Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment, and relates to the technical field of display. The display panel comprises a driving substrate, a light-emitting device layer and a packaging layer which are sequentially stacked. The packaging layer can comprise an inorganic protection layer, a base film layer and an optical function layer, and the inorganic protection layer, the base film layer and the optical function layer are sequentially stacked in the direction away from the driving substrate. In the structure, a multi-layer laminated structure of the inorganic protection layer, the base film layer and the optical function layer is used as the packaging layer, the inorganic protection layer is located between the light-emitting device layer and the base film layer, and water and oxygen can be effectively prevented from entering the light-emitting device layer through the inorganic protection layer, so that the problem of displaying dark spots is solved; the reliability and the service life of the product are effectively improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Micro-LEDs possess numerous advantages such as self-emissiveness, high efficiency, low power consumption, high integration, and high stability, making them a promising candidate for the market. However, in the manufacturing process of Micro-LED products, packaging technology is a crucial factor affecting product reliability.

[0003] However, existing packaging technologies do not perform well in high temperature and high humidity reliability tests, and problems such as dark spot failures exist. Summary of the Invention

[0004] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a display panel, a method for manufacturing the display panel, and an electronic device.

[0005] In a first aspect, embodiments of this application provide a display panel, the display panel comprising a driving substrate, a light-emitting device layer and an encapsulation layer stacked sequentially, wherein the light-emitting device layer includes a light-emitting unit electrically connected to the driving substrate;

[0006] The encapsulation layer includes an inorganic protective layer, a base film layer, and an optical functional layer, wherein the inorganic protective layer, the base film layer, and the optical functional layer are stacked sequentially in a direction away from the driving substrate.

[0007] In one possible implementation, the water vapor permeability of the inorganic protective layer is less than 0.001;

[0008] Preferably, the inorganic protective layer is made of silicon oxide.

[0009] In one possible implementation, the optical functional layer includes an anti-glare layer and an anti-reflection layer, wherein the anti-glare layer is located on the side of the base film layer away from the inorganic protective layer, and the anti-reflection layer is located on the side of the anti-glare layer away from the base film layer.

[0010] In one possible implementation, the haze of the anti-glare layer is 90% to 95%, and the visible light reflectance of the anti-reflection layer is 3.50 to 3.55.

[0011] In one possible implementation, the encapsulation layer further includes a light-diffusing adhesive layer located on the side of the inorganic protective layer away from the base film layer, the light-diffusing adhesive layer comprising a transparent optical polymer body and diffused particles uniformly distributed in the optical polymer body.

[0012] In one possible implementation, the thickness of the light-diffusing adhesive layer is 80 μm to 120 μm in a direction perpendicular to the plane of the driving substrate.

[0013] In one possible implementation, the light-emitting device layer further includes light-absorbing units located around the light-emitting unit, wherein the height of the light-absorbing units is less than the height of the light-emitting unit in a direction perpendicular to the plane of the driving substrate.

[0014] Preferably, the light-emitting device layer further includes an organic protective layer, which is located between the light-emitting unit and the light-absorbing unit.

[0015] In one possible implementation, the material of the light-absorbing unit is a black light-absorbing material, which includes ink.

[0016] Secondly, embodiments of this application also provide a method for manufacturing a display panel, the method comprising:

[0017] Provide a driving substrate;

[0018] A light-emitting device layer comprising light-emitting units connected to the driving substrate is fabricated on one side of the driving substrate.

[0019] An encapsulation layer is fabricated, consisting of a layered light-diffusing adhesive layer, an inorganic protective layer, a base film layer, and an optical functional layer, and the encapsulation layer is bonded to the side of the light-emitting device layer away from the driving substrate.

[0020] Thirdly, embodiments of this application also provide an electronic device, the electronic device including the display panel described in any one of the first aspects.

[0021] Based on any of the above aspects, the display panel, display panel manufacturing method, and electronic device provided in this application include a driving substrate, a light-emitting device layer, and an encapsulation layer stacked sequentially. The encapsulation layer may include an inorganic protective layer, a base film layer, and an optical functional layer, which are stacked sequentially in a direction away from the driving substrate. In the above structure, a multi-layered structure of an inorganic protective layer, a base film layer, and an optical functional layer is used as the encapsulation layer. The inorganic protective layer is located between the light-emitting device layer and the base film layer. The inorganic protective layer effectively prevents water and oxygen from entering the light-emitting device layer, thereby solving the problem of dark spots in the display and improving the reliability and lifespan of the product. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of this application. Figure 1 ;

[0024] Figure 2 A schematic diagram of the structure of a display panel provided in an embodiment of this application. Figure 2 ;

[0025] Figure 3 A schematic diagram of the structure of a display panel provided in an embodiment of this application. Figure 3 ;

[0026] Figure 4 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0027] Figure 5 for Figure 4 The corresponding process flow diagram.

[0028] icon:

[0029] 100 - Driving substrate; 200 - Light-emitting device layer; 300 - Encapsulation layer; 210 - Light-emitting unit; 220 - Light-absorbing unit; 230 - Organic protective layer; 310 - Inorganic protective layer; 320 - Base film layer; 330 - Optical functional layer; 340 - Light-diffusing adhesive layer; 331 - Anti-glare layer; 332 - Anti-reflection layer. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0036] The inventors discovered that related technologies typically employ TFE (Thin Film Encapsulation) encapsulation, which involves directly forming one or more thin films on the surface of the OLED device. These films are usually composed of alternating layers of inorganic and organic materials to block moisture and oxygen. However, in high-temperature and high-humidity environments, this multilayer structure may experience stress due to mismatched coefficients of thermal expansion between adjacent layers. This can lead to defects such as pinholes, crystal points, delamination, or cracking between adjacent layers, affecting encapsulation reliability and causing problems like dark spot failure.

[0037] To address the problems in the existing technology, please refer to... Figure 1 This application provides a display panel 10, which includes a driving substrate 100, a light-emitting device layer 200 and an encapsulation layer 300 stacked sequentially.

[0038] The light-emitting device layer 200 includes a plurality of light-emitting units 210 electrically connected to the driving substrate 100. Each light-emitting unit 210 may include an electrode side and a light-emitting side disposed opposite to each other, with the light-emitting side facing away from the driving substrate 100. The plurality of light-emitting units 210 may be arranged in an array or irregularly on the driving substrate 100. Preferably, the plurality of light-emitting units 210 may be arranged in an array on the driving substrate 100, and the array shape includes, but is not limited to, rectangular arrays, circular arrays, etc., which are not specifically limited in this application. It should be noted that the light-emitting unit 210 in the embodiments of this application includes Micro-LEDs.

[0039] The encapsulation layer 300 may include an inorganic protective layer 310, a base film layer 320, and an optical functional layer 330. In the direction away from the driving substrate 100, the inorganic protective layer 310, the base film layer 320, and the optical functional layer 330 are sequentially stacked. That is, the inorganic protective layer 310 is located on the side of the light-emitting device layer 200 away from the driving substrate 100, the base film layer 320 is located on the side of the inorganic protective layer 310 away from the driving substrate 100, and the optical functional layer is located on the side of the base film layer away from the driving substrate 100. The base film layer 320 includes, but is not limited to, flexible plastic materials such as polyester film (PET). While providing mechanical protection to the other film layers, it can also absorb and release internal stress in the encapsulation layer 300. Under stress, it can expand and contract with the other film layers to a certain extent, reducing the risk of cracking and delamination of the encapsulation layer 300 under high temperature and high humidity conditions. The inorganic protective layer 310, located between the light-emitting device layer 200 and the base film layer 320, can prevent external water and oxygen from penetrating the light-emitting device layer 200, thus improving the reliability of the product in high-temperature and high-humidity environments. Furthermore, the optical functional layer not only improves the display effect by enhancing light distribution but also further enhances the flexibility and impact resistance of the encapsulation layer 300.

[0040] In the above embodiments, a multilayer stacked structure of inorganic protective layer 310, base film layer 320 and optical functional layer 330 is used as the encapsulation layer 300. The inorganic protective layer 310 is located between the light-emitting device layer 200 and the base film layer 320. The inorganic protective layer 310 can more effectively prevent water and oxygen from entering the light-emitting device layer 200, thereby solving the bonding failure problem, improving the reliability and service life of the product in high temperature and high humidity environments, and avoiding the problem of dark spot failure.

[0041] Furthermore, in order to ensure the water and oxygen barrier effect, the inorganic protective layer 310 can be made of a highly dense material with a water vapor permeability of less than 0.001, wherein the material of the inorganic protective layer 310 includes, but is not limited to, silicon oxide.

[0042] Please refer to Figure 2The optical functional layer 330 may include an anti-glare layer 331 and an anti-reflection layer 332. The anti-glare layer 331 is located on the side of the base film layer 320 away from the inorganic protective layer 310, and the anti-reflection layer 332 is located on the side of the anti-glare layer 331 away from the base film layer 320. The haze of the anti-glare layer 331 is 90% to 95%, and the visible light reflectance of the anti-reflection layer 332 is 3.50 to 3.55. For example, the haze of the anti-glare layer 331 can be 90%, 90.5%, 91%, 92%, 93%, 94%, 94.5%, and 95%, etc., and the visible light reflectance of the anti-reflection layer 332 can be 3.5, 3.505, 3.51, 3.515, 3.52, 3.53, 3.54, 3.545, and 3.5, etc. Preferably, the haze of the anti-glare layer 331 is 92%, and the visible light reflectance of the anti-reflection layer 332 is 3.51.

[0043] In the above structure, the anti-glare layer 331 reduces direct light reflection, effectively reducing glare, while the anti-reflection layer 332 increases light transmittance and reduces reflected light, improving screen clarity and contrast in bright environments and providing customers with a better user experience. Furthermore, the anti-glare layer 331 and the anti-reflection layer 332 further enhance the flexibility and impact resistance of the encapsulation layer 300, preventing external forces from damaging the display panel 10.

[0044] In addition, to further improve the display effect of the display panel 10, please refer again. Figure 2 In this embodiment, the encapsulation layer 300 may further include a light-diffusing adhesive layer 340 located on the side of the inorganic protective layer 310 away from the base film layer 320. The light-diffusing adhesive layer 340 may include a transparent optical polymer body and diffusing particles uniformly distributed in the optical polymer body. The diffusing particles can change the propagation direction of light, increase the light diffusion area, reduce glare, improve the light emission uniformity of the display panel 10, improve the viewing angle of the display panel 10, and reduce display pitting. The thickness of the light-diffusing adhesive layer 340 is 80 μm to 120 μm in the direction perpendicular to the plane of the driving substrate 100. For example, in the direction perpendicular to the plane of the driving substrate 100, the thickness of the light-diffusing adhesive layer 340 can be 80μm, 81μm, 82μm, 85μm, 90μm, 100μm, 110μm, 115μm, 117μm, 119μm, and 120μm, etc. Preferably, the thickness of the light-diffusing adhesive layer 340 in the direction perpendicular to the plane of the driving substrate 100 is 100μm. Furthermore, the particle size of the diffused particles is 3μm to 4μm. For example, the particle size of the diffused particles can be 3μm, 3.1μm, 3.2μm, 3.5μm, 3.7μm, 3.9μm, and 4μm. Preferably, the particle size of the diffused particles is 3.5μm.

[0045] In some possible embodiments, please refer to Figure 3 The light-emitting device layer 200 also includes light-absorbing units 220 located around the light-emitting unit 210. In a direction perpendicular to the plane of the driving substrate 100, the height of the light-absorbing unit 220 is less than the height of the light-emitting unit 210. The material of the light-absorbing unit 220 can be a black light-absorbing material, preferably, the black light-absorbing material includes ink.

[0046] In addition, please refer to again Figure 3 The light-emitting device layer 200 may also include an organic protective layer 230. The organic protective layer 230 is located on the side of the light-emitting unit 210 and the black filling layer away from the driving substrate 100. The organic protective layer 230 can initially protect the light-emitting unit 210 from water vapor and oxygen corrosion in the process module segment.

[0047] The inventors also discovered that the overall process of TFE thin film encapsulation is relatively complex and costly, making roll-to-roll production difficult to achieve. Furthermore, the processing temperature during the preparation of the encapsulation layer may damage the device and affect the lifespan of the display panel.

[0048] Based on the same inventive concept, this application also provides a method for manufacturing a display panel, please refer to the following for details. Figure 4 and Figure 5 , Figure 4 This is a flowchart illustrating the manufacturing process of a display panel. Figure 5 for Figure 4 The corresponding process flow diagram. (See below for details.) Figure 4 and Figure 5 The process of manufacturing the display panel is described in detail.

[0049] Step S110: Provide a driving substrate.

[0050] Step S120: A light-emitting device layer including a light-emitting unit connected to the driving substrate is formed on one side of the driving substrate.

[0051] In this step, the light-emitting units 210 can be transferred onto the driving substrate 100 via mass transfer. Each light-emitting unit 210 may include an electrode side and a light-emitting side disposed opposite to each other, with the light-emitting side facing away from the driving substrate 100. Multiple light-emitting units 210 can be arranged in an array or irregularly on the driving substrate 100. Preferably, multiple light-emitting units 210 can be arranged in an array on the driving substrate 100, and the array shape includes, but is not limited to, rectangular arrays, circular arrays, etc., which are not specifically limited in this application. It should be noted that the light-emitting units 210 in the embodiments of this application include, but are not limited to, Micro-LEDs.

[0052] Then, light-absorbing units 220 located around the light-emitting unit 210 are made using a black light-absorbing material. Preferably, the light-absorbing units 220 can be made of ink. The height of the light-absorbing units 220 is less than the height of the light-emitting unit 210 in the direction perpendicular to the driving substrate 100.

[0053] Finally, an organic protective layer 230 can be made on the side of the light-emitting unit 210 and the light-absorbing unit 220 away from the driving substrate 100 using optical organic materials. This organic protective layer 230 can protect the light-emitting unit 210 from water and oxygen intrusion before the encapsulation layer 300 is attached.

[0054] Step S130: Fabricate an encapsulation layer consisting of a stacked inorganic protective layer, a base film layer, and an optical functional layer, and bond the encapsulation layer to the side of the light-emitting device layer away from the driving substrate.

[0055] In this step, a base film layer 320 can be provided first. This base film layer 320 includes, but is not limited to, flexible plastic materials such as polyester film (PET). It can not only provide mechanical protection for other film layers, but also absorb and release the internal stress of the encapsulation layer 300. Under stress, it can expand and contract with other film layers to a certain extent, reducing the risk of cracking and delamination of the encapsulation layer 300 under high temperature and high humidity conditions. Then, an inorganic protective layer 310 is deposited on one side of the base film layer 320 to prevent the intrusion of water vapor and oxygen. Next, an optical functional layer 330 is formed on the other side of the base film layer 320 to improve the overall strength of the encapsulation layer 300 and improve the light distribution, thereby improving the display effect. Specifically, an anti-glare layer 331 is formed on the side of the base film layer 320 where the inorganic protective layer 310 is not provided. For example, the anti-glare layer 331 can be formed by etching, rolling, spraying, or coating anti-glare materials to reduce direct light reflection and reduce glare. Then, an anti-reflection layer 332 can be formed on the side of the anti-glare layer 331 away from the base film layer 320 by magnetron sputtering, sol-gel or vapor deposition anti-reflection material, which improves light transmittance and reduces reflected light, improves the screen’s clarity and contrast in bright environments, and provides customers with a better user experience.

[0056] In addition, a light diffusion adhesive layer 340 composed of a transparent optical polymer body and diffusion particles uniformly distributed in the optical polymer body can be formed on the side of the inorganic protective layer 310 away from the base film layer 320. The diffusion particles can change the propagation direction of light, increase the light diffusion area, reduce glare, improve the light emission uniformity of the display panel 10, improve the viewing angle of the display panel 10, and reduce display pitting.

[0057] In this embodiment, an encapsulation layer 300 is first fabricated, consisting of a stacked inorganic protective layer 310, a base film layer 320, and an optical functional layer 330. Then, the encapsulation layer 300 is bonded to the side of the light-emitting device layer 200 furthest from the driving substrate 100. The inorganic protective layer 310 is located between the light-emitting device layer 200 and the base film layer 320. Compared to TFE thin-film encapsulation technology, this not only reduces the impact of high-temperature environments in subsequent processes on the device but also prevents water and oxygen from entering the light-emitting device layer 200 through the inorganic protective layer 310, thereby solving the bonding failure problem, improving the reliability and lifespan of the product in high-temperature and high-humidity environments, and avoiding dark spot failure.

[0058] Furthermore, this application also provides an electronic device that may include the display panel 10 described in the above embodiments. The display panel 10 includes a driving substrate 100, a light-emitting device layer 200, and an encapsulation layer 300 stacked sequentially. The encapsulation layer 300 includes an inorganic protective layer 310, a base film layer 320, and an optical functional layer 330, which are stacked sequentially in a direction away from the driving substrate 100. In the above-described display panel 10, the inorganic protective layer 310 can effectively prevent water and oxygen from entering the light-emitting device layer 200, thereby solving the problem of bonding failure, effectively improving the reliability and service life of the electronic device in high temperature and high humidity environments, and avoiding problems such as dark spot failure and display pitting.

[0059] In summary, this application provides a display panel, a method for manufacturing the display panel, and an electronic device. The display panel includes a driving substrate, a light-emitting device layer, and an encapsulation layer stacked sequentially. The encapsulation layer may include an inorganic protective layer, a base film layer, and an optical functional layer, which are stacked sequentially in the direction away from the driving substrate. In the above structure, a multilayer stacked structure of an inorganic protective layer, a base film layer, and an optical functional layer is used as the encapsulation layer. The inorganic protective layer is located between the light-emitting device and the base film layer. The inorganic protective layer can effectively prevent water and oxygen from entering the light-emitting device layer, thereby solving the problem of bonding failure, effectively improving the reliability and service life of the product, and avoiding problems such as dark spot failure and display pitting.

[0060] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, It includes a driving substrate, a light-emitting device layer and an encapsulation layer stacked in sequence, wherein the light-emitting device layer includes a light-emitting unit electrically connected to the driving substrate; The encapsulation layer includes an inorganic protective layer, a base film layer, and an optical functional layer, wherein the inorganic protective layer, the base film layer, and the optical functional layer are stacked sequentially in a direction away from the driving substrate.

2. The display panel according to claim 1, characterized in that, The water vapor permeability of the inorganic protective layer is less than 0.001; Preferably, the inorganic protective layer is made of silicon oxide.

3. The display panel according to claim 1, characterized in that, The optical functional layer includes an anti-glare layer and an anti-reflection layer. The anti-glare layer is located on the side of the base film layer away from the inorganic protective layer, and the anti-reflection layer is located on the side of the anti-glare layer away from the base film layer.

4. The display panel according to claim 3, characterized in that, The haze of the anti-glare layer is 90% to 95%, and the visible light reflectance of the anti-reflection layer is 3.50 to 3.

55.

5. The display panel according to claim 1, characterized in that, The encapsulation layer further includes a light-diffusing adhesive layer located on the side of the inorganic protective layer away from the base film layer. The light-diffusing adhesive layer includes a transparent optical polymer body and diffused particles uniformly distributed in the optical polymer body.

6. The display panel according to claim 5, characterized in that, The thickness of the light-diffusing adhesive layer is 80 μm to 120 μm in the direction perpendicular to the plane of the driving substrate.

7. The display panel according to claim 1, characterized in that, The light-emitting device layer also includes light-absorbing units located around the light-emitting unit. In the direction perpendicular to the plane where the driving substrate is located, the height of the light-absorbing unit is less than the height of the light-emitting unit. Preferably, the light-emitting device layer further includes an organic protective layer, which is located on the side of the light-emitting unit and the light-absorbing unit away from the driving substrate.

8. The display panel according to claim 7, characterized in that, The light-absorbing unit is made of a black light-absorbing material, which includes ink.

9. A method for manufacturing a display panel, characterized in that, The method includes: Provide a driving substrate; A light-emitting device layer comprising light-emitting units connected to the driving substrate is fabricated on one side of the driving substrate. An encapsulation layer is fabricated, consisting of a light-diffusing adhesive layer, an inorganic protective layer, a base film layer, and an optical functional layer stacked together, and the encapsulation layer is bonded to the side of the light-emitting device layer away from the driving substrate.

10. An electronic device, characterized in that, The electronic device includes the display panel as described in any one of claims 1-8.

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