Chip packaging positioning jig and use method thereof

Abstract

The invention relates to the technical field of chip packaging and positioning, in particular to a chip packaging and positioning jig and a using method thereof. A working groove is formed in one side wall of the positioning base; and a chip positioning mechanism is arranged in the working groove. The adjacent connecting magnetic columns are controlled to move towards the opposite sides, so that the elastic pieces are compressed, the elastic pieces are wavy, the width of the elastic pieces is increased in the compression process, and the elastic pieces extend out of the connecting grooves, so that the corresponding contact pieces can abut against the connecting points of the chip, the size of the outlet is reduced, and the chip is prevented from falling off; meanwhile, when the two groups of connecting magnetic columns move to the lower part of the detection cavity, a lifting magnetic plate is pushed through magnetism to drive a plurality of groups of detection probes to extend out of four groups of telescopic through grooves and abut against pins of the packaging substrate, so that functional detection when the chip is adhered to the packaging substrate is realized; the working stability of the positioning jig is improved, and meanwhile, the using effect of the positioning jig on chip packaging work is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging and positioning, and in particular relates to a chip packaging and positioning fixture and a use method thereof. Background Art

[0002] Chip packaging is the basic level of integrated circuit packaging, which refers to the process of electrically connecting a single chip to a packaging substrate or lead frame, physically protecting it, and forming external pins. When packaging a chip, a positioning fixture is usually required to position the chip and the packaging substrate.

[0003] After searching, in the prior art, the Chinese patent announcement number: CN114068378A, announcement date: 2022-02-18, discloses a chip packaging positioning fixture, including a control base, a mainframe fixedly installed on the control base, a positioning platform and a vertical plate fixedly installed on the mainframe, and a positioning column fixedly installed on the positioning platform, a positioning groove is provided on the positioning platform, and an air vent is provided on the positioning groove, and a through-hole hanging rope is installed in the air vent, an air intake pipe is fixedly connected to the control base, and a main through pipe is fixedly connected to the air intake pipe, a shunt pipe is connected to the main through pipe, and a positioning structure with a segmented working function is connected to the shunt pipe; the invention adds a positioning structure around the positioning groove on the surface of the fixture, and uses the positioning structure to position the chip placed in the positioning groove to ensure the smooth progress of the chip packaging process. Through a chip packaging positioning method, the operation process of the positioning fixture can be standardized, the coordination of the positioning structure in the fixture can be ensured, and the stable packaging of the chip can be completed.

[0004] However, the positioning fixture still has the following defects: When the chip is pasted on the packaging substrate, it is impossible to immediately detect whether the chip can work normally. Functional testing needs to be performed after the chip is packaged, which reduces the effectiveness of the positioning fixture in chip packaging. Summary of the invention

[0005] In view of the above problems, the present invention provides a chip packaging positioning fixture, comprising a positioning base, a working groove is formed on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove; a substrate positioning mechanism for calibrating and positioning a packaging substrate is provided directly below the chip positioning mechanism; The chip positioning mechanism includes several groups of auxiliary positioning components; The auxiliary positioning assembly includes a second mounting frame for calibrating the positioning chip; a group of connecting grooves are respectively provided on the inner walls of the four sides of the second mounting frame; two groups of connecting magnetic columns are provided in each group of the connecting grooves; a group of elastic sheets are provided between the two corresponding groups of connecting magnetic columns; the elastic sheets are wavy, and a plurality of groups of connecting contact sheets capable of connecting to the chip are evenly spaced on a side wall close to the second positioning plate; Four groups of detection cavities are arranged in the second mounting frame; each group of the detection cavities is slidably connected with a group of lifting magnetic plates in the vertical direction; a group of guide blocks are arranged on the top of each group of lifting magnetic plates; and a number of detection probes connected to the packaging substrate are arranged on the top of each group of guide blocks.

[0006] Furthermore, the top of the working groove is an open structure; the chip positioning mechanism and the substrate positioning mechanism are transmission connected; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is transmission connected to the chip positioning mechanism; an installation slot is provided on one side wall of the positioning base; an auxiliary unloading mechanism is movably penetrated in the installation slot; two groups of limiting magnets are symmetrically provided at the two side edges of the top of the installation slot.

[0007] Furthermore, a first working groove is provided on one side wall of the positioning base; an air guide cavity is provided on an inner wall of one side of the mounting groove; a plurality of groups of first electric push rods are provided on an inner wall of the air guide cavity on a side away from the auxiliary unloading mechanism; an air guide plate is transmission-connected to the output ends of the plurality of first electric push rods; a plurality of groups of limiting connecting tubes are evenly spaced on a side wall of the air guide plate close to the auxiliary unloading mechanism; an end of each group of limiting connecting tubes away from the air guide plate is movable and penetrates into the auxiliary unloading mechanism; a refrigerator is provided on an inner wall of the air guide cavity on a side away from the auxiliary unloading mechanism.

[0008] Furthermore, the chip positioning mechanism also includes a rotating shaft; a plurality of groups of mounting blocks are distributed in a circular array on the outer wall of the rotating shaft; a plurality of groups of chip positioning grooves are evenly spaced on a side wall of each group of mounting blocks away from the rotating shaft; each group of auxiliary positioning components is installed in a corresponding group of chip positioning grooves; and a group of telescopic suction cups are provided in each group of chip positioning grooves.

[0009] Furthermore, the substrate positioning mechanism includes a rotating column; a plurality of groups of substrate positioning grooves are arranged in a circular array on the outer wall of the rotating column; a group of first positioning plates capable of calibrating and positioning the packaging substrate are arranged on the four inner walls of each group of substrate positioning grooves; a group of adsorption holes are arranged on the inner wall of one side of each group of substrate positioning grooves close to the axis of the rotating column; an adsorption cavity is arranged in the rotating column; the adsorption cavity is connected to the plurality of groups of adsorption holes; and a closed magnetic plate is arranged in the adsorption cavity.

[0010] Furthermore, the auxiliary unloading mechanism includes a first mounting frame; the first mounting frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first mounting frame; a cooling groove and a second working groove are respectively provided on the inner walls on both sides of the first mounting frame; the second working groove is connected to the first working groove.

[0011] Furthermore, a plurality of groups of air guide holes are evenly spaced on a side wall of the cooling groove away from the second working groove; each group of the limiting connecting tubes is movably inserted into a corresponding group of air guide holes; a plurality of groups of second electric push rods are symmetrically arranged on the inner walls on both sides of the first mounting frame; a group of guide plates are transmission-connected to the output ends of the plurality of groups of the second electric push rods on the same side; a plurality of groups of guide rollers are evenly spaced on the side walls opposite to the two groups of guide plates.

[0012] Furthermore, the second mounting frame is in the shape of a U-shaped letter "U". A group of second positioning plates are respectively provided on the inner walls of the four sides of the bottom of the second mounting frame. A group of telescopic grooves are respectively provided at the edges of the four sides of the top of the second mounting frame. Each group of the detection cavities is connected to a corresponding group of telescopic grooves.

[0013] Furthermore, a plurality of reset springs are symmetrically arranged on the top of each group of lifting magnetic plates; the top of each group of reset springs is connected to the top of a corresponding group of detection cavities; a group of guide blocks are arranged on the top of each group of lifting magnetic plates; a plurality of detection probes are damped and slidably connected to the top of each group of guide blocks; and each group of detection probes is electrically connected to a corresponding group of connection contacts.

[0014] A method for using a chip packaging positioning fixture, the method comprising: Placing a plurality of groups of chips in a chip positioning mechanism; placing a plurality of groups of package substrates in a substrate positioning mechanism; Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the top of the packaging substrate; Controlling two adjacent groups of connection magnetic columns to move toward opposite sides, compressing the elastic sheet, so that a plurality of groups of connection contact sheets are connected to the chip; Two adjacent groups of connected magnetic pillars move to the bottom of the corresponding lifting magnetic plate, and the lifting magnetic plate is pushed by magnetic force to drive several groups of detection probes to extend and connect with the packaging substrate; Controlling the chip positioning mechanism to stick the chip on the packaging substrate; Complete chip packaging positioning work.

[0015] The beneficial effects of the present invention are: 1. By controlling the adjacent connecting magnetic columns to move toward the opposite side, the elastic sheet is compressed. Since the elastic sheet is wavy, its width increases and extends out of the connecting groove during the compression process, so that the corresponding contact sheet can contact the connection point of the chip and reduce the outlet size to prevent the chip from falling. At the same time, when the two groups of connecting magnetic columns move to the bottom of the detection cavity, the lifting magnetic plate is driven by magnetism to drive several groups of detection probes to extend from the four groups of telescopic through grooves and contact the pins of the packaging substrate, thereby realizing functional detection when the chip is pasted to the packaging substrate, and improving the working stability of the positioning fixture while improving the use effect of the positioning fixture on chip packaging.

[0016] 2. Since the chip usually needs to be heated when it is pasted on the packaging substrate, when the corresponding groups of packaging substrates and chips are rotated to face the cooling groove, cold air is introduced through the corresponding groups of air guide holes to cool the packaging substrates and chips, so that the packaging substrates and chips can be directly unloaded when they are rotated to the bottom, avoiding the need for static cooling. At the same time, the guide plates on both sides are controlled to drive several groups of guide rollers to make slow reciprocating motions, which can correct the position of the packaging substrates and chips, so that the unloading positions of several groups of packaging substrates and chips remain consistent, thereby improving the unloading efficiency and quality of the positioning fixture.

[0017] 3. By controlling the circulating motor to drive the rotating shaft to rotate, the rotating shaft will drive the rotating column to rotate, and the corresponding groups of substrate positioning grooves will be exposed in the first working groove. Then, the corresponding groups of packaging substrates will be placed in the corresponding substrate positioning grooves for calibration and positioning. When the corresponding groups of chips are rotated to the bottom of the rotating shaft, the corresponding groups of packaging substrates are rotated to the top of the rotating column. At this time, the corresponding groups of chips and the packaging substrates are correctly aligned, and the corresponding telescopic suction cups will stick the chips to the packaging substrates, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture.

[0018] 4. When the auxiliary unloading mechanism needs to be disassembled, several groups of first electric push rods can be controlled to drive the air guide plate to move toward the side away from the auxiliary unloading mechanism, so that several groups of limiting connecting pipes are disengaged from the corresponding groups of air guide holes. Then the first mounting frame can be directly pulled out from the side of the mounting groove to carry out corresponding repairs or maintenance work, thereby ensuring the refrigeration efficiency and improving the maintenance efficiency of the positioning fixture.

[0019] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic structural diagram of a positioning fixture according to an embodiment of the present invention is shown; Figure 2 A cross-sectional schematic diagram of a positioning fixture according to an embodiment of the present invention is shown; Figure 3 A schematic structural diagram of a chip positioning mechanism according to an embodiment of the present invention is shown; Figure 4 A schematic structural diagram of an auxiliary positioning assembly according to an embodiment of the present invention is shown; Figure 5 A cross-sectional schematic diagram of an auxiliary positioning assembly according to an embodiment of the present invention is shown; Figure 6 A schematic structural diagram of an elastic sheet according to an embodiment of the present invention is shown; Figure 7 A schematic structural diagram of a substrate positioning mechanism according to an embodiment of the present invention is shown; Figure 8 A schematic cross-sectional view of a substrate positioning mechanism according to an embodiment of the present invention is shown; Fig. 9 A structural schematic diagram of an auxiliary unloading mechanism according to an embodiment of the present invention is shown.

[0022] In the figure: 1, positioning base; 2, working groove; 3, chip positioning mechanism; 4, substrate positioning mechanism; 5, circulation motor; 6, installation groove; 7, auxiliary unloading mechanism; 8, limiting magnet; 9, first working groove; 10, air guide cavity; 11, first electric push rod; 12, air guide plate; 13, limiting connecting pipe; 14, refrigerator; 301, rotating shaft; 302, mounting block; 303, chip positioning groove; 304, auxiliary positioning assembly; 305, telescopic suction cup; 401, rotating column; 402, substrate positioning groove; 403, first positioning plate; 404, adsorption hole; 405, adsorption cavity; 406, closed magnetic plate; 701, first mounting frame; 702, conveying belt; 703, cooling groove; 704, second working groove; 705, air guide hole; 706, second electric push rod; 707, guide plate; 708, guide roller; 30401, second mounting frame; 30402, second positioning plate; 30403, telescopic through groove; 30404, power cavity; 30405, third electric push rod; 30406, lead screw; 30407, transmission block; 30408, connecting groove; 30409, connecting magnetic column; 30410, elastic sheet; 30411, detection cavity; 30412, lifting magnetic plate; 30413, reset spring; 30414, guide block; 30415, detection probe; 30416, connecting contact sheet. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The embodiment of the present invention provides a chip packaging positioning fixture, including a positioning base 1. For example, Figure 1 and Figure 2As shown, a working groove 2 is provided on one side wall of the positioning base 1; the top of the working groove 2 is an open structure; a chip positioning mechanism 3 is provided in the working groove 2; a substrate positioning mechanism 4 is provided directly below the chip positioning mechanism 3; the chip positioning mechanism 3 and the substrate positioning mechanism 4 are transmission-connected; a circulating motor 5 is provided on one side wall of the positioning base 1; the output end of the circulating motor 5 is transmission-connected to the chip positioning mechanism 3; a mounting through groove 6 is provided on one side wall of the positioning base 1; an auxiliary material discharge mechanism 7 is movably penetrated in the mounting through groove 6; two groups of limiting magnets 8 are symmetrically provided at the two side edges of the top of the mounting through groove 6 A first working groove 9 is provided on one side wall of the positioning base 1; an air guide cavity 10 is provided on an inner wall of one side of the mounting through groove 6; a plurality of groups of first electric push rods 11 are provided on the inner wall of the air guide cavity 10 away from the auxiliary unloading mechanism 7; an air guide plate 12 is transmission-connected to the output ends of the plurality of first electric push rods 11; a plurality of groups of limiting connecting tubes 13 are evenly spaced on a side wall of the air guide plate 12 close to the auxiliary unloading mechanism 7; an end of each group of limiting connecting tubes 13 away from the air guide plate 12 is movable and penetrates into the auxiliary unloading mechanism 7; a refrigerator 14 is provided on the inner wall of the air guide cavity 10 away from the auxiliary unloading mechanism 7.

[0025] When performing chip packaging positioning work, several groups of chips and packaging substrates are placed in the chip positioning mechanism 3 and the substrate positioning mechanism 4 for positioning, and then the chip positioning mechanism 3 is controlled to stick the chip on the packaging substrate, and then the substrate positioning mechanism 4 is controlled to drive the packaging substrate and the chip to carry out material unloading, which is convenient for the subsequent protective shell injection molding work.

[0026] For example, Figure 3 As shown, the chip positioning mechanism 3 includes a rotating shaft 301; a plurality of groups of mounting blocks 302 are arranged in a circular array on the outer wall of the rotating shaft 301; a plurality of groups of chip positioning grooves 303 are evenly spaced on a side wall of each group of mounting blocks 302 away from the rotating shaft 301; a group of auxiliary positioning components 304 are arranged in each group of chip positioning grooves 303; a group of telescopic suction cups 305 are arranged in each group of chip positioning grooves 303; For example, Figure 4 and Figure 5As shown, the substrate positioning mechanism 4 includes a rotating column 401; the rotating column 401 is transmission-connected with the rotating shaft 301; a plurality of groups of substrate positioning grooves 402 are arranged in a circular array on the outer wall of the rotating column 401; a group of first positioning plates 403 are arranged on the four inner walls of each group of the substrate positioning grooves 402; a group of adsorption holes 404 are arranged on the inner wall of one side of each group of the substrate positioning grooves 402 close to the axis of the rotating column 401; an adsorption cavity 405 is arranged in the rotating column 401; the adsorption cavity 405 is communicated with the plurality of groups of adsorption holes 404; a closed magnetic plate 406 is arranged in the adsorption cavity 405.

[0027] When performing chip packaging positioning work, several groups of chips are placed in the chip positioning grooves 303, and the corresponding groups of auxiliary positioning components 304 are controlled to calibrate and position the chips. Then, the circulating motor 5 is controlled to drive the rotating shaft 301 to rotate, and the rotating shaft 301 will drive the rotating column 401 to rotate, so that the corresponding groups of substrate positioning grooves 402 are exposed in the first working groove 9, and then several groups of packaging substrates are placed in the corresponding substrate positioning grooves 402. First, the adsorption holes 404 generate a slight adsorption force on the packaging substrate to prevent the packaging substrate from falling. Then, the four groups of first positioning plates 403 in each group of substrate positioning grooves 402 calibrate and position the corresponding packaging substrate. When the corresponding groups of chips rotate to the bottom of the rotating shaft 301, the corresponding groups of packaging substrates rotate to the top of the rotating column 401. Since the corresponding groups of chips and the packaging substrates are correctly aligned at this time, the auxiliary positioning components 304 are controlled to release the restrictions on the chips, and the corresponding telescopic suction cups 305 stick the chips on the packaging substrates, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture. Under the magnetic effect of the two groups of limiting magnets 8, the closed magnetic plate 406 always remains at the bottom of the adsorption chamber 405. When the corresponding groups of packaging substrates and chips rotate to the bottom of the rotating column 401, the closed magnetic plate 406 will close the corresponding groups of adsorption holes 404, so that the corresponding packaging substrates and chips will fall into the auxiliary unloading mechanism 7 for unloading.

[0028] For example, Figure 6As shown, the auxiliary unloading mechanism 7 includes a first mounting frame 701; the first mounting frame 701 is U-shaped; a conveyor belt 702 is provided on the bottom inner wall of the first mounting frame 701; a cooling groove 703 and a second working groove 704 are respectively provided on the inner walls on both sides of the first mounting frame 701; the second working groove 704 is connected to the first working groove 9; a plurality of groups of air guide holes 705 are evenly spaced on a side wall of the cooling groove 703 away from the second working groove 704; each group of the limiting connecting pipes 13 are movable through a corresponding group of air guide holes 705; a plurality of groups of second electric push rods 706 are symmetrically provided on the inner walls on both sides of the first mounting frame 701; a group of guide plates 707 are transmission-connected to the output ends of the plurality of groups of the second electric push rods 706 on the same side; a plurality of groups of guide rollers 708 are evenly spaced on the opposite side walls of the two groups of the guide plates 707.

[0029] When performing chip packaging and positioning work, since the chip usually needs to be heated when it is pasted on the packaging substrate, when the corresponding groups of packaging substrates and chips rotate to face the cooling groove 703, cold air is introduced through the corresponding groups of air guide holes 705 to cool the packaging substrates and chips, so that the packaging substrates and chips can be directly unloaded when they rotate to the bottom, avoiding the need for static cooling work. At the same time, the guide plates 707 on both sides are controlled to drive the groups of guide rollers 708 to make slow reciprocating movements, which can correct the positions of the packaging substrates and chips, so that the unloading positions of the groups of packaging substrates and chips are consistent, thereby improving the unloading efficiency and quality of the positioning fixture. When it is necessary to disassemble the auxiliary unloading mechanism 7, the groups of first electric push rods 11 can be controlled to drive the air guide plates 12 to move toward the side away from the auxiliary unloading mechanism 7, so that the groups of limiting connecting pipes 13 are separated from the corresponding groups of air guide holes 705, and then the first mounting frame 701 can be directly pulled out from the side of the mounting slot 6 to perform corresponding repairs or maintenance work, thereby ensuring the cooling efficiency and improving the maintenance efficiency of the positioning fixture.

[0030] For example, Figure 7 , Figure 8 and Fig. 9As shown, the auxiliary positioning component 304 includes a second mounting frame 30401; the second mounting frame 30401 is in a shape of a double-square; on the inner walls of the four sides of the bottom of the second mounting frame 30401, a set of second positioning plates 30402 are respectively provided; at the edges of the four sides of the top of the second mounting frame 30401, a set of telescopic through grooves 30403 are respectively provided; four power chambers 30404 are provided inside the second mounting frame 30401; on the inner wall of each power chamber 30404 close to the second positioning plate 30402, several third electric push rods 30405 are provided; the output end of each third electric push rod 30405 is in transmission connection with a corresponding set of second positioning plates 30402; two lead screws 30406 are provided in each power chamber 30404; one ends of the corresponding two lead screws 30406 are fixedly connected, and the other ends are respectively rotatably connected to the inner walls of both sides of a corresponding power chamber 30404; the thread directions of the corresponding two lead screws 30406 are opposite, and the central axes are on the same straight line; two transmission blocks 30407 are slidably connected to the top inner wall of each power chamber 30404; each transmission block 30407 is in threaded connection with a corresponding lead screw 30406; a set of connection grooves 30408 are respectively formed on the inner walls of the four sides of the second mounting frame 30401; one end of each transmission block 30407 extends into a corresponding set of connection grooves 30408 and is in transmission connection with a set of connection magnetic columns 30409; a set of elastic sheets 30410 are provided between the corresponding two connection magnetic columns 30409; the elastic sheet 30410 is wavy, and several connection contact pieces 30416 are equidistantly provided on the side wall close to the second positioning plate 30402; four detection chambers 30411 are provided inside the second mounting frame 30401; each detection chamber 30411 is communicated with a corresponding telescopic through groove 30403; a set of lifting magnetic plates 30412 are slidably connected in the vertical direction in each detection chamber 30411; several reset springs 30413 are symmetrically provided on the top of each lifting magnetic plate 30412; the top of each reset spring 30413 is connected to the top of a corresponding detection chamber 30411; a set of guiding blocks 30414 are provided on the top of each lifting magnetic plate 30412; several detection probes 30415 are damping slidably connected to the top of each guiding block 30414; each detection probe 30415 is electrically connected to a corresponding connection contact piece 30416.

[0031] When performing chip packaging positioning work, several groups of chips are placed in the second installation frame 30401, and several groups of third electric push rods 30405 drive four groups of second positioning plates 30402 to calibrate and position the chips. Then, when several groups of chips are rotated to the bottom, the screw rod 30406 is controlled to rotate. Under the threaded connection relationship between the screw rod 30406 and the transmission block 30407, the two adjacent groups of transmission blocks 30407 can drive the adjacent connecting magnetic columns 30409 to move toward the opposite side, so that the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is wavy, its width changes during the compression process. The large connecting groove 30408 ​​is extended so that the corresponding contact piece can contact the connection point of the chip. At the same time, when the two groups of connecting magnetic pillars 30409 move to the bottom of the detection cavity 30411, the lifting magnetic plate 30412 is magnetically pushed to drive several groups of detection probes 30415 to extend from the four groups of telescopic through grooves 30403 and contact the pins of the packaging substrate. Not only does it realize the functional detection when the chip and the packaging substrate are pasted, but the extension of the elastic sheet 30410 can reduce the size of the outlet to prevent the chip from falling during transfer, thereby improving the working stability of the positioning fixture and the use effect of the positioning fixture on chip packaging.

[0032] By controlling the adjacent connecting magnetic pillars 30409 to move toward the opposite side, the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is wavy, its width increases during the compression process and extends out of the connecting groove 30408, so that the corresponding contact piece can contact the connection point of the chip. At the same time, when the two groups of connecting magnetic pillars 30409 move to the bottom of the detection cavity 30411, the lifting magnetic plate 30412 is magnetically pushed to drive several groups of detection probes 30415 to extend out from the four groups of telescopic through grooves 30403 and contact the pins of the packaging substrate. Not only does it realize the functional detection of the chip and the packaging substrate when they are pasted, but the extension of the elastic sheet 30410 can reduce the size of the outlet to prevent the chip from falling during transfer, thereby improving the working stability of the positioning fixture and the use effect of the positioning fixture on chip packaging.

[0033] Since the chip usually needs to be heated when it is pasted on the packaging substrate, when the corresponding groups of packaging substrates and chips rotate to face the cooling groove 703, cold air is introduced through the corresponding groups of air guide holes 705 to cool the packaging substrates and chips, so that the packaging substrates and chips can be directly unloaded when they rotate to the bottom, avoiding the need for static cooling. At the same time, the guide plates 707 on both sides are controlled to drive the groups of guide rollers 708 to make slow reciprocating motions, which can correct the position of the packaging substrates and chips, so that the unloading positions of the groups of packaging substrates and chips are consistent, thereby improving the unloading efficiency and quality of the positioning fixture.

[0034] By controlling the circulating motor 5 to drive the rotating shaft 301 to rotate, the rotating shaft 301 will drive the rotating column 401 to rotate, and the corresponding groups of substrate positioning grooves 402 will be exposed in the first working groove 9, and then the corresponding groups of packaging substrates will be placed in the corresponding substrate positioning grooves 402 for calibration and positioning. When the corresponding groups of chips are rotated to the bottom of the rotating shaft 301, the corresponding groups of packaging substrates are rotated to the top of the rotating column 401. At this time, since the corresponding groups of chips and the packaging substrates are correctly aligned, the corresponding telescopic suction cup 305 will stick the chips to the packaging substrate, thereby realizing continuous chip packaging positioning work and improving the working efficiency of the positioning fixture.

[0035] When the auxiliary unloading mechanism 7 needs to be disassembled, several groups of first electric push rods 11 can be controlled to drive the air guide plate 12 to move toward the side away from the auxiliary unloading mechanism 7, so that several groups of limiting connecting tubes 13 are disengaged from the corresponding groups of air guide holes 705. Subsequently, the first mounting frame 701 can be directly pulled out from the side of the mounting groove 6 to carry out corresponding repairs or maintenance work, thereby improving the maintenance efficiency of the positioning fixture while ensuring the refrigeration efficiency.

[0036] Based on the above-mentioned chip packaging positioning fixture, an embodiment of the present invention further proposes a method for using the chip packaging positioning fixture. Exemplarily, the method includes: Placing a plurality of groups of chips in a chip positioning mechanism; placing a plurality of groups of package substrates in a substrate positioning mechanism; Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the top of the packaging substrate; Controlling two adjacent groups of connection magnetic columns to move toward opposite sides, compressing the elastic sheet, so that a plurality of groups of connection contact sheets are connected to the chip; Two adjacent groups of connected magnetic pillars move to the bottom of the corresponding lifting magnetic plate, and the lifting magnetic plate is pushed by magnetic force to drive several groups of detection probes to extend and connect with the packaging substrate; Controlling the chip positioning mechanism to stick the chip on the packaging substrate; Complete chip packaging positioning work.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip packaging positioning fixture, comprising a positioning base, characterized in that: A working groove is provided on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove; and a substrate positioning mechanism for calibrating and positioning the packaging substrate is provided directly below the chip positioning mechanism; The chip positioning mechanism includes several groups of auxiliary positioning components; The auxiliary positioning assembly includes a second mounting frame for calibrating the positioning chip; a group of connecting grooves are respectively provided on the inner walls of the four sides of the second mounting frame; two groups of connecting magnetic columns are provided in each group of the connecting grooves; a group of elastic sheets are provided between the two corresponding groups of connecting magnetic columns; the elastic sheets are wavy, and a plurality of groups of connecting contact sheets capable of connecting to the chip are evenly spaced on a side wall close to the second positioning plate; Four groups of detection cavities are arranged in the second mounting frame; each group of the detection cavities is slidably connected with a group of lifting magnetic plates in the vertical direction; a group of guide blocks are arranged on the top of each group of lifting magnetic plates; and a number of detection probes connected to the packaging substrate are arranged on the top of each group of guide blocks.

2. The chip packaging positioning fixture according to claim 1, characterized in that: The top of the working groove is an open structure; the chip positioning mechanism and the substrate positioning mechanism are transmission connected; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is transmission connected to the chip positioning mechanism; a mounting groove is provided on one side wall of the positioning base; an auxiliary unloading mechanism is movably penetrated in the mounting groove; two groups of limiting magnets are symmetrically provided at the two side edges of the top of the mounting groove.

3. The chip packaging positioning fixture according to claim 2, characterized in that: A first working groove is provided on one side wall of the positioning base; an air guide cavity is provided on an inner wall on one side of the installation slot; a plurality of groups of first electric push rods are provided on an inner wall on a side of the air guide cavity away from the auxiliary unloading mechanism; an air guide plate is transmission-connected to the output ends of the plurality of first electric push rods; a plurality of groups of limiting connecting tubes are evenly spaced on a side wall of the air guide plate close to the auxiliary unloading mechanism; an end of each group of limiting connecting tubes away from the air guide plate can be movably inserted into the auxiliary unloading mechanism; a refrigerator is provided on an inner wall on a side of the air guide cavity away from the auxiliary unloading mechanism.

4. The chip packaging positioning fixture according to claim 1, characterized in that: The chip positioning mechanism also includes a rotating shaft; a plurality of groups of mounting blocks are distributed in a circular array on the outer wall of the rotating shaft; a plurality of groups of chip positioning grooves are evenly spaced on a side wall of each group of mounting blocks away from the rotating shaft; each group of auxiliary positioning components is installed in a corresponding group of chip positioning grooves; and a group of telescopic suction cups are provided in each group of chip positioning grooves.

5. The chip packaging positioning fixture according to claim 1, characterized in that: The substrate positioning mechanism comprises a rotating column; a plurality of groups of substrate positioning grooves are arranged in a circular array on the outer wall of the rotating column; a group of first positioning plates capable of calibrating and positioning the packaging substrate are arranged on the inner walls on four sides of each group of substrate positioning grooves; a group of adsorption holes are arranged on the inner wall on one side of each group of substrate positioning grooves close to the axis of the rotating column; an adsorption cavity is arranged in the rotating column; the adsorption cavity is connected to the plurality of groups of adsorption holes; and a closed magnetic plate is arranged in the adsorption cavity.

6. The chip packaging positioning fixture according to claim 3, characterized in that: The auxiliary unloading mechanism includes a first mounting frame; the first mounting frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first mounting frame; a cooling groove and a second working groove are respectively provided on the inner walls on both sides of the first mounting frame; the second working groove is connected to the first working groove.

7. The chip packaging positioning fixture according to claim 6, characterized in that: A plurality of groups of air guide holes are evenly spaced on a side wall of the cooling groove away from the second working groove; each group of the limit connecting pipes is movably inserted into a corresponding group of air guide holes; a plurality of groups of second electric push rods are symmetrically arranged on the inner walls on both sides of the first mounting frame; a group of guide plates are transmission-connected to the output ends of the plurality of groups of the second electric push rods on the same side; a plurality of groups of guide rollers are evenly spaced on the side walls opposite to the two groups of guide plates.

8. The chip packaging positioning fixture according to claim 1, characterized in that: The second mounting frame is in the shape of a U-shaped letter "U". A group of second positioning plates are respectively provided on the inner walls of the four sides of the bottom of the second mounting frame. A group of telescopic through grooves are respectively provided at the edges of the four sides of the top of the second mounting frame. Each group of the detection cavities is connected to a corresponding group of telescopic through grooves.

9. The chip packaging positioning fixture according to claim 8, characterized in that: Several groups of reset springs are symmetrically arranged on the top of each group of lifting magnetic plates; the top of each group of reset springs is connected to the top of a corresponding group of detection cavities; a group of guide blocks is arranged on the top of each group of lifting magnetic plates; the top of each group of guide blocks is damped and slidably connected to several groups of detection probes; each group of detection probes is electrically connected to a corresponding group of connection contacts.

10. A method for using the chip packaging positioning fixture according to any one of claims 1 to 9, characterized in that: The method of use includes: Placing a plurality of groups of chips in a chip positioning mechanism; placing a plurality of groups of package substrates in a substrate positioning mechanism; Controlling the chip positioning mechanism to drive the substrate positioning mechanism to rotate so that the chip is transferred to the top of the packaging substrate; Controlling two adjacent groups of connection magnetic columns to move toward opposite sides, compressing the elastic sheet, so that a plurality of groups of connection contact sheets are connected to the chip; Two adjacent groups of connected magnetic pillars move to the bottom of the corresponding lifting magnetic plate, and the lifting magnetic plate is pushed by magnetic force to drive several groups of detection probes to extend and connect with the packaging substrate; Controlling the chip positioning mechanism to stick the chip on the packaging substrate; Complete chip packaging positioning work.

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