Solid state disk device and electronic device

Abstract

The invention discloses a solid state disk device and an electronic device. The solid state disk device comprises a circuit board, a heat conduction metal block, a control chip, a memory and a plugging structure. The circuit board comprises a heat dissipation area and an electronic part area, a heat conduction metal block is embedded in the heat dissipation area, and the heat dissipation area occupies at least one half of a wide side face of the circuit board. The heat-conducting metal block can be provided with a heat-conducting through hole according to actual requirements. The two end faces of the heat-conducting metal block are exposed out of the two sides of the circuit board. The control chip and the memory are fixedly arranged in the electronic part area. The solid state disk device can be connected with a slot of an electronic device through the plug-in structure. Wherein the heat conduction metal block is not connected with a circuit used for connecting the control chip and the memory in the circuit board. The heat dissipation area is not provided with a control chip or a memory.

Description

Technical Field

[0001] The present invention relates to a solid state hard disk device and an electronic device, and in particular to a solid state hard disk device (SSD) with good heat dissipation effect and an electronic device comprising the solid state hard disk device. Background Art

[0002] In the prior art, a solid-state drive (SSD) installed in a computer will generate a large amount of heat during operation, especially when installed in a laptop. Since the space in the laptop is relatively small, the heat generated by the SSD during operation is relatively difficult to dissipate. For this reason, relevant laptop manufacturers will install fans, water coolers and other SSD devices around the SSD to discharge the heat generated by the SSD during operation. However, whether it is a fan or a water cooler, it will greatly increase the cost of the laptop. Summary of the invention

[0003] The invention discloses a solid state hard disk device and an electronic device, which are mainly used to improve the problem of poor heat dissipation effect of the existing common solid state hard disk.

[0004] One of the embodiments of the present invention discloses a solid-state hard disk device, which includes: a circuit board, which includes a heat dissipation area and an electronic component area, the heat dissipation area occupies at least half of a wide side of the circuit board; the circuit board includes a through hole in the heat dissipation area; a heat-conducting metal block, at least a portion of which is fixedly disposed in the through hole, and both end surfaces of the heat-conducting metal block are exposed on both sides of the circuit board; at least one control chip, which is fixedly disposed in the electronic component area; at least one memory, which is fixedly disposed in the electronic component area; a plug-in structure, which is disposed at one end of the circuit board; the solid-state hard disk device can be connected to a slot of an electronic device through the plug-in structure; wherein the heat-conducting metal block is not connected to the circuit in the circuit board used to connect the control chip and the memory; and the heat dissipation area is not provided with a control chip or a memory.

[0005] Preferably, the circuit board is a multi-layer board structure, the circuit board includes a multi-layer core board, each layer of the core board includes a through hole, and the through holes of each core board are interconnected to jointly form a through hole; the multi-layer core boards are connected to each other by an adhesive, and the heat-conducting metal block is fixed to the multi-layer core boards by the adhesive.

[0006] Preferably, the circuit board is provided with at least one auxiliary heat-conducting structure on a side opposite to the side where the control chip is provided. The auxiliary heat-conducting structure is not connected to the circuit in the circuit board used to connect the control chip and the memory, and is connected to the heat-conducting metal block.

[0007] Preferably, the circuit board further includes at least one heat-conducting through hole in the electronic component area, the heat-conducting through hole is arranged through the circuit board, and the heat-conducting through hole is adjacent to one of the control chip and the memory, and the heat-conducting through hole is filled with a heat-conducting block, one end of the heat-conducting block is connected to the auxiliary heat-conducting structure; the heat-conducting block is not connected to the circuit in the circuit board used to connect the control chip and the memory.

[0008] Preferably, the heat-conducting metal block further comprises at least one heat-dissipating through hole, and the heat-dissipating through hole passes through the heat-conducting metal block.

[0009] Preferably, at least one end surface of the heat-conducting metal block is formed with at least one heat-conducting channel, and both ends of the heat-conducting channel have openings communicating with the outside.

[0010] Preferably, the solid state hard disk device further includes an auxiliary heat sink, a portion of which is fixed to the surface of at least one of the control chip and the memory, and a portion of which is fixed to the surface of the heat conductive metal block.

[0011] Preferably, at least one memory is also provided on a side of the circuit board opposite to the side where the control chip is provided.

[0012] Preferably, the solid state drive device complies with PCIe Gen5M.2 specifications.

[0013] One of the embodiments of the present invention discloses an electronic device, which includes: the solid-state hard disk device of the present invention described above, a body, a cover body and an auxiliary heat sink, wherein a circuit main board is arranged in the body, the circuit main board has a slot, and the slot and a portion of the circuit main board are exposed from an opening of the body; the plug-in structure of the solid-state hard disk device is used to be plugged into the slot, the cover body is detachably fixed to the body, and the cover body can cover the opening; the auxiliary heat sink is fixed to the inner side of the cover body; when the cover body is fixed to the body and the plug-in structure of the solid-state hard disk device is plugged into the slot, a portion of the auxiliary heat sink is attached to at least one of the control chip and the memory, and a portion of the auxiliary heat sink is attached to a portion of the heat-conducting metal block.

[0014] In summary, the storage device and the electronic device of the present invention can effectively increase the heat dissipation effect of the storage device during operation through the design of heat-conducting metal, thereby preventing the storage device from being unable to operate normally due to high temperature.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 and Figure 2 Schematic diagrams of different viewing angles of the first embodiment of the solid state drive device of the present invention.

[0017] Figure 3 for Figure 1 Schematic cross-sectional view along section line III-III.

[0018] Figure 4 It is a side view of a second embodiment of a solid state hard disk device of the present invention.

[0019] Figure 5 FIG. 4 is a partial exploded schematic diagram of a third embodiment of a solid state drive device of the present invention.

[0020] Figure 6 FIG. 4 is a schematic diagram of another side of the third embodiment of the solid state drive device of the present invention.

[0021] Figure 7 for Figure 5 Schematic cross-sectional view along section line VII-VII.

[0022] Figure 8 FIG. 4 is a schematic diagram of a solid state drive device according to a fourth embodiment of the present invention.

[0023] Fig. 9 and Fig.10 Schematic diagrams of different viewing angles of a sixth embodiment of a solid state drive device of the present invention.

[0024] Fig.11 and Fig.12 Schematic diagrams of different viewing angles of the seventh embodiment of the solid state drive device of the present invention.

[0025] Fig.13 for Fig.11 Schematic cross-sectional view along section line XIII-XIII.

[0026] Fig.14 FIG. 4 is a cross-sectional schematic diagram of an eighth embodiment of an electronic device of the present invention.

[0027] Fig.15 It is a partial exploded schematic diagram of the electronic device of the present invention. DETAILED DESCRIPTION

[0028] In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the related contents described in the subsequent description appear in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.

[0029] Please also read Figures 1 to 3 , Figure 1 and Figure 2 Schematic diagrams of different viewing angles of the first embodiment of the solid state hard disk device of the present invention, Figure 3 for Figure 1Schematic cross-sectional view along the III-III section line. The solid-state hard disk device 100 of the present invention comprises: a circuit board 1, a control chip 2, a plug-in structure 3, a plurality of memories 4 and a heat-conducting metal block 5. The solid-state hard disk device 100 of the present invention is a solid-state drive (SSD), which is particularly suitable for application as a solid-state drive that can be installed in a laptop computer. For example, the solid-state hard disk device 100 of the present invention can be applied as a SATA M.2 SSD, NVMe M.2 SSD, PCIe Gen5 M.2 SSD, etc. It should be particularly noted that since the solid-state hard disk device 100 of the present invention has a better heat dissipation effect than a traditional solid-state hard disk, the solid-state hard disk device 100 of the present invention is particularly suitable for application as a PCIe Gen5 M.2 SSD, because the PCIe Gen5 M.2 SSD will generate relatively more heat energy when it is in operation.

[0030] The circuit board 1 includes an electronic component area 11 and a heat dissipation area 12. The electronic component area 11 is provided with a control chip 2, a memory 4, a resistor, etc., which are necessary electronic components required for the operation of the solid state drive. The control chip 2 is, for example, a variety of microprocessors. The number and location of the control chip 2 and the memory 4 are not limited to those shown in the figure. One end of the circuit board 1 has a plug-in structure 3. The plug-in structure 3 is, for example, a plug-in structure that complies with the PCIe specification. The solid state drive device 100 can be connected to a slot of an electronic device (such as a laptop computer, a motherboard, etc.) through the plug-in structure 3.

[0031] The heat dissipation area 12 is not provided with electronic components such as the control chip 2 and the memory 4. The heat dissipation area 12 occupies at least one-half of a wide side of the circuit board 1. In practical applications, if the heat dissipation area 12 occupies at least one-third of the wide side of the circuit board, the heat dissipation effect of the storage device can be further improved.

[0032] The heat-conducting metal block 5 is, for example, a metal with a high thermal conductivity, such as a copper block. The heat-conducting metal block 5 is embedded in the heat dissipation area 12 of the circuit board 1. Specifically, the circuit board 1 includes a through hole 13 in the heat dissipation area 12, and the heat-conducting metal block 5 is fixedly disposed in the through hole 13, and the two end surfaces 51 of the heat-conducting metal block 5 are respectively exposed at the two wide sides of the circuit board 1.

[0033] like Figure 3As shown, in one of the practical applications, the circuit board 1 can be, for example, a multilayer circuit board. The multilayer circuit board includes a plurality of cores, and the same position of each core 14 can be a perforation of the same size. When the plurality of cores 14 are stacked on each other, the perforations of each core 14 will be interconnected to form the through hole 13, and the heat-conducting metal block 5 can be correspondingly arranged in the through hole 13. Before the plurality of cores 14 are pressed together, an adhesive 20 of the circuit board will be arranged between each core 14, and the heat-conducting metal block 5 can be connected to the plurality of cores 14 through a plurality of adhesives 20. When the plurality of cores 14 are stacked on each other through the adhesive 20, and the heat-conducting metal block 5 is also arranged in the through hole 13 through the adhesive 20, the plurality of cores 14 and the heat-conducting metal block 5 can be pressed together into a multilayer circuit board through relevant pressing equipment. The manufacturing method of the multilayer circuit board can be changed according to actual needs. The above description is only used to illustrate one of the specific embodiments in which the heat-conducting metal block 5 is buried in the circuit board 1.

[0034] It is worth mentioning that the heat-conducting metal block 5 is mainly used to assist the solid-state hard disk device 100 in heat dissipation during operation. Therefore, the heat-conducting metal block 5 is not connected to the circuit in the circuit board 1 for connecting the control chip 2 and the memory 4. In the embodiment where the circuit board 1 is a multi-layer circuit board, the surface or interior of each core board 14, adjacent to the perforation, may also be provided with a copper circuit (or other materials with good thermal conductivity), and the plurality of copper circuits are used to connect to the heat-conducting metal block 5, while the plurality of copper circuits are not connected to other electronic parts such as the control chip 2 or the memory 4. In other words, the plurality of copper circuits are only used to connect to the heat-conducting metal block 5, so that part of the heat energy generated during the operation of the solid-state hard disk device 100 can be transferred to the heat-conducting metal block 5 through the circuit board 1 and the plurality of copper circuits, and then transferred outwardly by the heat-conducting metal block 5.

[0035] like Figure 3 It should be noted that, in the drawings of this embodiment, the two end surfaces 51 of the heat-conducting metal block 5 are respectively flush with the front surface 15 and the back surface 16 of the circuit board 1 as an example, but the invention is not limited thereto. In different embodiments, at least one of the two end surfaces 51 of the heat-conducting metal block 5 may not be flush with the corresponding front surface 15 and the back surface 16 of the circuit board 1.

[0036] As described above, the solid-state hard disk device 100 of the present invention is designed by embedding a heat-conducting metal block 5 in the circuit board 1, so that the heat energy generated by the solid-state hard disk device 100 during operation can be transferred to the outside through the circuit board 1 and the heat-conducting metal block 5. Therefore, the heat dissipation effect of the solid-state hard disk device 100 can be greatly improved, and the problem of the solid-state hard disk device 100 not being able to operate normally due to heat accumulation can be greatly reduced.

[0037] See also Figure 4 , which is a side schematic diagram of the second embodiment of the solid state hard disk device of the present invention. The biggest difference between this embodiment and the aforementioned embodiment is that the solid state hard disk device 100 may also include an auxiliary heat sink 6. A portion of the auxiliary heat sink 6 is fixedly disposed on the surface of at least one of the control chip 2 and the memory 4, and a portion of the auxiliary heat sink 6 is fixed to the surface of the heat-conducting metal block 5. The auxiliary heat sink 6 is, for example, various types of thermal pads (Thermal Pad), but is not limited to this. As long as the component can be used to transfer heat energy, it belongs to the scope of application of the auxiliary heat sink 6. In actual applications, the auxiliary heat sink 6 can be, for example, fixed to the control chip 2, the memory 4 and the heat-conducting metal block 5 using a colloid such as a heat dissipation adhesive or a high-temperature resistant double-sided adhesive.

[0038] Through the design of the auxiliary heat sink 6, when the solid state drive device 100 is in operation, a large amount of heat energy generated by the control chip 2 and the memory 4 can be transferred outward through the auxiliary heat sink 6 and the heat conductive metal block 5, thereby achieving a rapid heat dissipation effect. The specific material, size, appearance, etc. of the auxiliary heat sink 6 can be changed according to needs and are not limited to those shown in the figure.

[0039] In one embodiment, a portion of the auxiliary heat sink 6 may, for example, simultaneously cover the surface of the control chip 2, the surfaces of all the memories 4 located on the same side, and the entire surface of the heat-conducting metal block 5. In different embodiments, the auxiliary heat sink 6 may also only cover a portion of the surface of the heat-conducting metal block 5.

[0040] Please also read Figures 5 to 7 , Figure 5 is a partial exploded schematic diagram of a third embodiment of a solid state hard disk device of the present invention, Figure 6 is a schematic diagram of another side of the third embodiment of the solid state hard disk device of the present invention, Figure 7 for Figure 5 Schematic cross-sectional view along section line VII-VII.

[0041] like Figure 6 As shown, one of the differences between this embodiment and the previous embodiment is that: the side of the circuit board 1 opposite to the side where the control chip 2 is arranged, that is, the back side 16 of the circuit board 1, can also be provided with an auxiliary heat-conducting structure 17, and the auxiliary heat-conducting structure 17 can be, for example, a copper foil (or related metal with high thermal conductivity) laid on the surface of the circuit board 1. The auxiliary heat-conducting structure 17 can be, for example, connected to the heat-conducting metal block 5. For example, a part of the auxiliary heat-conducting structure 17 can be extended to the side wall of the through hole 13, and the heat-conducting metal block 5 can be directly in contact with the auxiliary heat-conducting structure 17 located in the through hole 13, so as to be connected to each other. In practical applications, the auxiliary heat-conducting structure 17 can be, for example, manufactured during the manufacturing process of the circuit board 1, but is not limited thereto.

[0042] In different embodiments, the auxiliary thermal conductive structure 17 may be formed on the back side 16 of the circuit board 1 through relevant manufacturing procedures after the thermal conductive metal block 5 has been embedded in the circuit board 1. In this example, a portion of the auxiliary thermal conductive structure 17 may be directly formed on the surface of the thermal conductive metal block 5, and the auxiliary thermal conductive structure 17 and the thermal conductive metal block 5 may be connected to each other accordingly.

[0043] As described above, the solid state drive device 100 of this embodiment can further increase the heat dissipation surface of the solid state drive device 100 through the design of the auxiliary heat conductive structure 17, thereby further improving the overall heat dissipation effect of the solid state drive device 100.

[0044] like Figure 5 and Figure 7 As shown, another difference between this embodiment and the previous embodiment is that: the circuit board 1 may include a plurality of heat-conducting through holes 18 in the electronic component area 11, and each heat-conducting through hole 18 is filled with a heat-conducting block 19, and one end of each heat-conducting block 19 is adjacent to one of the control chip 2 and the memory 4, and the other end of the heat-conducting block 19 is connected to the auxiliary heat-conducting structure 17. With such a design, when the solid-state hard disk device 100 is in operation, part of the heat energy generated by the control chip 2 and the memory 4 can be transferred to the auxiliary heat-conducting structure 17 through the heat-conducting block 19, and then transferred to the outside through the large-area auxiliary heat-conducting structure 17. The size, setting position, and number of the heat-conducting blocks 19 can be designed according to actual needs and are not limited here. In one specific application, the heat-conducting block 19 can be, for example, a copper block.

[0045] It should be noted that the heat conductive block 19 is only used to transfer the heat energy generated by the operation of the control chip 2 or the memory 4. Therefore, the heat conductive block 19 is not connected to the circuit used to connect to the control chip 2 or the memory 4 and other related electronic components in the circuit board 1. The number, size, and location of the heat conductive block 19 can be designed according to the needs and are not limited to those shown in the figure. In practice, the heat conductive through hole 18 and the heat conductive block 19 can be manufactured together during the process of manufacturing the circuit board 1.

[0046] It should be noted that, in practical applications, the two different features between this embodiment and the aforementioned embodiment are not limited to exist at the same time, and the two different features may also exist separately according to requirements.

[0047] Please also read Figure 2 , Figure 6 and Figure 8 , Figure 8 FIG. 4 is a schematic diagram of a fourth embodiment of a solid state hard disk device of the present invention. Figure 2 and Figure 6In the illustrated embodiment, the circuit board 1 of the solid-state hard disk device 100 is manufactured by single-sided punching, and only one side (the front side 15 of the circuit board 1) of the circuit board 1 is provided with electronic components (control chip 2, memory 4, etc.), and the other side (the back side 16 of the circuit board 1) of the circuit board 1 is not provided with electronic components.

[0048] like Figure 8 As shown, this embodiment and Figure 6 The biggest difference of the embodiment is that at least one electronic component, such as memory 4, is also disposed on the back side 16 of the circuit board 1. Figure 8 In the example shown, the appearance of the auxiliary heat-conducting structure 17 disposed on the back side 16 of the circuit board 1 will change accordingly according to the arrangement of the memory 4. The number of memories 4 disposed on the back side 16 of the circuit board 1 is not limited to that shown in the figure, and the appearance of the auxiliary heat-conducting structure 17 is not limited to that shown in the figure.

[0049] like Figure 8 As shown, it is worth mentioning that the memory 4 arranged on the back side 16 of the circuit board 1 can be arranged in a horizontal manner so that a larger area can be reserved on the back side 16 of the circuit board 1 to provide an auxiliary heat conduction structure 17.

[0050] Please also read Fig. 9 and Fig.10 , Fig. 9 and Fig.10 Schematic diagrams of different viewing angles of the sixth embodiment of the solid-state hard disk device of the present invention. The biggest difference between this embodiment and the previous embodiments is that the heat-conducting metal block 5 can also include at least one heat dissipation through-hole 52, and the heat-dissipating through-hole 52 is set through the heat-conducting metal block 5. Through the design of the heat-dissipating through-hole 52, the heat dissipation area of ​​the heat-conducting metal block 5 can be further increased, thereby improving the heat dissipation effect of the solid-state hard disk device 100. The number, size, appearance, arrangement, etc. of the heat-dissipating through-holes 52 can all be designed according to actual needs and are not limited to those shown in the figure. The solid-state hard disk device 100 of this embodiment can also allow air to flow between the heat-dissipating through-holes 52 through the design of the heat-dissipating through-holes 52, thereby allowing heat energy to be transferred outward more quickly through the airflow.

[0051] It should be noted that in the drawings of this embodiment, the auxiliary heat-conducting structure 17 is provided on the back side 16 of the circuit board 1 as an example, but the invention is not limited thereto; in one of the variations of this embodiment, the auxiliary heat-conducting structure 17 may not be provided on the back side 16 of the circuit board 1.

[0052] In addition, in the drawings of the present embodiment, the circuit board 1 is manufactured by single-sided punching as an example, but the invention is not limited thereto. In one of the variations of the present embodiment, the circuit board 1 can also be manufactured by double-sided punching, that is, the back side 16 of the circuit board 1 can also be provided with a memory or control chip.

[0053] Please also read Figures 11 to 14 , Fig.11 and Fig.12 Schematic diagrams of different viewing angles of the seventh embodiment of the solid state hard disk device of the present invention, Fig.13 for Fig.11 Schematic diagram of the section along the XII-XII section line, Fig.14 : is a cross-sectional schematic diagram of the eighth embodiment of the electronic device of the present invention. The biggest difference between this embodiment and the previous embodiments is that the two end surfaces 51 of the heat-conducting metal block 5 can also be respectively formed with at least one heat-conducting channel 53. Each heat-conducting channel 53 is, for example, a groove formed at one end of the heat-conducting metal block 5, and both ends of the groove have openings 54 connected to the outside. The shape, number, width, length, depth and arrangement of the heat-conducting channel 53 can be changed according to actual needs and are not limited here.

[0054] In practical applications, the heat-conducting metal block 5 is, for example, a copper block. Before being embedded in the circuit board 1 , the heat-conducting metal block 5 may be processed by a related process (such as laser, etc.) to form a plurality of heat-conducting channels 53 at both ends of the copper block.

[0055] It should be noted that in the drawings of this embodiment, the auxiliary heat-conducting structure 17 is provided on the back side 16 of the circuit board 1 as an example, but the invention is not limited thereto; in one of the variations of this embodiment, the auxiliary heat-conducting structure 17 may not be provided on the back side 16 of the circuit board 1.

[0056] In addition, in the drawings of this embodiment, the circuit board 1 is manufactured by double-sided punching as an example, but the invention is not limited thereto; in one of the variations of this embodiment, the circuit board 1 can also be manufactured by single-sided punching.

[0057] like Fig.13 As shown, in one specific practical application of this embodiment, the two end surfaces 51 of the heat-conducting metal block 5 can be flush with the front surface 15 and the back surface 16 of the circuit board 1, respectively, and each heat-conducting channel 53 is formed by the concave end surface of the heat-conducting metal block 5. Fig.14 As shown, in another variation of the present embodiment, the two end surfaces 51 of the heat-conducting metal block 5 may be higher than the front surface 15 and the back surface 16 of the circuit board 1 , respectively.

[0058] See also Fig.15, which is a partial exploded schematic diagram of the electronic device of the present invention. The electronic device 200 of the present invention comprises a body 201, a cover 202, at least one solid state hard disk device 100 and two auxiliary heat sinks 6. The electronic device 200 is, for example, a portable electronic device such as a notebook computer, but is not limited thereto. The electronic device 200 may also be, for example, a desktop computer. The body 201 comprises a housing 2011, a circuit board 2012, a screen, a keyboard, and other electronic components required for the operation of the electronic device 200. A portion of the circuit board 2012 is exposed from an opening 20111 of the housing 2011, and the cover 202 is detachably fixed to the housing 2011, and the cover 202 is used to cover the opening 20111 of the housing 2011. The circuit board 2012 is provided with a slot 2013, and the slot 2013 is used to provide a plug-in structure 3 of the solid state hard disk device 100 for insertion.

[0059] In practical applications, the solid state drive device 100 of this embodiment may be the same as the solid state drive device 100 described in any of the aforementioned embodiments. For detailed description of the solid state drive device 100, please refer to the aforementioned embodiments, which will not be repeated here.

[0060] In practical applications, one of the auxiliary heat sinks 6 can be fixed to the inner side of the cover 202, for example. When the solid state disk device 100 is fixedly disposed in the housing 2011 and the cover 202 is fixed to the housing 2011, a portion of the auxiliary heat sink 6 is attached to at least one of the control chip 2 and the memory 4 of the solid state disk device 100, and a portion of the auxiliary heat sink 6 is attached to the heat conductive metal block 5. Another auxiliary heat sink 6 is disposed on the side of the solid state disk device 100 opposite to the cover 202. The number of auxiliary heat sinks 6 and their location are not limited to the above description.

[0061] In summary, the solid state drive device 100 and the electronic device 200 of the present invention can effectively improve the heat dissipation effect of the solid state drive device 100 during operation through the design of the heat conductive metal block 5, so that the solid state drive device 100 can play its normal operating performance during operation. Since the solid state drive device 100 of the present invention has a better heat dissipation effect than the traditional solid state drive device 100, the solid state drive device 100 of the present invention can be applied as a PCIeGen5M.2SSD.

[0062] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. A solid state hard disk device, characterized in that: The solid state hard disk device comprises: A circuit board, comprising a heat dissipation area and an electronic component area, wherein the heat dissipation area occupies at least one half of a wide side surface of the circuit board; the circuit board comprises a through hole in the heat dissipation area; a heat-conducting metal block, at least a portion of which is fixedly disposed in the through hole, and both end surfaces of the heat-conducting metal block are exposed at two sides of the circuit board; At least one control chip, which is fixedly disposed in the electronic component area; At least one memory, which is fixedly disposed in the electronic component area; A plug-in structure is disposed at one end of the circuit board; the solid state hard disk device can be connected to a slot of an electronic device through the plug-in structure; The heat-conducting metal block is not connected to the circuit in the circuit board for connecting the control chip and the memory; and the heat dissipation area is not provided with the control chip or the memory.

2. The solid state hard disk device according to claim 1, characterized in that: The circuit board is a multi-layer board structure, and the circuit board includes multiple layers of core boards. Each layer of the core boards includes a through hole, and the through holes of each core board are interconnected to jointly form the through hole; the multiple layers of the core boards are connected to each other by an adhesive, and the heat-conducting metal block is fixed to the multiple layers of the core boards by the adhesive.

3. The solid state hard disk device according to claim 1, characterized in that: The circuit board is provided with at least one auxiliary heat-conducting structure on a side opposite to the side where the control chip is provided. The auxiliary heat-conducting structure is not connected to the circuit in the circuit board used to connect the control chip and the memory, and the auxiliary heat-conducting structure is connected to the heat-conducting metal block.

4. The solid state hard disk device according to claim 3, characterized in that: The circuit board further includes at least one heat-conducting through hole in the electronic component area, the heat-conducting through hole is arranged to penetrate the circuit board, and the heat-conducting through hole is arranged adjacent to one of the control chip and the memory, the heat-conducting through hole is filled with a heat-conducting block, one end of the heat-conducting block is connected to the auxiliary heat-conducting structure; the heat-conducting block is not connected to the circuit in the circuit board used to connect the control chip and the memory.

5. The solid state hard disk device according to claim 1, wherein: The heat-conducting metal block further includes at least one heat-dissipating through hole, and the heat-dissipating through hole passes through the heat-conducting metal block.

6. The solid state hard disk device according to claim 1, wherein: At least one end surface of the heat-conducting metal block is formed with at least one heat-conducting channel, and both ends of the heat-conducting channel have openings communicating with the outside.

7. The solid state hard disk device according to claim 1, wherein: The solid state hard disk device further includes an auxiliary heat sink, a portion of which is fixed to the surface of at least one of the control chip and the memory, and a portion of which is fixed to the surface of the heat conductive metal block.

8. The solid state hard disk device according to any one of claims 1 to 7, characterized in that: The circuit board is further provided with at least one memory on a side opposite to the side where the control chip is provided.

9. The solid state hard disk device according to any one of claims 1 to 7, characterized in that: The solid state drive device complies with the PCIe Gen5 M.2 specification.

10. An electronic device, characterized in that: The electronic device comprises: a solid-state hard disk device according to any one of claims 1 to 6, a body, a cover body and an auxiliary heat sink, wherein a circuit main board is arranged in the body, the circuit main board has a slot, and the slot and a portion of the circuit main board are exposed from an opening of the body; the plug-in structure of the solid-state hard disk device is used to be plugged into the slot, the cover body is detachably fixed to the body, and the cover body can cover the opening; the auxiliary heat sink is fixed to the inner side of the cover body; when the cover body is fixed to the body and the plug-in structure of the solid-state hard disk device is plugged into the slot, a portion of the auxiliary heat sink is attached to at least one of the control chip and the memory, and a portion of the auxiliary heat sink is attached to a portion of the heat-conducting metal block.

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