LED light-emitting panel based on COB packaging and manufacturing method thereof

Abstract

The invention discloses an LED light-emitting panel based on COB packaging and a manufacturing method thereof.The LED light-emitting panel is simple in structure and easy to implement, LED light-emitting unit areas can be conveniently defined through arrangement of unit peripheral wall bodies of first insulating material layers, independent color mixing spaces are formed, light color crosstalk between the LED light-emitting unit areas is avoided, and practicability is good; a first protruding part is arranged in the unit peripheral wall body part and used for separating two bonding pads of the same LED chip and supporting the bottom of the LED chip conveniently, the separating and supporting effects are achieved, welding flux on the two bonding pads of the same LED chip is not prone to being short-circuited together due to pressure when the LED chip is welded, practicability is good, and the service life of the LED chip is prolonged. The welding flux is easy to fill the gap between the bonding pad and the first lug boss and expel air between the bonding pad and the first lug boss, so that the surface-mount welding effect is improved, and the practicability is good; the second protruding parts are used for separating the bonding pads between the adjacent LED chips, in this way, during implementation, welding flux on the bonding pads between the adjacent LED chips is not prone to being short-circuited together due to pressure, the quality of finished products can be guaranteed, and practicability is good.

Description

Technical Field

[0001] The invention relates to an LED light-emitting panel based on COB packaging and a manufacturing method thereof. Background Art

[0002] Mini LED displays generally use COB packaging technology; the existing Mini LED COB packaging technology has the advantages of high efficiency and suitability for mass production, but there are still defects such as light and color crosstalk, pixel color deficiency, and display screen "caterpillars" that affect the improvement of product quality. The reason for the product defects is that the LED chip does not provide the independent pixels composed of LED RGB three-color chips with corresponding independent color mixing space during the COB packaging process, which will be affected by the surrounding pixel light-emitting chips participating in the color mixing; secondly, there are residual flux residues and residual gases at the bottom of the LED chip after COB packaging. When the LED chip is not tightly sealed around the periphery, the LED chip electrode is easily corroded and damaged, resulting in defective products. Therefore, it is necessary to solve the above problems. Summary of the invention

[0003] The present invention overcomes the shortcomings of the above-mentioned technology and provides an LED light-emitting panel based on COB packaging and a manufacturing method thereof.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A COB-based LED light-emitting panel includes a PCB board 1, on which a circuit layer 2 and a first insulating material layer 3 are provided, wherein the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing a LED light-emitting unit area, wherein the circuit layer 2 is provided with a plurality of solder pads 21 located in the area enclosed by the unit peripheral wall portion 31 for electrically connecting a plurality of LED chips 4, and wherein the first insulating material layer 3 also includes a plurality of solder pads 21 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two solder pads 21 of the same LED chip 4 and facilitating electrical connection. The bottom of the LED chip 4 supports the first protrusion 32 thereon, the top height of the first protrusion 32 is higher than the top height of the soldering pad 21, and the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall portion 31. The first insulating material layer 3 also includes a plurality of second protrusions 33 located in the area surrounded by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 and / or connected to the first protrusion 32 for separating the soldering pads 21 between adjacent LED chips 4, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall portion 31.

[0006] Preferably, the first insulating material layer 3 further includes a first connecting portion 301 for connecting a plurality of adjacent unit peripheral wall portions 31 together.

[0007] Preferably, a connection hole 11 connected to the first connection portion 301 is provided on the back side of the PCB board 1 , and the connection hole 11 is filled with a second connection portion 302 connected to the first connection portion 301 .

[0008] Preferably, the connection hole 11 on the back side of the PCB board 1 is a countersunk hole.

[0009] Preferably, the first insulating material layer 3 is an insulating plastic layer.

[0010] Preferably, the first insulating material layer 3 is made of black PPA material.

[0011] Preferably, the number of the solder pads 21 in the area of ​​the outer wall portion 31 of each unit is 6 and distributed in 3*2 horizontal rows, and a flip-chip LED chip is connected between the left and right solder pads 21 in each horizontal row.

[0012] This case also protects a method for manufacturing an LED light-emitting panel based on COB packaging, which includes the following steps:

[0013] Step 1: prepare a PCB board 1, wherein the PCB board 1 has a required circuit layer 2 and required pads 21;

[0014] Step 2, installing an injection molding mold on the PCB board 1, and then performing injection molding, and demoulding after molding the first insulating material layer 3, wherein the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing each LED light-emitting unit area, a first protrusion 32 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two pads 21 of the same LED chip 4 and facilitating the bottom of the LED chip 4 to support it, and a second protrusion 33 for separating the pads 21 between adjacent LED chips 4, and the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall portion 31, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall portion 31;

[0015] Step 3: Use a machine to apply solder to the pad 21, then connect the LED chip 4 and make the bottom of the LED chip 4 supported on the first protrusion 32 at the corresponding position, and finally perform a die bonding process.

[0016] Preferably, in step one, a plurality of connection holes 11 connected to the front side are provided on the back side of the PCB board 1, and the position of the connection holes 11 is the feed port during injection molding in step two. After the injection molding is completed, a first connection portion 301 connected to the first insulating material layer 3 is formed on the connection holes 11.

[0017] Preferably, the connecting hole 11 is a countersunk hole.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The structure of the LED light-emitting panel in this case is simple and easy to implement. The setting of the unit peripheral wall body of the first insulating material layer is convenient for enclosing one LED light-emitting unit area after another to form an independent color mixing space, thereby avoiding light color crosstalk between LED light-emitting unit areas, and has good practicality. The setting of the first raised portion in the unit peripheral wall body is used to separate the two soldering pads of the same LED chip and facilitate the bottom of the LED chip to support it. It plays a role of separation and support, so that when soldering the LED chip, the solder on the two soldering pads of the same LED chip is not easy to short-circuit due to pressure, and has good practicality. In addition, the solder can easily fill the gap between the soldering pad and the first raised portion and force out the air between them, thereby improving the mounting and welding effect, and has good practicality. The setting of the second raised portion is used to separate the soldering pads between adjacent LED chips. In this way, when implemented, the solder on the soldering pads between adjacent LED chips is not easy to short-circuit due to pressure, which is conducive to ensuring the quality of the finished product, and has good practicality.

[0020] 2. The manufacturing method of a LED light-emitting panel based on COB packaging in this case is easy to implement. The first insulating material layer is formed by mold injection molding, which is easy to implement. Compared with the technical solution of applying ink or brushing ink, it is easy to form the required parts of different heights by mold injection molding; the setting of the first protrusion in the outer peripheral wall of the unit described in this case is used to separate the two pads of the same LED chip and facilitate the bottom of the LED chip to support it. It plays a role of separation and support, so that when welding the LED chip, the solder on the two pads of the same LED chip is not easy to short-circuit due to pressure, which is practical, and the solder can easily fill the gap between the pad and the first protrusion and force out the air between them, thereby improving the mounting welding effect, which is practical; the setting of the second protrusion is used to separate the pads between adjacent LED chips. In this way, when implemented, the solder on the pads between adjacent LED chips is not easy to short-circuit due to pressure, which is conducive to ensuring the quality of the finished product, and has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is one of the structural diagrams of this case.

[0022] Figure 2This is the second structural diagram of this case.

[0023] Figure 3 This is the third structural diagram of this case.

[0024] Figure 4 This is the fourth structural diagram of this case.

[0025] Figure 5 This is the fifth structural diagram of this case. DETAILED DESCRIPTION

[0026] The features of the present invention and other related features are further described in detail below through embodiments to facilitate understanding by those skilled in the art:

[0027] like Figures 1 to 5 As shown, an LED light-emitting panel based on COB packaging includes a PCB board 1, on which a circuit layer 2 and a first insulating material layer 3 are provided, the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing a LED light-emitting unit area, the circuit layer 2 is provided with a plurality of solder pads 21 located in the area enclosed by the unit peripheral wall portion 31 for electrically connecting a plurality of LED chips 4, the first insulating material layer 3 also includes a plurality of solder pads 21 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating and facilitating the two solder pads 21 of the same LED chip 4 The first protrusion 32 is provided for supporting the bottom of the LED chip 4, the top height of the first protrusion 32 is higher than the top height of the soldering pad 21, and the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall portion 31. The first insulating material layer 3 also includes a plurality of second protrusions 33 located in the area surrounded by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 and / or connected to the first protrusion 32 for separating the soldering pads 21 between adjacent LED chips 4, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall portion 31.

[0028] As described above, the structure of the LED light-emitting panel in this case is simple and easy to implement. The setting of the unit peripheral wall body 31 of the first insulating material layer 3 is convenient for enclosing one LED light-emitting unit area after another to form an independent color mixing space, thereby avoiding light color crosstalk between LED light-emitting unit areas, and has good practicality. The setting of the first protrusion 32 in the unit peripheral wall body 31 is used to separate the two solder pads 21 of the same LED chip 4 and to facilitate the bottom of the LED chip 4 to support it. It plays a role of separation and support, so that when the LED chip 4 is soldered, the solder on the two solder pads 21 of the same LED chip 4 is not easy to short-circuit due to pressure, and has good practicality. In addition, the solder can easily fill the gap between the solder pad 21 and the first protrusion 32 and force out the air between them, thereby improving the mounting welding effect, and has good practicality. The setting of the second protrusion 33 is used to separate the solder pads 21 between adjacent LED chips 4. In this way, when implemented, the solder on the solder pads 21 between adjacent LED chips 4 is not easy to short-circuit due to pressure, which is beneficial to ensuring the quality of the finished product, and has good practicality.

[0029] As described above, when the packaging is completed, the area surrounded by the unit peripheral wall portion 31 is filled with packaging glue or the entire surface of the LED light-emitting panel is covered with packaging glue, so as to make the product packaging more reliable and stable.

[0030] like Figure 3 As shown, in a specific implementation, the first insulating material layer 3 further includes a first connecting portion 301 for connecting a plurality of adjacent unit peripheral wall portions 31 together, which is beneficial to enhancing the connection stability.

[0031] like Figure 3 , Figure 4 As shown, in a specific implementation, a connecting hole 11 connected to the first connecting part 301 is provided on the back of the PCB board 1, and the connecting hole 11 is filled with a second connecting part 302 connected to the first connecting part 301, which is beneficial to enhance the connection stability and reduce the falling off of the unit outer wall part 31 and the first connecting part 301.

[0032] As described above, in a specific implementation, the connection hole 11 on the back side of the PCB board 1 is a countersunk hole.

[0033] As described above, in a specific implementation, the first insulating material layer 3 is an insulating plastic layer, which can be formed by injection molding, and preferably uses black PPA material.

[0034] As described above, in a specific implementation, the number of the pads 21 in the area of ​​the outer wall portion 31 of each unit is 6 and distributed in 3*2 horizontal rows, and a flip-chip LED chip is connected between the left and right pads 21 in each row.

[0035] As mentioned above, the present case also discloses a method for manufacturing an LED light-emitting panel based on COB packaging, comprising the following steps:

[0036] Step 1: prepare a PCB board 1, wherein the PCB board 1 has a required circuit layer 2 and required pads 21;

[0037] Step 2, installing an injection molding mold on the PCB board 1, and then performing injection molding, and demoulding after molding the first insulating material layer 3, wherein the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing each LED light-emitting unit area, a first protrusion 32 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two pads 21 of the same LED chip 4 and facilitating the bottom of the LED chip 4 to support it, and a second protrusion 33 for separating the pads 21 between adjacent LED chips 4, and the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall portion 31, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall portion 31;

[0038] Step 3: Use a machine to apply solder to the pad 21, then connect the LED chip 4 and make the bottom of the LED chip 4 supported on the first protrusion 32 at the corresponding position, and finally perform a die bonding process.

[0039] As described above, the manufacturing method of the LED light-emitting panel based on COB packaging in this case is easy to implement. The first insulating material layer 3 is formed by mold injection molding, which is easy to implement. Compared with the technical solution of applying ink or brushing ink, it is easy to form the required parts of different heights by mold injection molding; the first protrusion 32 in the unit peripheral wall body 31 in this case is used to separate the two pads 21 of the same LED chip 4 and facilitate the bottom of the LED chip 4 to support it. It plays a role of separation and support, so that when the LED chip 4 is soldered, the solder on the two pads 21 of the same LED chip 4 is not easy to short-circuit due to pressure, which is practical, and the solder can easily fill the gap between the pad 21 and the first protrusion 32 and force out the air between them, thereby improving the mounting welding effect, which is practical; the second protrusion 33 is set to separate the pads 21 between adjacent LED chips 4. In this way, when implemented, the solder on the pads 21 between adjacent LED chips 4 is not easy to short-circuit due to pressure, which is conducive to ensuring the quality of the finished product, and has good practicality.

[0040] As described above, in step one, a plurality of connection holes 11 connected to the front side of the PCB board 1 are subsequently provided on the back side, and the position of the connection holes 11 is the feed port during injection molding in step two. After the injection molding is completed, a first connection portion 301 connected to the first insulating material layer 3 is formed on the connection holes 11, which is beneficial to enhance the stability of the first insulating material layer 3.

[0041] As described above, the connecting hole 11 is a countersunk hole, so that the first connecting portion 301 therein is not easy to move to the other end and fall out.

[0042] As mentioned above, this case protects an LED light-emitting panel based on COB packaging and its manufacturing method. All technical solutions that are the same or similar to the structure of this case should be deemed to fall within the protection scope of this case.

Claims

1. A LED light-emitting panel based on COB packaging, characterized in that The invention comprises a PCB board (1), wherein the PCB board (1) is provided with a circuit layer (2) and a first insulating material layer (3), wherein the first insulating material layer (3) comprises a unit peripheral wall portion (31) for enclosing a LED light-emitting unit area, wherein the circuit layer (2) is provided with a plurality of solder pads (21) located in the area enclosed by the unit peripheral wall portion (31) for electrically connecting a plurality of LED chips (4), and wherein the first insulating material layer (3) further comprises a solder pad (21) located in the area enclosed by the unit peripheral wall portion (31) and connected to the unit peripheral wall portion (31) for separating two solder pads (21) of the same LED chip (4) and facilitating the connection of the LED chip (4). The bottom supports a first protrusion (32) thereon, the top height of the first protrusion (32) being higher than the top height of the soldering pad (21), and the top height of the first protrusion (32) being lower than the top height of the unit peripheral wall portion (31), the first insulating material layer (3) further comprising a plurality of second protrusions (33) located in an area surrounded by the unit peripheral wall portion (31) and connected to the unit peripheral wall portion (31) and / or connected to the first protrusion (32) for separating the soldering pads (21) between adjacent LED chips (4), the top height of the second protrusion (33) being lower than the top height of the unit peripheral wall portion (31).

2. The LED light-emitting panel based on COB packaging according to claim 1, characterized in that The first insulating material layer (3) also includes a first connecting portion (301) for connecting a plurality of adjacent unit peripheral wall portions (31) together.

3. The LED light-emitting panel based on COB packaging according to claim 2, characterized in that The back side of the PCB board (1) is provided with a connection hole (11) connected to the first connection part (301), and the connection hole (11) is filled with a second connection part (302) connected to the first connection part (301).

4. The LED light-emitting panel based on COB packaging according to claim 3, characterized in that The connection hole (11) on the back side of the PCB board (1) is a countersunk hole.

5. The LED light-emitting panel based on COB packaging according to claim 1, characterized in that The first insulating material layer (3) is an insulating plastic layer.

6. The LED light-emitting panel based on COB packaging according to claim 5, characterized in that The first insulating material layer (3) is made of black PPA material.

7. The LED light-emitting panel based on COB packaging according to claim 1, characterized in that The number of the soldering pads (21) in the area of ​​the peripheral wall body (31) of each unit is 6 and distributed in 3*2 horizontal rows, and a flip-chip LED chip is connected between the two left and right soldering pads (21) in each row.

8. A method for manufacturing an LED light-emitting panel based on COB packaging, characterized in that The steps include: Step 1: prepare a PCB board (1), wherein the PCB board (1) has a required circuit layer (2) and required pads (21); Step 2: Installing an injection molding mold on the PCB board (1), and then performing injection molding to mold a first insulating material layer (3), and then performing demoulding, wherein the first insulating material layer (3) includes a unit peripheral wall body (31) for enclosing a LED light-emitting unit area, a first protrusion (32) located in the area enclosed by the unit peripheral wall body (31) and connected to the unit peripheral wall body (31) for separating two solder pads (21) of the same LED chip (4) and facilitating the bottom of the LED chip (4) to be supported thereon, and a second protrusion (33) for separating the solder pads (21) between adjacent LED chips (4), and the top height of the first protrusion (32) is lower than the top height of the unit peripheral wall body (31), and the top height of the second protrusion (33) is lower than the top height of the unit peripheral wall body (31); Step three: Use a machine to apply solder to the pad (21), then connect the LED chip (4) and make the bottom of the LED chip (4) supported on the first protrusion (32) at the corresponding position, and finally perform a die-bonding process.

9. The method for manufacturing a COB-based LED light-emitting panel according to claim 8, characterized in that In step one, a plurality of connection holes (11) connected to the front side of the PCB board (1) are provided on the back side, and the connection holes (11) are located at the feed inlet during injection molding in step two. After the injection molding is completed, a first connection portion (301) connected to the first insulating material layer (3) is formed on the connection holes (11).

10. The method for manufacturing a COB-based LED light-emitting panel according to claim 9, characterized in that The connecting hole (11) is a countersunk hole.

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