Paster component performance test fixture and use method thereof

Abstract

The invention discloses a surface-mounted component performance test fixture and a use method thereof. The testing jig comprises a base, a rotating disc and a probe station, the rotating disc is rotationally connected to the base, the probe station is installed at the bottom of the base, the probe station is provided with a detection probe, the rotating disc is provided with a containing cavity, the containing cavity is used for containing a surface-mounted component, a connecting terminal is arranged at the bottom of the containing cavity, and the surface-mounted component abuts against the connecting terminal. The detection probe passes through the base and abuts against the connection terminal to form conduction so as to be used for testing the performance of the surface-mounted component. According to the invention, the turntable structure is designed, so that the patch components can be sequentially placed in different accommodating cavities of the turntable, and the turntable is rotationally connected with the base, so that a tester can simply rotate the turntable to send the patch components to be tested to the area of the detection probe one by one for testing, and the testing efficiency is improved. The time for manually replacing the surface-mounted components is greatly shortened, and the testing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip component performance testing, and in particular to a chip component performance testing jig and a use method thereof. Background Art

[0002] In the field of electronic component manufacturing, passive components are widely used in various electronic devices. The stability and reliability of their performance are directly related to the operating efficiency and safety of the entire system. Therefore, in the production process of passive components, strict and efficient testing of their performance is an indispensable part. The performance testing of large-scale production of electronic components relies on automated testing equipment. However, in the sampling inspection of incoming materials in laboratories and electronic product manufacturers, the traditional passive component performance testing process mainly relies on manual operation. Although this model can meet basic testing needs to a certain extent, with the continuous improvement of production efficiency and product quality in the modern electronics industry, its limitations are becoming increasingly prominent.

[0003] Specifically, the main challenges faced by traditional testing methods include:

[0004] Low test efficiency: Manual operation is not only time-consuming, but also increases the fatigue of testers when processing a large number of samples, which can easily lead to a decrease in test speed and make it difficult to meet fast-paced testing needs.

[0005] Lack of accuracy: Manual testing is easily affected by human factors, such as operating proficiency, consistency of judgment standards, etc. These factors may introduce errors, affect the accuracy of test results, and further affect the quality control of capacitor products.

[0006] Frequent replacement and adjustment of test fixtures: Passive components often have different sizes and shapes due to different application fields. Traditional test systems usually require the design or use of specific test fixtures for different types of capacitors, which not only increases manufacturing costs, but also greatly reduces the continuity and efficiency of the test process during the actual test process due to frequent replacement and adjustment of fixtures.

[0007] In summary, the existing passive component performance testing process has obvious deficiencies in terms of automation, test accuracy, and adaptability to diversified product needs. There is an urgent need to develop a new fixture that is more efficient, accurate, and can adapt to the testing needs of passive components of different sizes and shapes, so as to improve the overall quality and efficiency of passive component testing. Summary of the invention

[0008] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a chip component performance test fixture and a method for using the same.

[0009] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0010] In the first aspect, an embodiment of the present invention provides a chip component performance test fixture, including: a base, a turntable and a probe station, the turntable is rotatably connected to the base, the probe station is installed at the bottom of the base, and the probe station is provided with a detection probe, the turntable is provided with a accommodating cavity, the accommodating cavity is used to place chip components, the bottom of the accommodating cavity is provided with a connecting terminal, the chip component abuts against the connecting terminal, the detection probe passes through the base and abuts against the connecting terminal to form conduction, so as to be used for the performance test of the chip component.

[0011] In a specific embodiment, a limiting member is further provided in the accommodating cavity, and the limiting member is used to limit the patch component.

[0012] In a specific embodiment, the limiting member is an elastic clip.

[0013] In a specific embodiment, the connecting terminal includes a connecting seat, a spring member and a connecting head, one end of the spring member is connected to the connecting seat, and the other end is connected to the connecting head, the connecting head abuts against the patch component, and the connecting seat abuts against the detection probe.

[0014] In a specific embodiment, the position of the rotating disk located at the connecting seat is also provided with an opening slot adapted for the detection probe.

[0015] In a specific embodiment, a buffer spring is further provided at the bottom of the detection probe.

[0016] In a specific embodiment, the base is further connected to a driving member, and the driving member is drivingly connected to the turntable.

[0017] In a specific embodiment, a transmission tooth is disposed on the outer side of the turntable, and the driving member is a driving gear, and the driving gear meshes with the transmission tooth for transmission.

[0018] In a specific embodiment, the base is provided with a mounting column, the mounting column is connected to a ball bearing, and the turntable is rotatably connected to the ball bearing.

[0019] The chip component performance test fixture of the present invention has the following beneficial effects compared with the prior art: by designing the turntable structure, the chip components can be placed in different accommodating cavities of the turntable in sequence, and the rotating connection design of the turntable and the base allows the tester to simply rotate the turntable to send the chip components to be tested to the area of ​​the detection probe for testing one by one. This automated or semi-automated testing process greatly reduces the time for manual replacement of chip components, significantly improves the testing efficiency, and adapts to the needs of large-scale production; in addition, the chip components are connected to the connecting terminals at the bottom of the turntable accommodating cavity and are connected to the detection probes passing through the base, thereby ensuring the stable transmission of the test signal. This design reduces the problem of poor contact or signal interruption caused by improper manual operation and improves the accuracy and reliability of the test; at the same time, the stable installation of the turntable and the probe station, as well as the smooth rotation of the turntable, further ensure the stability during the test.

[0020] In a second aspect, an embodiment of the present invention provides a method for using a patch component performance test fixture, comprising the following steps:

[0021] Place the components in the accommodating cavity of the turntable so that the chip components abut against the connecting terminals;

[0022] Rotate the turntable so that the connecting terminal abuts against the detection probe;

[0023] Connect the probe station to the external testing equipment and start the test to complete the performance test of the chip components.

[0024] The method for using the chip component performance test fixture of the present invention has the following beneficial effects compared with the prior art: the performance test of the chip components can be achieved by placing components, rotating a turntable, connecting a detection device and starting a test. This process design greatly simplifies the test operation, reduces manual intervention, and thus improves the test efficiency. In addition, the design of the turntable enables a plurality of chip components to be placed in the accommodating cavity in sequence, and the tests can be performed one by one by rotating the turntable, without the need to frequently replace fixtures or components, thereby further improving the test speed. In addition, the components are placed in the accommodating cavity of the turntable, and are connected to the detection probe by abutting against the connecting terminal. This contact mode ensures the stable transmission of the test signal and reduces the test error caused by poor contact.

[0025] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 A schematic diagram of the structure of a chip component performance test fixture provided by the present invention;

[0028] Figure 2 A schematic cross-sectional view of a chip component performance test fixture provided by the present invention;

[0029] Figure 3 An exploded schematic diagram of a chip component performance test fixture provided by the present invention;

[0030] Figure 4 A schematic diagram of the structure of the connecting terminal provided by the present invention;

[0031] Figure 5 A flow chart of a method for using the patch component performance testing fixture provided by the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0039] See also Figures 1 to 4In the specific embodiment shown, the present invention discloses a chip component performance test fixture, including: a base 10, a turntable 20 and a probe station 30, the turntable 20 is rotatably connected to the base 10, the probe station 30 is installed at the bottom of the base 10, and the probe station 30 is provided with a detection probe 31, the turntable 20 is provided with a accommodating cavity, the accommodating cavity is used to place the chip component, the bottom of the accommodating cavity is provided with a connecting terminal 40, the chip component abuts against the connecting terminal 40, the detection probe 31 passes through the base 10 and abuts against the connecting terminal 40 to form conduction, so as to be used for the performance test of the chip component.

[0040] Specifically, by designing the structure of the turntable 20, the patch components can be placed in different accommodating cavities of the turntable 20 in sequence. The rotating connection design of the turntable 20 and the base 10 allows the tester to simply rotate the turntable 20 to send the patch components to be tested to the area of ​​the detection probe 31 for testing. This automated or semi-automated test process greatly reduces the time for manual replacement of patch components, significantly improves the test efficiency, and adapts to the needs of large-scale production. In addition, the patch components are connected to the connection terminals 40 at the bottom of the accommodating cavity of the turntable 20 and are connected to the detection probe 31 passing through the base 10, ensuring the stable transmission of the test signal. This design reduces the problem of poor contact or signal interruption caused by improper manual operation, and improves the accuracy and reliability of the test; at the same time, the stable installation of the turntable 20 and the probe station 30, as well as the stability of the rotation of the turntable 20, further ensure the stability during the test. In addition, the design of the accommodating cavity can be adjusted or customized according to the size and shape of different patch components, so that the fixture can be applied to various types of patch component testing. This feature greatly expands the scope of application of the fixture, reduces the cost and time consumption caused by frequent replacement of test fixtures, and improves the flexibility and economy of the test. In addition, the traditional manual testing method requires testers to frequently manually replace patch components, which is labor-intensive and inefficient. The fixture can automatically switch the patch components to be tested by rotating the turntable 20, which greatly simplifies the operation process, reduces the labor intensity of the testers, and improves work efficiency and comfort. Among them, the patch components are capacitors or other components.

[0041] In one embodiment, a limiting member 50 is further provided in the accommodating cavity, and the limiting member 50 is used to limit the patch component.

[0042] Specifically, a limiting member 50 is added to the accommodating cavity, and these limiting members 50 are cleverly designed and fixed at the appropriate position of the accommodating cavity to achieve effective limiting of the patch components. The limiting member 50 can take a variety of forms, including but not limited to elastic buckles, fixed blocks or adjustable limiting screws, etc., and the specific selection depends on the shape, size and test requirements of the patch components. For example, when the patch components are rectangular or square, the limiting member 50 can be designed as elastic buckles at the four corners, which can automatically rebound and clamp the corners of the patch components after the patch components are placed in the accommodating cavity, thereby preventing them from shifting during the test. For circular or other irregularly shaped patch components, the limiting member 50 can be designed as a fixed block or an adjustable limiting screw surrounding the edge of the patch component. By adjusting the position and tightness of these limiting members 50, stable limiting of patch components of different shapes can be achieved.

[0043] More specifically, the introduction of the limiter 50 effectively prevents the displacement of the patch components during the test process, ensures the stable contact between the patch components and the connecting terminals 40 and the detection probes 31, thereby improving the accuracy and stability of the test. In addition, the stable positioning of the patch components by the limiter 50 reduces the test failure or inaccurate test results caused by the displacement of the patch components, and improves the reliability and repeatability of the test. In addition, the design of the limiter 50 has certain flexibility and adjustability, and can be adjusted according to patch components of different shapes and sizes, thereby expanding the scope of application of the fixture and improving the versatility and flexibility of the test. In addition, the use of the limiter 50 eliminates the need for testers to apply additional fixing measures when placing patch components, simplifies the operation process, and improves test efficiency.

[0044] In one embodiment, the limiting member 50 is an elastic clip.

[0045] Specifically, an elastic clip is cleverly provided in the accommodating cavity as a limiter 50. These elastic clips are usually made of a material with appropriate elasticity (such as spring steel sheets, rubber or other elastic plastics) to ensure that they can firmly clamp the patch components and can adapt to patch components of different sizes without causing damage. In specific implementation, the elastic clip is designed to fit the inner wall of the accommodating cavity and have a certain opening angle so that after the patch components are placed in the accommodating cavity, they can automatically rebound and tightly clamp the two sides or edges of the patch components. In order to further enhance the clamping effect, the surface of the elastic clip can also be provided with an anti-slip texture or coating to increase the friction between the patch components and prevent them from sliding or shifting during the test. In addition, the number and position of the elastic clips can be flexibly adjusted according to the shape and size of the patch components. For example, for larger SMD components, multiple elastic clips can be installed to provide stronger clamping force; for smaller or irregularly shaped SMD components, the opening angle and position of the elastic clips can be adjusted to ensure that they can fit the SMD components tightly and effectively prevent displacement.

[0046] More specifically, the elastic clip can firmly clamp the patch components to prevent them from shifting or sliding during the test, thereby ensuring the stability of the test. In addition, since the elastic clip ensures stable contact between the patch components and the connecting terminals 40 and the detection probes 31, the accuracy of the test can be greatly improved, and the test errors caused by poor contact or displacement can be reduced. In addition, the flexibility and adjustability of the elastic clip enable the fixture to be applicable to patch components of different shapes and sizes, thereby improving the versatility and flexibility of the test. In addition, the elastic clip is made of a soft and elastic material, which can avoid damaging the patch components while clamping them, thereby extending the service life of the patch components. In addition, since the elastic clip can automatically rebound and clamp the patch components, the tester does not need to apply additional fixing measures when placing the patch components, which simplifies the operation process and improves the test efficiency.

[0047] See also Figures 2 to 4 As shown, in one embodiment, the connecting terminal 40 includes a connecting seat 41, a spring member 42 and a connecting head 43, one end of the spring member 42 is connected to the connecting seat 41, and the other end is connected to the connecting head 43, the connecting head 43 abuts against the patch component, and the connecting seat 41 abuts against the detection probe 31.

[0048] Specifically, one end of the spring member 42 is firmly connected to the connection seat 41 by welding, riveting or other fastening methods, and the other end is also connected to the connector 43 by a reliable connection method (such as crimping, welding), ensuring that the elastic deformation of the spring can be effectively transmitted to the connector 43 when subjected to force. The connector 43 is designed with a contact surface that matches the shape of the PIN pin of the patch component to ensure that a good electrical path can be formed when in contact. When the detection probe 31 applies pressure to the connection seat 41, the spring member 42 is compressed, pushing the connector 43 to fit tightly onto the PIN pin of the patch component. The elastic design of the spring member 42 allows the patch components with different PIN spacings to be adapted within a certain range, while providing the necessary contact pressure to ensure the stability of the electrical connection. When encountering excessive pressure, the buffering effect of the spring member 42 can absorb excess force to prevent the connector 43 from being deformed or damaged due to overpressure.

[0049] More specifically, through the elastic design of the spring member 42, the connection terminal 40 can adapt to patch components with different PIN spacings, thereby improving the versatility and flexibility of the test fixture. In addition, the continuous contact pressure provided by the spring member 42 ensures good contact between the connector 43 and the PIN pin of the patch component, reduces the contact resistance, and improves the accuracy of the test. In addition, the buffering effect of the spring member 42 effectively reduces the overpressure shock that may be caused by improper operation or position deviation of the PIN pin of the patch component, and extends the service life of the connector 43 and the detection probe 31. In addition, the design simplifies the preparation work before the test, and there is no need to replace different connection components for patch components with different PIN spacings, thereby reducing the complexity of operation and maintenance costs.

[0050] In one embodiment, the rotating disk 20 is further provided with an opening slot adapted to fit the detection probe 31 at the position of the connecting seat 41 .

[0051] Specifically, the shape of the opening slot is usually designed to match the cross section of the detection probe 31 to ensure that the detection probe 31 can be inserted smoothly and stably. In terms of size, the width of the opening slot is slightly larger than the diameter of the detection probe 31 to provide the necessary gap to avoid excessive friction resistance, while maintaining sufficient accuracy to prevent the detection probe 31 from shaking. The length is determined according to the angular range of rotation of the turntable 20 and the relative position of the detection probe 31 and the connection seat 41 to ensure that when the turntable 20 rotates to the test position, the detection probe 31 can be fully inserted and contact the connection seat 41. When the turntable 20 rotates to the test position, the detection probe 31 is inserted into the opening slot. Due to the limiting effect of the slot wall, a certain resistance is formed between the detection probe 31 and the turntable 20, thereby playing a limiting role. This limiting mechanism not only ensures the stable contact between the detection probe 31 and the connection seat 41, but also prevents the turntable 20 from accidentally rotating during the test, thereby improving the accuracy and safety of the test.

[0052] More specifically, the precisely designed opening slot and the alignment of the detection probe 31 ensure the stability and accuracy of the electrical connection during the test, reducing the test error caused by inaccurate alignment. In addition, the limit mechanism effectively prevents the turntable 20 from accidentally rotating during the test, avoiding damage to the fixture or personal injury caused by unstable connection or the fall of the detection probe 31. In addition, the user only needs to simply rotate the turntable 20 to achieve the alignment of the detection probe 31 and the connection seat 41, without the need for complex adjustment or calibration steps, simplifying the operation process.

[0053] See also Figure 2 As shown, in one embodiment, a buffer spring 32 is further provided at the bottom of the detection probe 31 .

[0054] Specifically, the buffer spring 32 can effectively absorb the impact force when the detection probe 31 contacts the connection seat 41, prevent instantaneous high stress caused by direct contact, and protect the detection probe 31 and the connection seat 41 from damage. In addition, through the elastic deformation of the buffer spring 32, it can be ensured that the detection probe 31 can maintain good contact on different surface morphologies and small unevenness, thereby improving the accuracy and stability of the measurement. In addition, the introduction of the buffer spring 32 reduces the direct hard friction between the detection probe 31 and the connection seat 41, prolongs the service life of the detection probe 31, and reduces the heat and wear generated by friction, which is particularly important in high-frequency or long-term detection tasks.

[0055] See also Figures 1 to 3 As shown, in one embodiment, the base 10 is further connected to a driving member 60 , and the driving member 60 is drivingly connected to the turntable 20 .

[0056] Specifically, according to the requirements of the test system and the size of the load of the turntable 20, an electric motor (such as a DC motor, a stepper motor or a servo motor) can be selected as the driving member 60. The electric motor has the advantages of fast response speed and high control accuracy, and is suitable for accurately controlling the rotation of the turntable 20. The driving member 60 is usually installed on one side of the base 10, and it is ensured that it is stable during operation and does not interfere with the movement of other components. In other words, by automatically driving the turntable 20 to rotate, multiple patch components are tested in sequence, which greatly shortens the test cycle and improves the test efficiency.

[0057] In one embodiment, a transmission tooth is disposed on the outer side of the turntable 20 , and the driving member 60 is a driving gear, which meshes with the transmission tooth for transmission.

[0058] Specifically, the outer side of the turntable 20 is designed with transmission teeth, and the driving member 60 is in the form of a driving gear, and the two are meshed to achieve the rotation of the turntable 20. In addition, the driving gear is flexible, and the driving gear can be connected to a manual shaft or a motor, that is, it can be manually operated or connected to a motor to achieve automatic drive.

[0059] More specifically, through precise tooth shape matching and reasonable tooth number and module design, efficient transmission between the turntable 20 and the drive gear is achieved, reducing energy loss. In addition, the drive gear can be operated manually or connected to a motor for automatic drive, meeting the needs of different test scenarios and improving the flexibility and versatility of the fixture. In automatic mode, through the precise control of the control system, it can be ensured that the parameters such as the rotation angle, speed and stop position of the turntable 20 meet the test requirements, thereby improving the accuracy and reliability of the test. In addition, the design of the manual and automatic switching mechanism allows users to quickly switch operating modes as needed, simplifying the operating process and improving work efficiency.

[0060] See also Figures 1 to 3 As shown, in one embodiment, the base 10 is provided with a mounting column 11 , the mounting column 11 is connected to a ball bearing 12 , and the turntable 20 is rotatably connected to the ball bearing 12 .

[0061] Specifically, the use of the ball bearing 12 significantly reduces the friction and resistance of the turntable 20 during the rotation process, allowing the turntable 20 to rotate more smoothly and flexibly, improving the operability and user experience of the fixture. In addition, the ball bearing 12 can withstand large radial and axial loads, thereby ensuring that the turntable 20 can still maintain a stable rotation state when carrying heavy objects or being subjected to large impact forces, extending the service life of the fixture. In addition, the rolling contact method of the ball bearing 12 reduces the friction noise and vibration during the rotation process, making the fixture quieter and more stable during operation, and improving the overall performance and quality of the fixture.

[0062] In one embodiment, the number of detection probes 31 can be multiple groups to achieve parallel testing of multiple patch components. In other words, through parallel testing, the test time can be significantly shortened and the test efficiency can be improved. At the same time, since multiple patch components can be tested at the same time, the idle time of the test equipment is also reduced. In addition, parallel testing can reduce the number of test equipment and the number of testers, thereby reducing the test cost. In addition, since the test time is shortened, the inventory time and cost of patch components can also be reduced.

[0063] In one embodiment, for polarized chip components, an electrode detection circuit may be provided on the base 10 to detect the positive and negative poles of the chip components.

[0064] Specifically, the base 10 is internally integrated with an electrode detection circuit, which is connected to the pin contact area of ​​the patch component and is used to detect the positive and negative poles of the patch component. The base 10 is provided with contact areas corresponding to the pins of the patch component, which are made of conductive materials to ensure good contact with the pins of the patch component. The core of the electrode detection circuit is a voltage comparator, which is used to compare the voltage difference between the pins of the patch component. Since polar patch components (such as diodes, LEDs, etc.) have specific voltage characteristics between the positive and negative poles, their positive and negative poles can be determined by detecting this voltage difference. For comparison, the electrode detection circuit also includes a reference voltage source. The reference voltage source provides a stable voltage value as a reference for the voltage comparator. When the voltage comparator detects that the voltage difference between the pins of the patch component does not match the voltage value provided by the reference voltage source, it will output a signal indicating that the positive and negative poles of the patch component are not connected correctly, and this signal can be displayed by an LED indicator, a buzzer or other forms of output devices. Among them, by installing the polar patch component in the accommodating cavity and ensuring that its pins are in good contact with the contact area on the base 10. Start the electrode detection circuit, the voltage comparator starts working, and compares the voltage difference between the pins of the SMD components with the voltage value provided by the reference voltage source. According to the output result of the voltage comparator, it is judged whether the positive and negative poles of the SMD components are correctly connected. If the output indication shows that the connection is incorrect, the position of the SMD components needs to be adjusted or reinstalled.

[0065] That is to say, through the electrode detection circuit, it can be ensured that the polarized SMD components are correctly connected to their positive and negative poles during the installation process, thereby avoiding equipment failure or performance degradation caused by incorrect connection. In addition, the electrode detection circuit provides a reliable detection method that can automatically detect and indicate the positive and negative connection status of SMD components, thereby enhancing the overall reliability of the equipment. In addition, the use of electrode detection circuits can simplify the installation process of SMD components and reduce the time and cost of manual inspection. At the same time, due to the automation of the detection process, the risk of human error can also be reduced. In addition, the use of electrode detection circuits can enhance users' trust and satisfaction with the equipment. Users can quickly understand the connection status of SMD components through simple instructions, making it more convenient to use and maintain the equipment.

[0066] See also Figure 5 As shown, an embodiment of the present invention provides a method for using a patch component performance test fixture, comprising the following steps:

[0067] S1, placing components in the receiving cavity of the turntable so that the chip components abut against the connection terminals;

[0068] S2, rotating the rotating disk so that the connecting terminal abuts against the detection probe;

[0069] S3, connect the probe station to the external testing equipment and start the test to complete the performance test of the chip components.

[0070] Specifically, the external detection equipment adopts the existing public equipment, which will not be elaborated in detail here. Among them, by placing components, rotating the turntable, connecting the detection equipment and starting the test, the performance test of the chip components can be realized. This process design greatly simplifies the test operation, reduces manual intervention, and thus improves the test efficiency; in addition, the design of the turntable allows multiple chip components to be placed in the accommodating cavity in sequence, and they can be tested one by one by rotating the turntable, without the need to frequently replace the fixture or components, further improving the test speed; in addition, the components are placed in the accommodating cavity of the turntable, and are connected to the detection probe by abutting against the connection terminal. This contact method ensures the stable transmission of the test signal and reduces the test error caused by poor contact.

[0071] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention may also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. A chip component performance test fixture, characterized in that: include: A base, a turntable and a probe station, wherein the turntable is rotatably connected to the base, the probe station is installed at the bottom of the base, and the probe station is provided with a detection probe, the turntable is provided with a accommodating cavity, the accommodating cavity is used to place chip components, and the bottom of the accommodating cavity is provided with connecting terminals, the chip components abut against the connecting terminals, and the detection probe passes through the base and abuts against the connecting terminals to form conduction, so as to be used for performance testing of the chip components.

2. The chip component performance test fixture according to claim 1, characterized in that: A limiting member is also provided in the accommodating cavity, and the limiting member is used to limit the patch component.

3. The chip component performance test fixture according to claim 2, characterized in that: The limiting component is an elastic clip.

4. The chip component performance test fixture according to claim 1, characterized in that: The connecting terminal comprises a connecting seat, a spring member and a connecting head, one end of the spring member is connected to the connecting seat, and the other end is connected to the connecting head, the connecting head abuts against the patch component, and the connecting seat abuts against the detection probe.

5. The chip component performance test fixture according to claim 4, characterized in that: The rotating disk is located at the connection seat and is also provided with an opening slot adapted for the detection probe.

6. The chip component performance test fixture according to claim 4, characterized in that: A buffer spring is also provided at the bottom of the detection probe.

7. The chip component performance test fixture according to claim 1, characterized in that: The base is also connected to a driving member, and the driving member is drivingly connected to the turntable.

8. The chip component performance test fixture according to claim 7, characterized in that: Transmission teeth are arranged on the outer side of the rotating disk, and the driving member is a driving gear, which is meshed with the transmission teeth for transmission.

9. The chip component performance test fixture according to claim 8, characterized in that: The base is provided with a mounting column, the mounting column is connected with a ball bearing, and the turntable is rotatably connected to the ball bearing.

10. A method for using a chip component performance test fixture, characterized in that: The following steps are involved: Place the components in the accommodating cavity of the turntable so that the chip components abut against the connecting terminals; Rotate the turntable so that the connecting terminal abuts against the detection probe; Connect the probe station to the external testing equipment and start the test to complete the performance test of the chip components.

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