Laser beam processing apparatus and object cutting method using the same

Abstract

The present invention relates to a laser processing apparatus which forms a ring beam having uniform energy distribution and outputs a laser beam having a long focal depth and a small focal size. Here, the laser processing apparatus includes: a housing portion having an accommodation space formed therein, an incident hole at one end, and an output hole at the other end; the aperture part is arranged in the shell part, is positioned below the incidence hole and is used for adjusting the size of an incidence light beam passing through the incidence hole; a multi-focus diffraction lens part which is installed inside the housing part, is located below the aperture part, and is used for deflecting an incident light beam according to a plurality of orders along an optical axis, and diffracting the deflected light beam to form a ring beam; and a multi-layer focusing lens part which is installed inside the housing part, is located below the multi-focus diffraction lens part, and is used for focusing the light beam passing through the multi-focus diffraction lens part. In addition, the invention also relates to an object processing method of the laser processing device for cutting the deep part of the object through the processed and output light beam by using the laser processing device. The method for processing the object by using the laser processing device comprises the following steps of: (A) preparing a shell part which is internally provided with an accommodating space and is provided with an incidence hole at one end and an output hole at the other end, an aperture part which is arranged in the shell part, is positioned below the incidence hole and is used for adjusting the size of an incident beam, and a processing part which is arranged in the shell part and is used for processing the object; the multi-focus diffraction lens part is positioned below the aperture part and is used for deflecting an incident light beam according to a plurality of orders along an optical axis and diffracting the deflected light beam to form a ring beam; a multi-layer focusing lens unit positioned below the multi-focus diffraction lens unit and used for focusing the light beam passing through the multi-focus diffraction lens unit; (B) mounting a laser processing device below a laser beam output device for outputting the laser beam; and (C) placing an object below the laser processing device.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing devices capable of accurately cutting thick glass. Background Art

[0002] Glass cutting has received extensive attention in the flat panel display and smart electronics industry markets. The glass cutting process requires high process efficiency, low residual heat, and smooth cut surfaces. In addition, the glass cutting process should also be efficient in terms of energy and materials.

[0003] like Figure 1 The Axicon lens-based Bessel beam optics shown are widely used in glass cutting processes. The Axicon lens-based Bessel beam optics achieves processing by generating nonlinear optical absorption proportional to the incident beam intensity in a medium with almost no linear absorption. Therefore, it has the advantage of efficiently transferring energy to a narrow area.

[0004] However, the depth of focus (DOF: Depth of Focus) of the Bessel beam optical device based on the axicon lens is short. Therefore, in order to increase the depth of focus, it is necessary to install an axicon lens with a larger refraction angle, which leads to an increase in the overall size of the module.

[0005] In addition, the Bessel beam optics based on the axicon lens cannot precisely adjust the beam intensity, resulting in the inability to cleanly cut thick objects and the generation of micro-cracks on the surface of the object.

[0006] In other words, this device will reduce the quality of object processing.

[0007] [Prior Art Document] Korean Patent Registration No.: 10-2251985 (Announcement Date: May 17, 2021) Summary of the invention

[0008] 1. Technical issues to be resolved

[0009] Therefore, the present invention aims to solve the problem of the existing Bessel beam processing device based on the axicon lens, that is, the cutting thickness cannot be accurately adjusted and micro cracks are generated on the top of the object, thereby reducing the processing quality.

[0010] The problems to be solved by the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will become clear to those skilled in the art through the following description.

[0011] (II) Technical solution

[0012] In order to achieve the above-mentioned problems to be solved, the laser processing device of the present invention includes: a shell portion with a accommodating space formed inside, with an incident hole at one end and an output hole at the other end; an aperture portion installed inside the shell portion, located below the incident hole, and used to adjust the size of the incident light beam passing through the incident hole; a multifocal diffraction lens portion installed inside the shell portion, located below the aperture portion, and used to deflect the incident light beam along the optical axis according to multiple orders, and at the same time diffract the deflected light beam to form a ring beam (Ring Beam); and a multi-layer focusing lens portion installed inside the shell portion, located below the multifocal diffraction lens portion, and used to focus the light beam passing through the multifocal diffraction lens portion.

[0013] The laser processing device of the present invention may also include a first protective window installed in the housing space of the shell and located below the incident hole, and a second protective window installed inside the shell and located between the multi-layer focusing lens part and the output hole.

[0014] In order to achieve another problem to be solved, the method of processing an object using a laser processing device of the present invention includes the following steps: (A) preparing a laser processing device including a shell portion having a accommodating space formed therein, an incident hole at one end and an output hole at the other end, an aperture portion installed inside the shell portion and located below the incident hole for adjusting the size of an incident light beam, a multifocal diffraction lens portion installed inside the shell portion and located below the aperture portion for deflecting the incident light beam along the optical axis in multiple orders and diffracting the deflected light beam to form a ring beam, and a multilayer focusing lens portion installed inside the shell portion and located below the multifocal diffraction lens portion for focusing the light beam passing through the multifocal diffraction lens portion; (B) installing the laser processing device below a laser beam output device that outputs the laser beam; and (C) placing the object below the laser processing device.

[0015] (III) Beneficial effects

[0016] The laser processing device of the present invention can form an annular light beam with uniform energy distribution, and output a laser light beam with a long focal depth and a small focal size.

[0017] By using this high-power beam, the laser processing device of the present invention can cut deep into the object. In addition, by reducing the intensity of the n-order diffracted beam other than the zero-order, the laser can be output accurately at the target position without damaging the surrounding of the processing area, and the object can be processed.

[0018] In particular, the laser processing device of the present invention can be miniaturized because it has fewer components for processing the incident light beam and a short light beam output distance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1is a perspective view of an existing Bessel beam optical device based on an axicon lens.

[0020] Figure 2 It is a perspective view of the laser processing device of the present invention.

[0021] Figure 3 It is a cross-sectional view of the laser processing device of the present invention taken along line II-II'.

[0022] Figure 4 It is a comparison Figure 1 The existing Bessel beam optical device based on axicon lens is Figure 3 A diagram of a durable structure of the laser processing device of the present invention.

[0023] Figure 5 Yes Display Figure 1 A diagram showing a state in which an incident light beam is processed and output in a conventional Bessel beam optical device based on an axicon lens.

[0024] Figure 6 Yes Display Figure 5 A diagram of the state of the beam output to an object in a conventional axicon-based Bessel beam optical device.

[0025] Figure 7 Yes Display Figure 2 A diagram showing a state in which an incident light beam is processed in the laser processing device of the present invention.

[0026] Figure 8 Yes Display Figure 2 Diagram of a laser beam formed by a multifocal diffractive lens section.

[0027] Fig. 9 Yes Display Figure 2 A diagram of a ring beam (Ring Beam) after passing through the diffraction lens portion of the laser processing device of the present invention and a spot beam (Spot Beam) after passing through the multi-layer focusing lens.

[0028] Fig.10 Yes Display Fig. 9 A diagram showing the state of a beam output to an object in a laser processing device.

[0029] Fig.11 is a more detailed display Fig.10 A diagram showing the state of a beam output to an object in a laser processing device.

[0030] Fig.12 It is a flowchart of a method of processing an object using the laser processing device of the present invention. Best Mode for Carrying Out the Invention

[0031] The advantages, features and implementation of the present invention will become more apparent by referring to the following detailed description and the accompanying drawings. However, the definition of the present invention is not limited to the embodiments described herein. The present invention can be modified in various forms.

[0032] The detailed description and multiple illustrations shown in this specification are intended to make the disclosure of the present invention complete and fully convey the scope of the invention to those skilled in the art. Only the claims of the present invention can define the scope of the invention.

[0033] In order to make the description of the present invention more concise and clear, the following reference will be made to Figure 2 and Figure 3 A general description of the laser processing apparatus is given.

[0034] Figure 2 is a perspective view of the laser processing device of the present invention, Figure 3 is along Figure 2 A cross-sectional view of the laser processing device of the present invention showing the II-II' line cutting. The laser processing device 1 is capable of forming a ring beam with uniform energy distribution, and outputting a laser beam with a long depth of focus (DOF: Depth of Focus) and a small focal size. This laser beam can be transmitted to the deep part of an object, so that the laser processing device 1 can smoothly cut to the deep part of the object. In addition, the laser processing device 1 can output laser at a precise position and cut the object without damaging the surrounding of the processing area by reducing the intensity of the n-order diffraction beam other than the zero-order. In particular, the laser processing device 1 and Figure 1 Compared with the existing Bessel beam optical device based on an axicon lens shown in FIG, the components used to process the incident beam are fewer and the beam output distance is shorter. Therefore, the laser processing device 1 can be formed in a smaller size than the existing Bessel beam optical device based on an axicon lens.

[0035] The laser processing device 1 having such features includes a housing 10, an aperture 20, a multifocal diffraction lens 30, and a multilayer focusing lens 40. In addition, the laser processing device 1 may include a first protection window 50 and a second protection window 60 installed at both ends of the housing 10.

[0036] Each component constituting the laser processing apparatus 1 will be described in detail below.

[0037] The housing 10 is the housing of the laser processing device 1. Figure 2 and Figure 3 As shown, the shell 10 may be partially formed into a rectangular parallelepiped, and a cylindrical structure is connected to the bottom of the rectangular parallelepiped. Figure 3 As shown, a structure having a height of 'B2'.

[0038] The rectangular parallelepiped and cylindrical parts of the outer shell 10 are both hollow structures. An incident hole 101 is punched at the end of the rectangular parallelepiped, and an output hole 102 is punched at the other end of the cylinder. In addition, the aperture part 20, the multi-focal diffraction lens part 30, the multi-layer focusing lens part 40, and the first protection window part 50 and the second protection window part 60 are installed inside the rectangular parallelepiped and the cylinder.

[0039] First, the first protection window 50 is installed below the incident hole 101 and above the aperture 20. Such a first protection window 50 prevents foreign matter from entering the interior of the housing 10, thereby keeping the interior of the housing 10 clean. In addition, the first protection window 50 can protect the aperture 20, the multifocal diffraction lens 30, and the multilayer focusing lens 40 from being affected by noise beams.

[0040] The aperture part 20 is a device that limits the amount of light entering the optical system. The aperture part 20 is installed in the housing part 10, and includes a frame module with holes and an aperture module installed on the frame module for opening and closing the holes. The aperture part 20 adjusts the size of the incident light beam passing through the incident hole 101 by opening and closing the aperture module.

[0041] The multi-focal diffraction lens unit 30 deflects the incident light beam along the optical axis in multiple orders, and diffracts the deflected light beam to form a ring beam. At this time, the multi-focal diffraction lens unit 30 generates diffraction of the laser beam according to the pattern on its surface. In other words, the multi-focal diffraction lens unit 30 can form a laser beam according to the formed pattern.

[0042] The multifocal diffraction lens unit 30 reduces the intensity of the n-order diffraction beams other than the zero-order to form a ring beam. Such a multifocal diffraction lens unit 30 is installed below the aperture unit 20 in the housing 10. The multilayer focusing lens unit 40 is installed below the multifocal diffraction lens unit 30 in the housing 10 to focus the beam passing through the multifocal diffraction lens unit 30.

[0043] The second protection window portion 60 is installed below the multi-layer focusing lens portion 40 and above the output hole 102. Such a second protection window portion 60 prevents foreign matter from entering the interior of the housing portion 10.

[0044] The first protection window 50 and the second protection window 60 of the present invention prevent dust from entering the interior of the housing 10, thereby ensuring that the interior of the housing 10 remains clean and avoiding the diffraction of the laser beam caused by impurities.

[0045] The following references Figures 4 to 11 , a detailed comparison is made between the existing Bessel beam optical device based on an axicon lens and the laser processing device of the present invention to describe in detail the structure and characteristics of the laser processing device of the present invention.

[0046] Figure 4 yes Figure 1 There are existing Bessel beam optical devices based on axicon lenses and Figure 3 The comparison diagram of the durable structure of the laser processing device of the present invention, Figure 5 Shows Figure 1 The state in which the incident beam is processed and output in the existing Bessel beam optical device based on an axicon lens, Figure 6 Shows Figure 5 The state of the light beam output to the object in the existing device. Figure 7 Shown Figure 2 The state in which the incident light beam is processed in the laser processing device of the present invention, Figure 8 Shown Figure 2 The laser beam is formed by the multi-focus diffraction lens section. Fig. 9 Shown Figure 2 The ring beam (Ring Beam) after passing through the diffraction lens part of the laser processing device of the present invention and the spot beam (Spot Beam) after passing through the multi-layer focusing lens. Fig.10 Shown Fig. 9 The state of the beam output to the object in the laser processing device, Fig.11 Shown in more detail Fig.10 The state of the beam output to the object in the laser processing device.

[0047] The existing Bessel beam optical device A based on an axicon lens is as follows: Figure 4 As shown, it has a longer height than the laser processing device 1. That is, the existing Bessel beam optical device A based on the axicon lens has a larger structure than the laser processing device 1, for example, Figure 4 As shown, a structure with a height of 'B1' may be provided.

[0048] An incident hole 101 can be formed at the top of the shell of the existing axicon lens-based Bessel beam optical device A, and an output hole 102 can be formed at the bottom of the shell. In addition, the first protective window 50, the second protective window 60, the aperture 20 and the multi-layer focusing lens 40, which are the same as those in the laser processing device 1, are installed inside the shell 10.

[0049] In addition, a filter C, an axicon lens D, and a delay lens E that are not installed inside the laser processing device 1 are also installed. At this time, the first protection window portion 50 is located between the incident hole 101 and the aperture portion 20, the aperture portion 20 is installed between the first protection window portion 50 and the filter C, and the filter C is installed between the aperture portion 20 and the axicon lens D. The filter C increases the brightness by allowing only specific wavelengths to pass.

[0050] The axicon lens D is installed between the filter C and the delay lens E to form a circular beam. The delay lens E is installed between the axicon lens D and the multi-layer focusing lens unit 40 to prevent the deformed circular beam from spreading outward and keep it flat.

[0051] Therefore, the existing Bessel beam optical device A based on an axicon lens includes more components than the laser processing device of the present invention. Fig.11 As shown, the existing Bessel beam optical device A based on an axicon lens has a short depth of focus (DOF), resulting in uneven energy intensity along the Z-axis direction, and only outputs a surface contact laser beam with a larger intensity, and the laser beam cannot penetrate into the interior of the object. Figure 6 As shown, the laser beam outputted from the prior art device to the object F has a large focal size, which may damage the area around the laser output point. In addition, the energy intensity of the laser beam along the Z axis gradually weakens due to the short focal depth.

[0052] In order to output a laser beam having a long focal depth from the existing axicon lens-based Bessel beam optical device A, a large-sized axicon lens D must be installed, which increases the size of the optical device.

[0053] In contrast, the laser processing device 1 of the present invention is Figure 4 As shown, the laser processing device 1 has a shorter height than the existing Bessel beam optical device A based on an axicon lens. That is, the laser processing device 1 has a smaller structure than the existing Bessel beam optical device A based on an axicon lens, for example, Figure 4 As shown, a structure may have a height decreasing from 'B1' to 'B3' to 'B2'.

[0054] The laser processing device 1 of the present invention is different from the existing Bessel beam optical device A based on an axicon lens, and the first protection window portion 50, the second protection window portion 60, the aperture portion 20, the multi-layer focusing lens portion 40 and the multi-focal diffraction lens portion 30 are installed in the internal housing portion 10. At this time, the multi-focal diffraction lens portion 30 can diffract the laser beam according to the pattern on its surface to form a beam, such as Figure 8 Such a multi-focal diffraction lens unit 30 can form a ring beam with a long focal depth and a small spot size within a short distance.

[0055] This multifocal diffraction lens section 30 embodies the features of the axicon lens D and the delay lens E included in the existing axicon lens-based Bessel beam optical device A, and can replace them.

[0056] The laser processing device 1 of the present invention is as follows Fig.11 As shown, a laser beam with a long depth of focus (DOF) is output, and the energy intensity is uniform along the Z-axis. In this way, the laser beam can be delivered deep into the object.

[0057] In addition, if Figure 7 As shown, the laser processing device 1 reduces the size of the incident light beam G by the aperture unit 20, and then irradiates the reduced laser beam to the multi-focus diffraction lens unit 30. Figure 8 As shown, the reduced laser beam is deflected in multiple orders, and the deflected beam is diffracted to form a ring beam, and is focused by the multi-layer focusing lens unit 40 to form a laser beam H with a small diameter, that is, a spot beam.

[0058] At this time, the laser processing device 1 is as follows Fig.10 and Fig.11 As shown, a point beam H with small size and high intensity is output.

[0059] refer to Fig.12 , the following describes a method for processing an object based on the above-mentioned laser processing device.

[0060] Fig.12 It is a flowchart of a method of processing an object using the laser processing device of the present invention.

[0061] The laser processing device for processing an object may be the laser processing device 1 of the present invention. Therefore, in order to simplify the description of the method of processing an object using the laser processing device, the detailed description of the laser processing device is replaced by the previous description of the laser processing device 1.

[0062] The method of processing an object using a laser processing device is to transmit a laser beam from one side of the object to the other side through the laser processing device 1, uniformly cut the object and improve the strength of the cut surface.

[0063] This method of processing an object using the laser processing device 1 is performed by the following steps: (A) preparing the laser processing device 1 (step S100); (B) installing the laser processing device 1 below a laser beam output device that outputs a laser beam (step S200); (C) placing an object below the laser processing device 1 (step S300).

[0064] This method of processing an object using a laser processing device can accurately cut the cutting part of the object, cut with uniform strength, prevent micro cracks from occurring in the object, and thus improve the quality of the processed object.

[0065] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but those skilled in the art will appreciate that the present invention can be implemented in other specific forms without changing its technical ideas or basic features. Therefore, the embodiments described above should be considered as illustrative and not restrictive in all aspects.

[0066] Description of reference numerals:

[0067] 1: Laser processing equipment

[0068] 10: Shell

[0069] 101: Entrance hole

[0070] 102: Output hole

[0071] 20: Aperture

[0072] 30: Multi-focus diffractive lens unit

[0073] 40: Multi-layer focusing lens unit

[0074] 50: First protection window

[0075] 60: Second protection window

Claims

1. A laser processing device, comprising: A housing portion (10) is formed with a receiving space inside, and has an incident hole (101) at one end and an output hole (102) at the other end; An aperture portion (20) installed inside the housing portion (10) and located below the incident hole (101) and used to adjust the size of an incident light beam passing through the incident hole (101); A multi-focal diffraction lens portion (30) installed inside the housing portion (10) and below the aperture portion (20) for deflecting an incident light beam along the optical axis in multiple orders and causing the deflected light beam to diffract to form an annular light beam; and A multi-layer focusing lens section (40) is installed inside the housing section (10) and is located below the multi-focal diffraction lens section (30) and is used to focus the light beam passing through the multi-focal diffraction lens section (30).

2. The laser processing device according to claim 1, characterized in that: Also includes: A first protective window portion (50) installed in the accommodation space of the outer shell portion (10) and located below the incident hole (101); as well as A second protective window portion (60) is installed inside the housing portion (10) and is located between the multi-layer focusing lens portion (40) and the output hole (102).

3. A method for processing an object using a laser processing device, characterized in that: The following steps are involved: (A) preparing a laser processing device (1) including a housing portion (10) having a housing space formed therein, an incident hole (101) at one end and an output hole (102) at the other end, an aperture portion (20) installed inside the housing portion (10) and located below the incident hole for adjusting the size of an incident light beam, a multi-focal diffraction lens portion (30) installed inside the housing portion and located below the aperture portion for deflecting the incident light beam along the optical axis in multiple orders and diffracting the deflected light beam to form an annular light beam, and a multi-layer focusing lens portion (40) installed inside the housing portion and located below the multi-focal diffraction lens portion for focusing the light beam passing through the multi-focal diffraction lens portion (S100); (B) installing the laser processing device (1) below a laser beam output device that outputs a laser beam (S200); and (C) An object is placed under the laser processing device (1) (S300).

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