesive layer. It can be understood that the anisotropic conductive adhesive layer is a unidirectional conductive adhesive that conducts electricity only in the vertical direction, but not in the horizontal direction, so it can avoid electrical connection between different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212. Based on the characteristics of the above-mentioned anisotropic conductive adhesive, when the second bonding structure 32 is an anisotropic conductive adhesive layer, different styles of design can be performed. Specifically, Fig.15 , which is a schematic diagram of the structure of another spliced ​​display screen provided by an embodiment of the present application, wherein when the second bonding structure 32 is an anisotropic conductive adhesive layer, the anisotropic conductive adhesive is only arranged between the first electrode 111 and the anode 211, and between the second electrode 112 and the cathode 212, such as the first sub-anisotropic conductive adhesive layer 321 arranged between the first electrode 111 and the anode 211, and the second sub-anisotropic conductive adhesive layer 322 arranged between the second electrode 112 and the cathode 212, and there is no corresponding anisotropic conductive adhesive in the remaining areas. Or as Fig.16 As shown, it is a schematic diagram of the structure of another spliced ​​display screen provided by an embodiment of the present application, wherein, when the second bonding structure 32 is an anisotropic conductive adhesive layer, the anisotropic conductive adhesive is only arranged between the first electrode 111 and the anode 211, and the part arranged between the second electrode 112 and the cathode 212 is connected as a whole, and the anisotropic conductive adhesives between different second bonding structures 32 are independent of each other; because the anisotropic conductive adhesive is only conductive in the vertical direction (the direction perpendicular to the plane where the display panel is located), the second bonding structure 32 cannot electrically connect the different driving electrodes 11 arranged in the horizontal direction (the direction parallel to the plane where the display panel is located), between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212. Or as Fig.17 As shown, it is a structural schematic diagram of another spliced ​​display screen provided in an embodiment of the present application, wherein, when the second bonding structure 32 is an anisotropic conductive adhesive layer, the anisotropic conductive adhesive is only arranged between the first electrode 111 and the anode 211, and the part arranged between the second electrode 112 and the cathode 212 is connected as a whole, and the anisotropic conductive adhesives between different second bonding structures 32 are connected as a whole; similarly, since the anisotropic conductive adhesive is only conductive in the vertical direction, the second bonding structure 32 cannot electrically connect different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212, thereby achieving the diversity of the preparation bonding structure of the second bonding structure 32.

[0098] In one embodiment of the present application, the conductive adhesive layer provided in the embodiment of the present application is a light-shielding conductive adhesive layer; at the joint boundary between two adjacent display panels, the light-shielding conductive adhesive layers of the two display panels also extend to cover the joint boundary and contact each other. Fig.18 As shown, it is a structural schematic diagram of another spliced ​​display screen provided by an embodiment of the present application, wherein the second bonding structure 32 provided by the embodiment of the present application is a conductive adhesive layer, and when the conductive adhesive layer is a light-shielding conductive adhesive layer, the light-shielding conductive adhesive layers of two adjacent display panels can also extend toward the splicing boundary and contact each other, thereby shielding the splicing gap 100 at the splicing boundary, thereby improving the display effect of the spliced ​​display screen. In particular, when the light-shielding conductive adhesive layer can be an isotropic conductive adhesive, there is no need to consider that the conductive adhesive electrically connects different drive electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212, so that it is convenient to realize the bonding electrical connection between the drive electrode 11 and the external electrode 21, and can extend to cover the splicing gap 100 to achieve the purpose of gap shielding, thereby improving the display effect of the spliced ​​display screen. Optionally, the light-shielding adhesive layer may cover the entire splicing edge display area AA21; or the light-shielding adhesive layer may cover a partial area of ​​the splicing edge display area AA21 close to the splicing gap 100, and this application does not make any specific limitation on this.

[0099] Based on the same inventive concept, the embodiment of the present application also provides a method for preparing a spliced ​​display screen, which is used to prepare the spliced ​​display screen provided by any of the above embodiments. Figures 19 to 22 As shown, Fig.19 A flowchart of a method for preparing a spliced ​​display screen provided in an embodiment of the present application, Figure 20 to Figure 22 for Fig.19 The preparation method provided in the embodiment of the present application includes:

[0100] S21. Provide at least two driving substrates 10 and a plurality of light-emitting elements 20, wherein the driving substrate 10 includes a display area, wherein the display area includes a central display area AA1, and an edge display area AA2 surrounding the central display area AA1, wherein at least one side of the edge display area AA2 is a spliced ​​edge display area AA21; and, the driving substrate 10 includes a plurality of driving electrodes 11, and the light-emitting element 20 includes an external electrode 21.

[0101] The display area of ​​the driving substrate 10 provided in the embodiment of the present application is the display area of ​​the display panel, and the central display area AA1 of the driving substrate 10 is the central display area AA1 of the display panel, and the edge display area AA2 of the driving substrate 10 is the edge display area AA2 of the display panel. In addition, the transistor in the driving substrate 10 provided in the embodiment of the present application can be a bottom-gate transistor or a top-gate transistor, the light-emitting element 20 can be a micro light-emitting diode, the driving electrode 11 includes a first electrode 111 and a second electrode 112, and the external electrode 21 includes an anode 211 and a cathode 222, which is the same as the technical content described in the above embodiment, so no redundant description is made here.

[0102] S22 . At least in the central display area AA1 , electrically connect the driving electrode 11 to the external electrode 21 by bonding.

[0103] like Fig. 20 As shown, the light-emitting element 20 is transferred to at least the central display area AA1, and the light-emitting element 20 can be transferred to the set area of ​​the edge display area AA2 (the set area is the area outside the spliced ​​edge display area AA21) according to the design requirements, and then the external electrode 21 of the light-emitting element 21 in the set area of ​​the central display area AA1 and the edge display area AA2 is bonded and electrically connected with the corresponding driving electrode 11 to complete the first bonding. Specifically, the embodiment of the present application provides that at least in the central display area AA1, the driving electrode 11 is bonded and electrically connected with the external electrode 21, including: at least in the central display area AA1, the driving electrode 11 and the external electrode 21 are bonded and electrically connected through a bonding metal layer.

[0104] S23, edge grinding the drive substrate. Edge grinding is grinding the edge of the drive substrate 10 by rotating a grinding wheel or a grinding rod at high speed to reduce micro cracks formed on the edge of the drive substrate 10 after cutting. Since the edge of the drive substrate 10 includes a small amount or even no light-emitting elements 20, the problem of damage to the light-emitting elements 20 at the edge of the drive substrate 10 during edge grinding is improved.

[0105] S24. In the splicing edge display area AA21, the driving electrode 11 is bonded and electrically connected to the external electrode 21 to obtain a display panel, wherein the bonding method between the driving electrode 11 and the external electrode 21 in the central display area AA1 is different from the bonding method between the driving electrode 11 and the external electrode 21 in the splicing edge display area AA21.

[0106] like Fig.21As shown, after the edge grinding process of the driving substrate 10 is completed, the remaining light-emitting elements 20 are transferred to the splicing edge display area AA21, wherein the driving electrode 11 at the edge display area AA2 and the external electrode 21 of the light-emitting element 20 are not bonded during the first bonding, and the splicing edge display area AA21 is the entire edge display area AA2; or the part of the driving electrode 11 at the edge display area AA2 and the external electrode 21 of the light-emitting element 20 are bonded during the first bonding, and the splicing edge display area AA21 is the remaining part of the edge display area AA2. After the light-emitting element 20 is transferred to the splicing edge display area AA21, the driving electrode 11 at the splicing edge display area AA21 and the external electrode 21 of the light-emitting element 20 are bonded for the second time. In some embodiments, the step of bonding and electrically connecting the drive electrode 11 and the external electrode 21 at the splicing edge display area AA21 includes: bonding and electrically connecting the drive electrode 11 and the external electrode 21 at the splicing edge display area AA21 through a conductive adhesive layer. That is to say, in the technical solution provided in the embodiment of the present application, the first bonding can be electrically connected by bonding with a metal bonding layer, and the second bonding can be electrically connected by bonding with a conductive adhesive. In particular, the step of bonding and electrically connecting the drive electrode 11 and the external electrode 21 through a conductive adhesive layer includes: bonding and electrically connecting the drive electrode 11 and the external electrode 21 through an anisotropic conductive adhesive layer. Among them, the anisotropic conductive adhesive layer is a unidirectional conductive adhesive, which conducts electricity only in the vertical direction but not in the horizontal direction. Therefore, it can avoid electrical connection between different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212. This is the same as the technical content described in the above embodiment, so it will not be repeated here.

[0107] S25, splicing at least two of the display panels into a spliced ​​display screen, wherein the spliced ​​edge display areas AA2 of the two adjacent spliced ​​display panels are opposite to each other, such as Fig. 22 shown.

[0108] In one embodiment of the present application, the embodiment of the present application provides that the driving electrode 11 and the external electrode 21 are bonded and electrically connected through a conductive adhesive layer, including: bonding and electrically connecting the driving electrode 11 and the external electrode 21 through a light-shielding conductive adhesive layer, wherein, at the splicing boundary between two adjacent display panels, the light-shielding conductive adhesive layers of the two display panels also extend to cover the splicing boundary and contact each other, thereby shielding the splicing gap 100 at the splicing boundary, thereby improving the display effect of the spliced ​​display screen. The corresponding structure can refer to Fig.18As shown, after the light-emitting element 20 is transferred to the splicing edge display area AA21, the display panel can be prepared for splicing, and then the splicing between adjacent display panels is completed while the driving electrode 11 and the external electrode 21 are bonded through the light-shielding conductive layer. In particular, when the light-shielding conductive adhesive layer can be an isotropic conductive adhesive, there is no need to consider that the conductive adhesive electrically connects different driving electrodes 11 arranged in the horizontal direction, between the first electrode 111 and the second electrode 112, between different external electrodes 21, and between the anode 211 and the cathode 212, so that the driving electrode 11 and the external electrode 21 can be bonded and electrically connected, and at the same time, it can extend to cover the splicing gap 100 to achieve the purpose of gap shielding, thereby improving the display effect of the spliced ​​display screen. Optionally, the light-shielding adhesive layer can cover the entire splicing edge display area AA21; or the light-shielding adhesive layer can cover a portion of the splicing edge display area AA21 close to the splicing gap 100, and this application does not make specific restrictions on this.

[0109] Based on the same inventive concept, the embodiment of the present application also provides an electronic device. Fig.23 As shown, it is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, wherein the electronic device 1000 provided in an embodiment of the present application includes the display panel provided in any one of the above embodiments, or includes the spliced ​​display screen provided in any one of the above embodiments.

[0110] In some embodiments, the electronic device 1000 provided in the embodiment of the present application may be a large or small device such as a mobile terminal, a notebook, a tablet computer, a computer, a wearable device, etc., and the present application does not impose any specific restrictions on this.

[0111] In summary, the embodiments of the present application provide a display panel and a method for preparing the same, a spliced ​​display screen and a method for preparing the same, and an electronic device, wherein the method for preparing the display panel includes: providing a driving substrate and a plurality of light-emitting elements, wherein the driving substrate includes a display area, wherein the display area includes a central display area, and an edge display area surrounding the central display area; and, the driving substrate includes a plurality of driving electrodes, and the light-emitting elements include external electrodes; at least in the central display area, the driving electrodes are bonded and electrically connected to the external electrodes; the driving substrate is edge-grinded; and at the edge display area, the remaining driving electrodes are bonded and electrically connected to the external electrodes, wherein the bonding method of at least part of the driving electrodes in the edge display area to the external electrodes is different from the bonding method of the driving electrodes in the central display area to the external electrodes.

[0112] As can be seen from the above content, the technical solution provided by the embodiment of the present application first performs bonding processing of the light-emitting elements on at least the central display area, then performs edge grinding on the driving substrate, and finally performs bonding of the light-emitting elements on the remaining part of the edge display area. Since only part of the light-emitting elements at the edge display area are bonded when the driving substrate is edge ground, or even no light-emitting elements are bonded at the edge display area, the problem of damage to the light-emitting elements at the edge of the display panel caused by the edge grinding process can be improved, thereby improving the manufacturing yield and manufacturing quality of the device.

[0113] In the description of the embodiments of the present application, it needs to be understood that the orientation or position relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0114] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the embodiments of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0115] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0116] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0117] In the embodiments of the present application, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradicting each other.

[0118] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area, wherein the display area comprises a central display area and an edge display area surrounding the central display area; The display panel includes a driving substrate and a plurality of light-emitting elements located on the driving substrate and in the display area; the driving substrate includes a plurality of driving electrodes, and the light-emitting elements include external electrodes bonded and electrically connected to the corresponding driving electrodes, wherein the bonding method between at least part of the driving electrodes in the edge display area and the external electrodes is different from the bonding method between the driving electrodes in the central display area and the external electrodes.

2. The display panel according to claim 1, characterized in that: In the central display area, a bonding metal layer is included between the driving electrode and the external electrode, and the driving electrode and the external electrode are bonded and electrically connected through the bonding metal layer.

3. The display panel according to claim 1, characterized in that: At the edge display area, at least a portion of the driving electrodes and the external electrodes include a conductive adhesive layer, and the driving electrodes and the external electrodes are bonded and electrically connected via the conductive adhesive layer.

4. The display panel according to claim 3, characterized in that: The conductive adhesive layer is an anisotropic conductive adhesive layer.

5. A method for preparing a display panel, characterized in that: The preparation method comprises: A driving substrate and a plurality of light-emitting elements are provided, wherein the driving substrate comprises a display area, the display area comprises a central display area, and an edge display area surrounding the central display area; and the driving substrate comprises a plurality of driving electrodes, and the light-emitting elements comprise external electrodes; At least in the central display area, the driving electrode is electrically bonded to the external electrode; Performing edge grinding on the driving substrate; At the edge display area, the remaining driving electrodes are bonded and electrically connected to the external electrodes, wherein the bonding method between at least part of the driving electrodes at the edge display area and the external electrodes is different from the bonding method between the driving electrodes at the central display area and the external electrodes.

6. The method for preparing a display panel according to claim 5, characterized in that: The step of bonding and electrically connecting the driving electrode to the external electrode at least in the central display area comprises: At least in the central display area, the driving electrode and the external electrode are electrically connected by bonding through a bonding metal layer.

7. The method for preparing a display panel according to claim 5, characterized in that: The step of bonding and electrically connecting the remaining driving electrodes to the external electrodes at the edge display area comprises: At the edge display area, the remaining driving electrodes are electrically connected to the external electrodes by bonding through a conductive adhesive layer.

8. The method for preparing a display panel according to claim 7, characterized in that: The step of electrically connecting the remaining driving electrodes to the external electrodes by bonding through a conductive adhesive layer comprises: The remaining driving electrodes are electrically connected to the external electrodes by bonding through an anisotropic conductive adhesive layer.

9. A spliced ​​display screen, characterized in that: include: At least two display panels, the display panels comprising display areas, the display areas comprising a central display area and an edge display area surrounding the central display area, at least one side of the edge display area being a spliced ​​edge display area; the spliced ​​edge display areas of the two adjacent spliced ​​display panels are opposite; The display panel includes a driving substrate and a plurality of light-emitting elements located on the driving substrate and located in the display area; the driving substrate includes a plurality of driving electrodes, and the light-emitting elements include external electrodes bonded and electrically connected to the corresponding driving electrodes; In the display panel, a bonding method between the driving electrode and the external electrode in the central display area is different from a bonding method between the driving electrode and the external electrode in the splicing edge display area.

10. The spliced ​​display screen according to claim 9, characterized in that: In the central display area, a bonding metal layer is included between the driving electrode and the external electrode, and the driving electrode and the external electrode are bonded and electrically connected through the bonding metal layer.

11. The spliced ​​display screen according to claim 9, characterized in that: At the splicing edge display area, a conductive adhesive layer is included between the driving electrode and the external electrode, and the driving electrode and the external electrode are bonded and electrically connected through the conductive adhesive layer.

12. The spliced ​​display screen according to claim 11, characterized in that: The conductive adhesive layer is a light-shielding conductive adhesive layer; At the joint boundary between two adjacent display panels, the light-shielding conductive adhesive layers of the two display panels extend to cover the joint boundary and are connected.

13. The spliced ​​display screen according to claim 11, characterized in that: The conductive adhesive layer is an anisotropic conductive adhesive layer.

14. A method for preparing a spliced ​​display screen, characterized in that: The preparation method comprises: At least two driving substrates and a plurality of light-emitting elements are provided, wherein the driving substrate comprises a display area, the display area comprises a central display area and an edge display area surrounding the central display area, at least one side of the edge display area is a spliced ​​edge display area; and the driving substrate comprises a plurality of driving electrodes, and the light-emitting element comprises an external electrode; At least in the central display area, the driving electrode is electrically bonded to the external electrode; Performing edge grinding on the driving substrate; At the splicing edge display area, the driving electrode is bonded and electrically connected to the external electrode to obtain a display panel, wherein the bonding method of the driving electrode and the external electrode at the central display area is different from the bonding method of the driving electrode and the external electrode at the splicing edge display area; At least two of the display panels are spliced ​​together to form a spliced ​​display screen, and the spliced ​​edge display areas of the two adjacent spliced ​​display panels are opposite to each other.

15. The method for preparing a spliced ​​display screen according to claim 14, characterized in that: The step of bonding and electrically connecting the driving electrode to the external electrode at least in the central display area comprises: At least in the central display area, the driving electrode and the external electrode are electrically connected by bonding through a bonding metal layer.

16. The method for preparing a spliced ​​display screen according to claim 14, characterized in that: The step of bonding and electrically connecting the driving electrode to the external electrode at the splicing edge display area includes: At the splicing edge display area, the driving electrode and the external electrode are electrically connected by bonding through a conductive adhesive layer.

17. The method for preparing a spliced ​​display screen according to claim 16, characterized in that: The step of electrically connecting the driving electrode and the external electrode by bonding through a conductive adhesive layer comprises: The driving electrode and the external electrode are bonded and electrically connected via a light-shielding conductive adhesive layer, wherein at a splicing boundary between two adjacent display panels, the light-shielding conductive adhesive layer of the two display panels also extends to cover the splicing boundary and is connected and contacted.

18. The method for preparing a spliced ​​display screen according to claim 16, characterized in that: The step of electrically connecting the driving electrode and the external electrode by bonding through a conductive adhesive layer comprises: The driving electrode and the external electrode are electrically connected by bonding through an anisotropic conductive adhesive layer.

19. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 4, or comprises the spliced ​​display screen according to any one of claims 9 to 13.

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