Conductive film

Abstract

The first conductive line (24) has a first recess (26). The second conductive line (25) has a second recess (27). The groove width dimension (L2) of the second groove part (9) is larger than the groove width dimension (L1) of the first groove part (8). The recess width dimension (w2) of the second recess (27) is larger than the recess width dimension (w1) of the first recess (26). The recess depth dimension (d2) of the second recess (27) is larger than the recess depth dimension (d1) of the first recess (26).

Description

Technical Field

[0001] The present disclosure relates to a conductive film. Background Art

[0002] Conventionally, as a conductive film that can be applied to a touch sensor, for example, a conductive film disclosed in Patent Document 1 is known.

[0003] Patent document 1 discloses a touch sensor having a display area and a non-display area. The touch sensor includes: a light-transmitting cover member (polarizing plate), a conductive film (touch panel) laminated on the back side of the cover member, and a flexible substrate for the touch panel connected to the conductive film in the non-display area.

[0004] The conductive film (touch panel) includes a substrate, a plurality of electrodes (touch electrodes) provided on the surface of the substrate and arranged in a display area, and a plurality of routing wirings (peripheral wirings) arranged in a non-display area.

[0005] Each electrode is composed of a plurality of conductive wires arranged on the surface side of the substrate in a mesh-like pattern. Each lead-through wiring is composed of a conductive wire formed by a single wire arranged on the surface side of the substrate. Each conductive wire is composed of a conductive layer, which is formed by burying a conductive metal material in a bottomed groove portion (conductive layer forming groove portion, wiring forming groove portion) formed on the surface of the substrate. The outer surface of the conductive layer is arranged opposite to the cover member (polarizing plate). The outer surface of the conductive layer is configured as a flat surface flush with the surface of the substrate.

[0006] The touch panel flexible substrate is connected to the end of one long side of the conductive film. In addition, the conductive wires constituting the routing wiring are electrically connected to the terminal portion of the touch panel flexible substrate via the anisotropic conductive resin material (anisotropic conductive film) in the mounting area of ​​the touch panel flexible substrate.

[0007] Patent Document 1: Japanese Patent Publication No. 2019-121311 Summary of the invention

[0008] -Technical problem to be solved by the invention-

[0009] As described above, in the conductive film of Patent Document 1, since the outer surface of the conductive layer is a flat surface, external light incident from the outside of the touch sensor (the surface side of the cover member) toward the inside of the touch sensor is reflected (mirror reflection) toward the cover member at the outer surface (flat surface) of the conductive layer. Therefore, when the user observes the touch sensor, the plurality of conductive lines constituting each electrode become apparent. That is, the plurality of electrodes located in the display area become apparent. As a result, the visibility of the display area is reduced.

[0010] In addition, since the outer surface of the conductive layer is a flat surface, for example, in the manufacturing process of the touch sensor, when a film for protecting the outer surface of the conductive layer (hereinafter referred to as a "process protective film") is repeatedly attached to the conductive film or the process protective film is peeled off from the conductive film, a portion of the conductive layer located on the outer surface side is easily peeled off from the groove. As a result, the conductive layer is easily corroded, or the conductive layer may be damaged by ESD. That is, in the conductive film of Patent Document 1, the conductive line is not maintained in an appropriate state, and the conduction reliability of the conductive line may be damaged.

[0011] In addition, since the outer surface of the conductive layer is a flat surface, it is conceivable that in the mounting area of ​​the flexible substrate for a touch panel located in the non-display area, the conductive particles contained in the anisotropic conductive resin material will be in point contact with the outer surface of the conductive layer. That is, the contact area between the conductive particles and the conductive layer will be relatively small. Therefore, the electrical connection state between the conductive particles and the conductive wires constituting the routing wiring is likely to become unstable. As a result, it is possible that the conduction reliability of the conductive wires located in the non-display area cannot be fully obtained.

[0012] The present disclosure is completed to solve the above-mentioned technical problems, and its purpose is to optimize the visibility of the conductive film and ensure the conduction reliability of the conductive lines constituting the conductive film.

[0013] -Technical solutions for solving technical problems-

[0014] In order to achieve the above-mentioned purpose, one embodiment of the present disclosure is a conductive film, which is provided with a first area and a second area, and the conductive film includes a substrate, at least one first conductive line and at least one second conductive line, the first conductive line is arranged on the substrate, and the second conductive line is arranged on the substrate. The substrate has at least one first groove and at least one second groove, the first groove is arranged in the first area, and is in a bottomed shape extending in a linear shape, and the second groove is arranged in the second area, and is in a bottomed shape extending in a linear shape. The first conductive line and the second conductive line include a conductive layer, and the conductive layer is formed by a conductive material buried in the first groove and the second groove, respectively. The first conductive line has at least one first recessed portion, and the first recessed portion is recessed from the opening side of the first groove toward the thickness direction of the substrate at a cross-sectional angle. The second conductive line has at least one second recessed portion, and the second recessed portion is recessed from the opening side of the second groove toward the thickness direction of the substrate at a cross-sectional angle. The first groove and the second groove are configured such that the groove width dimension of the second groove is larger than the groove width dimension of the first groove. Furthermore, the first recessed portion and the second recessed portion are configured such that: the recessed width dimension of the second recessed portion is larger than the recessed width dimension of the first recessed portion, and the recessed depth dimension of the second recessed portion is larger than the recessed depth dimension of the first recessed portion.

[0015] - Effects of the Invention -

[0016] According to the present disclosure, the visibility of the conductive film can be optimized, and the conduction reliability of the conductive wire constituting the conductive film can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an overall stereogram of the touch sensor;

[0018] Figure 2 is a plan view schematically showing a connection state between a conductive film and a flexible wiring board according to an embodiment of the present disclosure;

[0019] Figure 3 is a perspective view schematically showing the structures of a substrate, a transmitting electrode, a receiving electrode, a routing wiring, and a connecting pad when viewed from the front side of a conductive film;

[0020] Figure 4 is a top view schematically showing the structures of the substrate, the transmitting electrode, the routing wiring, and the connecting pad as viewed from the back side of the conductive film;

[0021] Figure 5 is a bottom view schematically showing the structures of the substrate, receiving electrodes, routing wiring, and connection pads as viewed from the surface side of the substrate;

[0022] Figure 6 is along Figure 1 A cross-sectional view taken along line VI-VI;

[0023] Figure 7 is along Figure 1 A cross-sectional view taken along line VII-VII;

[0024] Figure 8 is a local enlarged top view showing a part of the receiving electrode;

[0025] Fig. 9 is along Figure 8 A cross-sectional view taken along line IX-IX;

[0026] Fig.10 is a partial enlarged top view showing a part of the second conductive wire constituting the routing wiring in an enlarged manner;

[0027] Fig.11 is a partial enlarged top view showing a part of a second conductive line constituting a connection pad;

[0028] Fig.12 is along Fig.10 A cross-sectional view taken along line XII-XII;

[0029] Fig.13is a cross-sectional view schematically showing a state in which the conductive particles are fitted into the second recessed portion;

[0030] Fig.14 is a partial enlarged plan view showing a part of a second conductive line constituting a lead in a first modification according to an embodiment of the present disclosure;

[0031] Fig.15 is with Fig.12 The corresponding figure schematically shows the cross-sectional structure of the second conductive line in the modification 2 according to the embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] The following detailed description of the embodiments of the present disclosure is based on the accompanying drawings. The following description of the embodiments is merely illustrative in nature and is not intended to limit the present disclosure, its application objects, or its uses.

[0033] Figure 1 The conductive film 4 according to the embodiment to which the present disclosure is applied (see Figure 2 to Figure 5 ) is a structure of a touch sensor 1. The touch sensor 1 is a sensor type input device capable of touch operation. The touch sensor 1 is used as an input device for, for example, a car navigation system or other vehicle-mounted device, a display device of a personal computer, a mobile phone, a portable information terminal, a portable game machine, a copier, a ticket vending machine, an automatic teller machine, a clock, etc.

[0034] In the following description, the side where the operation surface 2a of the cover member 2 described later is located is referred to as the "front side" of the touch sensor 1, and the opposite side is referred to as the "back side" of the touch sensor 1, to define the positional relationship of the elements constituting the touch sensor 1. In addition, in the conductive film 4, the surface opposite to the back side of the cover member 2 is defined as the "front side 5a", and the surface on the opposite side to the cover member 2 is defined as the "back side 5b".

[0035] In addition, in this embodiment, for the sake of convenience of explanation, Figure 1 to Figure 3 The direction from the left side to the right side in the paper plane is defined as the first direction X. On the other hand, Figure 1 to Figure 3 The direction from the lower side to the upper side in the paper is defined as the second direction Y.

[0036] (Cover parts)

[0037] like Figure 1 As shown in FIG. 1 , the touch sensor 1 includes a light-transmitting cover member 2. The cover member 2 is, for example, a glass cover or a plastic protective cover. The cover member 2 is, for example, a rectangular plate in a plan view. The cover member 2 is fixed to the front surface 5a of the conductive film 4 by an adhesive layer 21 described later (see FIG. 2 ). Figure 6 and Figure 7 ).

[0038] like Figure 1 , Figure 6 and Figure 7 As shown in FIG. 1 , a decorative portion 3 is provided on the peripheral portion of the back side of the cover member 2. The decorative portion 3 is formed into a substantially frame shape of a dark color such as black by screen printing, for example. The inner rectangular area of ​​the front side of the cover member 2 surrounded by the decorative portion 3 is configured as a finger F of the user (see FIG. 1 ). Figure 6 ) etc. along with the operation surface 2a contacted by the touch operation.

[0039] (Conductive film)

[0040] like Figure 2 As shown in FIG. 1 , the conductive film 4 is formed into a substantially rectangular shape when viewed from above. The conductive film 4 can be mounted on the back side of the cover member 2 (see FIG. 1 ). Figure 6 and Figure 7 ). It should be noted that the specific structure of the conductive film 4 will be described later.

[0041] like Figure 2 to Figure 4 As shown, the conductive film 4 includes a first region R1 and a second region R2 .

[0042] The first region R1 is a region inside the decorative portion 3 when the conductive film 4 is attached to the cover member 2. In this embodiment, the first region R1 is configured as a visible region of the touch sensor 1. Thus, a user of the touch sensor 1 can obtain visual information from a display panel (not shown) disposed on the back side of the touch sensor 1 via the first region R1.

[0043] The second region R2 is a region corresponding to the position of the decorative portion 3 when the conductive film 4 is attached to the cover member 2. That is, the second region R2 is a region located outside the first region R1. In this embodiment, the second region R2 is configured as a non-visible region of the touch sensor 1. Thus, the user of the touch sensor 1 cannot see the components of the conductive film 4 located in the second region R2 from the outside.

[0044] (Adhesive layer)

[0045] like Figure 6 and Figure 7 As shown, the touch sensor 1 includes adhesive layers 21. Each adhesive layer 21 is stacked on the front surface 5a and the back surface 5b of the conductive film 4. The adhesive layer 21 is an optical clear adhesive (OCA) having light transmittance. The thickness of the adhesive layer 21 is preferably 25 μm to 250 μm.

[0046] like Figure 7As shown in FIG. 1 , a notch 22 is formed in the adhesive layer 21 by cutting away a part of the adhesive layer 21. The notch 22 located on the front surface 5a side corresponds to the mounting position between the front surface 5a and the front side connecting portion 18 described later. The notch 22 located on the back surface 5b side corresponds to the mounting position between the back surface 5b and the back side connecting portion 19 described later.

[0047] (Transmitting electrode and receiving electrode)

[0048] like Figure 3 to Figure 5 As shown, the touch sensor 1 includes a plurality of transmitting electrodes 11 and a plurality of receiving electrodes 12 based on a capacitive type. The plurality of transmitting electrodes 11 and the plurality of receiving electrodes 12 are arranged in a first region R1. The transmitting electrodes 11 and the receiving electrodes 12 are respectively formed by a plurality of first conductive lines 24 described later (see Figure 6 and Figure 8 ).

[0049] like Figure 4 As shown, each transmitting electrode 11 is arranged on the back side 5b. When viewed from above, each transmitting electrode 11 extends in a substantially strip shape along the first direction X. A plurality of transmitting electrodes 11 are arranged at intervals in the second direction Y. Each transmitting electrode 11 is connected to a driving circuit (not shown) via a flexible wiring board 16 described later. Each transmitting electrode 11 is configured to release an electric field to the surroundings under the drive of the driving circuit.

[0050] like Figure 5 As shown, each receiving electrode 12 is arranged on the front surface 5a. Each receiving electrode 12 is insulated from each transmitting electrode 11 via a film substrate 6 (described later) of the conductive film 4. When viewed from above, each receiving electrode 12 extends in a substantially strip shape along the second direction Y. The plurality of receiving electrodes 12 are arranged at intervals in the first direction X.

[0051] like Figure 6 As shown, the touch sensor 1 can detect a touch operation performed by a user's finger F (ie, a detection object connected to a ground terminal (GND)) in contact with the operation surface 2a through a plurality of transmitting electrodes 11 and a plurality of receiving electrodes 12.

[0052] Each receiving electrode 12 is configured to receive an electric field emitted from each transmitting electrode 11. Each receiving electrode 12 is connected to a detection circuit (not shown) via a flexible wiring board 16 described later.

[0053] (Route wiring)

[0054] like Figure 3 to Figure 5As shown in FIG. 1 , the touch sensor 1 includes a plurality of routing wires 13. The routing wires 13 are elements for electrically connecting the plurality of transmitting electrodes 11 and the plurality of receiving electrodes 12 to an external circuit (not shown). The plurality of routing wires 13 are arranged on the front surface 5a and the back surface 5b, respectively. Each routing wire 13 is composed of a plurality of second conductive lines 25 described later (see FIG. 1 ). Fig.10 ).

[0055] The plurality of routing wires 13 are arranged in the second region R2. Specifically, the plurality of routing wires 13 are arranged so as to overlap with the decorative portion 3 when viewed from the operating surface 2a. That is, the plurality of routing wires 13 cannot be seen from the operating surface 2a due to the presence of the decorative portion 3. Figure 6 In order to simplify the illustration, the routing wiring 13 is omitted.

[0056] like Figure 4 As shown, one end of each routing wiring 13 located on the back side 5b is connected to one end of each transmitting electrode 11 (located at Figure 4 The other end of each lead wiring 13 is connected to the conductive film 4 at the left end of the paper. Figure 4 The two regions converge at approximately the center of the second region R2 on the lower side of the paper (connection region R3 described later).

[0057] like Figure 5 As shown, one end of each lead wiring 13 located on the front surface 5a and one end of each receiving electrode 12 (located at Figure 5 The other end of each lead wiring 13 is connected to the conductive film 4 at the bottom of the paper. Figure 5 The two regions converge at approximately the center of the second region R2 on the lower side of the paper (connection region R3 described later).

[0058] (Connection pad)

[0059] like Figure 3 to Figure 5 As shown in FIG. 1 , the touch sensor 1 includes a plurality of connection pads 15. Each connection pad 15 is disposed at the other end of each routing wiring 13. Figure 7 As shown, the plurality of connection pads 15 are electrically connected to the flexible wiring board 16 (front side connection portion 18 and back side connection portion 19) described later. Each connection pad 15 is composed of a plurality of second conductive wires 25 described later (see Figure 7 and Fig.11 ).

[0060] The plurality of connection pads 15 are arranged in the second region R2 (specifically, a connection region R3 described later) so that the plurality of connection pads 15 cannot be seen from the operation surface 2a side, similarly to the plurality of routing wires 13 .

[0061] (Flexible wiring board)

[0062] like Figure 1 As shown, the touch sensor 1 includes a flexible wiring board 16. The flexible wiring board 16 is configured to have flexibility and its electrical characteristics do not change even in a deformed state. The flexible wiring board 16 is composed of a flexible insulating film, and the insulating film is formed of, for example, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc.

[0063] like Figure 2 As shown, the flexible wiring board 16 has a main body 17, a front side connection part 18, and a back side connection part 19. The front side connection part 18 and the back side connection part 19 are formed integrally with the main body 17. In addition, the front side connection part 18 and the back side connection part 19 are formed to branch out from one end side of the main body 17 in two directions.

[0064] like Figure 7 As shown, the front side connection part 18 is fixed to the peripheral part of the front side 5a by an anisotropic conductive adhesive (not shown), for example. The front side connection part 18 is configured such that a plurality of terminal parts (not shown) provided on the front side connection part 18 are electrically connected to each of the plurality of connection pads 15 located on the front side 5a.

[0065] The back side connection part 19 is fixed to the peripheral part of the back side 5b by the above-mentioned anisotropic conductive adhesive. The back side connection part 19 is configured so that a plurality of terminal parts (not shown) provided on the back side connection part 19 are electrically connected to each of the plurality of connection pads 15 located on the back side 5b.

[0066] (Protective film)

[0067] like Figure 6 and Figure 7 As shown in FIG. 1 , the touch sensor 1 includes a protective film 23. The protective film 23 is a film material mainly used to protect the plurality of transmission electrodes 11 and the plurality of routing wires 13 located on the back surface 5 b side. Examples of the film material include resin materials such as PET (polyethylene terephthalate), polycarbonate, COP (cycloolefin polymer), COC (cycloolefin copolymer), and PE.

[0068] The protective film 23 is formed, for example, in a substantially rectangular shape when viewed from above. The protective film 23 is formed to be the same size as the conductive film 4. The protective film 23 is stacked and arranged at a position opposite to the back surface 5b. Specifically, the protective film 23 is fixed to the back surface 5b by the adhesive layer 21. It should be noted that the protective film 23 has a much stronger adhesive force than the process protective film (not shown) temporarily used in the manufacturing process of the touch sensor 1.

[0069] (Specific structure of conductive film)

[0070] The conductive film 4 includes a substrate 5 , a plurality of first conductive lines 24 , and a plurality of second conductive lines 25 .

[0071] (Substrate)

[0072] like Figure 2 to Figure 5 As shown in FIG. 1 , the substrate 5 is formed into a substantially rectangular shape when viewed from above. Figure 6 and Figure 7 As shown, the substrate 5 is stacked so that the front surface 5 a thereof faces the rear surface of the cover member 2 via the adhesive layer 21 .

[0073] like Fig. 9 and Fig.12 As shown, the substrate 5 has a film base material 6. The film base material 6 is made of a transparent resin material. Examples of the resin material include PET (polyethylene terephthalate), polycarbonate, COP (cycloolefin polymer), and COC (cycloolefin copolymer).

[0074] In this embodiment, the substrate 5 has two groove forming layers 7. Each groove forming layer 7 is a layer for forming a plurality of first groove portions 8 and a plurality of second groove portions 9 described later. Each groove forming layer 7 is made of a resin material having insulating properties and light transmissive properties. The groove forming layer 7 has a shaping property for forming grooves, and has the function of firmly bonding the adhesion layer 31 (described later) in the groove to the film substrate 6. The groove forming layers 7 are stacked on the front side and the back side of the film substrate 6, respectively. The thickness of the groove forming layer 7 is, for example, 2.0 μm to 17.0 μm. It should be noted that in Fig. 9 and Fig.12 In the figure, the groove-forming layer 7 located on the back side of the film substrate 6 is omitted from illustration.

[0075] (First groove portion)

[0076] A plurality of first grooves 8 are provided on the front surface 5a side (see Fig. 9 ). A plurality of first grooves 8 are arranged in the first region R1. The plurality of first grooves 8 extend linearly on the front surface 5a in a manner forming a predetermined pattern described later. It should be noted that, similar to the front surface 5a side, a plurality of first grooves 8 are also provided on the back surface 5b side, although illustration is omitted.

[0077] like Fig. 9 As shown, the first groove portion 8 is formed into a bottomed shape that is recessed in the thickness direction of the substrate 5 (the direction from the groove forming layer 7 toward the film base material 6). The groove depth dimension D1 of the first groove portion 8 is set, for example, to be greater than 0.5 μm and less than 10.0 μm. More preferably, the groove depth dimension D1 of the first groove portion 8 is set to be greater than 0.5 μm and less than 2.0 μm.

[0078] The first groove portion 8 is configured such that the groove width L1 is larger than 0.3 μm and is 30.0 μm or less. More preferably, the groove width L1 of the first groove portion 8 is 0.5 μm or more and 3.0 μm or less.

[0079] In this embodiment, the plurality of first grooves 8 are configured such that the groove depths D1 of the first grooves 8 are substantially the same as one another. Also, the plurality of first grooves 8 are configured such that the groove widths L1 of the first grooves 8 are substantially the same as one another.

[0080] In this embodiment, a fillet is formed at the corner between the side surface and the bottom surface of the first groove portion 8. It should be noted that the fillet may not be formed at the above-mentioned corner. The bottom surface of the first groove portion 8 may also be curved. In addition, the side surface of the first groove portion 8 may also be inclined in a manner that gradually expands from the bottom surface of the first groove portion 8 toward the opening.

[0081] (Second groove portion)

[0082] A plurality of second grooves 9 are provided on the front surface 5a (see Fig.12 ). A plurality of second grooves 9 are arranged in the second region R2. The plurality of second grooves 9 extend linearly on the front surface 5a in a manner forming a predetermined pattern described later. It should be noted that, similar to the front surface 5a side, a plurality of second grooves 9 are also provided on the back surface 5b, although illustration is omitted.

[0083] like Fig.12 As shown, the second groove portion 9 is formed into a bottomed shape that is recessed in the thickness direction of the substrate 5 (the direction from the groove forming layer 7 toward the film base material 6). The groove depth dimension D2 of the second groove portion 9 is set, for example, to be greater than 0.5 μm and less than 10.0 μm. More preferably, the groove depth dimension D2 of the second groove portion 9 is set to be greater than 0.5 μm and less than 2.0 μm.

[0084] The second groove 9 has a groove width L2 greater than 0.3 μm and less than 30.0 μm. More preferably, the groove width L2 of the second groove 9 is greater than 8.0 μm and less than 12.0 μm. Furthermore, the groove width L2 of the second groove 9 is greater than the groove width L1 of the first groove 8.

[0085] In this embodiment, the plurality of second grooves 9 are configured such that the groove depths D2 of the second grooves 9 are substantially the same. Also, the plurality of second grooves 9 are configured such that the groove widths L2 of the second grooves 9 are substantially the same.

[0086] In this embodiment, a rounded corner is formed at the corner between the side surface and the bottom surface of the second groove portion 9. It should be noted that the rounded corner may not be formed. In addition, the side surface of the second groove portion 9 may also be inclined in a manner that gradually expands from the bottom surface of the second groove portion 9 toward the opening.

[0087] (First conductive line)

[0088] Figure 8 The plurality of first conductive lines 24 constituting each receiving electrode 12 are exemplified. The plurality of first conductive lines 24 are arranged on the front surface 5a in such a manner as to form a prescribed pattern on the front surface 5a. As an example of the prescribed pattern, the following can be cited: Figure 8 As shown, the plurality of first conductive lines 24 are arranged in a first pattern (grid pattern) in a grid shape. It should be noted that the plurality of first conductive lines 24 constituting each transmitting electrode 11 are also arranged on the back surface 5b in a predetermined pattern, although not shown.

[0089] The first pattern is formed in the following state: a plurality of first conductive lines 24 intersect each other, and a plurality of first conductive lines 24 are arranged at predetermined intervals (equal intervals in the example shown in the figure). Each first conductive line 24 constituting the first pattern extends in a direction inclined relative to both the first direction X and the second direction Y. In addition, the first pattern is a mesh structure in which a plurality of units composed of a plurality of first conductive lines 24 are regularly arranged. Each of the units has a rhombus shape, for example.

[0090] It should be noted that the above-mentioned specified pattern is not limited to the above-mentioned first pattern (grid pattern), for example, it can also be a second pattern in which multiple first conductive lines 24 are arranged in a ladder shape, or a third pattern in which multiple first conductive lines 24 are arranged in a shape other than a grid shape and a ladder shape.

[0091] The line width of the first conductive line 24 is set to, for example, 0.5 μm to 3.0 μm. That is, the line width of the first conductive line 24 is equal to the groove width L1 of each first groove 8. In this embodiment, the plurality of first conductive lines 24 are configured to have the same line width.

[0092] The surface roughness of the portion of the first conductive line 24 exposed from the groove forming layer 7 is set to, for example, 0.01 μm or more and 0.34 μm or less. If the surface roughness of the first conductive line 24 is set within the above numerical range, it is possible to suppress the reflection (specular reflection) of external light such as sunlight or illumination light incident from the operation surface 2a of the touch sensor 1 on the surface of the first conductive line 24. As a result, when the user of the touch sensor 1 observes from the operation surface 2a side, it is not easy to see the plurality of first conductive lines 24 constituting the transmitting electrode 11 and the receiving electrode 12 from the operation surface 2a side. That is, the so-called "conductive line appearance" of the plurality of first conductive lines 24 is prevented. As a result, the touch sensor 1 can be made beautiful. In addition, if the surface roughness of the first conductive line 24 is set within the above numerical range, the surface of the first conductive line 24 is not easy to contact the adhesive layer 21. As a result, it is easy to ensure the conduction reliability of the first conductive line 24.

[0093] (Cross-sectional structure of the first conductive line)

[0094] like Fig. 9 As shown, the first conductive line 24 is composed of a bonding layer 31 , a conductive layer 32 and a blackened layer 38 .

[0095] The adhesion layer 31 is an element for ensuring adhesion of the conductive layer 32 to the first groove portion 8. The adhesion layer 31 also has a function of making the first conductive lines 24 less visible when the user observes from the operation surface 2a of the touch sensor 1.

[0096] The adhesion layer 31 is a metal layer composed of a metal nitride or a metal oxide, and the metal nitride or metal oxide contains at least one metal selected from the group consisting of, for example, Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn. The adhesion layer 31 may be a single layer or a laminated body formed by laminating a plurality of layers of different compositions. The adhesion layer 31 is laminated in the first groove portion 8 in a thin film form, for example, by evaporation or sputtering.

[0097] The conductive layer 32 is an element for ensuring the conductivity of the first conductive line 24. The conductive layer 32 is buried in the first groove portion 8. The conductive layer 32 is composed of a seed layer 33 and a main layer 34. The seed layer 33 and the main layer 34 are both formed of a conductive material. As the conductive material, a conductive metal such as copper (Cu) or silver (Ag) is preferably used. It should be noted that a transparent conductive material with light transmittance, such as a conductive resin material, indium tin oxide, tin oxide, etc., can also be used instead of the above-mentioned conductive metal.

[0098] The seed layer 33 has the function of improving the adhesion between the adhesion layer 31 and the main layer 34. Specifically, for example, during the electroplating process for forming the main layer 34, the seed layer 33 functions as a cathode for depositing a plating solution containing copper (Cu) or the like on the adhesion layer 31. The seed layer 33 is stacked in a thin film on the adhesion layer 31 by, for example, evaporation or sputtering. It should be noted that, when the main layer 34 is formed by a method different from the electroplating process, the seed layer 33 may not be provided.

[0099] The main layer 34 is formed by, for example, evaporation, sputtering, chemical plating or electroplating. In this embodiment, a method of stacking the main layer 34 on the seed layer 33 by electroplating is shown. It should be noted that after the electroplating, the seed layer 33 and the main layer 34 are formed into one body, and the interface between the seed layer 33 and the main layer 34 cannot be determined.

[0100] The black layer 38 is stacked on the opening side of the first recessed portion 26 described later of the conductive layer 32. The thickness of the black layer 38 is, for example, 7 nm to 40 nm. The black layer 38 has a function of making the first conductive line 24 less visible when the user of the touch sensor 1 observes from the operation surface 2a.

[0101] The blackened layer 38 is formed by replacing the copper grains at the boundaries (so-called "grain boundaries") between the copper grains on the surface of the conductive layer 32 (the main body layer 34) with palladium (blackening treatment). Specifically, during the blackening treatment, intergranular corrosion proceeds along the boundaries (grain boundaries) between the copper grains on the surface of the main body layer 34, and the copper grains constituting the surface of the main body layer 34 are replaced with palladium. As a result, the blackened layer 38 is stacked on the surface of the main body layer 34.

[0102] (First recessed portion)

[0103] like Fig. 9 As shown, the first conductive line 24 has a first recessed portion 26. When viewed in section, the first recessed portion 26 is formed into a bottomed shape that is recessed from the opening side of the first groove portion 8 toward the thickness direction of the substrate 5. The first recessed portion 26 is formed into a curved shape with a predetermined radius of curvature. The length direction of the first recessed portion 26 extends along the extension direction of the first groove portion 8. It should be noted that the above-mentioned "curved shape" refers to a shape that is curved in an arc shape, and the concept of the above-mentioned "curved shape" includes "arc shape".

[0104] In this embodiment, the depression width dimension w1 of the first depression 26 is substantially the same as the groove width dimension L1 of the first groove 8. In addition, it is preferred that the first depression 26 is configured such that the depression depth dimension d1 is greater than 0.004 μm and less than 7.0 μm. Furthermore, the first groove 8 and the first depression 26 are configured such that the value obtained by dividing the depression depth dimension d1 by the groove width dimension L1 is greater than 0.01 and less than 0.4. It should be noted that the depression depth dimension d1 refers to the distance from the front face 5a (or the back face 5b) to the position corresponding to the deepest part of the first depression 26.

[0105] (Second conductive line)

[0106] Fig.10 The second conductive wires 25 constituting each routing wiring 13 are exemplified. Fig.10 As shown, each routing wiring 13 of this embodiment is composed of one second conductive wire 25 .

[0107] Fig.11 The plurality of second conductive lines 25 constituting each connection pad 15 are exemplified. Each connection pad 15 is constituted by a pattern (corresponding to the above-described second pattern) in which the plurality of second conductive lines 25 are arranged in a ladder shape.

[0108] The line width of each second conductive line 25 is set to, for example, 8.0 μm or more and 12.0 μm or less. That is, the line width of each second conductive line 25 is equal to the groove width L2 of each second groove 9. In this embodiment, the plurality of second conductive lines 25 are configured such that the line widths of these second conductive lines 25 are equal to each other.

[0109] The surface roughness of the second conductive line 25 is set to be, for example, 0.01 μm or more and 0.34 μm or less. If the surface roughness of the second conductive line 25 is set within the above numerical range, the surface of the second conductive line 25 is unlikely to contact the adhesive layer 21. As a result, the conduction reliability of the second conductive line 25 is easily ensured.

[0110] (Cross-sectional structure of the second conductive line)

[0111] like Fig.12 As shown, the second conductive line 25 is composed of a close contact layer 31, a conductive layer 32, and a blackened layer 38. It should be noted that the close contact layer 31, the conductive layer 32, and the blackened layer 38 constituting the second conductive line 25 are the same as the close contact layer 31, the conductive layer 32, and the blackened layer 38 constituting the first conductive line 24, so the detailed description thereof is omitted.

[0112] (Second recessed portion)

[0113] like Fig.12As shown, the second conductive line 25 has a second recessed portion 27. In cross-section, the second recessed portion 27 is formed into a bottomed shape that is recessed from the opening side of the second groove portion 9 toward the thickness direction of the substrate 5. The second recessed portion 27 is formed into a curved shape with a predetermined radius of curvature. The length direction of the second recessed portion 27 extends along the extension direction of the second groove portion 9.

[0114] In this embodiment, the depression width dimension w2 of the second depression 27 is substantially the same as the groove width dimension L2 of the second groove 9. In addition, it is preferred that the second depression 27 is configured such that the depression depth dimension d2 is greater than 0.004 μm and less than 7.0 μm. Furthermore, the second groove 9 and the second depression 27 are configured such that the value obtained by dividing the depression depth dimension d2 by the groove width dimension L2 is greater than 0.01 and less than 0.4. It should be noted that the depression depth dimension d2 refers to the distance from the front face 5a (or the back face 5b) to the position corresponding to the deepest part of the second depression 27.

[0115] However, if Figure 2 to Figure 4 As shown, the second region R2 includes a connection region R3, in which a plurality of conductive particles Cp (see Fig.13 ) is arranged on the surface of the substrate 5. The second groove 9 is configured such that a portion of the second groove 9 is located in the connection region R3. It should be noted that, in this embodiment, it is assumed that the particle size of the conductive particles Cp is ( Fig.13 The radius r) shown is comprised in the range of 3.0 μm to 20.0 μm.

[0116] like Fig.13 As shown, the second conductive line 25 is configured such that the second recessed portion 27 located in the connection region R3 has a size capable of contacting the conductive particles Cp. Specifically, the second recessed portion 27 located in the connection region R3 is configured such that the cross-sectional shape of the outer surface side of the second recessed portion 27 is curved.

[0117] In this embodiment, the second recessed portion 27 located in the connection region R3 is configured such that the cross-sectional shape of the outer surface side of the second recessed portion 27 is an arc shape. Preferably, the second recessed portion 27 located in the connection region R3 is configured such that the curvature radius of the arc shape is equal to the particle size of the conductive particles Cp ( Fig.13 More preferably, the second concave portion 27 located in the connection region R3 is configured such that the curvature radius of the arc shape is smaller than the particle size ( Fig.13 The radius of curvature of the radius r) shown is large.

[0118] Here, it is preferable that the depression depth dimension d2 of the second depression 27 is configured so that the relationship between the particle diameter (radius r) of the conductive particles Cp and the groove width dimension L2 of the second groove portion 9 satisfies the following relationship.

[0119]

Mathematical formula 1

[0120]

[0121] (Characteristic structure)

[0122] like Fig. 9 and Fig.12 As shown, as a characteristic structure involved in the embodiment of the present disclosure, the second recessed portion 27 is configured so that its recessed degree is greater than that of the first recessed portion 26. Specifically, the first recessed portion 26 and the second recessed portion 27 are configured so that the recessed width dimension w2 of the second recessed portion 27 is greater than the recessed width dimension w1 of the first recessed portion 26. In addition, the first recessed portion 26 and the second recessed portion 27 are configured so that the recessed depth dimension d2 of the second recessed portion 27 is greater than the recessed depth dimension d1 of the first recessed portion 26.

[0123] [Effects of the Embodiments]

[0124] As described above, the first conductive line 24 arranged in the first region R1 has a first recessed portion 26. Thus, when external light (sunlight, illumination light, etc.) incident from the operation surface 2a side of the touch sensor 1 toward the inside of the touch sensor 1 enters the first recessed portion 26, it is reflected in all directions (diffuse reflection) in the first recessed portion 26. That is, the external light entering the first recessed portion 26 is not easy to be specularly reflected toward the outside of the touch sensor 1 due to the above-mentioned diffuse reflection. Thus, the reflectivity of the specular reflection of the external light on the first conductive line 24 is suppressed. As a result, the so-called "conductive line appearance" of the plurality of first conductive lines 24 is prevented. Specifically, in this embodiment, when the user observes the touch sensor 1 from the operation surface 2a side, it is not easy to see the constituent elements of the conductive film 4 located in the first region R1 (especially the above-mentioned first pattern constituting each receiving electrode 12 arranged on the operation surface 2a side). Thus, the visibility of the first region R1 is optimized.

[0125] In addition, when viewed in section, the first recessed portion 26 is recessed from the opening side of the first groove portion 8 toward the thickness direction of the substrate 5. When viewed in section, the second recessed portion 27 is also recessed from the opening side of the second groove portion 9 toward the thickness direction of the substrate 5. Therefore, for example, in the manufacturing process of the touch sensor 1, even if the above-mentioned process protection film is repeatedly attached to the conductive film 4 or peeled off from the conductive film 4, a portion of the conductive layer 32 constituting the first conductive line 24 and the second conductive line 25 is not easily peeled off from the first groove portion 8 and the second groove portion 9 together with the adhesive portion of the above-mentioned process protection film. As a result, the conductive layer 32 is not easily corroded, or the conductive layer 32 can be prevented from being damaged by ESD. That is, the first conductive line 24 and the second conductive line 25 are maintained in an appropriate state, and the conduction reliability of the first conductive line 24 and the second conductive line 25 is ensured.

[0126] In addition, the first recessed portion 26 and the second recessed portion 27 are configured such that the recessed width dimension w2 of the second recessed portion 27 is larger than the recessed width dimension w1 of the first recessed portion 26, and the recessed depth dimension d2 of the second recessed portion 27 is larger than the recessed depth dimension d1 of the first recessed portion 26. That is, the second recessed portion 27 is configured such that the recessed degree is larger than the recessed degree of the first recessed portion 26. According to this structure, for example, in the connection region R3 located in the second region R2, the conductive particles Cp contained in the anisotropic conductive resin material are easily embedded in the second recessed portion 27. That is, the contact area between the conductive particles Cp and the surface of the second recessed portion 27 is increased. As a result, the electrical connection state between the second conductive wire 25 and the conductive particles Cp is easily maintained stable, and the conduction reliability of the second conductive wire 25 located in the second region R2 is improved.

[0127] Therefore, in the conductive film 4 and the touch sensor 1 including the conductive film 4 according to the embodiment of the present disclosure, the visibility of the first region R1 can be optimized, and the conduction reliability of the first conductive line 24 and the second conductive line 25 can be ensured.

[0128] In addition, it is preferred that the groove width dimension L1 of the first groove portion 8 is set to be greater than 0.5 μm and less than 3.0 μm, and the groove depth dimension D1 of the first groove portion 8 is set to be greater than 0.5 μm and less than 2.0 μm. By setting in this way, the first conductive line 24 is thinned. Therefore, the so-called "conductive line appearance" of multiple first conductive lines 24 is prevented, and the visibility of the first region R1 is optimized. In contrast, it is preferred that the groove width dimension L2 of the second groove portion 9 is set to be greater than 8.0 μm and less than 12.0 μm, and the groove depth dimension D2 of the second groove portion 9 is set to be greater than 0.5 μm and less than 2.0 μm. By setting in this way, the line width of the second conductive line 25 becomes relatively large. As a result, it is easy to keep the electrical connection state between the second conductive line 25 and the conductive particle Cp stable. That is, the conduction reliability of the second conductive line 25 located in the second region R2 is ensured. Therefore, the visibility of the first region R1 can be optimized, and the conduction reliability of the second conductive line 25 can be particularly improved.

[0129] It should be noted that, when the groove depth dimensions D1 and D2 are set to be 0.5 μm or more and 2.0 μm or less, the recess depth dimensions d1 and d2 can be set to appropriate dimensions corresponding to the groove depth dimensions D1 and D2. For example, when the groove depth dimensions D1 and D2 are set to the upper limit of the above numerical range, i.e., 2.0 μm, the recess depth dimensions d1 and d2 can be set to be about 0.15 μm or more and 1.34 μm or less.

[0130] In addition, it is preferred that the first recessed portion 26 and the second recessed portion 27 are configured so that the recessed depth dimensions d1 and d2 are respectively greater than 0.004 μm and less than 7.0 μm. According to this structure, the external light entering the first recessed portion 26 is not easily reflected toward the outside of the touch sensor 1 due to diffuse reflection, so that the visibility of the first region R1 is optimized as in the above-mentioned effect. In addition, the first recessed portion 26 and the second recessed portion 27 are not easily in contact with the adhesive portion of the protective film for the above-mentioned process. Therefore, as in the above-mentioned effect, the conduction reliability of the first conductive line 24 and the second conductive line 25 is ensured.

[0131] It should be noted that, when the recess depth dimensions d1 and d2 are set to be 0.004 μm or more and 7.0 μm or less, the groove depth dimensions D1 and D2 can be set to appropriate dimensions corresponding to the dimensions of the recess depth dimensions d1 and d2. For example, when the recess depth dimensions d1 and d2 are set to the upper limit of the above numerical range, i.e., 7.0 μm, the groove depth dimensions D1 and D2 can be set to about 10.0 μm.

[0132] In addition, the second groove portion 9 and the second recessed portion 27 are configured such that the value obtained by dividing the recessed depth dimension d2 by the groove width dimension L2 is greater than or equal to 0.01 and less than or equal to 0.4. If such a relationship is satisfied, for example, in the connection region R3 located in the second region R2, the conductive particles Cp contained in the anisotropic conductive resin material are easily embedded in the second recessed portion 27. More specifically, the conductive particles Cp are easily in contact with the surface of the second recessed portion 27. As a result, the electrical connection state between the second conductive wire 25 and the conductive particles Cp is easily maintained stable. Therefore, the conduction reliability of the second conductive wire 25 located in the second region R2 can be improved.

[0133] In addition, the second region R2 includes a connection region R3, in which an anisotropic conductive resin material containing a plurality of conductive particles Cp can be arranged on the surface of the substrate 5, and the second groove portion 9 is configured so that a portion of the second groove portion 9 is located in the connection region R3. In addition, the second conductive line 25 is configured so that the second recessed portion 27 located in the connection region R3 has a size that can contact each of the plurality of conductive particles Cp. According to this structure, in the connection region R3, the conductive particles Cp contained in the anisotropic conductive resin material are easily embedded in the second recessed portion 27. As a result, the electrical connection state between the second conductive line 25 and the conductive particles Cp is easily kept stable. Therefore, the conduction reliability of the second conductive line 25 located in the second region R2 can be improved.

[0134] In addition, the second recessed portion 27 located in the connection region R3 is configured such that the cross-sectional shape of the outer surface side of the second recessed portion 27 is curved. According to this structure, the conductive particles Cp having a substantially spherical shape are easily embedded in the second recessed portion 27. As a result, the electrical connection state between the second conductive wire 25 and the conductive particles Cp is easily maintained stable. Therefore, the conduction reliability of the second conductive wire 25 located in the second region R2 can be improved.

[0135] In addition, the second recessed portion 27 located in the connection region R3 is configured such that the cross-sectional shape of the outer surface side of the second recessed portion 27 is arc-shaped, and the second recessed portion 27 located in the connection region R3 is configured such that the radius of curvature of the arc-shaped is larger than the radius of curvature of the particle diameter of the conductive particles Cp. According to this structure, the conductive particles Cp are easily embedded in the second recessed portion 27, and the conductive particles Cp are easily in contact with the outer surface of the second recessed portion 27. As a result, the electrical connection state between the second conductive wire 25 and the conductive particles Cp is easily maintained stable. Therefore, the conduction reliability of the second conductive wire 25 located in the second region R2 can be further improved.

[0136] In addition, the first conductive line 24 further includes a black layer 38. When the user of the touch sensor 1 observes from the operation surface 2a, the first conductive line 24 is not easily visible due to the presence of the black layer 38. As a result, the visibility of the first region R1 can be improved.

[0137] [Variation 1 of the embodiment]

[0138] In the above embodiment, each routing wiring 13 is shown to be composed of one second conductive wire 25, but the present invention is not limited to this embodiment. Fig.14 As shown in the first variation, each routing wiring 13 may also be composed of a plurality of second conductive wires 25. Fig.14 In FIG. 1 , the routing wiring 13 is exemplified as a pattern in which a plurality of second conductive lines 25 are arranged in a ladder shape.

[0139] [Variation 2 of the embodiment]

[0140] In the above embodiment, only one second recessed portion 27 is provided on the second conductive line 25, but the present invention is not limited to this embodiment. Fig.15 As shown in the second modification example, the second conductive line 25 may also have one second recessed portion 27 and two third recessed portions 28 .

[0141] like Fig.15 As shown, the second conductive line 25 of the second modification example 2 is configured such that the concave width dimension w2 of the second concave portion 27 is smaller than the groove width dimension L2 of the second groove portion 9. It should be noted that, similarly to the above-mentioned embodiment, the second groove portion 9 of this modification example is configured such that the groove width dimension L2 is greater than 0.3 μm and is less than 30.0 μm. In addition, similarly to the above-mentioned embodiment, the second concave portion 27 of this modification example is configured such that the concave depth dimension d2 is greater than 0.004 μm and less than 7.0 μm.

[0142] The third recessed portion 28 is arranged on both sides of the second recessed portion 27. The recessed width dimension w3 of the third recessed portion 28 is smaller than the recessed width dimension w2 of the second recessed portion 27. In addition, the recessed depth dimension d3 of the third recessed portion 28 is smaller than the recessed depth dimension d2 of the second recessed portion 27.

[0143] In such a modified example, during the manufacturing process of the touch sensor 1, the second conductive line 25 is not easily affected by the adhesive layer 21 due to the presence of the second recessed portion 27 and the third recessed portions 28, 28. Therefore, the conductive layer 32 is not easily corroded, or the conductive layer 32 can be prevented from being damaged by ESD. Therefore, the second conductive line 25 is maintained in an appropriate state, ensuring the conduction reliability of the second conductive line 25.

[0144] In this modification, since the second recess 27 has an appropriate size, the electrical connection between the second conductive wire 25 and the conductive particles Cp can be easily stabilized, and the conduction reliability of the second conductive wire 25 in the second region R2 is improved, as in the above embodiment.

[0145] It should be noted that the first conductive line 24 may also have a first recessed portion 26 and at least one third recessed portion 28, which are not shown. Even in this manner, the conduction reliability of the second conductive line 25 is ensured. In addition, if the first conductive line 24 has a first recessed portion 26 and at least one third recessed portion 28, external light entering the first recessed portion 26 and the third recessed portion 28 is diffusely reflected, thereby further suppressing the reflectivity of the specular reflection of the external light on the first conductive line 24. As a result, the visibility of the first region R1 is optimized.

[0146] [Other embodiments]

[0147] In the above-mentioned embodiments and the above-mentioned variations, the touch sensor 1 to which the conductive film 4 according to the embodiments of the present disclosure is applied is exemplified, but the present invention is not limited thereto. For example, the conductive film 4 according to the embodiments of the present disclosure can be widely applied to technical fields other than the touch sensor 1 (for example, various technical fields such as liquid crystal display devices, organic electroluminescent display devices (OLED), micro LED display devices, solar cell devices, heater devices, antenna devices, and electromagnetic wave shielding sheets).

[0148] In the conductive film 4 according to the above embodiment, a single substrate 5 is used, but the present invention is not limited to this embodiment. For example, the substrate 5 may be a laminated body (not shown) in which two substrates are bonded together.

[0149] In the conductive film 4 involved in the above embodiment, a mode in which a plurality of transmitting electrodes 11 and a plurality of receiving electrodes 12 are formed on both surfaces (the front surface 5a and the back surface 5b) of a substrate 5 is shown, but the present invention is not limited to this mode. That is, a plurality of transmitting electrodes 11 and a plurality of receiving electrodes 12 may be formed on only one surface (either the front surface 5a or the back surface 5b) of a substrate 5.

[0150] In the above embodiment, each transmitting electrode 11 and each receiving electrode 12 is shown to be roughly strip-shaped, but it is not limited to this embodiment. For example, each receiving electrode 12 may also be a method in which a protrusion (not shown) is repeatedly arranged along the extension direction, wherein the protrusion protrudes in a manner that the middle part of the protrusion becomes thinner as it goes toward the first direction X or the opposite direction. Similarly, for each transmitting electrode 11, the roughly strip-shaped method shown in the above embodiment may be replaced by a method in which a protrusion (not shown) is repeatedly arranged along the extension direction, wherein the protrusion protrudes in a manner that the middle part of the protrusion becomes thinner as it goes toward the first direction X or the opposite direction. In other words, the shape of each electrode may also be a shape in which a fixed flat plate portion formed into a rhombus or the like is repeated along the extension direction.

[0151] In the conductive film 4 according to the above embodiment, the groove forming layers 7, 7 are provided on both surfaces of the film substrate 6, but the present invention is not limited to this embodiment. That is, a structure in which the groove forming layer 7 is not stacked on the film substrate 6 (that is, a structure consisting only of the film substrate 6) may be adopted. In this structure, the plurality of first groove portions 8 and the plurality of second groove portions 9 may be formed on both surfaces of the film substrate 6.

[0152] In the above embodiment, the groove depths D1 of the plurality of first grooves 8 are substantially the same, but the present invention is not limited to this. For example, the plurality of first grooves 8 may be configured such that the groove depths D1 are different from each other.

[0153] In the above embodiment, the groove depths D2 of the plurality of second grooves 9 are substantially the same, but the present invention is not limited to this. For example, the plurality of second grooves 9 may be configured so that the groove depths D2 are different from each other.

[0154] In the above embodiment, a method is shown in which the groove width dimensions L1 of the plurality of first groove portions 8 are approximately the same size as each other, but it is not limited to this method. For example, the plurality of first groove portions 8 may also be configured so that the groove width dimensions L1 of these first groove portions 8 are different from each other within the above-mentioned range of 0.5 μm or more and 3.0 μm or less. According to this structure, the plurality of first conductive lines 24 are configured so that the line widths of these first conductive lines 24 are different from each other. That is, the plurality of first conductive lines 24 may also be configured so that the line widths of these first conductive lines 24 are different in size within a range that ensures the visibility of the first region R1. In addition, the conductive film 4 having a structure in which the line widths of the plurality of first conductive lines 24 are different from each other may also be applied to technical fields other than the touch sensor 1.

[0155] In addition, in the above-mentioned embodiment, a method in which the groove width dimensions L1 of the plurality of first groove portions 8 are substantially the same size as each other is shown, but it is not limited to this method. For example, with respect to the groove width dimension L1 of any one of the plurality of first groove portions 8, the groove width dimension of a part thereof may be different from the groove width dimension of other parts within the above-mentioned range of 0.5 μm or more and 3.0 μm or less. According to this structure, the plurality of first conductive lines 24 are configured such that the line width of the first conductive line 24 is locally different from the line width of other parts within the above-mentioned any one of the plurality of first groove portions 8. That is, the plurality of first conductive lines 24 may also be configured with respective line widths within a range that ensures the visibility of the first region R1. In addition, the conductive film 4 having a structure in which the line widths of the plurality of first conductive lines 24 are different from each other may also be applied to technical fields other than the touch sensor 1.

[0156] In the above embodiment, a method is shown in which the groove width dimensions L2 of the plurality of second groove portions 9 are approximately the same size as each other, but it is not limited to this method. For example, the plurality of second groove portions 9 may also be configured so that the groove width dimensions L2 of these second groove portions 9 are different from each other within the above-mentioned range of 8.0 μm or more and 12.0 μm or less. According to this structure, the plurality of second conductive lines 25 are configured so that the line widths of these second conductive lines 25 are different from each other. That is, the plurality of second conductive lines 25 may also be configured so that the line widths of these second conductive lines 25 are different from each other within a range that ensures the conductivity reliability of each second conductive line 25. In addition, the conductive film 4 having a structure in which the line widths of the plurality of second conductive lines 25 are different from each other may also be applied to technical fields other than the touch sensor 1.

[0157] In addition, in the above-mentioned embodiment, a method in which the groove width dimensions L2 of the plurality of second groove portions 9 are substantially the same size as each other is shown, but it is not limited to this method. For example, the groove width dimension L2 of one of the plurality of second groove portions 9 may be different from the groove width dimensions L2 of the other second groove portions 9 within the above-mentioned range of 8.0 μm or more and 12.0 μm or less. According to this structure, the plurality of second conductive lines 25 are configured such that the line width of the second conductive line 25 in one of the plurality of second groove portions 9 is different from the line width of the other second conductive lines 25. That is, the plurality of second conductive lines 25 may also be configured such that their respective line widths are set within a range that ensures the conductive reliability of each second conductive line 25. In addition, the conductive film 4 having a structure in which the line widths of the plurality of second conductive lines 25 are different from each other may also be applied to technical fields other than the touch sensor 1.

[0158] In the conductive film 4 involved in the above-mentioned embodiment, the manner in which the entire outer surface of each of the first recessed portion 26 and the second recessed portion 27 is formed into a curved shape when viewed in section is shown, but the present invention is not limited to this manner. That is, each of the first recessed portion 26 and the second recessed portion 27 may not be formed so that the entire outer surface is curved. For example, each of the first recessed portion 26 and the second recessed portion 27 may also be formed so that a portion of the outer surface is curved (or arc-shaped), which is not shown. Alternatively, each of the first recessed portion 26 and the second recessed portion 27 may be formed so that the entire outer surface is roughly V-shaped when viewed in section.

[0159] In the conductive film 4 according to the above embodiment, the adhesion layer 31 is formed in each of the first groove 8 and the second groove 9, but the present invention is not limited to this. That is, the conductive layer 32 may be formed directly in the first groove 8 and the second groove 9 without providing the adhesion layer 31.

[0160] Furthermore, in the conductive film 4 according to the above embodiment, a mode in which the blackened layer 38 is provided is shown, but the blackened layer 38 may not be provided.

[0161] In the conductive film 4 involved in the above embodiment, a mode including a plurality of first conductive lines 24 and a plurality of second conductive lines 25 is shown, but the present invention is not limited to this mode. For example, when the conductive film 4 is applied to a technical field other than the touch sensor 1, the conductive film 4 may also be configured to include at least one first conductive line 24 and at least one second conductive line 25 (not shown). That is, as the conductive film 4, at least one first groove 8 may be arranged in the first region R1, and at least one second groove 9 may be arranged in the second region R2.

[0162] As mentioned above, although embodiment of this disclosure was described, this disclosure is not limited to the said embodiment, Various changes are possible within the scope of this disclosure.

[0163] - Industrial Applicability -

[0164] The present disclosure can be used in industry as a conductive film applicable to a touch sensor or the like.

[0165] - Explanation of symbols -

[0166] 1: Touch sensor

[0167] 2: Cover parts

[0168] 2a: Operation surface

[0169] 3: Decoration Department

[0170] 4: Conductive film

[0171] 5: Substrate

[0172] 6: Film substrate

[0173] 7: Groove formation

[0174] 8: First groove

[0175] 9: Second groove

[0176] 11: Transmitting electrode

[0177] 12: Receiving electrode

[0178] 13: Route wiring

[0179] 15: Connecting pads

[0180] 16: Flexible wiring board

[0181] 17: Flexible wiring board main body

[0182] 18: Flexible wiring board front side connection part

[0183] 19: Flexible wiring board back side connection part

[0184] 21: Adhesive layer

[0185] 23: Protective film

[0186] 24: First conductive line

[0187] 25: Second conductive wire

[0188] 26: First concave portion

[0189] 27: Second recessed portion

[0190] 28: The third recessed portion

[0191] 31: Adhesion layer

[0192] 32: Conductive layer

[0193] 33: Seed layer

[0194] 34: Main layer

[0195] 38: Black layer

[0196] Cp: ​​Conductive particles

[0197] R1: First Area

[0198] R2: Second Area

[0199] R3: Connection area

Claims

1. A conductive film, comprising a first region and a second region, wherein: The conductive film includes a substrate, at least one first conductive line and at least one second conductive line. The first conductive line is disposed on the substrate, The second conductive line is disposed on the substrate, The substrate has at least one first groove portion and at least one second groove portion, The first groove is arranged in the first region and is in a bottomed shape extending in a linear shape. The second groove is arranged in the second region and is in a bottomed shape extending in a linear shape. The first conductive line and the second conductive line include a conductive layer, and the conductive layer is formed of a conductive material buried in the first groove portion and the second groove portion, respectively. The first conductive line has at least one first recessed portion, and the first recessed portion is recessed from the opening side of the first groove portion toward the thickness direction of the substrate in a cross-sectional view. The second conductive line has at least one second recessed portion, and the second recessed portion is recessed from the opening side of the second groove portion toward the thickness direction of the substrate in a cross-sectional view. The first groove portion and the second groove portion are configured such that: the groove width of the second groove portion is larger than the groove width of the first groove portion; The first recessed portion and the second recessed portion are configured such that: a recessed width dimension of the second recessed portion is larger than a recessed width dimension of the first recessed portion, and a recessed depth dimension of the second recessed portion is larger than a recessed depth dimension of the first recessed portion.

2. The conductive film according to claim 1, characterized in that: The groove width of the first groove portion is not less than 0.5 μm and not more than 3.0 μm. The groove width of the second groove portion is not less than 8.0 μm and not more than 12.0 μm. The first groove portion and the second groove portion each have a groove depth dimension of 0.5 μm or more and 2.0 μm or less.

3. The conductive film according to claim 1, characterized in that: The first recessed portion and the second recessed portion are configured such that a recessed depth dimension of each of the first recessed portion and the second recessed portion is not less than 0.004 μm and not more than 7.0 μm.

4. The conductive film according to claim 3, characterized in that: The second groove portion and the second recessed portion are configured such that a value obtained by dividing the recessed depth dimension by the groove width dimension is not less than 0.01 and not more than 0.

4.

5. The conductive film according to claim 1, characterized in that: The second region includes a connection region in which an anisotropic conductive resin material containing a plurality of conductive particles can be arranged on the surface of the substrate. The second groove portion is configured such that a portion of the second groove portion is located in the connection region. The second conductive line is configured such that the second recessed portion located in the connection region has a size capable of contacting each of the plurality of conductive particles.

6. The conductive film according to claim 5, characterized in that: The second recessed portion located in the connection region is configured such that a cross-sectional shape of an outer surface side of the second recessed portion is curved.

7. The conductive film according to claim 5, characterized in that: The second recessed portion located in the connection area is configured such that the cross-sectional shape of the outer surface side of the second recessed portion is an arc shape, The second recessed portion located in the connection region is configured such that a radius of curvature of the arc shape is larger than a radius of curvature of a particle diameter of each of the plurality of conductive particles.

8. The conductive film according to claim 1, characterized in that: The first conductive line further includes a blackened layer, and the blackened layer is stacked on the conductive layer at the opening side of the first recessed portion.

9. The conductive film according to claim 1, characterized in that: The first conductive line also has at least one third recessed portion, The third recessed portion has a smaller recessed width than the first recessed portion, and the third recessed portion has a smaller recessed depth than the first recessed portion.

10. The conductive film according to claim 1, characterized in that: The second conductive line also has at least one third recessed portion, The third recessed portion has a smaller recessed width than the second recessed portion, and the third recessed portion has a smaller recessed depth than the second recessed portion.

Images