Defect detection device and method

Abstract

The invention provides defect detection equipment and a defect detection method. The equipment comprises a light beam generator for generating a light beam; the shaping lens shapes the light beam to obtain a shaped light beam; the beam splitter vertically reflects the shaped light beam to obtain a first light beam; the first light beam is transmitted to a to-be-detected object through the microscope objective, and the to-be-detected object comprises a to-be-detected crystal material; the to-be-measured object is irradiated and excited by the first light beam to generate emission light; the emitted light is transmitted to a target device after passing through the beam splitter, and is transmitted or reflected by the target device to obtain a target light beam; the imaging unit generates an image of the to-be-detected crystal material based on the target light beam; and the processing equipment analyzes an image of the crystal material to be detected generated based on the target light beam to obtain a detection result about whether the crystal material to be detected has defects or not. The target light beam is reflected and transmitted through the target device, so that the image corresponding to the defect is generated, and the defect detection result is obtained.

Description

Technical Field

[0001] The present application relates to the technical field of defect classification, and in particular to a defect detection device and method. Background Art

[0002] In the related art, silicon carbide crystal materials are usually used in electronic devices or related electronic equipment. However, silicon carbide crystal materials may have some defects of different forms, but even using a metallographic microscope, it is difficult to observe the defects of silicon carbide crystal materials, and it is difficult to achieve accurate detection results. Summary of the invention

[0003] The present application provides a defect detection device and method to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present application, a defect detection device is provided, the device comprising:

[0005] A beam generator, used for generating a beam;

[0006] A shaping mirror, used for shaping the light beam to obtain a shaped light beam;

[0007] A beam splitter, used for vertically reflecting the shaped light beam to obtain a first light beam;

[0008] A microscope objective lens, used for focusing the first light beam and irradiating it onto the object to be measured, and for amplifying the emission light generated by the object to be measured to obtain a second light beam;

[0009] A target device, used for performing transmission or reflection processing on the second light beam to obtain a target light beam;

[0010] An imaging unit, configured to generate an image of the crystal material to be detected based on the target light beam;

[0011] A processing device, used for analyzing an image of the crystal material to be detected generated based on the target light beam, and obtaining a detection result of whether the crystal material to be detected has defects;

[0012] Among them, the first light beam is focused on the object to be tested through the microscope objective lens, and the object to be tested includes a crystal material to be tested; the crystal material to be tested is irradiated and excited by the first light beam to generate emission light, and the emission light is amplified by the microscope objective lens to obtain a second light beam, and the second light beam is transmitted to the target device through the beam splitter, and the target light beam is obtained after transmission or reflection processing by the target device.

[0013] In one possible implementation, the target device includes: a first beam splitter, a second beam splitter, and a reflector;

[0014] The reflective surface of the first beam splitter is coated with a reflective film of a first wavelength range, and the transmissive surface of the first beam splitter is coated with a transmissive film of a second wavelength range;

[0015] The reflective surface of the second beam splitter is coated with a reflective film in a third wavelength range, and the transmissive surface of the second beam splitter is coated with a transmissive film in a fourth wavelength range;

[0016] The reflective surface of the reflector is coated with a reflective film in a fourth wavelength range;

[0017] Wherein, the first wavelength range is smaller than the third wavelength range, the second wavelength range is smaller than the fourth wavelength range, and the third wavelength range is smaller than the fourth wavelength range;

[0018] In response to the wavelength of the emitted light, the first beam splitter or the second beam splitter or the reflector in the wavelength range corresponding to the wavelength of the emitted light transmits or reflects the emitted light to obtain a target light beam.

[0019] In one possible implementation, the beam splitter is located between the microscope objective and the first beam splitter;

[0020] The first beam splitter, the second beam splitter and the reflector are arranged in sequence.

[0021] In one embodiment, the imaging unit includes: a first imaging tube lens, a second imaging tube lens, a third imaging tube lens, a first camera, a second camera and a third camera, the first imaging tube lens is threadedly connected to the first camera, the second imaging tube lens is threadedly connected to the second camera, and the third imaging tube lens is threadedly connected to the third camera;

[0022] The first imaging tube lens is used to amplify the first target light beam emitted by the first beam splitter and converge it to the first camera, and the first camera generates a first image;

[0023] The second imaging tube lens is used to amplify the second target light beam emitted by the second beam splitter and converge it to the second camera, and the second camera generates a second image;

[0024] The third imaging tube lens is used to amplify the third target light beam reflected by the reflector and converge it to the third camera, and the third camera generates a third image.

[0025] In one possible implementation manner, the processing device is further used to obtain defect categories corresponding to multiple defects when the crystal material to be inspected has multiple defects.

[0026] In one embodiment, the device further comprises:

[0027] A prism, used to focus the light beam to obtain a focused light beam;

[0028] The shaping mirror is used to shape the focused light beam into a shaped light beam;

[0029] Wherein, the reflective surface of the prism is coated with a UV-enhanced aluminum film with high reflectivity, and the transmissive surface of the prism is coated with a UV-enhanced aluminum film with high transmittance.

[0030] In one embodiment, the orthopedic mirror comprises:

[0031] A first shaping lens, a second shaping lens and a stepping motor, wherein the first shaping lens and the second shaping lens are mounted on the stepping motor;

[0032] The stepper motor is used to receive a control instruction to move so as to make the optical axis center of the first shaping lens coaxial with the optical axis of the light beam or the optical axis center of the second shaping lens coaxial with the optical axis of the light beam.

[0033] In one possible implementation, the beam generator includes a plurality of laser generators;

[0034] The plurality of laser generators can emit light beams in different wavelength ranges.

[0035] In one possible implementation, when the shaping mirror adopts a line laser shaping lens, the first camera, the second camera, and the third camera adopt black and white line scan cameras;

[0036] When the shaping mirror adopts a surface laser shaping lens, the first camera, the second camera and the third camera adopt black and white area array cameras.

[0037] In one embodiment, the first beam splitter and the second beam splitter are both flat dichroic mirrors.

[0038] According to a second aspect of the present application, a method for classifying crystal material defects is provided, the method comprising:

[0039] Placing the object to be tested within the focusing range of the microscope objective lens; wherein the surface of the object to be tested is a crystal material to be tested;

[0040] Turn on the beam generator to generate a beam, the beam is shaped by the shaping mirror to form a shaped beam, the shaped beam is reflected by the beam splitter to form a first beam, the light of the first beam is focused on the surface of the object to be measured by the microscope objective lens, and only when there is a defect on the surface of the object to be measured, the defect is irradiated by the first beam to excite and form emission light;

[0041] Separating target light beams having different wavelength ranges from the emitted light by a target device;

[0042] The plurality of imaging units respectively receive target light beams in corresponding wavelength ranges and form images;

[0043] Analyze the defects on the surface of the object to be tested according to the image.

[0044] In one embodiment, the target device comprises: a first beam splitter, a second beam splitter and a reflector; and the target light beams having different wavelength ranges are separated from the emitted light by the target device, comprising:

[0045] intercepting wavelengths in a first wavelength range from the emitted light and transmitting wavelengths in a second wavelength range through a first beam splitter to obtain a first target light beam;

[0046] intercepting wavelengths in a third wavelength range from the emitted light and transmitting wavelengths in a fourth wavelength range through a second beam splitter to obtain a second target light beam;

[0047] intercepting wavelengths in a fourth wavelength range from the emitted light by a reflector to obtain a third target light beam;

[0048] Among them, the first wavelength range is smaller than the third wavelength range, the second wavelength range is smaller than the fourth wavelength range, and the third wavelength range is smaller than the fourth wavelength range.

[0049] In one embodiment, the imaging unit includes: a first imaging tube lens, a second imaging tube lens, a third imaging tube lens, a first camera, a second camera, and a third camera. The plurality of imaging units respectively receive target light beams in corresponding wavelength ranges and form images, including:

[0050] Receive a first target light beam through the first imaging tube lens and converge it to a first camera to generate a first image;

[0051] The second target light beam is received through the second imaging tube lens and converged to the second camera to generate a second image;

[0052] The third target light beam is received by the third imaging tube lens and converged to the third camera to generate a third image.

[0053] In one possible implementation manner, after analyzing the defects on the surface of the object to be tested according to the image, the method further includes:

[0054] If there are multiple defects on the surface of the object to be tested, defect categories corresponding to the multiple defects are determined.

[0055] In one possible implementation manner, determining defect categories corresponding to the multiple defects includes:

[0056] The corresponding defect category is determined based on the images generated by the plurality of imaging units.

[0057] In one embodiment, after the light beam generator is turned on to generate the light beam, the method further comprises:

[0058] Focusing the light beam using a prism to obtain a focused light beam;

[0059] shaping the focused light beam into a shaped light beam using the shaping mirror;

[0060] Wherein, the reflective surface of the prism is coated with a UV-enhanced aluminum film with high reflectivity, and the transmissive surface of the prism is coated with a UV-enhanced aluminum film with high transmittance.

[0061] In one possible implementation manner, the shaped light beam is a line light beam or a surface light beam.

[0062] In one possible implementation, when the shaped light beam is a line light beam, the imaging unit uses a black and white line scan camera to generate an image based on the line light beam;

[0063] When the shaped light beam is a surface light beam, the imaging unit uses a black and white area array camera to generate an image based on the surface light beam.

[0064] According to a third aspect of the present application, an electronic device is provided, including:

[0065] at least one processor; and

[0066] a memory communicatively connected to the at least one processor; wherein,

[0067] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present application.

[0068] According to a fourth aspect of the present application, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to enable the computer to execute the method described in the present application.

[0069] The defect detection device and method of the present application, the present application shapes the light beam generated by the light beam generator through a shaping mirror, and then uses a beam splitter to vertically reflect the shaped light beam to obtain a first light beam, and then the first light beam is transmitted to the object to be tested through a microscope objective lens, and the object to be tested includes a crystal material to be tested; the object to be tested is irradiated and excited by the first light beam to generate emission light; the emission light is transmitted to the target device after passing through the beam splitter, and the target light beam is obtained after transmission or reflection processing by the target device. The imaging unit generates an image of the target light beam, and the processing device can determine whether there is a defect in the crystal material to be tested based on the image of the light beam. In the present application, the target device can receive emission light within different wavelength ranges. According to different defects, the wavelength of the emission light generated by the excitation of the crystal material to be tested is different, and the final generated image features are different, thereby determining the existence of defects and the type of defects. The present application can realize the detection of different defects and determine the type of defects.

[0070] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become readily understood. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, wherein:

[0072] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0073] Figure 1 A schematic diagram of the structure of a crystal material defect classification device according to an embodiment of the present application is shown;

[0074] Figure 2 This is a line laser morphology effect diagram provided in an embodiment of the present application;

[0075] Figure 3 This is a surface laser morphology effect diagram provided in an embodiment of the present application;

[0076] Figure 4 This is an imaging effect diagram of the channel where the first camera is located provided in an embodiment of the present application;

[0077] Figure 5 This is an imaging effect diagram of the channel where the third camera is located provided in the embodiment of the present application;

[0078] Figure 6 This is an imaging effect diagram of using a first laser generator to irradiate a portion of silicon carbide crystal material in this application;

[0079] Figure 7 This is an imaging effect diagram of using a second laser generator to irradiate a portion of silicon carbide crystal material in this application;

[0080] Figure 8 A schematic flow chart of a method for classifying crystal material defects according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0081] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0082] It can be understood that by using a laser of a specific wavelength as an excitation light source to provide photons of a certain energy, the ground state electrons in silicon carbide enter an excited state after absorbing these photons, releasing light of a larger wavelength, and then using a highly sensitive and high-resolution camera for photosensitivity and imaging. The light intensity after imaging is proportional to the non-equilibrium minority carrier concentration at the corresponding position. Since defects will cause the minority carrier concentration in the area to decrease, thereby weakening its fluorescence effect, it will appear as dark dots, lines or specific shapes after imaging, so photoluminescence can be used to determine whether the sample has defects. The present application uses the different wavelengths of emitted light generated by different defect lasers to determine whether there are defects and the type of defects, thereby achieving accurate detection and classification of defects in crystal materials.

[0083] A defect detection device and method provided by the present application are introduced below in conjunction with the accompanying drawings.

[0084] like Figure 1 As shown, the defect detection equipment provided by the present application includes the following components: a first laser generator 1, a second laser generator 2, a beam splitter prism 3, a shaping lens 4, a microscope objective 5, a third beam splitter 6, a first beam splitter 7, a second beam splitter 8, a reflector 9, a first imaging tube lens 10, a second imaging tube lens 11, a third imaging tube lens 12, a first camera 13, a second camera 14 and a third camera 15.

[0085] It can be understood that the first laser generator 1 and the second laser generator 2 can be used as beam generators. The wavelengths of the lasers emitted by the first laser generator 1 and the second laser generator 2 are different, so as to illuminate different defects and detect different defects. The shaping lens 4 can be used as a shaping lens, the third beam splitter 6 can be used as a beam splitter, the first beam splitter 7, the second beam splitter 8, and the reflector 9 can be used as target devices, the first camera 13, the second camera 14 and the third camera 15 can be used as imaging units, and the processing equipment in this application can use a computer. The surface of the object to be tested in this application is sprayed with a crystal material to be detected, and the crystal material to be detected in this application can be a silicon carbide crystal material.

[0086] The present application can control the first laser generator 1 or the second laser generator 2 to generate laser light, and the solution of the beam generator generating a beam can be realized by the first laser generator 1 or the second laser generator 2 generating laser light. The laser light generated by the first laser generator 1 or the second laser generator 2 is transmitted or reflected by the beam splitter prism 3, such as Figure 1As shown in the figure, if the first laser generator 1 generates a light beam, the light beam passes through the beam splitter prism 3 and then enters the shaping lens; if the second laser generator 2 generates a light beam or a light spot, the light beam or the light spot passes through the beam splitter prism 3 and then changes its direction vertically and enters the shaping lens. Then, the shaping lens 4 shapes the focused light beam. The function of the shaping lens 4 is to convert the incident point laser into a line laser or a surface laser. The line laser morphology is shown in FIG. Figure 2 As shown in the figure, the long side of the line laser can cover the imaging field of view. Figure 3 As shown, the long and short lengths of the surface laser can cover the imaging field of view. In order to be compatible with the shaping functions of the line laser and the surface laser, the technical solution of the present application designs two shaping lenses 4 of different specifications. The two shaping lenses 4 are installed on the stepper motor with the help of a lens fixing device, which is convenient for accurately switching the lens in the optical path. Using the shaping lens 4, the optical axis center of the shaping lens 4 is coaxial with the laser optical axis by controlling the displacement of the stepper motor, so that the laser shaping effect is the best. The line laser emitted from the shaping lens 4 enters the target device. After the line laser is reflected by 90° through the third beam splitter 6, it enters the microscope objective lens 5 at an angle perpendicular to the object to be measured, and is focused and transmitted to the surface of the object to be measured through the microscope objective lens 5. The microscope objective lens 5 provides different refractive indices for different incident light rays, so that the light rays will be focused to different degrees when passing through the objective lens. In this way, points farther away from the objective lens will be focused to different positions on the focal plane after passing through the objective lens, thereby forming a clear image. After the surface of the object to be tested is irradiated with laser, the position where the defect exists will be stimulated to emit light of different wavelengths. The emitted light is transmitted through the third beam splitter 6 and sequentially passes through the first beam splitter 7, the second beam splitter 8, and the reflector 9. The first beam splitter 7 and the second beam splitter 8 are respectively coated with reflection films and transmission films of different wavelength ranges, and the reflector 9 is coated with reflection films of different wavelength ranges. The defect position and the non-defect position can be accurately distinguished by a dichroic mirror of a suitable wavelength range. One is to intercept the wavelength of the defect position and block the wavelength of the non-defect position; the other is to block the wavelength of the defect position and intercept the wavelength of the non-defect position. Therefore, the second light beam can generate an image through the first imaging tube lens 10, the second imaging tube lens 11, the third imaging tube lens 12 and the corresponding first camera 13, the second camera 14 and the third camera 15 of the first beam splitter 7 or the second beam splitter 8 or the reflector 9, and determine whether the crystal material to be tested has defects based on the image.

[0087] The third beam splitter 6 is a flat beam splitter with a design wavelength of 300-1100nm. By precisely adjusting the angle of the third beam splitter 6, it is ensured that the energy distribution of the line laser spot transmitted to the surface of the object to be tested is uniform. The defect position and the non-defect position will produce a more obvious contrast, thereby determining whether the crystal material to be tested has defects.

[0088] In the present application, the first beam splitter 7 and the second beam splitter 8 are both flat dichroic mirrors. Reflection films and transmission films of different wavelength ranges are coated on the reflection surface and the transmission surface, respectively. Designing a dichroic mirror with a suitable wavelength range can accurately distinguish between defective positions and non-defective positions. One is to intercept the wavelength of the defective position and block the wavelength of the non-defective position; the other is to block the wavelength of the defective position and intercept the wavelength of the non-defective position. The defective position and the non-defective position will produce a more obvious contrast. The best method is selected according to the defect detection requirements.

[0089] Among them, the reflection wavelength range of the first beam splitter 7 is 400-490nm, and the transmission wavelength range is 500nm-1100nm. The reflected light passing through the first beam splitter 7 is amplified by a specified magnification after passing through the imaging first imaging tube lens 10, and finally converges to the rear focal plane of the imaging first imaging tube lens 10. The first camera 13 is an imaging unit, and its image sensor is coplanar with the rear focal plane of the imaging first imaging tube lens 10. The first camera 13 is a black and white line scan camera, and the black and white line scan camera is threadedly connected to the imaging first imaging tube lens 10, and the thread interface specifications are consistent.

[0090] The reflection wavelength range of the second beam splitter 8 is 500-590nm, and the transmission wavelength range is 600nm-1100nm. The reflected light of the second beam splitter 8 is amplified by a specified magnification after passing through the second imaging tube lens 11, and finally converges to the rear focal plane of the second imaging tube lens 11. The second camera 14 is an imaging unit, and its image sensor is coplanar with the rear focal plane of the second imaging tube lens 11. The second camera 14 is a black and white line scan camera, and the black and white line scan camera is threadedly connected to the second imaging tube lens 11, and the thread interface specifications are consistent.

[0091] The reflection wavelength range of the reflector 9 is 600nm-1100nm. The reflected light of the reflector 9 is amplified by a specified magnification after passing through the third imaging tube lens 12, and finally converges to the rear focal plane of the imaging third imaging tube lens 12. The second camera 14 is an imaging unit, and its image sensor is coplanar with the rear focal plane of the imaging third imaging tube lens 12. The third camera 15 is a black and white line scan camera, which is threadedly connected to the third imaging tube lens 12, and the thread interface specifications are consistent.

[0092] Since the three imaging channels where the first camera 13, the second camera 14, and the third camera 15 are located receive emitted light in different wavelength ranges respectively, the imaging of the defect in the three imaging channels also has its own characteristics. Specifically, taking a triangular stacking fault as an example, the imaging of a native triangular stacking fault in the channel where the first camera 13 is located is as follows: Figure 4 As shown, compared with the background, the stacking fault is bright. Figure 5 As shown in the figure, compared with the background, the stacking fault is dark. According to the wavelength range of different channels, the stacking fault defects can be accurately detected and secondary classified.

[0093] It should be noted that the first laser generator 1 emits a continuous, stable and well-collimated laser light as an illumination light source. The illumination light source is a specific single-wavelength laser. The fixing device of the laser generator 1 is a six-dimensional adjustment device, which can adjust the relative position of the six dimensions of x, y, z, rotation, horizontal, and pitch to ensure that the laser is collimated relative to the device reference plane. The laser light is transmitted through the dichroic prism 3 adjacent to the optical axis direction and enters the shaping lens 4. The reflection surface and transmission surface of the dichroic prism 3 are respectively coated with ultraviolet high-reflection film and ultraviolet high-transmittance film, which effectively improves the utilization rate of laser energy.

[0094] It is understandable that, as another embodiment, the first laser generator 2 can also be used as an illumination light source, and the host computer software can control the first laser generator 1 to be turned off and not participate in illumination. The laser generator 2 emits a continuous, stable and well-collimated laser light as an illumination light source. The illumination light source is a specific single wavelength laser. The fixing device of the laser generator 1 is a six-dimensional adjustment device, which can adjust the relative position of the six dimensions of x, y, z, rotation, horizontal and pitch to ensure that the laser is collimated relative to the device reference plane. Figure 6 As shown, for a portion of silicon carbide crystal materials, compared with the defect imaging using the first laser generator 1, the illumination spot emitted by the second laser generator 2 has a more obvious excitation effect on the defect, and the defect imaging contrast is higher, as shown in FIG. Figure 7 shown.

[0095] As another embodiment, the present application can also use a surface laser shaping lens, and the optical axis center of the shaping lens 4 is made coaxial with the laser optical axis by controlling the displacement of the stepper motor. The surface laser emitted from the shaping lens 4 enters the multi-channel imaging module. The first camera 13 serves as an imaging unit, and its image sensor is coplanar with the rear focal plane of the first imaging tube lens 10. The first camera 13 is a black and white array camera, and the black and white array camera is threadedly connected to the first imaging tube lens 10, and the thread interface specifications are consistent.

[0096] The second camera 14 serves as an imaging unit, and its image sensor is coplanar with the rear focal plane of the second imaging tube lens 11. The second camera 14 is a black-and-white area array camera, which is threadedly connected to the second imaging tube lens 11, and the thread interface specifications are consistent. Camera 14 serves as an imaging unit, and its image sensor is coplanar with the rear focal plane of the second imaging tube lens 12. Camera 15 is a black-and-white area array camera, which is threadedly connected to the second imaging tube lens 12, and the thread interface specifications are consistent. The embodiment of the present application uses a surface laser spot as the illumination spot, and then selects a surface array camera with a matching field of view as the imaging unit, thereby improving the imaging efficiency of the imaging system.

[0097] Based on the above embodiments, the defect detection device provided by the present application includes:

[0098] A beam generator (such as the first laser generator 1 or the second laser generator 2), used to generate a beam;

[0099] A shaping lens (such as a shaping lens 4), used to shape the light beam to obtain a shaped light beam;

[0100] A beam splitter (such as the third beam splitter 6), used for vertically reflecting the shaped light beam to obtain a first light beam;

[0101] A microscope objective lens 5, used for focusing the first light beam and irradiating it onto the object to be measured, and for amplifying the emission light generated by the object to be measured to obtain a second light beam;

[0102] A target device, used for performing transmission or reflection processing on the second light beam to obtain a target light beam;

[0103] An imaging unit (such as an imaging tube lens and a camera), used to generate an image of the crystal material to be detected based on the target light beam;

[0104] A processing device (such as a computer) is used to analyze the image of the crystal material to be detected generated based on the target light beam to obtain a detection result of whether the crystal material to be detected has defects;

[0105] Among them, the first light beam is focused on the object to be tested through the microscope objective lens 5, and the object to be tested includes a crystal material to be tested; the crystal material to be tested is excited by the first light beam to generate emission light, and the emission light is amplified by the microscope objective lens 5 to obtain a second light beam, and the second light beam is transmitted to the target device through the beam splitter, and the target light beam is obtained after transmission or reflection processing by the target device.

[0106] In one embodiment, the target device comprises: a first beam splitter 7, a second beam splitter 8 and a reflector 9;

[0107] The reflective surface of the first beam splitter 7 is coated with a reflective film of a first wavelength range, and the transmissive surface of the first beam splitter 7 is coated with a transmissive film of a second wavelength range;

[0108] The reflective surface of the second beam splitter 8 is coated with a reflective film in a third wavelength range, and the transmissive surface of the second beam splitter 8 is coated with a transmissive film in a fourth wavelength range;

[0109] The reflective surface of the reflector 9 is coated with a reflective film in a fourth wavelength range;

[0110] Wherein, the first wavelength range is smaller than the third wavelength range, the second wavelength range is smaller than the fourth wavelength range, and the third wavelength range is smaller than the fourth wavelength range;

[0111] In response to the wavelength of the emitted light, the first beam splitter 7 or the second beam splitter 8 or the reflector 9 corresponding to the wavelength range of the wavelength of the emitted light transmits or reflects the emitted light to obtain a target light beam.

[0112] Wherein, the beam splitter (such as the third beam splitter 6) is located between the microscope objective 5 and the first beam splitter 7;

[0113] The first beam splitter 7, the second beam splitter 8 and the reflector 9 are arranged in sequence.

[0114] The imaging unit comprises: a first imaging tube lens 10, a second imaging tube lens 11, a third imaging tube lens 12, a first camera 13, a second camera 14 and a third camera 15, wherein the first imaging tube lens 10 is threadedly connected to the first camera 13, the second imaging tube lens 11 is threadedly connected to the second camera 14, and the third imaging tube lens 12 is threadedly connected to the third camera 15;

[0115] The first imaging tube lens 10 is used to amplify the first target light beam emitted by the first beam splitter 7 and converge it to the first camera 13, and the first camera 13 generates a first image;

[0116] The second imaging tube lens 11 is used to amplify the second target light beam emitted by the second beam splitter 8 and converge it to the second camera 14, and the second camera 14 generates a second image;

[0117] The third imaging tube lens 12 is used to amplify the third target light beam reflected by the reflector 9 and converge it to the third camera 15, and the third camera 15 generates a third image.

[0118] It is understandable that the wavelength ranges of the first target beam, the second target beam, and the third target beam are different, and the emitted light of different wavelengths will be emitted to the corresponding spectroscopes. For example, assuming that the defect position emits 550nm light, it is transmitted through the first spectroscope 7 without reflection, and then reflected and not transmitted by the second spectroscope 8, then it is amplified by the second imaging tube lens 11 and converged to the second camera 14, and the second camera 14 generates a second image, which no longer reaches the reflector 9.

[0119] In some embodiments, the processing device is further used to obtain defect categories corresponding to multiple defects when the crystal material to be detected has multiple defects.

[0120] Because different defects have different wavelengths, the final images obtained are different. The corresponding defect type can be determined by the image corresponding to the wavelength. Since the three imaging channels receive the emitted light in different wavelength ranges, the defects in the three imaging channels show their own characteristics. The defects can be accurately classified according to the wavelength ranges of different channels. For example, a triangular layer defect, such as Figure 4and Figure 5 As shown, the different depths of the triangular layers cause different wavelengths of emitted light, resulting in different imaging.

[0121] In some embodiments, the device further comprises:

[0122] A prism (such as a beam splitter prism 3), used to focus the light beam to obtain a focused light beam;

[0123] The shaping mirror is used to shape the focused light beam into a shaped light beam;

[0124] Wherein, the reflective surface of the prism is coated with a UV-enhanced aluminum film with high reflectivity, and the transmissive surface of the prism is coated with a UV-enhanced aluminum film with high transmittance.

[0125] In some embodiments, the orthopedic lens comprises:

[0126] A first shaping lens, a second shaping lens and a stepping motor, wherein the first shaping lens and the second shaping lens are mounted on the stepping motor;

[0127] The stepper motor is used to receive a control instruction to move so as to make the optical axis center of the first shaping lens coaxial with the optical axis of the light beam or the optical axis center of the second shaping lens coaxial with the optical axis of the light beam.

[0128] The first shaping lens may be a line laser shaping lens, which functions to transform the incident point laser into a line laser; the second shaping lens may be a surface laser shaping lens, which functions to transform the incident point laser into a surface laser.

[0129] In some embodiments, the beam generator includes a plurality of laser generators;

[0130] The plurality of laser generators can emit light beams in different wavelength ranges.

[0131] In some embodiments, when the shaping mirror adopts a line laser shaping lens, the first camera, the second camera, and the third camera adopt black and white line scan cameras;

[0132] When the shaping mirror adopts a surface laser shaping lens, the first camera, the second camera and the third camera adopt black and white area array cameras.

[0133] In the present application, both the first beam splitter and the second beam splitter are flat-plate dichroic mirrors.

[0134] The composition and structure of the crystal material defect classification equipment can be found in the above-mentioned related descriptions and related drawings, and the repeated parts will not be repeated.

[0135] like Figure 8 As shown, an embodiment of the present application provides a method for classifying crystal material defects, the method comprising:

[0136] S801, placing the object to be tested within the focusing range of the microscope objective lens; wherein the surface of the object to be tested is a crystal material to be tested;

[0137] S802, turning on the beam generator to generate a beam, the beam is shaped by the shaping mirror to form a shaped beam, the shaped beam is reflected by the beam splitter to form a first beam, the light of the first beam is focused on the surface of the object to be measured by the microscope objective lens, and only when there is a defect on the surface of the object to be measured, the defect is irradiated by the first beam to excite and form emission light;

[0138] S803, separating target light beams with different wavelength ranges from the emitted light through a target device;

[0139] S804, a plurality of imaging units respectively receive target light beams in corresponding wavelength ranges and form images;

[0140] S805: Analyze defects on the surface of the object to be tested according to the image.

[0141] In some embodiments, the target device includes: a first beam splitter, a second beam splitter and a reflector; and separating target light beams with different wavelength ranges from the emitted light through the target device includes:

[0142] intercepting wavelengths in a first wavelength range from the emitted light and transmitting wavelengths in a second wavelength range through a first beam splitter to obtain a first target light beam;

[0143] intercepting wavelengths in a third wavelength range from the emitted light and transmitting wavelengths in a fourth wavelength range through a second beam splitter to obtain a second target light beam;

[0144] intercepting wavelengths in a fourth wavelength range from the emitted light by a reflector to obtain a third target light beam;

[0145] Among them, the first wavelength range is smaller than the third wavelength range, the second wavelength range is smaller than the fourth wavelength range, and the third wavelength range is smaller than the fourth wavelength range.

[0146] In some embodiments, the imaging unit includes: a first imaging tube lens, a second imaging tube lens, a third imaging tube lens, a first camera, a second camera, and a third camera. The plurality of imaging units respectively receive target light beams in corresponding wavelength ranges and form images, including:

[0147] Receive a first target light beam through the first imaging tube lens and converge it to a first camera to generate a first image;

[0148] The second target light beam is received through the second imaging tube lens and converged to the second camera to generate a second image;

[0149] The third target light beam is received by the third imaging tube lens and converged to the third camera to generate a third image.

[0150] In some embodiments, after analyzing the defects on the surface of the object to be tested according to the image, the method further includes:

[0151] If there are multiple defects on the surface of the object to be tested, defect categories corresponding to the multiple defects are determined.

[0152] In some embodiments, determining defect categories corresponding to the multiple defects includes:

[0153] The corresponding defect category is determined based on the images generated by the plurality of imaging units.

[0154] In some embodiments, after the light beam generator is turned on to generate the light beam, the method further comprises:

[0155] Focusing the light beam using a prism to obtain a focused light beam;

[0156] shaping the focused light beam into a shaped light beam using the shaping mirror;

[0157] Wherein, the reflective surface of the prism is coated with a UV-enhanced aluminum film with high reflectivity, and the transmissive surface of the prism is coated with a UV-enhanced aluminum film with high transmittance.

[0158] In some embodiments, the shaped light beam is a line light beam or a surface light beam.

[0159] In some embodiments, when the shaped light beam is a line light beam, the imaging unit uses a black and white line scan camera to generate an image based on the line light beam;

[0160] When the shaped light beam is a surface light beam, the imaging unit uses a black and white area array camera to generate an image based on the surface light beam.

[0161] According to an embodiment of the present application, the present application also provides an electronic device and a readable storage medium.

[0162] It can be understood that the method embodiment provided above corresponds to the device embodiment described above, and the corresponding specific contents can be referenced to each other and will not be repeated here.

[0163] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage and optical storage, etc.) that contain computer-usable program code.

[0164] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0165] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction method, which is implemented in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0166] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0167] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution disclosed in this application can be achieved, and this document is not limited here.

[0168] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0169] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A defect detection device, characterized in that: The device comprises: A beam generator, used for generating a beam; A shaping mirror, used for shaping the light beam to obtain a shaped light beam; A beam splitter, used for vertically reflecting the shaped light beam to obtain a first light beam; A microscope objective lens, used for focusing the first light beam and irradiating it onto the object to be measured, and for amplifying the emission light generated by the object to be measured to obtain a second light beam; A target device, used for performing transmission or reflection processing on the second light beam to obtain a target light beam; An imaging unit, configured to generate an image of the crystal material to be detected based on the target light beam; A processing device, used for analyzing an image of the crystal material to be detected generated based on the target light beam, and obtaining a detection result of whether the crystal material to be detected has defects; Among them, the first light beam is focused on the object to be tested through the microscope objective lens, and the object to be tested includes a crystal material to be tested; the crystal material to be tested is irradiated and excited by the first light beam to generate emission light, and the emission light is amplified by the microscope objective lens to obtain a second light beam, and the second light beam is transmitted to the target device through the beam splitter, and the target light beam is obtained after transmission or reflection processing by the target device.

2. The device according to claim 1, characterized in that The target device comprises: a first beam splitter, a second beam splitter and a reflector; The reflective surface of the first beam splitter is coated with a reflective film of a first wavelength range, and the transmissive surface of the first beam splitter is coated with a transmissive film of a second wavelength range; The reflective surface of the second beam splitter is coated with a reflective film in a third wavelength range, and the transmissive surface of the second beam splitter is coated with a transmissive film in a fourth wavelength range; The reflective surface of the reflector is coated with a reflective film in a fourth wavelength range; Wherein, the first wavelength range is smaller than the third wavelength range, the second wavelength range is smaller than the fourth wavelength range, and the third wavelength range is smaller than the fourth wavelength range; In response to the wavelength of the emitted light, the first beam splitter or the second beam splitter or the reflector in the wavelength range corresponding to the wavelength of the emitted light transmits or reflects the emitted light to obtain a target light beam.

3. The device according to claim 2, characterized in that The beam splitter is located between the microscope objective and the first beam splitter; The first beam splitter, the second beam splitter and the reflector are arranged in sequence.

4. The device according to claim 2, characterized in that The imaging unit comprises: a first imaging tube lens, a second imaging tube lens, a third imaging tube lens, a first camera, a second camera and a third camera, wherein the first imaging tube lens is threadedly connected to the first camera, the second imaging tube lens is threadedly connected to the second camera, and the third imaging tube lens is threadedly connected to the third camera; The first imaging tube lens is used to amplify the first target light beam emitted by the first beam splitter and converge it to the first camera, and the first camera generates a first image; The second imaging tube lens is used to amplify the second target light beam emitted by the second beam splitter and converge it to the second camera, and the second camera generates a second image; The third imaging tube lens is used to amplify the third target light beam reflected by the reflector and converge it to the third camera, and the third camera generates a third image.

5. The device according to claim 1, characterized in that The processing device is also used to obtain defect categories corresponding to multiple defects when the crystal material to be detected has multiple defects.

6. The device according to claim 1, characterized in that The device also includes: A prism, used to focus the light beam to obtain a focused light beam; The shaping mirror is used to shape the focused light beam into a shaped light beam; Wherein, the reflective surface of the prism is coated with a UV-enhanced aluminum film with high reflectivity, and the transmissive surface of the prism is coated with a UV-enhanced aluminum film with high transmittance.

7. The device according to claim 1, characterized in that The orthopedic mirror comprises: A first shaping lens, a second shaping lens and a stepping motor, wherein the first shaping lens and the second shaping lens are mounted on the stepping motor; The stepper motor is used to receive a control instruction to move so as to make the optical axis center of the first shaping lens coaxial with the optical axis of the light beam or the optical axis center of the second shaping lens coaxial with the optical axis of the light beam.

8. A method for classifying defects in crystal materials, characterized in that: The method comprises: Placing the object to be tested within the focusing range of the microscope objective lens; wherein the surface of the object to be tested is a crystal material to be tested; Turn on the beam generator to generate a beam, the beam is shaped by the shaping mirror to form a shaped beam, the shaped beam is reflected by the beam splitter to form a first beam, the light of the first beam is focused on the surface of the object to be measured by the microscope objective lens, and only when there is a defect on the surface of the object to be measured, the defect is irradiated by the first beam to excite and form emission light; Separating target light beams having different wavelength ranges from the emitted light by a target device; The plurality of imaging units respectively receive target light beams in corresponding wavelength ranges and form images; Analyze the defects on the surface of the object to be tested according to the image.

9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 1-7.

Images