Element missing solder detection method, computer device and computer readable storage medium

Abstract

The invention provides an element missing solder detection method, a computer device and a computer readable storage medium. The element missing solder detection method comprises the following steps: determining target parameters of a light-emitting device by using a preset number of sample elements; controlling the light-emitting device to emit target detection light based on the target parameter; acquiring a detection image of the to-be-detected element under the target detection light by using a 2D camera; extracting a detection parameter of the element to be detected in the detection image; and based on a comparison result of the detection parameter and a preset standard parameter, judging whether the to-be-detected element has micro-empty welding or not. In the embodiment, the features of the detection part in the detection image obtained under the target detection light are more obvious, more effective detection parameters can be obtained by further analyzing and detecting the detection image, the detection parameters can be further compared with the preset standard parameters, and the detection accuracy is improved. Whether missing solder exists in the to-be-detected element or not can be accurately judged. The method can achieve the optimal detection effect, and is high in detection speed and high in accuracy.

Description

Technical Field

[0001] The present application relates to the field of automatic optical detection technology, and in particular to a component empty soldering detection method, a computer device and a computer-readable storage medium. Background Art

[0002] As the application of electronic equipment gradually increases, the use of electronic devices in electronic equipment is becoming more and more widespread. The premise for the normal operation of electronic equipment is that the electronic devices can work normally. Empty solder joints are a defect that often occurs when soldering components on electronic devices. Therefore, it is necessary to detect whether empty solder joints occur on electronic devices.

[0003] However, as the manufacturing industry becomes more and more intensive, more and more tiny electronic devices are used in electronic devices. Because the size of the solder joints of tiny electronic devices is much smaller than that of general electronic devices, the current detection methods cannot effectively, accurately and quickly detect the defects of the solder joints on tiny electronic devices. Summary of the invention

[0004] In view of the above, it is necessary to provide a component empty solder joint detection method, a computer device and a computer readable storage medium to solve the problem that the current detection method cannot effectively, accurately and quickly detect solder joint defects on electronic devices.

[0005] In a first aspect, an embodiment of the present application provides a component empty welding detection method, comprising:

[0006] Determining target parameters of the light emitting device using a preset number of sample elements;

[0007] Controlling the light emitting device to emit target detection light based on the target parameter;

[0008] Using a 2D camera to obtain a detection image of the component to be detected under the target detection light;

[0009] Extract the detection parameters of the component to be detected in the detection image, and determine whether there is micro-empty welding in the component to be detected based on the comparison result between the detection parameters and the preset standard parameters.

[0010] In the above embodiment, the features of the detection part in the detection image obtained under the target detection light are more obvious, and by further analyzing and detecting the detection image, more effective detection parameters can be obtained, and the detection parameters can be further compared with the preset standard parameters to accurately determine whether there is an empty solder joint in the component to be detected. This method can achieve the best detection effect, with fast detection speed and high accuracy.

[0011] In one embodiment, the preset number of sample elements includes a plurality of micro-hollow welding elements and a plurality of non-micro-hollow welding elements, and determining the target parameters of the light-emitting device using the preset number of sample elements includes:

[0012] Controlling the light emitting device to emit original detection light;

[0013] Using the 2D camera to obtain images of the plurality of micro-void welding elements respectively under the original detection light, to obtain a plurality of micro-void welding images, and obtaining images of the plurality of non-micro-void welding elements respectively under the original detection light, to obtain a plurality of non-micro-void welding images;

[0014] Calculating image parameters of the plurality of micro-hole welding components in the corresponding micro-hole welding images, and calculating image parameters of the plurality of non-micro-hole welding components in the corresponding non-micro-hole welding images;

[0015] The target parameters of the light emitting device are determined based on the image parameters of the plurality of micro-hole welding elements in the corresponding micro-hole welding images and the image parameters of the plurality of non-micro-hole welding elements in the corresponding non-micro-hole welding images.

[0016] In one embodiment, determining the target parameters of the light emitting device based on the image parameters of the plurality of micro-hole welding elements in the corresponding micro-hole welding images and the image parameters of the plurality of non-micro-hole welding elements in the corresponding non-micro-hole welding images comprises:

[0017] Comparing the image parameters corresponding to each of the plurality of micro-hole welding images with the image parameters corresponding to each of the plurality of non-micro-hole welding images, to obtain a plurality of comparison results;

[0018] The control signal of the light emitting device is adjusted based on the multiple sets of comparison results, thereby determining the target parameters of the light emitting device.

[0019] In one embodiment, the image parameters include color parameters and brightness parameters, and the target parameters include color parameters and brightness parameters.

[0020] In one embodiment, the preset standard parameter includes a first standard value, and the extracting of the detection parameter of the component to be detected in the detection image, and judging whether the component to be detected has micro-empty welding based on the comparison result of the detection parameter and the preset standard parameter includes:

[0021] Transform the detection image based on a color extraction algorithm to calculate the chroma H, saturation S, and brightness V of the detection image;

[0022] Extracting the red component, the blue component, and the green component in the detection image based on the calculated hue H, the saturation S, the lightness V, and the preset standard threshold of the hue H, the preset standard threshold of the saturation S, and the preset standard threshold of the lightness V;

[0023] Calculate the proportion of the red component in the total color components of the red component, the blue component, and the green component in the detection image;

[0024] When the ratio is greater than the first standard value, it is determined that there is no micro-empty welding in the component to be detected;

[0025] When the ratio is less than or equal to the first standard value, it is determined that micro-empty welding exists in the component to be detected.

[0026] In one embodiment, the preset standard threshold of chroma H is 0.1-0.9, the preset standard threshold of saturation S is 0.5-1, and the preset standard threshold of brightness V is 0.4-1.

[0027] In one embodiment, the preset standard parameter includes a second standard value, and the extracting the detection parameter of the component to be detected in the detection image, and judging whether there is micro-empty welding in the component to be detected based on the comparison result of the detection parameter and the preset standard parameter includes:

[0028] By performing binarization processing on the detection image, the original brightness value of the red channel of the detection image is filtered out to obtain the detection image after binarization processing;

[0029] Based on a brightness extraction algorithm, extracting a first detection brightness value of a blue channel and a second detection brightness value of a green channel from the detection image that has been binarized;

[0030] When the first detection brightness value and / or the second detection brightness value is greater than the second standard value, it is determined that there is micro-hollow welding in the component to be detected;

[0031] When the first detection brightness value and the second detection brightness value are both less than or equal to the second standard value, it is determined that there is no micro-hollow weld in the component to be detected.

[0032] In one embodiment, the component empty welding detection method further includes:

[0033] When it is determined that the component to be inspected does not have micro-hollow welds, using a 3D camera to obtain a three-dimensional image of the component to be inspected;

[0034] According to the preset 3D algorithm and the three-dimensional image, it is determined whether the component to be inspected has common empty solder joints.

[0035] In a second aspect, an embodiment of the present application further provides a computer device, comprising: a memory storing at least one instruction; and a processor executing the at least one instruction to implement the component empty welding detection method as described in the above embodiment.

[0036] In a second aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein at least one instruction is stored in the computer-readable storage medium, and the at least one instruction is executed by a processor of a control device to implement the component empty welding detection method as described in the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a framework diagram of a computer device provided in one embodiment of the present application.

[0038] Figure 2 It is a flow chart of a component empty soldering detection method provided in one embodiment of the present application.

[0039] Figure 3 yes Figure 2 Detailed flow chart of step S100 in the component empty soldering detection method shown.

[0040] Figure 4 yes Figure 2 Detailed flow chart of step S400 in the component empty solder joint detection method shown.

[0041] Figure 5 yes Figure 2 Detailed flow chart of step S400 in the component empty solder joint detection method shown.

[0042] Main component symbols

[0043] Computer device 10

[0044] Memory 11

[0045] Processor 12

[0046] Computer Programs 13 DETAILED DESCRIPTION

[0047] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0048] In the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, words such as "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "for example" is intended to present related concepts in a concrete way. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0049] In the description of the present application, it should be noted that, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In addition, in the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically limited.

[0050] In the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0052] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0053] In the prior art, empty solder joints of electronic devices are often detected by an automatic optical inspection (AOI) method. Specifically, an image of a test solder joint on the electronic device is automatically captured by a camera, and then the image of the test solder joint is compared with qualified images in a database to determine the welding condition of the test solder joint.

[0054] Understandably, one of the keys to fully automatic optical inspection is to select the correct and appropriate light source. The role of the light source is to assist the camera in obtaining a contrasting image of the features to be inspected on the electronic device. Therefore, the inspection light source directly affects the quality of the image, and thus affects the inspection effect.

[0055] In view of this, the present application provides a component empty solder joint detection method, by adjusting the light emitting device, and then detecting the component to be detected under the adjusted light emitting device. The component empty solder joint detection method of the present application is suitable for detecting electronic devices, especially for detecting tiny electronic devices.

[0056] Combination Figure 1 As shown, in the present application, the component empty soldering detection method is applied to a computer device 10, and the hardware of the computer device 10 includes, but is not limited to, a microprocessor, an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field-programmable gate array (Field-Programmable Gate Array, FPGA), a digital signal processor (Digital Signal Processor, DSP), an embedded device, etc.

[0057] Combination Figure 1 As shown, in one embodiment, the computer device 10 includes, but is not limited to, a memory 11, a processor 12, and a computer program 13 stored in the memory 11 and executable by the processor 12. For example, the computer program 13 can be a program for performing empty welding detection on the component to be inspected.

[0058] In this embodiment, the network where the computer device 10 is located includes, but is not limited to: the Internet, a wide area network, a metropolitan area network, a local area network, a virtual private network (VPN), etc.

[0059] Combination Figure 2 As shown, in one embodiment, the component empty welding detection method is applied to Figure 1 The computer device 10 shown in the figure. According to different requirements, the order of the steps of the component empty soldering detection method can be changed, and some steps can be omitted.

[0060] S100, determining target parameters of a light emitting device using a preset number of sample components.

[0061] In one embodiment, the preset number of sample elements includes a plurality of micro-void weld elements and a plurality of non-micro-void weld elements, wherein each of the plurality of micro-void weld elements is an element with micro-void welds, and each of the plurality of non-micro-void weld elements is an element without micro-void welds.

[0062] In one embodiment, the detailed process of step S100 is shown in Figure 3 Steps shown.

[0063] S200, controlling the light emitting device to emit target detection light based on the target parameters.

[0064] In one embodiment, the computer device 10 sends a corresponding control signal to the light-emitting device according to the target parameter, so that the light-emitting device emits target detection light.

[0065] S300, using a 2D camera to obtain a detection image of the component to be detected under target detection light.

[0066] In one embodiment, the computer device 10 can obtain an image of the solder joint of the component to be inspected through a region of interest. In machine vision and image processing, a region of interest (ROI) is an area to be processed that is outlined in the form of a box, circle, ellipse, irregular polygon, etc. from the processed image. In the field of image processing, a region of interest is an image area selected from an image, and this area is the focus of image analysis. The area is circled for further processing. Using the region of interest to circle the target to be processed can reduce processing time and increase accuracy.

[0067] In this embodiment, the detection image has an image in RGB color mode. Among them, RGB color mode is a color standard in the industry. It obtains various colors by changing the three color channels of red, green, and blue and superimposing them on each other. RGB represents the colors of the three channels of red, green, and blue. This standard almost includes all colors that can be perceived by human vision and is one of the most widely used color systems. The RGB color mode uses the RGB model to assign an intensity value in the range of 0-255 to the RGB component of each pixel in the image. For example: the R value of pure red is 255, the G value is 0, and the B value is 0.

[0068] S400, extracting detection parameters of the component to be detected in the detection image, and judging whether there are micro-empty welds in the component to be detected based on the comparison result between the detection parameters and the preset standard parameters.

[0069] In the above embodiment, the features of the detection part in the detection image obtained under the target detection light are more obvious. By further analyzing and detecting the detection image, more effective detection parameters can be obtained. The detection parameters can be further compared with the preset standard parameters to accurately determine whether there is an empty solder joint in the component to be detected. This method can achieve the best detection effect, with fast detection speed and high accuracy.

[0070] Combination Figure 3 As shown, in one embodiment, the preset number of sample elements includes a plurality of micro-hollow welding elements and a plurality of non-micro-hollow welding elements, and the target parameters of the light-emitting device are determined by using the preset number of sample elements, including:

[0071] S110, controlling the light emitting device to emit original detection light.

[0072] In one embodiment, the light emitting device is a device that can change color and brightness and provide direct or diffuse reflection illumination. A commonly used light emitting device is composed of a red, green, and blue LED lamp array and a metal structure that provides direct or diffuse reflection. For example, the original detection light is white light.

[0073] S120, using a 2D camera to obtain images of multiple micro-void welding components under original detection light, to obtain multiple micro-void welding images, and obtaining images of multiple non-micro-void welding components under original detection light, to obtain multiple non-micro-void welding images.

[0074] In one embodiment, each micro-void welding image in a plurality of micro-void welding images refers to an image of a micro-void welding element in a plurality of micro-void welding elements under original detection light, and each non-micro-void welding image in a plurality of non-micro-void welding images refers to an image of a non-micro-void welding element in a plurality of non-micro-void welding elements under original detection light.

[0075] In this embodiment, the plurality of micro-void welding images and the plurality of non-micro-void welding images are images with RGB color mode.

[0076] S130, calculating image parameters of a plurality of micro-void welding components in corresponding micro-void welding images, and calculating image parameters of a plurality of non-micro-void welding components in corresponding non-micro-void welding images.

[0077] In one embodiment, the image parameters include color parameters and brightness parameters. The computer device 10 calculates the red component, blue component, and green component of each of the multiple micro-hole welding images and the multiple non-micro-hole welding images based on the color extraction algorithm. The computer device 10 calculates the brightness value of the red component, the brightness value of the blue component, and the brightness value of the green component of each image based on the brightness extraction algorithm.

[0078] S140, determining target parameters of the light emitting device based on image parameters of a plurality of micro-hole welding components in corresponding micro-hole welding images and image parameters of a plurality of non-micro-hole welding components in corresponding non-micro-hole welding images.

[0079] In one embodiment, the target parameters include color parameters and brightness parameters. The computer device 10 compares the image parameters corresponding to each micro-void welding image in the plurality of micro-void welding images with the image parameters corresponding to each non-micro-void welding image in the plurality of non-micro-void welding images to obtain multiple sets of comparison results; and adjusts the control signal of the light-emitting device based on the multiple sets of comparison results to determine the target parameters of the light-emitting device.

[0080] For example, a plurality of micro-hole welding elements include A1, A2, and A3, and the corresponding micro-hole welding images are A11, A21, and A31, respectively, and a plurality of non-micro-hole welding elements include B1, B2, and B3, and the corresponding non-micro-hole welding images are B11, B12, and B13, respectively. The color components and brightness values ​​of A11 and B11, A21 and B21, and A31 and B31 are compared respectively. The computer device 10 finds through comparison that the proportion of the red component in the total color components of the red component, the blue component, and the green component in A11, A21, and A31 is respectively less than the proportion of the red component in the total color components of the red component, the blue component, and the green component in B11, B12, and B13. At the same time, the brightness value of the blue component in A11, A21, and A31 is respectively greater than the brightness value of the blue component in B11, B12, and B13, and the brightness value of the green component in A11, A21, and A31 is respectively greater than the brightness value of the green component in B11, B12, and B13. Therefore, the computer device 10 adjusts the control signal of the light-emitting device so that the target detection light emitted by the light-emitting device can enhance the red component, the blue component, and the green component in the detection image obtained under the target detection light, thereby facilitating the 2D camera to obtain a detection image with better detection effect later.

[0081] In addition, the staff can also continuously adjust the illumination angle of the light-emitting device, the height of the distance component, etc. according to multiple sets of comparison results, thereby assisting the 2D camera to obtain detection images with better detection effects.

[0082] Combination Figure 4 As shown, in one embodiment, the preset standard parameters include a first standard value, extracting the detection parameters of the component to be detected in the detection image, and judging whether there is micro-empty welding in the component to be detected based on the comparison result between the detection parameters and the preset standard parameters, including:

[0083] S410, transform the detection image based on the color extraction algorithm, and calculate the hue H, saturation S, and brightness V of the detection image.

[0084] In one embodiment, before transforming the detection image, the computer device 10 performs feature enhancement processing on the red channel, green channel, and blue channel of the detection image to achieve the best detection effect.

[0085] S411, based on the calculated hue H, saturation S, brightness V and the preset standard threshold of hue H, the preset standard threshold of saturation S and the preset standard threshold of brightness V, extract the red component, blue component and green component in the detection image.

[0086] In the embodiment of the present application, the preset standard threshold of chromaticity H is 0.1-0.9, the preset standard threshold of saturation S is 0.5-1, and the preset standard threshold of brightness V is 0.4-1.

[0087] S412, calculating the proportion of the red component in the total color components of the red component, the blue component, and the green component in the detection image.

[0088] In the embodiment of the present application, the total color component is the sum of the red component, the blue component, and the green component. In one embodiment, according to the comparison result in step S140, it is found that the color of each micro-hollow welding element in the corresponding micro-hollow welding image of the plurality of micro-hollow welding elements is blue and green, and the red component accounts for a small proportion. This feature is used to calculate the proportion of the red component in the total color components of the red component, the blue component, and the green component in the detection image, and the detection element is detected.

[0089] S413, determining whether the ratio is greater than a first standard value.

[0090] In one embodiment, the first standard value is obtained by comprehensively analyzing the proportion of the red component on each non-empty weld image in the multiple non-empty weld images to the total color components of the red component, the blue component, and the green component in the color components of each non-empty weld image.

[0091] In one embodiment, when the ratio is greater than the first standard value, it is determined that there is no micro-empty weld in the component to be detected. When the ratio is greater than the first standard value, it indicates that the red component accounts for a large proportion, and it can be determined that there is no micro-empty weld in the component to be detected.

[0092] In one embodiment, when the ratio is less than or equal to the first standard value, it is determined that there is micro-void welding in the component to be detected. When the ratio is greater than the first standard value, it indicates that the red component accounts for a small proportion, and it can be determined that there is micro-void welding in the component to be detected.

[0093] In the above embodiment, the feature that "the color of each micro-hollow welding element among multiple micro-hollow welding elements in the corresponding micro-hollow welding image is blue and green, and the proportion of red is relatively small" is used to detect the element to be detected. It can effectively determine whether there is a hollow weld in the element to be detected based on color distinction, and the detection accuracy is high.

[0094] Combination Figure 5 As shown, in one embodiment, the preset standard parameters include a second standard value, extracting the detection parameters of the component to be detected in the detection image, and judging whether there is micro-empty welding in the component to be detected based on the comparison result between the detection parameters and the preset standard parameters, including:

[0095] S420, binarizing the detection image and filtering out the original brightness value of the red channel of the detection image to obtain a binarized detection image.

[0096] In one embodiment, the computer device 10 needs to pre-process the detection image before filtering it, specifically as follows: first, superimpose the brightness of the green channel of the detection image twice to obtain a superposition result; then, calculate the difference between the superposition result and the brightness of the red channel of the detection image; then, generate a single-channel image based on the difference; finally, subtract a preset value from the brightness value of the single-channel image. For example, the preset value is 0.1.

[0097] S421, based on a brightness extraction algorithm, extracting a first detection brightness value of a blue channel and a second detection brightness value of a green channel from the detection image that has been binarized.

[0098] In this embodiment, according to the comparison result in step S140, it is found that the brightness value of the blue channel of the micro-void welding element in the corresponding micro-void welding image is higher than the brightness value of the blue channel of the non-micro-void welding element in the corresponding non-micro-void welding image, and the brightness value of the green channel of the micro-void welding element in the corresponding micro-void welding image is higher than the brightness value of the green channel of the non-micro-void welding element in the corresponding non-micro-void welding image. This feature is used to extract the first detection brightness value of the blue channel and the second detection brightness value of the green channel in the detection image to detect the components to be detected.

[0099] S422, determining whether the first detected brightness value and the second detected brightness value are both greater than a second standard value.

[0100] In one embodiment, the preset standard parameters include a second standard value, which is calculated by comprehensively analyzing the brightness values ​​of a blue channel and the brightness values ​​of a green channel on a plurality of non-empty welding images.

[0101] In one embodiment, when the first detection brightness value and / or the second detection brightness value is greater than the second standard value, it is determined that there is micro-hollow welding in the component to be detected. When the first detection brightness value and / or the second detection brightness value is greater than the second standard value, it indicates that the brightness is high, and it can be determined that there is micro-hollow welding in the component to be detected.

[0102] In one embodiment, when the first detection brightness value and the second detection brightness value are both less than or equal to the second standard value, it is determined that there is no micro-empty welding in the component to be detected. When the first detection brightness value and the second detection brightness value are both less than or equal to the second standard value, it indicates that the brightness is low, and it can be determined that there is no micro-empty welding in the component to be detected.

[0103] In the above embodiment, the feature of "the brightness value of the blue channel of the micro-void welding element in the corresponding micro-void welding image is higher than the brightness value of the blue channel of the non-micro-void welding element in the corresponding non-micro-void welding image, and the brightness value of the green channel of the micro-void welding element in the corresponding micro-void welding image is higher than the brightness value of the green channel of the non-micro-void welding element in the corresponding non-micro-void welding image" is utilized to detect the element to be detected, and it is possible to effectively determine whether there is a void weld in the tiny electronic device based on the brightness distinction, and the detection accuracy is high.

[0104] In one embodiment, the component empty solder joint detection method in the above embodiment further includes: when it is determined that there is no micro empty solder joint in the component to be detected, using a 3D camera to obtain a three-dimensional image of the component to be detected; based on a preset 3D algorithm and the three-dimensional image, determining whether there is a common empty solder joint in the component to be detected.

[0105] In one embodiment, the three-dimensional image acquired by the 3D camera carries height information, and the computer device 10 calculates the height difference of the electrodes at both ends of the component to be detected based on the preset 3D algorithm and the three-dimensional image. When the height difference of the electrodes at both ends of the component to be detected without micro-empty welding is more than 40 microns, it can be determined that the component to be detected has ordinary empty welding. When the height difference of the electrodes at both ends of the component to be detected without micro-empty welding is within 40 microns, the component to be detected can be determined as a qualified component.

[0106] In the above embodiment, the height difference between the electrodes at both ends of the qualified component is within 40 microns. When the height difference between the electrodes at both ends of the component to be detected exceeds 40 microns, the preset 3D algorithm can detect the existence of ordinary empty solder joints in the component to be detected. However, when the height difference between the electrodes at both ends of the component to be detected is within 40 microns, the preset 3D algorithm cannot effectively detect whether there are empty solder joints in the component to be detected. Therefore, the component empty solder joint detection method of the above embodiment is required for further detection.

[0107] After testing, the component empty welding detection method of the embodiment of the present application combines 2D detection and 3D detection, and has extremely low false detection rate and missed detection rate, which can effectively ensure a high accuracy rate and a fast detection speed.

[0108] Then Figure 1 In the description of the computer device 10 shown in FIG. 1 , the processor 12 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor. The processor 12 may also be any conventional processor, etc. The processor 12 is the computing core and control center of the computer device 10, and uses various interfaces and lines to connect various parts of the entire computer device 10, and obtain the operating system of the computer device 10 and various installed applications, program codes, etc.

[0109] The memory 11 can be used to store a computer program 13. The processor 12 implements various functions of the computer device 10 by running or acquiring the computer program 13 stored in the memory 11 and calling the data stored in the memory 11. The memory 11 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required for a function, etc. In addition, the memory 11 can include a non-volatile memory 11, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk memory 11 device, a flash memory device, or other non-volatile solid-state storage devices.

[0110] The memory 11 may be an external memory and / or an internal memory of the computer device 10. Furthermore, the memory 11 may be a memory in a physical form, such as a memory stick, a TF card (Trans-flash Card), and the like.

[0111] The computer program 13 includes computer program code, which may be in source code form, object code form, an accessible file, or some intermediate form, etc. Computer readable media may include: any entity or device capable of carrying computer program code, recording media, USB flash drives, mobile hard disks, magnetic disks, optical disks, computer memory, and read-only memory (ROM).

[0112] The embodiment of the present application further provides a computer-readable storage medium, which stores at least one instruction, and the at least one instruction is executed by a processor of a computer device to implement the component empty welding detection method as described in the above embodiment.

[0113] Those skilled in the art can understand that all or part of the processes in the component empty soldering detection method described in the above embodiment can be completed by hardware related to the computer program 13. The computer program 13 can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the component empty soldering detection method described above. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), a flash memory (FM), a hard disk (HDD), or a solid-state drive (SSD), etc.; the storage medium can also include a combination of the above-mentioned types of memory 11.

[0114] In the several embodiments provided in this application, it should be understood that the disclosed system can be implemented in other ways. For example, the system embodiments described above are only schematic, for example, the division of modules is only a logical function division, and there may be other division methods in actual implementation.

[0115] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0116] Each functional module in each embodiment of the present application can be integrated into one unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0117] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present application is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0118] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in this application can also be implemented by one unit or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0119] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A component empty soldering detection method, characterized in that: include: Determining target parameters of the light emitting device using a preset number of sample elements; Controlling the light emitting device to emit target detection light based on the target parameter; Using a 2D camera to obtain a detection image of the component to be detected under the target detection light; Extract the detection parameters of the component to be detected in the detection image, and determine whether there is micro-empty welding in the component to be detected based on the comparison result between the detection parameters and the preset standard parameters.

2. The component empty soldering detection method according to claim 1, characterized in that: The preset number of sample elements includes a plurality of micro-hollow welding elements and a plurality of non-micro-hollow welding elements, and determining the target parameters of the light-emitting device using the preset number of sample elements includes: Controlling the light emitting device to emit original detection light; Using the 2D camera to obtain images of the plurality of micro-void welding elements respectively under the original detection light, to obtain a plurality of micro-void welding images, and obtaining images of the plurality of non-micro-void welding elements respectively under the original detection light, to obtain a plurality of non-micro-void welding images; Calculating image parameters of the plurality of micro-hole welding components in the corresponding micro-hole welding images, and calculating image parameters of the plurality of non-micro-hole welding components in the corresponding non-micro-hole welding images; The target parameters of the light emitting device are determined based on the image parameters of the plurality of micro-hole welding elements in the corresponding micro-hole welding images and the image parameters of the plurality of non-micro-hole welding elements in the corresponding non-micro-hole welding images.

3. The component empty soldering detection method according to claim 2, characterized in that: The determining the target parameters of the light emitting device based on the image parameters of the plurality of micro-hole welding elements in the corresponding micro-hole welding images and the image parameters of the plurality of non-micro-hole welding elements in the corresponding non-micro-hole welding images comprises: Comparing the image parameters corresponding to each of the plurality of micro-hole welding images with the image parameters corresponding to each of the plurality of non-micro-hole welding images, to obtain a plurality of comparison results; The control signal of the light emitting device is adjusted based on the multiple sets of comparison results, thereby determining the target parameters of the light emitting device.

4. The component empty soldering detection method according to claim 3, characterized in that: The image parameters include color parameters and brightness parameters, and the target parameters include color parameters and brightness parameters.

5. The component empty soldering detection method according to claim 1, characterized in that: The preset standard parameter includes a first standard value, and the extracting the detection parameter of the component to be detected in the detection image, and judging whether the component to be detected has micro-empty welding based on the comparison result between the detection parameter and the preset standard parameter includes: Transform the detection image based on a color extraction algorithm to calculate the chroma H, saturation S, and brightness V of the detection image; Extracting the red component, the blue component, and the green component in the detection image based on the calculated hue H, the saturation S, the lightness V, and the preset standard threshold of the hue H, the preset standard threshold of the saturation S, and the preset standard threshold of the lightness V; Calculate the proportion of the red component in the total color components of the red component, the blue component, and the green component in the detection image; When the ratio is greater than the first standard value, it is determined that there is no micro-empty welding in the component to be detected; When the ratio is less than or equal to the first standard value, it is determined that micro-empty welding exists in the component to be detected.

6. The component empty soldering detection method according to claim 5, characterized in that: The preset standard threshold of chroma H is 0.1-0.9, the preset standard threshold of saturation S is 0.5-1, and the preset standard threshold of brightness V is 0.4-1.

7. The component empty soldering detection method according to claim 1, characterized in that: The preset standard parameter includes a second standard value, and the extracting the detection parameter of the component to be detected in the detection image, and judging whether the component to be detected has micro-empty welding based on the comparison result of the detection parameter and the preset standard parameter includes: By performing binarization processing on the detection image, the original brightness value of the red channel of the detection image is filtered out to obtain the detection image after binarization processing; Based on a brightness extraction algorithm, extracting a first detection brightness value of a blue channel and a second detection brightness value of a green channel from the detection image that has been binarized; When the first detection brightness value and / or the second detection brightness value is greater than the second standard value, it is determined that there is micro-hollow welding in the component to be detected; When the first detection brightness value and the second detection brightness value are both less than or equal to the second standard value, it is determined that there is no micro-hollow weld in the component to be detected.

8. The component empty soldering detection method according to claim 1, characterized in that: The component empty welding detection method also includes: When it is determined that the component to be inspected does not have micro-hollow welds, using a 3D camera to obtain a three-dimensional image of the component to be inspected; According to the preset 3D algorithm and the three-dimensional image, it is determined whether the component to be inspected has common empty solder joints.

9. A computer device, characterized in that: The computer device comprises: A memory storing at least one instruction; The processor executes the at least one instruction to implement the component empty welding detection method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: At least one instruction is stored in the computer-readable storage medium, and the at least one instruction is executed by a processor of the control device to implement the component empty welding detection method according to any one of claims 1 to 8.

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