A light-emitting device, a preparation method thereof, and a lighting device

Abstract

The present invention discloses a light-emitting device, a preparation method thereof, and a light-emitting device. The preparation method of the light-emitting device includes: providing an encapsulant and an encapsulation substrate with a plurality of light-emitting element groups mounted thereon; the encapsulation substrate includes a plurality of die-bonding areas, and the light-emitting element groups are fixed in the die-bonding areas; one side surface of the encapsulation substrate facing away from the light-emitting element groups includes a plurality of light-emitting pins; placing the encapsulant on one side surface of the light-emitting element groups facing away from the encapsulation substrate, and pressing the encapsulant to form a light-emitting assembly; cutting the light-emitting assembly to form a light-emitting device including at least two light-emitting element groups. The technical solution of the present invention can improve the thrust of the light-emitting pins in the light-emitting device and the thrust of the light-emitting device itself, thereby improving the mounting stability of the light-emitting device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular, to a light-emitting device, a method for manufacturing the same, and a light-emitting device Background Art

[0002] A light-emitting diode (LED) is a solid-state semiconductor device that can directly convert electrical energy into light energy. Due to the advantages of long life, small size, low power consumption, etc. of the light-emitting diode, it has been widely used as a light source for various devices, such as a light source for a display device.

[0003] With the thinning of display devices, the size and volume of light-emitting devices are getting smaller and smaller. Similarly, the size of the pin pads in the light-emitting devices is also getting smaller and smaller, which will directly lead to a decrease in the pin thrust of the light-emitting devices. After the light-emitting devices are mounted on the substrate to be mounted, it is easy for the light-emitting devices to fall off from the substrate to be mounted, resulting in defects or scrapping of the entire product. Therefore, how to improve the pin thrust of the light-emitting devices has become a technical problem that needs to be solved urgently at present. Summary of the Invention

[0004] The present invention provides a light-emitting device, a method for manufacturing the same, and a light-emitting device, which can improve the thrust of the light-emitting pins in the light-emitting device and the thrust of the light-emitting device itself, and further improve the mounting stability of the light-emitting device.

[0005] In a first aspect, the present invention provides a method for manufacturing a light-emitting device, including:

[0006] Providing encapsulant and an encapsulation substrate on which a plurality of light-emitting element groups are mounted; the encapsulation substrate includes a plurality of die bonding regions, and the light-emitting element groups are fixed in the die bonding regions; a side surface of the encapsulation substrate facing away from the light-emitting element groups includes a plurality of light-emitting pins;

[0007] Placing the encapsulant on a side surface of the light-emitting element groups facing away from the encapsulation substrate, and pressing the encapsulant to form a light-emitting assembly;

[0008] Cutting the light-emitting assembly to form a light-emitting device including at least two of the light-emitting element groups.

[0009] Optionally, providing an encapsulation substrate on which a plurality of light-emitting element groups are mounted includes:

[0010] Providing the encapsulation substrate; the encapsulation substrate includes a plurality of die bonding regions, and each of the die bonding regions includes a plurality of positive electrode pads and negative electrode pads arranged in one-to-one correspondence with the positive electrode pads;

[0011] Providing a plurality of the light-emitting element groups; each of the light-emitting element groups includes a plurality of light-emitting elements, and a side surface of the light-emitting element includes a positive electrode input end and a negative electrode input end;

[0012] Mount each of the light-emitting element groups at each of the die bonding areas to form the packaging substrate on which the light-emitting element groups are mounted; wherein, the positive input terminal is electrically connected to the positive pad, and the negative input terminal is electrically connected to the negative pad.

[0013] Optionally, the encapsulant includes a black glue layer and a transparent glue layer;

[0014] Place the encapsulant on the surface of the light-emitting element group facing away from the packaging substrate, and press the encapsulant to form a light-emitting component, including:

[0015] Place the black glue layer on the surface of the light-emitting element group facing away from the packaging substrate, and the transparent glue layer is located on the surface of the black glue layer facing away from the packaging substrate;

[0016] Apply a pressure to the encapsulant in the direction from the transparent glue layer to the packaging substrate to press the encapsulant;

[0017] Bake and cure the packaging substrate provided with the light-emitting element group and the encapsulant to form the light-emitting component.

[0018] Optionally, in the thickness direction of the packaging substrate, the height of the light-emitting element group is h0; before pressing the encapsulant, the thickness of the black glue layer is h11;

[0019] Wherein, 0μm ≤ h0 - h11 ≤ 10μm.

[0020] Optionally, in the light-emitting component, in the direction parallel to the plane where the packaging substrate is located, the minimum distance between two adjacent light-emitting element groups is d1;

[0021] Cut the light-emitting component to form a light-emitting device including at least two light-emitting element groups, including:

[0022] Remove a part of the transparent glue layer located between some adjacent two light-emitting element groups to form a light-emitting element group distinguishing groove; the light-emitting element group on one side of the light-emitting element group distinguishing groove is the first light-emitting element group, and the light-emitting element group on the other side of the light-emitting element group distinguishing groove is the second light-emitting element group. In the direction from the first light-emitting element group to the second light-emitting element group, the width of the light-emitting element group distinguishing groove is d2; wherein, 0μm < d2 ≤ d1;

[0023] Cut out the area including at least two light-emitting element groups from the light-emitting component to form the light-emitting device; between two adjacent light-emitting element groups in the light-emitting device, there is the light-emitting element group distinguishing groove.

[0024] Optionally, in the thickness direction of the encapsulation substrate, the thickness of the transparent adhesive layer is h2;

[0025] wherein, h2 ≥ 0.5 μm.

[0026] Optionally, cutting the light-emitting component to form a light-emitting device including at least two of the light-emitting element groups, includes:

[0027] Cutting the light-emitting component to form a light-emitting device including M of the light-emitting element groups; wherein, M = 2n and n is a positive integer.

[0028] Optionally, the light-emitting device includes four of the light-emitting element groups, and one side surface of the light-emitting device facing away from the light-emitting element groups includes eight of the light-emitting pins.

[0029] In a second aspect, the present invention provides a light-emitting device prepared by the method for preparing a light-emitting device according to the first aspect.

[0030] In a third aspect, the present invention further provides a light-emitting device, including: a circuit board and the light-emitting device according to the second aspect;

[0031] The light-emitting device is mounted on the circuit board; one side surface of the circuit board includes a set of pin pads corresponding to each of the light-emitting devices, each pin pad in the set of pin pads corresponds to each of the light-emitting pins in the light-emitting device, and each of the pin pads is electrically connected to each of the light-emitting pins in a one-to-one correspondence.

[0032] The technical solution provided by the present invention, by providing an encapsulating adhesive and an encapsulation substrate mounted with a plurality of light-emitting element groups, placing the encapsulating adhesive on one side surface of the light-emitting element group facing away from the encapsulation substrate, and pressing the encapsulating adhesive to form a light-emitting component, the encapsulating adhesive is adhered to both the encapsulation substrate and the light-emitting element group, so as to improve the adhesion firmness and stability between the light-emitting element group and the encapsulation substrate, between the encapsulating adhesive and the encapsulation substrate, and between the encapsulating adhesive and the light-emitting element group. Then, cutting the light-emitting component to form a light-emitting device including at least two light-emitting element groups, so that the light-emitting device has a larger size and more light-emitting pins, which can improve the thrust of the light-emitting pins and the thrust of the light-emitting device itself, and further improve the mounting stability of the light-emitting device. Description of the Drawings

[0033] Figure 1 is a flowchart of a method for preparing a light-emitting device provided by an embodiment of the present invention;

[0034] Figure 2 is a schematic structural diagram of a process for preparing a light-emitting device provided by an embodiment of the present invention;

[0035] Figure 3 A top - view structural schematic diagram of a packaging substrate provided by an embodiment of the present invention;

[0036] Figure 4 A preparation flow chart of a packaging substrate forming a light - emitting element group provided by an embodiment of the present invention;

[0037] Figure 5 A top - view structural schematic diagram of a packaging substrate including a light - emitting element group provided by an embodiment of the present invention;

[0038] Figure 6 A preparation flow chart of a light - emitting component provided by an embodiment of the present invention;

[0039] Figure 7 A process structural schematic diagram of preparing a light - emitting component provided by an embodiment of the present invention;

[0040] Figure 8 A structural schematic diagram of a packaging substrate with a light - emitting element group and packaging glue provided by an embodiment of the present invention;

[0041] Figure 9 A flow chart of cutting a light - emitting component provided by an embodiment of the present invention;

[0042] Figure 10 A process structural schematic diagram of cutting a light - emitting component to form a light - emitting device provided by an embodiment of the present invention;

[0043] Figure 11 A structural schematic diagram of a light - emitting component with a part of the transparent glue layer removed provided by an embodiment of the present invention;

[0044] Figure 12 Another structural schematic diagram of a light - emitting component with a part of the transparent glue layer removed provided by an embodiment of the present invention;

[0045] Figure 13 A back - view schematic diagram of a light - emitting device provided by an embodiment of the present invention;

[0046] Figure 14 A top - view structural schematic diagram of a circuit board in a light - emitting device provided by an embodiment of the present invention. Detailed implementation manners

[0047] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all the structures.

[0048] Figure 1 A flow chart of a preparation method of a light - emitting device provided by an embodiment of the present invention,Figure 2 A schematic structural diagram of a process for preparing a light-emitting device provided by an embodiment of the present invention is shown as Figure 1 shown. The preparation method of the light-emitting device includes:

[0049] S101. Provide encapsulant and an encapsulation substrate with multiple light-emitting element groups mounted thereon.

[0050] Among them, Figure 3 a top-view structural diagram of an encapsulation substrate provided by an embodiment of the present invention is shown as Figure 3 shown. The encapsulation substrate 10 includes multiple die-bonding areas 11. Referring to Figure 2 and Figure 3 , the surface of the encapsulation substrate 10 close to the light-emitting element group 20 is the first surface 101, the surface of the encapsulation substrate 10 facing away from the light-emitting element group 20 is the second surface 102, the die-bonding areas 11 are located on the first surface 101, and the light-emitting element group 20 is fixed in the die-bonding areas 11. The die-bonding areas 11 may include multiple pads so that the light-emitting element group 20 is electrically connected to the pads and then attached to the encapsulation substrate 10. The surface of the encapsulation substrate 10 facing away from the light-emitting element group 20 includes multiple light-emitting pins 12, and the light-emitting pins 12 may be electrically connected to the electrical signal pads in other modules to transmit the electrical signals required for operation to the light-emitting element group 20 through the light-emitting pins 12 and the encapsulation substrate 10.

[0051] Specifically, the encapsulation substrate 10 includes metal materials such as aluminum and copper, or ceramic materials such as aluminum oxide (Al2O3) and aluminum nitride (AlN). The light-emitting element group 20 may include three light-emitting elements, namely a red light-emitting element, a blue light-emitting element, and a green light-emitting element. The light-emitting elements include light-emitting diodes and may also be others, which can be set according to actual needs. The process of providing the encapsulation substrate 10 with multiple light-emitting element groups 20 mounted thereon can refer to the following description. First, provide the encapsulation substrate 10 without the light-emitting element group 20 mounted thereon, and then mount each light-emitting element group 20 at each die-bonding area 11 respectively to form the encapsulation substrate 10 with multiple light-emitting element groups 20 mounted thereon. The encapsulant 30 includes a colloid such as epoxy resin, and the size of the encapsulant 30 is the same as that of the encapsulation substrate 10.

[0052] S102. Place the encapsulant on the surface of the light-emitting element group facing away from the encapsulation substrate and press the encapsulant to form a light-emitting assembly.

[0053] Specifically, a vacuum press can be used to provide pressure to the side of the encapsulant 30 facing away from the encapsulation substrate 10 to apply pressure to the encapsulant 30 so that the encapsulant 30 fits tightly with the encapsulation substrate 10 and the light-emitting element group 20, improving the fitting reliability between the encapsulant 30 and the encapsulation substrate 10 and the light-emitting element group 20 to form a light-emitting assembly.

[0054] S103, cutting the light-emitting assembly to form a light-emitting device including at least two light-emitting element groups.

[0055] It is understandable that the light emitting device in the prior art includes only one light emitting element group, which makes the light emitting device smaller in size. When mounted on an external circuit board, the contact area is smaller, so the pin thrust is also smaller, making it easy to fall off.

[0056] Specifically, refer to Figure 2 and Figure 3 , the light emitting element group 20 and the packaging glue 30 are Figure 3 After the package substrate 10 is bonded, cutting can be performed in the non-crystal-bonding area between two adjacent crystal-bonding areas 11 to cut out a light-emitting device including at least two light-emitting element groups 20. By forming a light-emitting device including more than two light-emitting element groups 20, the overall size of the light-emitting device is increased, and the number of light-emitting pins on the side away from the light-emitting element group 20 in the light-emitting device is increased, thereby increasing the thrust of the light-emitting pins and the overall thrust of the light-emitting device.

[0057] The technical solution of the present invention provides packaging glue and a packaging substrate with multiple light-emitting element groups mounted thereon, places the packaging glue on a side surface of the light-emitting element group away from the packaging substrate, and presses the packaging glue to form a light-emitting component, wherein the packaging glue is bonded to the packaging substrate and the light-emitting element group to improve the bonding firmness and stability between the light-emitting element group and the packaging substrate, the packaging glue and the packaging substrate, and the packaging glue and the light-emitting element group, and then cuts the light-emitting component to form a light-emitting device including at least two light-emitting element groups, so that the light-emitting device has a larger size and more light-emitting pins, which can increase the thrust of the light-emitting pins and the thrust of the light-emitting device itself, thereby improving the mounting stability of the light-emitting device.

[0058] In an optional embodiment, Figure 4 A preparation flow chart of a package substrate including a light-emitting element group provided in an embodiment of the present invention, Figure 5 A schematic diagram of a top view of a packaging substrate including a light-emitting element group provided in an embodiment of the present invention, such as Figure 4 As shown, a packaging substrate with multiple light-emitting element groups mounted thereon is provided, comprising:

[0059] S111. Provide a packaging substrate.

[0060] The packaging substrate includes a plurality of die-bonding regions, and each die-bonding region includes a plurality of positive electrode pads and negative electrode pads that are arranged in one-to-one correspondence with the positive electrode pads.

[0061] For details, please refer to Figure 3, the encapsulation substrate 10 includes a plurality of die bonding areas 11. The die bonding areas 11 include a positive electrode pad 111 and a negative electrode pad 112. The number of the positive electrode pads 111 is the same as that of the negative electrode pads 112, and can be set according to the number of light-emitting elements in the light-emitting element group 20. In an optional embodiment, the light-emitting element group 20 includes three light-emitting elements. Therefore, the die bonding area 11 can include three pairs of pad groups arranged in pairs, and each pair of pad groups is composed of a positive electrode pad 111 and a negative electrode pad 112, so that in the subsequent process, the light-emitting element group 20 can be electrically connected to the pad groups in the die bonding area 11 one by one, improving the mounting reliability.

[0062] S112. Provide a plurality of light-emitting element groups.

[0063] Among them, each light-emitting element group includes a plurality of light-emitting elements, and one side surface of the light-emitting element includes a positive electrode input terminal and a negative electrode input terminal.

[0064] Specifically, the light-emitting element group may include three light-emitting elements that emit different color light beams. For example, the light-emitting element group includes a first light-emitting element that emits a blue light beam, a second light-emitting element that emits a green light beam, and a third light-emitting element that emits a red light beam. The corresponding number of light-emitting element groups can be provided according to the number of die bonding areas provided in the encapsulation substrate. In an optional embodiment, if the number of die bonding areas provided in the encapsulation substrate is m, then m light-emitting element groups need to be provided. A positive electrode electrical signal can be provided to the positive electrode input terminal of the light-emitting element, and a negative electrode electrical signal can be provided to the negative electrode input terminal of the light-emitting element to drive the light-emitting element to emit light.

[0065] S113. Mount each light-emitting element group at each die bonding area to form an encapsulation substrate with the light-emitting element group mounted thereon.

[0066] Among them, the positive electrode input terminal is electrically connected to the positive electrode pad, and the negative electrode input terminal is electrically connected to the negative electrode pad.

[0067] Specifically, solder paste can be applied to the positive electrode pad and the negative electrode pad in the die bonding area. Then, equipment such as a chip mounter is used to align and contact the positive electrode input terminal and the negative electrode input terminal in the light-emitting element group with the positive electrode pad and the negative electrode pad respectively. Then, the encapsulation substrate provided with the light-emitting element group is integrally placed in a reflow soldering furnace, and the temperature is gradually increased to melt the solder paste. After cooling, the solder paste forms stable solder joints, so as to improve the mounting reliability and firmness between the light-emitting element group and the encapsulation substrate, and prevent the light-emitting element group from falling off during the subsequent preparation process.

[0068] In the technical solution of the embodiment of the present invention, by providing a packaging substrate including a plurality of die bonding areas, each die bonding area includes a plurality of positive pads and negative pads arranged in one-to-one correspondence with the positive pads. Then, a plurality of light-emitting element groups are provided, and one side surface of each light-emitting element in the light-emitting element group includes a positive input terminal and a negative input terminal. In this way, the positive input terminal can be electrically connected to the positive pad correspondingly through materials such as solder paste, and the negative input terminal can be electrically connected to the negative pad correspondingly, so as to mount each light-emitting element group at each die bonding area, and then form a packaging substrate with the light-emitting element group mounted thereon, improving the mounting stability and reliability between the light-emitting element group and the packaging substrate.

[0069] In an optional embodiment, the embodiment of the present invention describes the situation of forming a light-emitting component when the encapsulation glue includes a black glue layer and a transparent glue layer. Figure 6 It is a preparation flow chart of a light-emitting component provided by the embodiment of the present invention. Figure 7 It is a schematic structural diagram of a process for preparing a light-emitting component provided by the embodiment of the present invention. As Figure 6 shown, place the encapsulation glue on the side surface of the light-emitting element group facing away from the packaging substrate, and press the encapsulation glue to form a light-emitting component, including:

[0070] S121. Place the black glue layer on the side surface of the light-emitting element group facing away from the packaging substrate, and the transparent glue layer is located on the side surface of the black glue layer facing away from the packaging substrate.

[0071] Among them, referring to Figure 7 , the encapsulation glue 30 includes a black glue layer 31 and a transparent glue layer 32. 0.2% - 0.5% black agent can be added to the transparent epoxy resin material to form the black glue layer 31, and the black agent includes blackening materials such as carbon powder. The transparent glue layer 32 includes a transparent epoxy resin material.

[0072] Specifically, if the encapsulation glue is all composed of the black glue layer, after the subsequent pressing step is performed, there may be black glue remaining on the side surface of some light-emitting element groups 20 facing away from the packaging substrate 10, affecting the light output effect of the light-emitting elements. By arranging the transparent glue layer 32 on the side surface of the black glue layer 31 facing away from the packaging substrate 10, after the subsequent pressing of the encapsulation glue 30 and the light-emitting element group 20, the black glue layer 31 can be flush with the light-emitting element group 20, or the side surface of the black glue layer 31 facing away from the packaging substrate 10 is lower than the side surface of the light-emitting element group 20 facing away from the packaging substrate 10, and the transparent glue layer 32 can cover the surface and part of the side surface of the light-emitting element group 20, ensuring the light output efficiency of the light-emitting element group 20. After the subsequent pressing, the black glue layer 31 is located in the area where the light-emitting element group 20 is not provided. When the light-emitting element group 20 emits light, the black glue layer 31 shows dull black, which can improve the display contrast of the subsequent light-emitting device.

[0073] S122. Apply a pressure to the encapsulation adhesive in the direction from the transparent adhesive layer towards the encapsulation substrate to press and bond the encapsulation adhesive.

[0074] Specifically, the encapsulation adhesive can be pressed and bonded by a vacuum laminator. The pressing environment conditions are related to the thickness of the encapsulation adhesive and the thickness of the light-emitting element group, and can be set according to actual needs. In an exemplary embodiment, the thickness of the light-emitting element group is 90 μm, the thickness of the black adhesive layer 31 is 80 μm, and the thickness of the transparent adhesive layer 32 is 220 μm. The pressing environment includes: the temperature range is 70°C to 80°C, the pressure range is 0.8 Mpa to 1.5 Mpa, and the pressing duration range is 4 minutes to 8 minutes.

[0075] It can be understood that since the encapsulation adhesive has a certain hardness, it is necessary to provide a high-temperature pressing environment to melt the encapsulation adhesive at a high temperature so that the encapsulation adhesive can be closely attached to the encapsulation substrate 10. At the same time, under the action of the pressure provided by the vacuum machine, the light-emitting element group 20 can pierce the black adhesive layer 31, causing the black adhesive layer 31 to flow between adjacent two light-emitting element groups 20, preventing the black adhesive layer 31 from covering the light-emitting surface of the light-emitting element group 20, and improving the light-emitting effect of the light-emitting element group 20.

[0076] S123. Bake and cure the encapsulation substrate provided with the light-emitting element group and the encapsulation adhesive to form a light-emitting component.

[0077] Specifically, the pressed light-emitting element group and the encapsulation substrate can be placed in a curing box for curing to improve the bonding reliability and firmness between the encapsulation adhesive and the light-emitting element group and the encapsulation substrate, and improve the overall stability of the light-emitting component. The curing environment in the curing box is related to parameters such as the material of the encapsulation adhesive. In an exemplary embodiment, the baking temperature range in the curing box is 100°C to 130°C, and the baking time is 90 minutes to 120 minutes. It can also be other values, which are not specifically limited here.

[0078] The technical solution of the embodiment of the present invention is that by placing the black adhesive layer on the surface of the light-emitting element group facing away from the encapsulation substrate, and the transparent adhesive layer is located on the surface of the black adhesive layer facing away from the encapsulation substrate, after applying a pressure to the encapsulation adhesive in the direction from the transparent adhesive layer towards the encapsulation substrate, the light-emitting element group can pierce the black adhesive layer in the encapsulation adhesive, so that the black adhesive layer is located in the area between adjacent two light-emitting element groups, avoiding the black adhesive layer from covering the light-emitting surface of the light-emitting element group and affecting the light-emitting effect of the light-emitting element group. Then, the encapsulation substrate provided with the light-emitting element group and the encapsulation adhesive is baked and cured to fix the encapsulation adhesive, improve the bonding tightness and reliability between the encapsulation adhesive and the light-emitting element group and the encapsulation substrate, and improve the overall firmness and stability of the light-emitting component.

[0079] On the basis of the above embodiment, the embodiment of the present invention describes the thickness of the black adhesive layer. Optionally, Figure 8The figure is a schematic structural diagram of a packaging substrate and packaging glue with a light-emitting element group provided by an embodiment of the present invention. As shown in Figure 8 the figure, in the thickness direction Z of the packaging substrate 10, the height of the light-emitting element group 20 is h0; before the packaging glue 30 is pressed, the thickness of the black glue layer 31 is h11; where 0μm ≤ h0 - h11 ≤ 10μm.

[0080] Specifically, by setting the height h0 of the light-emitting element group 20 to be greater than or equal to the thickness h11 of the black glue layer 31, during the pressing process, it can be ensured that the light-emitting element group 20 can completely pierce through the black glue layer 31, preventing the black glue layer 31 from remaining on the surface of the light-emitting element group 20 and affecting the light-emitting effect of the light-emitting element group 20. If the difference between the height h0 of the light-emitting element group 20 and the thickness h11 of the black glue layer 31 is greater than 10μm, the thickness of the black glue layer 31 is relatively thin at this time. When the light-emitting element group 20 includes a first light-emitting element that emits blue light beams, the side of the first light-emitting element may be sapphire, and sapphire can reflect light beams. When the thickness of the black glue layer 31 is relatively thin, the black glue layer 31 cannot completely wrap the side of the first light-emitting element. When the first light-emitting element emits light beams, the sapphire on the side of the first light-emitting element can emit the light beams in a direction parallel to the plane where the packaging substrate 10 is located, affecting the light-emitting efficiency of the first light-emitting element. Therefore, by setting the difference between the height h0 of the light-emitting element group 20 and the thickness h11 of the black glue layer 31 to be within 0μm to 10μm, the light-emitting efficiency of the light-emitting element group 20 can be ensured.

[0081] Based on the above embodiments, the embodiments of the present invention illustrate the case of cutting a light-emitting component to form a light-emitting device including at least two light-emitting element groups. Optionally, Figure 9 The figure is a flowchart of cutting a light-emitting component provided by an embodiment of the present invention. Figure 10 The figure is a schematic structural diagram of a process of cutting a light-emitting component to form a light-emitting device provided by an embodiment of the present invention. As shown in Figure 9 the figure, cutting a light-emitting component to form a light-emitting device including at least two light-emitting element groups includes:

[0082] S131. Removing a part of the transparent glue layer located between some adjacent two light-emitting element groups to form a light-emitting element group distinguishing groove.

[0083] Wherein, Figure 11 The figure is a schematic structural diagram of a light-emitting component with a part of the transparent glue layer removed provided by an embodiment of the present invention. Refer to Figure 10 and Figure 11, in the light-emitting component, in the direction parallel to the plane where the encapsulation substrate 10 is located, the minimum distance between two adjacent light-emitting element groups 20 is d1. The light-emitting element group 20 located on one side of the light-emitting element group distinguishing groove 33 is the first light-emitting element group, and the light-emitting element group located on the other side of the light-emitting element group distinguishing groove 33 is the second light-emitting element group. In the direction from the first light-emitting element group to the second light-emitting element group, the width of the light-emitting element group distinguishing groove 33 is d2; where 0μm < d2 ≤ d1.

[0084] Specifically, since some of the light-emitting devices mounted on the product only include one light-emitting element group 20, after the light-emitting device including only one light-emitting element group 20 is attached to the circuit board, there is a gap between two adjacent light-emitting devices or light-emitting element groups 20. To meet this design requirement, by removing part of the transparent adhesive layer 32 located between some adjacent two light-emitting element groups 20, a light-emitting element group distinguishing groove 33 is formed in the part where the transparent adhesive layer 32 is removed, so as to correspond to the gap in the product design and improve the applicability and practicality of the light-emitting device.

[0085] S132. Cut out the area including at least two light-emitting element groups from the light-emitting component to form a light-emitting device.

[0086] Among them, a light-emitting element group distinguishing groove is included between two adjacent light-emitting element groups in the light-emitting device.

[0087] Specifically, referring to Figure 11 , the light-emitting component can be cut along the cutting line B-B' to cut out a light-emitting device including two light-emitting element groups 20. Or, referring to Figure 12 , the light-emitting element group distinguishing groove 33 includes a first light-emitting element group distinguishing groove 331 extending along the first direction Y and a second light-emitting element group distinguishing groove 332 extending along the second direction X. The second direction X is parallel to the row arrangement direction of the light-emitting element groups 20, and the first direction Y is parallel to the column arrangement direction of the light-emitting element groups 20. The overlapping area of the first light-emitting element group distinguishing groove 331 and the second light-emitting element group distinguishing groove 332 is the cross center 50. The four light-emitting element groups 20 located around the cross center 50 and the light-emitting element group distinguishing grooves (331 and 332) located between the four light-emitting element groups 20 constitute a light-emitting device. Cut along the cutting line C-C' to cut out a light-emitting device including four light-emitting element groups 20, so that the light-emitting device has a relatively large area as a whole, improving the thrust of the light-emitting pins in the light-emitting device and enhancing the assembly stability of the light-emitting device.

[0088] In the technical solution of the embodiment of the present invention, by removing a part of the transparent adhesive layer located between some adjacent two light-emitting element groups to form a light-emitting element group distinguishing groove, and then cutting out the area including at least two light-emitting element groups from the light-emitting component to form a light-emitting device, and in the formed light-emitting device, a light-emitting element group distinguishing groove is included between adjacent two light-emitting element groups, so that the light-emitting device can adapt to the gap in the product design, and the applicability and practicability of the light-emitting device are improved.

[0089] Optionally, continue to refer to Figure 8 , in the thickness direction Z of the encapsulation substrate 10, the thickness of the transparent adhesive layer 32 is h2; wherein, h2≥0.5μm.

[0090] Specifically, if the thickness h2 of the transparent adhesive layer 32 is less than 0.5μm, when applying a pressing force to the encapsulation adhesive, it cannot be guaranteed that the light-emitting element group 20 can pierce the black adhesive layer 31, and as a result, the black adhesive layer 31 remains on the side of some light-emitting element groups 20 facing away from the encapsulation substrate 10, thereby affecting the light-emitting effect of the light-emitting element group 20. Therefore, by setting the thickness h2 of the transparent adhesive layer 32 to be greater than or equal to 0.5μm, it is ensured that no black adhesive layer 31 remains on the side of the light-emitting element group 20 facing away from the encapsulation substrate 10, and the light-emitting effect of the light-emitting element group 20 is guaranteed. In addition, on the basis that the thickness h2 of the transparent adhesive layer 32 is greater than or equal to 0.5μm, the thickness of the transparent adhesive layer 32 can be set according to actual needs. When a light-emitting device with a larger height is required for the designed product, the thickness h2 of the transparent adhesive layer 32 can be appropriately increased. In an exemplary embodiment, the thickness h2 of the transparent adhesive layer 32 is 220μm.

[0091] In an optional embodiment, cutting the light-emitting component to form a light-emitting device including at least two light-emitting element groups includes: cutting the light-emitting component to form a light-emitting device including M light-emitting element groups; wherein, M = 2n, and n is a positive integer.

[0092] Specifically, since most of the existing display modules are rectangular, and the area where the light-emitting device is arranged in the display module is also rectangular, therefore, by setting the number of light-emitting element groups in the light-emitting device to be an even number, the light-emitting device can be matched with the light-emitting device setting area in the display module, and the assembly simplicity and reliability are improved.

[0093] Optionally, the light-emitting device includes four light-emitting element groups, and the surface of the light-emitting device facing away from the light-emitting element groups includes eight light-emitting pins.

[0094] Specifically, Figure 13 is a schematic diagram of the back of a light-emitting device provided by an embodiment of the present invention. Refer to Figure 12 and Figure 13 , Figure 13 in the light-emitting device 40, and Figure 12corresponding to the light-emitting device cut out along the cutting line C-C' in the [description] and including four light-emitting element groups 20 Figure 12 The figure shows a front top view of the light-emitting device or light-emitting component. Figure 13 The figure shows the back structure diagram of the light-emitting device, that is, the side of the encapsulation substrate in the light-emitting device facing away from the light-emitting element group. There are 8 light-emitting pins provided on this side. Compared with the light-emitting device including only one light-emitting element group, the number of light-emitting pins of the light-emitting device with four light-emitting element groups is larger, the contact area with the circuit board in the display module increases, and the pin thrust increases by 6 to 8 times. This can improve the subsequent mounting stability and reliability of the light-emitting device, and at the same time can improve the mounting efficiency, with the mounting efficiency increased by more than 4 times.

[0095] Based on the same inventive concept, the present invention also provides a light-emitting device, which is obtained by the preparation method of the light-emitting device provided in the above embodiment of the present invention, and has the same beneficial effects as the preparation method. The same parts can refer to the above description and will not be repeated here.

[0096] Based on the same inventive concept, an embodiment of the present invention also provides a light-emitting device Figure 14 is a top view structural schematic diagram of a circuit board in a light-emitting device provided by an embodiment of the present invention. Refer to Figures 12 - 14 , one side surface of the circuit board 60 includes a pin pad group 61 provided corresponding to each light-emitting device 40 one by one. Each pin pad 610 in the pin pad group 61 is provided corresponding to each light-emitting pin 12 in the light-emitting device 40. The side of the light-emitting device 40 provided with the light-emitting pins 12 is welded and mounted to the circuit board 60, so that each pin pad 610 is electrically connected to each light-emitting pin 12 one by one to form a light-emitting device.

[0097] Specifically, since the light-emitting device in the light-emitting device includes an overall structure composed of multiple light-emitting element groups, therefore, after the light-emitting device is attached to the circuit board, the pin thrust of the light-emitting device increases, avoiding problems such as the light-emitting device falling off the circuit board, improving the attachment stability between the light-emitting device and the circuit board, and further improving the preparation reliability of the light-emitting device.

[0098] Note that the above is only a preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments, combinations with each other, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to only the above embodiments. Without departing from the inventive concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for preparing a light-emitting device, characterized in that, Comprising: Providing an encapsulant and an encapsulation substrate mounted with a plurality of light-emitting element groups; The encapsulation substrate includes a plurality of die bonding regions, and the light-emitting element groups are fixed in the die bonding regions; One side surface of the encapsulation substrate facing away from the light-emitting element groups includes a plurality of light-emitting pins; Placing the encapsulant on one side surface of the light-emitting element groups facing away from the encapsulation substrate, and pressing the encapsulant to form a light-emitting component; the encapsulant includes a black glue layer and a transparent glue layer, the black glue layer is located in the region where the light-emitting element groups are not provided, and the transparent glue layer covers the surface and part of the side surfaces of the light-emitting element groups; Cutting the light-emitting component to form a light-emitting device including at least two of the light-emitting element groups; Among them, cutting the light-emitting component to form a light-emitting device including at least two of the light-emitting element groups includes: removing part of the transparent glue layer located between some adjacent two of the light-emitting element groups to form a light-emitting element group distinguishing groove; A light-emitting element group distinguishing groove is included between two adjacent light-emitting element groups in the light-emitting device; Cutting out the region including at least two of the light-emitting element groups from the light-emitting component to form the light-emitting device; a light-emitting element group distinguishing groove is included between two adjacent light-emitting element groups in the light-emitting device.

2. The manufacturing method of the light-emitting device according to claim 1, characterized in that, Providing an encapsulation substrate mounted with a plurality of light-emitting element groups, including: Providing the encapsulation substrate; the encapsulation substrate includes a plurality of die bonding regions, and each die bonding region includes a plurality of positive electrode pads and negative electrode pads arranged in one-to-one correspondence with the positive electrode pads; Providing a plurality of the light-emitting element groups; each light-emitting element group includes a plurality of light-emitting elements, and one side surface of the light-emitting element includes a positive electrode input end and a negative electrode input end; Mounting each light-emitting element group at each die bonding region to form the encapsulation substrate mounted with the light-emitting element groups; wherein, the positive electrode input end is electrically connected to the positive electrode pad, and the negative electrode input end is electrically connected to the negative electrode pad.

3. The method for preparing a light-emitting device according to claim 1, wherein, The encapsulant includes a black glue layer and a transparent glue layer; Placing the encapsulant on one side surface of the light-emitting element groups facing away from the encapsulation substrate, and pressing the encapsulant to form a light-emitting component, including: Placing the black glue layer on one side surface of the light-emitting element groups facing away from the encapsulation substrate, and the transparent glue layer is located on one side surface of the black glue layer facing away from the encapsulation substrate; Applying a pressure to the encapsulant in the direction from the transparent glue layer to the encapsulation substrate to press the encapsulant; Baking and curing the encapsulation substrate provided with the light-emitting element groups and the encapsulant to form the light-emitting component.

4. The method for preparing a light-emitting device according to claim 3, wherein In the thickness direction of the encapsulation substrate, the height of the light-emitting element group is h0; before pressing the encapsulant, the thickness of the black glue layer is h11; Among them, 0μm ≤ h0 - h11 ≤ 10μm.

5. The manufacturing method of the light-emitting device according to claim 3, characterized in that, In the light-emitting component, in the direction parallel to the plane where the encapsulation substrate is located, the minimum distance between two adjacent light-emitting element groups is d1; Cutting the light-emitting component to form a light-emitting device including at least two of the light-emitting element groups, including: A portion of the transparent adhesive layer between two adjacent light-emitting element groups is removed to form a light-emitting element group distinguishing groove; the light-emitting element group located on one side of the light-emitting element group distinguishing groove is a first light-emitting element group, and the light-emitting element group located on the other side of the light-emitting element group distinguishing groove is a second light-emitting element group, and the width of the light-emitting element group distinguishing groove along the direction from the first light-emitting element group to the second light-emitting element group is d2; wherein 0 μm<d2≤d1; A region including at least two of the light emitting element groups is cut out from the light emitting component to form the light emitting device; and a groove for distinguishing the light emitting element groups is provided between two adjacent light emitting element groups in the light emitting device.

6. The method for preparing a light-emitting device according to claim 3, wherein, In the thickness direction of the packaging substrate, the thickness of the transparent adhesive layer is h2; Among them, h2≥0.5μm.

7. The method for preparing the light-emitting device according to claim 1, wherein Cutting the light-emitting assembly to form a light-emitting device including at least two of the light-emitting element groups comprises: The light-emitting assembly is cut to form a light-emitting device including M light-emitting element groups; wherein M=2n, and n is a positive integer.

8. The manufacturing method of the light-emitting device according to claim 7, characterized in that, The light emitting device comprises four light emitting element groups, and a surface of the light emitting device on one side away from the light emitting element groups comprises eight light emitting pins.

9. A light-emitting device, characterized in that, The light-emitting device is prepared by the preparation method of the light-emitting device according to any one of claims 1 to 8.

10. A light-emitting device, characterized in that, include: A circuit board and a light emitting device as claimed in claim 9; The light-emitting device is mounted on the circuit board; one side surface of the circuit board includes a pin pad group arranged in one-to-one correspondence with each of the light-emitting devices, each pin pad in the pin pad group is arranged in one-to-one correspondence with each light-emitting pin in the light-emitting device, and each pin pad is electrically connected to each light-emitting pin in one-to-one correspondence.

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