Electronic component and method for operating such an electronic component

Abstract

The electronic component (1) has an integrated circuit (2), a capacitor (3), and a plurality of conductors which are connected to contact elements of the integrated circuit (2) by means of bonding wires. The two conductors are connected to each other via a current path in which a capacitor (3), a first electrically conductive layer (11A) connecting a first connection (3.1) of the capacitor (3) to the first conductor (7A), and a second electrically conductive layer (11B) connecting a second connection (3.2) of the capacitor (3) to the second conductor (7B) are arranged. The integrated circuit (2) has an impedance measuring device (14) which can be connected to the first conductor (7A) by means of a switch in order to measure the impedance between the conductors (7A, 7B) connected to one another by means of a current path. The impedance measuring device (14) is designed to determine an equivalent ohmic series resistance between the conductors (7A, 7B). As a result, the contact quality of the layers (11A, 11B) can be checked.

Description

Technical Field

[0001] The invention relates to an electronic component, comprising at least one integrated circuit (IC), at least one capacitor and a plurality of electrical conductors, each of which has at least one first contact point, which is connected to a contact element of the integrated circuit assigned to the conductor in question by means of a bonding wire or a similar connection, wherein at least two conductors, in addition to the first contact point, each have at least one second contact point, and the second contact points of the conductors are connected to one another by means of at least one current path, in which a capacitor, a first conductive layer connecting a first terminal of the capacitor to a second contact point of the first conductor, and a second conductive layer connecting a second terminal of the capacitor to a second contact point of the second conductor are arranged. The invention also relates to a method for operating such a component. Background Art

[0002] The document US 2018 / 0061784 A1 discloses an electronic component of the type described above, which has a plurality of integrated circuits arranged on a lead frame in an IC housing. The lead frame has a plurality of electrical conductors spaced apart from each other and designed as lead frame contact points, each of which has a first contact point, which is connected to a contact element of an integrated circuit assigned to the relevant conductor via a welding wire. The three conductors each have at least one second contact point in addition to the first contact point. The second contact point of the first conductor is connected to the second contact point of the second conductor via a first capacitor arranged in the IC housing. Accordingly, another second contact point of the second conductor is connected to the second contact point of the third conductor via a second capacitor also arranged in the IC housing.

[0003] The capacitor is set as a stabilizing filter in this configuration and therefore does not participate in the original function of the electrical structural element at all. In an absolutely interference-free environment with an ideal power supply, the capacitor is therefore completely unnecessary for the correct operation of the structural element. In practical applications, however, the environment, especially in the field of automotive electronics, is largely full of interference, which causes undesirable voltage fluctuations not only through large load changes, but also through the radiated coupling into the cable harness. Such effects and phenomena are generally summarized in the concept of electromagnetic compatibility (EMC). This field is extended by the phenomenon of electrostatic discharge (ESD), which is particularly important during assembly and maintenance. For the reliable filtering function of the capacitor, the quality of the electrical connection is particularly important. On the contrary, the insufficient quality of the electrical connection reduces the robustness required by the structural element EMC and ESD.

[0004] Multiple manufacturers of integrated circuits have provided structural elements with integrated capacitors. For example, in the case of an integrated Hall sensor - a combination of the type HAC830 from the applicant (TDK-Micronas GmbH) - two capacitors are respectively integrated into the housing in a hybrid manner together with the sensor IC. This eliminates the need to provide capacitors at the system level. Such an increase in integration generally helps to reduce effort and costs during further processing and in the application of electronic structural elements.

[0005] Thus, for example, a sensor housing is disclosed in the document WO 2007 / 067422 A1, in which it is possible to completely dispense with an external ceramic or PCB (printed circuit board) carrier. On a "lead frame" substrate, the sensor is in electrical and mechanical contact with an ASIC (application specific integrated circuit), a plurality of capacitors, and other components for this purpose. The lead frame consists of a plurality of individual metal lines, which lead outwards from the inside of the encapsulated structural element and serve as connection contact points there. In addition, the metal lines or conductors of the lead frame serve as a mechanical carrier and / or as electrical contact points for different integrated components inside the housing and can also be implemented as wiring inside the housing. For mechanical and / or electrical contact, electrically conductive and non-conductive adhesives are used for this purpose. Alternatively, welding techniques are used to establish the connection. The electrical contact of the integrated circuit or the sensor chip is achieved by means of bonding wires, which are arranged between the pads on the integrated circuit and the contact points on the metal lines or conductors or the connection contact points of the lead frame.

[0006] In a demanding environment, such as automotive electronics, the electrical connections are subjected to particularly high physical loads during use, such as increased absolute temperature or very rapid temperature changes. It is known that such load profiles accelerate the aging process precisely in electrically conductive adhesives, which ultimately leads to a degradation of the contact quality. Summary of the Invention

[0007] The object of the present invention is therefore to implement an electronic structural element of the type mentioned at the beginning and a method for operating such a structural element, which enables: a simple way to determine the degradation of an electrically conductive layer provided for contacting at least one capacitor. This object is required in safety-oriented applications.

[0008] With regard to the structural element, this object is achieved by the features of claim 1. These features provide that the integrated circuit has an impedance measuring device for measuring the impedance between first contact points of conductors connected to one another via at least one current path, at least one measurement signal connection of the impedance measuring device being connectable to at least one of the first contact points by means of at least one switch, and the impedance measuring device being designed to determine an equivalent ohmic series resistance between the first contact points connected to one another via the at least one current path.

[0009] With regard to the method, the above-mentioned object is achieved by means of the features of claim 10. These features provide that the integrated circuit is placed in a test mode, wherein an impedance measuring device present on the integrated circuit switches between the conductors in order to detect an impedance measuring signal on conductors connected to one another via a current path, and an equivalent ohmic series resistance is determined between the conductors connected to one another via the current path using the impedance measuring signal.

[0010] The impedance between conductors connected to one another via a current path can be represented by means of an electrical series equivalent circuit diagram having an ohmic series resistance and a reactance connected in series therewith, the reactance comprising at least one capacitive or capacitive component. The invention is based on the finding that the ohmic series resistance increases (degrades) with increasing age of the electrical component and / or with increasing operating duration, due to degradation of a conductive layer provided between a connection of the capacitor and two contact points of the conductor associated with the connection, while the capacitance of the capacitor remains largely constant.

[0011] Due to the shift in the effective cutoff frequency of the filter with capacitance and ohmic series resistance, the interference generated is no longer suppressed in the desired manner. As a result, the function of the integrated circuit can be affected in the case of a sufficiently large interference exposure. Since the degradation of the conductive layer is a system-inherent property and is also related to the budget of the physical load, the degradation of the conductive layer seems to be unavoidable.

[0012] The contact quality of the electrical connection between the connection terminal of the capacitor and the conductor provided therefor may also be affected by fluctuations related to the manufacturing process. This results in different values ​​for the equivalent ohmic series resistance. Therefore, a higher ohmic electrical connection reaches the critical point of degradation earlier than a relatively low ohmic electrical connection according to experience. The expected life of the integrated circuit for safe operation thus fluctuates proportionally with the initial quality of the electrical connection at the end of manufacturing. In other words, the increase in the initial ohmic series resistance approaches the critical threshold value in the application more quickly.

[0013] By fully integrating the impedance measuring device as a circuit component in the IC, the equivalent ohmic series resistance can also be measured after the initial commissioning of the component and virtually over the entire life of the integrated circuit. In this case, the measurement can be carried out repeatedly at predetermined time intervals if necessary and / or after each switching on of the component before the component starts its normal operation.

[0014] The impedance measuring device according to the invention has at least one switch, by means of which the current path to be checked is connected to the impedance measuring device. It should be noted that the switch can also be fully integrated in an IC in electronic form. It is also possible to provide a plurality of such switches in order to connect further hybrid integrated capacitors to the impedance measuring device.

[0015] Depending on the application, at least one capacitor can also be used as a backup capacitor or decoupling capacitor. In the case of generating a DC voltage for the power supply, these are referred to as smoothing or filter capacitors.

[0016] Capacitors are used to suppress voltage fluctuations on conductors. Not only overvoltage peaks but also undervoltage peaks are prohibited. Voltage stabilization is not limited to the supply voltage, but also to the signal levels of digital inputs and outputs and also to the analog outputs in terms of bandwidth limiting. As a result, not only conducted interference but also coupled interference is suppressed by the filtering effect. In general, capacitors therefore increase the robustness of electronic components in the field of electromagnetic compatibility (EMC) and electrostatic discharge (ESD). The latter is not limited to operational interference alone, but may also damage electronic components. Therefore, the corresponding configuration for external wiring of integrated circuits is usually pre-given or recommended in a specific manner in the manufacturer's data sheet.

[0017] In a preferred embodiment of the present invention, the impedance measuring device has a test signal generator for applying a test signal to at least one capacitor. The test signal can be designed in particular sinusoidally, as a step function or rectangularly. If the test signal is designed in a step-shaped manner, then the equivalent ohmic series resistance can be realized by evaluating the charging curve of the transient charging current of the capacitor.

[0018] Advantageously, the impedance measuring device:

[0019] - a current measuring device for detecting the current flowing between the test signal generator and the conductor to which the test signal is applied,

[0020] a voltage measuring device for detecting the voltage on the conductor to which the test signal is applied, and

[0021] A phase difference measuring device is provided for detecting the phase difference between the current and the voltage. The series resistance can thus be determined from the phase shift and, if applicable, the measured impedance as the real part of the impedance.

[0022] In an advantageous design of the present invention, the integrated circuit has a signal processing mechanism, which is connected to a current measuring mechanism, a voltage measuring mechanism and a phase difference measuring mechanism and is designed to obtain an equivalent ohmic series resistance of an electrical connection between the second contact points of the conductors connected to each other through the at least one capacitor from the detected phase difference, the measured current and the measured voltage. The signal processing mechanism may include, for example, a scanning mechanism, an analog-to-digital converter, a data memory and / or a microprocessor with a program memory. In the case of obtaining the equivalent ohmic series resistance, the capacitance of the capacitor located in the current path and / or the value of the impedance connected in parallel with the current path (for example, the internal resistance of the power supply voltage source connected to the conductor) can be considered. The corresponding value can be stored in the data memory, for example. Alternatively, the parallel impedance can be separated from the current path for the measured period by another switch to be set. This is particularly suitable for the internal resistance of the connected power supply voltage source. The power supply of the IC will then be interrupted on the system side for the measured period. It is determined that it runs with the residual energy stored in the IC in this case, and the result is stored. In the case of reconnection immediately afterwards, the measurement result exists in the manner of the present invention for the adjustment (Abgleich) of the functional test. Such a sequence is advantageous, for example, for any shutdown and restart process of the system.

[0023] By providing at least one further switch, the two inputs of the impedance measuring device can be separated. This allows the current path of the impedance measuring device to be completely isolated. This is necessary, for example, when testing a differentially implemented signal output. In the case of capacitors that are grounded on one side, the measurement is ungrounded on the supply side while separating the grounding.

[0024] In one embodiment of the invention, the impedance measuring device has an output for outputting a measurement signal for the equivalent ohmic series resistance, wherein the integrated circuit has a comparison device, which has a first comparison signal input connected to the output for outputting the measurement signal for the equivalent ohmic series resistance and a second comparison signal input connected to a reference value generator for comparing the equivalent ohmic series resistance with at least one predefined threshold value. In this case, an error state can be indicated and in particular a warning or alarm signal can be output from the electronic component if the threshold value is exceeded. If necessary, the warning or alarm signal can be reset again if the threshold value is undershot.

[0025] The integrated circuit preferably has a data memory in which the determined equivalent ohmic series resistance and / or the result of the comparison performed by means of the comparison device can be stored. It is even possible to store the equivalent ohmic series resistance (R) in the data memory at different times. 3 , R 6 ), read the ohmic series resistance (R 3 , R 6 ) and identify trends in order to indicate, if necessary, that a threshold is about to be exceeded.

[0026] In an advantageous embodiment of the invention, the integrated circuit has at least one magnetic field sensor. The magnetic field sensor can be designed as a Hall sensor or a magnetoresistive sensor. Such a magnetic field sensor can be used in various forms in particular in motor vehicles, for example as a position sensor for detecting a rotation angle or a linear movement or as a position transmitter.

[0027] In a preferred embodiment of the present invention, the component has a closed plastic housing which surrounds the integrated circuit and the at least one capacitor. The integrated circuit and the at least one capacitor are protected from environmental influences by the plastic housing.

[0028] Advantageously, the conductor is designed as a lead frame contact point. This makes it possible to save an additional printed circuit board on which and / or in which the conductor is arranged.

[0029] In another advantageous embodiment of the present invention, the conductor is designed as a printed conductor arranged on and / or in a printed circuit board or has such a printed conductor, wherein the printed conductor is arranged on a printed circuit board surrounded by a plastic housing. At least one of the conductors may include at least two printed conductors, which are connected to each other via at least one welding wire arranged in the housing. It is also advantageous that at least two printed conductors are connected to a lead frame contact point via a welding wire arranged in the plastic housing, and the lead frame contact point preferably has at least one contact surface exposed outside the housing.

[0030] Further advantageous embodiments of the invention are described in the dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Embodiments of the present invention are explained in more detail below with reference to the accompanying drawings. In the accompanying drawings:

[0032] Figure 1 A plan view of a first exemplary embodiment of an electronic component is shown, wherein the housing of the component is shown only in dashed lines along its outer contour;

[0033] Figure 2 Shown from Figure 1 A side view of the electronic structural element in the direction indicated by II;

[0034] Figure 3 Shown from Figure 1 A side view of the electronic structural element in the direction indicated by III;

[0035] Figure 4 A circuit diagram showing an impedance measuring device for determining an equivalent ohmic series resistance of a current path contained in an electronic component in which a respective capacitor is arranged; and

[0036] Figure 5 A second exemplary embodiment of an electronic component is shown in a plan view, wherein the housing of the component is shown transparently. DETAILED DESCRIPTION

[0037] exist Figure 1 The electronic component denoted as a whole by 1 in the figure has a semiconductor chip including an integrated circuit 2, a plurality of capacitors 3, 4, 5, 6 hybrid-integrated into the component 1, and a plurality of electrical conductors 7A, 7B, 7C, 7D, which are designed as lead frame contact points. Each conductor 7A, 7B, 7C, 7D has a first contact point 8A, 8B, 8C, 8D, which is connected to a contact element 10A, 10B, 10C, 10D of the integrated circuit 2, which is assigned to the relevant conductor 7A, 7B, 7C, 7D, and is designed as a soldering pad, via at least one bonding wire 9A, 9B, 9C, 9D.

[0038] Furthermore, each conductor 7A, 7B, 7C, 7D has at least one second contact point 3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D, which is connected to a second contact point 6D, 6B, 5C, 5B, 4C, 4B, 3B, 3A of another conductor 7D, 7C, 7B, 7A via a current path. A capacitor 3, 4, 5, 6 and two conductive layers 11A, 11B, 12A, 12C, 13D, 13B are provided in each current path, and the connection ends 3.1, 3.2, 4.1, 4.2, 5.1, 5.2, 6.1, 6.2 of the capacitor 3, 4, 5, 6 associated with the conductive layer are connected to the second contact points 3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D assigned to the connection ends. The capacitors 3 , 4 , 5 , 6 are used to suppress EMC (electromagnetic compatibility) interference and electrostatic discharge voltage present on the conductors 7A, 7B, 7C, 7D.

[0039] The integrated circuit 2 is designed as a magnetic field sensor, which has a first differential output connected to the first conductor 7A via a first bonding wire 9A, a supply voltage connection for a first supply voltage potential connected to the second conductor 7B via a second bonding wire 9B, a supply voltage connection for a second supply voltage potential connected to the third conductor 7C via a third bonding wire 9C, and a second differential output connected to the fourth conductor 7D via a fourth bonding wire 9D. The magnetic field measurement values ​​can be transmitted from the integrated circuit 2 to an external control device that can be connected to the conductors 7A, 7D via the differential outputs.

[0040] like Figure 2 As can be seen in FIG. 1 , the first connection terminal 3.1 of the first capacitor 3 is connected to the second contact point 3A of the first conductor 7A through the first conductive layer 11A. The second connection terminal 3.2 of the first capacitor 3 is connected to the second contact point 3B of the second conductor 7B through the second conductive layer 11B.

[0041] The first connection terminal 4.1 of the second capacitor 4 is connected to the second contact point 4C of the third conductor 7C through another first conductive layer. The second connection terminal 4.2 of the second capacitor 4 is connected to another second contact point 4B of the second conductor 7B through another second conductive layer.

[0042] The first connection terminal 5.1 of the third capacitor 5 is connected to the second contact point 5C of the third conductor 7C via another first conductive layer 12C. Figure 1 and 3 As can be seen from FIG. 1 , the second connection terminal 5 . 2 of the third capacitor 5 is connected to another second contact point 5B of the second conductor 7B via another second conductive layer 12B.

[0043] As in Figure 3 It can also be seen that the first terminal 6.1 of the fourth capacitor 5 is connected to the second contact point 6D of the fourth conductor 7D via another first conductive layer 13D. The second terminal 6.2 of the fourth capacitor 6 is connected to another second contact point 6B of the second conductor 7B via another second conductive layer 13B.

[0044] In order to measure the impedance between the conductors 7A, 7B, 7C, 7D respectively connected to each other via current paths, the integrated circuit 2 has an impedance measuring device 14. Figure 4As can be seen in FIG. 1 , the impedance measuring device 14 has a first measuring connection 15, which can be selectively or switchably connected to the first contact point 8A of the first conductor 7A, the first contact point 8C of the third conductor 7C or the first contact point 8D of the fourth conductor 7D by means of a first switch 16 designed as a multiplexer. The first contact point 8B of the second conductor 7B can be connected to the second measuring connection 17 of the impedance measuring device 14 via a second switch 16'. If the first measuring connection 15 is connected to the first contact points 8A, 8C, 8D via the first switch 16, the second switch 16' is closed. Otherwise, the second switch 16' is open.

[0045] In order to apply a test signal having an AC voltage component to the measuring connections 15 , 17 , the impedance measuring device 14 has a test signal generator 18 having a first and a second test signal generator connection at which a sinusoidal test voltage can be output.

[0046] The first test signal generator connection is connected to the first measurement connection 15 via a current measuring device 19, and the second test signal generator connection is connected to the second measurement connection 17. The output of the current measuring device 19 is connected to a first input of a phase difference measuring device 20 for outputting a current measurement signal.

[0047] To measure the electrical voltage between the measuring connections 15 and 17, the impedance measuring device 14 has a voltage measuring device 21, which is connected with a first measuring connection to the first test signal generator connection and with a second measuring connection to the second test signal generator connection. The output of the voltage measuring device 21 is connected to a second input of the phase difference measuring device 20 for outputting a voltage measurement signal.

[0048] The output end of the phase difference measuring mechanism 20 is connected to a first input end of a signal processing mechanism 22 in order to output a phase difference measuring signal corresponding to the phase difference between the current measurement signal and the voltage measurement signal. The second input end of the signal processing mechanism 22 is connected to the current measurement signal output end of the current measurement mechanism 19, and the third input end of the signal processing mechanism 22 is connected to the voltage measurement signal output end of the voltage measurement mechanism 21.

[0049] The impedance dependent on the frequency of the test voltage can be expressed as a numerical value of impedance and phase or in the form of a general equivalent circuit diagram consisting of a resistor R, a capacitor C and an inductor L in a series circuit or a cascade circuit. The frequency relationship or frequency characteristic is inherently contained in the representation as an RLC equivalent circuit diagram.

[0050] In the present invention, based on the known structure, a series circuit of an ohmic resistor and a capacitor is used as an equivalent circuit diagram for at least one current path to be checked, which is connected to the measuring terminals 15, 17, and capacitors 3, 4, 5, 6 and first and second conductive layers 11A, 11B, 12B, 12C, 13B, 13D are provided in the current path.

[0051] As a further simplification, a known value can be assumed for the capacitance value, for example the rated value of the capacitor 3, 4, 5, 6 arranged in at least one current path. This assumption makes it possible to carry out measurements at only one frequency with harmonic excitation by the test signal.

[0052] Signal processing device 22 is therefore designed to determine an equivalent ohmic series resistance of at least one equivalent circuit connected between measuring connections 15 , 17 and equivalent to at least one current path connected to measuring connections 15 , 17 , which has a series resistor and a capacitor connected in series therewith.

[0053] The output of the signal processing unit 22 is connected to the first comparison signal input 23 of the comparison unit 24. The second comparison signal input 25 is connected to the reference value generator 26. The output of the comparison unit 24 is used to output a result signal related to the result of the comparison. If the equivalent ohmic series resistance obtained is greater than a predetermined threshold value predefined by the reference value generator 26, the result signal indicates an error. In the case of exceeding the threshold value, the structural element 1 can trigger a warning or alarm signal. It is conceivable that multiple threshold values ​​are also specified. Accordingly, the corresponding warning or alarm signal can be assigned to different levels or priorities.

[0054] The first measuring connection 15 is connected to one of the conductors 7A, 7C, 7D in sequence by means of the switch 16. If the first measuring connection 15 is connected to the first conductor 7A, the impedance measuring device 17 determines the equivalent ohmic series resistance R of the first current path, which includes the first capacitor 3. 3 .

[0055] If the first measuring connection 15 is connected to the third conductor 7C, the impedance measuring device 17 determines the equivalent ohmic series resistance R of the parallel circuit consisting of the second current path with the second capacitor 4 and the third current path with the third capacitor 5. 4 ∙R 5 / (R 4 +R 5 ).

[0056] If the first measuring connection 15 is connected to the fourth conductor 7D, the impedance measuring device 17 determines the equivalent ohmic series resistance R of the current path containing the fourth capacitor 6.6 .

[0057] Alternatively, within the scope of simplifying assumptions, it is also possible to apply a step-shaped test signal to at least one of the current paths and determine the equivalent ohmic series resistance for at least one current path by means of a transient evaluation of the current characteristic curve. The transient current characteristic curve can also be referred to as a charging curve in this configuration.

[0058] The determination of the equivalent ohmic series resistance can be triggered by external control during the operation of the electronic component 1 or can be a component of each functional execution, such as detecting and outputting the magnetic field measurement value of the integrated circuit 2. For this purpose, the integrated circuit 2 can be placed in a mode in which the impedance measuring device is connected to at least one current path to be checked by means of the switch 16. If necessary, the method can also be carried out successively for a plurality of current paths to be checked, which are arranged between different conductors 7A, 7B, 7C, 7D.

[0059] The impedance measuring device 14 can be switched off for the time period during which the integrated circuit 2 is operating in normal measuring mode (measuring the magnetic field). Figure 4 , in which the measuring connection 15 is not connected to any conductor 7A, 7B, 7C, 7D.

[0060] It should be mentioned that, as an alternative to switching off the impedance measuring device 14, components of the integrated circuit 2 that are set up for normal measuring operation of the integrated circuit 2, such as an existing analog-digital converter (ADC) or a configurable digital signal processor (DSP) up to (if present) an integrated microprocessor or microcontroller, can be used in an impedance measuring mode under corresponding configuration. These parts are then components of the impedance measuring device 14 for the period of the impedance measurement. Such an architecture significantly reduces the required circuit expenditure.

[0061] The component 1 has a closed plastic housing 28 which surrounds the integrated circuit 2 and the capacitors 3, 4, 5, 6. Each conductor 7A, 7B, 7C, 7D has a first section surrounded by the plastic housing 28 and at least one second section which is exposed on the plastic housing 28 and / or protrudes therefrom.

[0062] exist Figure 5Another embodiment of the component denoted by 1' in FIG. 1 also has a semiconductor chip including an integrated circuit 2, a plurality of capacitors 3, 4, 5, 6 hybridly integrated into the component 1', and a plurality of electrical conductors 7A, 7B, 7C, 7D. The conductors 7A and 7D are designed as printed conductors, while the conductors 7B and 7C have printed conductors and bonding wires that connect the printed conductors to each other. The printed conductors extend on and / or in a printed circuit board 29. The integrated circuit 2 is also arranged on the printed circuit board 29.

[0063] Each conductor 7A, 7B, 7C, 7D has a first contact point 8A, 8B, 8C, 8C′, 8D, which is connected via at least one bonding wire 9A, 9B, 9C, 9C′, 9D to a contact element of the integrated circuit 2 assigned to the respective conductor 7A, 7B, 7C, 7D and designed as a bonding pad.

[0064] In addition, each conductor 7A, 7B, 7C, 7D has at least one second contact point 3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D, which is connected to a second contact point 6D, 6B, 5C, 5B, 4C, 4B, 3B, 3A of another conductor 7D, 7C, 7B, 7A via a current path. A capacitor 3, 4, 5, 6 and two conductive layers are provided in each current path, and the connection terminals 3.1, 3.2, 4.1, 4.2, 5.1, 5.2, 6.1, 6.2 of the capacitor 3, 4, 5, 6 of the conductive layer are connected to the second contact point 3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D assigned to it. The capacitor 3, 4, 5, 6 is used to suppress EMC interference and electrostatic discharge voltage present on the conductor 7A, 7B, 7C, 7D.

[0065] The conductor tracks of conductors 7A, 7B, 7C, 7D are connected to lead frame contact points 31A, 31B, 31C, 31D via bonding wires 30A, 30B, 30C, 30D arranged in plastic housing 28, each of which has a first section arranged in plastic housing 28 and a second section integrally connected thereto, the second section being arranged outside plastic housing 28.

[0066] In addition, Figure 5 The exemplary embodiment shown in FIG. 1 corresponds essentially to the exemplary embodiment shown in FIG. Figures 1 to 4 The first embodiment is shown in FIG. 1 , so that the description of the first embodiment applies correspondingly to the second embodiment.

Claims

1. An electronic component (1, 1') comprising at least one integrated circuit (2), at least one capacitor (3, 4, 5, 6) and a plurality of electrical conductors (7A, 7B, 7C, 7D), each of which has at least one first contact point (8A, 8B, 8C, 8D) which is connected to a contact element (10A, 10B, 10C, 10D) of the integrated circuit (2) which is associated with the respective conductor (7A, 7B, 7C, 7D) via a bonding wire (9A, 9B, 9C, 9D) or a similar connection, wherein: At least two conductors (7A, 7B, 7C, 7D) each have at least one second contact point (3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D) in addition to the first contact point (8A, 8B, 8C, 8D), and the second contact points (3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D) of the conductors (7A, 7B, 7C, 7D) are connected to each other via at least one current path, in which the second contact points (3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D) are connected to each other via at least one current path. The capacitor (3, 4, 5, 6), a first conductive layer (11A, 12C, 13D) connecting the first connection end (3.1, 4.1, 5.1, 6.1) of the capacitor (3, 4, 5, 6) to the second contact point (3A, 3B, 4B, 4C, 5B, 5C, 6B, 6D) of the first conductor (7A, 7C, 7D) and a second connection end (3.2, 4.3) of the capacitor (3, 4, 5, 6) are provided. .2, 5.2, 6.2) and a second conductive layer (11B, 12B, 13B) connected to a second contact point (3B, 4B, 5B, 6B) of a second conductor (7B), characterized in that the integrated circuit (2) has an impedance measuring device (14), the impedance measuring device is used to measure the impedance between the first contact points (7A, 7C, 7D) of the conductors (7A, 7B, 7C, 7D) connected to each other through the at least one current path, at least one measurement signal connection terminal (15) of the impedance measuring device (14) can be connected to at least one of the first contact points (7A, 7C, 7D) by means of at least one switch (16), and the impedance measuring device (14) is configured to determine an equivalent ohmic series resistance (R3, R6) between the first contact points (8A, 8B, 8C, 8D) connected to each other through the at least one current path.

2. The electronic component (1, 1') according to claim 1, characterized in that The impedance measuring device (14) has a test signal generator (18) for applying a test signal to the at least one capacitor (3, 4, 5, 6).

3. The electronic component (1, 1') according to claim 2, characterized in that The test signal generator (18) is designed to generate a sinusoidal test signal.

4. The electronic component (1, 1') according to claim 2 or 3, characterized in that The impedance measuring device (14): - a current measuring device (19) for detecting the current flowing between the test signal generator (18) and the conductor (3, 4, 5, 6) to which the test signal is applied, - a voltage measuring device (21) for detecting the voltage on the conductors (3, 4, 5, 6) to which the test signal is applied, and A phase difference measuring device (20) is provided for detecting a phase difference between the current and the voltage.

5. The electronic component (1, 1') according to claim 4, characterized in that The integrated circuit (2) has a signal processing device (22) which is connected to a current measuring device (19), a voltage measuring device (21) and a phase difference measuring device (20) and is designed to determine an equivalent ohmic series resistance (R3, R6) of an electrical connection between second contact points (3B, 4B, 5B, 6B) of conductors (7A, 7B, 7C, 7D) connected to each other via the at least one capacitor (3, 4, 5, 6) from a detected phase difference, a measured current and a measured voltage.

6. The electronic component (1, 1') according to any one of claims 1 to 5, characterized in that The impedance measuring device (14) has an output end for outputting a measurement signal for an equivalent ohmic series resistor (R3, R6), and the integrated circuit (2) has a comparison mechanism (24) which, in order to compare the equivalent ohmic series resistor (R3, R6) with at least one predefined threshold value, has a first comparison signal input end (23) connected to the output end for outputting a measurement signal for the equivalent ohmic series resistor (R3, R6) and a second comparison signal input end (25) connected to a reference value generator (26).

7. The electronic component (1, 1') according to claim 6, characterized in that The integrated circuit (2) has a device for outputting an error signal (17) according to a comparison result.

8. The electronic component (1, 1') according to any one of claims 1 to 7, characterized in that The integrated circuit (2) has at least one magnetic field sensor.

9. The electronic component (1, 1') according to any one of claims 1 to 8, characterized in that The component (1) has a closed plastic housing (28) which surrounds the integrated circuit (2) and the at least one capacitor (3, 4, 5, 6).

10. The electronic component (1, 1') according to any one of claims 1 to 9, characterized in that The conductors (7A, 7B, 7C, 7D) are designed as lead frame contact points.

11. The electronic component (1, 1') according to claim 9, characterized in that The conductors (7A, 7B, 7C, 7D) are designed as conductor tracks arranged on and / or in a printed circuit board or have such conductor tracks, and the conductor tracks are arranged on the printed circuit board surrounded by the plastic housing.

12. The electronic component (1, 1') according to claim 11, characterized in that At least one of the conductors (7A, 7B, 7C, 7D) comprises at least two conductor tracks, which are connected to one another via at least one bonding wire arranged in the housing.

13. The electronic component (1, 1') according to claim 11, characterized in that The conductor tracks of at least two conductors (7A, 7B, 7C, 7D) are connected to lead frame contact points via soldering wires arranged in a plastic housing (28), and the lead frame contact points preferably each have at least one contact surface exposed outside the housing.

14. A method for operating an electronic component (1, 1'), comprising at least one integrated circuit (2), at least one capacitor (3) and a plurality of electrical conductors (7A, 7B, 7C, 7D), each of which has at least one first contact point (8A, 8B, 8C, 8D), which is connected to a contact element (10A, 10B, 10C, 10D) of the integrated circuit (2) which is associated with the respective conductor (7A, 7B, 7C, 7D) via a bonding wire (9A, 9B, 9C, 9D) or a similar connection, wherein: At least two conductors (7A, 7B, 7C, 7D) each have at least one second contact point (3B, 4B, 5B, 6B) in addition to the first contact point (8A, 8B, 8C, 8D), wherein the second contact points (3B, 4B, 5B, 6B) of the conductors (7A, 7B, 7C, 7D) are connected to each other via at least one current path, in which the capacitor (3, 4, 5, 6) and a first conductive layer (11A, 12C, 13D) connecting the first connection end (3.1, 4.1, 5.1, 6.1) of the capacitor (3, 4, 5, 6) to the second contact point (3B, 4B, 5B, 6B) of the first conductor (7A, 7C, 7D) are arranged ) and a second conductive layer (11B, 12B, 13B) connecting the second connection end of the capacitor (3, 4, 5, 6) to the second contact point (3B, 4B, 5B, 6B) of the second conductor (7B), characterized in that the integrated circuit (2) is placed in a test mode, in which an impedance measuring device (14) present on the integrated circuit (2) switches between the conductors (7A, 7B, 7C, 7D) in order to detect an impedance measurement signal on the conductors (7A, 7B, 7C, 7D) connected to each other via a current path, and an equivalent ohmic series resistance (R3, R6) between the conductors (7A, 7B, 7C, 7D) connected to each other via the current path is determined using the impedance measurement signal.

15. The method according to claim 14, characterized in that In the test mode, a test signal is applied to the current path.

16. The method according to claim 15, characterized in that The test signal is sinusoidal and determines the equivalent ohmic series resistance (R3, R6) by measuring and evaluating a current characteristic and / or a voltage characteristic and a phase difference between the current characteristic and the voltage characteristic of the test signal.

17. The method according to claim 15, characterized in that The test signal is step-shaped and the equivalent ohmic series resistance (R3, R6) is realized by evaluating the charging curve of the transient charging current of the capacitor (3, 4, 5, 6).

18. The method according to any one of claims 14 to 17, characterized in that The determined equivalent ohmic series resistance ( R3 , R6 ) is compared with a predefined threshold value and an exceeding and / or undershooting of the threshold value is detected.

19. The method according to claim 18, characterized in that A result signal, in particular an error signal, is generated as a function of the result of the threshold value comparison and is output from the electronic component (1) and / or stored in a data memory of the integrated circuit (2), and / or the determined equivalent ohmic series resistance (R3, R6) is stored in the data memory.

20. The method according to claim 19, characterized in that The equivalent ohmic series resistance (R3, R6) is stored in the data memory at different times, the ohmic series resistance (R3, R6) is read from the data memory and a trend is identified for it, and when a trend indicating an increase in the equivalent ohmic series resistance (R3, R6) is identified, it is indicated that the threshold value is about to be exceeded.

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