Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The preparation method comprises the following steps: constructing an isolation structure on a substrate; the isolation structure is enclosed to form a plurality of pixel openings, the isolation structure comprises a first isolation part, a second isolation part and a third isolation part which are stacked in the direction away from the substrate, and the surface roughness of the second isolation part is greater than that of the first isolation part; the orthographic projection of the first isolation part and the orthographic projection of the second isolation part on the substrate are both located in the orthographic projection of the third isolation part on the substrate; and sequentially constructing a light-emitting unit and a packaging structure. By constructing the third isolation part on the second isolation part, the surface, in contact with the second isolation part, of the third isolation part has the same surface roughness as the surface of the second isolation part, and under the condition that part of the rough surface of the third isolation part is exposed, higher adhesive force exists between the packaging structure and the third isolation part; the probability that the packaging structure falls off is reduced, the problem of pixel dark spots is solved, and the yield of the display panel is improved.

Description

Technical Field

[0001] This application belongs to the field of display panel technology, and particularly relates to a display panel, its preparation method, and a display device. Background Technology

[0002] Currently, organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies have become the mainstream display devices due to their advantages such as high image quality, power saving, thin body and wide range of applications. Summary of the Invention

[0003] The purpose of this application is to provide a display panel, a method for manufacturing the same, and a display device.

[0004] A first aspect of this application provides a method for manufacturing a display panel, comprising: constructing a substrate; constructing an isolation structure on the substrate; the isolation structure enclosing a plurality of pixel openings, the isolation structure including a first isolation portion, a second isolation portion, and a third isolation portion stacked sequentially along a direction away from the substrate, the surface roughness of the second isolation portion being greater than the surface roughness of the first isolation portion; the orthographic projections of the first isolation portion and the second isolation portion on the substrate being located within the orthographic projection of the third isolation portion on the substrate; constructing a light-emitting unit and an encapsulation structure sequentially; the light-emitting unit being at least partially located within the pixel openings, the encapsulation structure at least covering the surface of the light-emitting unit and the surfaces of the first isolation portion, the second isolation portion, and the third isolation portion facing the pixel openings.

[0005] In one embodiment, constructing the isolation structure on the substrate includes: sequentially forming a first isolation material layer, a second isolation material layer, and a third isolation material layer on the substrate; and etching the first isolation material layer, the second isolation material layer, and the third isolation material layer with a preset pattern to form the isolation structure.

[0006] In one embodiment, etching the first isolation material layer, the second isolation material layer, and the third isolation material layer with a preset pattern to form the isolation structure includes: depositing a photoresist layer on the surface of the third isolation material layer away from the substrate; exposing and developing the photoresist layer to form an etch barrier portion corresponding to the isolation structure; and etching the first isolation material layer, the second isolation material layer, and the third isolation material layer to form the isolation structure. Preferably, etching the first isolation material layer, the second isolation material layer, and the third isolation material layer to form the isolation structure includes: etching at least the third isolation material layer to form the third isolation portion; etching the first isolation material layer and the second isolation material layer to form a first isolation preparation portion and a second isolation preparation portion; and etching the sidewalls of the first isolation preparation portion and the second isolation preparation portion to form the first isolation portion and the second isolation portion, exposing a portion of the surface of the third isolation portion near the substrate.

[0007] In one embodiment, constructing the isolation structure on the substrate includes: sequentially forming a first isolation material layer, a second isolation material layer, a third isolation material layer, a planarization layer, and a hardening layer on the substrate; and etching the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer with a preset pattern to form the isolation structure.

[0008] In one embodiment, etching the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer with a preset pattern to form the isolation structure includes: depositing a photoresist layer on the surface of the hardening layer away from the substrate; exposing and developing the photoresist layer to form an etching barrier portion corresponding to the isolation structure; and etching the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer to form the isolation structure. Preferably, etching the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer to form the isolation structure includes: etching at least the hardening layer, the planarization layer, and the third isolation material layer to form a hardened portion, a planarization portion, and the third isolation portion; etching the first isolation material layer and the second isolation material layer to form a first isolation preparation portion and a second isolation preparation portion; and etching the sidewalls of the first isolation preparation portion and the second isolation preparation portion to form a first isolation portion and a second isolation portion, exposing a portion of the surface of the third isolation portion near the substrate.

[0009] In one embodiment, the step of sequentially forming a first isolation material layer, a second isolation material layer, a third isolation material layer, a planarization layer, and a hardening layer on the substrate includes: preparing a planarization layer material on the side of the third isolation material layer away from the substrate, and then heating and curing it to form a planarization layer.

[0010] A second aspect of this application provides a display panel, comprising: a substrate; an isolation structure disposed on the substrate and enclosing a plurality of pixel openings, the isolation structure including a first isolation portion, a second isolation portion, and a third isolation portion along a direction away from the substrate, the surface roughness of the second isolation portion being greater than the surface roughness of the first isolation portion; the orthographic projections of the first isolation portion and the second isolation portion on the substrate being located within the orthographic projection of the third isolation portion on the substrate; a light-emitting unit, the light-emitting unit being at least partially located within the pixel openings; and an encapsulation structure, the encapsulation structure at least covering the surface of the light-emitting unit and the surfaces of the first isolation portion, the second isolation portion, and the third isolation portion facing the pixel openings.

[0011] In one embodiment, the material of the second isolation portion includes molybdenum, the material of the first isolation portion includes aluminum, and the material of the third isolation portion includes titanium.

[0012] In one embodiment, the isolation structure further includes a fourth isolation portion, which is disposed between the substrate and the first isolation portion, and the orthographic projection of the fourth isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0013] In one embodiment, the isolation structure further includes: a flat portion covering the surface of the third isolation portion away from the substrate; and a hardened portion covering the surface of the flat portion away from the substrate. Preferably, the material of the flat portion includes photosensitive polyimide. Preferably, the material of the hardened portion includes at least one of silicon oxide, silicon nitride, and silicon oxynitride. Preferably, the material of the hardened portion includes silicon oxide.

[0014] In one embodiment, the encapsulation structure at least covers the surface of the light-emitting unit, the first isolation portion, the second isolation portion, the third isolation portion, the flat portion, and the surface of the hardened portion facing the pixel opening, as well as the surface of the hardened portion away from the substrate.

[0015] A third aspect of the application provides a display device, including a display panel as described above, or a display panel prepared by the preparation method described above.

[0016] The beneficial effects of this application embodiment compared with the prior art are: by constructing a third isolation part on the second isolation part, the side of the third isolation part that contacts the second isolation part can have the same surface roughness as the surface of the second isolation part. When the surface of the third isolation part with a partially rough surface is exposed, the encapsulation structure and the third isolation part will have a higher adhesion force, reducing the probability of the encapsulation structure falling off, improving the problem of pixel dark spots, and improving the yield of the display panel. Attached Figure Description

[0017] Figure 1 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0018] Figure 2 This is a cross-sectional schematic diagram of an isolation structure provided in an embodiment of this application;

[0019] Figure 3 A cross-sectional schematic diagram of a display panel provided in an embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the device cross-section after execution step S210, provided in an embodiment of this application.

[0021] Figure 5 This is a schematic diagram of the device cross-section after execution steps S230 to S240, provided in an embodiment of this application.

[0022] Figure 6 Another cross-sectional schematic diagram of a display panel provided in an embodiment of this application;

[0023] Figure 7 This is a schematic diagram of a display device provided in an embodiment of this application.

[0024] Explanation of reference numerals in the drawings: 10, display device; 20, display panel; 100, substrate; 200, isolation structure; 210, first isolation portion; 220, second isolation portion; 230, third isolation portion; 240, planar portion; 250, hardened portion; 260, fourth isolation portion; 300, pixel opening; 400, light-emitting unit; 500, encapsulation structure; 610, first isolation material layer; 620, second isolation material layer; 630, third isolation material layer. Detailed Implementation

[0025] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] In the field of display panel technology, display panels are typically manufactured by using chemical vapor deposition (CVD) technology at the end to deposit an insulating film on the surface of the finished product as an encapsulation structure, thereby fixing and protecting the structure of the display panel.

[0030] However, for some structures, such as metal structures constructed by physical vapor deposition (PVD), the surface of the PVD encapsulation structure is usually relatively smooth, and the adhesion between the encapsulation structure and the metal structure is low. This makes it easy for the encapsulation structure to separate from the metal structure, which may lead to the display panel being invaded by chemicals, causing the metal structure to be corroded, and ultimately affecting the display effect of the display panel.

[0031] Figure 1 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application is shown. For ease of explanation, only the parts relevant to this embodiment are shown, and are described in detail below:

[0032] The preparation method includes steps S100 to S300.

[0033] Step S100: Construct a substrate.

[0034] Step S200: Construct an isolation structure on the substrate.

[0035] like Figure 2 As shown, the isolation structure 200 encloses and forms a plurality of pixel openings 300. The isolation structure 200 includes a first isolation portion 210, a second isolation portion 220, and a third isolation portion 230 stacked sequentially along the direction away from the substrate 100. The surface roughness of the second isolation portion 220 is greater than that of the first isolation portion 210. The orthographic projections of the first isolation portion 210 and the second isolation portion 220 on the substrate 100 are both located within the orthographic projection of the third isolation portion 230 on the substrate 100, and the areas of the orthographic projections of the first isolation portion 210 and the second isolation portion 220 on the substrate 100 are both smaller than the area of ​​the orthographic projection of the third isolation portion 230 on the substrate.

[0036] It is understandable that, since the second isolation portion 220 has a high surface roughness, by constructing a third isolation portion 230 on the second isolation portion 220, the contact surface between the third isolation portion 230 and the second isolation portion 220 can also have the same surface roughness as the second isolation portion 220. The surface roughening of the second isolation portion 220 can be achieved using the material properties of the second isolation portion 220 itself, or it can be achieved through post-processing of the second isolation portion 220; this embodiment does not limit the scope of the application.

[0037] like Figure 2 As shown, by making the orthographic projections of the first isolation portion 210 and the second isolation portion 220 on the substrate 100 both located within the orthographic projection of the third isolation portion 230 on the substrate 100, and by making the orthographic projections of the first isolation portion 210 and the second isolation portion 220 on the substrate 100 smaller than the orthographic projection of the third isolation portion 230 on the substrate 100, the first isolation portion 210, the second isolation portion 220 and the third isolation portion 230 form a stepped structure, thereby strengthening the isolation between the pixel openings 300.

[0038] Step S300: Construct the light-emitting unit and the encapsulation structure in sequence.

[0039] like Figure 3 As shown, the light-emitting unit 400 is at least partially located within the pixel opening 300, and the encapsulation structure 500 at least covers the surface of the light-emitting unit 400 and the surfaces of the first isolation portion 210, the second isolation portion 220 and the third isolation portion 230 facing the pixel opening 300.

[0040] It is understood that at least one light-emitting unit 400 can be provided within each pixel opening 300, and light-emitting units 400 of different colors can be provided in different pixel openings 300. The light-emitting unit 400 can be connected to the electrode on the substrate 100 or can be connected to the isolation structure 200. The embodiments of this application do not limit the specific structure of the light-emitting unit 400. The composition, preparation, etc. of the light-emitting unit 400 are further described in patents 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A for reference.

[0041] By constructing a third isolation portion 230 on the second isolation portion 220, which has a higher surface roughness, the surface roughness of the side of the third isolation portion 230 that contacts the second isolation portion 220 can be increased. With the exposed portion of the third isolation portion 230 having a higher surface roughness, there will be stronger adhesion between the encapsulation structure 500 and the third isolation portion 230, reducing the probability of the encapsulation structure 500 detaching and reducing the risk of corrosion of the first isolation portion 210 and the substrate 100. This can prevent the corrosion of circuits corresponding to certain light-emitting units 400, which could lead to pixel dark spots on the display panel, thus improving the yield rate of the display panel. It should be noted that, based on current technology, there is usually a certain gap between the encapsulation structure 500 and the surface of the third isolation portion 230 furthest from the substrate 100. Some liquid may remain in this gap. By strengthening the adhesion between the encapsulation structure 500 and the third isolation portion 230, the residual liquid can be prevented from corroding the first isolation portion 210 and the substrate 100.

[0042] In some embodiments, substrate 100 may be a substrate within which the desired circuit structure can be constructed. The substrate may be a glass substrate. In some embodiments, the substrate may include organic resin materials such as epoxy resin, silicone resin, or polyimide. For example, the substrate may be an FR4 type printed circuit board (PCB) or a flexible PCB that is easily deformable. In some embodiments, the substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or may include metals or metal compounds. For example, the substrate may be a metal core printed circuit board (MCPCB) or a metal copper clad laminate (MCCL).

[0043] In one embodiment, step S200 specifically includes steps S210 to S220.

[0044] Step S210: A first isolation material layer, a second isolation material layer and a third isolation material layer are sequentially formed on the substrate.

[0045] The structure after step S210 is as follows Figure 4 As shown, the first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630 are sequentially stacked on the substrate 100. The specific fabrication process of the first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630 can be selected according to the specific materials of the first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630. For example, when the materials of the first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630 are metals, the first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630 can be constructed by physical vapor deposition.

[0046] Step S220: Etch the first isolation material layer, the second isolation material layer and the third isolation material layer with a preset pattern to form an isolation structure.

[0047] The structure after step S220 is as follows Figure 2 As shown, it can be understood that a suitable preset pattern can be determined according to the requirements for the pixel opening 300. After etching away part of the first isolation material layer 610, the second isolation material layer 620 and the third isolation material layer 630 until the substrate 100 is exposed, the opening formed by etching is the pixel opening 300, and the remaining first isolation material layer 610, second isolation material layer 620 and third isolation material layer 630 become the isolation structure 200.

[0048] In one embodiment, step S220 specifically includes steps S221 to S223.

[0049] Step S221: A photoresist layer is deposited on the surface of the third isolation material layer away from the substrate.

[0050] Step S222: Expose and develop the photoresist layer to form an etch barrier corresponding to the isolation structure.

[0051] Step S223: Etch the first isolation material layer, the second isolation material layer and the third isolation material layer to form an isolation structure.

[0052] The first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630 can be photolithographically formed through steps S221 to S223, thus completing the construction of the isolation structure 200. It is understood that after forming the isolation structure 200, the remaining photoresist layer needs to be removed.

[0053] In some embodiments, step S223 specifically includes steps S2231 to S2233.

[0054] Step S2231: At least the third isolation material layer is etched to form the third isolation portion;

[0055] Step S2232: Etch the first isolation material layer and the second isolation material layer to form the first isolation preparation area and the second isolation preparation area;

[0056] Step S2233: Etch the sidewalls of the first isolation preparation part and the second isolation preparation part to form the first isolation part and the second isolation part, and expose the surface of the third isolation part near the substrate.

[0057] It is understood that through steps S2231 to S2233, the orthographic projections of the first isolation portion 210 and the second isolation portion 220 on the substrate 100 are both located within the orthographic projection of the third isolation portion 230 on the substrate 100, and the areas of the orthographic projections of the first isolation portion 210 and the second isolation portion 220 on the substrate 100 are both smaller than the area of ​​the orthographic projection of the third isolation portion 230 on the substrate 100. This ensures that the shape and size of the isolation structure 200 meet actual requirements.

[0058] In one embodiment, step S200 specifically includes steps S230 to S240.

[0059] Step S230: A first isolation material layer, a second isolation material layer, a third isolation material layer, a planarization layer, and a hardening layer are sequentially formed on the substrate.

[0060] Step S240: Etch the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer and the hardening layer with a preset pattern to form an isolation structure.

[0061] After performing steps S230 to S240, the isolation structure 200 is as follows: Figure 5 As shown, the specific preparation processes of the first isolation material layer 610, the second isolation material layer 620, the third isolation material layer 630, the planarization layer, and the hardening layer can be selected according to the specific materials of the first isolation material layer 610, the second isolation material layer 620, the third isolation material layer 630, the planarization layer, and the hardening layer.

[0062] For example, the planarization layer can be constructed by coating, and the hardening layer can be deposited by CVD.

[0063] In one embodiment, step S240 specifically includes steps S241 to S243.

[0064] Step S241: Deposit a photoresist layer on the surface of the hardened layer away from the substrate.

[0065] Step S242: Expose and develop the photoresist layer to form an etch barrier corresponding to the isolation structure.

[0066] Step S243: Etch the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer and the hardening layer to form an isolation structure.

[0067] In some embodiments, step S243 specifically includes steps S2431 to S2433.

[0068] Step S2431: At least the hardened layer, the planarization layer, and the third isolation material layer are etched to form the hardened portion, the planarization portion, and the third isolation portion.

[0069] Step S2431: Etch the first isolation material layer and the second isolation material layer to form the first isolation preparation part and the second isolation preparation part.

[0070] Step S2431: Etch the sidewalls of the first isolation preparation portion and the second isolation preparation portion to form the first isolation portion and the second isolation portion, and expose the portion of the third isolation portion near the substrate.

[0071] It should be noted that steps S230 to S240 can replace steps S210 to S220. After etching in step S223, the edge of the third isolation portion 230 will lack the support and fixation of the first isolation portion 210 and the second isolation portion 220, making the edge of the third isolation portion 230 prone to bending. Especially for the third isolation portion 230 constructed by physical vapor deposition, it inherently has an upward stress. Therefore, constructing the flat portion 240 and the hardened portion 250 through steps S230 to S240 can improve the impact resistance of the third isolation portion 230 and prevent deformation. Based on the current process, there is usually a certain gap between the packaging structure 500 and the surface of the hardened portion 250 away from the substrate 100. Some liquid may remain in the gap. By strengthening the adhesion between the packaging structure 500 and the third isolation portion 230, the residual liquid can be prevented from corroding the first isolation portion 210 and the substrate 100.

[0072] In one embodiment, step S230 specifically includes steps S231 to S233.

[0073] Step S231: A first isolation material layer, a second isolation material layer, and a third isolation material layer are sequentially formed on the substrate.

[0074] Step S232: Prepare a planarization layer material on the side of the third isolation material layer away from the substrate, and cure it by high temperature to form a planarization layer.

[0075] Step S233: Prepare a hardened layer on the side of the planarization layer away from the substrate.

[0076] It should be noted that when the materials of the first isolation material layer 610, the second isolation material layer 620, and the third isolation material layer 630 are different, wet etching technology can be used to sequentially etch the sidewalls of the first isolation preparation portion and the second isolation preparation portion, so that the width of the first isolation portion 210 and the second isolation portion 220 is smaller than that of the third isolation portion 230, thereby exposing the surface of the third isolation portion 230 near the substrate 100.

[0077] Figure 3 A schematic diagram of a display panel according to an embodiment of this application is shown. For ease of explanation, only the parts relevant to this embodiment are shown, and the details are as follows:

[0078] The display panel includes: a substrate 100, an isolation structure 200, a light-emitting unit 400, and an encapsulation structure 500.

[0079] An isolation structure 200 is disposed on the substrate 100 and encloses a plurality of pixel openings 300. The isolation structure 200 includes a first isolation portion 210, a second isolation portion 220, and a third isolation portion 230 stacked sequentially along a direction away from the substrate 100. The surface roughness of the second isolation portion 220 is greater than that of the first isolation portion 210. The orthographic projections of the first isolation portion 210 and the second isolation portion 220 onto the substrate 100 are both located within the orthographic projection of the third isolation portion 230 onto the substrate 100, and the areas of the orthographic projections of the first isolation portion 210 and the second isolation portion 220 onto the substrate 100 are both smaller than the area of ​​the orthographic projection of the third isolation portion 230 onto the substrate 100. The light-emitting unit 400 is at least partially located within the pixel openings 300. The encapsulation structure 500 at least covers the surface of the light-emitting unit 400 and the surfaces of the first isolation portion 210, the second isolation portion 220, and the third isolation portion 230 facing the pixel openings 300.

[0080] The display panel of this embodiment can be manufactured using the preparation method of any of the above embodiments.

[0081] By constructing a third isolation portion 230 on the roughened second isolation portion 220, the side of the first isolation portion 210 that contacts the second isolation portion 220 can also become rough. When the sidewall of the second isolation portion 220 is etched, part of the roughened surface of the first isolation portion 210 will be exposed. When the constructed encapsulation structure 500 is adhered to the first isolation portion 210, it will have a higher adhesion force and reduce the probability of the encapsulation structure 500 falling off.

[0082] In one embodiment, the material of the second isolation portion 220 includes molybdenum, the material of the first isolation portion 210 includes aluminum, and the material of the third isolation portion 230 includes titanium.

[0083] Understandably, due to the properties of molybdenum itself, even when physical vapor deposition is used, the surface roughness of the second isolation portion 220 formed by molybdenum is relatively high at the microscopic level. Therefore, the surface roughness of the contact surface between the third isolation portion 230 and the second isolation portion 220 is also relatively high. This will result in a stronger adhesion between the encapsulation structure 500 and the third isolation portion 230, reducing the probability of separation between the encapsulation structure 500 and the isolation structure 200.

[0084] Titanium has strong corrosion resistance, while aluminum has weak corrosion resistance. By strengthening the adhesion between the encapsulation structure 500 and the third isolation part 230, corrosive substances can be prevented from invading the first isolation part 210 through the gap between the encapsulation structure 500 and the third isolation part 230, thereby reducing the risk of corrosion of the first isolation part 210 and related circuit structures.

[0085] In one embodiment, such as Figure 5 As shown, the isolation structure 200 also includes a fourth isolation portion 260, which is disposed between the substrate 100 and the first isolation portion 210. The orthographic projection of the fourth isolation portion 260 on the substrate 100 is located within the orthographic projection of the third isolation portion 230 on the substrate 100. The fourth isolation portion 260 is used to adhere the first isolation portion 210 and the substrate 100.

[0086] It should be noted that during the manufacturing process of the display panel, operations such as rinsing are required, which will cause a certain impact on the isolation structure 200. Therefore, when the material of the first isolation part 210 is aluminum, in order to strengthen the adhesion between the isolation structure 200 and the substrate 100, the first isolation part 210 and the substrate 100 can be bonded by the fourth isolation part 260, thereby improving the structural strength of the display panel. The material of the fourth isolation part 260 may include molybdenum.

[0087] In one embodiment, such as Figure 6 As shown, the isolation structure 200 also includes a flat portion 240 and a hardened portion 250. The flat portion 240 covers the surface of the third isolation portion 230 that is away from the substrate 100. The hardened portion 250 covers the surface of the flat portion 240 that is away from the substrate 100.

[0088] Specifically, the material of the flat portion 240 may include photosensitive polyimide, and the material of the hardened portion 250 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride, with the appropriate material selected according to actual needs. Preferably, the material of the hardened portion 250 may be silicon oxide.

[0089] It should be noted that the third isolation portion 230 of physical vapor deposition will generate a stress toward the hardened portion 250, and the hardened portion 250 will generate a stress toward the third isolation portion 230. The two stresses cancel each other out, which can reduce the probability of deformation of the third isolation portion 230.

[0090] In one embodiment, such as Figure 6 As shown, the encapsulation structure 500 at least covers the surface of the light-emitting unit 400 and the surfaces of the first isolation portion 210, the second isolation portion 220, the third isolation portion 230, the flat portion 240 and the hardened portion 250 facing the pixel opening 300 and the surface of the hardened portion 250 away from the substrate 100.

[0091] By encapsulating the isolation structure 200 with the encapsulation structure 500, the probability of the encapsulation structure 500 falling off can be reduced, and the protection capability of the isolation structure 200 can be improved.

[0092] Figure 7 A schematic diagram of a display device according to an embodiment of this application is shown. For ease of explanation, only the parts relevant to this embodiment are shown, and the details are as follows:

[0093] The display device 10 includes a display panel 20 as described in any of the above embodiments. Since the display device 10 includes the display panel 20 of any of the above embodiments, the display device 10 has the beneficial effects of the display panel 20 of any of the above embodiments, which will not be described again here.

[0094] The display device 10 in this application embodiment includes, but is not limited to, mobile phones, tablets, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0095] In one embodiment, unlike the embodiments described above, the display device 10 includes a display panel prepared as described in any of the embodiments above.

[0096] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0097] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0098] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Constructing a substrate; An isolation structure is constructed on the substrate; The isolation structure encloses and forms multiple pixel openings. The isolation structure includes a first isolation portion, a second isolation portion, and a third isolation portion stacked sequentially along the direction away from the substrate. The surface roughness of the second isolation portion is greater than that of the first isolation portion. The orthographic projections of the first isolation portion and the second isolation portion on the substrate are both located within the orthographic projection of the third isolation portion on the substrate. A light-emitting unit and an encapsulation structure are constructed sequentially; the light-emitting unit is at least partially located within the pixel opening, and the encapsulation structure at least covers the surface of the light-emitting unit and the surfaces of the first isolation portion, the second isolation portion, and the third isolation portion facing the pixel opening.

2. The preparation method according to claim 1, characterized in that, The method of constructing an isolation structure on the substrate includes: A first isolation material layer, a second isolation material layer, and a third isolation material layer are sequentially formed on the substrate; The first isolation material layer, the second isolation material layer, and the third isolation material layer are etched with a preset pattern to form the isolation structure.

3. The preparation method according to claim 2, characterized in that, The step of etching the first isolation material layer, the second isolation material layer, and the third isolation material layer with a preset pattern to form the isolation structure includes: A photoresist layer is disposed on the surface of the third isolation material layer away from the substrate; The photoresist layer is exposed and developed to form an etch barrier corresponding to the isolation structure; The first isolation material layer, the second isolation material layer, and the third isolation material layer are etched to form the isolation structure; Preferably, etching the first isolation material layer, the second isolation material layer, and the third isolation material layer to form the isolation structure includes: At least the third isolation material layer is etched to form the third isolation portion; The first isolation material layer and the second isolation material layer are etched to form the first isolation preparation part and the second isolation preparation part; The sidewalls of the first isolation preparation portion and the second isolation preparation portion are etched to form the first isolation portion and the second isolation portion, and the surface of the third isolation portion near the substrate is exposed.

4. The preparation method according to claim 1, characterized in that, The method of constructing an isolation structure on the substrate includes: A first isolation material layer, a second isolation material layer, a third isolation material layer, a planarization layer, and a hardening layer are sequentially formed on the substrate; The isolation structure is formed by etching the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer with a preset pattern.

5. The preparation method according to claim 4, characterized in that, The step of etching the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer with a preset pattern to form the isolation structure includes: A photoresist layer is formed on the surface of the hardened layer away from the substrate; The photoresist layer is exposed and developed to form an etch barrier corresponding to the isolation structure; The first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer are etched to form the isolation structure; Preferably, the etching of the first isolation material layer, the second isolation material layer, the third isolation material layer, the planarization layer, and the hardening layer to form the isolation structure includes, At least the hardened layer, the planarization layer, and the third isolation material layer are etched to form the hardened portion, the planarization portion, and the third isolation portion; The first isolation material layer and the second isolation material layer are etched to form the first isolation preparation part and the second isolation preparation part; The sidewalls of the first isolation preparation portion and the second isolation preparation portion are etched to form the first isolation portion and the second isolation portion, and the surface of the third isolation portion near the substrate is exposed.

6. The preparation method according to any one of claims 4 to 5, characterized in that, The step of sequentially forming a first isolation material layer, a second isolation material layer, a third isolation material layer, a planarization layer, and a hardening layer on the substrate includes: A planarization layer material is prepared on the side of the third isolation material layer away from the substrate, and then cured by heating to form a planarization layer.

7. A display panel, characterized in that, include: substrate; An isolation structure is disposed on the substrate and surrounds to form a plurality of pixel openings. The isolation structure includes a first isolation portion, a second isolation portion, and a third isolation portion along a direction away from the substrate. The surface roughness of the second isolation portion is greater than that of the first isolation portion. The orthographic projections of the first isolation portion and the second isolation portion on the substrate are both located within the orthographic projection of the third isolation portion on the substrate. A light-emitting unit, wherein the light-emitting unit is at least partially located within the pixel opening; The encapsulation structure at least covers the surface of the light-emitting unit and the surfaces of the first isolation portion, the second isolation portion, and the third isolation portion facing the pixel opening.

8. The display panel as described in claim 7, characterized in that, The material of the second isolation portion includes molybdenum, the material of the first isolation portion includes aluminum, and the material of the third isolation portion includes titanium.

9. The display panel as described in claim 8, characterized in that, The isolation structure further includes a fourth isolation portion, which is disposed between the substrate and the first isolation portion, and the orthographic projection of the fourth isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

10. The display panel according to any one of claims 7 to 9, characterized in that, The isolation structure also includes: A flat portion, the flat portion covering the surface of the third isolation portion away from the substrate; A hardened portion that covers the surface of the flat portion away from the substrate; Preferably, the material of the flat portion includes photosensitive polyimide; Preferably, the material of the hardened portion includes at least one of silicon oxide, silicon nitride, and silicon oxynitride; Preferably, the material of the hardened portion includes silicon oxide.

11. The display panel as claimed in claim 10, characterized in that, The encapsulation structure at least covers the surface of the light-emitting unit, as well as the surfaces of the first isolation portion, the second isolation portion, the third isolation portion, the flat portion, and the hardened portion facing the pixel opening, and the surface of the hardened portion away from the substrate.

12. A display device, characterized in that, It includes the display panel as described in any one of claims 7 to 11, or the display panel prepared by the preparation method as described in any one of claims 1 to 6.

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