A method and system for detecting the performance of an optoelectronic information conversion component

Abstract

The present invention relates to the technical field of quality inspection, and specifically discloses a method and system for detecting the performance of an optoelectronic information conversion component. An LED chip welding image is acquired, and the acquired LED chip welding image is preprocessed. Feature extraction is performed on the preprocessed LED chip welding image to obtain LED chip welding feature data. By performing data processing on the abnormal ratio of weld seam spacing units and the abnormal ratio of the LED chip welding area, a quality characterization value of the LED chip welding is obtained; according to the quality characterization value of the LED chip welding, the overall quality state of the LED chip welding is identified to obtain an LED chip welding quality state level signal. The present invention completes the identification of the LED chip welding quality according to the number of quality abnormalities of a single weld seam spacing subunit of the LED chip welding and the difference in the monomer spacing line values of multiple weld seam spacing subunits on the whole of the LED chip welding, and has high accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of quality inspection, and specifically relates to a method and system for detecting the performance of an optoelectronic information conversion component. Background Art

[0002] The welding of an LED chip to a substrate is a core process for balancing electrical performance, thermal management, and mechanical reliability. The electrodes (P / N poles) of the LED chip need to be connected to the substrate circuit through a conductive material to form a complete current path.

[0003] If there are welding defects in the welding of the LED chip to the substrate, it will lead to accelerated light decay, color drift, and even sudden failure.

[0004] In the prior art for the welding quality inspection of an LED chip to a substrate, most of them only separately process the size and appearance defects of the welding of the LED chip to the substrate, lacking the integration of the influencing factors for the welding quality of the LED chip to the substrate, and having great limitations. Summary of the Invention

[0005] The purpose of the present invention is to provide a method and system for detecting the performance of an optoelectronic information conversion component. By extracting features from the LED chip welding image to obtain LED chip welding feature data, and processing the obtained abnormal ratio of weld pitch units and abnormal ratio of the LED chip welding area to obtain a quality characterization value of the LED chip welding, that is, based on the number of quality anomalies of individual weld pitch sub-units of the LED chip welding and the difference in the single pitch line values of multiple weld pitch sub-units on the whole of the LED chip welding, the welding quality identification of the LED chip is completed to solve the problems in the above background.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A method for detecting the performance of an optoelectronic information conversion component includes the following steps:

[0008] Obtain an LED chip welding image, preprocess the collected LED chip welding image, and extract features from the preprocessed LED chip welding image to obtain LED chip welding feature data;

[0009] Among them, the LED chip welding feature data includes the abnormal ratio of weld pitch units and the abnormal ratio of the LED chip welding area;

[0010] By processing the abnormal ratio of weld pitch units and the abnormal ratio of the LED chip welding area, a quality characterization value of the LED chip welding is obtained;

[0011] Identify the overall welding quality status of the LED chip based on the quality characterization value of the LED chip welding, and obtain the LED chip welding quality status level signal;

[0012] Among them, the LED chip welding quality status signal includes the LED chip welding quality good signal, the LED chip welding quality general signal, and the LED chip welding quality poor signal;

[0013] And based on the quality characterization value of the LED chip welding, conduct spot checks on the LED chip welding to complete the evaluation of the LED chip welding processing trend.

[0014] As a further solution of the present invention: the LED chip welding characteristic data includes the abnormal ratio of the weld spacing unit and the abnormal ratio of the LED chip welding area;

[0015] Record the abnormal ratio of the weld spacing unit as Fi;

[0016] Record the abnormal ratio of the LED chip welding area as Di;

[0017] Through the formula Calculate the quality characterization value DF of the LED chip welding, where df is the abnormal value of the weld surface of the LED chip welding.

[0018] As a further solution of the present invention: preset the limit values of the quality characterization value of the LED chip welding as DF1 and DF2, where DF1 < DF2;

[0019] When DF < DF1, it means that the overall welding quality status of the LED chip is good, and obtain the LED chip welding quality good signal;

[0020] When DF1 ≤ DF < DF2, it means that the overall welding quality status of the LED chip is general, and obtain the LED chip welding quality general signal;

[0021] When DF ≥ DF2, it means that the overall welding quality status of the LED chip is poor, and obtain the LED chip welding quality poor signal.

[0022] As a further solution of the present invention: the process of obtaining the abnormal ratio of the weld spacing unit is as follows:

[0023] Record the area between two adjacent welds and the formed spacing in the LED chip welding image as the weld spacing sub-unit;

[0024] Obtain the weld spacing in the weld spacing sub-unit, and divide the weld spacing along the length direction into several weld spacing monomers;

[0025] Integrate the monomer spacing values of all weld spacing monomers to obtain a monomer spacing value group, and obtain the variance of the monomer spacing value group;

[0026] Based on the variance of the monomer spacing value group, complete the identification of non-standard weld spacing sub-units and calibrated weld spacing sub-units;

[0027] Calculate the ratio of the number of non-standard weld spacing sub-units to the total number of weld spacing sub-units to obtain the weld spacing unit anomaly ratio.

[0028] As a further solution of the present invention: the identification process of non-standard weld spacing sub-units and calibrated weld spacing sub-units is as follows:

[0029] If the variance value of the weld spacing monomer is greater than or equal to the variance threshold of the weld spacing monomer, the weld spacing sub-unit is recorded as a non-standard weld spacing sub-unit;

[0030] If the variance value of the weld spacing monomer is less than the variance threshold of the weld spacing monomer, the weld spacing sub-unit is recorded as a calibrated weld spacing sub-unit.

[0031] As a further solution of the present invention: the process of obtaining the anomaly ratio of the LED chip welding area is as follows:

[0032] Process the monomer spacing value group according to the mean calculation method to obtain the monomer spacing mean value, and record it as the monomer spacing line value;

[0033] Integrate the monomer spacing line values corresponding to each weld spacing sub-unit to obtain a monomer spacing line value group;

[0034] Obtain the standard deviation and the monomer spacing line amplitude of the monomer spacing line value group;

[0035] Record the standard deviation of the monomer spacing line value group as D1;

[0036] Record the monomer spacing line amplitude as D2;

[0037] Through the formula Calculate to obtain the LED chip welding area anomaly ratio Di, where d1 and d2 are both preset proportionality factors.

[0038] As a further solution of the present invention: the process of obtaining the monomer spacing line amplitude is as follows:

[0039] Obtain the maximum value in the monomer spacing line value group and mark it as Dmax;

[0040] Obtain the minimum value in the monomer spacing line value group and mark it as Dmin;

[0041] Use the formula D2 = (Dmax - Dmin) / Dmin to calculate and obtain the monomer spacing line amplitude D2.

[0042] As a further solution of the present invention: The process of obtaining the surface anomaly value of the weld of the LED chip is as follows:

[0043] Obtain the weld spacing sub-unit, and obtain all the weld planes that need to be subjected to quality inspection within the weld spacing sub-unit;

[0044] Obtain the weld direction deviation value of the LED chip, and denote it as Nj;

[0045] Obtain the weld finish value of the LED chip, and denote it as Mj;

[0046] Through the formula Obtain the surface anomaly value df of the weld of the LED chip, where is the monomer spacing deviation ratio.

[0047] As a further solution of the present invention: The process of obtaining the monomer spacing deviation ratio is as follows:

[0048] Obtain and integrate the monomer spacing line values of all non-standard weld spacing sub-units to obtain a non-standard weld spacing sub-unit group;

[0049] Process the non-standard weld spacing sub-unit group to obtain the monomer spacing line values of the non-standard weld spacing sub-unit group;

[0050] Obtain and integrate the monomer spacing line values of all calibrated weld spacing sub-units to obtain a calibrated weld spacing sub-unit group;

[0051] Process the calibrated weld spacing sub-unit group to obtain the monomer spacing line values of the calibrated weld spacing sub-unit group;

[0052] Perform a difference calculation on the monomer spacing line values of the non-standard weld spacing sub-unit group and the monomer spacing line values of the calibrated weld spacing sub-unit group, and take the absolute value of the obtained difference to obtain the monomer spacing deviation value;

[0053] Perform a ratio calculation on the monomer spacing deviation value and the monomer spacing line values of the calibrated weld spacing sub-unit group to obtain the monomer spacing deviation ratio.

[0054] As a further solution of the present invention: An optoelectronic information conversion component performance detection system includes:

[0055] A feature recognition module, which is used to obtain the LED chip welding image, preprocess the collected LED chip welding image, and extract features from the preprocessed LED chip welding image to obtain LED chip welding feature data;

[0056] Among them, the LED chip welding feature data includes the weld spacing unit anomaly ratio and the LED chip welding area anomaly ratio;

[0057] A quality characterization module, which is used to process data on the abnormal ratio of weld spacing units and the abnormal ratio of the LED chip welding area to obtain a quality characterization value for LED chip welding;

[0058] A grade analysis module, which is used to identify the overall quality state of LED chip welding based on the quality characterization value of LED chip welding to obtain a grade signal for the quality state of LED chip welding;

[0059] Among them, the LED chip welding quality state signal includes a good signal for the quality state of LED chip welding, a general signal for the quality state of LED chip welding, and a poor signal for the quality state of LED chip welding;

[0060] A processing prediction module, which conducts spot checks on LED chip welding based on the quality characterization value of LED chip welding to complete the assessment of the processing trend of LED chip welding.

[0061] Advantages of the present invention:

[0062] In the present invention, by extracting features from the LED chip welding image, LED chip welding feature data is obtained, and based on the processed abnormal ratio of weld spacing units and the abnormal ratio of the LED chip welding area, a quality characterization value for LED chip welding is obtained, that is, according to the number of quality abnormalities of individual weld spacing sub-units in LED chip welding and the differences in the individual spacing line values of multiple weld spacing sub-units in the overall LED chip welding, the quality identification of LED chip welding is completed with high accuracy;

[0063] In the identification of the quality of LED chip welding in the present invention, in addition to processing the individual spacing values corresponding to the weld spacing sub-units, the weld plane of the weld spacing sub-units is also detected and processed, that is, by processing the defect points on the weld surface, the weld surface finish value, and the individual spacing deviation ratio, a weld surface abnormality value for LED chip welding is obtained, and through the weld surface abnormality value, the overall quality of LED chip welding is further identified, and the quality detection of LED chip welding is more comprehensive, that is, through strict process monitoring and reliability testing, the high performance and long life of the LED component are effectively ensured. Description of the drawings

[0064] The following further describes the present invention with reference to the drawings.

[0065] Figure 1 is a flowchart of a method for detecting the performance of an optoelectronic information conversion component according to an embodiment of the present invention;

[0066] Figure 2 is a flowchart for identifying the quality state of LED chip welding in a method for detecting the performance of an optoelectronic information conversion component according to an embodiment of the present invention;

[0067] Figure 3 is the program flowchart of a performance detection system for an optoelectronic information conversion component according to an embodiment of the present invention;

[0068] Figure 4 is the structural schematic diagram of an electronic device of a performance detection system for an optoelectronic information conversion component according to an embodiment of the present invention. Specific embodiments

[0069] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0070] Embodiment 1: Please refer to Figure 1 As shown, the present invention is a method for detecting the performance of an optoelectronic information conversion component, including the following steps:

[0071] Obtain the LED chip welding image, preprocess the collected LED chip welding image, and extract features from the preprocessed LED chip welding image to obtain LED chip welding feature data;

[0072] Among them, the LED chip welding feature data includes the abnormal ratio of weld spacing units and the abnormal ratio of the LED chip welding area;

[0073] By processing the abnormal ratio of weld spacing units and the abnormal ratio of the LED chip welding area, obtain the quality characterization value of LED chip welding;

[0074] Based on the quality characterization value of LED chip welding, identify the overall quality state of LED chip welding to obtain the LED chip welding quality state level signal;

[0075] Among them, the LED chip welding quality state signal includes the LED chip welding quality state good signal, the LED chip welding quality state general signal, and the LED chip welding quality state poor signal;

[0076] And based on the quality characterization value of LED chip welding, conduct spot checks on LED chip welding to complete the evaluation of the LED chip welding processing trend.

[0077] Among them, the acquisition of the LED chip welding image is performed by devices such as cameras or scanners for image acquisition;

[0078] Since the collected LED chip welding images may have problems such as noise and uneven illumination, the preprocessing of LED chip welding images includes filtering, denoising, and enhancing contrast;

[0079] For feature extraction in LED chip welding images, computer vision algorithms are used, including but not limited to edge detection and corner detection.

[0080] Example 2: The LED chip welding feature data includes the abnormal ratio of weld spacing units and the abnormal ratio of the LED chip welding area;

[0081] Among them, the process of obtaining the abnormal ratio of weld spacing units is as follows:

[0082] The area formed by two adjacent welds and the spacing between adjacent welds in the LED chip welding image is denoted as a weld spacing sub-unit;

[0083] Identify multiple weld spacing sub-units in the LED chip welding image. Specifically:

[0084] Obtain the weld spacing in the weld spacing sub-unit, and divide the weld spacing along the length direction into several weld spacing monomers;

[0085] Obtain the monomer spacing value at the middle position of each weld spacing monomer;

[0086] Integrate the monomer spacing values of all weld spacing monomers to obtain a group of monomer spacing values;

[0087] Process the group of monomer spacing values according to the variance calculation method to obtain the variance value of the weld spacing monomers;

[0088] Compare and process the variance value of the weld spacing monomers with the variance threshold of the weld spacing monomers;

[0089] If the variance value of the weld spacing monomers is greater than or equal to the variance threshold of the weld spacing monomers, the weld spacing sub-unit is denoted as a non-standard weld spacing sub-unit;

[0090] If the variance value of the weld spacing monomers is less than the variance threshold of the weld spacing monomers, the weld spacing sub-unit is denoted as a calibrated weld spacing sub-unit;

[0091] Obtain the number of non-standard weld spacing sub-units, calibrated weld spacing sub-units, and the total number of weld spacing sub-units;

[0092] Calculate the ratio of the number of non-standard weld spacing sub-units to the total number of weld spacing sub-units to obtain the abnormal ratio of weld spacing units;

[0093] It should be noted that: under standard conditions, the monomer spacing value (the spacing between adjacent welds) of each weld spacing monomer in the LED chip welding within each weld spacing sub-unit is consistent. However, if the variance of the multiple monomer spacing values in the same weld spacing sub-unit is large, it indicates that the quality of the weld spacing sub-unit is abnormal, which will affect the welding effect of the LED chip welding. That is, the larger the abnormal ratio of the weld spacing unit, the more weld spacing sub-units with abnormal spacing in the LED chip welding image, and the worse the overall quality of the LED chip welding.

[0094] Among them, the process of obtaining the abnormal ratio of the LED chip welding area is as follows:

[0095] Process the monomer spacing value group according to the mean calculation method to obtain the monomer spacing mean value, and record it as the monomer spacing line value;

[0096] Integrate the monomer spacing line values corresponding to each weld spacing sub-unit to obtain a group of monomer spacing line values;

[0097] Calculate the standard deviation of the group of monomer spacing line values according to the standard deviation calculation formula, and record it as D1;

[0098] Obtain the maximum value in the group of monomer spacing line values and mark it as Dmax;

[0099] Obtain the minimum value in the group of monomer spacing line values and mark it as Dmin;

[0100] Calculate the monomer spacing line amplitude D2 using the formula D2 = (Dmax - Dmin) / Dmin;

[0101] Then through the formula Calculate to obtain the abnormal ratio Di of the LED chip welding area, where d1 and d2 are both preset proportional factors.

[0102] It should be noted that: the abnormal ratio of the LED chip welding area is obtained by processing the monomer spacing value group of each weld spacing sub-unit to obtain the monomer spacing line value corresponding to each weld spacing sub-unit, and then performing data processing on the monomer spacing line values of all weld spacing sub-units to identify the spacing state of each weld spacing sub-unit in the LED chip. That is, the larger the abnormal ratio of the LED chip welding area, the greater the spacing deviation of each weld spacing sub-unit in the LED chip, and the worse the quality of the LED chip welding.

[0103] Process the abnormal ratio of the weld spacing unit and the abnormal ratio of the LED chip welding area, and record the abnormal ratio of the weld spacing unit as Fi;

[0104] Through the formula Calculate the quality characterization value DF of the LED chip welding, where df is the weld surface difference value of the LED chip welding;

[0105] It should be noted that: the larger the quality characterization value DF of the LED chip welding, the more the number of abnormal qualities of a single weld pitch sub-unit of the LED chip welding. At the same time, there are large differences in the monomer pitch line values of multiple weld pitch sub-units in the overall LED chip welding, resulting in obvious defects in the LED chip welding structure;

[0106] Refer to Figure 2 , and preset the limit values of the quality characterization value of the LED chip welding as DF1 and DF2, where DF1 < DF2;

[0107] Among them, the limit values DF1 and DF2 of the quality characterization value of the LED chip welding are empirical values, obtained according to experience:

[0108] In the actual obtaining process, there are many groups of weld pitch unit abnormality ratios and LED chip welding area abnormality ratios. Process many groups of weld pitch unit abnormality ratios and LED chip welding area abnormality ratios to obtain the corresponding quality characterization values of the LED chip welding for each group. The staff identify the quality status level of the LED chip welding based on these many groups of quality characterization values of the LED chip welding, thereby obtaining a correspondence between the quality characterization value of the LED chip welding and the quality status level of the LED chip welding. Furthermore, deduce and divide the quality characterization value of the LED chip welding according to the quality status of the LED chip welding of the quality characterization value of the LED chip welding, so as to obtain the limit values DF1 and DF2 of the quality characterization value of the LED chip welding. By comparing the limit values of the quality characterization value of the LED chip welding, the identification of the quality status level of the LED chip welding corresponding to the quality characterization value of the LED chip welding is completed;

[0109] When DF < DF1, it indicates that the overall quality status of the LED chip welding is good, the weld pitch unit abnormality ratio is small and / or the LED chip welding area abnormality ratio is small, and a good signal of the LED chip welding quality status is obtained;

[0110] When DF1 ≤ DF < DF2, it indicates that the overall quality status of the LED chip welding is average, the LED chip welding area abnormality ratio and the LED chip welding area abnormality ratio are moderate, and an average signal of the LED chip welding quality status is obtained;

[0111] When DF ≥ DF2, it indicates that the overall quality status of the LED chip welding is poor, the weld pitch unit abnormality ratio is large and / or the LED chip welding area abnormality ratio is large, and a poor signal of the LED chip welding quality status is obtained;

[0112] It should be noted that by obtaining the quality status level of the LED chip welding, the welding quality of the LED chip can be identified according to the welding quality status signal of the LED chip, which is convenient for the staff to manage the product quality control of the LED chip welding.

[0113] In a specific embodiment, the process of obtaining the abnormal value of the weld seam of the LED chip welding is as follows:

[0114] Obtain the angle between the weld seam direction and the surface of the base material to get the weld deviation angle;

[0115] Calculate the ratio of the weld deviation angle to the preset deviation angle to obtain the weld direction deviation value of the LED chip;

[0116] Among them, the preset deviation angle is 30°.

[0117] Use a deep learning framework to construct a convolutional neural network model;

[0118] Collect a large number of weld seam pictures corresponding to LED chips with different surface finishes, and label the true surface finish values corresponding to each weld seam picture to form a data set, and train the model through the data set;

[0119] Among them, during the training process, by continuously adjusting the parameters of the model, the error between the predicted surface finish value and the true value is minimized;

[0120] Apply the trained model to the weld seam pictures corresponding to the LED chips to obtain the surface finish values corresponding to each weld seam plane;

[0121] Sum and average the surface finish values corresponding to all weld seam planes within the weld seam spacing sub-unit to obtain the weld seam surface finish value of the LED chip;

[0122] Record the weld direction deviation value of the LED chip as Nj, and record the weld seam surface finish value of the LED chip as Mj;

[0123] Through the formula Obtain the abnormal value df of the weld seam of the LED chip welding, where is the monomer spacing deviation ratio.

[0124] Among them, the process of obtaining the monomer spacing deviation ratio is as follows:

[0125] Obtain the monomer spacing line values of all non-standard weld seam spacing sub-units, and record the monomer spacing line values of the non-standard weld seam spacing sub-units as Xi, where i is the number of non-standard weld seam spacing sub-units, i = 1, 2,...., n;

[0126] Integrate the monomer spacing line values of all non-standard weld seam spacing sub-units to obtain a non-standard weld seam spacing sub-unit group;

[0127] According to the formula the standard deviation value Xa of the non-standard weld spacing sub-unit group is calculated, where Xp is the average value of the deviation groups X1, X2, X3,...., Xn;

[0128] If the standard deviation value Xa of the non-standard weld spacing sub-unit group is greater than or equal to the standard deviation preset value Xy, delete the maximum value and / or the minimum value in the data of the non-standard weld spacing sub-unit group, and calculate the standard deviation value Xa of the data of the non-standard weld spacing sub-unit group again until Xa is less than the standard deviation preset value Xy. Then, sum up the remaining data in the non-standard weld spacing sub-unit group and take the average value to obtain the single-spacing line value of the non-standard weld spacing sub-unit group;

[0129] Obtain the single-spacing line values of all calibrated weld spacing sub-units, and denote the single-spacing line value of the calibrated weld spacing sub-unit as Wi, where i is the number of calibrated weld spacing sub-units, and i = 1, 2,...., m;

[0130] Integrate the single-spacing line values of all calibrated weld spacing sub-units to obtain the calibrated weld spacing sub-unit group;

[0131] According to the formula the standard deviation value Wa of the calibrated weld spacing sub-unit group is calculated, where Wp is the average value of the deviation groups W1, W2, W3,...., Wn;

[0132] If the standard deviation value Wa of the calibrated weld spacing sub-unit group is greater than or equal to the standard deviation preset value Wy, delete the maximum value and / or the minimum value in the data of the calibrated weld spacing sub-unit group, and calculate the standard deviation value Wa of the data of the calibrated weld spacing sub-unit group again until Wa is less than the standard deviation preset value Wy. Then, sum up the remaining data in the calibrated weld spacing sub-unit group and take the average value to obtain the single-spacing line value of the calibrated weld spacing sub-unit group;

[0133] Calculate the difference between the single-spacing line value of the non-standard weld spacing sub-unit group and the single-spacing line value of the calibrated weld spacing sub-unit group, and take the absolute value of the obtained difference to get the single-spacing deviation value;

[0134] Calculate the ratio of the single-spacing deviation value to the single-spacing line value of the calibrated weld spacing sub-unit group to obtain the single-spacing deviation ratio, denoted as pi.

[0135] Example 3: Based on the quality characterization value DF of the LED chip welding calculated in the above example, sample the LED chip welding production line to obtain the LED chip welding sampling group, and collect the quality characterization values of each LED chip welding in the LED chip welding sampling group;

[0136] Establish a plane coordinate system, with the processing time of LED chip soldering as the X-axis and the quality characterization value of LED chip soldering as the Y-axis;

[0137] Plot the quality characterization values of LED chip soldering within the LED chip soldering sampling group in the plane coordinate system in the order of the processing time of LED chip soldering, and then connect the points corresponding to all the quality characterization values of LED chip soldering in the coordinate system with a smooth curve from left to right in sequence to obtain the quality characterization curve of LED chip soldering;

[0138] If the quality characterization curve of LED chip soldering is linear and gradually increasing in the plane coordinate system, it indicates that the processing of the LED chip soldering processing equipment is abnormal, and an abnormal signal of the operation of the LED chip soldering processing equipment is generated;

[0139] If the quality characterization curve of LED chip soldering is linear and gradually decreasing in the plane coordinate system, it indicates that the processing of the LED chip soldering processing equipment is normal, and a normal signal of the operation of the LED chip soldering processing equipment is generated;

[0140] If the quality characterization curve of LED chip soldering is non-linear and fluctuates within a preset interval in the plane coordinate system, it indicates that the processing of the LED chip soldering processing equipment is normal, and a normal signal of the operation of the LED chip soldering processing equipment is generated.

[0141] Based on the abnormal signal of the operation of the LED chip soldering processing equipment, repair and handle the abnormal reasons of the LED chip soldering processing equipment to ensure the processing quality of LED chip soldering.

[0142] Among them, the LED chip soldering processing equipment includes but is not limited to weld pipe processing equipment, weld seam press / rolling machine.

[0143] Example 4: Please refer to Figure 3 As shown, the present invention is a performance detection system for an optoelectronic information conversion component, including:

[0144] A feature recognition module, which is used to acquire an LED chip soldering image, preprocess the acquired LED chip soldering image, and extract features from the preprocessed LED chip soldering image to obtain LED chip soldering feature data;

[0145] Among them, the LED chip soldering feature data includes the abnormal ratio of weld seam spacing units and the abnormal ratio of the LED chip soldering area;

[0146] A quality characterization module, which is used to process the abnormal ratio of weld seam spacing units and the abnormal ratio of the LED chip soldering area to obtain the quality characterization value of LED chip soldering;

[0147] A grading analysis module, which is used to identify the overall welding quality status of the LED chip based on the quality characterization value of the LED chip welding, and obtain the LED chip welding quality status grade signal;

[0148] Among them, the LED chip welding quality status signal includes a good LED chip welding quality status signal, a general LED chip welding quality status signal, and a poor LED chip welding quality status signal;

[0149] A processing prediction module, which randomly checks the LED chip welding based on the quality characterization value of the LED chip welding, and completes the evaluation of the processing trend of the LED chip welding.

[0150] Example 5: Please refer to Figure 4 As shown, the present invention is a schematic structural diagram of an electronic device.

[0151] The electronic device may include a processor, a memory, a bus, and a communication interface, and may further include a computer program stored in the memory and executable on the processor, such as a program for a method for detecting the performance of an optoelectronic information conversion component.

[0152] Among them, the memory includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disk, multimedia card, card-type memory (such as SD or DX memory, etc.), magnetic memory, magnetic disk, optical disk, etc. The memory may be an internal storage unit of the electronic device in some embodiments, such as the mobile hard disk of the electronic device. The memory may also be an external storage device of the electronic device in other embodiments, such as a plug-in mobile hard disk, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc. equipped on the electronic device. Further, the memory may include both an internal storage unit and an external storage device of the electronic device. The memory can be used not only to store application software installed on the electronic device and various types of data, such as the code of a processing program based on a method for detecting the performance of an optoelectronic information conversion component, but also to temporarily store data that has been output or will be output.

[0153] In some embodiments, the processor may be composed of an integrated circuit. For example, it may be composed of a single packaged integrated circuit, or may be composed of multiple packaged integrated circuits with the same or different functions, including the combination of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips. The processor is the control core (Control Unit) of the electronic device, connecting various components of the entire electronic device through various interfaces and circuits, and by running or executing programs or modules stored in the memory (such as a processing program for a method of detecting the performance of an optoelectronic information conversion component, etc.), and by calling the data stored in the memory, to perform various functions of the electronic device and process data.

[0154] The bus may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. This bus can be divided into an address bus, a data bus, a control bus, etc. The bus is set to enable connection and communication between the memory and at least one processor, etc.

[0155] Figure 4 Only the electronic device with components is shown. Those skilled in the art can understand that Figure 4 the shown structure does not constitute a limitation on the electronic device, and it may include fewer or more components than shown, or combine certain components, or have a different component layout.

[0156] The above formulas are all dimensionless and take their numerical values for calculation. The formulas are obtained by collecting a large amount of data for software simulation to get a formula that is closest to the actual situation. The preset parameters in the formulas are set by those skilled in the art according to the actual situation.

[0157] The above has described a detailed description of an embodiment of the present invention, but the above content is only a preferred embodiment of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A method for detecting the performance of an optoelectronic information conversion component, characterized in that, Including the following steps: Obtain the LED chip welding image, mark the area with two adjacent weld seams and the spacing formed between the adjacent weld seams in the LED chip welding image as the weld seam spacing sub-unit, and perform feature extraction on the LED chip welding image to obtain the LED chip welding feature data; Among them, the LED chip welding feature data includes the weld seam spacing unit abnormality ratio and the LED chip welding area abnormality ratio; Divide the weld seam spacing of the weld seam spacing sub-unit along the length direction into several weld seam spacing monomers, and integrate them to obtain a monomer spacing value group. Divide the weld seam spacing sub-unit into a non-standard weld seam spacing sub-unit and a calibrated weld seam spacing sub-unit according to the variance of the monomer spacing value group; The weld seam spacing unit abnormality ratio is the ratio of the number of non-standard weld seam spacing sub-units to the total number of weld seam spacing sub-units; Integrate the means of the monomer spacing value groups corresponding to all weld seam spacing sub-units to obtain a monomer spacing line value group, and process the standard deviation and the monomer spacing line amplitude value of the monomer spacing line value group to obtain the LED chip welding area abnormality ratio; Through data processing of the weld seam spacing unit abnormality ratio and the LED chip welding area abnormality ratio, obtain the quality characterization value of the LED chip welding; Identify the overall quality state of the LED chip welding according to the quality characterization value of the LED chip welding; The obtaining process of the LED chip welding area abnormality ratio is as follows: Record the standard deviation of the monomer spacing line value group as D1; Record the monomer spacing line amplitude value as D2; Through the formula the abnormal ratio Di of the LED chip welding area is calculated, where d1 and d2 are both preset proportionality factors.

2. The performance detection method of an optoelectronic information conversion component according to claim 1, wherein The LED chip welding feature data includes the weld seam spacing unit abnormality ratio and the LED chip welding area abnormality ratio; Record the weld seam spacing unit abnormality ratio as Fi; Record the LED chip welding area abnormality ratio as Di; Through the formula the quality characterization value DF of LED chip soldering is calculated, where df is the surface anomaly value of the weld of LED chip soldering.

3. A method for detecting the performance of an optoelectronic information conversion component according to claim 2, characterized in that, Preset the limit values of the quality characterization value of the LED chip welding as DF1 and DF2, where DF1 < DF2; When DF < DF1, it means that the overall quality state of the LED chip welding is good, and obtain the good signal of the LED chip welding quality state; When DF1 ≤ DF < DF2, it means that the overall quality state of the LED chip welding is average, and obtain the average signal of the LED chip welding quality state; When DF ≥ DF2, it means that the overall quality state of the LED chip welding is poor, and obtain the poor signal of the LED chip welding quality state.

4. A method for detecting the performance of an optoelectronic information conversion component according to claim 1, characterized in that, The identification process of the non-standard weld seam spacing sub-unit and the calibrated weld seam spacing sub-unit is as follows: If the variance value of the weld seam spacing monomer is greater than or equal to the variance threshold of the weld seam spacing monomer, then mark the weld seam spacing sub-unit as a non-standard weld seam spacing sub-unit; If the variance value of the weld seam spacing monomer is less than the variance threshold of the weld seam spacing monomer, then mark the weld seam spacing sub-unit as a calibrated weld seam spacing sub-unit.

5. A method for detecting the performance of an optoelectronic information conversion component according to claim 1, characterized in that, The obtaining process of the monomer spacing line amplitude value is as follows: Obtain the maximum value in the monomer spacing line value group and mark it as Dmax; Obtain the minimum value in the monomer spacing line value group and mark it as Dmin; Calculate and obtain the monomer spacing line amplitude value D2 using the formula D2 = (Dmax - Dmin) / Dmin.

6. A method for detecting the performance of an optoelectronic information conversion component according to claim 2, characterized in that The obtaining process of the weld surface abnormal value of the LED chip welding is as follows: Obtain the weld seam spacing sub-unit, and obtain all the weld planes that need to be quality inspected within the weld seam spacing sub-unit; Obtain the weld direction deviation value of the LED chip and mark it as Nj; Obtain the weld surface finish value of the LED chip and denote it as Mj; Obtained through the formula Get the weld table outlier df of LED chip soldering, where is the monomer spacing deviation ratio.

7. A method for detecting the performance of an optoelectronic information conversion component according to claim 6, characterized in that, The process of obtaining the monomer spacing deviation ratio is as follows: Obtain and integrate the monomer spacing line values of all non-standard weld spacing sub-units to obtain a non-standard weld spacing sub-unit group; Process the non-standard weld spacing sub-unit group to obtain the monomer spacing line values of the non-standard weld spacing sub-unit group; Obtain and integrate the monomer spacing line values of all calibrated weld spacing sub-units to obtain a calibrated weld spacing sub-unit group; Process the calibrated weld spacing sub-unit group to obtain the monomer spacing line values of the calibrated weld spacing sub-unit group; Perform a difference calculation on the monomer spacing line values of the non-standard weld spacing sub-unit group and the monomer spacing line values of the calibrated weld spacing sub-unit group, and take the absolute value of the obtained difference to obtain the monomer spacing deviation value; Perform a ratio calculation on the monomer spacing deviation value and the monomer spacing line values of the calibrated weld spacing sub-unit group to obtain the monomer spacing deviation ratio.

8. A performance detection system for an optoelectronic information conversion component, characterized in that, The optoelectronic information conversion component performance detection system is used to execute the method described in any one of the above claims 1-7.

Images