Display module and display device

Abstract

The invention discloses a display module and a display device, and belongs to the technical field of display. The display module comprises a display panel, a detection assembly and a flexible circuit board, the display panel is provided with a display area and a non-display area surrounding the periphery of the display area; the non-display area comprises a first binding area and a second binding area which are arranged in a first direction, and the detection assembly is in binding connection with the first pin group in the first binding area; the flexible circuit board is in binding connection with the second pin group in the second binding area, and the flexible circuit board is provided with at least two third target pins and at least one test capacitor; the at least two third target pins are correspondingly bonded with the at least two second target pins. According to the application, the detection assembly is bound to the display panel, the test capacitor is arranged on the flexible circuit board, and after the flexible circuit board is bound and connected to the second binding area, the detection assembly can measure the capacitance signal of the test capacitor so as to determine the bonding state between the second target pin and the corresponding third target pin.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the rapid development of organic light-emitting diode (OLED) display technology, the precision and reliability of module assembly have become one of the core indicators for measuring product quality. In particular, in the bonding process between flexible printed circuit (FPC) and display module, the quality of the effect is directly related to the display effect and service life of the product.

[0003] At present, although the FPC bonding impedance detection method can be used in the assembly stage to evaluate the initial quality of bonding to a certain extent, it has significant limitations, especially it cannot cover various unexpected situations that may occur during the product life cycle, such as potential damage after the whole machine is assembled or accidental drops during consumer use, which may quietly affect the integrity of FPC bonding and thus affect the display effect. Summary of the invention

[0004] The embodiment of the present application provides a display module and a display device. The problem that the prior art cannot detect the quality of FPC bonding in real time is solved. The technical solution is as follows:

[0005] In one aspect, a display module is provided, comprising: a display panel, a detection component and a flexible circuit board;

[0006] The display panel has a display area and a non-display area surrounding the display area; the non-display area includes: a first binding area and a second binding area arranged in a first direction, the first binding area is closer to the display area than the second binding area; the portion of the display panel distributed in the first binding area has a first pin group, and the portion of the display panel distributed in the second binding area has a second pin group; at least two first target pins in the first pin group and at least two second target pins in the second pin group are electrically connected to each other; the at least two second target pins are arranged along a second direction; the second direction intersects with the first direction;

[0007] The detection component is bound and connected to the first pin group in the first binding area;

[0008] The flexible circuit board is bound and connected to the second pin group in the second binding area, and the flexible circuit board has: at least two third target pins and at least one test capacitor; the at least two third target pins are bonded correspondingly to the at least two second target pins, every two of the at least two third target pins correspond to one test capacitor, and the first capacitor electrode and the second capacitor electrode in one test capacitor are electrically connected to the corresponding two third target pins, respectively.

[0009] Optionally, in the same test capacitor, the first capacitor electrode and the second capacitor electrode are arranged in the same layer and are made of the same material.

[0010] Optionally, in the same test capacitor, an arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the first direction, or an arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the second direction.

[0011] Optionally, in the same test capacitor, the first capacitor electrode has a hollow area, and the orthographic projection of the second capacitor electrode on the substrate in the flexible circuit board is located within the orthographic projection of the hollow area on the substrate in the flexible circuit board.

[0012] Optionally, the first capacitor electrode is a square ring electrode, and the second capacitor electrode is a square electrode;

[0013] Or, the first capacitor electrode is a rectangular ring electrode, and the second capacitor electrode is a rectangular electrode;

[0014] Or, the first capacitor electrode is a circular ring electrode, and the second capacitor electrode is a circular electrode;

[0015] Alternatively, the first capacitor electrode is an elliptical ring-shaped electrode, and the second capacitor electrode is an elliptical electrode.

[0016] Optionally, when the second capacitor electrode is a rectangular or elliptical electrode, an angle between a length direction of the second capacitor electrode and the second direction is greater than or equal to 0° and less than or equal to 180°.

[0017] Optionally, in the same test capacitor, the first capacitor electrode and the second capacitor electrode are arranged in different layers;

[0018] The orthographic projection of the first capacitor electrode on the substrate in the flexible circuit board overlaps with the orthographic projection of the second capacitor electrode on the substrate in the flexible circuit board.

[0019] Optionally, the first capacitor electrode and the second capacitor electrode are both square, rectangular, circular or elliptical electrodes.

[0020] Optionally, two third target pins corresponding to the same test capacitor are arranged adjacent to each other in the second direction.

[0021] Optionally, when there are multiple test capacitors, the multiple test capacitors include a first test capacitor and a second test capacitor;

[0022] The flexible circuit board also has a plurality of third-type pins; in the second direction, the two third target pins corresponding to the first test capacitor are distributed on one side of the plurality of third-type pins, and the two third target pins corresponding to the second test capacitor are distributed on the other side of the plurality of third-type pins;

[0023] The second pin group further includes: a plurality of second-type pins, and the plurality of second-type pins are bonded correspondingly to the plurality of third-type pins.

[0024] Optionally, the first pin group further includes: a plurality of touch pins; the portion of the display panel in the display area has a touch electrode layer; the touch electrode layer is electrically connected to the plurality of touch pins;

[0025] The detection component has multiple pairs of first-type touch interfaces and at least one pair of second-type touch interfaces; the multiple pairs of first-type touch interfaces are correspondingly connected to the multiple touch pins, and the at least one pair of second-type touch interfaces is correspondingly connected to the at least two first target pins;

[0026] Among them, the at least one pair of second-type touch interfaces corresponds to at least one test capacitor; for a touch drive interface and a touch sensing interface in a pair of the second-type touch interfaces, and the corresponding first capacitor electrode and second capacitor electrode in the test capacitor, the touch drive interface is used to connect to the first capacitor electrode, and the touch sensing interface is used to connect to the second capacitor electrode.

[0027] Optionally, the first pin group further includes: a plurality of data driving pins; the portion of the display panel in the display area also has a plurality of data signal lines; the plurality of data signal lines are correspondingly connected to the plurality of data driving pins;

[0028] The display module further includes: a driving chip bound and connected to the first pin group in the first binding area, and the driving chip is connected to the plurality of data driving pins.

[0029] Optionally, the detection component and the driving chip are integrated into one component.

[0030] Optionally, the first pin group further includes: a plurality of first-category pins; the second pin group further includes: a plurality of second-category pins; the plurality of first-category pins and the plurality of second-category pins are electrically connected to each other.

[0031] On the other hand, a display device is provided, comprising: a control component and any one of the display modules described above, wherein the control component is electrically connected to the display module.

[0032] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0033] By binding the detection component to the first binding area of ​​the display panel, setting the test capacitor on the flexible circuit board, after the flexible circuit board is bound and connected to the second binding area, the third target pin on the flexible circuit board is bonded to the second target pin on the second binding area. The detection component is electrically connected to the second target pin on the second binding area through the first target pin, and then electrically connected to the test capacitor through the second target pin on the second binding area and the third target pin on the flexible circuit board. In this way, the detection component can measure the capacitance signal of the test capacitor, and the capacitance signal can be used to characterize the bonding state between the second target pin and the corresponding third target pin; based on this, the binding state of the flexible circuit board and the display panel can be determined according to the capacitance signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 It is a structural diagram before displaying the module binding;

[0036] Figure 2 A schematic diagram of the structure of a display module provided in an embodiment of the application;

[0037] Figure 3 A schematic diagram of the structure of a non-display area of ​​a display panel provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present application;

[0039] Figure 5 for Figure 2 Schematic diagram of the membrane layer at A-A';

[0040] Figure 6 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0041] Figure 7 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0042] Figure 8 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0043] Fig. 9 for Figure 8 Schematic diagram of the membrane layer at B-B' in the middle;

[0044] Fig.10 A schematic diagram of the structure of a test capacitor provided in an embodiment of the present application;

[0045] Fig.11 A schematic diagram of the structure of another test capacitor provided in an embodiment of the present application;

[0046] Fig.12 A schematic diagram of the structure of another test capacitor provided in an embodiment of the present application;

[0047] Fig.13 A schematic diagram of the structure of another test capacitor provided in an embodiment of the present application;

[0048] Fig.14 A schematic diagram of the structure of a test capacitor provided in another embodiment of the present application;

[0049] Fig.15 A schematic diagram of the structure of a display module provided in another embodiment of the present application;

[0050] Fig.16 for Fig.15 Schematic diagram of the membrane layer at C-C';

[0051] Fig.17 A schematic diagram of the structure of a display module provided in yet another embodiment of the present application;

[0052] Fig.18 A schematic diagram of the structure of the detection component and the driver chip provided in the embodiment of the present application;

[0053] Fig.19 A schematic diagram of the structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0055] Please refer to Figure 1 , Figure 1It is a structural diagram of a display module before binding, and the display module includes a display panel 0 and a flexible circuit board 3. The display panel 0 may have a display area 1, and a non-display area 2 surrounding the periphery of the display area 1. The non-display area 2 may include a binding area 2a, and the flexible circuit board 3 is bound and connected to the binding area 2a. Among them, the portion of the display panel 0 distributed in the binding area 2a may have a plurality of first-class pins 2b, and the flexible circuit board 3 has a plurality of second-class pins 3a. Among them, after the flexible circuit board 3 is bound and connected to the binding area 2a, the first-class pins 2b and the second-class pins 3a are electrically connected correspondingly, such as one-to-one electrical connections.

[0056] At present, in the process of binding the flexible circuit board 3 to the binding area 2a, the first type of pins 2b and the second type of pins 3a are not electrically connected according to the designed corresponding relationship. Figure 1 The first first-category pin 2b on the left side is connected to the first second-category pin 3a on the left side, but after actual binding, the first first-category pin 2b on the left side is connected to other second-category pins 3a. This situation can be defined as binding offset. For example, the first-category pin 2b is electrically connected to the second-category pin 3a, but after binding, due to abnormal conditions (such as improper operation, display device falling, etc.), the binding area 2a of the flexible circuit board 3 and the display panel 0 is torn, resulting in disconnection or unreliable connection between the first-category pin 2b and the second-category pin 3a. This situation can be defined as binding tearing.

[0057] The existing detection of FPC bonding status is to detect the impedance between the first type pin 2b and the corresponding second type pin 3a after the display module is assembled, so as to determine whether the first type pin 2b and the second type pin 3a are electrically connected. If all the first type pins 2b and the second type pins 3a are electrically connected, the FPC bonding is considered normal. However, this detection method has significant limitations, especially it cannot cover various unexpected situations that may occur during the product life cycle. For example, potential damage after the assembly of the whole machine or accidental drop during consumer use may quietly affect the integrity of FPC bonding, thereby affecting the display effect.

[0058] First, the traditional impedance detection method is limited by the module status and cannot capture the subtle changes in the bonding status in real time after the whole machine is assembled or during the consumer use stage. Once the whole machine is accidentally dropped or improperly operated, resulting in damage to the FPC bonding (such as binding tearing), the traditional detection method often requires disassembly of the machine for inspection, which not only increases the maintenance cost, but also prolongs the troubleshooting time, seriously affecting the consumer experience.

[0059] Secondly, facing uncontrollable factors on the consumer side, such as the phone accidentally falling or colliding, traditional impedance detection methods are powerless. Consumers often find it difficult to determine whether the display abnormality is caused by FPC bonding problems, and professional testing requires a tedious disassembly process, which undoubtedly increases consumers' troubles and dissatisfaction.

[0060] In the embodiments of this application, please refer to Figures 2 to 4 , Figure 2 A schematic diagram of the structure of a display module provided in an embodiment of the application, Figure 3 A schematic diagram of the structure of the non-display area of ​​the display panel provided in an embodiment of the present application, Figure 4 A schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present application. The display module 000 may include: a display panel 00 , a detection component 10 and a flexible circuit board 20 .

[0061] The display panel 00 may have a display area 01 and a non-display area 01 surrounding the display area 01; the non-display area 01 may include: a first binding area 02a and a second binding area 02b arranged in a first direction X, the first binding area 02a being closer to the display area 01 than the second binding area 02b. The portion of the display panel 00 distributed in the first binding area 02a may have a first pin group 03, and the portion of the display panel 00 distributed in the second binding area 02b may have a second pin group 04.

[0062] The first pin group 03 may include at least two first target pins 03a, and the second pin group 04 may include at least two second target pins 04a. Here, the at least two first target pins 03a in the first pin group 03 and the at least two second target pins 04a in the second pin group 04 are electrically connected to each other. It should be noted that the at least two second target pins 04a in the second pin group 04 may be arranged along the second direction Y; the second direction Y intersects with the first direction X. For example, in the embodiment of the present application, the second direction Y is perpendicular to the first direction X.

[0063] For example, please refer to Figure 3 The portion of the display panel 000 between the first binding area 02a and the second binding area 02b may have at least two first connection lines L1 ( Figure 3 The first connection lines L2 are represented by solid lines in the figure to distinguish the second connection lines L2. One end of at least two first connection lines L1 can be electrically connected to at least two first target pins 03a, and the other end of at least two first connection lines L1 can be electrically connected to at least two second target pins 04a. To this end, each first target pin 03a can be electrically connected to the corresponding second target pin 04a through a corresponding first connection line L1.

[0064] The detection component 10 is bound and connected to the first pin group 03 in the first binding area 02 a .

[0065] The flexible circuit board 20 is bound and connected to the second pin group 04 in the second binding area 02b, and the flexible circuit board 20 may have: at least two third target pins 21a and at least one test capacitor 22. The at least two third target pins 21a are bonded to the at least two second target pins 04a, and every two third target pins 21a of the at least two third target pins 21a correspond to one test capacitor 22.

[0066] The first capacitor electrode 221 and the second capacitor electrode 222 in one test capacitor 22 are electrically connected to the corresponding two third target pins 21 a , respectively.

[0067] In the embodiment of the present application, the detection component 10 can be electrically connected to the first capacitor electrode 221 and the second capacitor electrode 222 of a test capacitor 22 through the two first target pins 03a in the first pin group 03, the two corresponding second target pins 04a in the second binding area 02b, and the two corresponding third target pins 21a on the flexible circuit board 20. In this way, the detection component 10 can measure the capacitance signal of the test capacitor 22. When the binding state of the flexible circuit board 20 and the display panel 00 is normal, the third target pin 21a of the flexible circuit board 20 is bonded to the second target pin 04a of the display panel 00, and the capacitance signal of the test capacitor 22 measured by the detection component 10 is within a design range, such as the capacitance value is within a range. When the binding state of the flexible circuit board 20 and the display panel 00 is abnormal, the bonding between the third target pin 21a of the flexible circuit board 20 and the second target pin 04a of the display panel 00 is abnormal, and the capacitance signal of the test capacitor 22 measured by the detection component 10 is not within the design range. For example, in the case of binding tearing, the bonding between the second target pin 04a and the third target pin 21a is disconnected, and the electrical connection between the corresponding test capacitor 22 and the detection component 10 is disconnected. At this time, the detection component 10 cannot measure the capacitance signal of the test capacitor 22. For another example, in the case of binding offset, the detection component 10 is also unable to measure the capacitance signal of the test capacitor 22.

[0068] For ease of description, in the same test capacitor 22, a loop between a second target pin 04a and a first capacitor electrode 221 is defined as a sending loop (referred to as Tx loop), and a loop between another second target pin 04a and a second capacitor electrode 222 is defined as a receiving loop (referred to as Rx loop). The detection component 10 can send a driving signal to the sending loop, and receive an alternating voltage signal as a capacitance signal through the receiving loop. The size of the capacitance signal is affected by the integrity of the sending loop and the receiving loop. In the event of an abnormality between the detection component 10 and the sending loop or between the detection component 10 and the receiving loop (such as binding offset or binding tearing), the detection component 10 cannot effectively receive the capacitance signal.

[0069] The detection component 10 detects the capacitance signal of the test capacitor 22, and the detection component 10 can communicate with the control component of the display device. The control component or the detection component 10 can determine the FPC bonding state according to the capacitance signal. In the case of a binding abnormality, the control component at the consumer end can display by controlling the display area 01 of the display panel 00 to prompt the consumer that the current display abnormality is caused by the FPC bonding problem, so as to facilitate the consumer to send the device for inspection and repair.

[0070] It can be seen that the embodiment of the present application sets a test capacitor on the flexible circuit board by binding the detection component to the first binding area of ​​the display panel, and after the flexible circuit board is bound and connected to the second binding area, the third target pin on the flexible circuit board is bonded to the second target pin on the second binding area. The detection component is electrically connected to the second target pin on the second binding area through the first target pin, and then electrically connected to the test capacitor through the second target pin on the second binding area and the third target pin on the flexible circuit board. In this way, the detection component can measure the capacitance signal of the test capacitor, and the capacitance signal can be used to characterize the bonding state between the second target pin and the corresponding third target pin; based on this, the binding state of the flexible circuit board and the display panel can be determined according to the capacitance signal.

[0071] For a possible implementation, see Figure 5 , Figure 5 for Figure 2 In the schematic diagram of the film layer at A-A' in FIG. 1 , the flexible circuit board 20 may include: a substrate 201, and at least one conductive layer 202 and at least one insulating layer 203 alternately arranged on one side of the substrate 201. In the same test capacitor 22, the first capacitor electrode 221 and the second capacitor electrode 222 are arranged in the same layer and made of the same material, that is, the first capacitor electrode 221 and the second capacitor electrode 222 may be formed by patterning the same conductive layer 202 and are located in the same conductive layer 202.

[0072] Please refer to Figure 2, Figure 6 and Figure 7 , Figure 6 A schematic diagram of the structure of another display module provided in an embodiment of the present application, Figure 7 A schematic diagram of another display module provided in an embodiment of the present application. The embodiment of the present application does not limit the shape and positional relationship of the first capacitor electrode 221 and the second capacitor electrode 222, wherein the larger the shape of the first capacitor electrode 221 and the second capacitor electrode 222, the better, and the smaller the interval between the two, the better, so as to produce a more sensitive capacitance detection effect. The first capacitor electrode 221 and the second capacitor electrode 222 can both be square, rectangular, circular or elliptical electrodes.

[0073] For example, please refer to Figure 6 For example, the first capacitor electrode 221 and the second capacitor electrode 222 may both be circular electrodes. Circular electrodes have lower peripheral tip discharge effects than square electrodes, and can improve the effect of resisting electrostatic discharge.

[0074] For example, in the same test capacitor 22, please refer to Figure 2 , the arrangement direction of the first capacitor electrode 221 and the second capacitor electrode 222 is parallel to the first direction X, or, please refer to Figure 7 , the arrangement direction of the first capacitor electrode 221 and the second capacitor electrode 222 is parallel to the second direction Y.

[0075] The test capacitor 22 is arranged in parallel to the first direction X or the second direction Y. The test capacitor 22 can be arranged at the edge of the flexible circuit board 20. In this way, the test capacitor 22 can avoid routing on the flexible circuit board 20, which has higher flexibility.

[0076] For a possible implementation, please refer to Figures 8 to 10 , Figure 8 A schematic diagram of the structure of another display module provided in an embodiment of the present application is shown in FIG. Fig. 9 for Figure 8 Schematic diagram of the film layer at B-B' in the figure. Fig.10 A schematic diagram of the structure of the test capacitor provided in the embodiment of the present application. In the same test capacitor 22 , the first capacitor electrode 221 may have a hollow area 221 a , and the orthographic projection of the second capacitor electrode 222 on the substrate 201 is located within the orthographic projection of the hollow area 221 a on the substrate 201 .

[0077] In the embodiment of the present application, the second capacitor electrode 222 is embedded in the hollow area 221a of the first capacitor electrode 221. In this way, the first capacitor electrode 221 and the second capacitor electrode 222 can construct a surrounding annular induction electric field, which greatly enhances the detection component 10's sensing of the signal. In other words, it has better detection sensitivity for tiny signal detection and a higher sensing quality factor.

[0078] In the embodiments of this application, please refer to Figures 10 to 14 , Fig.11 A schematic diagram of another structure of a test capacitor provided in an embodiment of the present application, Fig.12 A structural diagram of another test capacitor provided in an embodiment of the present application is shown. Fig.13 A schematic diagram of the structure of another test capacitor provided in an embodiment of the present application is shown in FIG. Fig.14 This is a schematic diagram of the structure of a test capacitor provided in another embodiment of the present application, and the shapes of the first capacitor electrode 221 and the second capacitor electrode 222 are not limited.

[0079] For example, Fig.10 As shown, the first capacitor electrode 221 may be a square ring electrode, and the second capacitor electrode 222 may be a square electrode. Fig.11 As shown, the first capacitor electrode 221 may be a rectangular ring electrode, and the second capacitor electrode 222 may be a rectangular electrode. Fig.12 As shown, the first capacitor electrode 221 may be a circular ring electrode, and the second capacitor electrode 222 may be a circular electrode. Fig.13 and Fig.14 As shown, the first capacitor electrode 221 may be an elliptical ring-shaped electrode, and the second capacitor electrode 222 may be an elliptical electrode correspondingly.

[0080] For example, please refer to Fig.11 , Fig.13 and Fig.14 , when the second capacitor electrode 222 is a rectangular or elliptical electrode, the angle between the length direction of the second capacitor electrode 222 and the second direction Y is greater than or equal to 0° and less than or equal to 180°. In addition, the length direction of the first capacitor electrode 221 can also be parallel to the length direction of the second capacitor electrode 222 to avoid a short circuit between the first capacitor electrode 221 and the second capacitor electrode 222.

[0081] By changing the shape and length direction of the first capacitor electrode 221 and the second capacitor electrode 222, the test capacitor 22 is designed to reserve space for different FPCs, and different test capacitors 22 are designed to ensure that the test capacitor 22 has a wide range of adaptability. For example, the elliptical electrode can have better flexibility to avoid interference with the subsequent routing on the flexible circuit board 20.

[0082] For a possible implementation, please refer to Fig.15 and Fig.16 , Fig.15 This is a schematic diagram of the structure of a display module provided in another embodiment of the present application. Fig.16 for Fig.15 Schematic diagram of the film layer at C-C' in the middle. In the same test capacitor 22, the first capacitor electrode 221 and the second capacitor electrode 222 are arranged in different layers; that is, the first capacitor electrode 221 and the second capacitor electrode 222 are respectively formed by two conductive layers 202 after patterning, and are respectively located in the two conductive layers 202.

[0083] The orthographic projection of the first capacitor electrode 221 on the substrate 201 in the flexible circuit board 20 overlaps with the orthographic projection of the second capacitor electrode 222 on the substrate 201 in the flexible circuit board 20 .

[0084] Since the flexible circuit board 20 generally has multiple conductive layers 202, the first capacitor electrode 221 and the second capacitor electrode 222 can be arranged in different layers according to needs. In this case, the positive projection area of ​​the test capacitor 22 on the substrate 201 can be minimized, and the occupied space is minimized.

[0085] For example, please refer to Fig.15 The first capacitor electrode 221 and the second capacitor electrode 222 can both be square, rectangular, circular or elliptical electrodes. The embodiment of the present application does not limit the shapes of the first capacitor electrode 221 and the second capacitor electrode 222. For example, circular electrodes are used. Circular electrodes have lower peripheral tip discharge effects than square electrodes, which can improve the effect of resisting electrostatic discharge.

[0086] For a possible implementation, please refer to Figure 2 , Figure 4 , Figures 5 to 8 as well as Fig.15 , two third target pins 21a corresponding to the same test capacitor 22 are arranged adjacent to each other in the second direction Y. For the adjacently arranged third target pins 21a, the wiring between the third target pin 21a and the test capacitor 22 does not need to be bridged with other wirings, thereby avoiding interference with the wiring of the flexible circuit board 20.

[0087] For a possible implementation, please refer to Figure 2 , Figure 4 , Figures 5 to 8 as well as Fig.15 In the case where there are multiple test capacitors 22 , the multiple test capacitors 22 may include a first test capacitor and a second test capacitor, such as the left and right test capacitors 22 in the figure.

[0088] Please refer to Figure 4The flexible circuit board 20 may also have multiple third-type pins 21b; in the second direction Y, the two third target pins 21a corresponding to the first test capacitor are distributed on one side of the multiple third-type pins 21b, and the two third target pins 21a corresponding to the second test capacitor are distributed on the other side of the multiple third-type pins 21b.

[0089] Please refer to Figure 3 The second pin group 04 may further include: a plurality of second type pins 04b, and the plurality of second type pins 04b are bonded to the plurality of third type pins 21b accordingly.

[0090] For ease of understanding, Figure 3 In the figure, in the first direction X, the second type pin 04b and the second target pin 04a are illustrated with different lengths, which does not limit the actual shapes and sizes of the two. Figure 4 In the figure, in the first direction X, the third type pin 21 b and the third target pin 21 a are illustrated with different lengths, which does not limit the actual shapes and sizes of the two.

[0091] In the embodiment of the present application, the first test capacitor and the second test capacitor can be respectively arranged on both sides of the flexible circuit board 20 in the second direction Y. The two third target pins 21a corresponding to the first test capacitor are distributed on one side of the plurality of third type pins 21b, and the two third target pins 21a corresponding to the second test capacitor are distributed on the other side of the plurality of third type pins 21b. In this way, in the case of binding offset or binding tearing between the flexible circuit board 20 and the display panel 00, the first offset or tear is the two sides of the flexible circuit board 20 in the second direction Y. At this time, the bonding between the third target pins 21a on both sides and the corresponding second target pins 04a is disconnected or abnormal, based on which, the detection component 10 can measure the change in the capacitance signal.

[0092] The display module 00 provided in the embodiment of the present application can set the sensing wiring of the sending circuit and the receiving circuit on both outer sides of the flexible circuit board 20 in the second direction Y, which will not affect the wiring of the display panel 00 and the inner area of ​​the flexible circuit board 20, and can reduce the complexity of the design of the display panel 00 and the flexible circuit board 20. The detection system composed of the detection component 10 and the test capacitor 20 can not only perform detection during the production and assembly process to ensure the integrity of the FPC bonding after each process, but also perform detection in the state of the whole machine. The bonding status can be quickly evaluated without any disassembly, which improves the timeliness and accuracy of the detection and reduces the cost and inconvenience caused by disassembly detection.

[0093] For a possible implementation, see Fig.17 , Fig.17A structural schematic diagram of a display module provided for another embodiment of the present application, wherein at least two third target pins 21a are arranged along the second direction Y, and the test capacitor 22 may include: a third test capacitor, and the flexible circuit board 20 may also have a plurality of third type pins 21b; in the second direction Y, the two third target pins 21a connected to the third test capacitor are distributed on both sides of the plurality of third type pins 21b.

[0094] In the embodiment of the present application, a test capacitor 22 can be provided, and the two third target pins 21a connected to the test capacitor 22 are respectively provided on both sides of the third type pin 21b, that is, on both sides of the flexible circuit board 20 in the second direction Y. In this way, when a binding offset or binding tear occurs between the flexible circuit board 20 and the display panel 00, the first offset or tear is the two sides of the flexible circuit board 20 in the second direction Y. At this time, the third target pins 21a on both sides are disconnected from the corresponding second target pins 04a. Based on this, the detection component 10 can measure the change in the capacitance signal. Compared with Figure 2 , Figure 4 , Figures 5 to 8 as well as Fig.15 In the test, two test capacitors 22 are required to detect. Fig.17 The solution shown only requires one test capacitor 22 to detect both sides of the flexible circuit board 20 .

[0095] For a possible implementation, please refer to Figure 3 The first pin group 03 may further include: a plurality of touch pins 03b; a portion of the display panel 00 in the display area 01 may have a touch electrode layer; and the touch electrode layer is electrically connected to the plurality of touch pins 03b.

[0096] Please refer to Figure 3 and Fig.18 , Fig.18 This is a schematic diagram of the structure of the detection component and the driver chip provided in the embodiment of the present application. The detection component 10 may have multiple pairs of first-type touch interfaces 11 and at least one pair of second-type touch interfaces 12. Multiple pairs of first-type touch interfaces 11 are correspondingly connected to multiple touch pins 03b, and at least one pair of second-type touch interfaces 12 is correspondingly connected to at least two first target pins 03a.

[0097] Among them, at least one pair of second-type touch interfaces 12 corresponds to at least one test capacitor 22. For a touch drive interface 12a and a touch sensing interface 12b in a pair of second-type touch interfaces 12, and a first capacitor electrode 221 and a second capacitor electrode 222 in the corresponding test capacitor 22, the touch drive interface 12a is used to connect to the first capacitor electrode 221, and the touch sensing interface 12b is used to connect to the second capacitor electrode 222.

[0098] For ease of understanding, Figure 3 Different filling methods are used to distinguish the touch pin 03b from other pins in the first pin group 03. Fig.18 Different filling methods are used to distinguish the first type of touch interface 11, the second type of touch interface 12 and other interfaces. Figure 3 and Fig.18 The same filling method is used to illustrate the corresponding electrical connection between the first pin group 03 and the detection component 10, but the above correspondence does not limit the specific implementation of the display module 000 provided in the embodiment of the present application.

[0099] Exemplarily, the touch electrode layer may include: a plurality of touch drive electrodes and a plurality of touch sensing electrodes, and the touch pin 03b may include: a plurality of touch drive pins and a plurality of touch sensing pins, wherein the plurality of touch drive pins and the plurality of touch sensing pins are arranged in a plurality of rows and a plurality of columns, and the touch drive electrodes in the same row are connected, and the touch sensing electrodes in the same column are connected. A row of touch drive electrodes is connected to one touch drive pin, and a column of touch sensing electrodes is connected to one touch sensing pin. For a pair of first-type touch interfaces 11, the touch drive interface of the first-type touch interface 11 is connected to one touch drive pin, and the touch sensing interface of the first-type touch interface 11 is connected to one touch sensing pin.

[0100] That is to say, the detection component 10 can be implemented by a touch chip based on capacitive touch, and the touch chip can have multiple touch interfaces, some of which (the first type of touch interface 11) are electrically connected to the touch electrode layer, and the remaining touch interfaces (the second type of touch interface 12) can be used to be electrically connected to the test capacitor 22. In other words, the display module 000 provided in the embodiment of the present application, when the display panel 00 is bound with a touch chip, does not need to add an additional chip to realize the function of the detection component 10, and the use of the remaining touch interface does not affect the normal use of the display device. By setting the test capacitor 22 on the flexible circuit board 20, and adding the second target pin 04a, the third target pin 21a and the corresponding routing between the display panel 00 and the flexible circuit board 20, the real-time detection of the binding state of the flexible circuit board 20 and the display panel 00 can be realized, which greatly improves the timeliness and accuracy of the detection, and reduces the cost and inconvenience caused by the disassembly detection.

[0101] For a possible implementation, please refer to Figure 2 and Fig.18 The first pin group 03 may further include: a plurality of data driving pins 03c; the portion of the display panel 00 in the display area 01 may further include a plurality of data signal lines; and the plurality of data signal lines are correspondingly connected to the plurality of data driving pins 03c.

[0102] The display module 000 may further include: a driving chip 30 bound and connected to the first pin group 03 in the first binding area 02a, the driving chip 30 is connected to a plurality of data driving pins 03c, and the driving chip 30 can drive the sub-pixels in the display area 01 through the data driving pins 03c.

[0103] The driving chip 30 can have multiple data driving interfaces 31 and multiple data input interfaces 32, which are electrically connected to the first type of pin 03d of the first pin group 03 through the data input interface 32, and then electrically connected to the third type of pin 21b through the second type of pin 04b, thereby realizing the electrical connection between the driving chip 30 and the control component of the display device through the flexible circuit board 20.

[0104] For a possible implementation, please refer to Fig.18 As shown, the detection component 10 and the driver chip 30 are integrated components. For example, the display panel 00 may also include a touch chip, the touch chip may include the above-mentioned detection component 10, the touch chip and the driver chip 30 may be packaged as an integrated TDDI (Touch and Display Driver Integration) chip, and the TDDI chip is bound and connected in the first binding area 02a.

[0105] The TDDI chip can accurately capture any slight tear, weak bonding or offset at the binding of the display panel 00 and the flexible circuit board 20. Once the significant attenuation of the capacitance signal of the test capacitor 22 is detected, the problem can be quickly determined and reported, providing an accurate basis for subsequent maintenance and repair. This real-time and efficient monitoring method not only improves the overall reliability of the product, but also greatly shortens the fault response time, bringing consumers a more secure and convenient user experience.

[0106] For a possible implementation, please refer to Figure 3 The first pin group 03 may further include: a plurality of first-type pins 03d; the second pin group 04 may further include: a plurality of second-type pins 04b; the plurality of first-type pins 03d and the plurality of second-type pins 04b are electrically connected to each other. The detection component 10 may further include a plurality of touch input interfaces 13, the plurality of touch input interfaces 13 are electrically connected to the plurality of first-type pins 03d of the first pin group 03, and the first-type pins 03d are electrically connected to the second-type pins 04b.

[0107] For example, please refer to Figure 3 The portion of the display panel 000 between the first binding area 02a and the second binding area 02b may have a plurality of second connection lines L2 ( Figure 3The first connection line L1 is represented by a dotted line in the figure to distinguish the first connection line L1. One end of the plurality of second connection lines L2 can be electrically connected to the plurality of first-type pins 03d, and the other end of the plurality of second connection lines L2 can be electrically connected to the plurality of second-type pins 04b. To this end, each first-type pin 03d can be electrically connected to the corresponding second-type pin 04b through a corresponding one of the plurality of second connection lines L2.

[0108] In summary, the display module may include: a display panel, a detection component and a flexible circuit board. By binding the detection component to the first binding area of ​​the display panel, a test capacitor is set on the flexible circuit board. After the flexible circuit board is bound and connected to the second binding area, the third target pin on the flexible circuit board is bonded to the second target pin on the second binding area. The detection component is electrically connected to the second target pin on the second binding area through the first target pin, and then electrically connected to the test capacitor through the second target pin on the second binding area and the third target pin on the flexible circuit board. In this way, the detection component can measure the capacitance signal of the test capacitor, and the capacitance signal can be used to characterize the bonding state between the second target pin and the corresponding third target pin; based on this, the binding state of the flexible circuit board and the display panel can be determined according to the capacitance signal.

[0109] Please refer to Fig.19 , Fig.19 The display device 100 is a schematic diagram of the structure of a display device provided in an embodiment of the present application, and may include: a control component 40 and any of the above-mentioned display modules 000 , wherein the control component 40 is electrically connected to the display module 000 .

[0110] The control component 40 is configured to obtain a capacitance signal of the test capacitor 22 through the detection component 10 , and determine a bonding state between the second target pin 04 a and the corresponding third target pin 21 a according to the capacitance signal.

[0111] For example, when the bonding state between the second target pin 04a and the corresponding third target pin 21a is abnormal, the control component 40 can display abnormal information through the display area 01 to prompt the consumer of the abnormal situation and facilitate the consumer to send the product for inspection and repair; it can also generate a system log, and maintenance personnel can query the abnormal situation through the log.

[0112] In addition, the display device 000 can display a detection control in the display area 01 of the display panel 00, and the detection control generates a detection instruction under the triggering of the user. After obtaining the detection instruction, the control component 40 obtains the capacitance information of all the test capacitors 22 through the detection component 10, and detects and judges the bonding state between the second target pin 04a connected to each test capacitor 22 and the corresponding third target pin 21a, so as to realize the detection of the binding state between the flexible circuit board 20 and the display panel 00, that is, the function of user self-inspection can be realized.

[0113] In the embodiment of the present application, the display device 100 may be a display screen in a display device such as a mobile phone, a tablet computer, a laptop computer, a monitor, a smart TV, etc. The display device 100 may also have the technical effects of the above-mentioned display module 000, which will not be described again.

[0114] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0115] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0116] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: include: Display panels, detection components, and flexible circuit boards; The display panel comprises a display area and a non-display area surrounding the display area; The non-display area includes: a first binding area and a second binding area arranged in a first direction, the first binding area being closer to the display area than the second binding area; a portion of the display panel distributed in the first binding area has a first pin group, and a portion of the display panel distributed in the second binding area has a second pin group; at least two first target pins in the first pin group and at least two second target pins in the second pin group are electrically connected to each other; the at least two second target pins are arranged along a second direction; and the second direction intersects with the first direction; The detection component is bound and connected to the first pin group in the first binding area; The flexible circuit board is bound and connected to the second pin group in the second binding area, and the flexible circuit board has: at least two third target pins and at least one test capacitor; the at least two third target pins are bonded correspondingly to the at least two second target pins, every two of the at least two third target pins correspond to one test capacitor, and the first capacitor electrode and the second capacitor electrode in one test capacitor are electrically connected to the corresponding two third target pins, respectively.

2. The display module according to claim 1, characterized in that: In the same test capacitor, the first capacitor electrode and the second capacitor electrode are arranged in the same layer and made of the same material.

3. The display module according to claim 2, characterized in that: In the same test capacitor, an arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the first direction, or an arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the second direction.

4. The display module according to claim 2, characterized in that: In the same test capacitor, the first capacitor electrode has a hollow area, and the orthographic projection of the second capacitor electrode on the substrate in the flexible circuit board is located within the orthographic projection of the hollow area on the substrate in the flexible circuit board.

5. The display module according to claim 4, characterized in that: The first capacitor electrode is a square ring electrode, and the second capacitor electrode is a square electrode; Or, the first capacitor electrode is a rectangular ring electrode, and the second capacitor electrode is a rectangular electrode; Or, the first capacitor electrode is a circular ring electrode, and the second capacitor electrode is a circular electrode; Alternatively, the first capacitor electrode is an elliptical ring-shaped electrode, and the second capacitor electrode is an elliptical electrode.

6. The display module according to claim 5, characterized in that: When the second capacitor electrode is a rectangular or elliptical electrode, an angle between a length direction of the second capacitor electrode and the second direction is greater than or equal to 0° and less than or equal to 180°.

7. The display module according to claim 1, characterized in that: In the same test capacitor, the first capacitor electrode and the second capacitor electrode are arranged in different layers; The orthographic projection of the first capacitor electrode on the substrate in the flexible circuit board overlaps with the orthographic projection of the second capacitor electrode on the substrate in the flexible circuit board.

8. The display module according to claim 3 or 7, characterized in that: The first capacitor electrode and the second capacitor electrode are both square, rectangular, circular or elliptical electrodes.

9. The display module according to any one of claims 1 to 7, characterized in that: The two third target pins corresponding to the same test capacitor are arranged adjacent to each other in the second direction.

10. The display module according to claim 9, characterized in that: In the case where there are multiple test capacitors, the multiple test capacitors include a first test capacitor and a second test capacitor; The flexible circuit board also has a plurality of third-type pins; in the second direction, the two third target pins corresponding to the first test capacitor are distributed on one side of the plurality of third-type pins, and the two third target pins corresponding to the second test capacitor are distributed on the other side of the plurality of third-type pins; The second pin group further includes: a plurality of second-type pins, and the plurality of second-type pins are bonded correspondingly to the plurality of third-type pins.

11. The display module according to any one of claims 1 to 7 and 10, characterized in that: The first pin group further includes: a plurality of touch pins; the display panel has a touch electrode layer in the display area; the touch electrode layer is electrically connected to the plurality of touch pins; The detection component has multiple pairs of first-type touch interfaces and at least one pair of second-type touch interfaces; the multiple pairs of first-type touch interfaces are correspondingly connected to the multiple touch pins, and the at least one pair of second-type touch interfaces is correspondingly connected to the at least two first target pins; Among them, the at least one pair of second-type touch interfaces corresponds to at least one test capacitor; for a touch drive interface and a touch sensing interface in a pair of the second-type touch interfaces, and the corresponding first capacitor electrode and second capacitor electrode in the test capacitor, the touch drive interface is used to connect to the first capacitor electrode, and the touch sensing interface is used to connect to the second capacitor electrode.

12. The display module according to claim 11, characterized in that: The first pin group further includes: a plurality of data driving pins; the portion of the display panel in the display area also has a plurality of data signal lines; the plurality of data signal lines are correspondingly connected to the plurality of data driving pins; The display module further includes: a driving chip bound and connected to the first pin group in the first binding area, and the driving chip is connected to the plurality of data driving pins.

13. The display module according to claim 12, characterized in that: The detection component and the driving chip are integrated into one component.

14. The display module according to claim 13, characterized in that: The first pin group further includes: a plurality of first-type pins; the second pin group further includes: a plurality of second-type pins; the plurality of first-type pins and the plurality of second-type pins are electrically connected to each other.

15. A display device, characterized in that: include: A control component and a display module according to any one of claims 1 to 14, wherein the control component is electrically connected to the display module.

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