Automated analysis device and method for controlling

Abstract

The invention relates to automatic analysis equipment and a control method of the automatic analysis equipment, and relates to the technical field of in-vitro diagnostic analysis, the automatic analysis equipment comprises a heat preservation device, the heat preservation device comprises a heat preservation container body and a heat preservation cover body, and the heat preservation container body supports the heat preservation cover body; the reaction disc is arranged in the heat preservation device; the heating device comprises at least two circles of heating film belts, all the heating film belts are arranged on the outer side of the reaction disc in a sleeving mode and are arranged in the axial direction of the reaction disc, all the heating film belts are sequentially connected in series, and two wiring end points of the heating device are arranged on the same heating film belt and are adjacently arranged. By adopting the scheme of the embodiment, the heating accuracy of the reaction liquid in the reaction disc in the heat preservation device is realized.

Description

Technical Field

[0001] The present application relates to the field of in vitro diagnostic analysis technology, and in particular to an automatic analysis device, a control method for an automatic analysis device, a control device for an automatic analysis device, an electronic device, a computer-readable storage medium, and a computer program product. Background Art

[0002] In the field of in vitro diagnostics and other analytical technologies, the temperature of the reaction solution is generally required to be within a certain temperature range, and the reaction efficiency is high under this temperature range. Therefore, most in vitro diagnostic equipment, such as biochemical immunoassay analyzers, need to control the reaction of the tested reaction solution within a set temperature range.

[0003] Accordingly, in order to keep the reaction liquid within a set temperature range, the automatic analysis device usually needs to heat the reaction liquid. However, current automatic analysis devices have the problem of low heating accuracy. Summary of the invention

[0004] Based on this, it is necessary to provide an automatic analysis device, a control method for the automatic analysis device, a control device for the automatic analysis device, an electronic device, a computer-readable storage medium and a computer program product that can improve the heating accuracy in response to the above technical problems.

[0005] In a first aspect, the present application provides an automatic analysis device, wherein the automatic analysis device comprises:

[0006] A heat preservation device, the heat preservation device comprising a heat preservation container body and a heat preservation cover body, the heat preservation container body supporting the heat preservation cover body;

[0007] A reaction disk, arranged inside the heat preservation device;

[0008] The heating device comprises at least two circles of heating film strips, each of which is sleeved on the outside of the reaction disk and arranged along the axial direction of the reaction disk. Each of the heating film strips is connected in series in sequence, and two connection terminals of the heating device are arranged on the same heating film strip and are arranged adjacent to each other.

[0009] Based on the automatic analysis equipment of the embodiment of the present application as described above, the reaction disk is arranged inside the insulation device, and the insulation device includes an insulation container body and an insulation cover supported by the insulation container body, which is convenient for placing and removing the reaction liquid or reaction tube in the reaction disk, and a heating device is arranged inside the insulation container body, so that through the cooperation of the heating performance of the heating device and the insulation performance of the insulation device, the impact and interference of the environment of the temperature of the reaction liquid in the second temperature of the outside world can be isolated, and the heating accuracy of the reaction liquid in the reaction disk inside the insulation device is achieved. And the heating device includes at least two circles of heating film belts arranged along the axial direction of the reaction disk and arranged on the outside of the reaction disk, and each heating film belt is connected in series in sequence, and the two wiring terminals of the heating device are adjacently arranged on the same heating film belt, so that the wiring terminal for powering on does not generate heat when it is powered on, and the heat can also be supplemented by the heat generated by the adjacent heating film belt, so that the uniformity of the heating of the heating device can be guaranteed, thereby improving the uniformity and accuracy of the heating of the reaction disk. Moreover, the two wiring terminals of the heating device are arranged at adjacent positions of the same heating film belt, so that one end can be connected, and the installation is simple and convenient.

[0010] In some embodiments, a collector ring is disposed inside the fixed spindle of the reaction disk, and the connection end of the heating device and the connection end of the first temperature sensor are connected to the collector ring.

[0011] Based on this embodiment, by arranging a collector ring in the fixed spindle of the reaction disk and connecting the wiring end of the heating device and the connection end of the first temperature sensor to the collector ring, the reaction disk can be rotated forward and reversely by any number of turns without worrying about the wire winding stress problem, which can improve safety and ease of operation.

[0012] In some embodiments, the heating film strip is disposed in the middle of a multi-layer insulating film sheet, and one side of the multi-layer insulating film layer is adhered and fixed to the outer side of the reaction disk.

[0013] Based on this embodiment, by setting the heating film strip in the middle of the multi-layer insulating film, the heating film strip can be heated while being insulated, which can reduce the influence of other possible conductive components on the heating film strip, help improve control accuracy, and further improve the heating accuracy of the reaction disk.

[0014] In some embodiments, the inner frame of the thermal insulation container body is made of a heat-conductive metal material, and a thermal insulation layer is disposed on the outer side of the thermal insulation container body.

[0015] Based on this embodiment, the inner frame of the insulation container body is made of heat-conducting metal material, and an insulation layer is arranged on the outer side of the insulation container body, which can avoid the influence of changes in the external environment of the insulation container body on the first temperature of the insulation container body, and can help to further improve the heating accuracy of the reaction disk.

[0016] In some embodiments, the outer edge of the thermal insulation container body is the same as the outer edge of the thermal insulation cover.

[0017] Based on this embodiment, by making the outer edge of the insulation container body identical to the outer edge of the insulation cover body, the insulation container body and the insulation cover body can be installed and connected by aligning the edges, which can improve installation convenience and practicality.

[0018] In some embodiments, the automatic analysis device further comprises:

[0019] A first temperature sensor, disposed inside the heat preservation device, for detecting a first temperature inside the heat preservation device;

[0020] The controller is in communication with the first temperature sensor and is used to adjust the working state of the heating device based on the first temperature detected by the first temperature sensor and the target temperature value corresponding to the reaction liquid on the reaction disk.

[0021] Based on this embodiment, the first temperature of the reaction disk can be detected by the first temperature sensor, and the controller can adjust the working state of the heating device based on the first temperature detected by the first temperature sensor and the target temperature value corresponding to the reaction liquid, so that the reaction liquid can be brought into the range of the target temperature value by heating to achieve the target temperature value with high reaction efficiency of the reaction liquid.

[0022] In some embodiments, a first temperature sensor is connected to the reaction disk to detect the first temperature in the reaction disk near the bearing hole of the reaction disk.

[0023] Based on this embodiment, by setting the first temperature sensor to be connected to the reaction disk and close to the bearing hole in the reaction disk, since the reaction cup containing the reaction liquid is placed in the bearing hole of the reaction disk, the first temperature sensor can detect the first temperature at a position closer to the reaction liquid, and the detected first temperature is also closer to the temperature of the reaction liquid. On this basis, the working state of the heating device is adjusted in combination with the first temperature, which helps to further improve the accuracy of heating control.

[0024] In some embodiments, the automatic analysis device further comprises a second temperature sensor;

[0025] The second temperature sensor is arranged outside the heat preservation device and is used to detect a second temperature of the external environment;

[0026] The controller is also connected to the second temperature sensor for adjusting the working state of the heating film strip based on the first temperature, the target temperature value and the second temperature.

[0027] Based on this embodiment, while taking into account the influence of the external environment of the insulation device, a temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor can be obtained based on the second temperature. Taking into account the influence of the second temperature on the temperature of the reaction liquid, the accuracy of the obtained temperature compensation value can be further improved, which helps to further improve the accuracy of the heating control.

[0028] In a second aspect, the present application provides a control method for an automatic analysis device, wherein the automatic analysis device includes a heat preservation device, a reaction disk and a heating device, a first temperature sensor and a controller, the heat preservation device includes a heat preservation container body and a heat preservation cover, and the heat preservation container body supports the heat preservation cover; the reaction disk, the heating device, and the first temperature sensor are arranged inside the heat preservation device, and the controller is communicatively connected with the heating device and the first temperature sensor, and the method includes:

[0029] Acquire a first temperature detected by the first temperature sensor;

[0030] The working state of the heating device is adjusted based on the first temperature and a target temperature value corresponding to the reaction liquid on the reaction disk.

[0031] In a third aspect, the present application provides a control device for an automatic analysis device, wherein the automatic analysis device comprises a heat preservation device, a reaction disk and a heating device, a first temperature sensor and a controller, the heat preservation device comprises a heat preservation container body and a heat preservation cover, the heat preservation container body supports the heat preservation cover; the reaction disk, the heating device, and the first temperature sensor are arranged inside the heat preservation device, the controller is in communication with the heating device and the first temperature sensor, and the device comprises:

[0032] A temperature acquisition module, used to acquire a first temperature detected by the first temperature sensor;

[0033] The control module adjusts the working state of the heating device based on the first temperature and a target temperature value corresponding to the reaction liquid on the reaction disk.

[0034] In a fourth aspect, the present application further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, wherein the processor implements the steps of the method in any of the above embodiments when executing the computer program.

[0035] In a fifth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method in any of the above embodiments are implemented.

[0036] In a sixth aspect, the present application further provides a computer program product, wherein the computer program product comprises a computer program, and when the computer program is executed by a processor, the steps of the method in any of the above embodiments are implemented.

[0037] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0039] Figure 1 A partial structural schematic diagram of an automatic analysis device according to some embodiments of the present application;

[0040] Figure 2 It is a partial structural schematic diagram of the automatic analysis equipment of other embodiments;

[0041] Figure 3 A schematic diagram of the connection relationship between two heating film strips in one embodiment;

[0042] Figure 4 A schematic diagram of the connection relationship between two heating film strips in another embodiment;

[0043] Figure 5 is a schematic diagram of the installation positions of the collector ring and the reaction disk in one embodiment;

[0044] Figure 6 is a schematic diagram of an installation position of a first temperature sensor in one embodiment;

[0045] Figure 7 A schematic diagram of the relationship between the second temperature, the reaction liquid temperature and the first temperature in one embodiment;

[0046] Figure 8 is a schematic diagram of a process for determining a temperature compensation value in a specific example;

[0047] Fig. 9 is a schematic flow chart of a control method of an automatic analysis device in an embodiment;

[0048] Fig.10 FIG. 4 is a flow chart of a control method of an automatic analysis device in another embodiment.

[0049] Fig.11 FIG. 4 is a structural block diagram of a control device of an automatic analysis device in an embodiment. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0051] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0052] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0054] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0055] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0056] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0057] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0058] At present, in order to allow the reaction liquid to be within the set temperature range, the automatic analysis equipment needs to be able to heat the reaction liquid. In order to heat the reaction liquid, in a related method, a strip heater is wound around the outer circumference of the reaction disk, adjacent to the two end areas. However, in actual applications, if the reaction disk with the heating film is a heat conductor with good thermal conductivity, the uniformity of the heating film will not be the focus of affecting the uniformity of the disk body. Due to the particularity of the device, the upper and lower layers of the disk body carrying the reaction cup cannot be pasted with insulation cotton due to restrictions, which makes it easy to be affected by the external environment, resulting in heating uniformity, and then affecting the heating accuracy of the reaction liquid.

[0059] After research, it is found that the current heating process of the reaction disk is mainly affected by the external environment. Different external environments will cause the temperature fluctuation of the reaction liquid on the reaction disk. Therefore, if the reaction disk and the device for heating the reaction disk can be placed in an environment that is not affected by the external environment, the influence of the external environment on the heating accuracy can be greatly reduced, thereby improving the heating accuracy of the reaction liquid on the reaction disk.

[0060] Accordingly, some embodiments of the present application provide an automatic analysis device, wherein the automatic analysis device includes:

[0061] A heat preservation device, the heat preservation device comprising a heat preservation container body and a heat preservation cover body, the heat preservation container body supporting the heat preservation cover body;

[0062] A reaction disk, arranged inside the heat preservation device;

[0063] The heating device comprises at least two circles of heating film strips, each of which is sleeved on the outside of the reaction disk and arranged along the axial direction of the reaction disk. Each of the heating film strips is connected in series in sequence, and two connection terminals of the heating device are arranged on the same heating film strip and are arranged adjacent to each other.

[0064] Among them, heat preservation is a way to slow down the dissipation of heat, usually referring to that the heat does not dissipate or dissipates at a slow speed. The heat preservation container body is a device that can achieve the heat preservation effect, that is, the heat will not be dissipated through the heat preservation container body itself, or the heat dissipation is very slow, and usually can only be dissipated from the opening of the heat preservation container body. The heat preservation container body includes a bottom and a side wall arranged around the bottom of the heat preservation container body, wherein the bottom and the side wall are both heat preservation bodies, that is, the heat will not be dissipated through the bottom and the side wall, or the heat dissipation is very slow. The heat preservation cover body is a cover body structure that can be matched with the heat preservation container body, and the heat preservation cover body is also a heat preservation body, that is, the heat will not be dissipated through the heat preservation cover body, or the heat dissipation is very slow. When the heat preservation cover body and the heat preservation container body are tightly installed together, a sealing structure is realized, so that the heat preservation effect inside the heat preservation device can be achieved.

[0065] The heating device is a structure that can heat to emit heat. By heating through the heating device, the temperature inside the insulation device can be increased. By controlling the heating device, the temperature inside the insulation device can be maintained within a certain temperature range. Heat will not be dissipated to the external environment through the insulation device, or although it will be dissipated, the dissipation rate will be relatively slow. The temperature change of the external environment will not affect the inside of the insulation device, or the speed of the impact will be very slow, thereby isolating the interference of external temperature shocks, which helps to improve the temperature stability and accuracy of the reaction liquid in the reaction disk.

[0066] A partial structural diagram of an automatic analysis device in an example is shown in FIG. Figure 1 shown. Figure 1 As shown, the heat preservation device includes a heat preservation container body 101 and a heat preservation cover 102. A reaction disk 200 is arranged inside the heat preservation device. The reaction disk 200 has a plurality of bearing holes, and a reaction cup 201 can be placed in the bearing holes. The reaction cup 201 contains a reaction liquid for chemical reaction.

[0067] The specific implementation of the heating device is not limited. In some embodiments, the heating device may include a heating film strip. The heating film strip is a sheet-like strip that can be heated. The specific form of the heating film strip is not limited. In some embodiments, the heating film strip may include a sheet-like resistance wire. It is understood that in other embodiments, the heating film strip may also be other sheet-like heating structures.

[0068] The location of the heating film belt in the heat preservation device is not limited, and some implementation methods are described below with examples.

[0069] In some embodiments, the heating device includes at least two circles of heating film strips, each of which is sleeved on the outside of the reaction disk and arranged along the axial direction of the reaction disk. Each of the heating film strips is connected in series in sequence, and the two connection terminals of the heating device are arranged on the same heating film strip and are adjacent to each other.

[0070] Taking the heating device including two circles of heating film belt as an example, a partial structural diagram of an automatic analysis device in an example is shown as follows: Figure 2 shown. Figure 2 As shown, the heating device includes a first heating film belt 301 sleeved on the upper side of the outer side of the reaction disk and a second heating film belt 302 sleeved on the lower side of the outer side of the reaction disk, and the first heating film belt 301 and the second heating film belt 302 are arranged in series. Figure 3 As shown, the two connection terminals 3020 of the heating device 30 are arranged on the same heating film strip and are arranged adjacent to each other. Figure 2 The second heating film belt 302 disposed at the lower side is taken as an example for explanation.

[0071] The two wiring terminals 3020 of the heating device can be arranged on the same heating film strip and adjacent to each other. By arranging the two electrodes (i.e., wiring terminals) of the input and output of the heating device on the same side of the same heating film strip, when the heating film strip is pasted on the outside of the reaction disk, pasting can be started from one end of the heating film and finally closed and connected together, which is convenient for pasting the heating film.

[0072] Wherein, when the heating device comprises two layers of sheet-like resistance wires in series and sleeved outside the reaction disk, the connection terminals do not generate heat when energized, but the heat can be supplemented by the heat generated by the heating film strip of another layer.

[0073] refer to Figure 4 As shown, W1, W2, and W3 are the length ranges of the heating film strip after it is divided in the long side direction. Figure 4 It can be seen that W3 has two electrode parts 3020, which are non-heating sections, so its heat density is lower than that of other ranges. According to Joule's law, the heat generated by the heating resistor is proportional to the resistance value and the square of the current value, and the resistance value is proportional to the length of the power-on direction. At the W1 position, the heat density is higher because the length of the reflux in the up and down directions is increased. The temperature at the position with higher heat density rises, so the temperature at the W1 position is higher than that of W2 and W3. Since the heat generated by the heating film is transferred to the disk body to form a temperature gradient, the heat at the position of the heating module with high temperature will be conducted to the direction of low temperature. That is, the temperature drop in the non-heating area W3 is compensated by increasing the heat density of W1, so that the temperature distribution of the entire reaction disk body is uniform.

[0074] Based on the automatic analysis equipment of this embodiment, the reaction disk is arranged inside the insulation device, and the insulation device includes an insulation container body and an insulation cover supported by the insulation container body, which is convenient for placing and removing the reaction liquid or reaction tube in the reaction disk, and a heating device is arranged inside the insulation container body, so that through the cooperation of the heating performance of the heating device and the insulation performance of the insulation device, the impact and interference of the environment where the temperature of the reaction liquid is located by the second temperature of the outside world can be isolated, and the heating accuracy of the reaction liquid in the reaction disk inside the insulation device can be achieved. And the heating device includes at least two circles of heating film belts arranged along the axial direction of the reaction disk and arranged on the outside of the reaction disk, and each heating film belt is connected in series in sequence, and the two wiring terminals of the heating device are adjacently arranged on the same heating film belt, so that the wiring terminal for powering on does not generate heat when it is powered on, and the heat can also be supplemented by the heat generated by the adjacent heating film belt, so that the uniformity of heating of the heating device can be guaranteed, thereby improving the uniformity and accuracy of heating the reaction disk. Moreover, the two wiring terminals of the heating device are arranged at adjacent positions of the same heating film belt, so that one end can be connected, and the installation is simple and convenient.

[0075] In some embodiments, the heating device includes a heating film strip, and the heating film strip is arranged at the bottom of the heat-insulating container body and is in the shape of a hollow ring.

[0076] Based on this embodiment, by setting the heating film strip at the bottom of the insulation container body and in a hollow ring shape, the reaction disk can be heated by an air bath, so that there is no need for excessively high requirements on the uniformity of the heating film strip, and the heating film strip is fixed on the insulation container body. The air bath heating method can ensure the uniformity of the temperature of the reaction disk, thereby improving the heating accuracy of the reaction disk.

[0077] In some embodiments, the heating device includes a heating film strip, and the heating film strip is arranged inside the side wall of the heat-insulating container body.

[0078] Based on this embodiment, by arranging the heating film strip on the side wall of the heat preservation container body, the reaction disk can be heated by means of an air bath, so that there is no need for excessively high requirements on the uniformity of the heating film strip, and the heating film strip is fixed on the heat preservation container body. The air bath heating method can ensure the uniformity of the temperature of the reaction disk, thereby improving the heating accuracy of the reaction disk.

[0079] In some embodiments, a collector ring is disposed inside the fixed spindle of the reaction disk, and the connection end of the heating device and the connection end of the first temperature sensor are connected to the collector ring.

[0080] Slip rings, also known as conductive slip rings, slip rings, collector rings or collector rings, can ensure the continuous transmission of power and signals between the fixed position and the rotating position when the equipment rotates continuously, thereby improving the performance of the system and simplifying the system structure, avoiding problems caused by wire sprains.

[0081] In a specific example, combining Figure 5 As shown in the axial schematic diagram of the analytical reaction device shown in FIG, the collector ring 50 is arranged in the spindle of the disk assembly 501 of the reaction disk 200, and the collector ring is supported by the bearing 502 and the disk assembly 501 is supported. Figure 5 As shown, the forward and reverse rotation of the bearing 502 can realize the transmission of electrical signals through the collector ring, and there is no problem of force on the wire winding, which can improve safety and ease of operation.

[0082] Based on this embodiment, by arranging a collector ring in the fixed spindle of the reaction disk and connecting the wiring end of the heating device and the connection end of the first temperature sensor to the collector ring, the reaction disk can be rotated forward and reversely by any number of turns without worrying about the wire winding stress problem, which can improve safety and ease of operation.

[0083] There is no limit to the way of setting the heating film strip. In some embodiments, the heating film strip can be set in the middle of a multi-layer insulating film sheet, and one side of the multi-layer insulating film layer is adhered and fixed to the outer side of the reaction disk, the inner bottom of the insulation container body, or the side wall of the insulation container body.

[0084] Combination Figure 3 , Figure 4 As shown, by setting the heating film strip 30 in the middle of the insulating film 40, on the one hand, it is convenient to stick the heating film strip 30 on the outer side of the reaction disk, the inner bottom of the insulation container body or the side wall inside the insulation container body, and the pasting is convenient. When the current is transmitted on the current path of the two connection terminals 3020, due to the insulation effect of the insulating film 40, more accurate control of the heating performance of the heating film strip 30 can be achieved.

[0085] Based on this embodiment, by setting the heating film strip in the middle of the multi-layer insulating film, the heating film strip can be heated while being insulated, which can reduce the influence of other possible conductive components on the heating film strip, help improve control accuracy, and further improve the heating accuracy of the reaction disk.

[0086] In some embodiments, the inner frame of the thermal insulation container body is made of a heat-conductive metal material, and a thermal insulation layer is disposed on the outer side of the thermal insulation container body.

[0087] Based on this embodiment, the inner frame of the insulation container body is made of heat-conducting metal material, and an insulation layer is arranged on the outer side of the insulation container body, which can avoid the influence of changes in the external environment of the insulation container body on the first temperature of the insulation container body, and can help to further improve the heating accuracy of the reaction disk.

[0088] In some embodiments, the outer edge of the thermal insulation container body is the same as the outer edge of the thermal insulation cover.

[0089] Based on this embodiment, by making the outer edge of the insulation container body identical to the outer edge of the insulation cover body, the insulation container body and the insulation cover body can be installed and connected by aligning the edges, which can improve installation convenience and practicality.

[0090] In some embodiments, the automatic analysis device further comprises:

[0091] A first temperature sensor is disposed inside the heat preservation device and is used to detect a first temperature inside the heat preservation device;

[0092] The controller is in communication with the first temperature sensor and is used to adjust the working state of the heating device based on the first temperature detected by the first temperature sensor and the target temperature value corresponding to the reaction liquid on the reaction disk.

[0093] The first temperature sensor is a device that can realize temperature detection. The number of the first temperature sensor is not limited, and the first temperature sensor may include one or more than two.

[0094] Wherein, when there is only one first temperature sensor, the controller may use the temperature detected by the first temperature sensor as the first temperature obtained by detection. Wherein, when there are more than two first temperature sensors, the controller may use the average value of the temperatures detected by the multiple first temperature sensors as the first temperature obtained by detection. Wherein, the determined first temperature may be considered as the ambient temperature of the reaction liquid in the reaction cup of the reaction disk.

[0095] The first temperature sensor may be arranged at any position inside the heat preservation device, for example, between two bearing holes of the reaction disk, outside of the reaction disk, and other positions. In the case of multiple first temperature sensors, taking the first temperature sensor being arranged between two adjacent bearing holes as an example, multiple first temperature sensors may be arranged at different positions between two bearing holes. In some specific examples, multiple first temperature sensors may be evenly spaced on the reaction disk, so that temperature detection may be performed from multiple different positions, which can further improve the accuracy of the first temperature obtained. It is understandable that, in the case of arranging the first temperature sensor at other positions such as outside of the reaction disk, the multiple first temperature sensors may also be evenly spaced.

[0096] In some embodiments, the first temperature sensor 601 is connected to the reaction disk 200 to detect the first temperature in the reaction disk near the bearing hole of the reaction disk.

[0097] In some specific examples, refer to Figure 6 As shown, the first temperature sensor 601 can be set on the reaction disk 200, and the controller 602 is electrically connected to the first temperature sensor 601 and the heating film belt 30, so that the controller 602 can obtain the first temperature detected by the first temperature sensor 601, and adjust the working state of the heating film 30 in combination with the first temperature and the target temperature value of the reaction liquid.

[0098] Based on this embodiment, by setting the first temperature sensor to be connected to the reaction disk and close to the bearing hole in the reaction disk, since the reaction cup containing the reaction liquid is placed in the bearing hole of the reaction disk, the first temperature sensor can detect the first temperature at a position closer to the reaction liquid, and the detected first temperature is also closer to the temperature of the reaction liquid. On this basis, the working state of the heating device is adjusted in combination with the first temperature, which helps to further improve the accuracy of heating control.

[0099] The target temperature value is the temperature value that the reaction liquid in the reaction disk needs to reach in order to achieve the highest reaction efficiency. For different reaction liquids, the corresponding target temperature values ​​may be different.

[0100] Based on this embodiment, the first temperature of the reaction disk can be detected by the first temperature sensor, and the controller can adjust the working state of the heating device based on the first temperature detected by the first temperature sensor and the target temperature value corresponding to the reaction liquid, so that the reaction liquid can be brought into the range of the target temperature value by heating to achieve the target temperature value with high reaction efficiency of the reaction liquid.

[0101] Based on the first temperature and the target temperature value corresponding to the reaction liquid on the reaction disk, the working state of the heating device is adjusted in any manner. In some embodiments:

[0102] A controller, used to obtain a temperature compensation value corresponding to the reaction liquid;

[0103] The heating device is controlled to perform heating, and when the first temperature reaches the sum of the target temperature value and the temperature compensation value, it is determined that the temperature of the reaction liquid on the reaction disk reaches the target temperature value.

[0104] Due to the effect of heat conduction of the reaction liquid, the first temperature detected by the first temperature sensor will be different from the actual temperature of the reaction liquid, and the actual temperature of the reaction liquid may be slightly higher or lower than the first temperature. During the heating process, since it takes a certain transfer process for the heat generated by the heating device to be transferred to the reaction liquid, when the first temperature detected by the first temperature sensor reaches the target temperature value, the actual temperature of the reaction liquid has not actually reached the target temperature value, so temperature compensation is required.

[0105] After obtaining the temperature compensation value, temperature compensation can be performed based on the temperature compensation value, that is, the heating device can be controlled to continue heating so that the first temperature detected by the first temperature sensor reaches the sum of the target temperature value and the temperature compensation value. At this time, the temperature of the reaction liquid can reach the target temperature value corresponding to the reaction liquid.

[0106] Based on the method in this embodiment, the heating process of the heating device is controlled by the temperature compensation value corresponding to the reaction liquid, taking into account the temperature difference between the first temperature detected by the first temperature sensor and the actual temperature of the reaction liquid, and achieving temperature compensation for the temperature difference, thereby improving the accuracy of heating control.

[0107] There is no limitation on the method of obtaining the temperature compensation value corresponding to the reaction liquid, and the temperature compensation value can be obtained by testing.

[0108] For example, the heating device is controlled to heat, and the temperature of the reaction liquid is detected by a temperature sensor set in the reaction liquid (in the actual process of using automatic analysis equipment for analysis, the temperature sensor may not be required), and when the temperature obtained by the first temperature sensor reaches the target temperature value, the reaction liquid temperature is obtained, and the temperature difference between the target temperature value and the reaction liquid temperature is determined, so that a temperature compensation value corresponding to the reaction liquid can be determined based on the temperature difference, for example, the temperature difference is used as the temperature compensation value.

[0109] In which, the heating process can be performed multiple times on the heating device to obtain multiple temperature difference values ​​and corresponding temperature compensation values. For example, the average value of the multiple temperature difference values ​​is used as the temperature compensation value corresponding to the reaction liquid, or after removing the maximum and minimum values ​​of the multiple temperature difference values, the average value of the remaining temperature difference values ​​is used as the temperature compensation value corresponding to the reaction liquid, and so on, but not limited to this.

[0110] The temperature compensation value obtained by the test can be stored and can be directly queried and used during the analysis of the automatic analysis device. It should be understood that when different types of reaction liquids have different target temperature values, different types of reaction liquids can be tested separately to obtain different temperature compensation values ​​for different types of reaction liquids.

[0111] In some embodiments, the automatic analysis device further comprises a second temperature sensor;

[0112] The second temperature sensor is arranged outside the heat preservation device and is used to detect a second temperature of the external environment;

[0113] The controller is also connected to the second temperature sensor for adjusting the working state of the heating film strip based on the first temperature, the target temperature value and the second temperature.

[0114] The location of the second temperature sensor is not limited, as long as it can be set outside the insulation device and can detect the second external temperature, for example, it can be set outside the insulation cover of the insulation device or outside the insulation container body, but is not limited to this.

[0115] Under ideal circumstances, the thermal insulation device can achieve the effect of thermal insulation, that is, no heat transfer will occur inside or outside the thermal insulation device. However, in actual application, heat transfer is inevitable, but the rate of heat transfer is greatly reduced compared to the case where the thermal insulation device is not used. Therefore, the working state of the heating film belt can be comprehensively adjusted in combination with the first temperature inside the thermal insulation device, the second temperature outside and the target temperature value of the reaction liquid, which helps to maintain the temperature of the reaction liquid at the target temperature value.

[0116] Wherein, in the case where a second temperature sensor is provided, at this time, when the controller obtains the temperature compensation value, it may be to obtain the temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor. In a specific example, the controller determines the temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor based on the preset correspondence between the reaction liquid type, the second temperature and the temperature compensation value.

[0117] The specific form of the correspondence between the preset reaction liquid type, the second temperature and the temperature compensation value is not limited. In a specific example, taking a specific reaction liquid type as an example, the correspondence can be expressed as:

[0118] .

[0119] in, is the second temperature, The second temperature The corresponding temperature compensation value, k, c are constant coefficients. For different types of reaction liquids, the constant coefficients k, c in the corresponding relationship may be different.

[0120] Therefore, while taking into account the influence of the external environment of the insulation device, a temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor can be determined based on the second temperature. Taking into account the influence of the second temperature on the temperature of the reaction liquid, the accuracy of the obtained temperature compensation value can be further improved, which helps to further improve the accuracy of heating control.

[0121] The preset corresponding relationship may be obtained by testing. In a specific example, the method of obtaining the preset corresponding relationship may include:

[0122] The automatic analysis equipment is respectively placed at different second temperatures, the heating device is controlled to heat, and the temperature of the reaction liquid is detected by a temperature sensor arranged in the reaction liquid, and when the temperature detected by the first temperature sensor reaches the target temperature value, the temperature of the reaction liquid is obtained, and the temperature difference between the target temperature value and the temperature of the reaction liquid is determined to obtain multiple groups of test data, wherein one group of test data includes the second temperature and the corresponding temperature difference;

[0123] Data fitting is performed on multiple groups of the test data to obtain the corresponding relationship.

[0124] The corresponding relationship is expressed as For example, by performing data fitting on multiple groups of test data, the specific values ​​of parameters k and c can be determined. The manner of performing data fitting on multiple groups of test data is not limited, as long as the corresponding relationship between the second temperature and the temperature difference can be obtained. The type of the corresponding relationship is not limited, for example, it can be a corresponding table, a relationship curve or a formula, etc., but is not limited thereto.

[0125] Among them, when analyzing through automatic analysis equipment, the ambient temperature (i.e. the above-mentioned second temperature) may need to be within a certain range, and when the second temperature is within the preset temperature range, the corresponding temperature compensation value is determined in combination with the corresponding relationship. If the second temperature is outside the preset temperature range, it means that the ambient temperature of the automatic analysis equipment is too high or too low, then other methods can be used for processing, such as no compensation, an alarm prompt for too high or too low temperature, or a fixed temperature compensation value, etc.

[0126] Accordingly, combined with Figure 8 As shown, taking the case where no compensation is performed when the temperature is too high or too low as an example, after obtaining the second temperature detected by the second temperature sensor, the second temperature can be compared with the preset temperature range:

[0127] If the second temperature is within the preset temperature range [T1, T2], the preset corresponding relationship between the second temperature and the temperature compensation value is adopted, as described above. , determine the temperature compensation value , and combined with the temperature compensation value to control the working state of the heating device. Specifically, the difference △T between the reaction liquid temperature and the target temperature value of the reaction liquid can be calculated, and the difference △T and the temperature compensation value can be combined to control the working state of the heating device. Determine the total temperature difference , and combined with the total temperature difference The heating device is controlled, for example, PID control is performed on the heating device.

[0128] If the second temperature is outside the preset temperature range [T1, T2], no temperature compensation is performed and the temperature compensation value is is 0, and the working state of the heating device is continuously controlled in combination with the temperature compensation value and the difference ΔT between the first temperature and the target temperature value of the reaction liquid.

[0129] The specific range of the preset temperature range is not limited. For example, in some embodiments, the preset temperature range can be set to be greater than or equal to 10°C (Celsius) and less than or equal to 40°C, that is, T1=10°C, T2=40°C, but it is not limited thereto.

[0130] Since the second temperature may affect the temperature of the reaction solution, and the second temperature is usually in a state where it may change, therefore, in some embodiments:

[0131] The controller is further used to continuously monitor the second temperature detected by the second temperature sensor during the reaction of the reaction liquid in the reaction disk;

[0132] Acquire a temperature compensation value corresponding to the reaction liquid and the second temperature;

[0133] The working state of the heating device is controlled based on the temperature compensation value so that the first temperature detected by the first temperature sensor reaches the sum of the target temperature value and the temperature compensation value.

[0134] In some examples, as the second temperature changes (from 35°C to 15°C in the figure), a schematic diagram of the corresponding relationship between the first temperature detected by the first temperature sensor and the temperature of the reaction liquid is shown as follows: Figure 7 As shown, 700 is the curve of the reaction liquid temperature, 701 and 702 are respectively the change curves of the reaction liquid temperature when the first temperature sensor is arranged near the reaction cup hole and close to or away from the heating film. It can be seen that in some cases, the first temperature detected by the first temperature sensor will be higher than the reaction liquid temperature, and in some cases, the first temperature detected by the first temperature sensor will be lower than the reaction liquid temperature.

[0135] Based on this, after the first temperature reaches the sum of the target temperature value and the temperature compensation value, that is, after the temperature of the reaction liquid has been heated to the target temperature value, the change of the second temperature can be continuously monitored, and the corresponding temperature compensation value can be continuously updated based on the second temperature to adjust the heating control, so that the temperature of the reaction liquid can be maintained at the target temperature value, further improving the accuracy of the heating control.

[0136] Taking the incubation tray as an example of the automatic analysis equipment, the temperature control of the incubation tray needs to make the deviation of the reaction liquid temperature within a certain deviation range of the target temperature value, such as 37°C ± 0.5°C. The temperature accuracy of the reaction tray, in the embodiment of the present application, can include three levels: the first level is that the temperature of the reaction liquid can be increased; the second level is that the temperature of the reaction liquid can be brought to within the deviation range of the target temperature value, such as 37 ± 0.5°C; the third level is that under different second temperatures, such as 15-40°C, the temperature of the reaction liquid can be balanced within a specific temperature range (such as the above-mentioned 37 ± 0.5°C).

[0137] For the reaction liquid, the heat flowing in per unit time minus the heat flowing out equals the change in the total energy of the reaction liquid, satisfying the following formula:

[0138]

[0139] In the formula, is the inflow heat, unit is W; The outflow heat, unit is W; C is the liquid heat capacity of the reaction liquid, unit is J / (kg℃); m is the mass of the reaction liquid, unit is kg; It is the temperature rise per unit time, in ℃ / s.

[0140] After the heating device is powered on, part of the heat generated by the Joule effect flows into the reaction liquid through heat conduction to form . The reaction liquid is transferred to the outside of the reaction liquid by convection or conduction. During the initial heating stage, a large amount of power is input to the heating device to make > , >0, the temperature of the reaction liquid is increased, which satisfies the first meaning of the temperature accuracy of the reaction disk: the temperature of the reaction liquid can be increased.

[0141] When the first temperature detected by the first temperature sensor reaches the target temperature value, the working state of the heating device is controlled through a feedback loop in combination with the temperature compensation value to adjust the input power of the heating device. = , that is, the heat loss of the reaction liquid Equal to the heat input from the heating diaphragm to the reaction liquid , satisfying the second meaning of the above-mentioned reaction disk temperature accuracy: the temperature of the reaction liquid can be stabilized within the specified range.

[0142] Temperature accuracy depends on the thermal resistance between the reaction liquid, the heating device, the temperature sensor and the external environment. When the reaction plate is installed, it can be considered that the resistance between the objects has been fixed. Therefore, the only factor affecting temperature accuracy is the influence of the second temperature, that is, when the reaction liquid temperature is debugged at a certain normal temperature environment at the target temperature (such as 37°C above), if the equipment is in normal use and the second temperature deviates from the temperature during debugging, the temperature after equilibrium will also be somewhat different, so it also involves the influence of the second temperature change on temperature accuracy.

[0143] The same reaction disk system will have different temperatures after equilibrium under different second temperature conditions. When the second temperature rises, the temperature of the reaction liquid rises, because the reaction liquid loses less heat to the outside world when the second temperature rises. When the sensor temperature remains unchanged, the overall temperature of the reaction liquid rises; similarly, when the second temperature drops, the temperature of the reaction liquid will be low.

[0144] When the first temperature sensor is arranged at a position such that the temperature detected by the first temperature sensor is lower than the temperature of the reaction liquid, the temperature compensation value increases, and vice versa.

[0145] Based on the automatic analysis device as described above, an embodiment of the present application further provides a control method for the automatic analysis device, and the control method can be executed by a controller in the automatic analysis device as described above.

[0146] refer to Fig. 9 As shown, the control method in some embodiments includes:

[0147] Step S901: acquiring a first temperature detected by the first temperature sensor;

[0148] Step S902: adjusting the working state of the heating device based on the first temperature and a target temperature value corresponding to the reaction liquid on the reaction disk.

[0149] In some embodiments, reference Fig.10 As shown, the step S902 of adjusting the working state of the heating device based on the first temperature and the target temperature value corresponding to the reaction liquid on the reaction disk includes:

[0150] Step S1001: obtaining a temperature compensation value corresponding to the reaction liquid;

[0151] Step S1002: controlling the heating device to perform heating, and when the first temperature reaches the sum of the target temperature value and the temperature compensation value, determining that the temperature of the reaction liquid on the reaction disk reaches the target temperature value.

[0152] In some embodiments, the step S1001 of obtaining the temperature compensation value corresponding to the reaction solution includes:

[0153] A temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor is acquired.

[0154] In some embodiments, the obtaining of a temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor includes:

[0155] The temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor is obtained by querying from the preset correspondence between the reaction liquid type, the second temperature and the temperature compensation value.

[0156] In some embodiments, the method further comprises:

[0157] The automatic analysis equipment is respectively placed at different second temperatures, the heating device is controlled to heat, and the temperature of the reaction liquid is detected by a temperature sensor arranged in the reaction liquid, and when the temperature detected by the first temperature sensor reaches the target temperature value, the temperature of the reaction liquid is obtained, and the temperature difference between the target temperature value and the temperature of the reaction liquid is determined to obtain multiple groups of test data, wherein one group of test data includes the second temperature and the corresponding temperature difference;

[0158] Data fitting is performed on multiple groups of the test data to obtain the corresponding relationship.

[0159] In some embodiments, after the first temperature reaches the sum of the target temperature value and the temperature compensation value, the method further includes:

[0160] During the reaction of the reaction liquid in the reaction disk, continuously monitoring the second temperature detected by the second temperature sensor;

[0161] Acquire a temperature compensation value corresponding to the reaction liquid and the second temperature;

[0162] The working state of the heating device is controlled based on the temperature compensation value so that the first temperature detected by the first temperature sensor reaches the sum of the target temperature value and the temperature compensation value.

[0163] Regarding the specific implementation of the control method of the automatic analysis device, reference may be made to the description of the automatic analysis device described above, which will not be elaborated here.

[0164] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0165] Based on the same inventive concept, the embodiment of the present application also provides a control device for an automatic analysis device for implementing the control method of the automatic analysis device involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the control device for one or more automatic analysis devices provided below can refer to the limitations of the control method for the automatic analysis device above, and will not be repeated here.

[0166] In one embodiment, Fig.11 As shown, a control device for an automatic analysis device is provided, comprising: a first temperature acquisition module 1101 and a control module 1102, wherein:

[0167] A temperature acquisition module 1101 is used to acquire a first temperature detected by the first temperature sensor;

[0168] The control module 1102 adjusts the working state of the heating device based on the first temperature and a target temperature value corresponding to the reaction liquid on the reaction disk.

[0169] In some embodiments, the control module 1102 is used to obtain a temperature compensation value corresponding to the reaction liquid; control the heating device to perform heating, and when the first temperature reaches the sum of the target temperature value and the temperature compensation value, determine that the temperature of the reaction liquid on the reaction disk reaches the target temperature value.

[0170] In some embodiments, the temperature acquisition module 1101 is further used to acquire a second temperature detected by a second temperature sensor;

[0171] The control module 1102 is used to obtain a temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor.

[0172] In some embodiments, the control module 1102 is further used to query and obtain the temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor from the correspondence between the preset reaction liquid type, the second temperature and the temperature compensation value.

[0173] In some embodiments, the control module 1102 is also used to obtain the automatic analysis equipment at different second temperatures, control the heating device to heat, and detect the reaction liquid temperature by a temperature sensor set in the reaction liquid, and when the reaction liquid temperature reaches the target temperature value, the first temperature sensor detects the obtained test first temperature, and determines the temperature difference between the test first temperature and the target temperature value to obtain multiple groups of test data, wherein a group of test data includes a second temperature and a corresponding temperature difference; perform data fitting on the multiple groups of test data to obtain the corresponding relationship.

[0174] In some embodiments, the control module 1102 is also used to obtain a second temperature detected by the second temperature sensor that is continuously monitored during the reaction of the reaction liquid in the reaction disk; obtain a temperature compensation value corresponding to the reaction liquid and the second temperature; and control the working state of the heating device based on the temperature compensation value so that the first temperature detected by the first temperature sensor reaches the sum of the target temperature value and the temperature compensation value.

[0175] Each module in the control device of the above-mentioned automatic analysis equipment can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in an electronic device in the form of hardware, or can be stored in a memory in an electronic device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0176] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, wherein the processor implements the steps of the method in any of the above embodiments when executing the computer program.

[0177] The present application also provides a computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method in any of the above embodiments are implemented.

[0178] The present application also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the steps of the method in any of the above embodiments are implemented.

[0179] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0180] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0181] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the present application. It should be noted that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. An automatic analysis device, characterized in that: The automatic analysis device comprises: A heat preservation device, the heat preservation device comprising a heat preservation container body and a heat preservation cover body, the heat preservation container body supporting the heat preservation cover body; A reaction disk, arranged inside the heat preservation device; The heating device comprises at least two circles of heating film strips, each of which is sleeved on the outside of the reaction disk and arranged along the axial direction of the reaction disk. Each of the heating film strips is connected in series in sequence, and two connection terminals of the heating device are arranged on the same heating film strip and are arranged adjacent to each other.

2. The automatic analysis device according to claim 1, characterized in that: A collector ring is arranged inside the fixed spindle of the reaction disk, and the connection end point of the heating device and the connection end point of the first temperature sensor are connected to the collector ring.

3. The automatic analysis device according to claim 1, characterized in that: The heating film belt is arranged in the middle of the multi-layer insulating film sheet, and one side of the multi-layer insulating film sheet is adhered and fixed to the outer side of the reaction disk.

4. The automatic analysis device according to any one of claims 1 to 3, characterized in that: The automatic analysis device also includes: A first temperature sensor, disposed inside the heat preservation device, for detecting a first temperature inside the heat preservation device; The controller is in communication with the first temperature sensor and is used to adjust the working state of the heating device based on the first temperature detected by the first temperature sensor and the target temperature value corresponding to the reaction liquid on the reaction disk.

5. The automatic analysis device according to claim 4, characterized in that: The automatic analysis device also includes a second temperature sensor; The second temperature sensor is arranged outside the heat preservation device and is used to detect a second temperature of the external environment; The controller is also in communication connection with the second temperature sensor, and is used for adjusting the working state of the heating device based on the first temperature, the target temperature value and the second temperature.

6. A control method for an automatic analysis device, characterized in that: The automatic analysis device comprises a heat preservation device, a reaction disk and a heating device, a first temperature sensor and a controller, the heat preservation device comprises a heat preservation container body and a heat preservation cover body, the heat preservation container body supports the heat preservation cover body; the reaction disk, the heating device and the first temperature sensor are arranged inside the heat preservation device, the controller is in communication connection with the heating device and the first temperature sensor, and the method comprises: Acquire a first temperature detected by the first temperature sensor; The working state of the heating device is adjusted based on the first temperature and a target temperature value corresponding to the reaction liquid on the reaction disk.

7. The method according to claim 6, characterized in that The adjusting the working state of the heating device based on the first temperature and a target temperature value corresponding to the reaction liquid on the reaction disk includes: Obtaining a temperature compensation value corresponding to the reaction liquid; The heating device is controlled to perform heating, and when the first temperature reaches the sum of the target temperature value and the temperature compensation value, it is determined that the temperature of the reaction liquid on the reaction disk reaches the target temperature value.

8. The method according to claim 7, characterized in that The automatic analysis device further comprises a second temperature sensor disposed outside the heat preservation device, and the controller is further in communication connection with the second temperature sensor; The obtaining of the temperature compensation value corresponding to the reaction liquid comprises: Based on the preset correspondence between the reaction liquid type, the second temperature and the temperature compensation value, a temperature compensation value corresponding to the reaction liquid and the second temperature detected by the second temperature sensor is determined.

9. The method according to claim 8, characterized in that The method further comprises: The automatic analysis equipment is placed at different second temperatures, the heating device is controlled to heat, and the temperature of the reaction liquid is detected by a temperature sensor disposed in the reaction liquid. When the temperature detected by the first temperature sensor reaches the target temperature value, the temperature of the reaction liquid is obtained, and the temperature difference between the target temperature value and the temperature of the reaction liquid is determined to obtain multiple groups of test data, wherein one group of test data includes the second temperature and the corresponding temperature difference; Data fitting is performed on multiple groups of the test data to obtain the corresponding relationship.

10. The method according to any one of claims 7 to 9, characterized in that: After the first temperature reaches the sum of the target temperature value and the temperature compensation value, the method further includes: During the reaction of the reaction liquid in the reaction disk, continuously monitoring a second temperature detected by a second temperature sensor; Acquire a temperature compensation value corresponding to the reaction liquid and the second temperature; The working state of the heating device is controlled based on the temperature compensation value so that the first temperature detected by the first temperature sensor reaches the sum of the target temperature value and the temperature compensation value.

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