Semiconductor production method and system based on full automation, terminal and medium

Abstract

The invention provides a semiconductor production method and system based on full automation, a terminal and a medium. The method comprises the steps that a full-automatic engine is configured to monitor the operation condition of a machine table on a semiconductor production line in real time; a circulation program for semiconductor production is configured in the full-automatic engine; and judging one of product running, daily testing and machine period testing which are to be executed by the machine subsequently based on the full-automatic engine, and automatically sending a corresponding wafer batch to the machine in advance according to a judgment result. According to the invention, mechanisms such as system automatic calculation, advanced stock-up, advanced cargo carrying and advanced preparation of a measuring machine wafer are added, and full-automatic cargo running (including product cargo running, daily machine measuring, periodic machine measuring and the like) is realized by the system, so that continuous cargo running of a machine table is realized, uninterrupted zero idle is realized, and the system efficiency is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor wafer processing and production technology, and in particular to a semiconductor production method, system, terminal and medium based on full automation. Background Art

[0002] At present, the mainstream solutions provided by semiconductor 12-inch system manufacturers mainly realize fully automatic delivery and delivery for product running (PROD RUN), that is, the third-generation running system (PROD Full Auto3 Run). This solution is based on Figure 1 It has gradually evolved and progressed in the sequence shown in: Manual, the first generation cargo transportation system based on the machine automatic cargo transportation program EAP (Equipment Automatic Program), the second generation cargo transportation system based on the machine automatic cargo transportation program EAP (Equipment Automatic Program) and the overhead crane handling system MCS (Material Control System), and the third generation cargo transportation system based on automation management AMA (Activity Manager for Automation), machine automatic cargo transportation program EAP (Equipment Automatic Program) and the overhead crane handling system MCS (Material Control System).

[0003] The above existing technical solutions are mainly to realize the partial automatic delivery of products, and their shortcomings are mainly as follows:

[0004] (1) The existing technical solutions do not have the concept of moving goods in advance and preparing goods in advance, so the machine idle time (Idle Time) will be very long, and the capacity of the machine cannot be fully utilized to improve production efficiency.

[0005] (2) The existing technical solutions for daily machine testing (EQ Test) and periodic machine testing (PM-EQ Test) do not take into account the advance preparation of test wafers and pre-measurement. There are still many parts that require manual processing. Therefore, engineers still spend a lot of time on repetitive trivial matters every day, which is time-consuming and inefficient. Summary of the invention

[0006] In view of the shortcomings of the prior art mentioned above, the purpose of the present application is to provide a semiconductor production method, system, terminal and medium based on full automation, so as to solve the technical problem of how to achieve continuous delivery of all machines online in a fully automated manner.

[0007] To achieve the above-mentioned purpose and other related purposes, the first aspect of the present application provides a semiconductor production method based on full automation, including: configuring a fully automatic engine to monitor the operation status of machines on the semiconductor production line in real time; the fully automatic engine is configured with a semiconductor production flow program; based on the fully automatic engine, judging one of the product delivery, daily testing and machine cycle testing to be performed by the machine in the future, and automatically dispatching the corresponding wafer batch to the machine in advance according to the judgment result.

[0008] In some embodiments of the first aspect of the present application, the semiconductor production flow program configured in the fully automatic engine includes: the production information management system determines the wafer batches currently available for delivery according to the current operating status of the machine, and sends the list information of the wafer batches available for delivery to the real-time delivery system.

[0009] In some embodiments of the first aspect of the present application, when the fully automatic engine determines that the subsequent execution of the machine is to run product delivery, the following is performed: based on the mechanism of advance stocking and unloading when the wafer loading system status is empty, the time node for advance stocking is automatically calculated and determined, and the stock is prepared in advance to the cargo storage carrier closest to the target machine.

[0010] In some embodiments of the first aspect of the present application, the mechanism based on advance stocking and unloading when the wafer loading system status is empty automatically calculates and determines the time node for advance stocking and prepares the goods in advance to the cargo storage carrier closest to the target machine, including the following: pre-building the modeling data of product delivery into the production information management system; configuring an advance stocking engine; using the advance stocking engine to monitor in real time the batches of wafers that can be delivered in the cargo storage carrier corresponding to the machine, to determine whether the advance stocking condition is triggered; if the advance stocking condition is triggered, the next batch of wafers that can be delivered will be delivered to the cargo storage carrier corresponding to the machine in advance. The automatic delivery system automatically delivers the wafers to the machine through the cargo storage carrier so that the wafers can be picked up from the cargo storage carrier to the machine when the wafer loading system is empty. When the wafer loading system outside the machine is empty or the wafer storage space inside the machine increases to a preset amount, the automatic delivery system performs automatic delivery. The overhead crane transport system transports the wafer batches prepared in advance on the cargo storage carrier to the wafer loading system. After the delivery of the previous batch of wafers in the machine is completed, the overhead crane transport system moves the goods to the next station, which is the nearest cargo storage carrier to the machine, and the equipment automation programming system then delivers the next batch of wafers to keep the machine in a zero idle state.

[0011] In some embodiments of the first aspect of the present application, when the fully automatic engine determines that the machine will subsequently perform routine machine testing, the following is performed: the fully automatic engine determines the time node at which the machine performs routine machine testing, calculates the time required to prepare the test machine wafers in advance, automatically completes wafer batching and pre-measurement in advance, and transports the test machine wafers to the pre-measurement process site to wait.

[0012] In some embodiments of the first aspect of the present application, the fully automatic engine determines the time node of the machine for daily machine testing, calculates the time required for preparing the machine testing wafer in advance, automatically completes wafer batching and pre-measurement in advance, and transports the machine testing wafer to the pre-measurement process site for waiting, which includes the following: pre-building the modeling data of the daily machine testing into the production information management system; the real-time computer station needs to prepare the machine testing wafer in advance, and completes the batching and pre-measurement in advance through the watchdog circuit of the automatic delivery system to wait for the delivery at the site; at the post-measurement site machine, the machine testing wafer is preferentially delivered according to the preset priority rules; for the machine testing wafer, it is automatically determined whether to reuse, recycle and downgrade it, and then enter the various processes of daily machine testing to perform related processes; wherein, the relationship between the reuse, recycling and downgrade includes: each cycle of traversing a pre-measurement, daily machine testing and post-measurement is one use; when the maximum number of uses is reached, it enters the recycling stage for continued use; when the maximum number of recycling is reached, it enters the downgrade stage for use by a lower-level machine.

[0013] In some embodiments of the first aspect of the present application, when the fully automatic engine determines that the machine will subsequently perform cycle testing, the following is performed: based on the end time of the cycle testing, the time point for preparing the test wafers required for the cycle testing is automatically calculated in advance to complete batch processing and pre-measurement in advance.

[0014] To achieve the above-mentioned purpose and other related purposes, the second aspect of the present application provides a semiconductor production system based on full automation, including: a fully automatic engine configuration module, used to configure the fully automatic engine to monitor the operation status of the machine on the semiconductor production line in real time; the fully automatic engine is configured with a semiconductor production flow program; a wafer batch pre-dispatch module, used to judge one of the product delivery, daily testing and machine cycle testing to be performed by the machine in the future based on the fully automatic engine, and automatically dispatch the corresponding wafer batch to the machine in advance according to the judgment result.

[0015] To achieve the above-mentioned purpose and other related purposes, the third aspect of the present application provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the semiconductor production method based on full automation is implemented.

[0016] To achieve the above-mentioned purpose and other related purposes, the fourth aspect of the present application provides an electronic terminal, including: a processor and a memory; the memory is used to store computer programs, and the processor is used to execute the computer programs stored in the memory, so that the terminal executes the semiconductor production method based on full automation.

[0017] As described above, the fully automated semiconductor production method, system, terminal and medium of the present application have the following beneficial effects:

[0018] (1) By adding a fully automatic engine, the system automatically determines the next action of the machine, prepares in advance and automatically dispatches the corresponding wafer batches, saving time and achieving zero idle operation of the machine.

[0019] (2) Introduce a mechanism for preparing and moving goods in advance, so that the goods to be transported by the machine next are sent to the cargo storage carrier OHB in advance, and the goods are sent to the load port immediately when the load port of the waiting machine is empty, so as to reduce the waiting time of the MCS system.

[0020] (3) For all wafers required for daily EQ Test and periodic EQ Test, the system will automatically batch and perform pre-measurement at the appropriate time, waiting for the wafers to be delivered at the process site, thus avoiding the waiting time for the preparation of wafers and pre-measurement operations.

[0021] (4) Daily machine testing (EQ Test), periodic machine testing (PM-EQ Test), warm-up (SEASON), etc. are all automatically judged and prepared by the system in advance, reducing manual operations and greatly improving work efficiency. Any abnormal situation in the system will be notified to relevant personnel in a timely manner for processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Shown is a schematic diagram of the evolution process of a semiconductor 12-inch system in one embodiment of the present application.

[0023] Figure 2 Shown is a flow chart of a fully automated semiconductor production method in one embodiment of the present application.

[0024] Figure 3 Shown is a schematic diagram of a semiconductor production flow procedure configured in a fully automatic engine in one embodiment of the present application.

[0025] Figure 4 Shown is a schematic diagram of the process of executing product delivery based on a fully automatic engine in one embodiment of the present application.

[0026] Figure 5 Shown is a schematic diagram of the process of fully automatic cargo transportation in one embodiment of the present application.

[0027] Figure 6 Shown is a schematic diagram of a process for performing daily machine testing based on a fully automatic engine in one embodiment of the present application.

[0028] Figure 7 Shown is a schematic diagram of the process of daily machine testing in one embodiment of the present application.

[0029] Figure 8 Shown is a flow chart of executing periodic machine testing based on a fully automatic engine in one embodiment of the present application.

[0030] Fig. 9 Shown is a schematic diagram of the process of a periodic test machine in one embodiment of the present application.

[0031] Fig.10 Shown is a schematic diagram of the structure of an electronic terminal in one embodiment of the present application.

[0032] Fig.11 Shown is a structural schematic diagram of a fully automated semiconductor production system in one embodiment of the present application. DETAILED DESCRIPTION

[0033] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0034] It should be noted that in the following description, with reference to the accompanying drawings, several embodiments of the present application are described in the accompanying drawings. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0035] In this application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "hold" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions or operations is inherently mutually exclusive in some way.

[0037] In order to solve the problems in the above-mentioned background technology, the present invention provides a semiconductor production method, system, terminal and medium based on full automation, aiming to provide a technical solution for realizing continuous running of all machines on the line in a fully automated manner. According to the characteristics of each area, the system automatically determines the type of product that the machine will run subsequently. The system automatically completes processes such as product running (ProdRun), daily machine testing (EQ Test), periodic machine testing (PM-EQ Test), and warm-up (SEASON), and realizes zero idle time of the machine (0 Idle Time), thereby maximizing the production efficiency of the machine, reducing human intervention and improving the work efficiency of personnel.

[0038] At the same time, in order to make the purpose, technical solution and advantages of the present invention more clear, the technical solution in the embodiment of the present invention is further described in detail through the following embodiments and in combination with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention and are not used to limit the invention.

[0039] Before further describing the present invention in detail, the nouns and terms involved in the embodiments of the present invention are explained. The nouns and terms involved in the embodiments of the present invention are applicable to the following interpretations:

[0040] <1> Season film: After the machine is started, insert a Season film to warm up the machine.

[0041] <2> Inch: Inch, a unit of length in the British and American systems.

[0042] <3> MES system: a production information management system for the execution layer of the workshop of manufacturing enterprises. MES system can provide enterprises with management modules including manufacturing data management, planning and scheduling management, production scheduling management, inventory management, quality management, human resources management, work center / equipment management, tool and fixture management, procurement management, cost management, project kanban management, production process control, bottom-level data integration analysis, raw-level data integration decomposition, etc., so as to create a solid, reliable, comprehensive and feasible manufacturing collaborative management platform.

[0043] <4> RTD system: Real-time dispatch system, used to help semiconductor factories optimize dispatch, improve production efficiency and increase equipment utilization.

[0044] <5> EQP (Equipment): Semiconductor production equipment, that is, machine.

[0045] <6> MCS (Material Control System): Overhead crane handling system.

[0046] <7> EAP (Equipment Automation Programming): Equipment Automation Programming System, also known as Machine Automation System, is a system used to control semiconductor manufacturing equipment for automated production. The EAP system is integrated with the MES system to verify product information and automatically do accounting. At the same time, it collects process data and equipment parameter data during product generation, helping to improve the production efficiency of semiconductor factories, avoid manual operation errors, and improve product yield.

[0047] The embodiments of the present invention provide a semiconductor production method based on full automation, a system based on the semiconductor production method based on full automation, and a storage medium storing an executable program for implementing the semiconductor production method based on full automation. As far as the implementation of the semiconductor production method based on full automation is concerned, the embodiments of the present invention will illustrate an exemplary implementation scenario of semiconductor production based on full automation.

[0048] like Figure 2 As shown, a schematic diagram of a process flow of a fully automated semiconductor production method in an embodiment of the present invention is shown. The fully automated semiconductor production method in this embodiment mainly includes the following steps:

[0049] Step S21: configuring a fully automatic engine to monitor the operation status of the machines on the semiconductor production line in real time; the fully automatic engine is configured with a semiconductor production flow program.

[0050] In an embodiment of the present invention, the semiconductor production flow program configured in the fully automatic engine includes: the production information management system determines the wafer batches currently available for delivery according to the current operating status of the machine, and sends the list information of the wafer batches available for delivery to the real-time delivery system.

[0051] It should be understood that the MES is a production information management system for the execution layer of the workshop of manufacturing enterprises, which can provide enterprises with management modules including manufacturing data management, planning and scheduling management, production scheduling management, inventory management, quality management, human resources management, work center / equipment management, tool and fixture management, procurement management, cost management, project kanban management, production process control, bottom-level data integration analysis, production-level data integration decomposition, etc. The real-time dispatch system RTD is used to help semiconductor factories optimize dispatch, improve production efficiency, and increase equipment utilization.

[0052] Step S22: determining one of the product delivery, daily test and machine cycle test to be subsequently performed by the machine based on the fully automatic engine, and automatically dispatching a corresponding wafer batch to the machine in advance according to the determination result.

[0053] In an embodiment of the present invention, after the semiconductor production flow program configured in the fully automatic engine sends the list information of wafer batches that can be used for delivery to the real-time delivery system, it also executes the following: judging one of the subsequent product delivery, daily testing and machine cycle testing to be performed according to the status of the wafer loading system of the machine.

[0054] Furthermore, if the daily machine test (EQ Test) is to be performed, the corresponding wafer batches used for monitoring and inspection will be sent to the real-time dispatch system RTD; if the periodic machine test (PM-EQ Test) is to be performed, the corresponding wafer batches used for monitoring and inspection will be sent to the real-time dispatch system RTD; if the product run (Prod Run) is to be performed, the corresponding wafer batches used for running or monitoring and inspection will be sent to the real-time dispatch system RTD, and the real-time dispatch system RTD will dispatch the goods according to the priority level.

[0055] Combination Figure 3 The specific process of the semiconductor production flow program configured in the fully automatic engine is explained: according to whether the wafer loading system of the machine is idle (EQ Load Port Idle), it is determined which process to execute next among product running (Prod Run), daily machine testing (EQ Test), and periodic machine testing (PM-EQ Test).

[0056] In the embodiment of the present invention, when the fully automatic engine determines that the subsequent operation of the machine is to run product delivery, the following is performed: based on the mechanism of preparing goods in advance and unloading goods when the wafer loading system is empty, the time node for preparing goods in advance is automatically calculated and the goods are prepared in advance to the cargo storage carrier closest to the target machine. The advantage of such operation is that it can reduce the time for waiting for the overhead crane handling system (MCS) to transport goods after the machine is idle (Idle), and realize continuous delivery.

[0057] Furthermore, the mechanism based on advance stocking and unloading when the wafer loading system is empty automatically calculates and determines the time node for advance stocking and stocks the goods in advance to the goods storage carrier closest to the target machine, specifically including Figure 4 The various sub-steps shown in:

[0058] Step S41: pre-build the product delivery modeling data into the production information management system.

[0059] Exemplarily, the modeling data of product delivery includes, but is not limited to, product delivery process (PROD FLOW), machine EQP, various process parameters (RECIPE), measurement-related data collection (EDC), etc.

[0060] Step S42: configure an advance stocking engine; use the advance stocking engine to monitor in real time the batches of wafers available for shipment in the cargo storage carrier corresponding to the machine, so as to determine whether the advance stocking conditions are triggered; if the advance stocking conditions are triggered, the next batch of wafers available for shipment will be delivered to the cargo storage carrier corresponding to the machine in advance, so as to be picked up from the cargo storage carrier to the machine when the wafer loading system status is empty.

[0061] In some examples, the advance stocking conditions include: the number of wafer batches that can be shipped in the cargo storage carrier corresponding to the machine is less than the water level; or the number of wafers remaining in the batch that the machine is shipping is lower than a preset wafer number threshold.

[0062] Combination Figure 3 The specific process of the semiconductor production flow program configured in the fully automatic engine shown is explained as follows: first, the advance stocking engine is turned on; second, the machine needs to be stocked in advance; then the next batch of wafers that can be run (Lot) is found and sent to the cargo storage carrier (OHB) near the machine. It should be noted that there are at least two situations for advance stocking: situation 1) the number of batches in the cargo storage carrier of the machine is less than the water level; situation 2) the number of wafers remaining in the batch of goods being run by the machine is close to being run, that is, if the number of wafers remaining is lower than the preset threshold, it is considered that the current batch is close to being run.

[0063] Step S43: When the wafer loading system outside the machine is empty or the wafer storage space inside the machine increases to a preset amount, the automatic delivery system executes automatic delivery; the overhead crane transport system transports the wafer batches prepared in advance on the cargo storage carrier to the wafer loading system; after the delivery of the previous batch of wafers in the machine is completed, the overhead crane transport system moves the goods to the next station, which is the nearest cargo storage carrier to the machine, and the equipment automation programming system then runs the next batch of wafers to keep the machine in a zero idle state.

[0064] Specifically, when the wafer loading system Load Port outside the machine is empty or the number of wafer storage positions Internal Buffer inside the machine increases to a certain threshold, the automatic delivery system AMA will automatically deliver goods, and the overhead crane handling system MCS will put the wafer batch Lot prepared in advance to the cargo storage carrier (OHB) to the wafer loading system LoadPort of the machine. After a batch of goods on the machine is finished, the overhead crane handling system MCS will move the goods to the next station, the cargo storage carrier OHB closest to the cargo machine, and the equipment automation programming system EAP will then run the next batch of goods, so that the machine can be guaranteed to be 0 Idle throughout the process.

[0065] like Figure 5 As shown, a schematic diagram of the process of fully automatic cargo transportation in one embodiment of the present invention is shown, and the specific process steps are as follows:

[0066] Step A1: Advance stocking Engine: Start the advance stocking engine.

[0067] Step A2: The machine needs to be stocked in advance.

[0068] Step A3: Find the next batch of runnable Lots and send them to the OHB closest to the machine: Find the next batch of runnable wafer batches and send them to the cargo storage carrier OHB closest to the machine.

[0069] Step A4: AMA Engine automatically triggers the dispatch of goods in real time (What Next Trigger): The automatic dispatch system AMA automatically triggers the dispatch of goods in real time (What Next Trigger).

[0070] Step A5: Load Port Empty or EQ: Determine whether the wafer loading system Load Port is empty or a test needs to be performed.

[0071] Step A6: Reserve Dummy: For the machine that needs a wafer dummy, reserve the wafer dummy (ReserveDummy).

[0072] Step A7: RTD calculates the priority of Lot Run according to the Rule: The real-time delivery system RTD calculates the priority of the wafer batch according to the rule.

[0073] Step A8: check dispatch lot list: Check the list of dispatched wafer batches.

[0074] Step A9: check season lot required: Determine whether warm-up is required and prepare the warm-up wafer batches to the cargo storage carrier OHB in advance.

[0075] Step A10: check empty foup required: Determine whether an empty wafer transfer box is required.

[0076] Step A11: Make a JobPrep appointment with MES: Make a stock preparation appointment through the production information management system MES.

[0077] Step A12: MES sends a transport instruction to MCS: The production information management system MES sends a transport instruction to the overhead crane transport system MCS.

[0078] Step A13: MCS transfers the batch to the machine: The overhead crane transport system MCS transfers the wafer batch to the corresponding machine.

[0079] Step A14: The machine reports to the EAP: The machine reports to the equipment automation programming system EAP.

[0080] Step A15: EAP requests JobIn: The automated programming system EAP requests JobIn for moving goods.

[0081] Step A16: EAP Create CJ / PJ to start shipping.

[0082] Step A17: Delivery completed, JobOut.

[0083] Step A18: MES sends a transport instruction.

[0084] Step A19: The MCS system transports the next batch.

[0085] In the embodiment of the present invention, when the fully automatic engine determines that the machine is to perform daily machine testing, the following is performed: the fully automatic engine determines the time node of the machine to perform daily machine testing, calculates the time required to prepare the machine testing wafers in advance, automatically completes wafer batching and pre-measurement in advance, and transports the machine testing wafers to the pre-measurement process site to wait. After the process site is completed, the measurement machine at the post-measurement site is automatically determined to prioritize the delivery of the machine testing wafers.

[0086] It should be noted that the EQ test needs to go through pre-measurement, process and post-measurement. Pre-measurement is the measurement before the target machine is tested, and post-measurement is the measurement after the target machine is tested. Waiting time can be reduced by preparing the wafers required for pre-measurement in advance.

[0087] Furthermore, when the fully automatic engine determines that the machine is to perform routine testing, the specific execution process is as follows: Figure 6 Shown include:

[0088] Step S61: pre-build the modeling data of daily machine testing into the production information management system.

[0089] In the embodiment of the present invention, the modeling data of daily machine testing includes but is not limited to NPW Flow (non-product production process, a universal process), Controlid (personalized settings of machine parameters), etc. Among them, NPW Flow mainly includes pre-process, InUse Flow, Reuse / Recycle / Downgrad, and the system automatically determines whether to reuse, recycle, or downgrade. The testing items of different machines are implemented in InUse Flow; the testing frequency, testing recipe, edc plan, etc. of each machine are configured in Controlid.

[0090] Step S62: The real-time computer station needs to prepare the time point of the test wafer in advance, and the watchdog circuit of the automatic delivery system completes the batching and pre-measurement in advance to wait for the delivery at the site.

[0091] It is worth noting that the advance preparation of the test wafer and the pre-completion measurement mechanism introduced in the embodiment of the present invention can avoid the time of waiting for the preparation of the test wafer, and can realize that the delivery of goods can be started immediately when the machine reaches the test time.

[0092] Step S63: At the post-measurement station machine, the wafers to be measured are prioritized according to the preset priority rules.

[0093] Step S64: for the test machine wafer, automatically determine whether to reuse, recycle and downgrade it, and then enter the various processes of daily test machine to perform related processes; wherein, the relationship between reuse, recycling and downgrade includes: each traversal of a cycle of pre-measurement, daily test machine and post-measurement is one use; when the maximum number of uses is reached, enter the recycling stage and continue to use it; when the maximum number of recycling times is reached, enter the downgrade stage for use by lower-level machines.

[0094] For example, the daily testing process is as follows: Figure 7 As shown:

[0095] Step B1: Monitor source Lot: Prepare the wafer for testing.

[0096] Step B2: In use start: Start using the test wafer.

[0097] Step B3: Pre Measure: Pre measurement.

[0098] Step B4: Process: The specific process of daily machine testing.

[0099] Step B5: Post Measure: Post measurement.

[0100] Step B6: In use end: The tester wafer has been used up.

[0101] Step B7: NPW in use end watchdog: The system automatically determines whether the wafer is reused or recycled.

[0102] Step B8: recycle end: If the maximum number of times of use is reached, the recycling ends; if the maximum number of times of use is not reached, continue to return to the above step 02.

[0103] Step B9: NPW recycle end watchdog: At the recycle end site, the system automatically determines whether the wafer is to be recycled or downgraded.

[0104] Step B10: Downgrade: If the maximum number of recycling times is reached, downgrade.

[0105] In the embodiment of the present invention, when the fully automatic engine determines that the machine is to perform a periodic test, the following is performed: according to the end time of the periodic test, the time point for preparing the test wafers required for the periodic test is automatically calculated in advance; batch processing and pre-measurement are completed in advance, and the test wafers are waiting to be transported at the test process station; and the test wafers are transported after the periodic test is completed. The advantage of such operation is that it can effectively avoid the waiting time for manually preparing wafers after the machine periodic test.

[0106] Furthermore, when the fully automatic engine determines that the machine is to be subsequently tested as a periodic test, the specific sub-steps are as follows: Figure 8 As shown, including:

[0107] Step S81: pre-build the modeling data of the periodic machine test into the production information management system.

[0108] In an embodiment of the present invention, the modeling data of the periodic machine testing includes but is not limited to data such as a periodic machine testing checklist, a post-periodic machine testing recovery process, an operation sequence, and the like. Among them, the periodic machine testing checklist (PM Check List) includes two types, namely, a checklist when the machine is undergoing periodic machine testing, and a checklist specifically used for the system triggering the post-periodic machine testing recovery process. The post-periodic machine testing recovery process (TRC Package) mainly defines the machine testing items that need to be completed after the machine completes the periodic machine testing.

[0109] Step S82: The system automatically determines whether the machine needs to undergo periodic testing; if necessary, the automatic delivery system prepares the test wafers required for the corresponding test project in advance and performs pre-measurement, so that after the machine completes the periodic testing, the test wafers can be delivered without waiting.

[0110] Step S83: At the post-measurement station, the system automatically determines the priority and runs the test machine wafers; after the post-measurement is completed, the cycle test machine process is completed.

[0111] It should be noted that the priority mentioned in this embodiment refers to the priority between product wafers and non-product wafers (NPW) in the post-measurement site. The priority can be determined by pre-setting rules. For example, for a PM post-measurement machine, if there are particularly important or special products, product wafers will be prioritized, otherwise non-product wafers will be prioritized, etc. The above examples are for reference only and are not limiting.

[0112] For example, the process of periodic testing is as follows: Fig. 9 As shown:

[0113] In the first branch:

[0114] Step C1: The machine needs to be tested periodically.

[0115] Step C2: Engineers perform periodic machine testing.

[0116] Step C3: Before the end of the periodic machine test, the engineer checks the trigger TRC process in the PM Check List.

[0117] Step C4: After the cycle test is completed, the recovery process TRC continues to run, and the next step triggers the dispatch of the monitor wafer (What Next dispatches the monitor lot).

[0118] Step C5: The periodic machine test is successful. After the periodic machine test, the machine recovery process TRC continues to run to the last step, and the machine status switches to idle.

[0119] In the second branch:

[0120] Step C6: Monitor source Lot: Prepare the wafer for testing.

[0121] Step C7: In use Start: Start using the test wafer, then go to step C8 or return to step C3.

[0122] Step C8: Pre Measure: Pre measurement.

[0123] Step C9: Process: The specific process of periodic machine testing.

[0124] Step C10: Post Measure: After post-measurement, return to step C5.

[0125] In the third branch:

[0126] Step C11: NPW in use end Watchdog: At the in use end site, the system automatically determines whether the wafer is to be reused or recycled.

[0127] Step C12: In use End: Determine whether the maximum number of times of use has been reached. If not, return to step C7. If so, proceed to step C13.

[0128] Step C13: Recycle End: Determine whether the maximum number of recycling times has been reached. If not, return to step C7. If so, proceed to step C14.

[0129] Step C14: Downgrade: Downgrade processing refers to the downgrade matching between different grades of wafers and different grades of machines. For example, if a machine can process B-grade wafers, then A-grade wafers can be downgraded to this machine for processing.

[0130] In summary, by adding mechanisms such as automatic system calculation, advance stocking, advance moving, and advance preparation of wafer testing machines to complete pre-measurement, the system can achieve fully automated product running (including product running, daily testing, periodic testing, etc.) to achieve continuous machine running, uninterrupted zero idleness, and greatly improve system efficiency.

[0131] The above is a detailed explanation of the implementation process and principle of a semiconductor production method based on full automation provided by an embodiment of the present invention. Hereinafter, the semiconductor production system, terminal and medium based on full automation in the present invention will be further described in combination with other embodiments.

[0132] The semiconductor production method based on full automation provided in the embodiment of the present invention can be implemented on the terminal side or the server side. As for the hardware structure of the semiconductor production terminal based on full automation, please refer to Fig.10 , is an optional hardware structure diagram of an electronic terminal 100 provided in an embodiment of the present invention. The terminal 100 may be a mobile phone, a computer device, a tablet device, a personal digital processing device, a factory background processing device, etc. The electronic terminal 100 includes: at least one processor 101, a memory 102, at least one network interface 104 and a user interface 106. The various components in the device are coupled together through a bus system 105. It can be understood that the bus system 105 is used to realize the connection and communication between these components. In addition to the data bus, the bus system 105 also includes a power bus, a control bus and a status signal bus. However, for the sake of clarity, in Fig.10 In the specification, various buses are labeled as bus systems.

[0133] The user interface 106 may include a display, a keyboard, a mouse, a trackball, a click gun, keys, buttons, a touch pad or a touch screen.

[0134] It is understood that the memory 102 can be a volatile memory or a non-volatile memory, and can also include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM). The memory described in the embodiments of the present invention is intended to include but is not limited to these and any other suitable categories of memory.

[0135] The memory 102 in the embodiment of the present invention is used to store various categories of data to support the operation of the electronic terminal 100. Examples of these data include: any executable program for operating on the electronic terminal 100, such as an operating system 1021 and an application 1022; the operating system 1021 includes various system programs, such as a framework layer, a core library layer, a driver layer, etc., for implementing various basic services and processing hardware-based tasks. The application 1022 may include various applications, such as a media player (MediaPlayer), a browser (Browser), etc., for implementing various application services. The semiconductor production method based on full automation provided by the embodiment of the present invention may be included in the application 1022.

[0136] The method disclosed in the above embodiment of the present invention can be applied to the processor 101, or implemented by the processor 101. The processor 101 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit in the processor 101 or the instruction in the form of software. The above processor 101 may be a general processor, a digital signal processor (DSP, Digital Signal Processor), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor 101 can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiment of the present invention. The general processor 101 can be a microprocessor or any conventional processor, etc. In combination with the steps of the accessory optimization method provided in the embodiment of the present invention, it can be directly embodied as a hardware decoding processor to execute, or it can be executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium, which is located in a memory, and the processor reads the information in the memory and completes the steps of the above method in combination with its hardware.

[0137] In an exemplary embodiment, the electronic terminal 100 may be implemented by one or more application specific integrated circuits (ASIC), DSP, programmable logic device (PLD), complex programmable logic device (CPLD) to execute the aforementioned method.

[0138] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to the computer program. The aforementioned computer program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other media that can store program codes.

[0139] like Fig.11 , a schematic diagram of a fully automated semiconductor production system in an embodiment of the present invention is shown. The semiconductor production system 1100 in an embodiment of the present invention includes: a fully automated engine configuration module 1101 and a wafer batch pre-assignment module 1102 .

[0140] The fully automatic engine configuration module 1101 is used to configure the fully automatic engine to monitor the operation of the machine on the semiconductor production line in real time; the fully automatic engine is configured with a semiconductor production flow program. The wafer batch pre-dispatch module 1102 is used to determine one of the product delivery, daily testing and machine cycle testing to be performed by the machine based on the fully automatic engine, and automatically dispatch the corresponding wafer batch to the machine in advance according to the judgment result.

[0141] It should be noted that: the semiconductor production device based on full automation provided in the above embodiment is only illustrated by the division of the above program modules when performing semiconductor production based on full automation. In actual applications, the above processing can be assigned to different program modules as needed, that is, the internal structure of the device is divided into different program modules to complete all or part of the processing described above. In addition, the semiconductor production device based on full automation provided in the above embodiment and the semiconductor production method embodiment based on full automation belong to the same concept. The specific implementation process is detailed in the method embodiment and will not be repeated here.

[0142] In the embodiments provided in the present application, the computer readable and writable storage medium may include a read-only memory, a random access memory, an EEPROM, a CD-ROM or other optical disk storage device, a disk storage device or other magnetic storage device, a flash memory, a USB flash drive, a mobile hard disk, or any other medium that can be used to store a desired program code in the form of an instruction or data structure and can be accessed by a computer. In addition, any connection can be appropriately referred to as a computer-readable medium. For example, if the instruction is sent from a website, a server or other remote source using a coaxial cable, an optical fiber cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, optical fiber cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. However, it should be understood that computer readable and writable storage media and data storage media do not include connections, carriers, signals, or other temporary media, but are intended to be non-temporary, tangible storage media. Disk and disc, as used in this application, includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers.

[0143] In summary, the present application provides a semiconductor production method, device, terminal and medium based on full automation. The present application adds a full-automatic engine, and the system automatically determines the next action of the machine. The system prepares and automatically dispatches the corresponding wafer batches in advance, saving time and realizing zero idle operation of the machine. The mechanism of pre-stocking and pre-moving is introduced, and the goods to be run by the machine next are sent to the cargo storage carrier OHB in advance, and the goods are sent to the Load Port immediately when the Load Port of the waiting machine is empty, so as to reduce the waiting time of the MCS system. For all the wafers required for daily test machines (EQ Test) and periodic test machines (PM-EQ Test), the system will judge to automatically batch and perform pre-measurement at the appropriate time point, and wait for the goods to run at the process site, avoiding the waiting time of the machine when preparing the test wafers and pre-measurement operations. Daily test machines (EQ Test), periodic test machines (PM-EQ Test), warm-up machines (SEASON), etc. are automatically judged and prepared by the system in advance, reducing manual operations and greatly improving work efficiency, and any abnormal conditions of the system will be notified to relevant personnel in time for processing. Therefore, the present application effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0144] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A semiconductor production method based on full automation, characterized in that: include: Configure a fully automatic engine to monitor the operation of machines on semiconductor production lines in real time; The fully automatic engine is configured with a semiconductor production flow program; Based on the fully automatic engine, one of the product delivery, daily test and machine cycle test to be performed by the machine is determined, and the corresponding wafer batch is automatically dispatched to the machine in advance according to the determination result.

2. The semiconductor production method based on full automation according to claim 1, characterized in that: The semiconductor production flow program configured in the fully automatic engine includes: the production information management system determines the wafer batches currently available for delivery according to the current operating status of the machine, and sends the list information of the wafer batches available for delivery to the real-time delivery system.

3. The fully automated semiconductor production method according to claim 1, characterized in that: When the fully automatic engine determines that the subsequent operation of the machine is to run product delivery, the following is performed: based on the mechanism of advance stocking and unloading when the wafer loading system status is empty, the time node for advance stocking is automatically calculated and the stock is prepared in advance to the cargo storage carrier closest to the target machine.

4. The fully automated semiconductor production method according to claim 3, characterized in that: The mechanism based on advance stocking and unloading when the wafer loading system is empty automatically calculates and determines the time node for advance stocking and stocks the goods in advance to the goods storage carrier closest to the target machine, including the following: Pre-build the product delivery modeling data into the production information management system; Configure an advance stocking engine; use the advance stocking engine to monitor in real time the batches of wafers that can be shipped in the cargo storage carrier corresponding to the machine, and determine whether to trigger the advance stocking condition; If the advance stocking condition is triggered, the next batch of wafers available for delivery will be delivered to the cargo storage carrier corresponding to the machine in advance, so that the goods can be taken from the cargo storage carrier to the machine when the wafer loading system status is empty; When the wafer loading system outside the machine is empty or the wafer storage space inside the machine increases to the preset amount, the automatic delivery system executes automatic delivery; the overhead crane handling system transports the wafer batches prepared in advance on the cargo storage carrier to the wafer loading system; after the previous batch of wafers in the machine is delivered, the overhead crane handling system moves the goods to the next station, which is the nearest cargo storage carrier to the machine, and the equipment automation programming system then runs the next batch of wafers to keep the machine in a zero idle state.

5. The fully automated semiconductor production method according to claim 1, characterized in that: In the case where the fully automatic engine determines that the machine will perform routine machine testing later, the following is performed: the fully automatic engine determines the time node of the machine for daily machine testing, calculates the time required to prepare the test machine wafers in advance, automatically completes wafer batching and pre-measurement in advance, and transports the test machine wafers to the pre-measurement process site to wait.

6. The fully automated semiconductor production method according to claim 5, characterized in that: The fully automatic engine determines the time node of the machine for daily machine testing, calculates the time required to prepare the test wafer in advance, automatically completes wafer batching and pre-measurement in advance, and transports the test wafer to the pre-measurement process site for waiting, which includes the following: Pre-build the modeling data of daily machine testing into the production information management system; The real-time computer station needs to prepare the time point for the wafer test in advance, and complete the batching and pre-measurement in advance through the watchdog circuit of the automatic delivery system to wait for the delivery at the site; At the post-measurement site, the wafers for the measurement machine are prioritized according to the preset priority rules; For the test machine wafer, it is automatically determined whether to reuse, recycle and downgrade it, and then enter the various processes of daily test machine to carry out related processes; wherein, the relationship between the reuse, recycling and downgrade includes: each traversal of a cycle of pre-measurement, daily test machine and post-measurement is one use; when the maximum number of uses is reached, it enters the recycling stage and continues to be used; when the maximum number of recycling times is reached, it enters the downgrade stage for use by lower-level machines.

7. The fully automated semiconductor production method according to claim 1, characterized in that: When the fully automatic engine determines that the machine will subsequently perform cycle testing, the following is performed: according to the end time of the cycle testing, the time point for preparing the test wafers required for the cycle testing is automatically calculated in advance to complete batch processing and pre-measurement in advance.

8. A fully automated semiconductor production system, characterized in that: include: Fully automatic engine configuration module, used to configure the fully automatic engine to monitor the operation of the machine on the semiconductor production line in real time; The fully automatic engine is configured with a semiconductor production flow program; The wafer batch pre-dispatch module is used to determine one of the product delivery, daily testing and machine cycle testing to be performed by the machine based on the fully automatic engine, and automatically dispatch the corresponding wafer batch to the machine in advance according to the judgment result.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the semiconductor production method based on full automation as claimed in any one of claims 1 to 7 is implemented.

10. An electronic terminal, characterized in that: include: Processor and memory; The memory is used to store computer programs; The processor is configured to execute the computer program stored in the memory so as to enable the terminal to execute the semiconductor production method based on full automation as claimed in any one of claims 1 to 7.

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