Light-emitting module and lighting equipment

Abstract

The invention relates to a light-emitting module and lighting equipment, the light-emitting module comprises a substrate and a light-emitting assembly arranged on the substrate, a circuit layer is arranged between the substrate and the light-emitting assembly, and the circuit layer comprises jumper wires; the light-emitting assembly comprises a plurality of light-emitting units arranged in rows, and the multiple light-emitting units in each row are connected in series. In one row of light-emitting units located at the end of the light-emitting assembly, a wire passing gap is formed between the light-emitting units located at the end of the row and the substrate, and the jumper wire penetrates through the wire passing gap and is connected to another adjacent light-emitting unit. Therefore, the light-emitting module has the function of addressing and programming a single light-emitting unit, so that the control of the light-emitting units of the light-emitting module is diversified, and the light-emitting module can be applied to an ADB system.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a light-emitting module and a lighting device. Background Art

[0002] In recent years, in order to improve driving safety and reduce the probability of accidents, the China New Car Assessment Program (C-NCAP) advocates the use of intelligent adaptive driving beam headlight systems (Adaptive Driving Beam), referred to as ADB headlights. Its working principle is to control the matrix LED light source module to output light shapes for lighting through the ADB visual system. Usually, the matrix LED light source module is composed of multiple LED chips integrated on a substrate to form an LED chip matrix. The wiring is performed at the positions between the LED chips in adjacent rows and columns on the substrate, and the circuit can only be designed in multiple strings or multiple parallels, and output from both ends of the array; this chip and circuit arrangement does not have a single chip addressing function, is not suitable for intelligent control systems, and cannot be adapted to the ADB visual system. Summary of the invention

[0003] The embodiments of the present application provide a light-emitting module and a lighting device, which help to enable the light-emitting module to have the function of addressing and programming a single light-emitting unit, so that the control of the light-emitting unit of the light-emitting module has diversity and can be adapted to the ADB system.

[0004] In order to achieve the above object, according to a first aspect of the present application, a light emitting module is provided, comprising:

[0005] substrate;

[0006] A circuit layer, disposed on the substrate, including jumper wires;

[0007] The light-emitting component is arranged on a side of the circuit layer away from the substrate, and includes a plurality of light-emitting units arranged in rows. The plurality of light-emitting units in each row are connected in series. In a row of light-emitting units located at the end of the light-emitting component, a line-passing gap is formed between the light-emitting units located at the end of the row and the substrate. The jumper wire passes through the line-passing gap and is connected to another adjacent light-emitting unit.

[0008] Optionally, the circuit layer further includes a plurality of welding pad groups, each welding pad group corresponds to one of the light-emitting units, each welding pad group includes two welding pads arranged at intervals, and the two welding pads are respectively connected to the positive terminal and the negative terminal of the light-emitting unit;

[0009] The line gap is formed between the two pads connected to the corresponding light emitting units.

[0010] Optionally, the thickness of the solder pad is greater than or equal to the thickness of the jumper wire.

[0011] Optionally, the width of the line gap is greater than the width of the jumper wire, and the jumper wire is spaced apart from the welding pads on both sides of the line gap; and / or,

[0012] The width of the jumper wire is set to be greater than or equal to 60 μm; and / or,

[0013] The spacing between the jumper wire and the welding pads on both sides of the wire gap is set to be greater than or equal to 50 μm.

[0014] Optionally, the circuit layer further includes an internal connection line and a driving line, the internal connection line is arranged between the plurality of light-emitting units, and the driving line is arranged at an end of the light-emitting component;

[0015] The plurality of light-emitting units in each row are connected in series via the internal connecting wires;

[0016] In a row of the light emitting units located at an end of the light emitting assembly, the light emitting units located at the end of the row are connected to the driving line.

[0017] Optionally, the plurality of light-emitting units in each row are arranged in a row direction, and in a row of light-emitting units located at the end of the light-emitting component, a line gap is formed between each of the light-emitting units and the substrate, a jumper wire is passed through each of the line gaps, and each of the jumpers is respectively connected to another adjacent light-emitting unit.

[0018] Optionally, the plurality of light-emitting units in each row are arranged in a column direction, and in a row of light-emitting units located at the end of the light-emitting component, line gaps are formed between the light-emitting units located at opposite ends of the row and the substrate, and each of the line gaps is penetrated by the jumper wire, and each of the jumper wires is respectively connected to another adjacent light-emitting unit.

[0019] Optionally, the light-emitting unit includes a light-emitting device and a fluorescent layer, the light-emitting device is arranged on a side of the circuit layer away from the substrate, the side of the light-emitting device away from the circuit layer is set as a light-emitting side, and the fluorescent layer is arranged on the light-emitting side.

[0020] Optionally, the light-emitting unit further comprises a reflective film, and the reflective film is arranged on the peripheral side surfaces of the light-emitting device and the fluorescent layer.

[0021] Optionally, the light-emitting unit further includes a transflective film, which is sandwiched between the light-emitting device and the fluorescent layer, and transmits the light emitted from the light-emitting side and reflects the light excited by the fluorescent layer.

[0022] Optionally, the transflective film includes a plurality of stacked sub-film layers, and the refractive index of any sub-film layer is different from the refractive index of other sub-film layers, so that light of different wavelengths has a phase difference after being transmitted between the plurality of sub-film layers.

[0023] Optionally, the thickness of the sub-film layer is set to T1, wherein 20nm≤T1≤900nm; and / or,

[0024] The total thickness of the transflective film is set to T2, wherein 0.5 μm≤T2≤100 μm; and / or,

[0025] The number of the sub-membrane layers is set to N, wherein 100≤N≤500.

[0026] Optionally, the material of the sub-film layer includes one of ZrO2, SiO2, Ta2O5 and a combination thereof.

[0027] Optionally, the light emitting device includes a eutectic chip or a flip chip.

[0028] Optionally, the fluorescent layer includes one of a fluorescent glass sheet, a fluorescent film, a fluorescent glue layer and a fluorescent powder layer.

[0029] Optionally, the light emitting device is configured as a blue light LED chip;

[0030] The color of the fluorescent layer is configured to be one of green, yellow and red.

[0031] Optionally, the light-emitting module further includes a reflective layer, which is disposed on the substrate and covers gaps between circuits of the circuit layer; and / or the light-emitting module further includes an insulating layer, which covers the jumper wire.

[0032] Optionally, the light-emitting module further includes a retaining wall, wherein the retaining wall is disposed on the substrate and the retaining wall is disposed around the outer periphery of the light-emitting component.

[0033] Optionally, the light-emitting module further includes a packaging adhesive layer, the packaging adhesive layer includes a first packaging part and a second packaging part, the first packaging part is filled between two adjacent light-emitting units, and the second packaging part is filled between the outer peripheral side of the light-emitting component and the inner peripheral side of the retaining wall.

[0034] Optionally, the substrate includes a first surface and a second surface that are arranged opposite to each other;

[0035] The circuit layer is disposed on the first surface;

[0036] The light-emitting module further includes a heat-dissipating metal layer, and the heat-dissipating metal layer is arranged on the second surface. According to a second aspect of the present application, a lighting device is provided, including the light-emitting module described above.

[0037] In the light-emitting module of the embodiment of the present application, a light-emitting component is arranged on the substrate, and a circuit layer is arranged between the substrate and the light-emitting component, and the circuit layer includes a jumper wire; the light-emitting component includes a plurality of light-emitting units arranged in rows, and the plurality of light-emitting units in each row are connected in series, so that the plurality of light-emitting units in the row can be controlled simultaneously; at the same time, in a row of light-emitting units located at the end of the light-emitting component, a line-passing gap is formed between at least the light-emitting unit located at the end of the row and the substrate, and the jumper wire is passed through the line-passing gap and connected to another adjacent light-emitting unit, so that the light-emitting unit can be individually controlled through the jumper wire; in this way, the light-emitting module is helped to have the function of addressing and programming a single light-emitting unit, so that the control of the light-emitting unit of the light-emitting module is diverse and can be applicable to the ADB system.

[0038] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0040] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0041] Figure 1 is a plan view of a light emitting module provided in an exemplary embodiment of the present disclosure;

[0042] Figure 2 is a first wiring diagram of a light emitting module provided in an exemplary embodiment of the present disclosure;

[0043] Figure 3 is a second wiring diagram of a light emitting module provided in an exemplary embodiment of the present disclosure;

[0044] Figure 4 is a cross-sectional view of a light emitting unit provided in an exemplary embodiment of the present disclosure;

[0045] Figure 5 is a cross-sectional view of a light emitting module provided in an exemplary embodiment of the present disclosure;

[0046] Figure 6 is a schematic structural diagram of a light emitting unit provided in an exemplary embodiment of the present disclosure;

[0047] Figure 7 is a light path diagram of a light emitting unit provided in an exemplary embodiment of the present disclosure;

[0048] Figure 8 is a schematic structural diagram of a transflective film provided in an exemplary embodiment of the present disclosure;

[0049] Fig. 9 is a process diagram of a light emitting module provided in an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0051] The present application provides a light emitting module 100, see Figure 1 and Figure 4 , Figure 1 is a schematic plan view of a light emitting module 100 provided in an exemplary embodiment of the present disclosure; Figure 4 is a cross-sectional view of a light emitting unit 31 provided in an exemplary embodiment of the present disclosure.

[0052] The light-emitting module 100 includes a substrate 1, a circuit layer 2 and a light-emitting component 3; the circuit layer 2 is arranged on the substrate 1, and the circuit layer 2 includes a jumper wire 21; the light-emitting component 3 is arranged on the side of the circuit layer 2 away from the substrate 1, and includes a plurality of light-emitting units 31 arranged in rows, and the plurality of light-emitting units 31 in each row are connected in series, and in a row of the light-emitting units 31 located at the end of the light-emitting component 3, a line-passing gap a is formed between at least the light-emitting units 31 located at the end of the row and the substrate 1, and the jumper wire 21 passes through the line-passing gap a and is connected to another adjacent light-emitting unit 31.

[0053] It is known that the matrix light source module in the ADB (Adaptive Driving Beam) headlight is usually integrated with more than 100 light-emitting units 31. In the related art, taking the matrix light source module including multiple columns of light-emitting units 31 as an example, wiring is performed between two adjacent columns of light-emitting units 31, and the driving line 24 extends along the column direction, and multiple light-emitting units 31 in the same column are connected in series. The driving line 24 passes through the two ends of the corresponding column of light-emitting units 31 in the column direction, and the driving lines 24 of the two adjacent columns are arranged in parallel. However, this wiring method can only adjust the entire column, does not have the addressing function of a single light-emitting unit 31, is not suitable for intelligent control systems, and cannot be adapted to the ADB vision system.

[0054] In an embodiment of the present application, a light-emitting component 3 is arranged on the substrate 1, and a circuit layer 2 is arranged between the substrate 1 and the light-emitting component 3, and the circuit layer 2 includes a jumper wire 21; the light-emitting component 3 includes a plurality of light-emitting units 31 arranged in rows, and the plurality of light-emitting units 31 in each row are connected in series, so that the plurality of light-emitting units 31 in the row can be controlled simultaneously; at the same time, in a row of the light-emitting units 31 located at the end of the light-emitting component 3, a line-passing gap a is formed between the light-emitting units 31 located at the end of the row and the substrate 1, and the jumper wire 21 is passed through the line-passing gap a and connected to another adjacent light-emitting unit 31, so that the light-emitting unit 31 can be individually controlled through the jumper wire 21; in this way, it is helpful to enable the light-emitting module 100 to have the function of addressing and programming a single light-emitting unit 31, so that the control of the light-emitting unit 31 of the light-emitting module 100 is diverse and can be applicable to the ADB system.

[0055] The circuit layer 2 includes not only the jumper wire 21, but also an internal connecting wire 23 and a driving wire 24. The internal connecting wire 23 is arranged between the multiple light-emitting units 31, and the driving wire 24 is arranged at the end of the light-emitting component 3; the multiple light-emitting units 31 in each row are connected in series through the internal connecting wire 23; in a row of the light-emitting units 31 located at the end of the light-emitting component 3, the light-emitting units 31 located at the end of the row are connected to the driving wire 24.

[0056] The present application does not specifically limit the arrangement of the light emitting units 31 and the structure of the circuit layer 2. To facilitate understanding of the present application, examples of the arrangement of the light emitting units 31 and the structure of the circuit layer 2 are given below, and it should be understood that the present application is not limited thereto.

[0057] See also Figure 2 , Figure 2It is a first wiring diagram of the light-emitting module 100 provided in the exemplary embodiment of the present disclosure. In the first embodiment of the present application, the plurality of light-emitting units 31 in each row are arranged along the row direction, and in a row of the light-emitting units 31 located at the end of the light-emitting assembly 3, a wire-passing gap a is formed between each of the light-emitting units 31 and the substrate 1, and a jumper wire 21 is passed through each of the wire-passing gaps a, and each of the jumper wires 21 is respectively connected to another adjacent light-emitting unit 31.

[0058] Taking multiple rows of the light emitting units 31 as an example, the multiple rows of the light emitting units 31 are arranged side by side in the column direction, and each row of the light emitting units 31 includes multiple light emitting units 31 arranged side by side in the row direction. The multiple rows of the light emitting units 31 include a first row located at the end of the light emitting component 3, and a second row adjacent to the first row; each of the light emitting units 31 in the first row is provided with the line gap a between it and the substrate 1.

[0059] In the plurality of light emitting units 31 in the same row, the positive terminals 31a and the negative terminals 31b of the light emitting units 31 are arranged in the same order, and the positive terminals 31a and the negative terminals 31b of the light emitting units 31 in two adjacent rows are arranged in the same order. In the plurality of light emitting units 31 in the same row, the positive terminals 31a and the negative terminals 31b of two adjacent light emitting units 31 are connected through the internal connection line 23, so that the plurality of light emitting units 31 in the same row are connected in series.

[0060] The driving line 24 includes a plurality of driving sub-lines, which are arranged in rows upward to form driving sub-lines 100, driving sub-lines 101, driving sub-lines 102, ...; a plurality of jumper wires 21 are provided, and the plurality of jumper wires 21 are arranged in rows upward to form jumper wires 200, jumper wires 201, jumper wires 202, ...

[0061] In the first row, starting from the light-emitting unit 31 at one end thereof, the plurality of light-emitting units 31 are marked A1, A2, A3, ... in sequence, the positive terminal 31a of the light-emitting unit A1 is connected to the driving sub-line 100, the negative terminal 31b of the light-emitting unit A1 is connected to the driving sub-line 101, and the negative terminals 31b of the remaining light-emitting units A2, A3, ... are connected to the driving sub-line 102, the driving sub-line 103, ... in sequence.

[0062] The jumper wire 21 is passed through the wire gap a and connected to the corresponding light emitting unit 31 in the second row. In the second row, starting from the light emitting unit 31 at one end thereof, the plurality of light emitting units 31 are marked as B1, B2, B3, ... in sequence, the positive terminal 31a of the light emitting unit B1 is connected to the jumper wire 200, and the positive terminal 31a of the light emitting unit B2 is connected to the jumper wire 201, ...

[0063] Based on the light-emitting module 100 provided in the first embodiment of the present application, the present application provides an addressing method for the light-emitting unit 31 as follows:

[0064] The driving sub-line 100 is configured as a high level common terminal H;

[0065] Through the driving sub-line 100 and the driving sub-line 101, the light-emitting unit A1 can be individually addressed, and the lighting and extinguishing of the light-emitting unit A1 can be individually controlled;

[0066] Through the driving sub-line 101 and the driving sub-line 102, the light-emitting unit A2 can be individually addressed, and the lighting and extinguishing of the light-emitting unit A2 can be individually controlled;

[0067] The light emitting unit A1 and the light emitting unit A2 can be addressed in series through the driving sub-line 100 and the driving sub-line 102, and the light emitting unit A1 and the light emitting unit A2 can be controlled to be turned on and off at the same time.

[0068] By using the above addressing method, any combination of the light emitting units 31 in the first row can be controlled.

[0069] The jumper wire 200 is configured as a high level common terminal H;

[0070] Through the jumper wire 200 and the jumper wire 201, the light emitting unit B1 can be individually addressed, and the light emitting unit B1 can be individually controlled to be turned on and off;

[0071] Through the jumper wires 201 and 202, the light-emitting unit B2 can be individually addressed, and the light-emitting unit B2 can be individually controlled to be turned on and off;

[0072] Through the jumper wires 200 and 202, the light-emitting unit B1 and the light-emitting unit B2 can be addressed in series, and the light-emitting unit B1 and the light-emitting unit B2 can be controlled to be turned on and off at the same time.

[0073] By using the above addressing method, any combination of the light emitting units 31 in the second row can be controlled.

[0074] See also Figure 3 , Figure 3 is a second wiring diagram of the light-emitting module 100 provided in the exemplary embodiment of the present disclosure. In the second embodiment of the present application, the plurality of light-emitting units 31 in each row are arranged in a column direction, and in a row of the light-emitting units 31 located at the end of the light-emitting assembly 3, the light-emitting units 31 located at opposite ends of the row are provided with the line-passing gap a and the substrate 1, and each of the line-passing gaps a is penetrated by the jumper wire 21, and each of the jumper wires 21 is respectively connected to another adjacent light-emitting unit 31.

[0075] Taking multiple columns of the light-emitting units 31 as an example, the multiple columns of the light-emitting units 31 are arranged side by side in the row direction, and each column of the light-emitting units 31 includes a plurality of the light-emitting units 31 arranged side by side in the column direction. The multiple columns of the light-emitting units 31 include a first column located at the end of the light-emitting component 3, and a second column adjacent to the first column; the line-crossing gap a is formed between the light-emitting units 31 at opposite ends of the first column and the substrate 1; the line-crossing gap a is formed between the light-emitting units 31 at opposite ends of the second column and the substrate 1.

[0076] In the plurality of light emitting units 31 in the same column, the positive terminals 31a and the negative terminals 31b of the light emitting units 31 are arranged in different orders, and the positive terminals 31a and the negative terminals 31b of the light emitting units 31 in two adjacent columns are arranged in the same order. In the plurality of light emitting units 31 in the same column, the positive terminals 31a and the negative terminals 31b of two adjacent light emitting units 31 are connected through the internal connecting line 23, so that the plurality of light emitting units 31 in the same column are connected in series.

[0077] The driving line 24 includes a plurality of driving sub-lines, including a driving sub-line 300, a driving sub-line 301, a driving sub-line 302, a driving sub-line 303, a driving sub-line 304, a driving sub-line 305, a driving sub-line 306, a driving sub-line 307, a driving sub-line 308, ...; a plurality of jumper wires 21 are provided, including a jumper wire 400, a jumper wire 401, a jumper wire 402, a jumper wire 403, ...

[0078] In the first column, starting from the light-emitting unit 31 at one end thereof, the plurality of light-emitting units 31 are sequentially marked as C1, C2, ..., Cn-1, Cn, the positive terminal 31a of the light-emitting unit C1 is connected to the driving sub-line 300, the negative terminal 31b of the light-emitting unit C1 is connected to the driving sub-line 301, the positive terminal 31a of the light-emitting unit Cn is connected to the driving sub-line 303, and the negative terminal 31b of the light-emitting unit Cn is connected to the driving sub-line 304.

[0079] In the second column, starting from the light emitting unit 31 at one end thereof, the plurality of light emitting units 31 are marked as D1, D2, ..., Dn-1, Dn in sequence, the positive terminal 31a of the light emitting unit D1 is connected to the driving sub-line 305, the negative terminal 31b of the light emitting unit D1 is connected to the driving sub-line 306, the positive terminal 31a of the light emitting unit Dn is connected to the driving sub-line 307, and the negative terminal 31b of the light emitting unit Dn is connected to the driving sub-line 308. In addition, in the first column and the second column, the driving sub-line 303 and the driving sub-line 307 are arranged in series.

[0080] The jumper wire 21 is inserted through the line gap a and connected to the adjacent light emitting unit 31. In the first column, the jumper wire 400 is inserted through the line gap a and connected to the negative terminal 31b of the light emitting unit C2, and the jumper wire 401 is inserted through the line gap a and connected to the positive terminal 31a of the light emitting unit Cn-1; in the second column, the jumper wire 403 is inserted through the line gap a and connected to the negative terminal 31b of the light emitting unit D2, and the jumper wire 401 is inserted through the line gap a and connected to the positive terminal 31a of the light emitting unit Dn-1.

[0081] Based on the light-emitting module 100 provided in the second embodiment of the present application, the present application provides an addressing method for the light-emitting unit 31 as follows:

[0082] The driving sub-line 300 is configured as a high level common terminal H;

[0083] The light emitting unit C1 can be individually addressed through the driving sub-line 300 and the driving sub-line 301, and the light emitting unit C1 can be individually controlled to be turned on and off;

[0084] The light emitting unit C2 can be addressed individually through the jumper wire 400 and the driving sub-wire 301, and the light emitting unit C2 can be individually controlled to be turned on and off;

[0085] The light emitting unit C3 can be individually addressed through the jumper wire 400 and the jumper wire 401, and the light emitting unit C3 can be individually controlled to be turned on and off;

[0086] The light-emitting unit Cn-1 can be individually addressed through the driving sub-line 303 and the jumper line 401, and the light-emitting unit Cn-1 can be individually controlled to be turned on and off;

[0087] The light emitting unit Cn can be addressed individually through the driving sub-line 303 and the driving sub-line 304, and the lighting and extinguishing of the light emitting unit Cn can be controlled individually;

[0088] The light-emitting unit Dn can be individually addressed through the driving sub-line 304 and the driving sub-line 308, and the lighting and extinguishing of the light-emitting unit Dn can be individually controlled;

[0089] In this way, by connecting the driving sub-wires and the jumper wires 21 in sequence, it is possible to control any combination of the light-emitting units 31 in the light-emitting assembly 3 .

[0090] The present application does not impose any specific restrictions on the material of the substrate 1. The material of the substrate 1 satisfies the requirement that the thermal conductivity is greater than 150W / mK and the surface temperature resistance is greater than 290 degrees. The substrate 1 also needs to be suitable for processes such as hot pressing eutectic, flip-chip soldering and face-up wire bonding, such as glass materials or high thermal conductivity ceramic materials.

[0091] See also Figure 4 The circuit layer 2 also includes a plurality of welding pad groups 22, each welding pad group 22 corresponds to one of the light-emitting units 31, and each welding pad group 22 includes two welding pads 221 arranged at intervals, and the two welding pads 221 are respectively connected to the positive terminal 31a and the negative terminal 31b of the light-emitting unit 31; the line gap a is formed between the two welding pads 221 connected to the corresponding light-emitting unit 31.

[0092] That is to say, in this embodiment, the circuit layer 2 also includes a welding pad group 22 arranged on the substrate 1, and each of the welding pad groups 22 includes two welding pads 221 arranged at intervals. When the light-emitting unit 31 is set on the substrate 1, the positive terminal 31a and the negative terminal 31b of the light-emitting unit 31 are respectively welded to the two welding pads 221, so that the two welding pads 221 and the substrate 1 and the bottom of the light-emitting unit 31 enclose the line gap a.

[0093] Typically, the light-emitting unit 31 is provided with a positive electrode pad or a positive electrode welding metal layer to form the positive terminal 31a, and the light-emitting unit 31 is provided with a negative electrode pad or a negative electrode welding metal layer to form the negative terminal 31b; that is, the positive terminal 31a and the negative terminal 31b generally protrude from the bottom of the light-emitting unit 31, and after the positive terminal 31a and the negative terminal 31b are welded to the corresponding welding pad 221, the actual depth of the line gap a is greater than the thickness of the welding pad 221.

[0094] In an embodiment of the present application, the thickness of the welding pad 221 is set to be greater than or equal to the thickness of the jumper wire 21; on the one hand, it can ensure that when the jumper wire 21 passes through the wire gap a, the jumper wire 21 will not interfere with the corresponding light-emitting unit 31; on the other hand, it can ensure that the positive terminal 31a and the negative terminal 31b of the light-emitting unit 31 will not have poor adhesion during welding.

[0095] Following the above “the line gap a is formed between the two welding pads 221 connected to the corresponding light-emitting unit 31”, that is, the jumper wire 21 is located between the two welding pads 221 connected to the corresponding light-emitting unit 31, and the arrangement of the two welding pads 221 of each welding pad group 22 along the row direction is taken as an example for explanation.

[0096] In the present application, the width W1 of the line-passing gap a is greater than the width W2 of the jumper wire 21, and the jumper wire 21 is spaced apart from the soldering pads 221 on both sides of the line-passing gap a; in this way, it is possible to ensure that the jumper wire 21 passes through the line-passing gap a smoothly and does not contact the soldering pads 221 to cause a short circuit.

[0097] In the present application, the width W2 of the jumper wire 21 is set to be greater than or equal to 60μm; it can be known that, when the current and time are constant, the greater the resistance, the greater the heat generated; therefore, in order to reduce the heat generated by the circuit, it is necessary to reduce the resistance of the jumper wire 21; at the same time, since at the same length, the larger the cross-sectional area of ​​the jumper wire 21, the smaller the resistance of the jumper wire 21, so the width W2 of the jumper wire 21 can be set wider while meeting the space requirements; by setting the width W2 of the jumper wire 21 to be greater than or equal to 60μm, the heat dissipation requirements of the jumper wire 21 can be met under normal use.

[0098] In the present application, the spacing H1 between the jumper wire 21 and the soldering pads 221 on both sides of the line gap a is set to be greater than or equal to 50μm; it can be known that there will be printing tolerances when printing metal wires on the substrate 1 to form circuits. In order to avoid contact between the jumper wire 21 and the soldering pads 221 due to printing process errors, the spacing H1 between the jumper wire 21 and the soldering pads 221 on both sides of the line gap a is set to be greater than or equal to 50μm, which can avoid the jumper wire 21 from short circuiting due to contact with the soldering pads 221.

[0099] It should be noted that the above three technical features can be set one by one, two by two, or all at the same time; specifically, in one embodiment, the above three technical features are set at the same time, which not only makes the arrangement of the jumper wire 21 more reasonable and avoids the short circuit of the jumper wire 21 due to contact with the welding pad 221, but also can meet the heat dissipation requirements of the jumper wire 21.

[0100] The present application does not impose any specific restrictions on the material of the circuit layer 2. The circuit layer 2 can be made of any material with good electrical and thermal conductivity, such as copper foil or other alloy materials.

[0101] Furthermore, the solder pad 221 and the jumper wire 21 may be plated with copper or gold. Since the solder pad 221 and the jumper wire 21 have different thicknesses, the solder pad 221 and the jumper wire 21 may be plated separately.

[0102] Based on the above statement that "at the same length, the larger the cross-sectional area of ​​the jumper wire 21, the smaller the resistance of the jumper wire 21", it can be understood by the same logic that at the same length, the larger the cross-sectional area of ​​the positive terminal 31a and the negative terminal 31b, the smaller the resistance of the positive terminal 31a and the negative terminal 31b; therefore, while meeting the space requirements, the width W3 of the positive terminal 31a and the negative terminal 31b can be set wider; by setting the width W3 of the positive terminal 31a and the negative terminal 31b to be greater than or equal to 110μm, the heat dissipation requirements of the positive terminal 31a and the negative terminal 31b can be met under normal use.

[0103] Meanwhile, in order to ensure the reliability of welding of the light emitting unit 31 , the thickness of the positive terminal 31 a and the negative terminal 31 b is set to 3-4 μm.

[0104] Furthermore, based on the above-mentioned “the width W1 of the line gap a is greater than the width W2 of the jumper wire 21”, in order to ensure the reliability of the welding of the light-emitting unit 31, the size of the positive terminal 31a and the negative terminal 31b should be greater than the size of the corresponding welding pad 221; in order to prevent the light-emitting unit 31 from scratching the jumper wire 21 during welding, it is necessary to set the distance H2 between the positive terminal 31a and the negative terminal 31b to be greater than the width W2 of the jumper wire 21.

[0105] In the embodiment of the present application, the light-emitting unit 31 includes a light-emitting device 311 and a fluorescent layer 312. The light-emitting device 311 is arranged on the side of the circuit layer 2 away from the substrate 1, and the side of the light-emitting device 311 away from the circuit layer 2 is set as the light-emitting side, and the fluorescent layer 312 is set on the light-emitting side. The light emitted from the light-emitting device 311 on its light-emitting side is transmitted to the fluorescent layer 312, and the fluorescent material of the fluorescent layer 312 radiates light after being excited by the light.

[0106] The present application does not impose any specific limitation on the type of the light emitting device 311 . The light emitting device 311 may be a eutectic chip or a flip chip.

[0107] The present application does not specifically limit the form of the fluorescent layer 312 , and the fluorescent layer 312 includes one of a fluorescent glass sheet, a fluorescent film, a fluorescent glue layer, or a fluorescent powder layer.

[0108] Generally, in a matrix light source module of an ADB vehicle headlight, a large number of the light emitting units 31 need to be integrated in a limited space, so the distance between adjacent light emitting units 31 is very small, resulting in serious crosstalk between adjacent light emitting units 31 .

[0109] In one embodiment of the present application, please refer to Figures 5 to 7The light-emitting unit 31 further includes a reflective film 313, which is arranged on the peripheral side of the light-emitting device 311 and the fluorescent layer 312; thus, on the one hand, the light emitted from the side of the light-emitting device 311 is reflected by the reflective film 313 to the front of the light-emitting device 311, thereby increasing the light transmitted to the fluorescent layer 312, thereby increasing the light excited by the fluorescent layer 312, and improving the front light output of the light-emitting unit 31; on the other hand, the light emitted from the side of the fluorescent layer 312 is reflected by the reflective film 313, which not only increases the front light output of the light-emitting unit 31, but also The light emission angle of the light emitting device 311 is reduced; at the same time, the external light is also reflected by the reflective film 313, reducing the influence of the external light on the light emitting device 311, avoiding the problem of cross-light between adjacent light emitting units 31, and improving the contrast of the light emitting component 3; since the setting of the reflective film 313 can solve the problem of cross-light between adjacent light emitting units 31, when a part of the matrix light source module of the ADB headlight is controlled to be dimmed, the dimmed area will not be affected by the lit light emitting unit 31, thereby realizing the dark area control of the matrix light source module of the ADB headlight.

[0110] The present application does not impose any specific restrictions on the material of the reflective film 313, and the reflective film 313 includes but is not limited to metal materials with high reflectivity such as gold, silver, and aluminum. In addition, the reflective film 313 is set as a single-layer metal film, and the present application does not impose any specific restrictions on the thickness of the reflective film 313, and the thickness of the reflective film 313 is set to 20 to 900 nm.

[0111] In order to further improve the front light emitting effect of the light emitting unit 31, in one embodiment of the present application, please refer to Figures 5 to 7 The light emitting unit 31 further includes a transflective film 314, which is sandwiched between the light emitting device 311 and the fluorescent layer 312. The transflective film 314 transmits the light emitted from the light emitting side and reflects the light excited by the fluorescent layer 312. In other words, the light emitted by the light emitting unit 31 transmits the transflective film 314, and the light radiated by the fluorescent layer 312 after being excited is reflected by the transflective film 314 when it is emitted to the transflective film 314, thereby reducing the heat loss of the light inside the light emitting unit 31, thereby increasing the front light output of the light emitting unit 31, and improving the front light output effect of the light emitting unit 31.

[0112] In the embodiment of the present application, the light emitting device 311 is configured as a blue LED chip, and the color of the fluorescent material of the fluorescent layer 312 includes but is not limited to one of green, red or yellow. The transflective film 314 is configured as a transflective film 314 of a specific wavelength band, that is, the short-wavelength light emitted by the light emitting device 311 can pass through the transflective film 314 to reach the fluorescent sheet, and the light radiated by the fluorescent sheet after being excited is a long-wavelength light, and the long-wavelength light emitted by the fluorescent sheet to the transflective film 314 is reflected by the transflective film 314.

[0113] The present application does not impose any specific restrictions on the structure of the transflective film 314. Figure 8 , the transflective film 314 includes a plurality of stacked sub-film layers 3141, and the refractive index of any of the sub-film layers 3141 is different from the refractive index of the other sub-film layers 3141, so that light with different wavelengths has a phase difference after being transmitted between the plurality of the sub-film layers 3141. In other words, the transflective film 314 is a coating layer made using the principle of a short-wave dichroic mirror; by stacking a plurality of the sub-film layers 3141 with different refractive indices, a phase difference exists between the film layers for different wavelengths, and by stacking a plurality of the sub-film layers 3141, a short-pass filter film can be formed. For example, the transflective film 314 formed by stacking a plurality of the sub-film layers 3141 can transmit blue light with a wavelength less than 500nm and reflect other light with a wavelength greater than 500nm.

[0114] In the present application, the thickness of the sub-film layer 3141 is set to T1, where 20nm≤T1≤900nm; that is, the transmission wavelength of the formed short-pass filter film can be adjusted by adjusting the thickness of each sub-film layer 3141.

[0115] In the present application, the total thickness of the transflective film 314 is set to T2, wherein 0.5 μm≤T2≤100 μm; that is, the transmission wavelength of the formed short-pass filter film can be adjusted by adjusting the total thickness of the transflective film 314 .

[0116] In the present application, the number of the sub-film layers 3141 is set to N, where 100≤N≤500; that is, the transmission wavelength of the formed short-pass filter film can be adjusted by adjusting the number of stacked sub-film layers 3141.

[0117] It should be noted that the above three technical features can be set one by one, two by two, or all at the same time; specifically, in one embodiment, the above three technical features are set all at the same time, that is, the thickness of the sub-film layer 3141, the number of the sub-film layers 3141 and the total thickness of the transflective film 314 can be adjusted to enable the transflective film 314 to reach a preset transmission wavelength.

[0118] Meanwhile, the present application does not limit the material of the sub-film layer 3141. The material of the sub-film layer 3141 includes but is not limited to one of ZrO2, SiO2, Ta2O5 and a combination thereof.

[0119] See also Figure 4 , the light emitting module 100 further includes a reflective layer 4a, which is disposed on the substrate 1 and covers the gaps between the circuits of the circuit layer 2; and / or, the light emitting module 100 further includes an insulating layer 4b, which covers the jumper wire 21. That is, the reflective layer 4a can be disposed on the substrate 1 to reflect the light emitted from the light emitting unit 31 to the substrate 1, thereby improving the light emitting effect of the light emitting component 3; the insulating layer 4b can also be disposed on the substrate 1, and the jumper wire 21 can be covered by the insulating layer 4b, so that the jumper wire 21 is insulated from the pad 221 to prevent the jumper wire 21 from short-circuiting; the reflective layer 4a and the insulating layer 4b can also be disposed at the same time.

[0120] In one embodiment of the present application, a high temperature resistant white oil insulation layer is provided on the substrate 1, and the white oil insulation layer covers the gaps between the circuits of the circuit layer 2 and covers the jumper wire 21; thus, the white oil insulation layer can be used as both the reflective layer 4a and the insulation layer 4b.

[0121] See also Figure 5 The light emitting module 100 further includes a retaining wall 5 , which is disposed on the substrate 1 and is arranged around the outer periphery of the light emitting component 3 .

[0122] In one embodiment of the present application, the light-emitting module 100 also includes a packaging glue layer 6, and the packaging glue layer 6 includes a first packaging part 61 and a second packaging part 62, the first packaging part 61 is filled between two adjacent light-emitting units 31, and the second packaging part 62 is filled between the outer peripheral side of the light-emitting component 3 and the inner peripheral side of the retaining wall 5.

[0123] The light emitting assembly 3 is encapsulated by the retaining wall 5 and the first encapsulation part 61 to protect the light emitting assembly 3 and extend the service life of the light emitting module 100. Meanwhile, the second encapsulation part 62 fills the gap between two adjacent light emitting units 31, thereby improving the stability of the light emitting units 31.

[0124] In one embodiment of the present application, the substrate 1 includes a first surface 11 and a second surface 12 arranged opposite to each other; the circuit layer 2 is arranged on the first surface 11; the light-emitting module 100 also includes a heat dissipation metal layer 7, and the heat dissipation metal layer 7 is arranged on the second surface 12.

[0125] Based on the light emitting component 3 provided in the embodiment of the present application, a manufacturing process of the light emitting component 3 is also provided. Fig. 9 , Fig. 9 1 is a process diagram of the light emitting module 100 provided in an exemplary embodiment of the present disclosure.

[0126] Step S10: providing a substrate 1, and printing the circuit layer 2 on the substrate 1;

[0127] Step S20: welding a plurality of light emitting devices 311 onto the circuit layer 2, and arranging the plurality of light emitting devices 311 in an array;

[0128] Step S30: providing a fluorescent sheet, and depositing the transflective film 314 on one side surface of the fluorescent sheet;

[0129] Step S40: cutting the fluorescent sheet according to the size of a single light-emitting device 311 to form a plurality of fluorescent layers 312;

[0130] Step S50: attaching the fluorescent layer 312 to the light-emitting side of the light-emitting device 311 , wherein the transflective film 314 is located between the fluorescent layer 312 and the light-emitting device 311 ;

[0131] Step S60: vapor-depositing a reflective film 313 on the surrounding side surfaces of the fluorescent layer 312 and the light-emitting device 311 to form a light-emitting unit 31;

[0132] Step S70: a retaining wall 5 is provided on the substrate 1, wherein the retaining wall 5 is provided around the periphery of the array of light emitting devices 311;

[0133] Step S80: Disposing a packaging glue layer 6 on the substrate 1, wherein the packaging glue layer 6 includes a first packaging portion 61 and a second packaging portion 62, the first packaging portion 61 is filled between two adjacent light-emitting units 31, and the second packaging portion 62 is filled between the outer peripheral side of the light-emitting component 3 and the inner peripheral side of the retaining wall 5.

[0134] The embodiment of the present application further provides a lighting device. The lighting device includes a light emitting module 100. It should be noted that the light emitting module 100 is configured as the light emitting module 100 described above, that is, the light emitting module 100 includes all technical features of the light emitting module 100 described above, and the lighting device includes all embodiments of the light emitting module 100 described above.

[0135] The lighting equipment includes but is not limited to ADB headlights, smart furniture lamps or surgical lamps.

[0136] Taking the ADB headlight as an example, the ADB headlight also includes an ADB vision system, which is electrically connected to the light-emitting module 100. In the light-emitting module 100, in a row of the light-emitting units 31 located at the end of the light-emitting component 3, a line-passing gap a is formed between at least the light-emitting unit 31 located at the end of the row and the substrate 1. The jumper wire 21 passes through the line-passing gap a and is connected to another adjacent light-emitting unit 31. By connecting the jumper wire 21 to the ADB vision system, the ADB vision system can independently control the light-emitting unit 31, and the ADB vision system can address and program a single light-emitting unit 31.

[0137] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0138] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0139] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0140] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A light emitting module, characterized in that: include: substrate; A circuit layer, disposed on the substrate, including jumper wires; The light-emitting component is arranged on a side of the circuit layer away from the substrate, and includes a plurality of light-emitting units arranged in rows. The plurality of light-emitting units in each row are connected in series. In a row of light-emitting units located at the end of the light-emitting component, a line-passing gap is formed between the light-emitting units located at the end of the row and the substrate. The jumper wire passes through the line-passing gap and is connected to another adjacent light-emitting unit.

2. The light emitting module according to claim 1, characterized in that: The circuit layer further includes a plurality of pad groups, each of which corresponds to one of the light-emitting units, and each of which includes two pads spaced apart from each other, and the two pads are respectively connected to the positive terminal and the negative terminal of the light-emitting unit; The line gap is formed between the two pads connected to the corresponding light emitting units.

3. The light emitting module according to claim 2, characterized in that: The thickness of the welding pad is greater than or equal to the thickness of the jumper wire.

4. The light emitting module according to claim 2, characterized in that: The width of the line gap is greater than the width of the jumper wire, and the jumper wire is spaced apart from the pads on both sides of the line gap; and / or, The width of the jumper wire is set to be greater than or equal to 60 μm; and / or, The spacing H1 between the jumper wire and the pads on both sides of the line gap is set to be greater than or equal to 50 μm.

5. The light emitting module according to claim 1, characterized in that: The circuit layer further includes an internal connection line and a driving line, wherein the internal connection line is arranged between the plurality of light-emitting units, and the driving line is arranged at an end of the light-emitting component; The plurality of light-emitting units in each row are connected in series via the internal connecting wires; In a row of the light emitting units located at an end of the light emitting assembly, the light emitting units located at the end of the row are connected to the driving line.

6. The light emitting module according to claim 1, characterized in that: The multiple light-emitting units in each row are arranged in a row direction. In a row of light-emitting units located at the end of the light-emitting component, a line gap is formed between each light-emitting unit and the substrate, and a jumper wire is passed through each line gap. Each jumper wire is respectively connected to another adjacent light-emitting unit.

7. The light emitting module according to claim 1, characterized in that: The multiple light-emitting units in each row are arranged in a column direction. In a row of light-emitting units located at the end of the light-emitting component, line gaps are formed between the light-emitting units located at opposite ends of the row and the substrate, and each of the line gaps is penetrated by a jumper wire, and each of the jumpers is respectively connected to another adjacent light-emitting unit.

8. The light emitting module according to claim 1, characterized in that: The light-emitting unit includes a light-emitting device and a fluorescent layer. The light-emitting device is arranged on a side of the circuit layer away from the substrate, the side of the light-emitting device away from the circuit layer is arranged as a light-emitting side, and the fluorescent layer is arranged on the light-emitting side.

9. The light emitting module according to claim 8, characterized in that: The light emitting unit further includes a reflective film, and the reflective film is arranged on the peripheral side surfaces of the light emitting device and the fluorescent layer.

10. The light emitting module according to claim 8, characterized in that: The light-emitting unit further includes a transflective film, which is sandwiched between the light-emitting device and the fluorescent layer. The transflective film transmits the light emitted from the light-emitting side and reflects the light excited by the fluorescent layer.

11. The light emitting module according to claim 10, characterized in that: The transflective film includes a plurality of stacked sub-film layers, and the refractive index of any of the sub-film layers is different from the refractive index of the other sub-film layers, so that light of different wavelengths has a phase difference after being transmitted between the plurality of sub-film layers.

12. The light emitting module according to claim 11, characterized in that: The thickness of the sub-film layer is set to T1, wherein 20nm≤T1≤900nm; and / or, The total thickness of the transflective film is set to T2, wherein 0.5 μm≤T2≤100 μm; and / or, The number of the sub-membrane layers is set to N, wherein 100≤N≤500.

13. The light emitting module according to claim 11, characterized in that: The material of the sub-film layer includes one of ZrO2, SiO2, Ta2O5 and a combination thereof.

14. The light emitting module according to claim 8, characterized in that: The light emitting device includes a eutectic chip or a flip chip.

15. The light emitting module according to claim 8, characterized in that: The fluorescent layer includes one of a fluorescent glass sheet, a fluorescent film, a fluorescent glue layer and a fluorescent powder layer.

16. The light emitting module according to claim 8, characterized in that: The light emitting device is configured as a blue light LED chip; The color of the fluorescent layer is configured to be one of green, yellow and red.

17. The light emitting module according to claim 1, characterized in that: The light-emitting module further includes a reflective layer, which is disposed on the substrate and covers the gaps between the circuits of the circuit layer; and / or the light-emitting module further includes an insulating layer, which covers the jumper wire.

18. The light emitting module according to claim 1, characterized in that: The light-emitting module further comprises a retaining wall, wherein the retaining wall is arranged on the substrate and the retaining wall is arranged around the outer peripheral side of the light-emitting component.

19. The light emitting module according to claim 18, characterized in that: The light-emitting module also includes a packaging glue layer, which includes a first packaging part and a second packaging part. The first packaging part is filled between two adjacent light-emitting units, and the second packaging part is filled between the outer peripheral side of the light-emitting component and the inner peripheral side of the retaining wall.

20. The light emitting module according to claim 1, characterized in that: The substrate comprises a first surface and a second surface which are arranged opposite to each other; The circuit layer is disposed on the first surface; The light emitting module further includes a heat dissipation metal layer, and the heat dissipation metal layer is disposed on the second surface.

21. A lighting device, characterized in that: A light-emitting module comprising any one of claims 1-20.

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