Laser radar and mobile device

Abstract

The embodiment of the invention discloses a laser radar and a mobile device, the laser radar comprises a housing, a transmit-receive board and a power panel, the housing forms an accommodating cavity, the transmit-receive board is located in the accommodating cavity, the power panel is located in the accommodating cavity, the power panel is electrically connected with the transmit-receive board, the power panel is located at the side of the transmit-receive board, and the transmit-receive board is electrically connected with the power panel. An included angle is formed between the power supply board and the transceiving board. The power panel is located on the side of the transceiver board and forms the included angle with the transceiver board, and the power panel is located behind the transceiver board and is stacked with the transceiver board in the related technology, so that the thickness of the laser radar can be reduced, the transceiver board can at least correspond to the rear board of the shell, the power panel at least corresponds to the side board of the shell, and the power panel is arranged on the side board of the shell. The heat of the transceiving board and the power board can be dissipated through different boards of the shell, the heat dissipation speed is increased, and the influence of temperature on the laser radar is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of laser detection equipment, and in particular to a laser radar and a movable device. Background Art

[0002] LiDAR is a radar system that emits laser beams to detect target characteristics such as position and speed. Its working principle is to first emit detection light to the target, and then compare the received echo light reflected from the target with the local oscillator light. After appropriate processing, relevant information about the target can be obtained, such as target distance, direction, altitude, speed, attitude, and even shape parameters.

[0003] In order to achieve a longer distance measurement capability and obtain a higher point cloud scanning frame rate, the transmitting sensor of the transmitting board in the laser radar is usually designed to operate according to the maximum transmission power and frequency, so its heat power is relatively large. At the same time, the receiving sensor and power board of the receiving board of the attached laser radar will also increase the output power to cooperate with the transmitting sensor to meet the ranging needs of the whole machine. However, during the operation of the laser radar, each device continues to emit heat. If the heat cannot be exported in time, as the laser radar heats up, the device resistance and current increase, the efficiency will decrease, and in severe cases, it may burn out. Summary of the invention

[0004] The embodiments of the present application provide a laser radar and a movable device, which are used to improve the problem in the related art that as the temperature of the laser radar increases, the device resistance and current increase, the efficiency decreases, and in severe cases, the laser radar may burn out.

[0005] In a first aspect, an embodiment of the present application provides a laser radar, including:

[0006] A housing, wherein the housing is formed with a receiving cavity;

[0007] A transceiver board, the transceiver board is located in the accommodating cavity;

[0008] A power board, the power board is located in the accommodating cavity, the power board is electrically connected to the transceiver board, the power board is located on the side of the transceiver board, and the power board and the transceiver board are arranged at an angle.

[0009] In a second aspect, an embodiment of the present application provides a movable device, comprising a device body and the above-mentioned laser radar, wherein the device body is connected to the laser radar.

[0010] In the laser radar and movable device of the present application, the power board is located on the side of the transceiver board and is set at an angle with the transceiver board. Compared with the related art in which the power board is located behind the transceiver board and is stacked with the transceiver board, the thickness of the laser radar can be reduced, and the transceiver board can at least correspond to the rear plate of the shell, and the power board can at least correspond to the side plate of the shell. In this way, the heat of the transceiver board and the power board can be dissipated through different plates of the shell, making full use of the surface heat dissipation of the shell, accelerating the heat dissipation rate, making the heat dissipation of the shell more uniform, and reducing the impact of temperature on the laser radar. The power board is located on the side of the transceiver board and is set at an angle with the transceiver board. Compared with the power board being located on the side of the transceiver board and being set parallel to the transceiver board, the arrangement of the power board and the transceiver board can be made more compact, which is conducive to reducing the size of the laser radar. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0012] Figure 1 is a schematic diagram of the structure of a laser radar provided in the first embodiment of the present application;

[0013] Figure 2 yes Figure 1 A schematic diagram of an explosion structure from a perspective of a laser radar is shown;

[0014] Figure 3 yes Figure 1 A schematic diagram of the explosion structure from another perspective of the laser radar is shown;

[0015] Figure 4 yes Figure 1 A schematic diagram of the cross-sectional structure of the laser radar in one direction is shown;

[0016] Figure 5 yes Figure 1 A schematic diagram of the local structure of the laser radar shown;

[0017] Figure 6 yes Figure 1 A schematic diagram of the cross-sectional structure of the laser radar shown in another direction;

[0018] Figure 7 It is a schematic diagram of the expanded connection structure of the transmitting board, the receiving board and the power board in the laser radar provided in the second embodiment of the present application;

[0019] Figure 8 yes Figure 7The schematic diagram of the connection structure of the transmitting board and the receiving board when assembled in the laser radar is shown;

[0020] Fig. 9 It is a schematic diagram of the exploded structure of the cover plate, optical element, transmitting plate and receiving plate in the laser radar provided in the third embodiment of the present application;

[0021] Fig.10 yes Fig. 9 A schematic diagram of a partial cross-sectional structure of a laser radar is shown;

[0022] Fig.11 yes Fig. 9 A schematic diagram of the local structure of the laser radar shown;

[0023] Fig.12 is a schematic diagram of the structure of a mobile device provided in an embodiment of the present application;

[0024] Fig.13 It is a schematic diagram of the cross-sectional structure of the laser radar provided in the fourth embodiment of the present application.

[0025] Description of reference numerals:

[0026] 1. LiDAR; 2. Mobile device; 3. Device body;

[0027] 10. Shell; 11. Main shell; 111. Accommodating cavity; 1111. First cavity; 1112. Second cavity; 1113. Third cavity; 1114. First sub-opening; 1115. Second sub-opening; 112. First opening; 113. Second opening; 12. Side plate; 13. Cover plate; 14. First fixing column; 141. First adhesive layer; 15. Second fixing column; 151. Second adhesive layer; 16. Second boss; 17. Third boss; 18. Heat dissipation teeth;

[0028] 20, transceiver board; 21, transmitter board; 211, transmitter; 212, first mounting hole; 213, first heat dissipation hole; 214, first side wall; 22, receiver board; 221, receiver; 222, second mounting hole; 223, second heat dissipation hole; 224, second side wall; 23, public base board;

[0029] 30. Power board;

[0030] 40. Connectors;

[0031] 51, flexible circuit board; 511, first bending portion; 5111, first section; 512, second bending portion; 5121, second section; 513, first structural portion; 52, flexible flat cable; 53, first positioning member; 531, first positioning portion; 54, second positioning member; 541, second positioning portion;

[0032] 60. Optical element; 61. Transmitting lens; 611. Transmitting lens barrel; 612. Transmitting lens; 62. Receiving lens; 621. Receiving lens barrel; 622. Receiving lens. DETAILED DESCRIPTION

[0033] In order to make the objectives, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0034] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0035] Embodiment 1

[0036] First, see Figure 1 to Figure 2 An embodiment of the present application provides a laser radar 1, which includes a shell 10, a transceiver board 20 and a power board 30.

[0037] See also Figures 2 to 5 The housing 10 is formed with a housing cavity 111, the power board 30 and the transceiver board 20 are both located in the housing cavity 111, the power board 30 is electrically connected to the transceiver board 20, the power board 30 is located on the side of the transceiver board 20, and the power board 30 and the transceiver board 20 are arranged at an angle.

[0038] Among them, the orientation of the side of the transceiver board 20 used for receiving and transmitting optical signals is the front of the transceiver board 20, the orientation of the side of the transceiver board 20 opposite to the side for receiving and transmitting optical signals is the rear of the transceiver board 20, and the orientation of the transceiver board 20 between the front and the rear is the side of the transceiver board 20.

[0039] In the embodiment of the present application, the power board 30 is located on the side of the transceiver board 20 and is arranged at an angle with the transceiver board 20. Compared with the related art in which the power board is located behind the transceiver board and is stacked with the transceiver board, the thickness of the laser radar 1 can be reduced, and the transceiver board 20 can be made to correspond to at least the rear plate of the shell 10, and the power board 30 can be made to correspond to at least the side plate of the shell 10. In this way, the heat of the transceiver board 20 and the power board 30 can be dissipated through different plates of the shell 10, making full use of the surface heat dissipation of the shell 10, accelerating the heat dissipation rate, making the heat dissipation of the shell 10 more uniform, and reducing the impact of temperature on the laser radar 1. The power board 30 is located on the side of the transceiver board 20 and is arranged at an angle with the transceiver board 20. Compared with the power board 30 being located on the side of the transceiver board 20 and being arranged parallel to the transceiver board 20, the arrangement of the power board 30 and the transceiver board 20 can be made more compact, which is conducive to reducing the size of the laser radar 1.

[0040] The power board 30 and the transceiver board 20 are arranged at an angle such that the angle between the power board 30 and the transceiver board 20 is greater than 0° and less than 180°. The specific value of the angle between the power board 30 and the transceiver board 20 can be flexibly designed in combination with actual needs; for example, the angle between the power board 30 and the transceiver board 20 can be 45°, 60°, 90°, 135°, 150°, etc. In the embodiment of the present application, the angle between the power board 30 and the transceiver board 20 is approximately 90°, that is, the power board 30 and the transceiver board 20 are arranged approximately vertically to optimize the space utilization in the housing 10.

[0041] It can be understood that the transceiver board 20 can have multiple sides; for example, the transceiver board 20 has a top side, a bottom side, a left side, a right side, and the like. Among them, the top side, the bottom side, the left side, and the right side are determined by reference to the position of the side of the transceiver board 20 used for receiving and transmitting light signals facing the observer when the laser radar 1 is in use. Specifically, when the laser radar 1 is in use, if the side of the transceiver board 20 used for receiving and transmitting light signals faces the observer, at this time, the top side of the transceiver board 20 corresponds to its top side, the bottom side of the transceiver board 20 corresponds to its bottom side, the left side of the transceiver board 20 corresponds to its left side, and the right side of the transceiver board 20 corresponds to its right side. The above-mentioned power board 30 is located on the side of the transceiver board 20, which can be: the power board 30 is located at least one of the top side, bottom side, left side, and right side of the transceiver board 20.

[0042] In the embodiment of the present application, the power board 30 is located on the top side of the transceiver board 20. In this way, the heat on the power board 30 can be dissipated through the top side plate of the shell 10, making full use of the surface of the shell 10 for heat dissipation and reducing the thickness of the laser radar 1.

[0043] See also Figures 2 to 4 The housing 10 includes a main housing 11 and a side panel 12. The main housing 11 is provided with a first opening 112 communicating with the accommodating cavity 111. The side panel 12 covers the first opening 112, and the power board 30 is arranged opposite to the side panel 12. Through the above design, when assembling the laser radar 1, the power board 30 can be assembled in the accommodating cavity 111 through the first opening 112, which is convenient for assembly.

[0044] Among them, the power board 30 can be connected to the main shell 11 and / or the side panel 12. That is, the power board 30 can be connected to the main shell 11 in the main shell 11 and the side panel 12, or it can be connected to the side panel 12 in the main shell 11 and the side panel 12, or it can be connected to the main shell 11 and the side panel 12. The connection method of the power board 30 is various and can be flexibly designed according to actual needs. If the power board 30 is connected to the side panel 12, during assembly, the power board 30 and the side panel 12 can be assembled first, and then the power board 30 and the side panel 12 are arranged together at the first opening 112 and assembled with the main shell 11. In this way, the power board 30 is less constrained by the internal components of the laser radar 1 during assembly, and the assembly is more convenient. If the power board 30 is connected to the main shell 11 and the side panel 12, the installation stability between the power board 30 and the shell 10 can be improved.

[0045] It should be noted that if the power board 30 and the side panel 12 are disposed together at the first opening 112 and assembled with the main housing 11, before the power board 30 and the side panel 12 are disposed together at the first opening 112, the power board 30 can be electrically connected to the transceiver board 20 and the like in the accommodating cavity 111 via a flexible electrical connector (e.g., a flexible circuit board, a flexible flat cable, etc.). The flexible electrical connector can be bent and deformed, and is not likely to interfere with the power board 30 and the side panel 12 being disposed together at the first opening 112.

[0046] The side panel 12 may be connected to the main housing 11, or the side panel 12 may be connected to the main housing 11 via a power panel 30 or the like. If the side panel 12 is connected to the main housing 11, the side panel 12 and the main housing 11 may be fixedly connected or detachably connected. In the embodiment of the present application, the side panel 12 and the main housing 11 are detachably connected, so that the side panel 12 and the main housing 11 can be disassembled and assembled, which is conducive to the maintenance and replacement of the internal components of the housing 10.

[0047] The side panel 12 and the main housing 11 can be sealed and connected to improve the sealing performance of the laser radar 1; for example, a sealing ring can be provided between the side panel 12 and the main housing 11 and connected by screws or the like. The sealing ring can be an integrally formed structure with the side panel 12 or the main housing 11 to simplify the assembly process and improve the connection reliability between the sealing ring and the integrally formed side panel 12 or the main housing 11. The sealing ring and the side panel 12 or the main housing 11 are an integrally formed structure, which can be achieved by processes such as two-color injection molding. The sealing ring can also be connected to the side panel 12 or the main housing 11 by dispensing or welding. The sealing ring can be a silicone ring, and the sealing ring can also be replaced by a sealant, etc. The sealant can be formed by dispensing.

[0048] It should be noted that, in addition to being independently formed and then assembled, the main shell 11 and the side panels 12 can also be an integrated structure to simplify the assembly process of the laser radar 1.

[0049] The power board 30 is arranged opposite to the side panel 12, and the heat on the power board 30 can be dissipated through the side panel 12. In order to improve the heat transfer efficiency between the power board 30 and the side panel 12, a heat conductor can be connected between the power board 30 and the side panel 12. Optionally, at least part of the electronic components on the power board 30 can be in contact with the side panel 12 through the heat conductor, so that the heat generated by at least part of the electronic components can be directly transferred to the side panel 12 through the heat conductor, shortening the heat transfer path and helping to enhance the heat dissipation effect. Among them, the heat conductor can be any device with thermal conductivity such as thermal conductive gel, and the thermal conductive gel can achieve heat transfer with a high thermal conductivity coefficient; and the thermal conductive gel has good elasticity and compression deformation after curing, and will not generate large thermal stress, which can avoid the position change of the power board 30 caused by thermal stress deformation.

[0050] Optionally, the side plate 12 may be formed with a first boss (not shown in the figure) at the electronic component on the power board 30 that needs heat conduction, and the first boss is in contact with the corresponding electronic component via a heat conductive member. The provision of the first boss facilitates contact with the electronic component on the power board 30 that needs heat conduction, without the need for the entire side plate 12 to be in contact with the power board 30. During actual assembly, a heat conductive member may be first provided on the electronic component on the power board 30 that needs heat conduction and / or a heat conductive member may be provided on the first boss, so that when the power board 30 is in contact with the side plate 12, the electronic component on the power board 30 that needs heat conduction is in contact with the corresponding first boss via the heat conductive member.

[0051] It should be noted that, in the power board 30 , the electronic component in contact with the side plate 12 through the heat conductive member may be an electronic component that is prone to generate heat, or may be any electronic component, and there is no limitation to this.

[0052] See also Figure 2 , Figure 3 and Figure 5 The housing 10 further includes a cover plate 13, the cover plate 13 and the side plate 12 are located on adjacent sides of the housing 10, and the transceiver board 20 is arranged opposite to the cover plate 13. The transceiver board 20 and the power board 30 are arranged opposite to the cover plate 13 and the side plate 12 on the adjacent sides of the housing 10, respectively, so that the arrangement of the transceiver board 20 and the power board 30 in the housing 10 can be more regular, thereby improving the space utilization rate in the housing 10.

[0053] The two boards can be arranged relatively to each other in parallel; for example, the power board 30 and the side board 12 can be arranged relatively to each other in parallel; for another example, the transceiver board 20 and the cover board 13 can be arranged relatively to each other in parallel. It should be noted that the power board 30 and the side board 12 can also be arranged relatively to each other in an inclined manner, and the transceiver board 20 and the cover board 13 can also be arranged relatively to each other in an inclined manner, and this is not limited.

[0054] See also Figure 2 and Figure 3 The main housing 11 may be provided with a second opening 113 communicating with the accommodating cavity 111, and the cover plate 13 covers the second opening 113. With the above design, when assembling the laser radar 1, the transceiver board 20 may be assembled in the accommodating cavity 111 through the second opening 113, which is convenient for assembly.

[0055] Among them, the transceiver board 20 can be connected to the main shell 11 and / or the cover plate 13. That is, the transceiver board 20 can connect the main shell 11 in the main shell 11 and the cover plate 13, can also connect the main shell 11 and the cover plate 13 in the cover plate 13, and can also connect the main shell 11 and the cover plate 13. The connection method of the transceiver board 20 is various and can be flexibly designed in combination with actual needs. If the transceiver board 20 is connected to the cover plate 13, during assembly, the transceiver board 20 and the cover plate 13 can be assembled first, and then the transceiver board 20 and the cover plate 13 are arranged together at the second opening 113 and assembled with the main shell 11. In this way, the transceiver board 20 is less constrained by the internal components of the laser radar 1 during assembly, and the assembly is more convenient. If the transceiver board 20 is connected to the main shell 11 and the cover plate 13, the installation stability between the transceiver board 20 and the shell 10 can be improved.

[0056] It should be noted that if the transceiver board 20 and the cover plate 13 are disposed together at the second opening 113 and assembled with the main housing 11, before the transceiver board 20 and the cover plate 13 are disposed together at the second opening 113, the transceiver board 20 can be electrically connected to other circuit boards (such as the power board 30) that need to be installed in the accommodating cavity 111 through flexible electrical connectors (such as flexible circuit boards, flexible flat cables, etc.). The flexible electrical connectors can be bent and deformed, and are not likely to interfere with the transceiver board 20 and the cover plate 13 being disposed together at the second opening 113.

[0057] The cover plate 13 may be connected to the main housing 11, or the cover plate 13 may be connected to the main housing 11 via the transceiver board 20, etc. If the cover plate 13 is connected to the main housing 11, the cover plate 13 and the main housing 11 may be fixedly connected or detachably connected. In the embodiment of the present application, the cover plate 13 and the main housing 11 are detachably connected, so that the cover plate 13 and the main housing 11 can be disassembled and assembled, which is conducive to the maintenance and replacement of the internal components of the housing 10.

[0058] The cover plate 13 and the main housing 11 can be sealed and connected to improve the sealing performance of the laser radar 1; for example, a sealing ring can be provided between the cover plate 13 and the main housing 11 and connected by screws or the like. The sealing ring can be an integrally formed structure with the cover plate 13 or the main housing 11 to simplify the assembly process and improve the connection reliability between the sealing ring and the integrally formed cover plate 13 or the main housing 11. The sealing ring and the cover plate 13 or the main housing 11 are an integrally formed structure, which can be achieved by processes such as two-color injection molding. The sealing ring can also be connected to the cover plate 13 or the main housing 11 by dispensing or welding. The sealing ring can be a silicone ring, and the sealing ring can also be replaced by a sealant, etc. The sealant can be formed by dispensing.

[0059] It should be noted that, in addition to being independently formed and then assembled, the main shell 11 and the cover plate 13 can also be an integrated structure to simplify the assembly process of the laser radar 1.

[0060] In an exemplary solution, the cover plate 13 may be light-transmissive, and the cover plate 13 may be used to pass the transmitted light signal and the echo light signal, that is, the cover plate 13 may serve as a window of the laser radar 1. In another exemplary solution, the cover plate 13 may be provided with a window for passing the transmitted light signal and the echo light signal, and in this case, the cover plate 13 is not light-transmissive.

[0061] See also Figures 4 to 6 The transceiver board 20 may include a transmitting board 21 and a receiving board 22. The transmitting board 21 is provided with a transmitter 211, and the transmitter 211 is used to send a transmission light signal. The receiving board 22 is provided with a receiver 221, and the receiver 221 is used to receive an echo light signal, and the echo light signal is formed by at least a part of the transmission light signal being reflected by the target object. Along the direction perpendicular to the board surface of the transmitting board 21, the receiving board 22 is spaced apart from the transmitting board 21, and the receiving board 22 and the transmitting board 21 are located on the same side of the power board 30. That is, the transmitting board 21 and the receiving board 22 are separately provided, so that the arrangement of the transmitting board 21 and the receiving board 22 in the housing 10 is more flexible.

[0062] It should be noted that when the transceiver board 20 includes the transmitting board 21 and the receiving board 22, the power board 30 being located on the side of the transceiver board 20 can be understood as: the power board 30 is located on the side of the transmitting board 21 and the receiving board 22 as a whole; that is, the transmitting board 21 and the receiving board 22 are considered as a whole. When the transceiver board 20 includes the transmitting board 21 and the receiving board 22, the side of the transmitting board 21 that emits the transmission light signal and the side of the receiving board 22 that receives the echo light signal face the same side.

[0063] The above-mentioned transceiver board 20 is electrically connected to the power board 30. The transmitting board 21 is electrically connected to the power board 30 and the receiving board 22 is electrically connected to the power board 30. The transmitting board 21 is electrically connected to the receiving board 22 and the receiving board 22 is electrically connected to the power board 30. The transmitting board 21 is electrically connected to the receiving board 22 and the receiving board 22 is electrically connected to the power board 30. The transmitting board 21 is electrically connected to the receiving board 22 and the transmitting board 21 is electrically connected to the power board 30. The electrical connection between any two of the transmitting board 21, the receiving board 22 and the power board 30 may be an electrical connection via a flexible electrical connector (such as a flexible circuit board, a flexible flat cable, etc.), which is not limited thereto.

[0064] In the present application, see Figure 7 , the transmitting board 21 is electrically connected to the receiving board 22, and the receiving board 22 is electrically connected to the power board 30. That is, among the transmitting board 21 and the receiving board 22, only the receiving board 22 is electrically connected to the power board 30. Compared with the case where both the transmitting board 21 and the receiving board 22 are electrically connected to the power board 30, the influence of the power board 30 fluctuation (such as assembly fluctuation, etc.) on the assembly position of the transmitting board 21 and the receiving board 22 can be reduced, and the assembly stability of the transmitting board 21 and the receiving board 22 can be improved.

[0065] Specifically, the transmitting board 21 and the receiving board 22 can be electrically connected via the flexible circuit board 51. The transmitting board 21, the receiving board 22 and the flexible circuit board 51 can be an integrated structure, which can achieve high integration of the whole machine, simplify overall material control, facilitate production, assembly and reduce costs.

[0066] Specifically, the receiving board 22 and the power board 30 can be electrically connected via the flexible flat cable 52, and at least one of the receiving board 22 and the power board 30 can be an integrally formed structure with the flexible flat cable 52, and the other of the receiving board 22 and the power board 30 can be provided with an electrical socket (not shown in the figure), and the flexible flat cable 52 is electrically connected to the electrical socket. That is, the power board 30 is independently formed relative to the receiving board 22, and the power board 30 can be electrically connected to the receiving board 22 after the transmitting board 21 and the receiving board 22 are assembled in the housing 10, thereby reducing the impact of the power board 30 on the assembly of the transmitting board 21 and the receiving board 22 in the housing 10.

[0067] The above-mentioned transceiver board 20 and the power board 30 are arranged at an angle, and the transmitting board 21 and the power board 30 are arranged at an angle, and the receiving board 22 and the power board 30 are arranged at an angle. Among them, the transmitting board 21 and the receiving board 22 can be arranged substantially in parallel, which is not limited.

[0068] See again Figure 2, the transmitting board 21, the receiving board 22 and the power board 30 can be roughly arranged in the receiving chamber 111, specifically, the receiving chamber 111 includes a first chamber 1111, a second chamber 1112 and a third chamber 1113, at least part of the transmitting board 21 is located in the first chamber 1111, the receiving board 22 is located in the second chamber 1112, the power board 30 is located in the third chamber 1113, and the third chamber 1113 is connected to the first chamber 1111 through the second chamber 1112. In this way, the first chamber 1111 and the third chamber 1113 can be separated as much as possible, and the electromagnetic interference between the transmitting board 21 in the first chamber 1111 and the power board 30 in the third chamber 1113 can be reduced.

[0069] Further, the second cavity 1112 has a first sub-opening 1114 and a second sub-opening 1115, and the first sub-opening 1114 and the second sub-opening 1115 can be located at adjacent sides of the second cavity 1112, and the second cavity 1112 is connected to the first cavity 1111 through the first sub-opening 1114, and the second cavity 1112 is connected to the third cavity 1113 through the second sub-opening 1115. In this way, the first cavity 1111 and the third cavity 1113 can be separated as much as possible on the basis of fully utilizing the space in the accommodating cavity 111, thereby reducing electromagnetic interference between the transmitting board 21 and the power board 30, etc.

[0070] See also Figures 2 to 6 , when observed in a direction perpendicular to the surface of the transmitting plate 21, part of the transmitting plate 21 overlaps part of the receiving plate 22. In this way, the size of the laser radar 1 in the direction parallel to the surface of the transmitting plate 21 can be reduced, and the miniaturized design of the laser radar 1 can be realized. It should be noted that, in order for the transmitter 211 on the transmitting plate 21 to emit a light signal to the outside of the laser radar 1, when observed in a direction perpendicular to the surface of the transmitting plate 21, the portion where the transmitter 211 is arranged on the transmitting plate 21 may not overlap with the receiving plate 22. In order for the receiver 221 on the receiving plate 22 to receive the echo light signal outside the laser radar 1, when observed in a direction perpendicular to the surface of the transmitting plate 21, the portion where the receiver 221 is arranged on the receiving plate 22 may not overlap with the transmitting plate 21.

[0071] It should be noted that, when viewed in a direction perpendicular to the plate surface of the transmitting plate 21 , the transmitting plate 21 and the receiving plate 22 may also be arranged at intervals, and this is not limited.

[0072] At least part of the transmitting plate 21 is located in the first cavity 1111, and the transmitting plate 21 may be located in the first cavity 1111 as a whole, or may be located partially in the first cavity 1111. If observed in a direction perpendicular to the plate surface of the transmitting plate 21, part of the transmitting plate 21 overlaps part of the receiving plate 22, and part of the transmitting plate 21 located in the first cavity 1111 may be: the non-overlapping part of the transmitting plate 21 and the receiving plate 22 is located in the first cavity 1111, and the overlapping part of the transmitting plate 21 and the receiving plate 22 is located in the second cavity 1112.

[0073] The transceiver board 20 may include a transmitting board 21 and a receiving board 22, or include a transmitting board 21 and multiple receiving boards 22, or include multiple transmitting boards 21 and multiple receiving boards 22, or include multiple transmitting boards 21 and a receiving board 22, etc., which are not limited to this.

[0074] In the present application, see Figure 6 and Figure 7 The transceiver board 20 includes two transmitting boards 21 and a receiving board 22. The two transmitting boards 21 are located on opposite sides of the receiving board 22. In a direction perpendicular to the board surface of the transmitting board 21, the receiving board 22 and the two transmitting boards 21 are located on the same side of the power board 30. At least two of the two transmitting boards 21, the receiving board 22, and the power board 30 can be electrically connected via a flexible electrical connector.

[0075] See also Figure 8 The flexible electrical connector may include a first bending portion 511 and a second bending portion 512, the first bending portion 511 and the second bending portion 512 are arranged along the extension direction of the flexible electrical connector, and the bending directions of the first bending portion 511 and the second bending portion 512 are opposite, so that during the assembly process of the first rigid circuit board and the second rigid circuit board electrically connected by the flexible electrical connector and the housing 10, the first bending portion 511 and the second bending portion 512 that bend back and forth can provide a certain amount of movement space for the assembly of the first rigid circuit board, the second rigid circuit board and the housing 10, and the assembly is more convenient. Among them, the first rigid circuit board can be one of the two transmitting boards 21, the receiving board 22, and the power board 30, and the second rigid circuit board can be the other of the two transmitting boards 21, the receiving board 22, and the power board 30.

[0076] It should be noted that the extension direction of the flexible electrical connector can be: the direction from one end of the flexible electrical connector connected to the first rigid circuit board to one end of the flexible electrical connector connected to the second rigid circuit board, or the direction from one end of the flexible electrical connector connected to the second rigid circuit board to one end of the flexible electrical connector connected to the first rigid circuit board. The flexible electrical connector is generally in a sheet-like structure, and has a first surface and a second surface opposite to each other. The bending directions of the first curved portion 511 and the second curved portion 512 are opposite: the first curved portion 511 bulges in a direction from the first surface to the second surface, and the second curved portion 512 bulges in a direction from the second surface to the first surface; thus, in the first interval 5111 defined by the first curved portion 511 and the second interval 5121 defined by the second curved portion 512, the first interval 5111 can be located on the side where the first surface is located, and the second interval 5121 can be located on the side where the second surface is located.

[0077] Furthermore, a first positioning member 53 is provided in the first section 5111 and the first positioning member 53 contacts the first curved portion 511, and the first positioning member 53 is used to position the first curved portion 511; a second positioning member 54 is provided in the second section 5121 and the second positioning member 54 contacts the second curved portion 512, and the second positioning member 54 is used to position the second curved portion 512. The provision of the first positioning member 53 and the second positioning member 54 is conducive to the controllable bending and fixation of the flexible electrical connector, ensuring the stacking form of the first rigid circuit board and the second rigid circuit board, and can prevent the flexible electrical connector from being easily affected by vibration and generating a large excitation, thereby improving the installation stability of the flexible electrical connector in the laser radar 1, and improving the connection stability between the flexible electrical connector and the first rigid circuit board and the second rigid circuit board.

[0078] The first positioning member 53 and / or the second positioning member 54 may be elastic, so that the first positioning member 53 and the second positioning member 54 may be deformed, thereby improving the installation stability of the flexible electrical connector. The first positioning member 53 and / or the second positioning member 54 may be made of materials such as silicone, silicone foam, etc., without limitation.

[0079] The first positioning member 53 contacts the first curved portion 511, and the first positioning member 53 and the first curved portion 511 are connected, for example, the two are connected by an adhesive, etc.; the first positioning member 53 contacts the first curved portion 511, and the first curved portion 511 is placed on the first positioning member 53, and there is no connection constraint between the two. It should be noted that the first positioning member 53 can contact part of the first curved portion 511, so that the part of the first curved portion 511 that is not in contact with the first positioning member 53 can be deformed to a certain extent, so as to release the stress generated when the first rigid circuit board or the second rigid circuit board shakes.

[0080] The second positioning member 54 contacts the second curved portion 512, and the second positioning member 54 and the second curved portion 512 are connected, for example, the two are connected by an adhesive, etc.; the second positioning member 54 contacts the second curved portion 512, and the second curved portion 512 is placed on the second positioning member 54, and there is no connection constraint between the two. It should be noted that the second positioning member 54 can contact part of the second curved portion 512, so that the part of the second curved portion 512 that is not in contact with the second positioning member 54 can be deformed to a certain extent, so as to release the stress generated when the first rigid circuit board or the second rigid circuit board shakes.

[0081] The flexible electrical connector includes a first structural portion 513, and the first positioning member 53 and the second positioning member 54 also respectively abut against two opposite sides of the first structural portion 513. Under the joint abutment of the first positioning member 53 and the second positioning member 54, the position of the first structural portion 513 in the housing 10 is fixed, which is more conducive to the controllable bending and fixation of the flexible electrical connector than the staggered arrangement of the contact portion of the first positioning member 53 and the contact portion of the second positioning member 54 and the flexible electrical connector.

[0082] Along the extension direction of the flexible electrical connector, the first structure portion 513 is located between the first curved portion 511 and the second curved portion 512, that is, the first structure portion 513 is independent of the first curved portion 511 and the second curved portion 512. The first structure portion 513 may be configured as at least a portion of the first curved portion 511, and / or the first structure portion 513 may be configured as at least a portion of the second curved portion 512.

[0083] The first positioning member 53 and the second positioning member 54 may be located between the first rigid circuit board and the second rigid circuit board. By properly arranging the first positioning member 53, the second positioning member 54, the first rigid circuit board and the second rigid circuit board, the size of the laser radar 1 may be compressed.

[0084] The positioning surface of the first positioning member 53 for contacting the first curved portion 511 can be roughly a curved surface, a plane, a combination of a curved surface and a plane, etc., without limitation. The positioning surface of the second positioning member 54 for contacting the second curved portion 512 can be roughly a curved surface, a plane, a combination of a curved surface and a plane, etc., without limitation.

[0085] In order to enable the first positioning member 53 to position the first curved portion 511, the first positioning member 53 can be fixed relative to the housing 10, and in order to enable the second positioning member 54 to position the second curved portion 512, the second positioning member 54 can be fixed relative to the housing 10. The first positioning member 53 is fixed relative to the housing 10, and the first positioning member 53 can be directly connected and fixed to the housing 10, or the first positioning member 53 can be indirectly connected and fixed to the housing 10, for example, the first positioning member 53 is connected and fixed to any device installed in the housing 10, thereby achieving connection and fixation with the housing 10. The second positioning member 54 is fixed relative to the housing 10, and the second positioning member 54 can be directly connected and fixed to the housing 10, or the second positioning member 54 can be indirectly connected and fixed to the housing 10, for example, the second positioning member 54 is connected and fixed to any device installed in the housing 10, thereby achieving connection and fixation with the housing 10.

[0086] Among them, the connection between the first positioning member 53 and the shell 10 or the connection between the first positioning member 53 and the device installed in the shell 10 can be connected via an adhesive, and the connection between the second positioning member 54 and the shell 10 or the connection between the second positioning member 54 and the device installed in the shell 10 can be connected via an adhesive, and there is no limitation on this.

[0087] In an exemplary solution, if the first positioning member 53 is connected to a device installed in the housing 10, and the second positioning member 54 is connected to a device installed in the housing 10, the first positioning member 53 can be connected to the first rigid circuit board installed in the housing 10, and the second positioning member 54 can be connected to the second rigid circuit board installed in the housing 10. In this way, after the positions of the first rigid circuit board and the second rigid circuit board in the housing 10 are fixed, the positions of the first positioning member 53 and the second positioning member 54 in the housing 10 will also be fixed, and assembly is more convenient. Specifically, during assembly, the first positioning member 53 can be first fixed to the first rigid circuit board, and the second positioning member 54 can be fixed to the second rigid circuit board. Then, when the first rigid circuit board and the second rigid circuit board are roughly formed into a stacked shape in the housing 10, the flexible electrical connector is bent, and after the entirety is placed in the housing 10, the controllable bending and fixing of the flexible electrical connector can be achieved.

[0088] In this exemplary embodiment, the first positioning member 53 may be silicone foam, and the second positioning member 54 may be silicone foam, which is not limited.

[0089] In this exemplary embodiment, the first rigid circuit board has a first side wall 214, the flexible electrical connector can be connected to the first side wall 214 of the first rigid circuit board, the first positioning member 53 can include a first positioning portion 531, the first positioning portion 531 is located on the side where the first side wall 214 of the first rigid circuit board is located, and the flexible electrical connector bypasses the first positioning portion 531 away from the side of the first side wall 214 to avoid excessive bending of the flexible electrical connector, which may cause the connection between the flexible electrical connector and the first rigid circuit board to be easily broken.

[0090] In this exemplary embodiment, the second rigid circuit board has a second side wall 224, the flexible electrical connector can be connected to the second side wall 224 of the second rigid circuit board, the second positioning member 54 can include a second positioning portion 541, the second positioning portion 541 is located on the side where the second side wall 224 of the second rigid circuit board is located, and the flexible electrical connector bypasses the second positioning portion 541 away from the side of the second side wall 224 to avoid excessive bending of the flexible electrical connector, which may cause the connection between the flexible electrical connector and the second rigid circuit board to be easily broken.

[0091] In another exemplary solution, if the first positioning member 53 is connected to a device installed in the housing 10, and the second positioning member 54 is connected to a device installed in the housing 10, the first positioning member 53 may be connected to the first rigid circuit board or the second rigid circuit board installed in the housing 10, and the second positioning member 54 may be connected to other devices in the housing 10 except the first rigid circuit board and the second rigid circuit board, for example, connected to the third rigid circuit board installed in the housing 10. The first positioning member 53 may be silicone foam, and the second positioning member 54 may be silicone with a hardness of about 30 degrees of shore A, so as to more accurately control the bending shape of the FPC.

[0092] If the first positioning member 53 is connected to a device installed in the housing 10, and / or the second positioning member 54 is connected to a device installed in the housing 10, and the first positioning member 53 and the second positioning member 54 respectively abut against opposite sides of the first structural portion 513, at this time, the first positioning member 53 and / or the second positioning member 54 may be in a compressed state. That is, the device connected to the first positioning member 53 in the housing 10 (for example, the transmitting plate 21) and the device connected to the second positioning member 54 in the housing 10 (for example, the receiving plate 22) will squeeze the first positioning member 53 and the second positioning member 54, which can improve the stability of the first positioning member 53 and the second positioning member 54 fixing the flexible electrical connector.

[0093] The bending angle of the first curved portion 511 may be greater than or equal to 160°, and the bending angle of the second curved portion 512 may be greater than or equal to 160°, so that the first curved portion 511 and the second curved portion 512 can be sufficiently deformed to facilitate assembly of the transmitting plate 21 and the receiving plate 22 with the housing 10 .

[0094] Optionally, the flexible electrical connector is an integrally formed structure with the first rigid circuit board and / or the second rigid circuit board. For example, the multilayer structure of the first rigid circuit board and / or the second rigid circuit board includes a flexible substrate layer, and the flexible substrate layer and the flexible electrical connector share the same flexible substrate. Compared with the related art, in which the flexible circuit board and the two rigid circuit boards are connected via an interface, the volume required for the interface can be saved and the operating cost can be reduced. It should be noted that the flexible electrical connector and the first rigid circuit board and / or the second rigid circuit board can also be electrically connected via an interface, and this is not limited.

[0095] The fixed connection between the first rigid circuit board, the second rigid circuit board and the housing 10 may be by screw connection, snap-fit ​​connection, etc., which is not limited thereto.

[0096] The heat on the transceiver board 20 can be dissipated through the main housing 11 and / or the cover plate 13. If the heat on the transceiver board 20 is dissipated through the main housing 11, the transceiver board 20 can be in contact with the side of the main housing 11 away from the cover plate 13, so that the heat on the transceiver board 20 is transferred toward the main housing 11.

[0097] In order to increase the thermal conductivity of the transceiver board 20 in the thickness direction, the transceiver board 20 can be provided with a heat dissipation hole, and a heat conductive material with a good thermal conductivity can be embedded in the heat dissipation hole. The heat conductive material can quickly absorb and disperse the heat to prevent the heat from accumulating at the transceiver board 20, causing damage to the device or low-power operation. Among them, the thermal conductive material can be copper with a high thermal conductivity, etc., which is not limited to this. Among them, the heat dissipation hole can be a single hole, or it can be composed of multiple small holes, which is not limited to this.

[0098] The transceiver board 20 can be in contact with the housing 10 (e.g., the main housing 11) through a heat-conducting member, so that the heat-conducting material in the heat dissipation hole can transfer heat to the housing 10 through the heat-conducting member. The heat-conducting member and the heat-conducting material set in the heat dissipation hole can be the same or different. The heat-conducting member can be any device with thermal conductivity, such as a thermally conductive gel, which can achieve heat transfer with a high thermal conductivity coefficient; and the thermally conductive gel has good elasticity and compression deformation after curing, and will not generate large thermal stress, which can avoid the position change of the transceiver board 20 caused by thermal stress deformation.

[0099] The housing 10 (e.g., the main housing 11) may be formed with a boss at the transceiver board 20, and a heat conductive member (e.g., heat conductive gel) may be disposed on the boss, so that the transceiver board 20 may transfer heat to the housing 10 through the corresponding heat conductive member on the boss. If the housing 10 is provided with a boss and the transceiver board 20 is provided with a heat dissipation hole, the boss may be disposed corresponding to the heat dissipation hole.

[0100] For example, see Figure 6, the transmitting plate 21 may be provided with a first heat dissipation hole 213 at a location corresponding to the transmitter 211, and the housing 10 may be provided with a second boss 16 at the transmitter 211, and the second boss 16 may pass through the first heat dissipation hole 213 to contact the transmitter 211, such as the second boss 16 passes through the first heat dissipation hole 213 to contact the transmitter 211 via the heat conductive member, so that the heat generated by the transmitter 211 is directly transferred to the housing 10. For another example, the receiving plate 22 may be provided with a second heat dissipation hole 223 at a location corresponding to the receiver 221, and the housing 10 may be provided with a third boss 17 at the receiver 221, and the third boss 17 may pass through the second heat dissipation hole 223 to contact the receiver 221, such as the third boss 17 passes through the second heat dissipation hole 223 to contact the receiver 221 via the heat conductive member, so that the heat generated by the receiver 221 is directly transferred to the housing 10.

[0101] In order to save costs, thermally conductive gels with different thermal conductivity coefficients can be used for different heat-generating devices; for example, for devices with higher thermal power (such as the receiving board 22, etc.), thermally conductive gels with high thermal conductivity are used to conduct heat in a timely manner; for devices with lower thermal power (such as the power board 30, etc.), thermally conductive gels with low thermal conductivity are selected to save costs. Among them, the thermal conductivity coefficient of the thermally conductive gel with high thermal conductivity can be greater than 10W / (m·k), and the thermal conductivity coefficient of the thermally conductive gel with low thermal conductivity can be greater than 3W / (m·k), and there is no limitation on this.

[0102] Among them, the main shell 11 can be made of metal parts. For example, the main shell 11 can be made of aluminum material with a thermal conductivity greater than 160W / (m·k) (watt / meter·degree); for example, the main shell 11 can be made of die-cast aluminum material, wherein die-casting is a processing method with relatively low processing costs. In the embodiment of the present application, the main shell 11 is made of high thermal conductivity die-cast aluminum HA160X material, which has a high thermal conductivity compared to the ADC12 material in the related technology, and can enhance the heat-balancing ability of the main shell 11 and improve the heat dissipation efficiency. It should be noted that the main shell 11 can also be processed by CNC, and the material can be Al6061, which is not limited to this.

[0103] See also Fig. 9 and Fig.10 The housing 10 may be provided with a fixing member for fixing the transceiver board 20 to improve the assembly accuracy and assembly efficiency between the transceiver board 20 and the housing 10. The fixing member may be provided on the cover plate 13 of the housing 10, so that the transceiver board 20 can be assembled with the cover plate 13 outside the accommodating cavity 111 and then assembled with the main housing 11, making the assembly of the transceiver board 20 more convenient.

[0104] If the transceiver board 20 includes a transmitting board 21 and a receiving board 22, the fixing member may include a first fixing column 14 corresponding to the transmitting board 21 and / or a second fixing column 15 corresponding to the receiving board 22, the transmitting board 21 is connected to the shell 10 via the first fixing column 14, and the receiving board 22 is connected to the shell 10 via the second fixing column 15.

[0105] Specifically, the housing 10 is provided with at least one first fixing column 14, the launch plate 21 is provided with at least one first mounting hole 212 corresponding to the at least one first fixing column 14, and the launch plate 21 is mounted on the first fixing column 14 of the housing 10 through the first mounting hole 212. The first fixing column 14 and the first mounting hole 212 may be interference fit or clearance fit. If the first fixing column 14 and the first mounting hole 212 are clearance fit, the gap between the first fixing column 14 and the first mounting hole 212 may be provided with a first adhesive layer 141 to fix the relative position between the launch plate 21 and the housing 10.

[0106] The first adhesive layer 141 may be a UV thermosetting composite adhesive layer. After the first fixing column 14 and the first mounting hole 212 are assembled, UV irradiation may be used for pre-fixation, and then heat-curing may be used to enhance the strength. The first adhesive layer 141 may also be made of two or more adhesive layers. After the first fixing column 14 and the first mounting hole 212 are assembled, UV irradiation may be used for pre-fixation, and then heat-curing may be used for strengthening the fixation.

[0107] The housing 10 may be provided with one first fixing column 14, or may be provided with a plurality of first fixing columns 14, for example, two, three, four, five first fixing columns 14, etc., which are not limited thereto. In the embodiment of the present application, the housing 10 may be provided with four first fixing columns 14 corresponding to a launch plate 21, and the launch plate 21 may be provided with first mounting holes 212 equal in number to the first fixing columns 14, and the four first mounting holes 212 may be substantially evenly distributed on the periphery of the launch plate 21 to improve the connection stability between the launch plate 21 and the housing 10.

[0108] The cross section of the first fixing column 14 may be roughly circular, polygonal, etc., and the shape of the first mounting hole 212 may be roughly matched with the shape of the first fixing column 14 .

[0109] The housing 10 is provided with at least one second fixing column 15, and the receiving plate 22 is provided with at least one second mounting hole 222 corresponding to the at least one second fixing column 15, and the receiving plate 22 is mounted on the second fixing column 15 of the housing 10 through the second mounting hole 222. The second fixing column 15 and the second mounting hole 222 may be interference fit or clearance fit, and if the second fixing column 15 and the second mounting hole 222 are clearance fit, the gap between the second fixing column 15 and the second mounting hole 222 may be provided with a second adhesive layer 151 to fix the relative position between the receiving plate 22 and the housing 10, and further fix the relative position between the receiving plate 22 and the receiving lens.

[0110] The second adhesive layer 151 may be a UV thermosetting composite adhesive layer. After the second fixing column 15 and the second mounting hole 222 are assembled, UV irradiation can be used for pre-fixation, and then heat-curing can be used to enhance the strength. The second adhesive layer 151 may also be made of two or more adhesive layers. After the second fixing column 15 and the second mounting hole 222 are assembled, UV irradiation can be used for pre-fixation, and then heat-curing can be used for strengthening the fixation.

[0111] The housing 10 may be provided with one second fixing column 15, or may be provided with a plurality of second fixing columns 15, for example, two, three, four, five second fixing columns 15, etc., which are not limited thereto. In the embodiment of the present application, the housing 10 may be provided with four second fixing columns 15 corresponding to a receiving plate 22, and the receiving plate 22 may be provided with second mounting holes 222 equal in number to the second fixing columns 15, and the four second mounting holes 222 may be substantially evenly distributed on the periphery of the receiving plate 22 to improve the connection stability between the receiving plate 22 and the housing 10.

[0112] The cross section of the second fixing column 15 may be substantially circular, polygonal, etc., and the shape of the second mounting hole 222 may be substantially matched with the shape of the second fixing column 15 .

[0113] Furthermore, at least one first fixing column 14 and at least one second fixing column 15 may be the same fixing column to save the internal space of the laser radar 1. Fig.10 , when viewed in a direction perpendicular to the surface of the transmitting plate 21, part of the transmitting plate 21 overlaps part of the receiving plate 22, and a first fixing column 14 and a second fixing column 15 can be set at the overlapping part of the transmitting plate 21 and the receiving plate 22, and the first fixing column 14 and the second fixing column 15 of this part can share the same fixing column.

[0114] In the embodiment of the present application, the housing 10 described above is provided with the first fixing column 14, which can be provided with the first fixing column 14 for the cover plate 13, so that the launch plate 21 is installed and fixed to the cover plate 13. Among them, the launch plate 21 is installed and fixed to the cover plate 13 through the first fixing column 14, which is also conducive to the heat generated by the launch plate 21 being guided to the cover plate 13 through the first fixing column 14, that is, the launch plate 21 can not only directly conduct heat to the main housing 11 by contacting with the main housing 11, but also conduct heat to the cover plate 13 through the first fixing column 14, so that the heat generated by the launch plate 21 is more evenly distributed, which is conducive to improving the heat dissipation efficiency of the laser radar 1.

[0115] The housing 10 described above is provided with a second fixing column 15, and the cover plate 13 is provided with a second fixing column 15, so that the receiving plate 22 is installed and fixed to the cover plate 13. The receiving plate 22 is installed and fixed to the cover plate 13 through the second fixing column 15, which is conducive to the heat generated by the receiving plate 22 being guided to the cover plate 13 through the second fixing column 15, that is, the receiving plate 22 can not only directly conduct heat to the main housing 11 by contacting with the main housing 11, but also conduct heat to the cover plate 13 through the second fixing column 15, so that the heat generated by the receiving plate 22 is more evenly distributed, which is conducive to improving the heat dissipation efficiency of the laser radar 1.

[0116] The cover plate 13 may be made of metal or non-metal (such as plastic). If the cover plate 13 is made of metal, the heat dissipation performance of the cover plate 13 is better. If the cover plate 13 is made of non-metal, it is beneficial to reduce the manufacturing cost of the cover plate 13 and reduce the weight of the laser radar 1.

[0117] The laser radar 1 includes a plurality of first fixing posts 14 that are symmetrical about the first straight line, the laser radar 1 includes a plurality of second fixing posts 15 that are symmetrical about the first straight line, and the housing 10 or the cover plate 13 that are symmetrical about the first straight line. Fig.11 Part of the cover plate 13 may protrude outward from the housing 10, specifically, may protrude vertically. The cover plate 13 may be provided with reinforcing ribs at the first fixing column 14 and / or the second fixing column 15 to provide sufficient support strength to prevent deformation of the cover plate 13 and the first fixing column 14 and / or the second fixing column 15.

[0118] See also Fig. 9 The laser radar 1 also includes an optical element 60, which includes a transmitting lens 61 and a receiving lens 62, wherein the transmitting lens 61 is located on the transmission path of the detection light signal emitted by the transmitter 211, and the receiving lens 62 is located on the transmission path of the echo light signal received by the receiver 221.

[0119] The transmitting lens 61 includes a transmitting lens barrel 611 and at least one transmitting lens 612 disposed in the transmitting lens barrel 611, and the transmitting lens barrel 611 is connected to the shell 10 (e.g., the cover 13); the receiving lens 62 includes a receiving lens barrel 621 and at least one receiving lens 622 disposed in the receiving lens barrel 621, and the receiving lens barrel 621 is connected to the shell 10 (e.g., the cover 13).

[0120] The transmitting lens barrel 611 and the cover plate 13 may be an integrally formed structure to simplify the assembly process of the transmitting lens barrel 611 and the cover plate 13, improve assembly efficiency, reduce the distance between the transmitting lens barrel 611 and the receiving lens barrel 621, and reduce the volume of the laser radar 1. The transmitting lens 612 may be any lens with a refractive force, for example, the transmitting lens 612 may be a convex lens, a concave lens, etc., which is not limited. The transmitting lens 61 may also include a spacer ring, a locking ring, etc., wherein the spacer ring is used to realize the support of the transmitting lens 612 and control the distance between two adjacent transmitting lenses 612, and the locking ring is used to lock and fix the transmitting lens 612.

[0121] The receiving lens barrel 621 and the cover plate 13 can be an integrally formed structure to simplify the assembly process of the receiving lens barrel 621 and the cover plate 13, improve assembly efficiency, reduce the distance between the transmitting lens barrel 611 and the receiving lens barrel 621, and reduce the volume of the laser radar 1. Among them, the receiving lens 622 can be any lens with refractive power, for example, the receiving lens 622 can be a convex lens, a concave lens, etc., which is not limited. The receiving lens 62 can also include a spacer ring, a locking ring, etc., wherein the spacer ring is used to realize the support of the receiving lens 622 and control the distance between two adjacent receiving lenses 622, and the locking ring is used to lock and realize the fixation of the receiving lens 622.

[0122] In the embodiment of the present application, the transmitting lens barrel 611 and the receiving lens barrel 621 are both integrally formed with the cover plate 13 , which can reduce the distance between the lenses, thereby reducing the size of the laser radar 1 .

[0123] See also Figure 6 and Fig.11 The housing 10 may be provided with heat dissipation teeth 18 to expand the heat dissipation area of ​​the housing 10 and improve the heat dissipation effect. Specifically, the heat dissipation teeth 18 may be provided at multiple locations such as the side of the main housing 11 of the housing 10 away from the cover plate 13, the side plate 12, the cover plate 13, etc., to increase the heat dissipation area and improve the heat dissipation efficiency. Among them, the height and setting density of the heat dissipation teeth 18 can be flexibly adjusted according to actual needs, and there is no limitation on this.

[0124] Optionally, the receiver 221 on the receiving board 22 can be integrated with the main control chip, so that the total thermal power of the laser radar 1 is reduced and the volume of the laser radar 1 is reduced. Among them, the receiver 221 and the main control chip are integrated into one, and the main control chip has the function of receiving echo light. Compared with the laser radar in the related art that includes both a receiving board and a main control board, the main control board can be omitted. It should be noted that the embodiment of the present application is not limited to this. The receiver 221 on the receiving board 22 and the main control chip may not be integrated into one, and the laser radar 1 may also include both the receiving board 22 and the main control board. Among them, when the laser radar 1 includes a main control board, the main control board and the power board 30 can be arranged on the same side of the transceiver board 20, etc., and there is no limitation on this.

[0125] The laser radar 1 further includes a connector 40, one end of which is located outside the housing 10, and the other end of the connector 40 passes through the housing 10 and is electrically connected to the power board 30. That is, the power board 30 can be used to realize signal transmission between the laser radar 1 and external devices. The power board 30 has a higher degree of integration and does not require an additional power signal adapter board. The power and signal are directly processed and transferred to the connector 40 on a circuit board.

[0126] In this embodiment, when assembling the laser radar 1, the cover plate 13, the transmitting plate 21, the receiving plate 22, the transmitting lens, the receiving lens, etc. can be assembled to form a first assembly, the power board 30, the side plate 12 and the connector 40 can be assembled to form a second assembly, and the main shell 11, the waterproof breathable valve, etc. can be assembled to form a third assembly; wherein the waterproof breathable valve can be attached to the main shell 11 by a pressure-sensitive adhesive; and then the first assembly, the second assembly and the third assembly are assembled, which is very convenient to assemble and reduces the material management cost.

[0127] It should be noted that when the laser radar 1 is installed on the device body 3 such as the vehicle body, the laser radar 1 and the device body 3 can be installed through a mounting part. Among them, the mounting part may include a mounting frame and locking parts such as screws. The mounting frame can be formed on the laser radar 1 or on the device body 3; if the mounting frame is formed on the laser radar 1, the mounting frame can be formed on the shell 10 of the laser radar 1. Furthermore, the number of mounting frames can be at least two, and at least two mounting frames are respectively arranged on opposite sides of the shell 10 to achieve reliable installation between the laser radar 1 and the device body 3. Furthermore, the mounting frame can be formed on the main shell 11 of the shell 10.

[0128] Second, see Fig.12, the embodiment of the present application provides a movable device 2, the movable device 2 includes a device body 3 and the above-mentioned laser radar 1, and the device body 3 is connected to the laser radar 1. In some embodiments, the movable device 2 is a car, the above-mentioned device body 3 is the car body, and the laser radar 1 is mounted on the car body; it can be understood that in other implementations of the present application, the movable device 2 can also be a device other than a car equipped with a laser radar 1, such as a drone, a robot, etc., and the present application does not limit this.

[0129] The movable device 2 includes a laser radar 1. The specific structure of the laser radar 1 refers to the above embodiment. Since the movable device 2 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. It can be understood that the present application does not impose a sole restriction on the specific setting position of the laser radar 1. For example, the laser radar 1 can also be set in front of, to the side, or behind the movable device 2.

[0130] Embodiment 2

[0131] The difference between this embodiment and the first embodiment is that: Fig.13 The transceiver board 20 includes a public substrate 23, on which a transmitter 211 and a receiver 221 are disposed. That is, in this embodiment, the transmitter board 21 and the receiver board 22 share the same substrate. Fig.13 The transceiver board 20 can be in contact with the main shell 11 of the shell 10 for heat dissipation; for example, the public substrate 23 can be provided with a first heat dissipation hole 213 at the location where the transmitter 211 is set, and the main shell 11 is provided with a second boss 16 at the transmitter 211, and the second boss 16 can pass through the first heat dissipation hole 213 to contact the transmitter 211, so that the heat generated by the transmitter 211 is directly transferred to the main shell 11; the public substrate 23 can be provided with a second heat dissipation hole 223 at the location where the receiver 221 is set, and the main shell 11 is provided with a third boss 17 at the receiver 221, and the third boss 17 can pass through the second heat dissipation hole 223 to contact the receiver 221, so that the heat generated by the receiver 221 is directly transferred to the main shell 11.

[0132] Among them, the public base plate 23 can also directly or indirectly contact the cover plate 13 of the shell 10 to dissipate heat. For example, the public base plate 23 can contact the surface of the cover plate 13 facing the main shell 11 to dissipate heat, or the public base plate 23 can contact the cover plate 13 through the fixing parts provided on the cover plate 13 to dissipate heat, and there is no limitation on this.

[0133] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" refers to at least two, for example, two, three, four, etc. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0134] The above disclosure is only the preferred embodiment of the present application, which certainly cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A laser radar, characterized in that: include: A housing, wherein the housing is formed with a receiving cavity; A transceiver board, the transceiver board is located in the accommodating cavity; A power board, the power board is located in the accommodating cavity, the power board is electrically connected to the transceiver board, the power board is located on the side of the transceiver board, and the power board and the transceiver board are arranged at an angle.

2. The laser radar according to claim 1, characterized in that: The housing comprises: A main housing, wherein the main housing is provided with a first opening communicating with the accommodating cavity; A side plate covers the first opening, and the power board is arranged opposite to the side plate.

3. The laser radar according to claim 2, characterized in that: The housing further comprises: A cover plate, wherein the cover plate and the side plate are located at adjacent sides of the shell, and the transceiver plate is arranged opposite to the cover plate.

4. The laser radar according to claim 3, characterized in that: The main shell is further provided with a second opening communicating with the accommodating cavity, and the cover plate covers the second opening.

5. The laser radar according to claim 1, characterized in that: The power board is located on the top side of the transceiver board.

6. The laser radar according to claim 1, characterized in that: The transceiver board comprises: A launching plate, on which a launcher is arranged; A receiving board is provided with a receiver, and the receiving board and the transmitting board are spaced apart in a direction perpendicular to the board surface of the transmitting board, and the receiving board and the transmitting board are located on the same side of the power board.

7. The laser radar according to claim 6, characterized in that: The transmitting board is electrically connected to the receiving board, and the receiving board is electrically connected to the power board.

8. The laser radar according to claim 7, characterized in that: The accommodating chamber comprises: a first cavity, wherein at least a portion of the launch plate is located in the first cavity; a second cavity, wherein the receiving plate is located in the second cavity; The third cavity, the power board is located in the third cavity, and the third cavity is connected with the first cavity through the second cavity.

9. The laser radar according to claim 8, characterized in that: The second cavity has a first sub-opening and a second sub-opening, the first sub-opening and the second sub-opening are located at adjacent sides of the second cavity, the second cavity is connected with the first cavity through the first sub-opening, and the second cavity is connected with the third cavity through the second sub-opening.

10. The laser radar according to claim 6, characterized in that: When viewed in a direction perpendicular to the plate surface of the transmitting plate, a portion of the transmitting plate overlaps a portion of the receiving plate.

11. The laser radar according to claim 6, characterized in that: The housing is provided with at least one first fixing column, the launch plate is provided with at least one first mounting hole corresponding to the at least one first fixing column, and the launch plate is mounted on the first fixing column of the housing through the first mounting hole; And / or, the shell is provided with at least one second fixing column, the receiving plate is provided with at least one second mounting hole corresponding to the at least one second fixing column, and the receiving plate is mounted on the second fixing column of the shell through the second mounting hole.

12. The laser radar according to any one of claims 6 to 11, characterized in that: The transceiver board includes two transmitting boards and one receiving board, and the two transmitting boards are located at opposite sides of the receiving board.

13. The laser radar according to claim 1, characterized in that: The transceiver board includes a male substrate, on which a transmitter and a receiver are arranged.

14. The laser radar according to claim 1, characterized in that: Also includes: A connector, one end of which is located outside the shell, and the other end of which passes through the shell and is electrically connected to the power board.

15. A movable device, characterized in that: It comprises a device body and a laser radar as described in any one of claims 1 to 14, wherein the device body is connected to the laser radar.

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