Display module and display device

Abstract

The present application relates to a display module and a display device, wherein the display module includes a display panel, a middle frame, a conductive buffer and a conductive tape, wherein the display panel is arranged on the middle frame, the conductive buffer contacts the middle frame, the surface of the conductive buffer away from the middle frame is sticky, and the conductive tape includes a first sticky layer and a non-sticky layer, and the first sticky layer and the non-sticky layer are both conductive. By bonding the first sticky layer to the display panel and directly bonding the non-sticky layer to the sticky surface of the conductive buffer away from the middle frame, there is no need to add additional conductive glue to bond the conductive tape to the conductive buffer. In this way, the risk of poor bonding between the conductive tape and the conductive buffer and the impedance between the conductive tape and the conductive buffer can be reduced, ensuring that the charge on the middle frame can be released through the conductive buffer and the conductive tape to be grounded, reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Static electricity is a natural phenomenon that occurs in a variety of ways, including contact, friction, and induction between electrical devices. Static electricity is characterized by long-term accumulation, high voltage, low charge, low current, and a short duration. Human movement or contact, separation, friction, or induction with other objects can generate static electricity of several thousand or even tens of thousands of volts. Triboelectric charging and human static electricity are two major hazards in the electronics industry, often causing unstable operation and even damage to electronic and electrical products.

[0003] Currently, static foam is typically placed on the grounded conductive tape in the display module. The middle frame is grounded through the static foam and the conductive tape to release accumulated charge on the middle frame. Since the conductive tape is usually double-sided, with conductive adhesive applied on both sides of the conductive fabric, and the conductive foam itself has a layer of conductive adhesive, if the conductive adhesive on the conductive tape and the conductive adhesive on the conductive foam do not bond well, the impedance between the conductive tape and the conductive adhesive is too high, preventing the charge on the middle frame from being released. This can cause static damage to the display module, resulting in reduced yield and quality.

[0004] Therefore, it is necessary to provide a display module and a display device to improve this defect. Summary of the Invention

[0005] The embodiments of the present application provide a display module and a display device, which can reduce the risk of electrostatic damage to the display module and improve the yield and quality of the display module.

[0006] To achieve the above objectives, according to a first aspect of the present application, a display module is provided, comprising:

[0007] Display panel;

[0008] a middle frame, on which the display panel is arranged;

[0009] a conductive buffer member in contact with the middle frame, wherein a surface of the conductive buffer member away from the middle frame is sticky; and

[0010] A conductive tape includes a first adhesive layer and a non-adhesive layer, wherein the non-adhesive layer is arranged on the first adhesive layer, the first adhesive layer and the non-adhesive layer are both conductive, the first adhesive layer is adhered to the display panel, the non-adhesive layer is adhered to the surface of the conductive buffer away from the middle frame, and the conductive tape is grounded.

[0011] Optionally, the display panel includes a main body and a binding portion, the binding portion is configured to be bent to the back side of the main body, and the first adhesive layer is at least partially adhered to the binding portion;

[0012] Wherein, the display module also includes an integrated circuit chip and a packaging tape, the integrated circuit chip is arranged on the binding part, the packaging tape is at least adhered to the non-adhesive layer, and in the film thickness direction of the packaging tape, the packaging tape covers the integrated circuit chip.

[0013] Optionally, the conductive buffer comprises a first sub-conductive buffer and a second sub-conductive buffer, and the first sub-conductive buffer is spaced apart from the second sub-conductive buffer;

[0014] In which, the conductive tape includes a first sub-conductive tape and a second sub-conductive tape, the first sub-conductive tape and the second sub-conductive tape are spaced apart, the non-adhesive layer of the first sub-conductive tape is bonded to the first sub-conductive buffer, and the non-adhesive layer of the first sub-conductive tape is bonded to the packaging tape; the non-adhesive layer of the second sub-conductive tape is bonded to the second sub-conductive buffer, and the non-adhesive layer of the second sub-conductive tape is bonded to the packaging tape, and the side of the packaging tape bonded to the non-adhesive layer is conductive.

[0015] Optionally, the packaging tape includes:

[0016] a second adhesive layer, partially adhered to the non-adhesive layer and partially adhered to the binding portion and the integrated circuit chip, the second adhesive layer being conductive;

[0017] a conductive layer disposed on a surface of the second adhesive layer away from the conductive tape; and

[0018] The insulating layer is disposed on a surface of the conductive layer away from the second adhesive layer.

[0019] Optionally, the display module also includes a flexible circuit board and a heat dissipation support layer, the heat dissipation support layer is arranged on the back of the main body, the flexible circuit board is bound and connected to the binding part, the flexible circuit board is in contact with the heat dissipation support layer, and the second adhesive layer is partially adhered to the flexible circuit board.

[0020] Optionally, the conductive buffer comprises a first sub-conductive buffer and a second sub-conductive buffer, and the first sub-conductive buffer is spaced apart from the second sub-conductive buffer;

[0021] The first sub-conductive buffer component and the second sub-conductive buffer component are bonded to the same non-adhesive layer, and the side of the packaging tape bonded to the non-adhesive layer is insulated.

[0022] Optionally, the packaging tape includes:

[0023] a second adhesive layer adhered to the non-adhesive layer, the second adhesive layer being insulating; and

[0024] an insulating layer, disposed on a surface of the second adhesive layer away from the conductive tape;

[0025] The orthographic projection of the packaging tape on the conductive tape is located inside the conductive tape.

[0026] Optionally, the packaging tape has an opening, the opening passes through the second adhesive layer and the insulating layer, and the conductive buffer is disposed in the opening.

[0027] Optionally, the display module also includes a flexible circuit board and a heat dissipation support layer. The flexible circuit board is bound and connected to the binding part, and the flexible circuit board is in contact with the heat dissipation support layer. In the film thickness direction of the conductive tape, the conductive tape covers the integrated circuit chip and partially covers the flexible circuit board. The first adhesive layer is partially adhered to the flexible circuit board.

[0028] According to a second aspect of the present application, a display device is provided, comprising the display module as described above.

[0029] In the display module of the embodiment of the present application, the first adhesive layer of the conductive tape is adhered to the display panel, and the non-adhesive layer of the conductive tape is directly adhered to the adhesive surface of the conductive buffer away from the middle frame, without the need for additional conductive adhesive to adhere the conductive tape to the conductive buffer. This can reduce the risk of poor bonding between the conductive tape and the conductive buffer, and reduce the impedance between the conductive tape and the conductive buffer, ensuring that the charge on the middle frame can be released through the conductive buffer and the conductive tape to be grounded, reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0030] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0032] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0033] Figure 1 A bottom view of the first display module provided in an embodiment of the present application;

[0034] Figure 2 A partially enlarged schematic diagram of a first display module provided in an embodiment of the present application;

[0035] Figure 3 A cross-sectional view of the first display module provided in an embodiment of the present application along the AA' direction;

[0036] Figure 4 A partially enlarged schematic diagram of the first display module provided in an embodiment of the present application after the packaging tape is removed;

[0037] Figure 5 A schematic structural diagram of a conductive tape in a first display module provided in an embodiment of the present application;

[0038] Figure 6 A partial enlarged schematic diagram of the second display module provided in an embodiment of the present application after the packaging tape is removed;

[0039] Figure 7 A cross-sectional view along the BB' direction of the second display module provided in an embodiment of the present application;

[0040] Figure 8 A schematic structural diagram of a conductive tape in a second display module provided in an embodiment of the present application;

[0041] Figure 9 A schematic structural diagram of a display device provided in an embodiment of the present application.

[0042] Description of reference numerals:

[0043] 1. Display panel; 11. Main body; 12. Binding portion; 13. Bending portion;

[0044] 2. Middle frame;

[0045] 3. Conductive buffer; 31. First sub-conductive buffer; 32. Second sub-conductive buffer; 301. Conductive main body; 302. Conductive adhesive portion;

[0046] 4. Conductive tape; 41. First sub-conductive tape; 42. Second sub-conductive tape; 401. First adhesive layer; 402. Non-adhesive layer;

[0047] 5. Integrated circuit chips;

[0048] 6. Packaging tape; 61. Opening; 601. Second adhesive layer; 602. Conductive layer; 603. Insulating layer;

[0049] 7. Flexible circuit board;

[0050] 8. Heat dissipation support layer;

[0051] 9. Protective layer;

[0052] 101. First backboard; 102. Second backboard; 103. Composite support layer;

[0053] 100. Display module; 200. Housing; 1000. Display device. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0055] An embodiment of the present application provides a display module, which includes a display panel, a middle frame, a conductive buffer and a conductive tape. The display panel is arranged on the middle frame, the conductive buffer is in contact with the middle frame, the surface of the conductive buffer away from the middle frame is sticky, and the conductive tape includes a first sticky layer and a non-sticky layer, both of which are conductive. The first sticky layer is bonded to the display panel, the non-sticky layer is bonded to the surface of the conductive buffer away from the middle frame, and the conductive tape is grounded.

[0056] In an embodiment of the present application, the first adhesive layer of the conductive tape is bonded to the display panel, and the non-adhesive layer of the conductive tape is directly bonded to the adhesive surface of the conductive buffer away from the middle frame, without the need for additional conductive adhesive to bond the conductive tape to the conductive buffer. This can reduce the risk of poor bonding between the conductive tape and the conductive buffer, and reduce the impedance between the conductive tape and the conductive buffer, ensuring that the charge on the middle frame can be released through the conductive buffer and the conductive tape to the ground, thereby reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0057] See also Figure 1 and Figure 2 , Figure 1 This is a bottom view of the first display module provided in an embodiment of the present application. Figure 2This is a partially enlarged schematic diagram of the first display module provided in an embodiment of the present application. Display module 100 includes a display panel 1, which includes a main body 11 and a binding portion 12. Binding portion 12 is connected to one end of main body 11. In the final product structure, binding portion 12 is configured to bend to the back of main body 11. The front of main body 11 is the display surface of display panel 1, and the back of main body 11 is the side opposite to the front of main body 11.

[0058] In some embodiments, see Figure 3 , Figure 3 This is a cross-sectional view of the first display module along the AA′ direction provided in an embodiment of the present application. The display panel 1 further includes a bending portion 13 , which is connected between the main body 11 and the binding portion 12 , and is configured in a bending shape.

[0059] In some embodiments, see Figure 3 The outer surface of the bending portion 13 is covered with a protective layer 9, which is used to maintain the shape of the bending portion 13 and prevent the bending portion 13 from being damaged.

[0060] See also Figures 1 to 3 The display module 100 further includes a middle frame 2, a conductive buffer 3, and a conductive tape 4. The display panel 1 is disposed on the middle frame 2, and the conductive buffer 3 is in contact with the middle frame 2. The surface of the conductive buffer 3 away from the middle frame 2 is adhesive. The conductive tape 4 includes a first adhesive layer 401 and a non-adhesive layer 402. The non-adhesive layer 402 is disposed on the first adhesive layer 401. Both the first adhesive layer 401 and the non-adhesive layer 402 are conductive. The first adhesive layer 401 is adhered to the display panel 1, and the non-adhesive layer 402 is adhered to the surface of the conductive buffer 3 away from the middle frame 2. The conductive tape 4 is grounded, and the middle frame 2 is electrically connected to the conductive tape 4 via the conductive buffer 3. Since the conductive tape 4 is grounded, the charge accumulated on the middle frame 2 can be released through the conductive tape 4.

[0061] In this embodiment, the surface of the conductive buffer 3 facing away from the middle frame 2 is adhesive, and the non-adhesive layer 402 of the conductive tape 4 directly adheres to the adhesive surface of the conductive buffer 3 facing away from the middle frame 2, thereby securing and electrically connecting the conductive buffer 3 and the conductive tape 4. Therefore, there is no need to apply conductive adhesive to the surface of the non-adhesive layer 402 near the conductive buffer 3. This reduces the risk of poor bonding between the conductive buffer 3 and the conductive tape 4, and lowers the impedance between the conductive buffer 3 and the conductive tape 4. This ensures that the charge on the middle frame 2 can be discharged through the conductive buffer 3 and the conductive tape 4 to the ground, reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0062] In some embodiments, see Figure 3The material of the first adhesive layer 401 is conductive adhesive, which includes adhesive material and conductive particles distributed in the adhesive material (not shown in the figure). The non-adhesive layer 402 is conductive fabric. Both the first adhesive layer 401 and the non-adhesive layer 402 are conductive.

[0063] In some embodiments, see Figure 3 The conductive buffer 3 includes a conductive main portion 301 and a conductive adhesive portion 302. The conductive main portion 301 is disposed on the conductive adhesive portion 302. The surface of the conductive main portion 301 away from the conductive adhesive portion 302 contacts the middle frame 2. The surface of the conductive adhesive portion 302 away from the conductive main portion 301 is directly bonded to the non-adhesive layer 402 of the conductive tape 4. The conductive main portion 301 has a certain degree of elastic deformation capability. The middle frame 2 is directly pressed against the surface of the conductive main portion 301 away from the conductive adhesive portion 302, thereby securing the conductive buffer 3.

[0064] In some embodiments, the conductive body portion 301 is made of conductive foam, and the conductive adhesive portion 302 is made of conductive glue.

[0065] In some embodiments, the combination and Figure 2 and Figure 4 As shown, Figure 4 The first display module provided in the embodiment of the present application is a partially enlarged schematic diagram after the packaging tape is removed. The display module 100 also includes an integrated circuit chip 5 and a packaging tape 6. The integrated circuit chip 5 is arranged on the binding portion 12, and the packaging tape 6 is at least adhered to the non-adhesive layer 402. In the film thickness direction of the packaging tape 6, the packaging tape 6 covers the integrated circuit chip 5.

[0066] In some embodiments, see Figures 1 to 4 The side where the packaging tape 6 is bonded to the non-adhesive layer 402 is conductive, the conductive adhesive portion 302 of the conductive buffer 3 is bonded to the non-adhesive layer 402, the conductive buffer 3 is electrically connected to the packaging tape 6 through the non-adhesive layer 402 of the conductive tape 4, and the packaging tape 6 is grounded, that is, the middle frame 2 is grounded through the conductive buffer 3, the conductive tape 4 and the packaging tape 6.

[0067] In some embodiments, see Figure 2 Display module 100 also includes a flexible circuit board 7 and a heat dissipation support layer 8. Heat dissipation support layer 8 is disposed on the back surface of main body 11. Flexible circuit board 7 is bonded to binding portion 12, making contact with heat dissipation support layer 8. Sealing tape 6 is bonded to flexible circuit board 7, making contact with the exposed metal pattern on the surface of flexible circuit board 7. Heat dissipation support layer 8 is made of metal and provides not only support and heat dissipation but also grounding, allowing middle frame 2 to be grounded via conductive buffer 3, conductive tape 4, sealing tape 6, flexible circuit board 7, and heat dissipation support layer 8.

[0068] In some embodiments, see Figure 4 and Figure 5 , Figure 5 A schematic structural diagram of the conductive tape in the first display module provided in an embodiment of the present application, wherein the conductive buffer 3 includes a first sub-conductive buffer 31 and a second sub-conductive buffer 32, wherein the first sub-conductive buffer 31 and the second sub-conductive buffer 32 are spaced apart from each other, and the first sub-conductive buffer 31 and the second sub-conductive buffer 32 are respectively arranged at opposite ends of the binding portion 12, and the first sub-conductive buffer 31 and the second sub-conductive buffer 32 have the same structure, both consisting of a conductive main body portion 301 and a conductive adhesive portion 302.

[0069] See also Figure 4 and Figure 5 The conductive tape 4 includes a first sub-conductive tape 41 and a second sub-conductive tape 42. The first sub-conductive tape 41 and the second sub-conductive tape 42 are arranged at intervals. The first sub-conductive tape 41 is arranged corresponding to the first sub-conductive buffer 31, and the second sub-conductive tape 42 is arranged corresponding to the second sub-conductive buffer 32. The first sub-conductive tape 41 and the second sub-conductive tape 42 have the same structure and are both composed of a first adhesive layer 401 and a non-adhesive layer 402.

[0070] See also Figure 4 and Figure 5 The non-adhesive layer 402 of the first sub-conductive tape 41 is bonded to the conductive adhesive portion 302 of the first sub-conductive buffer 31 , and the non-adhesive layer 402 of the first sub-conductive tape 41 is also bonded to the packaging tape 6 . The non-adhesive layer 402 of the second sub-conductive tape 42 is bonded to the conductive adhesive portion 302 of the second sub-conductive buffer 32. The non-adhesive layer 402 of the second sub-conductive tape 42 is also bonded to the packaging tape 6. The side of the packaging tape 6 bonded to the non-adhesive layer 402 is conductive. The first sub-conductive buffer 31 and the second sub-conductive buffer 32 can be conductive through the first sub-conductive tape 41, the packaging tape 6 and the second sub-conductive tape 42. Since the conductive tape 4 only has the first adhesive layer 401 and the non-adhesive layer 402, the non-adhesive layer 402 is directly bonded to the conductive adhesive portion 302 of the conductive buffer 3 without an additional layer of conductive glue. Therefore, the impedance between the first sub-conductive buffer 31 and the second sub-conductive buffer 32 can be reduced, ensuring that the charge on the middle frame can be released through the conductive buffer and the conductive tape to be grounded, reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0071] In some embodiments, see Figures 2 to 5The packaging tape 6 includes a second adhesive layer 601, a conductive layer 602 and an insulating layer 603 which are stacked together. The conductive layer 602 is arranged on the surface of the second adhesive layer 601 away from the conductive tape 4, and the insulating layer 603 is arranged on the surface of the conductive layer 602 away from the second adhesive layer 601. The second adhesive layer 601 is partially adhered to the non-adhesive layer 402, and the other part is adhered to the binding part 12 and the integrated circuit chip 5. The second adhesive layer 601 is conductive.

[0072] See also Figures 2 to 5 The non-adhesive layer 402 of the first sub-conductive tape 41 and the non-adhesive layer 402 of the second sub-conductive tape 42 are both bonded to the same second adhesive layer 601. The first sub-conductive tape 41 and the second sub-conductive tape 42 are electrically connected via the second adhesive layer 601 and the conductive layer 602. The first sub-conductive buffer 31 and the second sub-conductive buffer 32 are electrically connected via the first sub-conductive tape 41, the packaging tape 6, and the second sub-conductive tape 42. This allows the middle frame 2 to be grounded via the conductive buffer 3, the conductive tape 4, the packaging tape 6, the flexible circuit board 7, and the heat dissipation support layer 8. The integrated circuit chip 5 can also be grounded via the packaging tape 6 and the flexible circuit board 7, thereby reducing the risk of electrostatic damage to the integrated circuit chip 5.

[0073] In some embodiments, the second adhesive layer 601 is made of conductive adhesive.

[0074] In some embodiments, see Figure 3 The display module 100 also includes a first back plate 101, a second back plate 102 and a composite support layer 103. The first back plate 101 is arranged on the back of the main body 11, the heat dissipation support layer 8 is arranged on the side of the first back plate 101 away from the main body 11, the second back plate 102 is arranged on the back of the binding part 12, and the composite support layer 103 is arranged between the second back plate 102 and the heat dissipation support layer 8.

[0075] In some embodiments, see Figures 6 to 8 , Figure 6 This is a partial enlarged schematic diagram of the second display module provided in an embodiment of the present application after the packaging tape is removed. Figure 7 A cross-sectional view of the second display module provided in an embodiment of the present application along the BB' direction, Figure 8 This is a schematic diagram of the structure of the conductive tape in the second display module provided in an embodiment of the present application. The structure of the display module provided in this embodiment is roughly the same as the structure of the first display module provided in the above embodiment, with the difference that: the first sub-conductive buffer 31 and the second sub-conductive buffer 32 are bonded to the same non-adhesive layer 402, and the side where the packaging tape 6 is bonded to the non-adhesive layer 402 is insulated.

[0076] See also Figures 6 to 8The conductive tape 4 is an integrated structure and is arranged on the entire surface. The first sub-conductive buffer 31 and the second sub-conductive buffer 32 are both adhered to the non-adhesive layer 402 of the same conductive tape 4. The first sub-conductive buffer 31 and the second sub-conductive buffer 32 are directly connected through the non-adhesive layer 402 of the conductive tape 4. This can further reduce the impedance between the first sub-conductive buffer 31 and the second sub-conductive buffer 32, thereby further reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0077] See also Figure 8 The packaging tape 6 includes a second adhesive layer 601 and an insulating layer 603. The second adhesive layer 601 is bonded to the non-adhesive layer 402 and is insulated. The insulating layer 603 is disposed on the surface of the second adhesive layer 601 away from the conductive tape 4. The orthographic projection of the packaging tape 6 on the conductive tape 4 is located within the conductive tape 4. The size of the packaging tape 6 can be the same as or smaller than that of the conductive tape 4.

[0078] In this embodiment, the packaging tape 6 is not conductive but only insulating. By covering the packaging tape 6 on the surface of the conductive tape 4 away from the display panel 1, on the one hand, the conductive tape 4 can be isolated from other components in the display module to prevent other components from contacting the conductive tape 4 and causing a short circuit. On the other hand, the static electricity protection capability of the display module can be improved.

[0079] In some embodiments, see Figure 8 The packaging tape 6 has an opening 61 that extends through the second adhesive layer 601 and the insulating layer 603. The conductive buffer 3 is disposed in the opening 61, spaced apart from the inner wall of the opening 61. The opening 61 in the packaging tape 6 exposes the conductive body 301 of the conductive buffer 3, facilitating contact between the conductive body 301 of the conductive buffer 3 and the middle frame 2. This ensures that the middle frame 2 can be grounded via the conductive buffer 3, thereby reducing the risk of electrostatic damage to the display module and improving the yield and quality of the display module.

[0080] In some embodiments, the distance d1 between the conductive buffer 3 and the inner wall of the opening 61 is greater than or equal to 0.3 mm and less than or equal to 0.5 mm. Due to the limitations of the assembly process accuracy, if the size of the opening 61 is too small, when attaching the packaging tape 6, if the offset of the packaging tape 6 is too large, the packaging tape 6 will cover the conductive buffer 3, resulting in the middle frame 2 being unable to contact the conductive buffer 3, causing the middle frame 2 to be unable to be grounded through the conductive buffer 3, resulting in an increased risk of electrostatic damage to the display module. By making the distance d1 between the conductive buffer 3 and the inner wall of the opening 61 greater than or equal to 0.3 mm and less than or equal to 0.5 mm, it can be ensured that the conductive buffer 3 can be assembled into the opening 61, thereby ensuring that the middle frame 2 can be grounded through the conductive buffer 3, thereby reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0081] In some embodiments, see Figures 6 to 8 In the thickness direction of the conductive tape 4, the conductive tape 4 covers the integrated circuit chip 5 and partially covers the flexible circuit board 7. The first adhesive layer 401 is partially adhered to the flexible circuit board 7. The first adhesive layer 401 contacts the exposed metal pattern on the surface of the flexible circuit board 7. The middle frame 2 can be grounded through the conductive buffer 3, the conductive tape 4, the flexible circuit board 7 and the supporting layer 8.

[0082] Beneficial effects of the embodiments of the present application: In the display module of this embodiment, by bonding the first adhesive layer to the display panel and directly bonding the non-adhesive layer to the adhesive surface of the conductive buffer away from the middle frame, there is no need to add additional conductive adhesive to bond the conductive tape to the conductive buffer. This can reduce the risk of poor bonding between the conductive tape and the conductive buffer, and reduce the impedance between the conductive tape and the conductive buffer, ensuring that the charge on the middle frame can be released through the conductive buffer and the conductive tape to the ground, reducing the risk of electrostatic damage to the display module, thereby improving the yield and quality of the display module.

[0083] According to the second aspect of the present application, a display device is provided. Figure 9 , Figure 9 This is a schematic structural diagram of a display device provided in an embodiment of the present application. Display device 1000 includes a display module 100 and a housing 200, wherein display module 100 is disposed on housing 200. The display device provided in this embodiment can achieve the same technical effects as the display module provided in any of the above embodiments, and will not be described in detail here.

[0084] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0085] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0086] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0087] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: Display panel; a middle frame, on which the display panel is arranged; a conductive buffer member in contact with the middle frame, wherein a surface of the conductive buffer member away from the middle frame is sticky; as well as A conductive tape comprising a first adhesive layer and a non-adhesive layer, wherein the non-adhesive layer is disposed on the first adhesive layer, and both the first adhesive layer and the non-adhesive layer are conductive. The first adhesive layer is adhered to the display panel, and the non-adhesive layer is adhered to a surface of the conductive buffer away from the middle frame. The conductive tape is grounded. The display panel includes a main body and a binding portion, the binding portion is configured to be bent to the back of the main body, the first adhesive layer is at least partially adhered to the binding portion, and the display module further includes a packaging tape, the packaging tape is at least adhered to the non-adhesive layer; The conductive buffer includes a first sub-conductive buffer and a second sub-conductive buffer, and the first sub-conductive buffer is spaced apart from the second sub-conductive buffer. The conductive tape includes a first sub-conductive tape and a second sub-conductive tape, and the first sub-conductive tape is spaced apart from the second sub-conductive tape. The non-adhesive layer of the first sub-conductive tape is bonded to the first sub-conductive buffer, and the non-adhesive layer of the first sub-conductive tape is bonded to the packaging tape; the non-adhesive layer of the second sub-conductive tape is bonded to the second sub-conductive buffer, and the non-adhesive layer of the second sub-conductive tape is bonded to the packaging tape, and the side of the packaging tape bonded to the non-adhesive layer is conductive.

2. The display module according to claim 1, wherein: The display module further includes an integrated circuit chip, which is disposed on the binding portion. In the film thickness direction of the packaging tape, the packaging tape covers the integrated circuit chip.

3. The display module according to claim 2, wherein: The packaging tape comprises: a second adhesive layer, partially adhered to the non-adhesive layer and partially adhered to the binding portion and the integrated circuit chip, the second adhesive layer being conductive; a conductive layer disposed on a surface of the second adhesive layer away from the conductive tape; and The insulating layer is disposed on a surface of the conductive layer away from the second adhesive layer.

4. The display module according to claim 3, wherein: The display module also includes a flexible circuit board and a heat dissipation support layer. The heat dissipation support layer is arranged on the back of the main body. The flexible circuit board is bound and connected to the binding part. The flexible circuit board contacts the heat dissipation support layer. The second adhesive layer is partially adhered to the flexible circuit board.

5. The display module according to claim 2, wherein: The conductive buffer comprises a first sub-conductive buffer and a second sub-conductive buffer, wherein the first sub-conductive buffer is spaced apart from the second sub-conductive buffer; The first sub-conductive buffer component and the second sub-conductive buffer component are bonded to the same non-adhesive layer, and the side of the packaging tape bonded to the non-adhesive layer is insulated.

6. The display module according to claim 5, wherein: The packaging tape comprises: a second adhesive layer adhered to the non-adhesive layer, the second adhesive layer being insulating; and an insulating layer, disposed on a surface of the second adhesive layer away from the conductive tape; The orthographic projection of the packaging tape on the conductive tape is located inside the conductive tape.

7. The display module according to claim 6, wherein: The packaging tape has an opening, the opening passes through the second adhesive layer and the insulating layer, and the conductive buffer is disposed in the opening.

8. The display module according to claim 6, wherein: The display module also includes a flexible circuit board and a heat dissipation support layer. The flexible circuit board is bound and connected to the binding part, and the flexible circuit board is in contact with the heat dissipation support layer. In the film thickness direction of the conductive tape, the conductive tape covers the integrated circuit chip and partially covers the flexible circuit board. The first adhesive layer is partially adhered to the flexible circuit board.

9. A display device, characterized in that: The display module comprises the display module according to any one of claims 1 to 8.

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