Water drinking device

Abstract

The invention relates to a water drinking device. The water drinking device comprises a heat storage tank, a cold storage tank, a first semiconductor refrigerator, a heat dissipation assembly and a flow guide assembly. The cold storage tank is provided with a mounting part, the first semiconductor refrigerator is provided with a refrigerating surface and a heating surface, the refrigerating surface is arranged on the mounting part, the heating surface is provided with the heat dissipation assembly, and the heat dissipation assembly is used for driving airflow to flow to dissipate heat of the heating surface; the flow guide assembly is arranged on the periphery of the heat storage tank and connected with the heat dissipation assembly, and the heat dissipation assembly drives airflow to enter the heat dissipation assembly. The water drinking device can reduce energy consumption.

Description

Technical Field

[0001] The invention relates to the field of drinking water, and in particular to a drinking water device. Background Art

[0002] Water purifiers, also called water purifiers and water purifiers, are water treatment equipment that deeply filters and purifies water according to the requirements for water use. As the demand for drinking water diversifies, drinking cold water is becoming more and more popular, so adding refrigeration function to water purifiers has become a trend. At present, the refrigeration function in related technologies is performed by semiconductor refrigerators, but when the semiconductor refrigerator is heating, one side is heating and the other side is cooling, which will cause energy waste. Summary of the invention

[0003] In view of this, the present invention provides a drinking water device which can reduce energy consumption.

[0004] The present invention provides the following technical solutions:

[0005] A drinking water device, comprising: a heat storage tank, a cold storage tank, a first semiconductor refrigerator, a heat dissipation component, and a flow guide component;

[0006] The cold storage tank has a mounting portion, the first semiconductor refrigerator has a cooling surface and a heating surface, the cooling surface is arranged on the mounting portion, the heating surface is provided with the heat dissipation component, and the heat dissipation component is used to drive airflow to dissipate heat for the heating surface;

[0007] The flow guide component is arranged on the periphery of the heat storage tank, the flow guide component is connected to the heat dissipation component, and the heat dissipation component drives the airflow to enter the heat dissipation component.

[0008] Furthermore, the heat dissipation assembly includes: heat dissipation fins, a heat conducting member, and a driving member;

[0009] The heat dissipation fins are arranged on the heat conduction member, the driving member is arranged on the heat dissipation fins, and the heat conduction member is arranged on the heating surface.

[0010] Further, the flow guide assembly includes: a surrounding portion and an extended portion;

[0011] The interior of the extension part is a cavity; the surrounding part and the extension part are connected in sequence, the surrounding part is arranged around the outer circumference of the heat storage tank, the surrounding part and the outer side wall of the heat storage tank form a heating cavity, the extension part extends in a direction away from the surrounding part, the extension part is provided with a square hole, the driving member is arranged in the square hole, and the square hole is communicated with the interior of the extension part.

[0012] Furthermore, it also includes: a heat conduction component;

[0013] The heat conduction component comprises: a heat absorbing component and a plurality of heat transfer components;

[0014] A plurality of heat transfer elements are arranged at intervals on the heat absorption element, the heat absorption element is attached to the cooling surface and / or the heating surface, and the heat transfer element is used to transfer the heat on the heat absorption element.

[0015] Furthermore, the heat transfer element is a heat conductive sheet, and the heat conductive sheet extends into the cold storage tank.

[0016] Furthermore, it also includes: a limiting member;

[0017] The mounting portion is provided with a mounting hole, and the limiting member is arranged around the outer circumference of the mounting hole, and the limiting member includes an extension portion and a limiting portion, wherein the limiting portion is arranged on the extension portion, and an angle is formed between the extension portion and the limiting portion; when the heat conductive component is installed in the mounting hole, the limiting portion is parallel to the heat conductive sheet.

[0018] Further, it also includes: a filter element assembly;

[0019] The filter element assembly is arranged in the drinking water device, and the filter element assembly is connected to the cold storage tank and the heat storage tank respectively.

[0020] Furthermore, it also includes: a second semiconductor refrigerator;

[0021] The second semiconductor refrigerator is arranged on the heat storage tank, and the second semiconductor refrigerator is used for heating the heat storage tank.

[0022] Further, it also includes: a vane pump;

[0023] The vane pump is connected to the heat storage tank and the cold storage tank respectively, and the vane pump is used to supply water to the water-using equipment.

[0024] Furthermore, the surrounding portion and the outer periphery of the cold storage tank are both provided with a heat insulation layer.

[0025] The above-mentioned drinking water device includes a heat storage tank and a cold storage tank. A mounting portion is provided on the cold storage tank, and the cold storage tank is arranged on the cooling surface of the first semiconductor refrigerator. In this way, the first semiconductor refrigerator will generate heat when cooling the cold storage tank. The generated heat can drive the air through the heat dissipation component to discharge the heat generated by the heating surface, thereby reducing the temperature of the heating surface and heating the airflow. After being heated, the airflow can enter the guide component, so that the hot airflow in the guide component can provide insulation function for the heat storage tank, so as to achieve the purpose of reducing energy waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the implementation mode will be briefly introduced below. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 One of the structural schematic diagrams of the drinking water device provided in the embodiment of the present invention;

[0028] Figure 2 A second structural schematic diagram of a drinking water device provided in an embodiment of the present invention;

[0029] Figure 3 An exploded view of a heat dissipation assembly provided in an embodiment of the present invention;

[0030] Figure 4 A schematic diagram of the structure of a flow guide assembly provided in an embodiment of the present invention;

[0031] Figure 5 A schematic diagram of the structure of a heat conduction component provided in an embodiment of the present invention;

[0032] Figure 6 A cross-sectional view of a heat storage tank provided in an embodiment of the present invention;

[0033] Figure 7 for Figure 6 The enlarged view of point A in the middle;

[0034] Figure 8 A third structural schematic diagram of a drinking water device provided in an embodiment of the present invention;

[0035] Fig. 9 The fourth structural schematic diagram of the drinking water device provided in the embodiment of the present invention.

[0036] Description of reference numerals:

[0037] 100-drinking device; 10-heat storage tank; 20-cold storage tank; 21-installation part; 211-installation hole; 30-first semiconductor refrigerator; 31-cooling surface; 32-heating surface; 40-heat dissipation assembly; 41-heat dissipation fins; 42-heat transfer element; 43-driving element; 50-flow guide assembly; 51-surrounding part; 52-extension part; 53-cavity; 54-heating cavity; 55-square hole; 60-heat conduction assembly; 61-heat absorption element; 62-heat conduction element; 70-limiting element; 71-extension part; 72-limiting part; 80-filter element assembly; 81-second semiconductor refrigerator; 82-vane pump; 83-thermal insulation layer. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] The terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0040] References to "embodiments" or "implementations" herein mean that a particular feature, structure, or characteristic described in conjunction with the embodiments or implementations may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0041] Water purifiers, also called water purifiers and water purifiers, are water treatment equipment that deeply filters and purifies water according to the requirements for water use. As the demand for drinking water diversifies, drinking cold water is becoming more and more popular, so adding refrigeration function to water purifiers has become a trend. At present, the refrigeration function in related technologies is performed by semiconductor refrigerators, but when the semiconductor refrigerator is heating, one side is heating and the other side is cooling, which will cause energy waste.

[0042] In view of this, the present embodiment provides a drinking water device 100. The drinking water device 100 can reduce energy consumption.

[0043] See also Figure 1 and Figure 2 , a drinking water device 100, comprising: a heat storage tank 10, a cold storage tank 20, a first semiconductor refrigerator 30, a heat dissipation component 40, and a flow guide component 50;

[0044] The cold storage tank 20 has a mounting portion 21, the first semiconductor refrigerator 30 has a cooling surface 31 and a heating surface 32, the cooling surface 31 is arranged on the mounting portion 21, the heating surface 32 is provided with the heat dissipation component 40, and the heat dissipation component 40 is used to drive airflow to dissipate heat for the heating surface 32;

[0045] The flow guide component 50 is disposed on the outer periphery of the heat storage tank 10 , and the flow guide component 50 is connected to the heat dissipation component 40 , and the heat dissipation component 40 drives the airflow to enter the heat dissipation component 40 .

[0046] The above-mentioned drinking water device 100 includes a heat storage tank 10 and a cold storage tank 20, a mounting portion 21 is provided on the cold storage tank 20, and the cold storage tank 20 is arranged on the cooling surface 31 of the first semiconductor refrigerator 30, so that the first semiconductor refrigerator 30 will generate heat when cooling the cold storage tank 20. The generated heat can drive the air through the heat dissipation component 40 to discharge the heat generated by the heating surface 32, so that the temperature of the heating surface 32 can be reduced, and the airflow can be heated. After being heated, the airflow can enter the guide component 50, so that the hot airflow in the guide component 50 can provide insulation function for the heat storage tank 10, so as to achieve the purpose of reducing energy waste.

[0047] It can be understood that the first semiconductor refrigerator 30 will generate a large amount of heat during cooling, and this heat not only affects the efficiency of the semiconductor refrigerator in generating cold when working, but also affects the temperature of the cold storage tank 20, and will increase the temperature of the air flow near the cold storage tank 20. In this way, the pure water in the cold storage tank 20 will be cooled due to the influence of heat, resulting in a decrease in the cooling efficiency. Therefore, a heat dissipation component 40 is provided on the heating surface 32 of the first semiconductor refrigerator 30, and the heat generated by the heating surface 32 of the first semiconductor refrigerator 30 is taken away by the heat dissipation component 40. This not only reduces the temperature of the air flow near the cold storage tank 20, but also improves the cooling efficiency of the first semiconductor refrigerator 30.

[0048] It can be understood that the flow guide component 50 is arranged on the periphery of the heat storage tank 10, and the heat dissipation component 40 is connected to the flow guide component 50, so that when the heat dissipation component 40 is dissipating heat, the airflow near the heat dissipation component 40 can be heated and discharged into the flow guide component 50 through the heat dissipation component 40, so that the flow guide component 50 can conduct the hot air flow to the periphery of the heat storage tank 10, so that the hot air flow around the heat storage tank 10 can keep the heat storage tank 10 warm, so that the heat preservation effect of the heat storage tank 10 can be improved, thereby achieving the purpose of reducing energy waste.

[0049] See also Figure 2 and Figure 3 In some embodiments, the heat dissipation assembly 40 includes: heat dissipation fins 41, a heat conducting member 62, and a driving member 43;

[0050] The heat dissipation fins 41 are disposed on the heat conducting member 62 , the driving member 43 is disposed on the heat dissipation fins 41 , and the heat conducting member 62 is disposed on the heating surface 32 .

[0051] It can be understood that the heat dissipation component 40 includes: heat dissipation fins 41, heat conductive members 62, and driving members 43; wherein, the heat conductive members 62 are arranged on the heating surface 32, and multiple heat dissipation fins 41 are arranged on the heat conductive members 62, and the heat dissipation fins 41 are vertically arranged on the side of the heat conductive members 62 away from the heating surface 32; in this way, heat can be transferred to the heat dissipation fins 41 through the heat conductive members 62, and when the heat is conducted to the heat dissipation fins 41, the airflow near the heat dissipation fins 41 can exchange heat with the heat dissipation fins 41, so that the heat on the heat dissipation fins 41 can be taken away, thereby achieving heat dissipation; a driving member 43 is also arranged on one side of the heat dissipation fins 41, and the driving member 43 can accelerate the flow of airflow near the heat dissipation fins 41, so that the heat on the heat dissipation fins 41 can be accelerated, thereby achieving more efficient heat dissipation. Specifically, when the heating surface 32 of the semiconductor refrigerator generates heat, the heat can be transferred to the heat conductor 62 and then to the heat sink fins 41. The driving member 43 on the heat sink fins 41 can accelerate the airflow near the heat sink fins 41, thereby achieving the purpose of cooling the semiconductor refrigerator.

[0052] See also Figure 4 In some embodiments, the flow guide assembly 50 includes: a surrounding portion 51 and an extension portion 52;

[0053] The interior of the extension portion 52 is a cavity 53; the surrounding portion 51 and the extension portion 52 are connected in sequence, the surrounding portion 51 is arranged around the outer circumference of the heat storage tank 10, the surrounding portion 51 and the outer side wall of the heat storage tank 10 form a heating chamber 54, the extension portion 52 extends in a direction away from the surrounding portion 51, and a square hole 55 is provided on the extension portion 52. The driving member 43 is arranged in the square hole 55, and the square hole 55 is communicated with the interior of the extension portion 52.

[0054] It can be understood that the surrounding portion 51 and the extension portion 52 are connected in sequence, and part of the extension portion 52 is a cavity 53. The surrounding portion 51 is arranged around the outer periphery of the heat storage tank 10, so that the heat storage tank 10 and the surrounding portion 51 can be combined to form a heating cavity 54, and the heating cavity 54 can allow airflow to enter and gather at the outer periphery of the heat storage tank 10; the extension portion 52 is provided with a square hole 55, and the square hole 55 is connected to the cavity 53, so that when the driving member 43 drives the airflow to flow, the airflow can enter the cavity 53 through the square hole 55, and enter the heating cavity 54, so that the conduction of the hot airflow can be realized, so that the heat storage tank 10 can be kept warm. The driving member 43 can be arranged in the square hole 55, and the driving member 43 drives the airflow to flow into the square hole 55, so that the hot airflow can enter the cavity 53, and enter the heating cavity 54 through the cavity 53, so as to realize the flow and heat preservation functions of the hot airflow.

[0055] See also Figure 5 , in some embodiments, further comprising: a heat conducting component 60;

[0056] The heat conducting assembly 60 includes: a heat absorbing member 61 and a plurality of heat conducting members 42;

[0057] The plurality of heat transfer elements 42 are disposed at intervals on the heat absorption element 61 . The heat absorption element 61 is attached to the cooling surface 31 and / or the heating surface 32 . The heat transfer elements 42 are used to transfer heat from the heat absorption element 61 .

[0058] It can be understood that the heat conductive component 60 includes: a heat absorbing component 61 and a heat conductive sheet, wherein the heat absorbing component 61 is connected to the heat exchanger, and the heat absorbing component 61 is used to collect the cold generated by the first semiconductor refrigerator 30. A plurality of heat conductive sheets are arranged at intervals on the heat absorbing component 61, and the heat conductive sheets are arranged perpendicular to the heat absorbing component 61. At the same time, the heat conductive sheets extend into the cold storage tank 20, so that the cold on the heat absorbing component 61 can be transferred to the water storage tank through the heat conductive component 60, so that the cold generated by the first semiconductor refrigerator 30 can be transferred to the cold storage tank 20 through the heat absorbing component 61 and the heat conductive sheets. The provision of a plurality of heat conductive sheets can accelerate the efficiency of energy transfer, so that energy can enter the cold storage tank 20 faster and more evenly, realize heat exchange, and then enable the heat conductive component 60 to realize heat conduction.

[0059] See also Figure 2 and Figure 5 In some embodiments, the heat transfer element 42 is a heat conductive sheet, and the heat conductive sheet extends into the cold storage tank 20.

[0060] It can be understood that setting the heat transfer element 42 as a heat conductive sheet can increase the contact area between the heat transfer element 42 and the water flow, thereby improving the thermal conductivity of the heat transfer element 42. At the same time, the heat conductive sheet extends into the cold storage tank 20, which can reduce energy loss and enable the heat conductive sheet to directly exchange heat with the water flow, so that heat can be more directly and efficiently transferred to the water inside the tank, greatly improving the heat exchange efficiency and ensuring rapid adjustment of the water temperature.

[0061] See also Figure 6 and Figure 7 , in some embodiments, further comprising: a stopper 70;

[0062] The limiting member 70 is arranged around the outer periphery of the mounting hole 211, and the limiting member 70 includes an extension portion 71 and a limiting portion 72, wherein the limiting portion 72 is arranged on the extension portion 71, and an angle is formed between the extension portion 71 and the limiting portion 72; when the heat conductive component 60 is installed in the mounting hole 211, the limiting portion 72 is parallel to the heat conductive sheet.

[0063] It can be understood that a limiting member 70 is provided on the periphery of the mounting hole 211, and the limiting member 70 is used to cooperate with the heat conductive component 60 to limit the relative position of the heat conductive component 60 with respect to the water storage tank; the limiting member 70 includes an extension portion 71 and a limiting portion 72, wherein the extension portion 71 extends in a direction away from the mounting hole 211 (i.e., extends to the outside of the water storage tank), and the limiting portion 72 is provided on the extension portion 71, and the limiting portion 72 can be vertically provided on the extension portion 71, or can form an angle with the limiting portion 72, so that the limiting portion 72 can limit the installation position of the heat conductive component 60, so that the heat conductive component 60 can be installed more conveniently.

[0064] It can be understood that after the heat conductive component 60 is installed in the limiting portion 72, a seal can be set between the limiting portion 72 and the heat conductive component 60 to prevent water leakage from the mounting hole 211; the heat conductive component 60 can be directly fixed on the limiting portion 72, specifically, the mounting hole 211 can be set on the limiting portion 72, and the connection between the limiting portions 72 can be achieved by connecting the heat conductive component 60 to the mounting hole 211.

[0065] See also Figure 8 , in some embodiments, further comprising: a filter element assembly 80;

[0066] The filter element assembly 80 is disposed in the drinking water device 100 , and the filter element assembly 80 is connected to the cold storage tank 20 and the heat storage tank 10 , respectively.

[0067] It can be understood that the filter element assembly 80 is arranged in the water purification equipment, and the water purification equipment can purify the municipal water entering the water purification equipment, and after purification, the purified water can be output to the cold storage tank 20 and / or the heat storage tank 10, so that the water replenishment of the above-mentioned tank bodies can be achieved. The filter element assembly 80 includes a filter element and a water pump, and the water pump is used to pressurize the municipal water. This is because the filter element assembly 80 is provided with an RO filter element assembly 80 (Reverse Osmosis, reverse osmosis membrane). The water pressure of the municipal water supply is not enough to make the water flow through the RO filter element assembly 80 when the water flow is purified. In order to allow the water flow to pass through the filter element assembly 80 smoothly, a water pump is provided to ensure that the water flow can flow into the filter element assembly 80, while ensuring the purification efficiency of the filter element assembly 80.

[0068] See also Figure 2 , in some embodiments, further comprising: a second semiconductor refrigerator 81;

[0069] The second semiconductor refrigerator 81 is disposed on the heat storage tank 10 , and the second semiconductor refrigerator 81 is used to heat the heat storage tank 10 .

[0070] The above-mentioned water purification equipment is arranged on the second semiconductor refrigerator 81, and the second conductor refrigerator is used to heat the heat storage tank 10. The heat storage tank 10 is arranged on the heating surface 32 of the second semiconductor refrigerator 81 and the heat storage tank 10 is heated. In this way, the heat storage tank 10 can be heated by the second semiconductor refrigerator 81.

[0071] See also Fig. 9 , in some embodiments, further comprising: a vane pump 82;

[0072] The vane pump 82 is connected to the heat storage tank 10 and the cold storage tank 20 respectively, and the vane pump 82 is used to supply water to the water-using equipment.

[0073] It can be understood that the vane pump 82 can be set at any position in the water purification equipment, and the vane pump 82 is connected to the heat storage tank 10 and the cold storage tank 20, so that the vane pump 82 can pressurize the water flow in the above-mentioned tank bodies, and transport the water flow in the above-mentioned tank bodies to the user end after pressurization, so as to realize the water supply of the water purification equipment; specifically, the water flow in the above-mentioned tank bodies is discharged separately (when mixed water, that is, warm water, can also be discharged separately) and flows to the vane pump 82, and the vane pump 82 transports the water flow to the user end for user use after pressurizing the water flow. The vane pump 82 can ensure that the setting position of the heat storage tank 10 is not affected by the water pressure, and can smoothly transport the hot water in the heat storage tank 10 to the water-using equipment to improve the user experience.

[0074] See also Figure 8 In some embodiments, a heat insulation layer 83 is provided on the periphery of the surrounding portion 51 and the cold storage tank 20 .

[0075] It can be understood that the heat exchange part and the outer periphery of the cold storage tank 20 are both provided with an insulation layer 83, which can effectively reduce the heat exchange between the tank body and the external environment, reduce the rate of cold water heating and hot water cooling, and significantly improve the thermal insulation and cold preservation performance of the equipment.

[0076] Mentioning "embodiment" and "implementation method" in the present invention means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present invention can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of the present invention can be arbitrarily combined to form another embodiment without departing from the spirit and scope of the technical solution of the present invention, provided that there is no contradiction between them.

[0077] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above preferred implementation modes, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A drinking water device, characterized in that: include: Heat storage tank, cold storage tank, first semiconductor refrigerator, heat dissipation component, flow guide component; The cold storage tank has a mounting portion, the first semiconductor refrigerator has a cooling surface and a heating surface, the cooling surface is arranged on the mounting portion, the heating surface is provided with the heat dissipation component, and the heat dissipation component is used to drive airflow to dissipate heat for the heating surface; The flow guide component is arranged on the periphery of the heat storage tank, the flow guide component is connected to the heat dissipation component, and the heat dissipation component drives the airflow to enter the heat dissipation component.

2. The drinking water device according to claim 1, characterized in that: The heat dissipation assembly includes: heat dissipation fins, heat conducting parts, and driving parts; The heat dissipation fins are arranged on the heat conduction member, the driving member is arranged on the heat dissipation fins, and the heat conduction member is arranged on the heating surface.

3. The drinking water device according to claim 2, characterized in that: The flow guide assembly comprises: a surrounding portion and an extension portion; The interior of the extension part is a cavity; the surrounding part and the extension part are connected in sequence, the surrounding part is arranged around the outer circumference of the heat storage tank, the surrounding part and the outer side wall of the heat storage tank form a heating cavity, the extension part extends in a direction away from the surrounding part, the extension part is provided with a square hole, the driving member is arranged in the square hole, and the square hole is communicated with the interior of the extension part.

4. The drinking water device according to claim 1, characterized in that: Also includes: Thermally conductive components; The heat conduction component comprises: a heat absorbing component and a plurality of heat transfer components; A plurality of heat transfer elements are arranged at intervals on the heat absorption element, the heat absorption element is attached to the cooling surface and / or the heating surface, and the heat transfer element is used to transfer the heat on the heat absorption element.

5. The drinking water device according to claim 4, characterized in that: The heat transfer element is a heat conductive sheet, and the heat conductive sheet extends into the cold storage tank.

6. The drinking water device according to claim 5, characterized in that: Also includes: Limiting parts; The mounting portion is provided with a mounting hole, and the limiting member is arranged around the outer circumference of the mounting hole, and the limiting member includes an extension portion and a limiting portion, wherein the limiting portion is arranged on the extension portion, and an angle is formed between the extension portion and the limiting portion; when the heat conductive component is installed in the mounting hole, the limiting portion is parallel to the heat conductive sheet.

7. The drinking water device according to claim 1, characterized in that: Also includes: Filter element assembly; The filter element assembly is arranged in the drinking water device, and the filter element assembly is connected to the cold storage tank and the heat storage tank respectively.

8. The drinking water device according to claim 1, characterized in that: Also includes: A second semiconductor refrigerator; The second semiconductor refrigerator is arranged on the heat storage tank, and the second semiconductor refrigerator is used for heating the heat storage tank.

9. The drinking water device according to claim 1, characterized in that: Also includes: Vane pump; The vane pump is connected to the heat storage tank and the cold storage tank respectively, and the vane pump is used to supply water to the water-using equipment.

10. The drinking water device according to claim 3, characterized in that: The surrounding portion and the outer periphery of the cold storage tank are both provided with a heat insulation layer.

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