Frameless notebook display screen and manufacturing method thereof

Abstract

The invention relates to the technical field of display screens, and discloses a frameless notebook display screen and a manufacturing method thereof.The method comprises the steps that structural analysis is conducted on a substrate of the display screen, COF packaging processing is conducted on all initial area units, Micro-LED chips are attached to the preprocessing area units, and selective pre-curing processing is conducted; collecting temperature change data of the preliminarily mounted area units in real time, grouping the area units with balanced temperature, performing integral curing and local welding spot correction on the pre-cured substrate, and performing color and brightness consistency calibration on the cured substrate to obtain the frameless notebook display screen with a stable structure; by analyzing the thermal field baseline data of the display screen substrate and optimizing the manufacturing process of the display screen according to the thermal field distribution model, the problem of uneven stress of welding points is solved; local overheating and deformation are effectively avoided, and the stability and the display effect of the display screen in long-term use are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and in particular to a borderless notebook display screen and a manufacturing method thereof. Background Art

[0002] As electronic devices become increasingly thinner and more portable, borderless displays have become one of the design trends, especially in the field of mobile devices such as laptops and smartphones. Borderless notebook displays are mainly characterized by ultra-narrow borders, which not only provide a larger display area and a better visual experience, but are also favored by consumers for their unique appearance design. Borderless displays usually use advanced display technologies such as OLED, LCD, Micro-LED, etc. to achieve high resolution, wide color gamut, and lower power consumption requirements. Existing borderless notebook displays mainly rely on packaging technology and thermal management technology, but there is often a problem of uneven force on the welding points during the welding process. Specifically, due to the uneven force on the welding points, local areas with excessively high temperatures will be generated during the welding process, resulting in inconsistent thermal expansion, which in turn affects the long-term stability of the display. Especially during the curing stage, inaccurate temperature control leads to large differences in temperature distribution in different areas, and some areas are prone to overheating, causing deformation of the display and a decrease in display effect.

[0003] Therefore, it is necessary to provide a borderless notebook display screen and a manufacturing method thereof to solve the problem that the existing borderless notebook display screen manufacturing easily causes the display screen to deform, resulting in a decrease in display effect. Summary of the invention

[0004] The main purpose of the present invention is to provide a borderless notebook display screen and a manufacturing method thereof, aiming to solve the technical problems mentioned in the above background technology.

[0005] The present invention adopts the following technical solutions: A borderless notebook display screen and a manufacturing method thereof, comprising: Performing structural analysis on a substrate of a display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit; Performing COF packaging processing on each of the initial regional units, generating a layout strategy for the drive circuit based on the thermal field distribution model, integrating the drive circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processed regional unit with an integrated drive circuit; Mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminarily mounted regional unit; Real-time acquisition of temperature change data of the preliminarily mounted regional units, construction of a dynamic temperature change surface, slice-by-slice integral calculation of the temperature change surface, and when the integral value exceeds a preset temperature threshold, pulse temperature compensation is performed to obtain a temperature-balanced regional unit; The temperature-balanced regional units are grouped, the thermal stability of each group is calculated based on the thermal field distribution model, a differentiated reflow temperature curve is allocated according to the thermal stability, and the reflow temperature curve is adjusted based on the plastic deformation trend of the solder joint to perform segmented reflow curing to obtain a pre-cured substrate; The pre-cured substrate is cured as a whole and the local solder joints are corrected, and the cured substrate is calibrated for color and brightness consistency to obtain a frameless notebook display screen with a stable structure.

[0006] Furthermore, the step of performing structural analysis on the substrate of the display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit includes: Acquiring physical property data of a substrate of a display screen, the physical property data including thermal conductivity, specific heat capacity and structural thickness of the substrate, and performing thermal field simulation on the substrate using a finite element analysis method based on the physical property data to obtain thermal response simulation data; According to the thermal response simulation data, selecting and setting a grid density to divide the substrate into a plurality of thermally equivalent area units; Calculating the local temperature change of each thermally equivalent regional unit to establish a global thermal field distribution map, and dividing the substrate according to the global thermal field distribution map to obtain a plurality of initial regional units; Based on the temperature difference and thermal conductivity between the initial regional unit regions, the thermal field is optimized by fine-tuning the boundaries of the initial regional unit through an iterative optimization algorithm, and dynamic adjustments are made according to the thermal stability of the initial regional unit to generate a thermal field distribution model.

[0007] Furthermore, based on the temperature difference and thermal conductivity between the initial regional unit regions, the thermal field is optimized by fine-tuning the boundaries of the initial regional unit through an iterative optimization algorithm, and dynamically adjusting according to the thermal stability of the initial regional unit to generate a thermal field distribution model, including: Analyzing the thermal response data of the initial regional unit, using the principal component analysis method to reduce the dimension of the temperature difference and thermal conductivity of each region, and obtaining thermal response characteristic data; Based on the thermal response characteristic data, the initial area units are divided into different thermal response groups using a clustering algorithm; Applying an iterative optimization algorithm to fine-tune the boundary of each thermal response group to reduce the temperature difference between the thermal response groups, and adjusting the boundary position according to the thermal conductivity and boundary conditions of each thermal response group to obtain an optimized regional boundary; Simulating the thermal field distribution of the optimized regional boundary, eliminating potential deviations of the boundary of the initial regional unit based on the simulation results, and obtaining an accurate thermal field distribution model; According to the precise thermal field distribution model, the thermal stability of the initial area unit is dynamically adjusted by using a weighted average method, and the initial area units whose stability is lower than a preset stability threshold are marked and corrected to generate a thermal field distribution model with high thermal stability and uniform thermal distribution.

[0008] Further, each of the initial regional units is subjected to COF packaging processing, a layout strategy of a driving circuit is generated based on the thermal field distribution model, and the driving circuit is integrated into the flexible circuit board of the initial regional unit to obtain a pre-processing regional unit of an integrated driving circuit, comprising: Performing surface pretreatment on each of the initial area units, and coating a conductive adhesive on the surface of each of the initial area units; Calculate the thermal response characteristics of each initial area unit according to the thermal field distribution model, design the COF packaging structure in combination with the physical property data, and generate a COF packaging solution; Based on the COF packaging solution, a flexible circuit board is connected to the surface of the initial area unit by a thin film laser packaging method to obtain a stable packaging area unit; Performing thermal field analysis on the package stable regional unit, determining the local heat load distribution of each regional unit according to the thermal response characteristics and the thermal field distribution model of each regional unit to obtain a heat load calculation model; According to the heat load calculation model, a layout strategy for the drive circuit is generated using a computer-aided design tool, and a temperature-voltage coupling simulation analysis is performed on the layout strategy to obtain current density distribution and temperature rise data of each regional unit to adjust the parameters of the layout strategy and obtain the optimal layout strategy for the drive circuit; Based on the optimal layout strategy, the driving circuit is welded to the flexible circuit board of the initial area unit to obtain a pre-processing area unit of the integrated driving circuit.

[0009] Furthermore, the step of mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminary mounted regional unit includes: Measuring the surface finish of the pre-processed area unit to obtain surface roughness data, and generating an optimized surface treatment process for the pre-processed area unit based on the surface roughness data; Based on the optimized surface treatment process, ion treatment is performed on the surface of the pre-treated regional unit to a preset standard to obtain a regional unit with a smooth surface; According to the flat surface area unit, the mounting points of the Micro-LED chips are optimized based on the thermal field distribution model, and the mounting position of each Micro-LED chip is adjusted by performing stress analysis on each area unit to obtain a chip mounting solution; Performing dynamic mounting simulation on the chip mounting scheme, and obtaining simulation results of the dynamic mounting simulation through finite element analysis, and dynamically adjusting welding temperature and pressure parameters according to the simulation results to obtain an optimized welding process; Based on the optimized welding process, the Micro-LED chip is mounted on the area unit with a flat surface, and the solder joints of the Micro-LED chip are locally heated to a predetermined curing temperature to obtain a preliminarily mounted area unit.

[0010] Furthermore, the step of collecting the temperature change data of the initially mounted regional units in real time, constructing a dynamic temperature change surface, performing a slice integral calculation on the temperature change surface, and performing pulse temperature compensation to obtain a temperature-balanced regional unit when the integral value exceeds a preset temperature threshold comprises: Based on the temperature sensor array, real-time temperature change data of different positions of the initially mounted regional unit are collected to construct a temperature data matrix, and the temperature data matrix is ​​mapped to the temperature distribution of the initially mounted regional unit at different time points to obtain a temperature change data set; An interpolation algorithm is used to smooth the temperature change data set to obtain a temperature change surface; The temperature change surface is divided into a plurality of slice regions, each slice region is integrated by a numerical integration method to obtain a temperature change value of each slice region, and all temperature change values ​​are summarized to obtain a temperature integral value of the preliminarily mounted regional unit; Comparing the temperature integral value with a preset temperature threshold to determine whether the temperature integral value exceeds the preset temperature threshold; When the temperature integral value exceeds a preset threshold, dynamic pulse temperature compensation is performed on the preliminarily mounted regional unit with a preset pulse heating time and a preset pulse intensity to obtain a regional unit with balanced temperature.

[0011] Further, the step of grouping the temperature-balanced regional units, calculating the thermal stability of each group based on the thermal field distribution model, allocating differentiated reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curves based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate includes: The temperature-balanced regional units are grouped, and the heat capacity, thermal response time and thermal expansion coefficient of each grouped region are calculated based on the thermal field distribution model to obtain thermal stability data of each regional unit; Classifying each grouping area by a cluster analysis algorithm according to the thermal stability data to obtain a classification result, so as to assign different reflow curing temperature curves to grouping areas of different categories; According to the classification results, a regression analysis algorithm is used to generate a differentiated reflow temperature curve, and the reflow temperature curve is optimized by a regression model to obtain an optimized reflow temperature curve; Performing preliminary reflow curing treatment on each grouping area according to the optimized reflow temperature curve, and fine-tuning the reflow temperature curve based on a feedback control system to obtain a stable reflow curing area; Calculating the stress state of the solder joints in the reflow curing area based on the plastic deformation trend of the solder joints, and adjusting the heating section parameters of the reflow temperature curve according to the calculation results to optimize the reflow curing process for each grouping area; The temperature of the grouped areas after the optimized reflow curing is verified, and the temperature distribution of each grouped area is detected by using an infrared thermal imager to make the temperature distribution of each grouped area uniform, thereby obtaining a pre-cured substrate.

[0012] Furthermore, the steps of performing overall curing and local solder joint correction on the pre-cured substrate, and calibrating the color and brightness consistency of the cured substrate to obtain a frameless notebook display screen with a stable structure include: A segmented temperature control strategy is used to heat and cool the pre-cured substrate. The heating rate and cooling rate are adjusted based on the real-time temperature data during the segmented reflow curing process to obtain a cured substrate with uniform temperature distribution. According to the solder point distribution diagram of the solidified substrate with uniform temperature distribution, optically inspect the local solder points of the solidified substrate based on an automatic optical inspection system, and laser repair the defective solder points according to the inspection results to obtain a perfect solidified substrate; Scanning the display area of ​​the perfect-cured substrate with a color analyzer to collect color data of each pixel, generating a preliminary calibration curve based on the color data, and performing preliminary color adjustment on the perfect-cured substrate to obtain a substrate with preliminary color calibration; Based on the brightness detection device, the display area of ​​the substrate subjected to the preliminary color calibration is measured point by point, the brightness value data of each pixel is collected, and a brightness compensation curve is generated by using a data fitting algorithm to adjust the driving current of each pixel to obtain a substrate with consistent brightness; A dynamic calibration system is used to comprehensively analyze the display area of ​​the substrate with uniform brightness, correct the residual color and brightness deviations, and obtain a frameless notebook display screen with a stable structure.

[0013] A borderless notebook display screen, characterized in that it adopts the manufacturing method as described in any one of the above items, comprising a display screen substrate and a Micro-LED chip array, wherein the display screen substrate is provided with a flexible circuit board, and the Micro-LED chip array is connected to the flexible circuit board; A heat dissipation component is disposed on one end surface of the display screen substrate facing away from the Micro-LED chip array, the heat dissipation component includes a heat sink and a heat pipe, the heat sink abuts against the display screen substrate, the heat pipe is connected to the heat sink, and the heat pipe is connected to the circuit board of the display screen substrate; A shell is also provided on the side of the heat sink facing away from the display screen substrate, and the peripheral side of the heat sink and the heat pipe are both connected to the inner wall of the shell.

[0014] Beneficial effects: In the present invention, the problem of uneven force on the welding points is solved by analyzing the thermal field baseline data of the display screen substrate and optimizing the manufacturing process of the display screen according to the thermal field distribution model. The pretreatment area unit is dynamically temperature monitored, and a dynamic temperature change surface is constructed to analyze the temperature change in real time. The force distribution of the welding points can be adjusted in time to ensure uniform temperature distribution during the welding process, effectively avoid local overheating and deformation, and ensure the stability and display effect of the display screen in long-term use. In addition, the reflow curing process is further optimized by adjusting the differentiated reflow temperature curve and the plastic deformation trend of the solder joint. By accurately controlling the reflow temperature and the thermal stability during the curing process, not only the overall stability of the display screen is improved, but also the deformation problem of the display screen caused by uneven reflow curing is effectively reduced. Combined with local correction and color brightness consistency calibration during the welding process, the borderless notebook display screen reaches higher standards in color reproduction and brightness consistency, ultimately ensuring the high quality and performance of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic flow chart of a method for manufacturing a borderless notebook display screen of the present invention; Figure 2 The invention discloses an exploded structural diagram of a borderless notebook display screen.

[0016] Among them: 1. Display substrate; 2. Micro-LED chip array; 3. Flexible circuit board; 4. Heat sink; 5. Heat pipe; 6. Outer casing.

[0017] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0018] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0022] Reference Figure 1 The present invention proposes a method for manufacturing a borderless notebook display screen, comprising: S1: Performing structural analysis on a substrate of a display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit; In step S1, the substrate of the display screen is first structurally analyzed to obtain its thermal field baseline data. The thermal field characteristics of the substrate have an important influence on the overall performance of the display screen. The finite element analysis method can be combined with an infrared thermal imager and an embedded thermal sensor to perform a multi-condition thermal field test on the substrate to obtain the thermal field baseline data of the substrate, which is used to construct a thermal field distribution model, and the substrate is divided into multiple initial area units based on the model. The principle of regional division is to ensure that the thermal field distribution of each unit is as uniform as possible, while considering the thermal expansion characteristics of the substrate under different working conditions. In this way, high-temperature hot spots or thermal stress concentration areas that may appear on the substrate can be identified in advance, thereby providing a basis for subsequent drive circuit layout and welding process optimization.

[0023] S2: performing COF packaging processing on each of the initial regional units, generating a layout strategy for the driving circuit based on the thermal field distribution model, integrating the driving circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processing regional unit with an integrated driving circuit; In step S2, each initial area unit is subjected to COF packaging processing, and a layout strategy for the driving circuit is formulated based on the aforementioned thermal field distribution model. COF packaging can integrate the driver chip directly onto the flexible circuit board, reduce the complexity of PCB connection, and improve the signal transmission speed and reliability. When laying out the driving circuit, the thermal field characteristics of each area unit are considered, and the driving circuits with higher heat generation are evenly distributed to avoid excessive local temperature affecting the circuit stability. In addition, during the packaging process, high-precision dispensing and welding technology are used to make the solder joints of the driver chip evenly stressed, reduce the risk of solder joint cracking or circuit failure, and improve the reliability and life of the COF package.

[0024] S3: Mounting the Micro-LED chip on the pre-treated regional unit and performing selective pre-curing treatment, dynamically adjusting the force distribution of the welding point during the mounting process, and obtaining a preliminarily mounted regional unit; In step S3, the Micro-LED chip is mounted to the pre-treatment area unit and a selective pre-curing treatment is performed. During the mounting process, precision robotic arms and visual alignment systems are used to ensure the precise positioning of the Micro-LED chip on the substrate. In order to improve the welding quality, this step uses dynamic mounting pressure control technology to adjust the force distribution of the welding points during the mounting process according to the thermal expansion characteristics of the substrate area, and reduce the welding pressure in areas with greater thermal stress to avoid solder joint breakage or poor welding due to excessive local force. In addition, during the pre-curing process, low-temperature curing technology is used to initially fix the solder joints and ensure that the chip does not shift during the subsequent reflow curing process to improve welding consistency.

[0025] S4: collecting temperature change data of the initially mounted regional units in real time, constructing a dynamic temperature change surface, performing piecewise integral calculation on the temperature change surface, and when the integral value exceeds a preset temperature threshold, performing pulse temperature compensation to obtain a temperature-balanced regional unit; In step S4, the temperature change data of the units in the preliminary mounting area are collected in real time, and a dynamic temperature change surface is constructed. This surface is based on the data of multi-point temperature sensors and accurately reflects the temperature changes in each area through interpolation calculation. In actual production, different areas may have uneven temperature distribution due to material differences or different heat dissipation conditions. In order to solve this problem, this step performs a piecewise integral calculation on the temperature change surface. When the integral value of a certain area exceeds the preset temperature threshold, the system will execute a pulse temperature compensation strategy, that is, the temperature of the area is accurately adjusted through the local temperature control system to make the overall temperature distribution tend to be balanced. This can effectively reduce the uneven thermal expansion and contraction of materials caused by local overheating, improve the reliability of solder joints, and reduce the risk of substrate deformation.

[0026] S5: grouping the temperature-balanced regional units, calculating the thermal stability of each group based on the thermal field distribution model, allocating differentiated reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curves based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate; In step S5, the temperature-balanced regional units are grouped, and the thermal stability of each group is calculated based on the thermal field distribution model. Due to the different thermal capacity, heat dissipation conditions and welding characteristics of different regions, a single reflow soldering curve cannot be used. Instead, differentiated reflow temperature curves should be formulated according to the thermal stability of each region. For areas with low thermal stability, the heating rate is reduced to reduce temperature shock, thereby reducing the risk of stress concentration at the solder joints. In addition, a segmented heating strategy is adopted during the reflow curing process, that is, low-temperature preheating is performed first to gradually soften the solder joints, and then high-temperature curing is performed to optimize the plastic deformation trend of the solder joints, reduce solder joint cracking or deformation, and improve the consistency and reliability of reflow curing.

[0027] S6: performing overall curing and local solder joint correction on the pre-cured substrate, and calibrating the color and brightness consistency of the cured substrate to obtain a frameless notebook display screen with a stable structure.

[0028] In step S6, the pre-cured substrate is cured as a whole and the local solder joints are corrected, and color and brightness consistency calibration is performed. The overall curing adopts a uniform heat treatment process to eliminate the residual stress that may occur in the solder joints during the reflow process and improve the welding reliability. For local welding defects, such as solder joint collapse and voids, this step uses laser repair technology to fill or remelt the solder joints to ensure that the quality of all solder joints meets the standard requirements. Finally, color and brightness consistency calibration is performed. Through precision optical detection equipment, the color and brightness parameters of each display unit are analyzed, and the current and PWM signals of the driving circuit are fine-tuned to achieve pixel-level brightness and color consistency, which can ensure that the final display screen meets high standards in terms of brightness uniformity and color reproduction capabilities, and improve the user's visual experience.

[0029] In summary, by analyzing the thermal field baseline data of the display substrate and optimizing the display manufacturing process according to the thermal field distribution model, the problem of uneven force on the welding points is solved. Dynamic temperature monitoring is performed on the pre-treatment area unit, and a dynamic temperature change surface is constructed. The temperature change is analyzed in real time, and the force distribution of the welding points can be adjusted in time to ensure uniform temperature distribution during the welding process, effectively avoid local overheating and deformation, and ensure the stability and display effect of the display in long-term use. In addition, the reflow curing process is further optimized through the adjustment of differentiated reflow temperature curves and the plastic deformation trend of solder joints. By accurately controlling the reflow temperature and thermal stability during the curing process, not only the overall stability of the display is improved, but also the deformation of the display caused by uneven reflow curing is effectively reduced. Combined with local correction and color brightness consistency calibration during the welding process, the borderless notebook display has reached a higher standard in color reproduction and brightness consistency, ultimately ensuring the high quality and performance of the display.

[0030] In one embodiment, the step of performing structural analysis on a substrate of a display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit includes: Acquiring physical property data of a substrate of a display screen, the physical property data including thermal conductivity, specific heat capacity and structural thickness of the substrate, and performing thermal field simulation on the substrate using a finite element analysis method based on the physical property data to obtain thermal response simulation data; According to the thermal response simulation data, selecting and setting a grid density to divide the substrate into a plurality of thermally equivalent area units; Calculating the local temperature change of each thermally equivalent regional unit to establish a global thermal field distribution map, and dividing the substrate according to the global thermal field distribution map to obtain a plurality of initial regional units; Based on the temperature difference and thermal conductivity between the initial regional unit regions, the thermal field is optimized by fine-tuning the boundaries of the initial regional unit through an iterative optimization algorithm, and dynamic adjustments are made according to the thermal stability of the initial regional unit to generate a thermal field distribution model.

[0031] In the above embodiment, the physical property data of the display screen substrate is obtained, which is the basis for establishing the thermal field distribution model. The physical property data mainly includes thermal conductivity, specific heat capacity and structural thickness, which determine the heat transfer capacity of the substrate and its thermal response characteristics under different temperature conditions. Thermal conductivity determines the diffusion rate of heat in the substrate, specific heat capacity affects the storage capacity of the substrate for thermal energy, and structural thickness directly affects the overall thermal inertia. In order to improve the accuracy of the data, thermal conductivity is measured by using a laser thermal conductivity analyzer, specific heat capacity is evaluated by using a differential scanning calorimeter, and the thickness distribution of the substrate is accurately measured in combination with X-ray tomography technology. Based on the above physical property data, the finite element analysis method is used to simulate the thermal field of the substrate to obtain the thermal response data of the substrate under different working conditions. In this process, the thermal-structural coupling analysis model is used to simulate the heat transfer and thermal stress distribution of the substrate under different temperature gradients. For the Micro-LED chip mounting area, the heat source power distribution under the working state is simulated, and the temperature change of the substrate per unit time is calculated in combination with the thermal diffusion characteristics of the substrate material. Through finite element analysis, thermal response simulation data can be obtained, which is used to predict the temperature distribution of the substrate under a specific thermal load and provide a basis for the subsequent thermal area division.

[0032] Based on the thermal response simulation data, the substrate is divided into multiple thermal equivalent area units, and an adaptive meshing strategy is adopted, that is, the mesh density is dynamically adjusted according to the local temperature gradient of the substrate. In areas with more drastic temperature changes, the mesh density is set higher to obtain more detailed thermal field distribution data; while in areas with lower temperature gradients, the mesh density is appropriately reduced to reduce the amount of calculation. After the division is completed, each thermal equivalent area unit can be regarded as an independent area with relatively uniform heat transfer characteristics.

[0033] Calculate the local temperature change of each thermal equivalent area unit and establish a global thermal field distribution map. Through time-series temperature analysis, the temperature evolution curve of the substrate at different time points can be obtained, and a complete temperature field map can be generated based on this. Based on this distribution map, the substrate is divided to obtain multiple initial area units. The principle of dividing the initial area unit is to ensure uniform temperature distribution inside the unit as much as possible while reducing the thermal gradient difference between regions.

[0034] Finally, based on the temperature difference and thermal conductivity between the initial regional units, an iterative optimization algorithm is used to fine-tune the boundaries of the initial regional units to further optimize the thermal field distribution. Specifically, this step uses thermally coupled finite element iterative calculations to analyze the heat transfer paths between different units and adjust the unit boundaries to make the heat flow direction more uniform. When the thermal gradient of a certain regional unit is too large, the boundary position is adjusted to reduce the temperature difference with the adjacent area, thereby improving the overall thermal stability. In addition, a dynamic adjustment strategy is used to optimize the thermal field distribution model based on the thermal response characteristics of different units, so that the final generated thermal field distribution model can not only accurately describe the thermal transfer characteristics of the substrate, but also provide the optimal thermal management solution for subsequent welding and packaging processes.

[0035] In one example, the step of fine-tuning the boundaries of the initial regional units to optimize the thermal field based on the temperature difference and thermal conductivity between the initial regional units by an iterative optimization algorithm, and dynamically adjusting the thermal stability of the initial regional units to generate a thermal field distribution model includes: Analyzing the thermal response data of the initial regional unit, using the principal component analysis method to reduce the dimension of the temperature difference and thermal conductivity of each region, and obtaining thermal response characteristic data; Based on the thermal response characteristic data, the initial area units are divided into different thermal response groups using a clustering algorithm; Applying an iterative optimization algorithm to fine-tune the boundary of each thermal response group to reduce the temperature difference between the thermal response groups, and adjusting the boundary position according to the thermal conductivity and boundary conditions of each thermal response group to obtain an optimized regional boundary; Simulating the thermal field distribution of the optimized regional boundary, eliminating potential deviations of the boundary of the initial regional unit based on the simulation results, and obtaining an accurate thermal field distribution model; According to the precise thermal field distribution model, the thermal stability of the initial area unit is dynamically adjusted by using a weighted average method, and the initial area units whose stability is lower than a preset stability threshold are marked and corrected to generate a thermal field distribution model with high thermal stability and uniform thermal distribution.

[0036] In the above embodiment, the thermal response data of the initial regional unit is deeply analyzed, and the temperature difference, thermal conductivity and heat flux density of each region are reduced in dimension by the principal component analysis method to extract the key thermal response characteristic data. The initial thermal response data has a high dimension, and the complexity of directly performing optimization calculations is relatively large. The principal component analysis can extract the core factors that mainly affect the thermal distribution, such as the main temperature gradient direction, the strength of thermal conductivity, etc., thereby reducing calculation redundancy and improving the efficiency of subsequent cluster analysis.

[0037] After obtaining the thermal response characteristic data, the DBSCAN clustering algorithm is used to group the initial regional units to form different thermal response groups. The purpose of clustering is to classify regions with similar thermal response characteristics so that customized adjustments can be made for different thermal characteristic regions during optimization. Specifically, the Euclidean distance is used to calculate the thermal response similarity between the initial regional units, and regions with similar temperature gradients and thermal conductivity are classified into the same thermal response group.

[0038] An iterative optimization algorithm is applied to fine-tune the boundaries of each thermal response group to reduce the temperature difference between different thermal response groups. By adjusting the boundary positions of adjacent regions, the heat flow transmission is made more uniform, thereby reducing local thermal stress. During the boundary optimization process, if the thermal conductivity of two adjacent units is very different, the boundary position is adjusted to appropriately expand the high thermal conductivity area and appropriately shrink the low thermal conductivity area to balance the thermal diffusion capacity. In addition, for areas with high temperature gradients, this step uses Laplace smoothing optimization to further adjust the boundaries to reduce temperature mutations at the boundaries and improve overall thermal stability.

[0039] After optimizing the boundary, simulate the thermal field distribution of the optimized regional boundary to verify the optimization effect and further correct the potential thermal field deviation. Calculate the adjusted thermal field distribution through finite element simulation to analyze whether there are still local temperature anomalies or thermal gradient mutations after optimization. If the simulation results show that there are still large temperature differences at certain boundaries, readjust the boundary conditions, including optimizing the heat conduction path, adjusting the local heat dissipation structure, or optimizing the heat flow direction, to ensure that the optimized thermal field distribution is more uniform. Finally, after eliminating potential deviations, a more accurate thermal field distribution model is obtained.

[0040] According to the accurate thermal field distribution model, the weighted average method is used to dynamically adjust the thermal stability of the initial regional unit. Specifically, the thermal stability weight is calculated according to the temperature volatility, thermal diffusion rate and thermal conductivity uniformity of each region, and the overall stability of the region is judged based on the weighted result. When the stability of a regional unit is lower than the preset stability threshold, correction processing is performed, including adjusting the boundary position of the region, optimizing the local heat dissipation structure, or adding a thermal buffer layer in the high-temperature area to enhance its thermal stability. After this dynamic adjustment process, a thermal field distribution model with high thermal stability and uniform thermal distribution is finally generated.

[0041] In this embodiment, the calculation expression is: in, is the thermal field distribution model; is the current thermal field distribution matrix, representing the first The global thermal field distribution at the t-th iteration, where each element corresponds to the temperature state of a certain area unit; Optimize the step size factor for the thermal gradient, is the region boundary gradient operator, is the temperature gradient optimization term, Represents the temperature difference matrix of adjacent regions, Optimize weights for temperature, is the thermal conductivity optimization term, represents the regional thermal conductivity difference matrix, Optimize weights for thermal conductivity; is the thermal stability correction term, is the stability score matrix of region i, is the stability weight, is the thermal stability correction weight, N is the number of regional units; is the finite element thermal simulation correction term, Correction weights for simulation, Represents the modified thermal field calculated by finite element analysis.

[0042] In one embodiment, the steps of performing COF packaging processing on each of the initial regional units, generating a layout strategy for the drive circuit based on the thermal field distribution model, integrating the drive circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processed regional unit with an integrated drive circuit include: Performing surface pretreatment on each of the initial area units, and coating a conductive adhesive on the surface of each of the initial area units; Calculate the thermal response characteristics of each initial area unit according to the thermal field distribution model, design the COF packaging structure in combination with the physical property data, and generate a COF packaging solution; Based on the COF packaging solution, a flexible circuit board is connected to the surface of the initial area unit by a thin film laser packaging method to obtain a stable packaging area unit; Performing thermal field analysis on the package stable regional unit, determining the local heat load distribution of each regional unit according to the thermal response characteristics and the thermal field distribution model of each regional unit to obtain a heat load calculation model; According to the heat load calculation model, a layout strategy for the drive circuit is generated using a computer-aided design tool, and a temperature-voltage coupling simulation analysis is performed on the layout strategy to obtain current density distribution and temperature rise data of each regional unit to adjust the parameters of the layout strategy and obtain the optimal layout strategy for the drive circuit; Based on the optimal layout strategy, the driving circuit is welded to the flexible circuit board of the initial area unit to obtain a pre-processing area unit of the integrated driving circuit.

[0043] In the above embodiment, each initial area unit is subjected to surface pretreatment, and a conductive adhesive is coated on its surface to improve the stability and reliability of the electrical connection in the subsequent packaging process. Based on the thermal field distribution model, the thermal response characteristics of each initial area unit are calculated, and combined with the physical property data of the display substrate, such as thermal conductivity, specific heat capacity and thickness, a highly targeted COF packaging structure is designed, thereby generating a COF packaging solution that meets the thermal response requirements of different regions.

[0044] According to the packaging solution, the flexible circuit board is precisely docked with the surface of the initial regional unit through thin-film laser packaging technology to form a stable packaged regional unit, ensuring thermal stability and mechanical strength during the packaging process. For each stable packaged regional unit, a detailed thermal field analysis is performed, and the local heat load distribution of each regional unit is determined by combining the thermal response characteristics and the thermal field distribution model, and a heat load calculation model is constructed to gain a deep understanding of the thermal stress and thermal gradient changes that each regional unit may encounter during operation, ensuring that the packaged regional unit will not suffer performance degradation due to overheating or excessive temperature fluctuations.

[0045] Based on the heat load calculation model, computer-aided design tools are used to generate the layout strategy of the drive circuit, and combined with temperature-voltage coupling simulation analysis, the current density distribution and temperature rise data of each regional unit are further obtained. During the simulation analysis process, the various parameters of the drive circuit layout strategy are adjusted according to the current density distribution in different regions, and the layout scheme is optimized, so that the drive circuits in each region can operate efficiently without exceeding the safety temperature threshold, avoiding local overheating and causing drive circuit failure or performance degradation. Finally, after obtaining the optimal layout strategy, the drive circuit is integrated into the flexible circuit board through precision welding technology, and the integration and preliminary packaging of the drive circuit are completed to obtain the pre-processed regional unit, ensuring that the unit can provide stable and uniform current distribution in practical applications and can adapt to the heat load requirements of different regions.

[0046] In one embodiment, the step of mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminarily mounted regional unit includes: Measuring the surface finish of the pre-processed area unit to obtain surface roughness data, and generating an optimized surface treatment process for the pre-processed area unit based on the surface roughness data; Based on the optimized surface treatment process, ion treatment is performed on the surface of the pre-treated regional unit to a preset standard to obtain a regional unit with a smooth surface; According to the flat surface area unit, the mounting points of the Micro-LED chips are optimized based on the thermal field distribution model, and the mounting position of each Micro-LED chip is adjusted by performing stress analysis on each area unit to obtain a chip mounting solution; Performing dynamic mounting simulation on the chip mounting scheme, and obtaining simulation results of the dynamic mounting simulation through finite element analysis, and dynamically adjusting welding temperature and pressure parameters according to the simulation results to obtain an optimized welding process; Based on the optimized welding process, the Micro-LED chip is mounted on the area unit with a flat surface, and the solder joints of the Micro-LED chip are locally heated to a predetermined curing temperature to obtain a preliminarily mounted area unit.

[0047] In the above embodiment, the surface finish of the pre-processed area unit is measured to obtain surface roughness data, and then the optimized surface treatment process of the area unit is generated based on the roughness data, which can clearly identify the tiny defects and unevenness on the surface, thereby formulating a set of targeted optimized surface treatment processes. Based on this optimized process, the surface of the pre-processed area unit is treated using ion treatment technology until its surface meets the preset flatness standard, ensuring a smooth and clean surface, and reducing poor chip mounting or welding stress concentration caused by surface unevenness.

[0048] After obtaining a flat regional unit surface, the layout of the mounting points of the Micro-LED chip is optimized in combination with the thermal field distribution model. By calculating the thermal response characteristics of different regions, the layout of the Micro-LED chip can be optimized to ensure that the mounting position of each chip meets the requirements of heat conduction and stress distribution. On this basis, the stress analysis method is used to conduct a detailed analysis of each regional unit, adjust the specific mounting position of each Micro-LED chip, ensure that the welding point is evenly stressed during the welding process, thereby avoiding damage to the solder joints or chip failures due to excessive local stress, and finally obtain a reasonable chip mounting solution.

[0049] Based on the developed chip mounting scheme, dynamic mounting simulation is performed, and the simulation results are obtained through finite element analysis (FEM). The simulation process can accurately simulate the heat distribution, pressure effect and stress conditions of the soldering points during the chip mounting process, thereby ensuring that there will be no problems of excessive temperature or excessive pressure during the actual mounting process. Under the guidance of the simulation results, the welding temperature and pressure parameters are further adjusted to ensure that the heat load and stress distribution during the welding process are in the optimal state and to reduce potential risks during the welding process. Finally, based on the optimized welding process, the Micro-LED chip is actually mounted on the regional unit with a flat surface. During this process, the solder joints of the chip are locally heated so that the solder joints reach the predetermined curing temperature to ensure that the solder joints can be firmly connected and maintain long-term stability, thereby obtaining a preliminarily mounted regional unit. In one embodiment, the step of collecting the temperature change data of the initially mounted regional unit in real time, constructing a dynamic temperature change surface, performing a slice integral calculation on the temperature change surface, and performing pulse temperature compensation to obtain a temperature-balanced regional unit when the integral value exceeds a preset temperature threshold comprises: Based on the temperature sensor array, real-time temperature change data of different positions of the initially mounted regional unit are collected to construct a temperature data matrix, and the temperature data matrix is ​​mapped to the temperature distribution of the initially mounted regional unit at different time points to obtain a temperature change data set; An interpolation algorithm is used to smooth the temperature change data set to obtain a temperature change surface; The temperature change surface is divided into a plurality of slice regions, each slice region is integrated by a numerical integration method to obtain a temperature change value of each slice region, and all temperature change values ​​are summarized to obtain a temperature integral value of the preliminarily mounted regional unit; Comparing the temperature integral value with a preset temperature threshold to determine whether the temperature integral value exceeds the preset temperature threshold; When the temperature integral value exceeds a preset threshold, dynamic pulse temperature compensation is performed on the preliminarily mounted regional unit with a preset pulse heating time and a preset pulse intensity to obtain a regional unit with balanced temperature.

[0050] In the above embodiment, based on the temperature sensor array, the temperature change data of different positions of the preliminary mounting area unit are collected in real time. These data reflect the temperature distribution of the area unit at different time points by constructing a temperature data matrix, forming a complete temperature change data set.

[0051] The interpolation algorithm is used to smooth the temperature change data set to obtain a more accurate temperature change surface to ensure that temperature fluctuations are effectively suppressed. The temperature change surface is divided into multiple slice areas, and the numerical integration method is used to integrate each slice area to obtain the temperature change value of each area, and the temperature change values ​​of all areas are summarized to finally calculate the temperature integral value of the entire preliminary mounting area unit. The temperature integral value is compared with the preset temperature threshold to determine whether it exceeds the preset temperature upper limit. When the temperature integral value exceeds the preset threshold, the system starts the preset pulse heating strategy, and performs dynamic temperature compensation on the regional unit by controlling the preset pulse heating time and intensity to ensure temperature balance and avoid welding quality problems caused by local overheating.

[0052] In one embodiment, the step of grouping the temperature-balanced regional units, calculating the thermal stability of each group based on the thermal field distribution model, allocating differentiated reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curves based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate includes: The temperature-balanced regional units are grouped, and the heat capacity, thermal response time and thermal expansion coefficient of each grouped region are calculated based on the thermal field distribution model to obtain thermal stability data of each regional unit; Classifying each grouping area by a cluster analysis algorithm according to the thermal stability data to obtain a classification result, so as to assign different reflow curing temperature curves to grouping areas of different categories; According to the classification results, a regression analysis algorithm is used to generate a differentiated reflow temperature curve, and the reflow temperature curve is optimized by a regression model to obtain an optimized reflow temperature curve; Performing preliminary reflow curing treatment on each grouping area according to the optimized reflow temperature curve, and fine-tuning the reflow temperature curve based on a feedback control system to obtain a stable reflow curing area; Calculating the stress state of the solder joints in the reflow curing area based on the plastic deformation trend of the solder joints, and adjusting the heating section parameters of the reflow temperature curve according to the calculation results to optimize the reflow curing process for each grouping area; The temperature of the grouped areas after the optimized reflow curing is verified, and the temperature distribution of each grouped area is detected by using an infrared thermal imager to make the temperature distribution of each grouped area uniform, thereby obtaining a pre-cured substrate.

[0053] In the above embodiment, the temperature-balanced regional units are grouped, and the heat capacity, thermal response time, and thermal expansion coefficient of each grouped region are calculated based on the thermal field distribution model, thereby obtaining the thermal stability data of each regional unit, which provides a basis for the differentiated allocation of the subsequent reflow temperature curve. Based on the thermal stability data, a cluster analysis algorithm is used to classify each grouped region, so as to formulate a highly adaptable reflow temperature curve according to the thermal stability characteristics of different categories.

[0054] According to the classification results, the regression analysis algorithm is further used to generate differentiated reflow temperature curves, and the reflow temperature curves are optimized. The parameters of the temperature curves are adjusted through the regression model to ensure that they can effectively adapt to the thermal requirements of different areas. On this basis, according to the optimized reflow temperature curve, each grouping area is subjected to preliminary reflow curing treatment. At the same time, the reflow temperature curve is fine-tuned through the feedback control system, and the temperature parameters are adjusted in real time to ensure stable temperature control in each area, and finally form a stable reflow curing area.

[0055] In the process of optimizing the reflow curing, the plastic deformation trend of the solder joints is taken into account, and the stress state of the solder joints is analyzed using a calculation model. The heating section parameters in the reflow temperature curve are adjusted according to the analysis results to avoid plastic deformation of the solder joints due to local overheating or uneven temperature, and further optimize the reflow curing process. In the temperature verification stage, the temperature distribution of each grouping area is detected by an infrared thermal imager to ensure that the temperature of each area is evenly distributed, so as to obtain a pre-cured substrate and complete the optimization of the welding process.

[0056] In one embodiment, the steps of performing overall curing and local solder joint correction on the pre-cured substrate, and calibrating the color and brightness consistency of the cured substrate to obtain a frameless notebook display screen with a stable structure include: A segmented temperature control strategy is used to heat and cool the pre-cured substrate. The heating rate and cooling rate are adjusted based on the real-time temperature data during the segmented reflow curing process to obtain a cured substrate with uniform temperature distribution. According to the solder point distribution diagram of the solidified substrate with uniform temperature distribution, optically inspect the local solder points of the solidified substrate based on an automatic optical inspection system, and laser repair the defective solder points according to the inspection results to obtain a perfect solidified substrate; Scanning the display area of ​​the perfect-cured substrate with a color analyzer to collect color data of each pixel, generating a preliminary calibration curve based on the color data, and performing preliminary color adjustment on the perfect-cured substrate to obtain a substrate with preliminary color calibration; Based on the brightness detection device, the display area of ​​the substrate subjected to the preliminary color calibration is measured point by point, the brightness value data of each pixel is collected, and a brightness compensation curve is generated by using a data fitting algorithm to adjust the driving current of each pixel to obtain a substrate with consistent brightness; A dynamic calibration system is used to comprehensively analyze the display area of ​​the substrate with uniform brightness, correct the residual color and brightness deviations, and obtain a frameless notebook display screen with a stable structure.

[0057] In the above embodiment, a segmented temperature control strategy is adopted to heat and cool the pre-cured substrate, and based on the real-time temperature data during the segmented reflow curing process, the heating rate and the cooling rate are dynamically adjusted to ensure uniform temperature distribution and avoid local overheating or overcooling, thereby obtaining a cured substrate with uniform temperature.

[0058] According to the solder joint distribution map of the cured substrate, the substrate is locally inspected with the automatic optical inspection system, and the defective solder joints in the inspection results are laser repaired to eliminate welding defects and ensure the quality of solder joints, and finally a perfect cured substrate is obtained. The display area of ​​the perfect cured substrate is scanned based on the color analyzer, the color data of each pixel is collected, and a preliminary calibration curve is generated based on these color data. The substrate is preliminarily adjusted in color by adjusting the color parameters to obtain a substrate with preliminary color calibration.

[0059] After the color adjustment is completed, the brightness detection equipment is used to measure the brightness of the substrate after the preliminary color calibration point by point, collect the brightness value data of each pixel point, and generate a brightness compensation curve through the data fitting algorithm to finely adjust the driving current of each pixel point to achieve brightness consistency and ensure the brightness uniformity of the display. The dynamic calibration system is used to conduct a comprehensive analysis of the substrate with consistent brightness, correct any residual color and brightness deviations, and finally obtain a borderless notebook display with stable structure, uniform color and brightness.

[0060] Reference Figure 2 The present invention also proposes a borderless notebook display screen, which adopts the manufacturing method as described in any one of the above items, including a display screen substrate 1 and a Micro-LED chip array 2, wherein the display screen substrate 1 is provided with a flexible circuit board 3, and the Micro-LED chip array 2 is connected to the flexible circuit board 3; A heat dissipation component is disposed on one end surface of the display screen substrate 1 facing away from the Micro-LED chip array 2. The heat dissipation component includes a heat sink 4 and a heat pipe 5. The heat sink 4 abuts against the display screen substrate 1. The heat pipe is connected to the heat sink 4, and the heat pipe is connected to the circuit board of the display screen substrate 1. A housing 6 is further provided on the side of the heat sink 4 facing away from the display screen substrate 1 , and the peripheral side of the heat sink 4 and the heat pipe 5 are both connected to the inner wall of the housing 6 .

[0061] In the above embodiment, a flexible circuit board 3 is provided on the front of the display screen substrate 1, and the Micro-LED chip array 2 is connected to the flexible circuit board 3 to ensure efficient transmission of circuit signals. A heat dissipation component is provided on the back of the display screen substrate 1, and the heat dissipation component includes a heat sink 4 and a heat pipe 5. The heat sink 4 is in close contact with the display screen substrate 1, and can effectively conduct the heat generated on the substrate to the heat sink 4. The heat pipe 5 is connected to the heat sink 4 and extends to the circuit board part of the display screen substrate 1, further enhancing the heat conduction efficiency. This heat dissipation design can ensure that the internal temperature of the display screen is effectively reduced under high load or long-term use, and prevent overheating from causing performance degradation or failure.

[0062] The back of the heat sink 4 is provided with a housing 6, the inner wall of which is connected to the peripheral side of the heat sink 4 and the heat pipe 5, forming a complete heat dissipation system, ensuring that heat can be quickly and evenly conducted away from the display substrate 1, while protecting the internal components from the external environment. This heat dissipation structure not only improves the working stability of the display, but also effectively prolongs the service life of the display, ensuring the durability of the display effect.

[0063] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a borderless notebook display screen, characterized in that: include: Performing structural analysis on a substrate of a display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit; Performing COF packaging processing on each of the initial regional units, generating a layout strategy for the drive circuit based on the thermal field distribution model, integrating the drive circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processed regional unit with an integrated drive circuit; Mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminarily mounted regional unit; Real-time acquisition of temperature change data of the preliminarily mounted regional units, construction of a dynamic temperature change surface, slice-by-slice integral calculation of the temperature change surface, and when the integral value exceeds a preset temperature threshold, pulse temperature compensation is performed to obtain a temperature-balanced regional unit; The temperature-balanced regional units are grouped, the thermal stability of each group is calculated based on the thermal field distribution model, a differentiated reflow temperature curve is allocated according to the thermal stability, and the reflow temperature curve is adjusted based on the plastic deformation trend of the solder joint to perform segmented reflow curing to obtain a pre-cured substrate; The pre-cured substrate is cured as a whole and the local solder joints are corrected, and the cured substrate is calibrated for color and brightness consistency to obtain a frameless notebook display screen with a stable structure.

2. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of performing structural analysis on the substrate of the display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit includes: Acquiring physical property data of a substrate of a display screen, the physical property data including thermal conductivity, specific heat capacity and structural thickness of the substrate, and performing thermal field simulation on the substrate using a finite element analysis method based on the physical property data to obtain thermal response simulation data; According to the thermal response simulation data, selecting and setting a grid density to divide the substrate into a plurality of thermally equivalent area units; Calculating the local temperature change of each thermally equivalent regional unit to establish a global thermal field distribution map, and dividing the substrate according to the global thermal field distribution map to obtain a plurality of initial regional units; Based on the temperature difference and thermal conductivity between the initial regional unit regions, the thermal field is optimized by fine-tuning the boundaries of the initial regional unit through an iterative optimization algorithm, and dynamic adjustments are made according to the thermal stability of the initial regional unit to generate a thermal field distribution model.

3. The method for manufacturing a borderless notebook display screen according to claim 2, characterized in that: The step of optimizing the thermal field by fine-tuning the boundaries of the initial regional units based on the temperature difference and thermal conductivity between the initial regional units through an iterative optimization algorithm, and dynamically adjusting the thermal stability of the initial regional units to generate a thermal field distribution model includes: Analyzing the thermal response data of the initial regional unit, using the principal component analysis method to reduce the dimension of the temperature difference and thermal conductivity of each region, and obtaining thermal response characteristic data; Based on the thermal response characteristic data, the initial area units are divided into different thermal response groups using a clustering algorithm; Applying an iterative optimization algorithm to fine-tune the boundary of each thermal response group to reduce the temperature difference between the thermal response groups, and adjusting the boundary position according to the thermal conductivity and boundary conditions of each thermal response group to obtain an optimized regional boundary; Simulating the thermal field distribution of the optimized regional boundary, eliminating potential deviations of the boundary of the initial regional unit based on the simulation results, and obtaining an accurate thermal field distribution model; According to the precise thermal field distribution model, the thermal stability of the initial area unit is dynamically adjusted by using a weighted average method, and the initial area units whose stability is lower than a preset stability threshold are marked and corrected to generate a thermal field distribution model with high thermal stability and uniform thermal distribution.

4. The method for manufacturing a borderless notebook display screen according to claim 2, characterized in that: The steps of performing COF packaging processing on each of the initial regional units, generating a layout strategy of the driving circuit based on the thermal field distribution model, integrating the driving circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processing regional unit with an integrated driving circuit include: Performing surface pretreatment on each of the initial area units, and coating a conductive adhesive on the surface of each of the initial area units; Calculate the thermal response characteristics of each initial area unit according to the thermal field distribution model, design the COF packaging structure in combination with the physical property data, and generate a COF packaging solution; Based on the COF packaging solution, a flexible circuit board is connected to the surface of the initial area unit by a thin film laser packaging method to obtain a stable packaging area unit; Performing thermal field analysis on the package stable regional unit, determining the local heat load distribution of each regional unit according to the thermal response characteristics and the thermal field distribution model of each regional unit to obtain a heat load calculation model; According to the heat load calculation model, a layout strategy for the drive circuit is generated using a computer-aided design tool, and a temperature-voltage coupling simulation analysis is performed on the layout strategy to obtain current density distribution and temperature rise data of each regional unit to adjust the parameters of the layout strategy and obtain the optimal layout strategy for the drive circuit; Based on the optimal layout strategy, the driving circuit is welded to the flexible circuit board of the initial area unit to obtain a pre-processing area unit of the integrated driving circuit.

5. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminary mounted regional unit includes: Measuring the surface finish of the pre-processed area unit to obtain surface roughness data, and generating an optimized surface treatment process for the pre-processed area unit based on the surface roughness data; Based on the optimized surface treatment process, ion treatment is performed on the surface of the pre-treated regional unit to a preset standard to obtain a regional unit with a smooth surface; According to the flat surface area unit, the mounting points of the Micro-LED chips are optimized based on the thermal field distribution model, and the mounting position of each Micro-LED chip is adjusted by performing stress analysis on each area unit to obtain a chip mounting solution; Performing dynamic mounting simulation on the chip mounting scheme, and obtaining simulation results of the dynamic mounting simulation through finite element analysis, and dynamically adjusting welding temperature and pressure parameters according to the simulation results to obtain an optimized welding process; Based on the optimized welding process, the Micro-LED chip is mounted on the area unit with a flat surface, and the solder joints of the Micro-LED chip are locally heated to a predetermined curing temperature to obtain a preliminarily mounted area unit.

6. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of collecting the temperature change data of the initially mounted regional unit in real time, constructing a dynamic temperature change surface, performing a slice integral calculation on the temperature change surface, and performing pulse temperature compensation to obtain a temperature-balanced regional unit when the integral value exceeds a preset temperature threshold comprises: Based on the temperature sensor array, real-time temperature change data of different positions of the initially mounted regional unit are collected to construct a temperature data matrix, and the temperature data matrix is ​​mapped to the temperature distribution of the initially mounted regional unit at different time points to obtain a temperature change data set; An interpolation algorithm is used to smooth the temperature change data set to obtain a temperature change surface; The temperature change surface is divided into a plurality of slice regions, each slice region is integrated by a numerical integration method to obtain a temperature change value of each slice region, and all temperature change values ​​are summarized to obtain a temperature integral value of the preliminarily mounted regional unit; Comparing the temperature integral value with a preset temperature threshold to determine whether the temperature integral value exceeds the preset temperature threshold; When the temperature integral value exceeds a preset threshold, dynamic pulse temperature compensation is performed on the preliminarily mounted regional unit with a preset pulse heating time and a preset pulse intensity to obtain a regional unit with balanced temperature.

7. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of grouping the temperature-balanced regional units, calculating the thermal stability of each group based on the thermal field distribution model, allocating differentiated reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curves based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate includes: The temperature-balanced regional units are grouped, and the heat capacity, thermal response time and thermal expansion coefficient of each grouped region are calculated based on the thermal field distribution model to obtain thermal stability data of each regional unit; Classifying each grouping area by a cluster analysis algorithm according to the thermal stability data to obtain a classification result, so as to assign different reflow curing temperature curves to grouping areas of different categories; According to the classification results, a regression analysis algorithm is used to generate a differentiated reflow temperature curve, and the reflow temperature curve is optimized by a regression model to obtain an optimized reflow temperature curve; Performing preliminary reflow curing treatment on each grouping area according to the optimized reflow temperature curve, and fine-tuning the reflow temperature curve based on a feedback control system to obtain a stable reflow curing area; Calculating the stress state of the solder joints in the reflow curing area based on the plastic deformation trend of the solder joints, and adjusting the heating section parameters of the reflow temperature curve according to the calculation results to optimize the reflow curing process for each grouping area; The temperature of the grouped areas after the optimized reflow curing is verified, and the temperature distribution of each grouped area is detected by using an infrared thermal imager to make the temperature distribution of each grouped area uniform, thereby obtaining a pre-cured substrate.

8. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The steps of overall curing and local solder joint correction of the pre-cured substrate, and color and brightness consistency calibration of the cured substrate to obtain a frameless notebook display screen with a stable structure include: A segmented temperature control strategy is used to heat and cool the pre-cured substrate. The heating rate and cooling rate are adjusted based on the real-time temperature data during the segmented reflow curing process to obtain a cured substrate with uniform temperature distribution. According to the solder point distribution diagram of the solidified substrate with uniform temperature distribution, optically inspect the local solder points of the solidified substrate based on an automatic optical inspection system, and laser repair the defective solder points according to the inspection results to obtain a perfect solidified substrate; Scanning the display area of ​​the perfect-cured substrate with a color analyzer to collect color data of each pixel, generating a preliminary calibration curve based on the color data, and performing preliminary color adjustment on the perfect-cured substrate to obtain a substrate with preliminary color calibration; Based on the brightness detection device, the display area of ​​the substrate subjected to the preliminary color calibration is measured point by point, the brightness value data of each pixel is collected, and a brightness compensation curve is generated by using a data fitting algorithm to adjust the driving current of each pixel to obtain a substrate with consistent brightness; A dynamic calibration system is used to comprehensively analyze the display area of ​​the substrate with uniform brightness, correct the residual color and brightness deviations, and obtain a frameless notebook display screen with a stable structure.

9. A borderless notebook display screen, characterized in that: The manufacturing method according to any one of claims 1 to 7 comprises a display screen substrate and a Micro-LED chip array, wherein the display screen substrate is provided with a flexible circuit board, and the Micro-LED chip array is connected to the flexible circuit board; A heat dissipation component is disposed on one end surface of the display screen substrate facing away from the Micro-LED chip array, the heat dissipation component includes a heat sink and a heat pipe, the heat sink abuts against the display screen substrate, the heat pipe is connected to the heat sink, and the heat pipe is connected to the circuit board of the display screen substrate; A shell is also provided on the side of the heat sink facing away from the display screen substrate, and the peripheral side of the heat sink and the heat pipe are both connected to the inner wall of the shell.

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