Mold cleaning adhesive tape for synergistically realizing mold cleaning and lubricating effects through molecular grafting and preparation method of mold cleaning adhesive tape

Abstract

The invention discloses a mold cleaning adhesive tape for synergistically realizing mold cleaning and lubricating effects through molecular grafting and a preparation method thereof, which are characterized in that firstly, zinc methacrylate is utilized to initiate graft polymerization on the surface of silicon dioxide to prepare a novel filler, and the synergistic enhancement and thermal tear resistance characteristics of the zinc methacrylate and the silicon dioxide are exerted; meanwhile, good dispersion of silicon dioxide is realized; the preparation method comprises the following steps: grafting a lubricant oleamide on an epoxidized soybean oil molecular chain by utilizing a ring-opening reaction of amino and an epoxy group, further compounding ethylene glycol phenyl ether, decanoic acid glycidyl ether, 2-ethylhexyl acrylate and colloidal graphite paste, intensely and uniformly stirring, and obtaining a stable novel pasty cleaning and moistening auxiliary agent by utilizing an intermolecular hydrogen-bond interaction; the preparation method comprises the following steps: uniformly mixing a zinc methacrylate grafted silicon dioxide filler, a cleaning and moistening auxiliary agent, ethylene propylene diene monomer, butadiene rubber and carboxylated styrene-butadiene rubber on an open mill, adding zinc oxide, imidazole, 2, 6-butylated hydroxytoluene and a cross-linking agent, uniformly mixing, calendering, and cutting to obtain the mold cleaning rubber strip with mold cleaning and lubricating effects.

Description

Technical Field

[0001] The invention relates to the field of semiconductor packaging molds, and in particular to a mold cleaning rubber strip which realizes mold cleaning and lubrication through molecular grafting synergistically and a preparation method thereof. Background Art

[0002] With the rapid development of science and technology today, the field of semiconductor packaging is becoming more and more complex and full of challenges and opportunities. With the large-scale commercial use of 5G communications, artificial intelligence, and new energy technologies, they have strict requirements for high-frequency and high-speed signal transmission. Semiconductor chips need to process massive amounts of data. Traditional packaging is difficult to meet the signal integrity and low latency requirements, prompting the industry to innovate the packaging architecture. Epoxy resin is a commonly used coating material in semiconductor chip packaging. It may soften and deform under high temperature conditions. In addition, the components such as release agents contained in it will adhere to the metal mold at high temperatures. The surface of the mold is prone to epoxy resin residues and release agent volatiles. After repeated operations, serious dirt will be generated on the surface of the mold, and these dirt will further undergo high-temperature oxidation, causing mold corrosion, which will affect the protection of the chip. It may even cause internal stress due to the mismatch between the thermal expansion coefficient and the chip, causing the chip to crack or the solder joints to fall off, endangering the normal operation of the chip. Therefore, the cleaning of semiconductor packaging molds is very important.

[0003] Chinese patent CN202310615636.6 discloses a mold cleaning glue for semiconductor packaging molds and a preparation process. The mold cleaning glue uses styrene-butadiene rubber as the main matrix material, white carbon black as a reinforcing agent, and adds polyether compounds as lubricants. At the same time, fluorinated surfactants and silicone defoamers are added as auxiliary raw materials to improve the degree of material bonding and reduce the generation of bubbles, and vulcanizers and vulcanization accelerators cross-link the rubber molecular chains to form a structure. Among them, the modified additive is a high-performance zirconium diboride as the base material, but the zirconium diboride material is very toxic. Chinese patent CN108047694A discloses a mold cleaning material for semiconductor packaging molds and a preparation method thereof, characterized in that the main raw materials are: 45-65 parts of rubber (60%-80% of polyurethane rubber, 10%-20% of ethylene-propylene rubber and 10%-20% of butadiene rubber), 15-35 parts of modified fillers, 1-4 parts of penetrants, 2-7 parts of cleaning agents and 0.5-2 parts of cross-linking agents. The mold cleaning material greatly reduces its residue on the mold, while increasing the mold cleaning effect and greatly reducing the cost of the mold cleaning material. Chinese Patent Publication No. CN112430366A discloses a mold lubricating glue containing molybdenum disulfide, which is characterized in that molybdenum disulfide particles and wax in the mold release agent produce a synergistic effect to lubricate the mold. At present, the mold release agent components in the mold lubricating glue, such as paraffin wax, polysiloxane, etc., will migrate and be extracted during use, especially at high temperatures, which will cause pollution to the mold, and the interval between the mold cleaning and the next mold lubrication is short, and the mold lubricating glue has insufficient durable mold lubrication ability.

[0004] With the development of the semiconductor packaging industry, the mold cleaning glue used for packaging molds should have high mechanical strength and hot tear strength to facilitate removal after vulcanization cleaning. It should also have good fluidity to facilitate cleaning of more complex molds. However, the current problems with mold cleaning glue strips are that they are not resistant to heat and tear, and they break after vulcanization. As the composition of mold dirt becomes more complex, the high-temperature cleaning effect needs to be further improved, especially the research on mold cleaning glue strips that have both mold cleaning and lubrication functions is still very lacking. Summary of the invention

[0005] The purpose of the present invention is to provide a method for preparing a mold cleaning rubber strip that can achieve mold cleaning and lubrication through molecular grafting in response to the deficiencies of the prior art. The method is characterized in that zinc methacrylate is first used to initiate grafting polymerization on the surface of silicon dioxide to prepare a new filler, the synergistic enhancement and heat-resistant tearing properties of zinc polymethacrylate and silicon dioxide are brought into play, and good dispersion of silicon dioxide is achieved at the same time; the lubricant oleic acid amide is grafted on the molecular chain of epoxy soybean oil by the ring-opening reaction of amino and epoxy groups, ethylene glycol phenyl ether, capric acid glycidyl ether, isooctyl acrylate, and colloidal graphite paste are further compounded, vigorously stirred evenly, and a stable new paste-like cleaning aid is obtained by utilizing the intermolecular hydrogen bonding effect; the zinc methacrylate grafted silicon dioxide filler, the cleaning aid, ethylene propylene diene monomer rubber, butadiene rubber, and carboxylated styrene butadiene rubber are uniformly mixed on an open mill, zinc oxide, imidazole, 2,6-di-tert-butyl-p-cresol and a crosslinking agent are added and mixed evenly, and then the mold cleaning rubber strip with mold cleaning and lubrication effects is obtained by calendering and cutting. Zinc polymethacrylate grafted silica has an excellent reinforcing effect, oleamide grafted epoxy soybean oil enhances the migration resistance of the lubricant, and exerts high-efficiency and durable lubricity, and at the same time, the components of the compounded lubricant have strong hydrogen bonding, and the lubricant system is stable and synergistic. The mold cleaning strip prepared by the present invention has excellent cleaning and lubricating effects on epoxy resin encapsulation molds, greatly reduces the number of cleaning times, and greatly improves production efficiency.

[0006] The object of the present invention is achieved by the following technical scheme, wherein the raw material fractions are all mass fractions unless otherwise specified.

[0007]

[0008]

[0009] The compound moisturizing agent is composed of epoxy soybean oil, oleic acid amide, ethylene glycol phenyl ether, isooctyl acrylate, capric acid glycidyl ether, and colloidal graphite paste;

[0010] The crosslinking agent is any two of di-tert-butyl peroxide isopropylbenzene, trimethylolpropane trimethacrylate, and tert-octylphenol formaldehyde resin;

[0011] A method for preparing a mold cleaning rubber strip that achieves mold cleaning and lubrication through molecular grafting, characterized in that the preparation method comprises the following steps:

[0012] Preparation of poly(zinc methacrylate) grafted silica

[0013] Ultrasonic dispersion of 20-50 parts of silicon dioxide in distilled water to a mass concentration of 12wt% was performed, and 0.3-4 parts of zinc methacrylate was added. Ultrasonic dispersion was performed for 0.5h. Then, 0.1 parts of potassium persulfate were added. The mixture was stirred and reacted at 60-85°C for 0.5-1h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the mixture was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0014] Compounding of Molecular Grafting Moisturizing Agents

[0015] 8-25 parts of oleic acid amide are stirred and completely dissolved in 100-300 parts of ethanol, and 6 parts of epoxy soybean oil are added to form a uniform solution system. The system is stirred and reacted continuously at 40°C for 0.5-3h. The lubricant oleic acid amide is grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction of the amino group and the epoxy group. After the reaction is completed, the ethanol is removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 2-8 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste are vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2h, and a stable new paste-like compounded moisturizing agent is obtained by hydrogen bonding between the molecules of each component.

[0016] Preparation of mold cleaning rubber strip with synergistic mold cleaning and lubrication effects

[0017] 12 parts of butadiene rubber, 78 parts of ethylene propylene diene rubber, and 4 parts of carboxylated styrene butadiene rubber were first plasticized on an open mixing mill and thinly passed three times to allow the raw rubber to be continuously wrapped around a roller. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 0.5-1 part of imidazole, a compounded cleaning aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence and mixed evenly. Finally, 1.3-4.5 parts of a cross-linking agent were added and mixed evenly. The mixture was calendered and cut to obtain mold-washing rubber strips for testing.

[0018] The invention has the following advantages: the traditional mold cleaning glue has a single cleaning or lubricating effect, and the cleaning effect is limited, the number of mold cleaning and mold lubrication is large, the efficiency is low and the production cost is increased. The invention utilizes the characteristics that zinc methacrylate has acid, alkali, oil and high temperature resistance, and can obtain salt cross-linking bonds when combined with a rubber body to improve the strength of the rubber to improve the elasticity of the rubber strip, increase the tear resistance, and reduce the amount of silicon dioxide. Zinc methacrylate is used to initiate graft polymerization on the surface of silicon dioxide to synergistically exert the reinforcement and heat-resistant tearing properties of polyzinc methacrylate and silicon dioxide. In order to solve the problem that low molecular weight mold lubrication aids are easy to migrate and lack durability, the ring-opening reaction of amino groups and epoxy groups is used to graft lubricant oleic acid amide on the molecular chain of epoxy soybean oil to exert efficient and durable lubricity, and further compound ethylene glycol phenyl ether, capric acid glycidyl ether, isooctyl acrylate, and colloidal graphite paste to prepare a stable new paste-like lubrication aid by utilizing the hydrogen bonding effect between the molecules of each component. The mold cleaning rubber strip with mold cleaning and lubricating effects is obtained by mixing EPDM rubber, cis-1,4-butadiene rubber, carboxylated styrene-butadiene rubber, activator, antioxidant and cross-linking agent on an open mill, calendering and cutting. The mold cleaning rubber strip prepared by the present invention is used for epoxy resin encapsulation molds, has excellent cleaning and lubricating effects, is easy to demould after use, is intact and not easy to break, and greatly reduces the number of cleaning times for epoxy resin encapsulation molds. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the reaction structure of zinc methacrylate grafted onto silica and oleamide grafted onto epoxy soybean oil.

[0020] Figure 2 This is a picture of mold cleaning glue and its application effect. DETAILED DESCRIPTION

[0021] The present invention is further described below through specific examples. It should be noted that the examples are only used to further illustrate the present invention and cannot be understood as limiting the scope of protection of the present invention. Those skilled in the art in this field can make non-essential improvements and adjustments to the present invention based on the contents of the present invention described above.

[0022] Example 1

[0023] Ultrasonic dispersion of 20 parts of silicon dioxide in distilled water with a mass concentration of 12wt% was performed. 0.3 parts of zinc methacrylate was added and ultrasonic dispersion was performed for 0.5h. 0.1 parts of potassium persulfate was added and stirred for reaction at 60°C for 0.5h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the silicon dioxide was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0024] 8 parts of oleic acid amide were stirred and completely dissolved in 100 parts of ethanol, and 6 parts of epoxy soybean oil were added to form a uniform solution system. The reaction was stirred continuously at 40°C for 1 hour. The lubricant oleic acid amide was grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction of the amino group and the epoxy group. After the reaction was completed, the ethanol was removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 2 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste were vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2 hours, and a stable new paste-like compounded lubricant was obtained by hydrogen bonding between the molecules of each component.

[0025] 12 parts of cis-1,4-butadiene rubber, 78 parts of EPDM rubber, and 4 parts of carboxylated styrene-butadiene rubber were first plasticized on an open mill, and thinly passed 3 times to allow the raw rubber to be continuously rolled. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 0.5 parts of imidazole, compound moistening aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence, and mixed evenly. Finally, 0.3 parts of di-tert-butyl peroxide isopropylbenzene and 1 part of trimethylolpropane trimethacrylate were added, and mixed evenly, and then calendered and cut to obtain mold-washing rubber strips. Under the conditions of 170°C, 10MPa, and 5min vulcanization, the tensile strength of the mold-washing rubber was 8.2MPa, the elongation at break was 458%, the tear strength was 41N / m, and the number of times the encapsulation mold was cleaned was 4 times.

[0026] Example 2

[0027] 30 parts of silicon dioxide were ultrasonically dispersed in distilled water with a mass concentration of 12wt%. 0.5 parts of zinc methacrylate were added and ultrasonically dispersed for 0.5h. 0.1 parts of potassium persulfate were added and stirred for reaction at 70°C for 0.5h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the silicon dioxide was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0028] 15 parts of oleic acid amide were stirred and completely dissolved in 150 parts of ethanol, and 6 parts of epoxy soybean oil were added to form a uniform solution system. The reaction was stirred continuously at 40°C for 1 hour. The lubricant oleic acid amide was grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction of the amino group and the epoxy group. After the reaction was completed, the ethanol was removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 4 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste were vigorously stirred in a homogenizer, transferred to a reaction container, stirred and reacted at 45°C for 2 hours, and a stable new paste-like compounded lubricant was obtained by hydrogen bonding between the molecules of each component.

[0029] 12 parts of cis-1,4-butadiene rubber, 78 parts of EPDM rubber, and 4 parts of carboxylated styrene-butadiene rubber were first plasticized on an open mill, and thinned three times to allow the raw rubber to be continuously rolled. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 0.5 parts of imidazole, compound moistening aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence, and mixed evenly. Finally, 0.5 parts of di-tert-butyl peroxide isopropylbenzene and 1.5 parts of tert-octylphenol formaldehyde resin were added, and mixed evenly. After calendering and cutting, the mold-washing rubber strip was obtained. Under the vulcanization conditions of 170°C, 10MPa, and 5min, the tensile strength of the mold-washing rubber was 10.8MPa, the elongation at break was 511%, the tear strength was 46N / m, and the packaging mold was cleaned 4 times.

[0030] Example 3

[0031] Ultrasonic dispersion of 30 parts of silicon dioxide in distilled water with a mass concentration of 12wt% was performed. 2 parts of zinc methacrylate were added and ultrasonic dispersion was performed for 0.5h. 0.1 parts of potassium persulfate were added and stirred for reaction at 75°C for 1h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the silicon dioxide was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0032] 18 parts of oleic acid amide were stirred and completely dissolved in 200 parts of ethanol, and 6 parts of epoxy soybean oil were added to form a uniform solution system. The system was stirred and reacted continuously at 40°C for 2 hours. The lubricant oleic acid amide was grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction between the amino group and the epoxy group. After the reaction, the ethanol was removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 4 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste were vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2 hours, and a stable new paste-like compounded lubricant was obtained by hydrogen bonding between the molecules of each component.

[0033] 12 parts of cis-1,4-butadiene rubber, 78 parts of EPDM rubber, and 4 parts of carboxylated styrene-butadiene rubber were first plasticized on an open mill, and thinned three times to allow the raw rubber to be continuously rolled. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 0.6 parts of imidazole, compound moistening aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence, and mixed evenly. Finally, 1 part of di-tert-butyl peroxide isopropylbenzene and 1.4 parts of trimethylolpropane trimethacrylate were added, and mixed evenly, and then calendered and cut to obtain mold-washing rubber strips. Under the vulcanization conditions of 170°C, 10MPa, and 5min, the tensile strength of the mold-washing rubber was 12.6MPa, the elongation at break was 549%, the tear strength was 49N / m, and the packaging mold was cleaned 3 times.

[0034] Example 4

[0035] 40 parts of silicon dioxide were ultrasonically dispersed in distilled water with a mass concentration of 12wt%. 3 parts of zinc methacrylate were added and ultrasonically dispersed for 0.5h. 0.1 parts of potassium persulfate were added and stirred for reaction at 75°C for 1h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the silicon dioxide was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0036] 20 parts of oleic acid amide were stirred and completely dissolved in 200 parts of ethanol, and 6 parts of epoxy soybean oil were added to form a uniform solution system. The system was stirred and reacted continuously at 40°C for 2 hours. The lubricant oleic acid amide was grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction between the amino group and the epoxy group. After the reaction, the ethanol was removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 6 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste were vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2 hours, and a stable new paste-like compounded lubricant was obtained by hydrogen bonding between the molecules of each component.

[0037] 12 parts of cis-1,4-butadiene rubber, 78 parts of EPDM rubber, and 4 parts of carboxylated styrene-butadiene rubber were first plasticized on an open mill, and thinly passed 3 times to allow the raw rubber to be continuously rolled. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 0.8 parts of imidazole, compound moistening aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence, and mixed evenly. Finally, 1.2 parts of di-tert-butyl peroxide isopropylbenzene and 1.5 parts of trimethylolpropane trimethacrylate were added, and mixed evenly, and then calendered and cut to obtain mold-washing rubber strips. Under the vulcanization conditions of 170°C, 10MPa, and 5min, the tensile strength of the mold-washing rubber was 14.7MPa, the elongation at break was 563%, the tear strength was 52N / m, and the packaging mold was cleaned twice.

[0038] Example 5

[0039] Ultrasonic dispersion of 50 parts of silicon dioxide in distilled water with a mass concentration of 12wt% was performed. 4 parts of zinc methacrylate was added and ultrasonic dispersion was performed for 0.5h. 0.1 parts of potassium persulfate was added and stirred for reaction at 80°C for 1h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the silicon dioxide was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0040] 25 parts of oleic acid amide were stirred and completely dissolved in 300 parts of ethanol, and 6 parts of epoxy soybean oil were added to form a uniform solution system. The system was stirred and reacted continuously at 40°C for 3 hours. The lubricant oleic acid amide was grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction between the amino group and the epoxy group. After the reaction, the ethanol was removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 8 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste were vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2 hours, and a stable new paste-like compounded lubricant was obtained by hydrogen bonding between the molecules of each component.

[0041] 12 parts of cis-1,4-butadiene rubber, 78 parts of EPDM rubber, and 4 parts of carboxylated styrene-butadiene rubber were first plasticized on an open mill, and thinned three times to allow the raw rubber to be continuously rolled. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 1 part of imidazole, a compound moistening aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence, and mixed evenly. Finally, 1.5 parts of di-tert-butyl peroxide isopropylbenzene and 2 parts of trimethylolpropane trimethacrylate crosslinking agent were added, and mixed evenly, and then calendered and cut to obtain mold-washing rubber strips. Under the vulcanization conditions of 170°C, 10MPa, and 5min, the tensile strength of the mold-washing rubber was 16.2MPa, the elongation at break was 644%, the tear strength was 60N / m, and the packaging mold was cleaned twice.

[0042] Comparative Example 1

[0043] 25 parts of oleic acid amide were stirred and completely dissolved in 300 parts of ethanol, and 6 parts of epoxy soybean oil were added to form a uniform solution system. The system was stirred and reacted continuously at 40°C for 3 hours. The lubricant oleic acid amide was grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction between the amino group and the epoxy group. After the reaction, the ethanol was removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 8 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste were vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2 hours, and a stable new paste-like compounded lubricant was obtained by hydrogen bonding between the molecules of each component.

[0044] 12 parts of cis-1,4-butadiene rubber, 78 parts of EPDM rubber, and 4 parts of carboxylated styrene-butadiene rubber were first plasticized on an open mill, and thinly passed 3 times to allow the raw rubber to be continuously rolled. After the rubber layer was smooth, 50 parts of silicon dioxide, 4 parts of zinc methacrylate, 2 parts of stearic acid, 1 part of imidazole, a compound moistening aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence, and mixed evenly. Finally, 1.5 parts of di-tert-butyl peroxide isopropylbenzene and 2 parts of trimethylolpropane trimethacrylate crosslinking agent were added, and mixed evenly, and then calendered and cut to obtain a mold-washing rubber strip. Under the conditions of 170°C, 10MPa, and 5min vulcanization, the tensile strength of the mold-washing rubber was 13.8MPa, the elongation at break was 572%, the tear strength was 49N / m, and the number of times the encapsulation mold was cleaned was 3 times.

[0045] Comparative Example 2

[0046] Ultrasonic dispersion of 50 parts of silicon dioxide in distilled water with a mass concentration of 12wt% was performed. 4 parts of zinc methacrylate was added and ultrasonic dispersion was performed for 0.5h. 0.1 parts of potassium persulfate was added and stirred for reaction at 80°C for 1h. Under the initiation of potassium persulfate, zinc methacrylate was grafted and polymerized on the surface of silicon dioxide. After the reaction was completed, the silicon dioxide was dried at 60°C to obtain polyzinc methacrylate grafted silicon dioxide for standby use.

[0047] 12 parts of butadiene rubber, 78 parts of ethylene propylene rubber, and 4 parts of carboxylated styrene butadiene rubber are first plasticized on an open mill and thinned three times to allow the raw rubber to be continuously rolled. After the rubber layer is smooth, polymethacrylate zinc grafted silica, 20 parts of oleic acid amide, 6 parts of epoxy soybean oil, 2 parts of stearic acid, 2 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, 1 part of colloidal graphite paste, 2 parts of stearic acid, 1 part of imidazole, and 1 part of 2,6-di-tert-butyl-p-cresol are added in sequence and mixed evenly. Finally, 1.5 parts of di-tert-butyl peroxide isopropylbenzene and 2 parts of trimethylolpropane trimethacrylate crosslinking agent are added and mixed evenly, and then the mixture is calendered and cut to obtain a mold-washing rubber strip. Under the vulcanization conditions of 170°C, 10MPa and 5min, the tensile strength of the mold cleaning adhesive is 13.2MPa, the elongation at break is 551%, the tear strength is 50N / m, and the packaging mold is cleaned 4 times.

[0048] In summary, after adding polymethacrylate zinc grafted silica and compounding a wetting agent in the embodiment of the present invention, the mechanical properties and cleaning effect of the mold cleaning adhesive are significantly improved, and compared with the comparative example, the preparation method of the present invention has obvious advantages.

[0049] The above embodiments describe the specific contents of the present invention in detail, but the present invention is not limited to the embodiments, and those skilled in the art can make equivalent substitutions, which should be included in the protection scope of the present invention.

Claims

1. A mold cleaning rubber strip that achieves mold cleaning and lubrication through molecular grafting, characterized in that: The main raw materials are composed of the following components, calculated by mass: EPDM 78 parts 12 parts of butadiene rubber 4 parts of carboxylated styrene butadiene rubber Imidazole 0.5-1 part 2 parts stearic acid Zinc methacrylate 0.3-4 parts 20-50 parts of silicon dioxide Compound moistening agent 21-44 parts 2,6-di-tert-butyl-p-cresol 1 part Crosslinking agent 1.3-4.5 parts The compound moisturizing agent is composed of epoxy soybean oil, oleic acid amide, ethylene glycol phenyl ether, isooctyl acrylate, capric acid glycidyl ether, and colloidal graphite paste; The crosslinking agent is any two of di-tert-butyl peroxide isopropylbenzene, trimethylolpropane trimethacrylate, and tert-octylphenol formaldehyde resin.

2. A method for preparing the mold cleaning rubber strip for achieving mold cleaning and lubrication through molecular grafting as claimed in claim 1, characterized in that The preparation method comprises the following steps: Preparation of poly(zinc methacrylate) grafted silica Ultrasonic dispersion of 20-50 parts of silicon dioxide in distilled water to a mass concentration of 12wt%, adding 0.3-4 parts of zinc methacrylate, ultrasonic dispersion for 0.5 h, adding 0.1 parts of potassium persulfate, stirring and reacting at 60-85°C for 0.5-1 h, initiation of potassium persulfate, zinc methacrylate is grafted and polymerized on the surface of silicon dioxide, and after the reaction is completed, drying at 60°C to obtain poly(zinc methacrylate) grafted silicon dioxide, which is set aside; Compounding of Molecular Grafting Moisturizing Agents 8-25 parts of oleic acid amide are stirred and completely dissolved in 100-300 parts of ethanol, and 6 parts of epoxy soybean oil are added to form a uniform solution system. The system is stirred and reacted continuously at 40°C for 0.5-3 h. The lubricant oleic acid amide is grafted onto the epoxy soybean oil molecular chain by the ring-opening reaction between the amino group and the epoxy group. After the reaction is completed, the ethanol is removed in a 50°C oven to obtain a viscous oleic acid amide-epoxy soybean oil lubricant. The prepared oleic acid amide-epoxy soybean oil lubricant, 2-8 parts of ethylene glycol phenyl ether, 1 part of isooctyl acrylate, 2 parts of capric acid glycidyl ether, and 1 part of colloidal graphite paste are vigorously stirred in a homogenizer, transferred to a reaction vessel, stirred and reacted at 45°C for 2 h, and a stable new paste-like compounded lubricating agent is obtained by hydrogen bonding between the molecules of each component; Preparation of mold cleaning rubber strip with synergistic mold cleaning and lubrication effects 12 parts of butadiene rubber, 78 parts of ethylene propylene diene rubber, and 4 parts of carboxylated styrene butadiene rubber were first plasticized on an open mixing mill and thinly passed three times to allow the raw rubber to be continuously wrapped around a roller. After the rubber layer was smooth, polymethacrylate zinc grafted silica, 2 parts of stearic acid, 0.5-1 part of imidazole, a compounded cleaning aid, and 1 part of 2,6-di-tert-butyl-p-cresol were added in sequence and mixed evenly. Finally, 1.3-4.5 parts of a cross-linking agent were added and mixed evenly. The mixture was calendered and cut to obtain mold-washing rubber strips for testing.

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