Display panel, display panel preparation method and display device

Abstract

The invention belongs to the technical field of display devices, and particularly provides a display panel, a display panel preparation method and a display device.The display panel comprises a substrate, a pixel definition layer, a first electrode layer and a protective layer, and the pixel definition layer is at least partially arranged on one side of the substrate; the isolation structure is arranged on the side, away from the substrate, of the pixel definition layer, and at least part of the pixel definition part surrounds to form a light transmitting opening; the first electrode layer is arranged on the side, close to the substrate, of the pixel definition layer, and at least part of the first electrode layer is exposed in the light transmitting opening; the protection layer is at least partially arranged in the light-transmitting opening and located on the side, away from the substrate, of the first electrode layer, and the side, away from the substrate, of the protection layer comprises a crystallization surface. By arranging the protective layer, the first electrode layer can be prevented from being eroded in an etching process, so that the risk of pixel failure caused by connection fracture of the first electrode layer and the conductive layer is reduced, and the probability that dark spots appear on the display panel is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and more specifically, to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] A display panel generally includes a conductive layer and an electrode connected to the conductive layer. In the process of manufacturing the display panel, the conductive layer and the electrode are connected, and in the subsequent process of manufacturing the light-emitting functional layer, since an etching process is used to manufacture the light-emitting functional layer, there is a risk of corrosion of the electrode, which in turn causes the connection between the electrode and the conductive layer to break, resulting in dark spots on the display panel, greatly reducing the quality reliability of the display panel. Summary of the invention

[0003] The purpose of the present application is to provide a display panel, a method for manufacturing a display panel and a display device, so as to solve the technical problem in the prior art that the connection between the electrode and the conductive layer is broken, thereby causing dark spots on the display panel.

[0004] To achieve the above purpose, the technical solution adopted in this application is:

[0005] In a first aspect, a display panel is provided, the display panel comprising:

[0006] substrate;

[0007] A pixel definition layer, the pixel definition layer comprising a pixel definition portion, at least part of the pixel definition portion is disposed on one side of the substrate, and at least part of the pixel definition portion surrounds a light-transmitting opening;

[0008] A first electrode layer is disposed on a side of the pixel definition layer close to the substrate, and at least a portion of the first electrode layer is exposed in the light-transmitting opening;

[0009] A protective layer is at least partially disposed in the light-transmitting opening, the protective layer is located on a side of the first electrode layer away from the substrate, and a side of the protective layer away from the substrate includes a crystalline surface.

[0010] Specifically, by providing a protective layer on the first electrode layer, the first electrode layer can be prevented from being corroded during the etching process during the production of the display panel, thereby reducing the risk of pixel failure caused by broken connection between the first electrode layer and the conductive layer of the display panel, greatly reducing the probability of dark spots appearing on the display panel, and effectively improving the quality reliability of the display panel.

[0011] As an implementation, the thickness of the protective layer is 0.02um to 0.04um; preferably, the protective layer is made of a transparent material. Preferably, the material of the protective layer includes indium gallium zinc oxide, indium aluminum zinc oxide, indium tin zinc oxide, indium tin aluminum zinc oxide, or indium gallium oxide.

[0012] Specifically, by providing the protective layer with a thickness of 0.02um to 0.04um, the first electrode layer can be effectively protected during the etching process, while preventing the thickness of the display panel from increasing too much, which is still conducive to achieving a thin and light display panel. By using a transparent material to make the protective layer, the first electrode layer can be prevented from being corroded during the etching process, while ensuring the transmittance of the light-transmitting port.

[0013] As an embodiment, one end of the protective layer extends to the side of the light-transmitting opening and covers at least part of the side of the light-transmitting opening. Preferably, the display panel further comprises an isolation structure, which is arranged on the side of the pixel definition layer facing away from the substrate, and at least part of the isolation structure encloses and forms an ambient light hole, and the orthographic projection of the ambient light hole on the substrate covers the orthographic projection of the light-transmitting opening on the substrate. Preferably, a first plane is arranged on the side of the first electrode layer close to the pixel definition layer, and the other end of the protective layer extends to the first plane to form a protective plane portion. Preferably, a gap is arranged between the protective plane portion and the pixel definition portion. Preferably, the display panel further comprises an encapsulation layer, which covers at least part of the protective plane portion.

[0014] Specifically, by extending one end of the protective layer to part of the side surface of the light-transmitting port, it is possible to ensure that the protective layer has completely covered the end of the first electrode layer, thereby ensuring that the first electrode layer will not be corroded in the subsequent etching process. Furthermore, the other end of the protective layer extends to the first plane and forms a protective plane portion, so that the protective plane portion is at least partially located outside the position where the first electrode layer is connected to the conductive layer, thereby ensuring that the connection position between the first electrode layer and the conductive layer will not be corroded, thereby improving the connection reliability between the first electrode layer and the conductive layer. Furthermore, by providing the encapsulation layer and making the encapsulation layer cover at least part of the protective plane portion, the first electrode layer is completely covered, that is, the first electrode layer has no external leakage area, thereby effectively preventing the first electrode layer from being corroded in the subsequent etching process, and greatly reducing the risk of the first electrode layer being broken.

[0015] As an implementation manner, the protective layer covers the first electrode layer at the position of the light transmission opening.

[0016] As an embodiment, the display panel further comprises a conductive layer, which is disposed on a side of the first electrode layer close to the substrate, and at least a portion of the conductive layer is electrically connected to the first electrode layer. Optionally, an orthographic projection of the conductive layer on the substrate overlaps an orthographic projection of the light-transmitting opening on the substrate.

[0017] In a second aspect, a display panel manufacturing method is provided, which is used to manufacture the above-mentioned display panel. The display panel manufacturing method comprises:

[0018] Providing a first substrate, the first substrate comprising a conductive layer and a first electrode layer connected to the conductive layer, wherein a side of the first electrode layer away from the conductive layer is exposed;

[0019] A pixel definition layer is disposed on the first substrate, and a light-transmitting opening is opened on the pixel definition layer, wherein at least a portion of the first electrode layer is located in the light-transmitting opening;

[0020] Making a protective layer on a side of the first electrode layer away from the conductive layer to form a second substrate;

[0021] A light-emitting functional layer is manufactured on the second substrate.

[0022] Specifically, the conductive layer and at least part of the first electrode layer are located at the light-transmitting opening, and the light-transmitting opening cannot cover the encapsulation layer during the process of manufacturing the light-emitting functional layer, so that the first electrode layer at the position of the conductive layer is at risk of being corroded and broken during the etching process. The present application protects the first electrode layer by manufacturing the protective layer before the etching process, thereby preventing the first electrode layer from being corroded during the etching process, thereby reducing the risk of pixel failure caused by the broken connection between the first electrode layer and the conductive layer, greatly reducing the probability of dark spots appearing on the display panel, and effectively improving the quality reliability of the display panel.

[0023] As an implementation manner, the step of forming a protective layer on a side of the first electrode layer away from the conductive layer includes:

[0024] Making a covering layer on the surface of the first substrate;

[0025] Patterning the cover layer to form a protection pattern, so that the protection pattern covers the first electrode layer in the light-transmitting opening;

[0026] The protection pattern is crystallized to form the protection layer.

[0027] Preferably, after the step of providing a pixel definition layer on the first substrate and opening a light-transmitting opening on the pixel definition layer, the method further comprises:

[0028] An isolation structure is made on the side of the pixel definition layer away from the first substrate, and at least part of the isolation structure encloses an ambient light hole, and the orthographic projection of the ambient light hole on the first substrate covers the orthographic projection of the light transmission port on the first substrate.

[0029] Specifically, the protective layer formed by crystallization can better resist the erosion of the etching process, thereby achieving more effective protection for the first electrode layer.

[0030] As an embodiment, the step of patterning the covering layer to form a protection pattern so that the protection pattern covers the first electrode layer in the light-transmitting opening includes:

[0031] Perform coating, exposure, and development operations on the surface of the cover layer to expose a clean area other than the area where the light-transmitting port is located;

[0032] Etching the cleaned area to remove the covering layer in the cleaned area;

[0033] The coating in the area where the light-transmitting opening is located is peeled off to expose the covering layer in the area where the light-transmitting opening is located, thereby forming the protection pattern.

[0034] Specifically, through coating, exposure, development, etching and stripping and other processes, the operation reliability is high, and the covering layer outside the area where the light-transmitting port is located is effectively removed, and only the covering layer at the position of the light-transmitting port is retained, thereby forming the protective pattern that can effectively protect the conductive layer, which not only realizes the protection of the first electrode layer at the position of the conductive layer, but also avoids the influence of the protective pattern on the interlayer connection in other areas.

[0035] As an embodiment, the step of crystallizing the protection pattern to form the protection layer includes:

[0036] The protective pattern is baked to crystallize the protective pattern and form the protective layer.

[0037] Specifically, the crystallization of the protective pattern is achieved by high-temperature baking, the process is simple and the cost is low, the execution reliability is high, and it is easy to promote and apply.

[0038] As an embodiment, the first substrate is provided with a pixel opening, and the step of manufacturing the light-emitting functional layer on the second substrate comprises:

[0039] forming a light emitting material layer on the second substrate;

[0040] The light-emitting material layer is patterned to retain a portion of the light-emitting material layer located at the pixel opening to form the light-emitting functional layer.

[0041] Specifically, patterning the light-emitting material layer by an etching process to form the light-emitting functional layer can effectively improve the precision of the light-emitting functional layer. On the other hand, since the protective layer is provided before the etching process, the first electrode layer can be effectively prevented from being corroded and broken during the process of manufacturing the light-emitting functional layer.

[0042] In a third aspect, a display device is provided, wherein the display device comprises the above-mentioned display panel.

[0043] The display panel, display panel manufacturing method and display device provided by the present application have the following beneficial effects:

[0044] By forming the protective layer to protect the first electrode layer before the etching process, the first electrode layer can be prevented from being corroded during the etching process, thereby reducing the risk of pixel failure caused by broken connection between the first electrode layer and the conductive layer, greatly reducing the probability of dark spots appearing on the display panel, and effectively improving the quality reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0046] Figure 1 A schematic diagram of a partial structure of a display panel provided in an embodiment of the present application;

[0047] Figure 2 A schematic diagram of a first substrate provided in an embodiment of the present application;

[0048] Figure 3 A schematic diagram of a second substrate provided in an embodiment of the present application;

[0049] Figure 4 Schematic diagram of the steps of the display panel manufacturing method provided in the embodiment of the present application Figure 1 ;

[0050] Figure 5 Schematic diagram of the steps of the display panel manufacturing method provided in the embodiment of the present application Figure 2 ;

[0051] Figure 6 Schematic diagram of the steps of the display panel manufacturing method provided in the embodiment of the present application Figure 3 ;

[0052] Figure 7 Schematic diagram of the steps of the display panel manufacturing method provided in the embodiment of the present application Figure 4 ;

[0053] Figure 8 Schematic diagram of the steps of the display panel manufacturing method provided in the embodiment of the present application Figure 5 .

[0054] Among them, the reference numerals in the figure are:

[0055] 1. Substrate;

[0056] 2. pixel definition layer; 21. pixel definition portion; 22. light transmission port;

[0057] 3. Isolation structure;

[0058] 4. first electrode layer; 41. first plane;

[0059] 5. Protective layer; 51. Protective plane portion;

[0060] 6. Ambient light hole;

[0061] 7. Conductive layer;

[0062] 8. Encapsulation layer;

[0063] 100. First substrate; 200. Second substrate. DETAILED DESCRIPTION

[0064] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0065] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0066] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0067] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] Among them, the isolation structure recorded in the present application is recorded in applications CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A, please refer to them.

[0069] The present application embodiment provides a display panel, such as Figure 1 As shown, the display panel includes a substrate 1, a pixel definition layer 2, a first electrode layer 4 and a protective layer 5; the pixel definition layer 2 includes a pixel definition portion 21, at least a portion of the pixel definition portion 21 is arranged on a side of the substrate 1, and at least a portion of the pixel definition portion 21 surrounds a light-transmitting opening 22; the first electrode layer 4 is arranged on a side of the pixel definition layer 2 close to the substrate 1, and at least a portion of the first electrode layer 4 is exposed to the light-transmitting opening 22; the protective layer 5 is at least partially arranged in the light-transmitting opening 22, the protective layer 5 is located on a side of the first electrode layer 4 away from the substrate 1, and a side of the protective layer 5 facing away from the substrate 1 includes a crystalline surface.

[0070] On the one hand, by providing the protective layer 5 on the first electrode layer 4, the first electrode layer 4 can be prevented from being corroded in the etching process during the manufacturing process of the display panel, thereby reducing the risk of pixel failure caused by the connection between the first electrode layer 4 and the conductive layer 7 of the display panel being broken, greatly reducing the probability of dark spots appearing on the display panel, and effectively improving the quality reliability of the display panel. On the other hand, providing a crystallization surface on the side of the protective layer 5 facing away from the substrate 1 can better reduce the risk of the protective layer 5 being corroded in the etching process.

[0071] In one embodiment, the protective layer 5 is made of a transparent material. This design can both ensure the transmittance of the ambient light hole 6 and prevent the first electrode layer 4 from being corroded during the etching process.

[0072] In one embodiment, the thickness of the protective layer 5 is 0.02um to 0.04um. Specifically, by providing a protective layer 5 with a thickness of 0.02um to 0.04um, the first electrode layer 4 can be effectively protected during the etching process, while the thickness of the display panel can be prevented from being increased too much, which is still conducive to achieving a thin and light display panel.

[0073] In a specific implementation process, the thickness of the protective layer 5 is 0.02um, 0.025um, 0.03um, 0.035um or 0.04um.

[0074] In one embodiment, the protective layer 5 is a metal oxide layer.

[0075] Specifically, metal oxide is a transparent substance, and using metal oxide as the protective layer 5 is helpful to avoid the negative impact of the protective layer 5 on the transmittance of the ambient light hole 6 .

[0076] In one embodiment, the material of the protection layer 5 includes indium gallium zinc oxide, indium aluminum zinc oxide, indium tin zinc oxide, indium tin aluminum zinc oxide, or indium gallium oxide.

[0077] In one embodiment, if Figure 1 As shown, one end of the protective layer 5 extends to the side of the light-transmitting opening 22 and covers at least part of the side of the light-transmitting opening 22. In a specific implementation, a first plane 41 is provided on one side of the first electrode layer 4 close to the pixel definition layer 2, and the other end of the protective layer 5 extends to the first plane 41 to form a protective plane portion 51. A gap is provided between the protective plane portion 51 and the pixel definition portion 21. The display panel further includes an encapsulation layer 8, which covers at least part of the protective plane portion 51.

[0078] Specifically, by extending one end of the protective layer 5 to part of the side of the light-transmitting opening 22, it is possible to ensure that the protective layer 5 has completely covered the end of the first electrode layer 4, thereby ensuring that the first electrode layer 4 will not be corroded in the subsequent etching process. Further, the other end of the protective layer 5 extends to the first plane 41 and forms a protective plane portion 51, so that the protective plane portion 51 is at least partially located outside the position where the first electrode layer 4 is connected to the conductive layer 7, thereby ensuring that the connection position between the first electrode layer 4 and the conductive layer 7 will not be corroded, thereby improving the connection reliability between the first electrode layer 4 and the conductive layer 7. Further, by providing the encapsulation layer 8 and making the encapsulation layer 8 cover at least part of the protective plane portion 51, the first electrode layer 4 is completely covered, that is, the first electrode layer 4 has no external leakage area, thereby effectively preventing the first electrode layer 4 from being corroded in the subsequent etching process, and greatly reducing the risk of the first electrode layer 4 being broken.

[0079] In the specific implementation process, the display panel also includes an isolation structure 3, which is arranged on the side of the pixel definition layer 2 facing away from the substrate 1. At least part of the isolation structure 3 encloses an ambient light hole 6, and the orthographic projection of the ambient light hole 6 on the substrate 1 covers the orthographic projection of the light-transmitting port 22 on the substrate 1.

[0080] In one embodiment, if Figure 1 As shown, the protection layer 5 covers the first electrode layer 4 at the position of the light transmission opening 22 .

[0081] In one embodiment, the display panel further includes a conductive layer 7, which is disposed on a side of the first electrode layer 4 close to the substrate 1, and at least a portion of the conductive layer 7 is electrically connected to the first electrode layer 4. In a specific implementation, the protective layer 5 covers a side of the first electrode layer 4 away from the conductive layer 7, and the orthographic projection of the conductive layer 7 on the substrate 1 overlaps with the orthographic projection of the light-transmitting opening 22 on the substrate 1.

[0082] The present application provides a method for preparing a display panel. Figures 2 to 4 As shown, the preparation method comprises:

[0083] A first substrate 100 is provided. The first substrate 100 includes a conductive layer 7 and a first electrode layer 4 connected to the conductive layer 7. A side of the first electrode layer 4 away from the conductive layer 7 is exposed.

[0084] A pixel definition layer 2 is disposed on the first substrate 100, and a light-transmitting opening 22 is opened on the pixel definition layer 2, and at least a portion of the first electrode layer 4 is located in the light-transmitting opening 22. Figure 1 As shown;

[0085] A protective layer 5 is formed on the side of the first electrode layer 4 away from the conductive layer 7 to form a second substrate 200. Figure 2 As shown;

[0086] The light-emitting functional layer is manufactured on the second substrate 200 , so that the first electrode layer 4 is protected by the protective layer 5 during the etching process.

[0087] Specifically, the conductive layer 7 and at least part of the first electrode layer 4 are located at the light-transmitting opening 22, and the light-transmitting opening 22 cannot cover the encapsulation layer 8 during the process of manufacturing the light-emitting functional layer, so that the first electrode layer 4 at the position of the conductive layer 7 is at risk of being corroded and broken during the etching process. Figure 3 As shown, the present application protects the first electrode layer 4 by manufacturing a protective layer 5 before the etching process, thereby preventing the first electrode layer 4 from being corroded during the etching process, thereby reducing the risk of pixel failure caused by a broken connection between the first electrode layer 4 and the conductive layer 7, greatly reducing the probability of dark spots appearing on the display panel, and effectively improving the quality reliability of the display panel.

[0088] In one embodiment, the first electrode layer 4 is an anode.

[0089] In one embodiment, the conductive layer 7 is made of metal material.

[0090] In one embodiment, after the step of manufacturing the light-emitting functional layer on the second substrate 200, the step of manufacturing a second electrode on the second substrate 200 is also included. In a specific implementation process, the second electrode is a cathode.

[0091] In one embodiment, if Figure 5 As shown, the step of making the protective layer 5 on the side of the first electrode layer 4 away from the conductive layer 7 includes:

[0092] A covering layer is formed on the surface of the first substrate 100;

[0093] Patterning the cover layer to form a protection pattern, so that the protection pattern covers the first electrode layer 4 in the light-transmitting opening 22;

[0094] The protective pattern is crystallized to form a protective layer 5.

[0095] Specifically, the protection layer 5 formed by crystallization can better resist the erosion of the etching process, thereby achieving more effective protection for the first electrode layer 4 .

[0096] In one embodiment, after the step of disposing a pixel definition layer 2 on the first substrate 1 and opening a light-transmitting opening 22 on the pixel definition layer 2, the following steps are included:

[0097] An isolation structure 3 is fabricated on the side of the pixel definition layer 2 facing away from the first substrate 1 , and at least a portion of the isolation structure 3 encloses an ambient light hole 6 , whose orthographic projection on the first substrate 1 covers the orthographic projection of the light transmission port 22 on the first substrate 1 .

[0098] In one embodiment, the step of manufacturing the covering layer on the surface of the first substrate 100 specifically includes: manufacturing the covering layer on the surface of the first substrate 100 by using a physical deposition method.

[0099] In one embodiment, if Figure 6 As shown, the step of patterning the cover layer to form a protective pattern so that the protective pattern covers the first electrode layer 4" in the light-transmitting opening 22 includes:

[0100] Applying photoresist, exposing, and developing on the surface of the cover layer to expose a clean area other than the area where the light-transmitting opening 22 is located;

[0101] Etching the cleaned area to remove the covering layer in the cleaned area;

[0102] The photoresist coated on the area where the light transmission opening 22 is located is stripped to expose the covering layer in the area where the light transmission opening 22 is located, thereby forming a protection pattern.

[0103] Specifically, through coating, exposure, development, etching and stripping processes, the operation reliability is high, and the covering layer outside the area where the light-transmitting port 22 is located is effectively removed, leaving only the covering layer at the position of the light-transmitting port 22, thereby forming a protective pattern that can effectively protect the conductive layer 7, thereby achieving protection of the first electrode layer 4 at the position of the conductive layer 7 and avoiding the protective pattern from affecting the interlayer connection in other areas.

[0104] In one embodiment, the step of etching the cleaning area to remove the covering layer in the cleaning area specifically includes: etching the cleaning area using a wet etching process to remove the covering layer in the cleaning area.

[0105] In one embodiment, the step of crystallizing the protective pattern to form the protective layer 5 includes:

[0106] By baking the protective pattern, the protective pattern is crystallized and a protective layer 5 is formed.

[0107] Specifically, the crystallization of the protective pattern is achieved through high-temperature baking, the process is simple and the cost is low, the execution reliability is high, and it is easy to promote and apply.

[0108] In one embodiment, the initial thickness of the protective layer 5 is 0.1um to 0.4um. In a specific implementation process, the initial thickness of the protective layer 5 is 0.1um or 0.15um or 0.2um or 0.25um or 0.3um or 0.35um or 0.4um.

[0109] Specifically, by controlling the initial thickness of the protective layer 5 , it can be ensured that the protective layer 5 can have a certain residual thickness after the etching process, thereby ensuring that the protective layer 5 can provide effective protection for the first electrode layer 4 during the entire etching process.

[0110] In the specific implementation process, the initial thickness of the protective layer 5 can be selected according to the number of etching processes required to be carried out in the process of making the light-emitting functional layer in the subsequent process, so as to ensure that the protective layer 5 can have a certain remaining thickness after the etching process, thereby ensuring that the protective layer 5 can provide effective protection for the first electrode layer 4. Further, the remaining thickness of the protective layer 5 can be 0.02um to 0.04um. In the specific implementation process, the remaining thickness can be 0.02um or 0.025um or 0.03um or 0.035um or 0.04um.

[0111] In one embodiment, if Figure 7 As shown, the first substrate 100 is provided with a pixel opening, and the steps of manufacturing a light-emitting functional layer on the second substrate 200 include:

[0112] forming a light emitting material layer on the second substrate 200;

[0113] The light-emitting material layer is patterned to retain a portion of the light-emitting material layer located at the pixel opening to form a light-emitting functional layer.

[0114] Specifically, patterning the light-emitting material layer using an etching process to form a light-emitting functional layer can effectively improve the precision of the light-emitting functional layer. On the other hand, since a protective layer 5 is provided before the etching process, the first electrode layer 4 can be effectively prevented from being corroded and broken during the process of making the light-emitting functional layer.

[0115] In one embodiment, the first substrate 100 is provided with more than two pixel openings, and different pixel openings are provided with light-emitting functional layers of different colors. To make each light-emitting functional layer of a color, the step of "making a light-emitting functional layer on the second substrate 200" needs to be repeated once to form light-emitting functional layers of multiple different colors.

[0116] In one embodiment, if Figure 8 As shown, the step of “patterning the light-emitting material layer” includes:

[0117] Applying photoresist, exposing, and developing on the second substrate 200 having the light-emitting material layer to expose the light-emitting material layer outside the pixel opening;

[0118] Etching the light-emitting material layer outside the pixel opening to remove the light-emitting material layer outside the pixel opening;

[0119] The photoresist coated on the pixel opening is stripped off to expose the light-emitting functional layer of the pixel opening.

[0120] Specifically, through processes such as coating, exposure, development, etching and stripping, the operation reliability is high and the manufacturing accuracy of the light-emitting functional layer is effectively improved.

[0121] In one embodiment, the step of "etching the light-emitting material layer outside the pixel opening" specifically includes: sequentially performing dry etching and wet etching on the light-emitting material layer outside the pixel opening. Specifically, the dry etching process will cause erosion to the protective layer 5, and since the protective layer 5 is formed by crystallization, the wet etching process will not cause erosion to the protective layer 5. Therefore, by setting a sufficient thickness for the protective layer 5 during the dry etching process, effective protection of the first electrode layer 4 can be achieved.

[0122] An embodiment of the present application further provides a display device, which includes the above-mentioned display panel.

[0123] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: base(1); A pixel definition layer (2), the pixel definition layer (2) comprising a pixel definition portion (21), the pixel definition portion (21) being arranged on one side of the substrate (1), and at least a portion of the pixel definition portion enclosing a light-transmitting opening (22); A first electrode layer (4) is arranged on a side of the pixel definition layer (2) close to the substrate (1), and at least a portion of the first electrode layer (4) is exposed in the light-transmitting opening (22); A protective layer (5) is at least partially disposed in the light-transmitting opening (22); the protective layer (5) is located on a side of the first electrode layer (4) away from the substrate (1); and a side of the protective layer (5) facing away from the substrate (1) includes a crystalline surface.

2. The display panel according to claim 1, wherein: The thickness of the protective layer (5) is 0.02um to 0.04um; Preferably, the protective layer (5) is made of a transparent material; Preferably, the material of the protective layer (5) includes indium gallium zinc oxide, indium aluminum zinc oxide, indium tin zinc oxide, indium tin aluminum zinc oxide, or indium gallium oxide.

3. The display panel according to claim 1, wherein: One end of the protective layer (5) extends to the side surface of the light-transmitting opening (22) and covers at least part of the side surface of the light-transmitting opening (22); Preferably, the display panel further comprises an isolation structure (3), the isolation structure (3) being arranged on a side of the pixel definition layer (2) facing away from the substrate (1), at least a portion of the isolation structure (3) enclosing an ambient light hole (6), the orthographic projection of the ambient light hole (6) on the substrate (1) covering the orthographic projection of the light transmission port (22) on the substrate (1); Preferably, a first plane (41) is provided on one side of the first electrode layer (4) close to the pixel definition layer (2), and the other end of the protective layer (5) extends to the first plane (41) to form a protective plane portion (51); Preferably, a gap is provided between the protection plane portion (51) and the pixel definition portion (21); Preferably, the display panel further comprises an encapsulation layer (8), wherein the encapsulation layer (8) covers at least a portion of the protection plane portion (51); Preferably, the protective layer (5) covers the first electrode layer (4) at the position of the light-transmitting opening (22).

4. The display panel according to claim 1, wherein: The display panel further includes: A conductive layer (7) is arranged on a side of the first electrode layer (4) close to the substrate, and at least a portion of the conductive layer (7) is electrically connected to the first electrode layer (4); Optionally, an orthographic projection of the conductive layer (7) on the substrate overlaps with an orthographic projection of the light-transmitting opening (22) on the substrate.

5. A method for preparing a display panel, characterized in that: Used to prepare the display panel according to any one of claims 1 to 4, the preparation method comprising: Providing a first substrate (100), wherein the first substrate (100) comprises a conductive layer (7) and a first electrode layer (4) connected to the conductive layer (7), wherein a side of the first electrode layer (4) away from the conductive layer (7) is exposed; A pixel definition layer (2) is arranged on the first substrate (100), and a light-transmitting opening (22) is opened on the pixel definition layer (2), wherein at least a portion of the first electrode layer (4) is located in the light-transmitting opening (22); A protective layer (5) is formed on a side of the first electrode layer (4) away from the conductive layer (7) to form a second substrate (200); A light-emitting functional layer is manufactured on the second substrate (200).

6. The method for preparing a display panel according to claim 5, wherein: The step of manufacturing the protective layer (5) on the side of the first electrode layer (4) away from the conductive layer (7) comprises: Making a covering layer on the surface of the first substrate (100); Patterning the covering layer to form a protective pattern, so that the protective pattern covers the first electrode layer (4) in the light-transmitting opening (22); crystallizing the protective pattern to form the protective layer (5); Preferably, after the step of arranging a pixel definition layer (2) on the first substrate (100) and opening a light-transmitting opening (22) on the pixel definition layer (2), the method further comprises: An isolation structure (3) is made on a side of the pixel definition layer (2) facing away from the first substrate (100), and at least a portion of the isolation structure (3) encloses an ambient light hole (6), and an orthographic projection of the ambient light hole (6) on the first substrate (100) covers an orthographic projection of the light-transmitting port (22) on the first substrate (100).

7. The method for preparing a display panel according to claim 6, wherein: The step of patterning the covering layer to form a protective pattern so that the protective pattern covers the first electrode layer (4) in the light-transmitting opening (22) comprises: Performing coating, exposure and development operations on the surface of the cover layer to expose a clean area other than the area where the light-transmitting opening (22) is located; Etching the cleaned area to remove the covering layer in the cleaned area; The coating in the area where the light-transmitting opening (22) is located is peeled off to expose the covering layer in the area where the light-transmitting opening (22) is located, thereby forming the protection pattern.

8. The method for preparing a display panel according to claim 6, wherein: The step of crystallizing the protective pattern to form the protective layer (5) comprises: By baking the protective pattern, the protective pattern is crystallized and the protective layer (5) is formed.

9. The method for preparing a display panel according to claim 5, wherein: The first substrate (100) is provided with a pixel opening, and the step of manufacturing a light-emitting functional layer on the second substrate (200) comprises: forming a light emitting material layer on the second substrate (200); The light-emitting material layer is patterned, and a portion of the light-emitting material layer located at the pixel opening is retained to form the light-emitting functional layer.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 4.

Images