Chip detection device

Abstract

The invention discloses a chip detection device. The chip detection device comprises a turntable module, a probe module and a limiting module, the turntable module is configured to convey an object to be tested. The probe module corresponds to one surface of the turntable module, is configured to be used for contacting an object to be tested, and is configured to provide electric energy to the object to be tested or receive a signal generated by the object to be tested. The limiting module is located on the other face of the rotating disc module and provided with a first opening. When the probe module is in contact with the to-be-detected object, the limiting module shields the to-be-detected object, so that the to-be-detected object is located in the turntable module. Therefore, the chip detection device provided by the invention can strengthen the stability of the chip during detection and increase the diversity of chip detection.

Description

Technical Field

[0001] The present invention relates to a testing device, in particular to a chip testing device which can prevent a chip from falling off when being tested and can simultaneously test multiple performances of the chip. Background Art

[0002] In the semiconductor process, tiny particles or defects are often generated due to some unavoidable reasons. As the size of components in the semiconductor process continues to shrink and the circuit density continues to increase, the impact of these extremely small defects or particles on the quality of integrated circuits is becoming more and more serious. Therefore, in order to maintain the stability of product quality, it is usually necessary to perform defect detection on the produced semiconductor components while carrying out various semiconductor processes. The root causes of these defects can be analyzed based on the test results. Only then can the process parameters be further adjusted to avoid or reduce the generation of defects, so as to achieve the purpose of improving the yield and reliability of the semiconductor process.

[0003] However, the existing chip testing equipment currently requires additional complex clamping equipment to fix the chip under test when performing chip defect or performance testing. Moreover, if multiple tests are to be performed on the chip, the chip needs to be transported to different testing stations. Therefore, the related testing devices and auxiliary devices required by the existing chip testing equipment are not only numerous, the testing process is complicated, but also the testing cost is increased.

[0004] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become one of the important issues to be solved in the technical field. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a chip detection device in view of the deficiencies in the prior art.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a chip detection device, including a turntable module, at least one probe module and a limit module. The turntable module is configured to transport at least one object to be tested. At least one probe module corresponds to one side of the turntable module, at least one probe module is configured to contact at least one object to be tested, and at least one probe module is configured to provide electrical energy to at least one object to be tested or receive a signal generated by at least one object to be tested. The limit module is located on the other side of the turntable module, and the limit module has at least one first opening. Wherein, when at least one probe module contacts at least one object to be tested, the limit module blocks at least one object to be tested so that at least one object to be tested is located in the turntable module.

[0007] In one feasible or preferred embodiment, the turntable module has a plurality of transport slots, each of which is configured to accommodate the object to be tested.

[0008] In one feasible or preferred embodiment, the chip detection device further includes a plurality of the probe modules. The limit module has a plurality of the first openings, and each of the first openings corresponds to one of the probe modules. When the turntable module positions the plurality of objects to be tested at positions corresponding to the plurality of probe modules and the plurality of first openings, and each of the probe modules contacts the corresponding object to be tested, each of the objects to be tested generates a light beam, and the light beam is projected to the outside of the limit module through the corresponding first opening.

[0009] In one feasible or preferred embodiment, one side of the limiting module is recessed inwardly to form at least one projection groove, and at least one of the projection grooves is communicated with at least one of the first openings.

[0010] In one feasible or preferred embodiment, one of the surfaces of the limiting module is recessed inward to form at least one accommodating groove, and at least one of the accommodating grooves corresponds to at least one of the projection grooves and communicates with at least one of the projection grooves.

[0011] In one feasible or preferred embodiment, the position limiting module includes a carrier element and at least one light-transmitting element. The carrier element is located on the other side of the turntable module, and the carrier element has at least one first opening, at least one projection groove, and at least one receiving groove. At least one light-transmitting element is disposed in at least one receiving groove.

[0012] In one feasible or preferred embodiment, the limiting module further has a plurality of the second openings, each of which is adjacent to one of the first openings. The limiting module further has a plurality of the projection slots, each of which includes a plurality of depressions, two adjacent depressions are connected, one of the depressions of each projection slot corresponds to one of the first openings, and another of the depressions of each projection slot corresponds to one of the second openings. The chip detection device further includes a covering module, which is adjacent to the limiting module, and is configured to flexibly cover or open the plurality of the first openings and the plurality of the second openings.

[0013] In one feasible or preferred embodiment, the covering module includes a substrate element and a plurality of screen cover elements. The substrate element has a plurality of through openings penetrating the body. The plurality of screen cover elements are located on the substrate element and cover the plurality of through openings. When the covering module is driven and displaced to the detection position, the substrate element covers one side of the limit module, and the plurality of screen cover elements cover the plurality of the first openings.

[0014] In one feasible or preferred embodiment, when the covering module is driven to move from the detection position to the return position, the substrate element is away from the limiting module.

[0015] In one feasible or preferred embodiment, one side edge of one of the surfaces of the limiting module extends outward to form a stopper, and the stopper is adjacent to the center of the turntable module.

[0016] One of the beneficial effects of the present invention is that the chip detection device provided by the present invention can enhance the stability of the chip during testing and increase the diversity of chip detection through the technical solution of "a turntable module is configured to transport at least one object to be tested. At least one probe module corresponds to one side of the turntable module, at least one probe module is configured to contact at least one object to be tested, and at least one probe module is configured to provide electrical energy to at least one object to be tested or receive a signal generated by at least one object to be tested. A limit module is located on the other side of the turntable module, and the limit module has at least one first opening. A cover module is adjacent to the limit module, and the cover module is configured to movably cover or open at least one first opening. Wherein, when at least one probe module contacts at least one object to be tested, the limit module blocks at least one object to be tested so that at least one object to be tested is located in the turntable module."

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a three-dimensional schematic diagram of a chip detection device according to a first embodiment of the present invention.

[0019] Figure 2 It is a schematic exploded view of a chip detection device according to the first embodiment of the present invention from one viewing angle.

[0020] Figure 3 It is a schematic diagram of an exploded view of the chip detection device of the first embodiment of the present invention from another perspective.

[0021] Figure 4 FIG. 1 is a partial schematic diagram of a turntable module of a chip detection device according to the first embodiment of the present invention.

[0022] Figure 5 FIG. 1 is a partial top view of a chip detection device according to a first embodiment of the present invention.

[0023] Figure 6 FIG. 1 is a partial bottom view of a chip detection device according to a first embodiment of the present invention.

[0024] Figure 7 FIG. 1 is a partial cross-sectional diagram of a chip detection device according to a first embodiment of the present invention.

[0025] Figure 8 FIG. 4 is a partial schematic diagram of a limit module of a chip detection device according to a second embodiment of the present invention.

[0026] Fig. 9 FIG. 4 is a schematic three-dimensional diagram of a chip detection device according to a second embodiment of the present invention.

[0027] Fig.10 FIG. 1 is a schematic exploded view of a chip detection device according to a second embodiment of the present invention from one viewing angle.

[0028] Fig.11 FIG. 1 is a schematic diagram of an exploded view of a chip detection device according to a second embodiment of the present invention from another perspective.

[0029] Fig.12 FIG. 4 is a schematic diagram of a chip detection device in use according to a second embodiment of the present invention.

[0030] Fig.13 It is a partial schematic diagram of the chip detection device in use according to the second embodiment of the present invention.

[0031] Description of reference numerals:

[0032] Z-chip detection device; 1-turntable module; 10-transport slot; 11-center; 2-probe module; 3-limiting module; 30-carrier element; 300-first opening; 301-projection slot; 301a, 301b-sunken part; 302-accommodating slot; 303-second opening; 304-stopper; 31-light-transmitting element; 4-covering module; 40-substrate element; 400-through port; 41-screen cover element; E-object to be tested. DETAILED DESCRIPTION

[0033] The following is an explanation of the implementation of the "chip detection device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0034] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0035] First embodiment

[0036] See also Figures 1 to 7 , which are respectively a three-dimensional schematic diagram of a chip detection device according to the first embodiment of the present invention, an exploded schematic diagram from one viewing angle, an exploded schematic diagram from another viewing angle, a partial schematic diagram of a turntable module, a partial top view schematic diagram, a partial bottom view schematic diagram, and a partial cross-sectional schematic diagram. As shown in the above figures, the first embodiment of the present invention provides a chip detection device Z, which may include a turntable module 1, at least one probe module 2, and a limit module 3.

[0037] Cooperate Figures 1 to 4 As shown, the turntable module 1 of the present invention is configured to transport at least one object E to be tested. For example, the turntable module 1 of the present invention may be a conveying device with a turntable structure. The turntable module 1 may be located between the probe module 2 and the limit module 3. The turntable module 1 has a plurality of conveying slots 10, each of which is configured to accommodate the object E to be tested; wherein the plurality of conveying slots 10 are arranged at intervals on the side of the turntable module 1, and the conveying slots 10 may have a fixing element with a clamping function or an adsorption function to fix the object E to be tested. wherein, the object E to be tested may be an electronic component, such as a chip, but is not limited thereto, and when the present invention is actually applied, the object E to be tested may also be a non-electronic component. In addition, the turntable module 1 may also be provided with a power element (not shown in the figure) and a base element (not shown in the figure). The power element may be a motor or other types of power elements. The base element may be located below the lower surface of the turntable module 1, and the base element may also have a through-hole (not shown in the figure) that passes through the body, and the through-hole corresponds to the probe module 2.

[0038] Next, cooperate Figures 1 to 4 and Figure 7 As shown, the probe module 2 of the present invention corresponds to one side of the turntable module 1, and the probe module 2 can be configured to contact the object E to be tested, and the probe module 2 is configured to provide electrical energy to the object E to be tested or receive a signal generated by the object E to be tested. For example, the probe module 2 can be movably disposed at the bottom of the turntable module 1, the probe module 2 can be a probe structure, and can include a driving element (not shown in the figure). The present invention can drive the probe module 2 to rise and contact the object E to be tested, and drive the probe module 2 to fall away from the turntable module 1 or the object E to be tested through the driving element.

[0039] Next, cooperate Figures 1 to 3 As shown, the limiting module 3 of the present invention is located on the other side of the turntable module 1, and the limiting module 3 may have at least one first opening 300. For example, one side of the limiting module 3 may be recessed inward to form at least one projection groove 301, and at least one projection groove 301 is communicated with at least one first opening 300; wherein the projection groove 301 may be a radial recessed groove. Moreover, one side of the limiting module 3 may be recessed inward to form at least one receiving groove 302, and at least one receiving groove 302 may correspond to at least one projection groove 301 and communicate with at least one projection groove 301. Therefore, the first opening 300, the projection groove 301, and the receiving groove 302 are communicated with each other.

[0040] Furthermore, with Figures 1 to 3 ,and Figure 5 As shown, the position limiting module 3 of the present invention may further include a carrier element 30 and at least one light-transmitting element 31. The carrier element 30 may be located on the other side of the turntable module 1, that is, on the top of the turntable module 1; and the carrier element 30 may have at least one first opening 300, at least one projection groove 301 and at least one receiving groove 302. The at least one light-transmitting element 31 may be detachably disposed in the at least one receiving groove 302; wherein the light-transmitting element 31 may be transparent glass or a transparent plate.

[0041] Therefore, when the at least one probe module 2 contacts the at least one object to be measured E, the limiting module 3 can shield the at least one object to be measured E, so that the at least one object to be measured E is located in the turntable module 1 .

[0042] For example, with Figures 1 to 7As shown, when the object E to be tested is tested by the chip detection device Z of the present invention, the object E to be tested can first be transported by the turntable module 1 to the detection position corresponding to the first opening 300 of the carrier component 30. Then, the turntable module 1 will temporarily stop rotating, and the probe module 2 can move toward the object E to be tested and the turntable module 1 and contact the object E to be tested; at this time, since the carrier component 30 is located at the top of the turntable module 1 and approaches the upper surface of the turntable module 1, when the probe module 2 contacts the object E to be tested, the carrier component 30 can produce a blocking effect to prevent the object E to be tested from being ejected by the probe module 2 and leaving the transport slot 10.

[0043] Next, the object E to be tested can be subjected to a light emitting or light receiving detection procedure. When the object E to be tested is in the light emitting detection mode, the probe module 2 can provide electrical energy to the object E to be tested so that the object E to be tested generates a light beam. At this time, the tester or the detection equipment (such as an image capture module) can check whether the object E to be tested generates a light beam through the first opening 300 of the carrier element 30 to determine whether the object E to be tested is a good product. Among them, the chip detection device Z of the present invention simulates the actual use of a mobile phone camera (such as generating a flash) by setting a light-transmitting element 31 on the accommodating groove 302.

[0044] When the object E to be tested is in the light receiving detection mode, the probe module 2 can contact the object E to be tested; at this time, the object E to be tested can collect external light energy through the first opening 300 to generate a light signal. Next, the probe module 2 can receive the light signal generated by the object E to be tested. The tester or the detection equipment can determine whether the object E to be tested is a good product by determining whether the probe module 2 has received the light signal of the object E to be tested.

[0045] Therefore, the chip detection device Z of the present invention can not only prevent the object E to be tested from escaping from the conveying slot 10 of the turntable module 1 by using the above technical solution and setting a customized cover (i.e., the limit module 3), but also provide the object E to be tested for light emission and light collection detection through the opening of the cover (i.e., the first opening 300). In addition, a transparent plate (i.e., a light-transmitting element 31) can be installed on the cover to simulate the actual use of a mobile phone camera.

[0046] Furthermore, the chip detection device Z of the present invention may also include a plurality of probe modules 2. The limiting module 3 may have a plurality of first openings 300, each of which corresponds to one of the probe modules 2. When the turntable module 1 positions the plurality of objects to be tested E at positions corresponding to the plurality of probe modules 2 and the plurality of first openings 300, and each probe module 2 contacts the corresponding object to be tested E, each object to be tested E generates a light beam, and the light beam is projected to the outside of the limiting module 3 through the corresponding first opening 300.

[0047] For example, with Figures 1 to 7 As shown, the chip detection device Z of the present invention can also perform a light emitting or light receiving detection procedure on multiple test objects E at the same time. Therefore, the chip detection device Z of the present invention can be provided with multiple probe modules 2, and multiple first openings 300 are arranged at intervals on the carrier element 30; wherein each first opening 300 has its own corresponding projection groove 301 and receiving groove 302 (in other words, the chip detection device Z of the present invention can also be provided with multiple light-transmitting elements 31).

[0048] Next, multiple transport slots 10 of the turntable module 1 are used to transport multiple objects E to be tested. When the turntable module 1 transports a portion of the objects E to be tested to the detection positions of the multiple first openings 300 corresponding to the carrier component 30, the tester or the detection equipment (such as an image capture module) can check through the first openings 300 of the carrier component 30 to see whether the object E to be tested generates a light beam, or the tester or the detection equipment can determine whether the object E to be tested is a good product by determining whether the probe module 2 has received the light signal of the object E to be tested.

[0049] However, the above example is only one feasible implementation example and is not intended to limit the present invention.

[0050] Second embodiment

[0051] See also Figures 8 to 13 , respectively, are a partial schematic diagram, a stereoscopic schematic diagram, an exploded schematic diagram from one viewing angle, an exploded schematic diagram from another viewing angle, a schematic diagram of a use state, and a partial schematic diagram of a use state of a limit module of a chip detection device according to a second embodiment of the present invention, and please refer to them together Figures 1 to 7 . As shown in the above figures, the chip detection device Z of this embodiment is substantially similar to the chip detection device Z of the above embodiment, and therefore, the arrangement or operation of the same components will not be repeated herein. The difference between the chip detection device Z of this embodiment and the chip detection device Z of the above first embodiment is that, in this embodiment, the limit module 3 of the present invention further has a plurality of second openings 303, and each second opening 303 is adjacent to one of the first openings 300. Among them, the limit module 3 may also have a plurality of projection grooves 301, and each projection groove 301 may include a plurality of recessed portions 301a, 301b, and two adjacent recessed portions 301a, 301b are connected, and one of the recessed portions 301a, 301b of each projection groove 301 corresponds to one of the first openings 300, and another recessed portion 301a, 301b of each projection groove 301 corresponds to one of the second openings 303.

[0052] For example, with Figures 8 to 10As shown, each projection slot 301 of the position limiting module 3 may also have a second opening 303, that is, each second opening 303 corresponds to one of the first openings 300, one of the projection slots 301 and one of the receiving slots 302. Each projection slot 301 may also include a plurality of sunken portions 301a, 301b, and the sunken portions 301a, 301b may be radial grooves that are the same or different from each other. In addition, one side edge of one side of the position limiting module 3 extends outward to form a stopper 304, and the stopper 304 is adjacent to the center 11 (also referred to as the central axis) of the turntable module 1; that is, the side edge of the position limiting module 3 adjacent to the center 11 of the turntable module 1 may extend outward to form a stopper 304.

[0053] Next, cooperate Figures 9 to 12 As shown, the cover module 4 may include a substrate element 40 and a plurality of screen cover elements 41. The substrate element 40 has a plurality of through openings 400 penetrating the body. The plurality of screen cover elements 41 are located on the substrate element 40 and shield the plurality of through openings 400.

[0054] For example, the covering module 4 may be adjacent to the limiting module 3, and the limiting module 3 may be located between the turntable module 1 and the covering module 4. The covering module 4 may be configured to movably cover or open the first opening 300, the projection slot 301, the receiving slot 302, and the second opening 303. The substrate element 40 may be a plate structure, and the substrate element 40 has a plurality of through openings 400 arranged at intervals. Each screen cover element 41 is detachably disposed on one side of the substrate element 40 facing away from the limiting module 3 and covers one of the through openings 400.

[0055] Therefore, with Figures 8 to 13 As shown, the object E to be tested can be subjected to a gray card test or a light tube test by the chip detection device Z of the present invention. Further, at least one object E to be tested can first be transported to the detection position corresponding to the first opening 300 of the carrier component 30 by the turntable module 1. Then, the turntable module 1 will temporarily stop rotating, and the probe module 2 can move toward the object E to be tested and the turntable module 1 and contact the object E to be tested; and the probe module 2 can perform at least one of the actions of providing electrical energy to the object E to be tested and receiving the light signal generated by the object E to be tested; at this time, the cover module 4 is away from the carrier component 30 and is in the return position.

[0056] Next, the cover module 4 can be driven by a driving device (not shown in the figure) to move toward the carrier element 30, and cover one side of the limit module 3 and the multiple screen cover elements 41 cover the multiple first openings 300; at this time, the cover module 4 is located at the detection position, wherein the stopper 304 of the limit module 3 can also stop the cover module 4 from excessive displacement, providing a positioning function. Next, the probe module 2 can provide electrical energy to the object E to be tested, so that the light-emitting part (not shown in the figure) of the object E to be tested generates a light beam and projects it to the cover module 4 through the first opening 300; and the light-receiving part (not shown in the figure) of the object E to be tested can collect the light beam generated by the light-emitting part of the object E to be tested through the second opening 303 and generate a corresponding light signal, and the probe module 2 can receive the light signal of the object E to be tested. It is worth mentioning that in this test stage, the probe module 2 may not provide electrical energy to the object E to be tested, but only receive the light signal of the object E to be tested, but it is not limited to this.

[0057] When the detection is completed, the covering module 4 can be driven by the driving device to move away from the limiting module 3 to move to the initial return position.

[0058] Therefore, the chip detection device Z of the present invention can use the above technical solution to set up a movable cover module 4 to perform performance detection on the object E to be detected in different situations (such as bright and dark environments).

[0059] However, the above example is only one feasible implementation example and is not intended to limit the present invention.

[0060] Advantageous Effects of Embodiments

[0061] One of the beneficial effects of the present invention is that the chip detection device Z provided by the present invention can enhance the stability of the chip during testing and increase the diversity of chip detection through the technical solution of "the turntable module 1 is configured to transport at least one object to be tested E. At least one probe module 2 corresponds to one side of the turntable module 1, at least one probe module 2 is configured to contact at least one object to be tested E, and at least one probe module 2 is configured to provide electrical energy to at least one object to be tested E or receive a signal generated by at least one object to be tested E. The limit module 3 is located on the other side of the turntable module 1, and the limit module 3 has at least one first opening 300. When at least one probe module 2 contacts at least one object to be tested E, the limit module 3 blocks at least one object to be tested E so that at least one object to be tested E is located in the turntable module 1".

[0062] Furthermore, the chip detection device Z of the present invention can be provided with a customized cover (i.e., the limit module 3) through the above technical solution, which can not only prevent the object E to be tested from escaping from the conveying slot 10 of the turntable module 1, but also provide the object E to be tested for light emission and light collection through the opening of the cover (i.e., the first opening 300). In addition, a transparent plate (i.e., the light-transmitting element 31) can be installed on the cover to simulate the actual use of a mobile phone camera.

[0063] Furthermore, the chip testing device Z of the present invention can also utilize a movable cover module 4 to perform performance testing on the object to be tested E in different situations (eg, bright or dark environments).

[0064] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A chip detection device, characterized in that: include: A turntable module, wherein the turntable module is configured to transport at least one object to be tested; At least one probe module, at least one of the probe modules corresponds to one side of the turntable module, at least one of the probe modules is configured to contact at least one of the objects to be tested, and at least one of the probe modules is configured to provide electrical energy to at least one of the objects to be tested or receive a signal generated by at least one of the objects to be tested; as well as A limiting module, the limiting module is located on the other side of the turntable module, and the limiting module has at least one first opening; Wherein, when at least one of the probe modules contacts at least one of the objects to be tested, the limiting module shields at least one of the objects to be tested, so that at least one of the objects to be tested is located in the turntable module.

2. The chip detection device according to claim 1, characterized in that: The turntable module has a plurality of conveying slots, and each of the conveying slots is configured to accommodate the object to be tested.

3. The chip detection device according to claim 2, characterized in that: The chip detection device also includes a plurality of the probe modules; wherein the limiting module has a plurality of the first openings, and each of the first openings corresponds to one of the probe modules; wherein, when the turntable module positions the plurality of objects to be tested at positions corresponding to the plurality of probe modules and the plurality of first openings, and each of the probe modules contacts the corresponding object to be tested, each of the objects to be tested generates a light beam and the light beam is projected to the outside of the limiting module through the corresponding first opening.

4. The chip detection device according to claim 3, characterized in that: One side of the limiting module is inwardly recessed to form at least one projection groove, and at least one projection groove is communicated with at least one first opening.

5. The chip detection device according to claim 4, characterized in that: One of the surfaces of the limiting module is recessed inwardly to form at least one accommodating groove, and at least one of the accommodating grooves corresponds to at least one of the projection grooves and is in communication with at least one of the projection grooves.

6. The chip detection device according to claim 5, characterized in that: The limit module comprises: A carrier element, the carrier element is located on the other side of the turntable module, the carrier element has at least one first opening, at least one projection groove and at least one receiving groove; and At least one light-transmitting element, at least one of the light-transmitting elements is disposed in at least one of the accommodating grooves.

7. The chip detection device according to claim 5, characterized in that: The limiting module also has a plurality of second openings, each of the second openings being adjacent to one of the first openings; wherein the limiting module also has a plurality of projection grooves, each of the projection grooves comprising a plurality of depressions, two adjacent depressions being communicated with each other, one of the depressions of each projection groove corresponding to one of the first openings, and another of the depressions of each projection groove corresponding to one of the second openings; wherein the chip detection device also includes a covering module, the covering module being adjacent to the limiting module, and the covering module being configured to be able to flexibly cover or open a plurality of the first openings and a plurality of the second openings.

8. The chip detection device according to claim 7, characterized in that: The covering module comprises: a substrate member having a plurality of openings extending through the body; and A plurality of screen cover elements, wherein the plurality of screen cover elements are located on the substrate element and cover the plurality of through openings; When the covering module is driven to move to the detection position, the substrate element covers one side of the limiting module, and a plurality of screen cover elements cover a plurality of the first openings.

9. The chip detection device according to claim 8, characterized in that: When the covering module is driven to move from the detecting position to the returning position, the substrate element is away from the limiting module.

10. The chip detection device according to claim 3, characterized in that: One side edge of one of the surfaces of the limiting module extends outward to form a stopper, and the stopper is adjacent to the center of the turntable module.

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