Aerosol-generating device

Abstract

The invention relates to the technical field of aerosol preparation, in particular to an aerosol generating device. An aerosol generating device comprises a shell, an aerosol generating assembly, a heating assembly and a refrigerating part, and the shell is provided with a heating cavity; the aerosol generating assembly is inserted into the heating cavity, the aerosol generating assembly is provided with a cavity communicating with the heating cavity, and a vent communicating with the outside is formed in the side wall of the cavity; the heating assembly is arranged in the heating cavity and used for heating the aerosol generating assembly to generate aerosol; the refrigeration part is arranged on the outer side of the cavity in a surrounding mode and used for cooling the aerosol received by the cavity. According to the aerosol generating assembly, the air vent is formed in the side wall of the cavity of the aerosol generating assembly, air cools the aerosol in the cavity, the aerosol is cooled again through the refrigerating part, and the suction temperature of aerosol gas can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of aerosol preparation, and in particular to an aerosol generating device. Background Art

[0002] In recent years, with the improvement of health awareness and the increasing demand of consumers for diversified smoking methods, heated cigarettes and other aerosol generating devices have gradually gained wide attention and application in the market as substitutes for traditional cigarettes. Aerosol generating devices release the aroma and nicotine of tobacco or similar substances by heating rather than burning, aiming to reduce the harmful substances produced in the traditional smoking process.

[0003] However, although aerosol generating devices have made significant progress in reducing harmful substances, during use, existing aerosol generating devices heat aerosol products by setting up heating elements to generate aerosols containing aroma and nicotine, and users inhale these smoke through their mouths. However, the smoke temperature is too high when the user inhales directly, causing the user to feel hot in the mouth when inhaling, which seriously affects the user's comfort and usage experience. Summary of the invention

[0004] Based on this, it is necessary to provide an aerosol generating device that can reduce the temperature of smoke released by the aerosol generating device.

[0005] In order to solve the above technical problems, this application provides the following technical solutions:

[0006] An aerosol generating device, comprising:

[0007] A housing having a heating chamber;

[0008] an aerosol generating assembly, inserted into the heating chamber, the aerosol generating assembly having a cavity body communicating with the heating chamber, and a vent hole communicating with the outside world is formed on a side wall of the cavity;

[0009] A heating component, disposed in the heating chamber, for heating the aerosol generating component to generate aerosol; and

[0010] A refrigeration component is arranged around the outside of the cavity and is used for cooling the aerosol received by the cavity.

[0011] It can be understood that by arranging vents on the side walls of the cavity of the aerosol generating component, air enters the cavity through the vents to cool the aerosol in the cavity, and by surrounding the refrigeration component on the outside of the cavity, the aerosol entering the cavity is cooled again by the refrigeration component. By doubly cooling the aerosol in the cavity, the inhalation temperature of the aerosol gas can be effectively reduced, thereby improving the user experience.

[0012] In one embodiment, the refrigeration component is a semiconductor component based on the Peltier effect, the semiconductor component has a cold end, and a cooling channel is formed between the cold end and the outer wall of the cavity, and an air inlet is provided on the shell, and the cooling channel connects the air inlet with the vent.

[0013] It can be understood that, by facing the cold end toward the cooling channel, the cold end is first used to cool the air entering the cooling channel, and the air entering the cooling channel is used to pre-cool the aerosol in the cooling section, and then the cooled air enters from the vent to cool the aerosol in the cooling section, thereby achieving double cooling of the aerosol and making the cooling effect better, thereby reducing the temperature of the aerosol inhaled by the user and optimizing the user experience.

[0014] In one embodiment, the air inlet is opened at the bottom end of the shell; or

[0015] The air inlet is arranged on the side wall of the shell and is located at the same level as the boundary line between the cavity and the heating cavity.

[0016] In one embodiment, the semiconductor component has a hot end, and the hot end is attached to the inner wall of the shell.

[0017] In one embodiment, the refrigeration component is a semiconductor component based on the Peltier effect, the semiconductor component has a cold end, and a cooling channel is formed between the cold end and the inner wall of the shell, the shell is provided with an air inlet, and the cooling channel connects the air inlet with the vent.

[0018] In one embodiment, the air inlet is opened at the bottom end of the shell; or

[0019] The air inlet is arranged on the side wall of the shell and is located at the same level as the boundary line between the cavity and the heating cavity.

[0020] In one embodiment, the refrigeration component is a semiconductor component based on the Peltier effect, the semiconductor component has a cold end and a hot end, and the cold end is arranged corresponding to the cavity, the hot end and the shell are provided with an air intake channel, the top of the shell is provided with an air intake port, the air intake channel connects the air intake port with the heating cavity, and the air intake port is connected with the vent.

[0021] In one embodiment, there are multiple vents, and the sum of the flow areas of the vents is greater than or equal to the flow area of ​​the air inlet.

[0022] In one embodiment, the aerosol generating assembly is removably insertable into the heating chamber.

[0023] In one embodiment, the aerosol generating device further comprises a heat-insulating layer, and the heat-insulating layer is located at the periphery of the heating chamber.

[0024] Compared with the prior art, the aerosol generating device provides vents on the side walls of the cavity of the aerosol generating component, and air enters the cavity through the vents to cool the aerosol in the cavity. Furthermore, a refrigeration component is arranged on the outside of the cavity, and the aerosol entering the cavity is cooled again by the refrigeration component. By performing double cooling on the aerosol in the cavity, the inhalation temperature of the aerosol gas can be effectively reduced, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 Schematic diagram of the structure of the aerosol generating component provided in this application.

[0027] Figure 2 This is a schematic structural diagram of an aerosol generating device provided in the first embodiment of the present application.

[0028] Figure 3 This is a schematic structural diagram of an aerosol generating device provided in the second embodiment of the present application.

[0029] Figure 4 This is a schematic structural diagram of an aerosol generating device provided in the third embodiment of the present application.

[0030] Figure 5 This is a schematic structural diagram of an aerosol generating device provided in the fourth embodiment of the present application.

[0031] Figure 6 A schematic diagram of the working principle of the semiconductor component provided for this application.

[0032] Figure 7 This is a schematic diagram of the structure of the semiconductor component provided in this application.

[0033] The reference numerals of the components are as follows:

[0034] 100. Aerosol generating device; 10. Shell; 11. Heating chamber; 12. Cooling channel; 13. Air inlet; 14. Air inlet channel; 20. Aerosol generating assembly; 21. Cavity; 211. Air vent; 30. Heating assembly; 40. Refrigeration component; 41. Semiconductor component; 411. Cold end; 412. Hot end; 413. Insulating thermal conductor; 414. Electrical conductor; 415. P-type semiconductor; 416. N-type semiconductor; 50. Insulation layer; 60. Power module. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0036] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediate medium. Moreover, a first feature being “above”, “above”, or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0040] See also Figures 1 to 7 The present application provides an aerosol generating device 100, which includes: a shell 10, an aerosol generating component 20, a heating component 30 and a refrigeration component 40, wherein the shell 10 has a heating chamber 11; the aerosol generating component 20 is inserted into the heating chamber 11, and the aerosol generating component 20 has a cavity 21 connected to the heating chamber 11, and a vent 211 connected to the outside is opened on the side wall of the cavity 21; the heating component 30 is arranged in the heating chamber 11, and is used to heat the aerosol generating component 20 to generate aerosol; the refrigeration component 40 is surrounded by the outer side of the cavity 21 and is used to cool the aerosol received by the cavity 21. In this way, by arranging the vent 211 on the side wall of the cavity 21 of the aerosol generating component 20, air enters the cavity 21 through the vent 211 to cool the aerosol in the cavity 21, and by surrounding the refrigeration component 40 on the outside of the cavity 21, the aerosol entering the cavity 21 is cooled again by the refrigeration component 40. By doubly cooling the aerosol in the cavity 21, the inhalation temperature of the aerosol gas can be effectively reduced, thereby improving the user experience.

[0041] like Figures 1 to 5 As shown, the aerosol generating assembly 20 is removably insertable into the heating chamber 11 .

[0042] Here, the aerosol generating component 20 has a cavity 21, which is used to reduce the temperature of the aerosol and improve the comfort of inhaling the aerosol. Exemplarily, the cavity 21 contains cooling materials or is designed with a special structure such as a conical cavity, annular conical cavity, etc., to accelerate the flow of airflow and reduce the temperature.

[0043] Specifically, external air enters the cavity 21 through the vents 211, and there are multiple vents 211, for example, the number of vents 211 can be configured as 3, 4, 5, etc. In addition, the size of the vents 211 can be a small-sized hole or a large-sized hole, which is arranged at intervals on the side wall of the cavity 21. And the sum of the flow areas of the vents 211 is greater than or equal to the flow area of ​​the air inlet 13. When the sum of the flow areas of the vents 211 is greater than the flow area of ​​the air inlet 13, it is smoother when the air enters the cavity 21 from the pre-cooling channel, which is more conducive to the air entering the cavity 21 from the pre-cooling channel to cool the aerosol.

[0044] In one embodiment, the heating component 30 can adopt an internal heating mode or an external heating mode. In the internal heating mode, the heating component 30 is usually placed inside the heating chamber 11, so that the heat can directly and concentratedly act on the aerosol generating component 20, thereby improving the heating efficiency. In addition, the internal heating method is more flexible in product design, and the position and shape of the heating component 30 can be adjusted as needed to adapt to different aerosol materials and heating requirements. The external heating mode heats the aerosol product through an external heat source, which can more easily achieve stable temperature control and reduce the impact of temperature fluctuations on the heating effect of the aerosol material. In addition, the preheating method is suitable for various types of aerosol materials and heating requirements, and has high applicability and flexibility. Here, the shape of the heating component 30 can be a needle-shaped, rod-shaped or sheet-shaped shape, and the heating component 30 can be composed of ceramics, electric heating wires or printed circuits.

[0045] like Figure 2 and Figure 3 As shown, the refrigeration component 40 is a semiconductor component 41 based on the Peltier effect, the semiconductor component 41 has a cold end 411 and a hot end 412, and the cold end 411 is arranged corresponding to the cavity 21, and an air inlet channel 14 is arranged on the shell 10, and the hot end 412 is arranged toward the air inlet channel. In this embodiment, an air inlet port 13 is provided at the top end of the shell 10, and the air inlet channel 14 connects the air inlet port 13 with the heating chamber 11.

[0046] In one embodiment, if Figure 2 As shown, the top of the housing 10 is provided with an air inlet 13, the hot end 412 faces outward, and the cold end 411 is arranged corresponding to the cavity 21, so that the air passes through the air inlet channel 14 and is preheated by the hot end 412 before entering the heating cavity 11. The preheated air can increase the temperature of the aerosol product in the heating cavity 11, thereby shortening the preheating time. At the same time, the entry of the preheated air can also accelerate the flow of the gas in the heating cavity 11, thereby generating a thermal convection effect, which can further shorten the preheating time.

[0047] In one embodiment, if Figure 3 As shown, an air inlet 13 is provided at the top of the shell 10, the hot end 412 faces the air inlet channel 14, the cold end 411 is arranged corresponding to the cavity 21, and an air inlet is opened at the corresponding position of the air inlet channel 14 and the air vent, so that the air inlet 13 is connected with the air vent 211, and part of the air enters the air vent along the air inlet to cool the aerosol in the cavity 21. At the same time, the cavity 21 of the aerosol generating component 20 is cooled by the cold end 411 to further cool the aerosol. In this way, the aerosol temperature of the aerosol generating component 20 can be effectively reduced to prevent the problem of overheating of the aerosol when inhaling the aerosol, and the user experience can be optimized.

[0048] like Figure 4As shown, the refrigeration element 40 is a semiconductor element 41 based on the Peltier effect. The semiconductor element 41 has a cold end 411, and a cooling channel 12 is formed between the cold end 411 and the inner wall of the shell 10. The shell 10 is provided with an air inlet 13, and the cooling channel 12 connects the air inlet 13 with the vent 211. Here, the air inlet 13 is opened at the bottom end of the shell 10; or the air inlet 13 is provided on the side wall of the shell 10 and is located at the intersection of the cavity 21 and the heating cavity 11. In this embodiment, the heat from the hot end 412 is transferred to the shell 10 to slightly increase the surface temperature of the shell 10, so that the user can feel that the temperature of holding the aerosol generating device 100 is hotter, which is opposite to the cooler temperature during the first inhalation, thereby increasing the user's interest in use.

[0049] like Figure 5 As shown, the refrigeration component 40 is a semiconductor component 41 based on the Peltier effect. The semiconductor component 41 has a cold end 411, and a cooling channel 12 is formed between the cold end 411 and the outer wall of the cavity 21. The shell 10 is provided with an air inlet 13, and the cooling channel 12 connects the air inlet 13 with the vent 211. Through the cold end 411 toward the cooling channel 12, the cold end 411 is first used to cool the air entering the cooling channel 12, and the air entering the cooling channel 12 is used to pre-cool the aerosol in the cavity 21, and then the cooled air enters from the vent 211 to cool the aerosol in the cavity 21, so that the cooling effect is better, thereby reducing the temperature of the aerosol inhaled by the user and optimizing the user experience. Here, the air inlet 13 is opened at the bottom end of the shell 10; or the air inlet 13 is arranged on the side wall of the shell 10 and is located at the intersection of the cavity 21 and the heating cavity 11.

[0050] In this embodiment, the air inlet 13 is opened at the bottom end of the shell 10, and the cold end 411 occupies a larger area in the cooling channel 12 than when the air inlet 13 is arranged on the side wall of the shell 10 and is located at the same level as the boundary line between the cavity 21 and the heating cavity 11. Therefore, the cooling effect of the gas passing through the cooling channel 12 is better, and the temperature is lower when entering the cavity 21, so it can have a better cooling effect on the aerosol in the cavity 21.

[0051] In one embodiment, the semiconductor component 41 has a hot end 412, and the hot end 412 is attached to the inner wall of the shell 10. At this time, the hot end 412 can be set close to the heating component 30, and can transfer heat to the aerosol generating component 20 to preheat the aerosol generating component 20.

[0052] It should be noted that the Peltier Effect is a thermoelectric effect. When current passes through a junction composed of two different conductive materials, the two ends of the junction will absorb or release heat, thereby achieving a cooling or heating effect. Specifically, the semiconductor component 41 is composed of an insulating heat conductor 413, a conductor 414, a P-type semiconductor 415, and an N-type semiconductor 416. The conductor 414 and the wire connect the N-type semiconductor 416 and the P-type semiconductor 415 into a loop, connecting the semiconductor component 41 to the battery, and the conductor 414 and the wire only play a conductive role. After the current is turned on, the semiconductor component 41 generates electron-hole pairs at one end, the internal energy decreases, the temperature decreases, and heat is absorbed from the outside, which is called the cold end 411; the other end increases the internal energy and the temperature increases due to the recombination of the electron-hole pairs, and releases heat to the surrounding, which is called the hot end 412.

[0053] It can be understood that the insulating heat conductor 413 is composed of a material with electrical insulation and high thermal conductivity, such as ceramics and glass. The conductor 414 has a conductive property. The N-type semiconductor 416 is a semiconductor that mainly conducts electricity through electrons, such as a silicon semiconductor containing pentavalent element arsenic. The P-type semiconductor 415 is a semiconductor that mainly conducts electricity through holes, such as a silicon semiconductor containing trivalent element boron.

[0054] In one embodiment, the aerosol generating device 100 further includes a heat preservation layer 50 , and the heat preservation layer 50 is located outside the heating chamber 11 .

[0055] Specifically, the thermal insulation layer 50 includes a vacuum layer (not shown) and a thermal insulation layer (not shown), the vacuum layer is arranged on the outside of the heating chamber 11, and the thermal insulation layer is arranged on the inside of the shell 10; the thermal insulation layer is configured as one or more materials such as aerogel, asbestos, rock wool and / or glass fiber wool felt.

[0056] like Figure 7 As shown, the aerosol generating device 100 further includes a power module 60, and the power module 60 is used to control the semiconductor component to be turned on / off.

[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. An aerosol generating device, characterized in that: include: A housing (10), wherein the housing (10) has a heating chamber (11); an aerosol generating assembly (20) inserted into the heating chamber (11), the aerosol generating assembly (20) comprising a cavity (21) communicating with the heating chamber (11), the side wall of the cavity (21) being provided with a vent (211) communicating with the outside; A heating component (30), disposed in the heating chamber (11), used for heating the aerosol generating component (20) to generate aerosol; The refrigeration element (40) is disposed around the outside of the cavity (21) and is used to cool the aerosol received by the cavity (21).

2. The aerosol generating device according to claim 1, characterized in that: The refrigeration component (40) is a semiconductor component (41) based on the Peltier effect, the semiconductor component (41) has a cold end (411), and a cooling channel (12) is formed between the cold end (411) and the outer wall of the cavity (21), the shell (10) is provided with an air inlet (13), and the cooling channel (12) connects the air inlet (13) with the air vent (211).

3. The aerosol generating device according to claim 2, characterized in that: The air inlet (13) is opened at the bottom end of the shell (10); or The air inlet (13) is arranged on the side wall of the shell (10) and is located at the same level as the boundary line between the cavity (21) and the heating cavity (11).

4. The aerosol generating device according to claim 3, characterized in that: The semiconductor component (41) has a hot end (412), and the hot end (412) is attached to the inner wall of the shell (10).

5. The aerosol generating device according to claim 2, characterized in that: The refrigeration component (40) is a semiconductor component (41) based on the Peltier effect. The semiconductor component (41) has a cold end (411), and a cooling channel (12) is formed between the cold end (411) and the inner wall of the shell (10). An air inlet (13) is provided on the shell (10), and the cooling channel (12) connects the air inlet (13) with the air vent (211).

6. The aerosol generating device according to claim 5, characterized in that: The air inlet (13) is opened at the bottom end of the shell (10); or The air inlet (13) is arranged on the side wall of the shell (10) and is located at the same level as the boundary line between the cavity (21) and the heating cavity (11).

7. The aerosol generating device according to claim 2, characterized in that: The refrigeration element (40) is a semiconductor element (41) based on the Peltier effect. The semiconductor element (41) has a cold end (411) and a hot end (412). The cold end (411) is arranged corresponding to the cavity (21). An air inlet channel (14) is provided on the hot end (412) and the shell (10). An air inlet (13) is provided at the top end of the shell (10). The air inlet channel (14) connects the air inlet (13) with the heating cavity (11). The air inlet (13) is connected to the vent (211).

8. The aerosol generating device according to any one of claims 2 to 7, characterized in that: There are multiple vents (211), and the sum of the flow areas of the vents (211) is greater than or equal to the flow area of ​​the air inlet (13).

9. The aerosol generating device according to claim 1, characterized in that: The aerosol generating assembly (20) is detachably insertable into the heating chamber (11).

10. The aerosol generating device according to claim 1, characterized in that The aerosol generating device (100) further comprises a heat-insulating layer (50), wherein the heat-insulating layer (50) is located at the periphery of the heating chamber (11).

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