Quality detection device for packaged chip and detection method thereof

Abstract

The invention provides a quality detection device for packaged chips and a detection method thereof, and belongs to the technical field of chip detection.The quality detection device comprises a workbench and an equipment box, a detection tool used for containing multiple sets of packaged chips is arranged above the workbench, and a conveying rail used for conveying the detection tool is arranged at the top of the workbench; the top of the workbench is further provided with a bearing detection assembly corresponding to the detection tool, the bearing detection assembly comprises a pressure plate and a hydraulic cylinder, the hydraulic cylinder and the pressure plate are arranged above the workbench, one side of the bearing detection assembly is provided with a load detection assembly, the load detection assembly comprises an electrifying plate, and the top of the workbench is provided with a second through groove. An electrifying plate is slidably arranged in the second through groove, and a sorting assembly is arranged on the side, away from the bearing detection assembly, of the load detection assembly. Cracks, bubbles and welding spots in the packaged chip are detected through the bearing detection assembly, and detection and load detection are carried out on an internal circuit of the chip through the load detection assembly, so that the comprehensiveness and accuracy of detection are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection, and more specifically, particularly relates to a quality detection device and a detection method for packaged chips. Background Art

[0002] During chip production, the chip needs to be packaged, which not only provides physical protection for the chip to protect it from physical damage and chemical corrosion from the external environment, but also enables the electrical connection between the chip and the external circuit to ensure stable signal transmission. At the same time, it assists the chip in heat dissipation to ensure that the chip operates within the normal operating temperature range.

[0003] During the packaging process, due to the influence of various factors such as process level, material properties and production environment, quality problems may occur. For example, loose pin welding may lead to unstable electrical connection. For example, the Chinese invention patent with patent number 202411132674.7 provides a packaged chip pin detection device, which transports the packaged chip to a detection frame to detect the pin when in use. When it is detected that the packaged chip has a pin abnormality, the abnormal packaged chip is sorted through the air pipe and the air hole; however, by analyzing the above patent and combining with the prior art, it is found that the existing detection device can only detect some defects on the chip surface, and it is difficult to effectively detect potential problems inside the chip, and it is difficult to ensure the accuracy of the detection results. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a quality inspection device and an inspection method for packaged chips to solve the technical problems in the prior art that traditional inspection devices can only detect partial defects on the chip surface, and it is difficult to effectively detect potential problems inside the chip and it is difficult to ensure the accuracy of the inspection results.

[0005] The purpose and effect of the quality inspection device and inspection method of packaged chips of the present invention are achieved by the following specific technical means: A quality inspection device for packaged chips comprises a workbench and an equipment box arranged at the bottom of the workbench, an inspection tooling for placing multiple groups of packaged chips is arranged above the workbench, a transport track for transporting the inspection tooling is arranged on the top of the workbench, a load-bearing inspection component is also arranged on the top of the workbench corresponding to the inspection tooling, the load-bearing inspection component comprises a pressure plate and a hydraulic cylinder, the hydraulic cylinder and the pressure plate are arranged above the workbench, a load detection component is arranged on one side of the load-bearing inspection component, the load detection component comprises an electrification plate, a second through slot is opened on the top of the workbench, the electrification plate is slidably arranged in the second through slot, and a sorting component is arranged on the side of the load detection component away from the load detection component.

[0006] In a preferred embodiment, a plurality of groups of placement grooves are provided on the top of the detection tooling, and the plurality of groups of placement grooves are evenly spaced and distributed on the top of the detection tooling. A detection base for placing the packaged chip is provided in each of the plurality of placement grooves. A plurality of groups of power supply holes are provided on the top of the detection base corresponding to the pins of the packaged chip, and a power supply interface is provided at the bottom of the detection base corresponding to the plurality of power supply holes. An installation groove is provided on one side of the detection base, an RFID tag is provided in the installation groove, and a detachable side panel is provided at the opening on one side of the installation groove.

[0007] In a preferred embodiment, a first mounting seat is provided on the top of the workbench, a first mounting hole is provided on the top of the first mounting seat, the hydraulic cylinder is provided on the top of the first mounting hole, two groups of first guide columns are provided on the top of the pressure plate, two groups of first guide holes are opened at the bottom of the first mounting seat corresponding to the two groups of first guide columns, and the two groups of first guide columns can be slidably penetrated in the two groups of first guide holes respectively, the bottom end of the hydraulic cylinder is connected with a connecting seat through a hydraulic rod, a bearing plate is provided at the bottom of the connecting seat, and two groups of second guide columns are also provided on the top of the pressure plate, two groups of second guide holes are opened at the bottom of the bearing plate corresponding to the two groups of second guide columns, and the two groups of second guide columns can be slidably penetrated in the two groups of second guide holes respectively, and a pressure sensor is provided between the bearing plate and the pressure plate.

[0008] In a preferred embodiment, the load-bearing detection component also includes multiple groups of pressure contact blocks, a layout plate is arranged on the top of the detection tooling, and multiple groups of layout holes are opened on the top of the layout plate corresponding to the multiple groups of detection bases, and multiple groups of pressure contact blocks are arranged on the bottom of the pressure plate corresponding to the multiple groups of layout holes. A first mounting plate is connected to one side of the first mounting seat, and a mounting frame is arranged on the side of the first mounting plate away from the pressure plate, and multiple groups of mounting clips are arranged on one side of the mounting frame. Multiple groups of X-ray detectors are respectively installed in the multiple groups of mounting clips through connecting blocks. A defect detection module is also arranged on one side of the first mounting plate, and the multiple groups of X-ray detectors are connected to the defect detection module through signal lines, and multiple groups of first RFID writers are arranged on the other side of the first mounting plate corresponding to the multiple groups of X-ray detectors.

[0009] In a preferred embodiment, a first through groove is provided on the top of the workbench corresponding to the load-bearing detection component, a second mounting seat is provided at the bottom of the first through groove, a second mounting hole is provided at the bottom of the second mounting seat, a first linear drive device is provided at the bottom of the second mounting hole, a receiving plate is connected to the pushing rod of the first linear drive device, a non-slip layer is provided on the top of the receiving plate, a groove is provided on one side of the first through groove, a first photoelectric sensor is provided in the groove corresponding to the detection tooling, two groups of blocking through grooves are also provided on one side of the first through groove, a first connecting rod is provided on one side of the second mounting seat, a blocking fork is provided on one side of the first connecting rod, and the top of the blocking fork can be slidably penetrated into the two groups of blocking through grooves.

[0010] In a preferred embodiment, a third mounting seat is provided at the bottom of the second through groove, a third mounting hole is provided at the bottom of the third mounting seat, a second linear drive device is provided at the bottom of the third mounting hole, a push rod of the second linear drive device passes through the third mounting hole and is connected to the power-on plate, a plurality of groups of through holes are provided on the top of the power-on plate corresponding to the plurality of groups of power supply interfaces, power supply needles are provided in the plurality of groups of through holes, and the power supply needles can be inserted into the power supply interfaces, a groove is provided on one side of the second through groove, a second photoelectric sensor is provided in the groove, positioning grooves are provided on both sides of the second through groove, a first electric telescopic rod is provided on both sides of the third mounting seat, a positioning claw is connected to one end of the first electric telescopic rod, and one side of the positioning claw is slidably provided in the positioning groove.

[0011] In a preferred embodiment, a closed box is provided on the top of the second through groove, an opening is provided at the bottom of the closed box corresponding to the detection tooling, two groups of limit plates are provided on the top of the opening, first slide rails are provided on both sides of the opening, first electric sliders are slidably provided on the two groups of the first slide rails, the bottom end of the gantry is connected to the two groups of the first electric sliders, a second slide rail is provided on the gantry, a second electric slider is slidably provided on the second slide rail, a thermal imaging detection module is provided at the bottom of the second electric slider, and a second RFID writer is connected to one side of the second electric slider through two groups of second connecting rods.

[0012] In a preferred embodiment, the sorting component includes an RFID reader, a fourth mounting seat is provided on one side of the load detection component, a three-axis moving device is provided on the top of the fourth mounting seat, a second mounting plate is provided on the three-axis moving device, the RFID reader is provided at the bottom of the second mounting plate, a mounting clamp is provided on one side of the second mounting plate, a vacuum generator is provided on the mounting clamp, a mounting bracket is provided at the bottom of the mounting clamp, a suction nozzle is provided on the mounting bracket, the bottom end of the vacuum generator is connected to the suction nozzle through an air pipe, and a recovery conveyor belt is provided on one side of the workbench.

[0013] In a preferred embodiment, the sorting component includes an infrared detector, a fourth mounting seat is provided on one side of the load detection component, a three-axis moving device is provided on the top of the fourth mounting seat, a third slide rail is provided on one side of the fourth mounting seat, a third electric slider is provided on the third slide rail, an elevated frame is provided on the top of the third electric slider, a fifth mounting seat is provided on the top of the elevated frame, the fifth mounting seat is provided with the infrared detector, two groups of second electric telescopic rods are provided in multiple groups of the placement grooves, limited connecting plates are provided on both sides of the detection base, the top ends of the two groups of the second electric telescopic rods are respectively connected to the two groups of the limited connecting plates, a second mounting plate is provided on the three-axis moving device, a mounting clamp and a mounting bracket are provided on one side of the second mounting plate, a vacuum generator is provided on the mounting clamp, a suction nozzle is provided on the mounting bracket, the bottom end of the vacuum generator is connected to the suction nozzle through an air pipe, and a recovery conveyor belt is provided on the other side of the fourth mounting seat.

[0014] A method for detecting a quality detection device of a packaged chip comprises the following steps: Step 1: Place the packaged chip to be tested on the testing base in the placement slot at the top of the testing tooling, so that the pins of the packaged chip are inserted into the power supply hole at the top of the testing base; Step 2: Start the transport track to transport the inspection tooling with the packaged chips to the position of the load-bearing inspection component. When the first photoelectric sensor detects the inspection tooling, start the first linear drive device to push the receiving plate and the blocking fork up. The blocking fork first intercepts the inspection tooling on the transport track through the blocking slot, and then the receiving plate rises to lift the inspection tooling using the anti-slip layer on the top; start the hydraulic cylinder to push the pressure plate down, and the multiple groups of pressure contact blocks at the bottom of the pressure plate contact with multiple packaged chips respectively and apply set pressure. During the pressure process, the pressure sensor between the load-bearing plate and the pressure plate monitors the pressure value in real time; Step 3: After the pressure is applied, the load-bearing detection component is reset, and the hydraulic cylinder reverses to drive the pressure plate to rise and reset. At the same time, the first linear drive device also drives the receiving plate and the blocking fork to descend, and the detection tooling is put back on the transport track. The detection tooling continues to move forward along the transport track and passes through multiple sets of X-ray detectors on the mounting frame on one side of the first mounting plate. The X-ray detector detects the packaged chip after the load-bearing detection to check whether there are cracks, bubble defects and abnormal solder joints. The X-ray detector transmits the detected information to the defect detection module through the signal line. After analysis and processing, the defect detection module writes the defect information into the RFID tag in the detection base below the corresponding package chip through the first RFID writer on the other side of the first mounting plate; Step 4: When the inspection tooling arrives at the load detection component, the second photoelectric sensor detects the inspection tooling, starts the second linear drive device to push the power-on board up to lift the inspection tooling, and at the same time starts the first electric telescopic rods on both sides to drive the positioning claws to position the inspection tooling, ensuring that the power supply pin on the top of the power-on board penetrates the power supply interface at the bottom of the detection base. The power-on board continues to rise, and the inspection tooling is lifted to the bottom opening of the closed box, so that the inspection tooling enters the closed box, and the packaged chip is powered on to generate heat, and then the circuit inside the packaged chip is detected through the thermal imaging detection module. At the same time, the power of the packaged chip is gradually increased for load detection, and the second RFID writer writes the detected defect information into the RFID tag under the corresponding packaged chip. After the detection is completed, the power-on board descends and resets, and the inspection tooling is put back on the transportation track; Step 5: The inspection tooling arrives at the sorting component position, and the three-axis moving device drives the second mounting plate to move so that the RFID reader at the bottom is aligned with the RFID tag on the inspection tooling. The RFID reader reads the information in the RFID tag to determine whether the packaged chip has defects. If a defective packaged chip is detected, the three-axis moving device continues to move and drives the mounting jaws to move to the top of the corresponding packaged chip. The vacuum generator on the mounting jaws is started, and the suction nozzle on the mounting bracket generates negative pressure through the air pipe to suck the defective packaged chip, and then transfer it to the recovery conveyor belt on one side of the workbench to complete the sorting of the packaged chips.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the setting of the load-bearing detection component, the pressure plate is pushed by the hydraulic cylinder, and the set pressure is applied to the packaged chip by the pressure contact block. At the same time, the pressure sensor monitors the pressure value in real time, simulates the stress condition of the chip in actual use, and detects its structural stability. Subsequently, the chip is scanned by an X-ray detector to deeply detect whether there are potential problems such as cracks, bubble defects and abnormal solder joints inside the chip. In this process, the X-ray detector works together with the defect detection module. After the detection information is transmitted and analyzed, the defect information is accurately recorded in the RFID tag of the corresponding chip through the first RFID writer, so as to locate and record the quality problems inside the chip, and improve the comprehensiveness and accuracy of the detection.

[0016] 2. Through the setting of the load detection component, the power supply pin is connected to the power supply interface to power the packaged chip. The packaged chip generates heat when it is powered on. The thermal imaging detection module is then used to detect the internal circuit of the chip to detect whether there are any abnormal heating areas. At the same time, the chip power is gradually increased for load detection to simulate the operating conditions of the chip in actual complex working scenarios. This can further expose the possible decline in heat dissipation performance and poor stability of the chip under high load conditions, improve the detection capability of the electrical and thermal performance problems of the packaged chip, and ensure the reliability of the chip in actual applications.

[0017] 3. Through the setting of the first photoelectric sensor and the second photoelectric sensor, it is possible to detect that the inspection tooling on which the chip to be inspected is placed passes through the load-bearing detection component and the load detection component in sequence on the transport track. When the inspection tooling reaches the load-bearing detection component and the load detection component, the first photoelectric sensor and the second photoelectric sensor respectively trigger the corresponding linear drive device and the electric telescopic rod to complete the interception, lifting, positioning and other operations of the inspection tooling without excessive manual intervention. This automated detection method improves the detection efficiency, ensures the consistency of the detection results, and can meet the detection needs of large-scale chip production.

[0018] 4. Through the setting of the first RFID writer and the second RFID writer, the defect information found during the inspection process is written into the RFID tag. Finally, the sorting component reads the information in the RFID tag through the RFID reader to determine whether the chip has defects and automatically sorts the defective chips. This inspection data recording and traceability mechanism based on RFID technology can ensure that the inspection results of each chip are traceable, facilitate subsequent quality analysis and problem troubleshooting, and improve the transparency of production management. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of the structure of the first embodiment of the present invention after assembly; Figure 2 is a schematic diagram of the structure of the first embodiment of the present invention after expansion; Figure 3 It is a schematic diagram of the structure after the detection tooling and the arrangement plate are assembled in the present invention; Figure 4 It is a schematic diagram of the structure after the detection tooling and the arrangement plate are separated in the present invention; Figure 5 It is a schematic diagram of the structure after the detection base and the side plate are separated in the present invention; Figure 6 It is a schematic diagram of the structure of the load-bearing detection component after assembly in the present invention; Figure 7 yes Figure 6 Schematic diagram of the structure after splitting; Figure 8is a schematic structural diagram of a pressure contact block in the present invention; Fig. 9 It is a schematic diagram of the structure after the second mounting seat and the receiving plate are separated in the present invention; Fig.10 It is a schematic diagram of the structure of the load detection component after assembly in the present invention; Fig.11 yes Fig.10 Schematic diagram of the structure after splitting; Fig.12 It is a schematic diagram of the structure after the sorting components in the present invention are assembled; Fig.13 yes Fig.12 Schematic diagram of the structure after splitting; Fig.14 This is a schematic diagram of the structure of the sorting component after assembly in the second embodiment of the present invention; Fig.15 This is a schematic diagram of the structure of the sorting component after it is disassembled in the second embodiment of the present invention; Fig.16 The present invention is a flow chart of the steps of a detection method of a device for detecting quality of packaged chips.

[0020] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 101, workbench; 102, equipment box; 103, packaged chip; 104, transport track; 105, second through slot; 106, first through slot; 107, recycling conveyor belt; 201, pressure plate; 202, hydraulic cylinder; 203, first mounting seat; 204, first mounting hole; 205, first guide column; 206, first guide hole; 207, connecting seat; 208, bearing plate; 209, second guide column; 210, second guide hole; 211, pressure sensor; 212, pressure contact block; 213, first mounting plate; 214, mounting frame; 215, pressure sensor; 216, pressure contact block; 217, pressure sensor; 218, pressure contact block; 219, pressure sensor; 220, pressure contact block; 221, pressure sensor; 222, pressure contact block; 223, pressure sensor; 224, pressure contact block; 225, pressure sensor; 226, pressure contact block; 227, pressure sensor; 228, pressure sensor; 229, pressure contact block; 230, pressure sensor; 231, pressure sensor; 232, pressure contact block; 233, pressure sensor; 234, pressure contact block; 235, pressure sensor; 236, pressure sensor; 237, pressure sensor; 238, pressure sensor; 239, pressure sensor; 240, pressure sensor; 241, pressure sensor; 242, pressure sensor; 243, pressure sensor; 244, pressure sensor; 245, pressure sensor; 246, pressure sensor; 247, pressure sensor; 248, pressure sensor; 249, pressure sensor; 250, pressure sensor; 251, pressure sensor; 252, pressure sensor; 253, pressure sensor; 254, pressure sensor; 5. Mounting card; 216. X-ray detector; 217. Defect detection module; 218. Signal line; 219. First RFID writer; 220. Second mounting seat; 221. Second mounting hole; 222. First linear drive device; 223. Adapter plate; 224. Anti-skid layer; 225. First photoelectric sensor; 226. Blocking groove; 227. First connecting rod; 228. Blocking fork; 229. Connecting block; 301. Power plate; 302. Third mounting seat; 303. Third mounting hole; 304. Second linear drive device; 305. Power supply pin ; 307, second photoelectric sensor; 308, positioning slot; 309, first electric telescopic rod; 310, positioning claw; 311, closed box; 312, opening; 313, limit plate; 314, first slide rail; 315, first electric slider; 316, gantry; 317, second slide rail; 318, second electric slider; 319, thermal imaging detection module; 320, second connecting rod; 321, second RFID writer; 401, detection tooling; 402, placement slot; 403, detection base; 404, power supply hole; 405, power supply interface; 40 6. Mounting slot; 407. RFID tag; 408. Side panel; 409. Arrangement plate; 410. Arrangement hole; 411. Second electric telescopic rod; 412. Limiting connecting plate; 501. RFID reader; 502. Fourth mounting seat; 503. Three-axis moving device; 504. Second mounting plate; 505. Mounting jaws; 506. Vacuum generator; 507. Mounting bracket; 508. Suction nozzle; 509. Air pipe; 510. Third slide rail; 511. Third electric slide block; 512. Heightening frame; 513. Fifth mounting seat; 514. Infrared detector. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0022] Embodiment 1: As shown in the attached Figures 1 to 13 as well as Fig.16 As shown: The present invention provides a quality inspection device for packaged chips, comprising a workbench 101 and an equipment box 102 arranged at the bottom of the workbench 101, the equipment box 102 is connected to an external circuit for power supply, and an inspection tool 401 for placing multiple groups of packaged chips 103 is arranged above the workbench 101. The arrangement of the inspection tool 401 enables centralized inspection of multiple packaged chips 103 at one time, thereby improving the inspection efficiency. A transport track 104 for transporting the inspection tool 401 is arranged on the top of the workbench 101, so that the inspection tool 401 can reach each packaged chip 103 in sequence. A detection component position is arranged to realize an automated detection process. A load-bearing detection component is also provided on the top of the workbench 101 corresponding to the detection tooling 401. The load-bearing detection component includes a pressure plate 201 and a hydraulic cylinder 202. A hydraulic cylinder 202 and a pressure plate 201 are provided above the workbench 101. A load detection component is provided on one side of the load-bearing detection component. The load detection component includes a power-on plate 301. A second through groove 105 is provided on the top of the workbench 101. The power-on plate 301 can slide in the second through groove 105. A sorting component is provided on the side of the load detection component away from the load detection component.

[0023] Please refer to Figure 3 , Figure 4 and Figure 5 As shown, a plurality of groups of placement slots 402 are provided on the top of the detection tooling 401, and these placement slots 402 are evenly spaced on the top of the detection tooling 401. A detection base 403 for placing the packaged chip 103 is provided in each of the plurality of placement slots 402. A plurality of groups of power supply holes 404 are provided on the top of the detection base 403 corresponding to the pins of the packaged chip 103. The power supply holes 404 can be adapted to the pins of the packaged chip 103 to ensure the stability of the electrical connection. A power supply interface 405 is provided at the bottom of the detection base 403 corresponding to the plurality of power supply holes 404 for subsequent power supply to the packaged chip 103. A mounting slot 406 is provided on one side of the detection base 403, and an RFID tag 407 is provided in the mounting slot 406. The RFID tag 407 can record various detection information of the packaged chip 103 to facilitate subsequent sorting. A detachable side panel 408 is provided at the opening on one side of the mounting slot 406 to facilitate replacement or maintenance of the RFID tag 407 when necessary.

[0024] Please refer to Figure 6 and Figure 7As shown, a first mounting seat 203 is provided on the top of the workbench 101, a first mounting hole 204 is provided on the top of the first mounting seat 203, a hydraulic cylinder 202 is installed on the top of the first mounting hole 204, two groups of first guide columns 205 are provided on the top of the pressure plate 201, and two groups of first guide holes 206 are provided at the bottom of the first mounting seat 203 corresponding to the two groups of first guide columns 205. The two groups of first guide columns 205 are respectively slidably penetrated in the two groups of first guide holes 206, so that the pressure plate 201 can remain stable when moving up and down for load-bearing detection to avoid deviation. The bottom end of the hydraulic cylinder 202 is connected to a connecting rod through a hydraulic rod. The connecting seat 207 is provided with a supporting plate 208 at the bottom of the connecting seat 207, and two groups of second guide pillars 209 are also provided on the top of the pressure plate 201. Two groups of second guide holes 210 are opened at the bottom of the supporting plate 208 corresponding to the two groups of second guide pillars 209. The two groups of second guide pillars 209 can be slidably penetrated into the two groups of second guide holes 210 respectively. A pressure sensor 211 is provided between the supporting plate 208 and the pressure plate 201. The pressure sensor 211 can select the JLBU-1 model. The pressure value applied to the packaged chip 103 can be monitored in real time through the pressure sensor 211 to ensure that the pressure application process meets the detection requirements.

[0025] Please refer to Figure 7 and Figure 8As shown, the load-bearing detection component also includes multiple groups of pressure contact blocks 212, an arrangement plate 409 is arranged on the top of the detection tool 401, and multiple groups of arrangement holes 410 are opened on the top of the arrangement plate 409 corresponding to the multiple groups of detection bases 403, and multiple groups of pressure contact blocks 212 are arranged on the bottom of the pressure plate 201 corresponding to the multiple groups of arrangement holes 410. During the detection, pressure can be applied to multiple groups of packaged chips 103 respectively through the multiple groups of pressure contact blocks 212, which can simulate the stress conditions of the chips in actual use, and then detect their structural stability; a first mounting plate 213 is connected to one side of the first mounting seat 203, and a mounting frame 214 is arranged on the side of the first mounting plate 213 away from the pressure plate 201, and multiple groups of mounting clamps 215 are arranged on one side of the mounting frame 214, and multiple groups of X-ray detectors 216 are respectively installed in the multiple groups of mounting clamps 215 through connecting blocks 229. The X-ray detectors 216 can choose XDM03-US BX model, after the pressure test, the packaged chip 103 can be tested by multiple groups of X-ray detectors 216 to check whether there are potential problems such as cracks, bubble defects and abnormal solder joints inside, thereby improving the comprehensiveness and accuracy of the test; a defect detection module 217 is also arranged on one side of the first mounting plate 213, and the defect detection module 217 can select the OHR-PR10 model. The multiple groups of X-ray detectors 216 are connected to the defect detection module 217 through signal lines 218, and the X-ray detectors 216 transmit the detection information to the defect detection module 217 for analysis and processing; a multiple group of first RFID writers 219 are arranged on the other side of the first mounting plate 213 corresponding to the multiple groups of X-ray detectors 216, and the defect information can be input into the RFID tag 407 under the corresponding packaged chip 103 through the first RFID writer 219, so as to locate and record the quality problems inside the chip.

[0026] Please refer to Fig. 9As shown, a first through slot 106 is provided on the top of the workbench 101 corresponding to the load-bearing detection component, a second mounting seat 220 is provided at the bottom of the first through slot 106, a second mounting hole 221 is provided at the bottom of the second mounting seat 220, a first linear drive device 222 is provided at the bottom of the second mounting hole 221, a receiving plate 223 is connected to the push rod of the first linear drive device 222, and an anti-skid layer 224 is provided on the top of the receiving plate 223, and the anti-skid layer 224 can prevent the detection tool 401 from sliding on the receiving plate 223 to ensure the stability of the detection process; a groove is provided on one side of the first through slot 106, and a first photoelectric sensor 225 is provided in the groove corresponding to the detection tool 401. When the measuring tool 401 arrives here, the first photoelectric sensor 225 can detect it in time; two groups of blocking grooves 226 are also opened on one side of the first through groove 106, and a first connecting rod 227 is arranged on one side of the second mounting seat 220, and a blocking fork 228 is arranged on one side of the first connecting rod 227. The top of the blocking fork 228 can be slidably penetrated into the two groups of blocking grooves 226. When the first linear drive device 222 is started, the receiving plate 223 and the blocking fork 228 can be pushed up. The blocking fork 228 first intercepts the measuring tool 401 on the transport track 104 through the blocking groove 226, and then the receiving plate 223 rises to lift the measuring tool 401 for load-bearing detection.

[0027] Please refer to Fig.10 and Fig.11 As shown, a third mounting seat 302 is provided at the bottom of the second through slot 105, a third mounting hole 303 is provided at the bottom of the third mounting seat 302, a second linear drive device 304 is provided at the bottom of the third mounting hole 303, a push rod of the second linear drive device 304 passes through the third mounting hole 303 and is connected to a power-on plate 301, a plurality of through holes are provided at the top of the power-on plate 301 corresponding to the plurality of power supply interfaces 405, and power supply needles 305 are provided in the plurality of through holes. When the detection tooling 401 reaches the position of the load detection component, the second linear drive device 304 is started to push the power-on plate 301 to rise, so that the power supply needle 305 can be inserted into the power supply interface 405, thereby supplying power to the packaged chip 103 on the detection base 403; the second through slot 105 A groove is provided on the side, and a second photoelectric sensor 307 is arranged in the groove, which is used to detect whether the detection tooling 401 reaches the load detection component position. The first photoelectric sensor 225 and the second photoelectric sensor 307 can both use the STAB-40N model. Positioning grooves 308 are provided on both sides of the second through groove 105, and first electric telescopic rods 309 are provided on both sides of the third mounting seat 302. One end of the first electric telescopic rod 309 is connected to a positioning claw 310, and one side of the positioning claw 310 is slidably arranged in the positioning groove 308. When the power-on plate 301 rises, the first electric telescopic rods 309 on both sides are started, driving the positioning claws 310 to position the detection tooling 401 to ensure that the power supply pin 305 is accurately connected to the power supply interface 405.

[0028] Please refer to Fig.11 As shown, a closed box 311 is provided on the top of the second through slot 105, an opening 312 is provided at the bottom of the closed box 311 corresponding to the detection tooling 401, two groups of limit plates 313 are provided on the top of the opening 312, and are used to limit the position of the detection tooling 401, first slide rails 314 are provided on both sides of the opening 312, and first electric sliders 315 are slidably provided on the two groups of first slide rails 314, and the bottom end of the gantry 316 is connected to the two groups of first electric sliders 315, and a second slide rail 317 is provided on the gantry 316, and a second electric slider 318 is slidably provided on the second slide rail 317, and a thermal imaging detection module 319 is provided at the bottom of the second electric slider 318. The thermal imaging detection module 319 can select the X384D model. When the packaged chip 103 is powered on to generate heat, the thermal imaging detection module 319 can detect the internal electrical The circuit is tested to detect whether there are any abnormal heating areas. At the same time, the chip power is gradually increased during the testing process for load testing, simulating the operating conditions of the chip in actual complex working scenarios, which can further expose the problems of reduced heat dissipation performance and poor stability of the chip under high load conditions, thereby improving the detection capability of electrical and thermal performance problems of the packaged chip and ensuring the reliability of the chip in actual applications. A second RFID writer 321 is connected to one side of the second electric slider 318 through two sets of second connecting rods 320. Both the first RFID writer 219 and the second RFID writer 321 can use the FR1000 model. The defect information detected by the load detection component is input into the RFID tag 407 under the corresponding packaged chip 103 through the second RFID writer 321, which is convenient for subsequent sorting.

[0029] Please refer to Fig.12 and Fig.13As shown, the sorting component includes an RFID reader 501, and the RFID reader 501 can be selected as model D1601. A fourth mounting seat 502 is arranged on one side of the load detection component, and a three-axis moving device 503 is arranged on the top of the fourth mounting seat 502. A second mounting plate 504 is arranged on the three-axis moving device 503, and an RFID reader 501 is arranged at the bottom of the second mounting plate 504. After the detection tool 401 completes the previous detection process and reaches the sorting component position, the three-axis moving device 503 drives the second mounting plate 504 to move, so that the RFID reader 501 can align with the RFID tag 407 on the detection tool 401 to read information; a mounting clamp 505 is arranged on one side of the second mounting plate 504, and the mounting clamp A vacuum generator 506 is arranged on 505, and the vacuum generator 506 can be selected as the ZH13BL-08-10 model. A mounting bracket 507 is arranged at the bottom of the mounting jaw 505, and a suction nozzle 508 is arranged on the mounting bracket 507. The bottom end of the vacuum generator 506 is connected with the suction nozzle 508 through an air pipe 509. Based on the defect information read by the RFID reader 501, the mounting jaw 505 is driven to move to the top of the corresponding packaged chip 103 through the three-axis moving device 503. The vacuum generator 506 is started, and the suction nozzle 508 generates negative pressure through the air pipe 509 to suck the defective packaged chip 103, and then transport it to the recovery conveyor belt 107 arranged on one side of the workbench 101 to complete the sorting of the packaged chips 103.

[0030] Please refer to Fig.14 and Fig.15 As shown, the sorting component includes an infrared detector 514, a fourth mounting seat 502 is arranged on one side of the load detection component, a three-axis moving device 503 is arranged on the top of the fourth mounting seat 502, a third slide rail 510 is arranged on one side of the fourth mounting seat 502, a third electric slider 511 is arranged on the third slide rail 510, an increase frame 512 is arranged on the top of the third electric slider 511, a fifth mounting seat 513 is arranged on the top of the increase frame 512, an infrared detector 514 is arranged on the fifth mounting seat 513, and the infrared detector 514 can be selected from SWIR FPA model, two groups of second electric telescopic rods 411 are arranged in the multiple groups of placement slots 402, and limiting connecting plates 412 are arranged on both sides of the detection base 403. The top ends of the two groups of second electric telescopic rods 411 are respectively connected to the two groups of limiting connecting plates 412, and a second mounting plate 504 is arranged on the three-axis moving device 503. A mounting clamp 505 and a mounting bracket 507 are arranged on one side of the second mounting plate 504. A vacuum generator 506 is arranged on the mounting clamp 505, and a suction nozzle 508 is arranged on the mounting bracket 507. The bottom end of the vacuum generator 506 is connected to the suction nozzle 508 through an air pipe 509, and a recovery conveyor belt 107 is arranged on the other side of the fourth mounting seat 502.

[0031] A method for detecting a quality detection device of a packaged chip comprises the following steps: Step 1: Place the packaged chip 103 to be tested on the testing base 403 in the placement groove 402 at the top of the testing tool 401, so that the pins of the packaged chip 103 are inserted into the power supply hole 404 at the top of the testing base 403; Step 2: Start the transport track 104 to transport the inspection tool 401 with the packaged chip 103 to the position of the load-bearing inspection component. When the first photoelectric sensor 225 detects the inspection tool 401, start the first linear drive device 222 to push the receiving plate 223 and the blocking fork 228 to rise. The blocking fork 228 first intercepts the inspection tool 401 on the transport track 104 through the blocking groove 226. Then the receiving plate 223 rises and uses the anti-skid layer 224 on the top to lift the inspection tool 401. Start the hydraulic cylinder 202 to push the pressure plate 201 downward. The multiple groups of pressure contact blocks 212 at the bottom of the pressure plate 201 contact with multiple packaged chips 103 respectively and apply set pressure. During the pressure process, the pressure sensor 211 between the load-bearing plate 208 and the pressure plate 201 monitors the pressure value in real time. Step 3: After the pressure is applied, the load-bearing detection component is reset, and the hydraulic cylinder 202 moves in the reverse direction to drive the pressure plate 201 to rise and reset. At the same time, the first linear drive device 222 also drives the receiving plate 223 and the blocking fork 228 to descend, and the detection tooling 401 is put back on the transport track 104. The detection tooling 401 continues to move forward along the transport track 104, passing through the multiple groups of X-ray detectors 216 on the mounting frame 214 on one side of the first mounting plate 213. The X-ray detector 216 detects the packaged chip 103 after the load-bearing detection to check whether there are cracks, bubble defects and abnormal solder joints. The X-ray detector 216 transmits the detected information to the defect detection module 217 through the signal line 218. After the defect detection module 217 analyzes and processes, the defect information is written into the RFID tag 407 in the detection base 403 below the corresponding packaged chip 103 through the first RFID writer 219 on the other side of the first mounting plate 213; Step 4: When the detection tool 401 arrives at the load detection assembly, the second photoelectric sensor 307 detects the detection tool 401, and the second linear drive device 304 is started to push the power-on plate 301 to lift the detection tool 401. At the same time, the first electric telescopic rods 309 on both sides are started to drive the positioning claws 310 to position the detection tool 401, ensuring that the power supply pin 305 on the top of the power-on plate 301 penetrates the power supply interface 405 at the bottom of the detection base 403. The power-on plate 301 continues to rise, and the detection tool 401 is lifted to the closed box 3 11, the inspection tool 401 enters the closed box 311, the packaged chip 103 is powered on to generate heat, and then the circuit inside the packaged chip 103 is inspected by the thermal imaging inspection module 319, and the power of the packaged chip 103 is gradually increased for load detection. The second RFID writer 321 writes the detected defect information into the RFID tag 407 under the corresponding packaged chip 103. After the inspection is completed, the power board 301 is lowered and reset, and the inspection tool 401 is put back on the transport track 104; Step 5: The inspection tooling 401 arrives at the sorting component position, and the three-axis moving device 503 drives the second mounting plate 504 to move, so that the RFID reader 501 at the bottom is aligned with the RFID tag 407 on the inspection tooling 401, and the RFID reader 501 reads the information in the RFID tag 407 to determine whether the packaged chip 103 has defects. If a defective packaged chip 103 is detected, the three-axis moving device 503 continues to move to drive the mounting jaws 505 to move to the top of the corresponding packaged chip 103, and the vacuum generator 506 on the mounting jaws 505 is started, and the suction nozzle 508 on the mounting bracket 507 generates negative pressure through the air pipe 509, so as to suck the defective packaged chip 103, and then transfer it to the recovery conveyor belt 107 on one side of the workbench 101 to complete the sorting of the packaged chips 103.

[0032] Embodiment 2: Based on the quality inspection device and inspection method of packaged chips provided in Embodiment 1 of the present application, Embodiment 2 of the present application proposes a quality inspection device and inspection method of packaged chips. Embodiment 2 is only a preferred method of Embodiment 1, and the implementation of Embodiment 2 will not affect the independent implementation of Embodiment 1. Embodiment 2 of the present invention will be further described below.

[0033] Please refer to Fig.14 and Fig.15As shown, the sorting component includes an infrared detector 514, two groups of second electric telescopic rods 411 are arranged in the multiple groups of placement slots 402, and limited connection plates 412 are arranged on both sides of the detection base 403. The tops of the two groups of second electric telescopic rods 411 are respectively connected to the two groups of limited connection plates 412. The two groups of second electric telescopic rods 411 can be started based on the defect information in the RFID tag 407 to push the detection base 403 and the packaged chip 103 with defects on its top to rise, and the packaged chip 103 passes through the arrangement hole 410 to reach the top of the arrangement plate 409. A fourth mounting seat 502 is arranged on one side of the load detection component, and a three-axis moving device 503 is arranged on the top of the fourth mounting seat 502. A third slide rail 510 is arranged on one side of the fourth mounting seat 502, and a third electric slider 511 is arranged on the third slide rail 510. A heightening frame 512 is arranged on the top of the third electric slider 511. A fifth mounting seat 513 is arranged on the top of the rack 512, and an infrared detector 514 is arranged on the fifth mounting seat 513. The infrared detector 514 is driven to move by the third electric slider 511 on the third slide rail 510, so that the infrared detector 514 detects the defective packaged chip 103 above the arrangement plate 409. A second mounting plate 504 is arranged on the three-axis moving device 503, and a mounting clamp 505 and a mounting bracket 507 are arranged on one side of the second mounting plate 504. A vacuum generator 506 is arranged on the mounting clamp 505, and a suction nozzle 508 is arranged on the mounting bracket 507. The bottom end of the vacuum generator 506 is connected to the suction nozzle 508 through an air pipe 509. A recovery conveyor belt 107 is arranged on the other side of the fourth mounting seat 502, and the lifted packaged chip 103 is transferred to the recovery conveyor belt 107 by the vacuum generator 506 and the suction nozzle 508 on the three-axis moving device 503.

[0034] Compared with the first embodiment in which the sorting assembly only transfers the defective packaged chips 103 through the vacuum generator 506 and the suction nozzle 508, the second embodiment of the present invention starts the two sets of second electric telescopic rods 411 based on the defect information, pushes the detection base 403 and the packaged chips 103 with defects on its top to rise, and the packaged chips 103 pass through the arrangement holes 410 to reach the top of the arrangement plate 409. The main difference is that the defective packaged chips 103 can be lifted to a specific position separately, which is convenient for subsequent detection and grasping operations, and can avoid relying solely on the true The vacuum generator 506 and the suction nozzle 508 blindly search for defective chips to reduce the inefficiency caused by the low efficiency, and the third electric slider 511 on the third slide rail 510 drives the infrared detector 514 to move to detect the defective packaged chip 103 above the arrangement plate 409 and locate the position of the chip. Therefore, compared with the transportation only by the vacuum generator 506 and the suction nozzle 508, such a structure can improve the positioning accuracy of the defective chip during the sorting process, thereby improving the efficiency and accuracy of the entire sorting process; the other conditions are consistent with the embodiment 1, so this embodiment will not be repeated.

[0035] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A quality inspection device for packaged chips, comprising a workbench (101) and an equipment box (102) arranged at the bottom of the workbench (101), characterized in that: A detection fixture (401) for placing a plurality of groups of packaged chips (103) is arranged above the workbench (101); a transport track (104) for transporting the detection fixture (401) is arranged on the top of the workbench (101); a load-bearing detection component is also arranged on the top of the workbench (101) corresponding to the detection fixture (401); the load-bearing detection component comprises a pressure plate (201) and a hydraulic cylinder (202); the hydraulic cylinder (202) and the pressure plate (201) are arranged above the workbench (101); a load detection component is arranged on one side of the load-bearing detection component; the load detection component comprises an electric plate (301); a second through slot (105) is opened on the top of the workbench (101); the electric plate (301) is slidably arranged in the second through slot (105); and a sorting component is arranged on the side of the load detection component away from the load detection component.

2. The device for detecting quality of packaged chips according to claim 1, characterized in that: The top of the detection tool (401) is provided with a plurality of groups of placement grooves (402), the plurality of groups of placement grooves (402) are evenly spaced and distributed on the top of the detection tool (401), the plurality of groups of placement grooves (402) are each provided with a detection base (403) for placing the packaged chip (103), the top of the detection base (403) is provided with a plurality of groups of power supply holes (404) corresponding to the pins of the packaged chip (103), the bottom of the detection base (403) is provided with a power supply interface (405) corresponding to the plurality of groups of power supply holes (404), a mounting groove (406) is provided on one side of the detection base (403), an RFID tag (407) is provided in the mounting groove (406), and a detachable side panel (408) is provided at an opening on one side of the mounting groove (406).

3. The quality inspection device for packaged chips according to claim 2, characterized in that: A first mounting seat (203) is arranged on the top of the workbench (101), a first mounting hole (204) is arranged on the top of the first mounting seat (203), the hydraulic cylinder (202) is arranged on the top of the first mounting hole (204), two groups of first guide columns (205) are arranged on the top of the pressure plate (201), two groups of first guide holes (206) are opened at the bottom of the first mounting seat (203) corresponding to the two groups of first guide columns (205), the two groups of first guide columns (205) are slidably inserted into the two groups of first guide holes (206), and the hydraulic cylinder (202) is arranged on the top of the pressure plate (201). The bottom end of the pressure cylinder (202) is connected to a connecting seat (207) via a hydraulic rod, a bearing plate (208) is arranged at the bottom of the connecting seat (207), two groups of second guide columns (209) are also arranged at the top of the pressure plate (201), two groups of second guide holes (210) are opened at the bottom of the bearing plate (208) corresponding to the two groups of second guide columns (209), the two groups of second guide columns (209) are respectively slidably inserted into the two groups of second guide holes (210), and a pressure sensor (211) is arranged between the bearing plate (208) and the pressure plate (201).

4. The device for detecting quality of packaged chips according to claim 3, characterized in that: The load-bearing detection assembly also includes a plurality of groups of pressure contact blocks (212); an arrangement plate (409) is arranged on the top of the detection tool (401); a plurality of arrangement holes (410) are provided on the top of the arrangement plate (409) corresponding to the plurality of detection bases (403); a plurality of groups of pressure contact blocks (212) are provided on the bottom of the pressure plate (201) corresponding to the plurality of arrangement holes (410); a first mounting plate (213) is connected to one side of the first mounting seat (203); a mounting frame (213) is arranged on the side of the first mounting plate (213) away from the pressure plate (201). 4), a plurality of groups of mounting fixtures (215) are arranged on one side of the mounting frame (214), and a plurality of groups of X-ray detectors (216) are respectively installed in the plurality of groups of mounting fixtures (215) via connecting blocks (229); a defect detection module (217) is also arranged on one side of the first mounting plate (213), and the plurality of groups of X-ray detectors (216) are connected to the defect detection module (217) via signal lines (218); and a plurality of groups of first RFID writers (219) are arranged on the other side of the first mounting plate (213) corresponding to the plurality of groups of X-ray detectors (216).

5. The quality inspection device for packaged chips according to claim 1, characterized in that: A first through slot (106) is provided at the top of the workbench (101) corresponding to the load-bearing detection component, a second mounting seat (220) is provided at the bottom of the first through slot (106), a second mounting hole (221) is provided at the bottom of the second mounting seat (220), a first linear drive device (222) is provided at the bottom of the second mounting hole (221), a receiving plate (223) is connected to the push rod of the first linear drive device (222), and an anti-slip layer (223) is provided at the top of the receiving plate (223). 24), a groove is provided on one side of the first through slot (106), a first photoelectric sensor (225) is provided in the groove corresponding to the detection tooling (401), two groups of blocking through slots (226) are also provided on one side of the first through slot (106), a first connecting rod (227) is provided on one side of the second mounting seat (220), a blocking fork (228) is provided on one side of the first connecting rod (227), and the top of the blocking fork (228) is slidably inserted into the two groups of blocking through slots (226).

6. The device for detecting quality of packaged chips according to claim 2, characterized in that: A third mounting seat (302) is provided at the bottom of the second through slot (105), a third mounting hole (303) is provided at the bottom of the third mounting seat (302), a second linear drive device (304) is provided at the bottom of the third mounting hole (303), a push rod of the second linear drive device (304) passes through the third mounting hole (303) and is connected to the power-on plate (301), a plurality of through holes are provided at the top of the power-on plate (301) corresponding to the plurality of power supply interfaces (405), and power supply pins (305) are provided in each of the plurality of through holes. The power supply needle (305) can be inserted into the power supply interface (405), a groove is provided on one side of the second through slot (105), a second photoelectric sensor (307) is arranged in the groove, positioning grooves (308) are provided on both sides of the second through slot (105), and first electric telescopic rods (309) are provided on both sides of the third mounting seat (302), one end of the first electric telescopic rod (309) is connected to a positioning clamp (310), and one side of the positioning clamp (310) can be slidably arranged in the positioning slot (308).

7. The device for detecting quality of packaged chips according to claim 6, characterized in that: A closed box (311) is arranged at the top of the second through slot (105); an opening (312) is provided at the bottom of the closed box (311) corresponding to the detection tooling (401); two groups of limit plates (313) are arranged at the top of the opening (312); first slide rails (314) are arranged on both sides of the opening (312); first electric sliders (315) are slidably arranged on the two groups of the first slide rails (314); the bottom end of the gantry (316) is connected to the two groups of the first electric sliders (315); a second slide rail (317) is arranged on the gantry (316); a second electric slider (318) is slidably arranged on the second slide rail (317); a thermal imaging detection module (319) is arranged at the bottom of the second electric slider (318); and one side of the second electric slider (318) is connected to a second RFID writer (321) via two groups of second connecting rods (320).

8. The device for detecting quality of packaged chips according to claim 1, characterized in that: The sorting component comprises an RFID reader (501); a fourth mounting seat (502) is arranged on one side of the load detection component; a three-axis moving device (503) is arranged on the top of the fourth mounting seat (502); a second mounting plate (504) is arranged on the three-axis moving device (503); the RFID reader (501) is arranged at the bottom of the second mounting plate (504); a mounting clamp (505) is arranged on one side of the second mounting plate (504); a vacuum generator (506) is arranged on the mounting clamp (505); a mounting bracket (507) is arranged at the bottom of the mounting clamp (505); a suction nozzle (508) is arranged on the mounting bracket (507); the bottom end of the vacuum generator (506) is connected to the suction nozzle (508) via an air pipe (509); and a recovery conveyor belt (107) is arranged on one side of the workbench (101).

9. The device for detecting quality of packaged chips according to claim 1, characterized in that: The sorting component comprises an infrared detector (514); a fourth mounting seat (502) is arranged on one side of the load detection component; a three-axis moving device (503) is arranged on the top of the fourth mounting seat (502); a third slide rail (510) is arranged on one side of the fourth mounting seat (502); a third electric slider (511) is arranged on the third slide rail (510); a heightening frame (512) is arranged on the top of the third electric slider (511); a fifth mounting seat (513) is arranged on the top of the heightening frame (512); the infrared detector (514) is arranged on the fifth mounting seat (513); two groups of second electric telescopic rods (411) are arranged in each of the plurality of placement slots (402); the detector Limit connection plates (412) are arranged on both sides of the measuring base (403); the top ends of the two groups of the second electric telescopic rods (411) are respectively connected to the two groups of the limit connection plates (412); a second mounting plate (504) is arranged on the three-axis moving device (503); a mounting clamp (505) and a mounting bracket (507) are arranged on one side of the second mounting plate (504); a vacuum generator (506) is arranged on the mounting clamp (505); a suction nozzle (508) is arranged on the mounting bracket (507); the bottom end of the vacuum generator (506) is connected to the suction nozzle (508) via an air pipe (509); and a recovery conveyor belt (107) is arranged on the other side of the fourth mounting seat (502).

10. The method for detecting quality of packaged chips according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: placing the packaged chip (103) to be tested on the testing base (403) in the placement groove (402) at the top of the testing tool (401), so that the pins of the packaged chip (103) are inserted into the power supply hole (404) at the top of the testing base (403); Step 2: Start the transport track (104) to transport the inspection tool (401) with the packaged chip (103) to the position of the bearing inspection component. When the first photoelectric sensor (225) detects the inspection tool (401), start the first linear drive device (222) to push the receiving plate (223) and the blocking fork (228) to rise. The blocking fork (228) first intercepts the inspection tool (401) on the transport track (104) through the blocking slot (226). Then the receiving plate (223) rises and uses the anti-slip layer (224) on the top to lift the inspection tool (401). Start the hydraulic cylinder (202) to push the pressure plate (201) downward. The multiple groups of pressure contact blocks (212) at the bottom of the pressure plate (201) respectively contact the multiple packaged chips (103) and apply a set pressure. During the pressure application process, the pressure sensor (211) between the bearing plate (208) and the pressure plate (201) monitors the pressure value in real time. Step 3: After the pressure is applied, the load-bearing detection assembly is reset, the hydraulic cylinder (202) moves in the reverse direction to drive the pressure plate (201) to rise and reset, and at the same time, the first linear drive device (222) also drives the receiving plate (223) and the blocking fork (228) to descend, and the detection tooling (401) is put back on the transport track (104). The detection tooling (401) continues to move forward along the transport track (104), passing by the multiple sets of X-ray detectors (216) on the mounting frame (214) on one side of the first mounting plate (213). The X-ray detectors (216) 16) inspecting the packaged chip (103) after the load test to check whether there are cracks, bubble defects and abnormal solder joints, the X-ray detector (216) transmits the detected information to the defect detection module (217) through the signal line (218), and the defect detection module (217) analyzes and processes the information and writes the defect information into the RFID tag (407) in the detection base (403) below the corresponding packaged chip (103) through the first RFID writer (219) on the other side of the first mounting plate (213); Step 4: When the detection tooling (401) reaches the load detection assembly, the second photoelectric sensor (307) detects the detection tooling (401), and the second linear drive device (304) is started to push the power-on plate (301) to rise and lift the detection tooling (401). At the same time, the first electric telescopic rods (309) on both sides are started to drive the positioning claws (310) to position the detection tooling (401), ensuring that the power supply pin (305) at the top of the power supply plate (301) penetrates the power supply interface (405) at the bottom of the detection base (403). The power supply plate (301) continues to rise, and the detection tooling (401) is lifted to the closed box. (311) through the bottom opening (312), allowing the inspection tool (401) to enter the closed box (311), energizing the packaged chip (103) to generate heat, and then inspecting the circuit inside the packaged chip (103) through the thermal imaging inspection module (319), while gradually increasing the power of the packaged chip (103) for load inspection, and the second RFID writer (321) writes the detected defect information into the RFID tag (407) below the corresponding packaged chip (103). After the inspection is completed, the power-on board (301) is lowered and reset, and the inspection tool (401) is placed back on the transport track (104); Step 5: The inspection tool (401) arrives at the sorting component position, and the three-axis moving device (503) drives the second mounting plate (504) to move, so that the RFID reader (501) at the bottom is aligned with the RFID tag (407) on the inspection tool (401). The RFID reader (501) reads the information in the RFID tag (407) to determine whether the packaged chip (103) has defects. If a defective packaged chip (103) is detected, the three-axis moving device (503) continues to move to drive the mounting clamp (505) to move above the corresponding packaged chip (103), and the vacuum generator (506) on the mounting clamp (505) is started, and the suction nozzle (508) on the mounting bracket (507) generates negative pressure through the air pipe (509), sucking the defective packaged chip (103), and then transporting it to the recovery conveyor belt (107) on the side of the workbench (101), completing the sorting of the packaged chips (103).

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