Display substrate, manufacturing method thereof and display device

Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display device, and the display substrate comprises a substrate; the wiring structure is positioned on the substrate; the wiring structure comprises a driving part and a binding part, the driving part is used for being connected with a light-emitting device, and the binding part is used for being connected with a driving device. The protection structure is located on the surface of the side, away from the substrate, of the binding part; the protection structure is made of an inorganic material. According to the display substrate, the protection structure is arranged on the binding part, so that the exposed binding part wires can be prevented from being in contact with etching liquid when other film layers in the display substrate are etched subsequently, the influence on the conductivity of the display substrate is prevented, and the display substrate can have relatively good reliability.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate, a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) devices are widely used in flexible display products because of their self-luminescence, wide viewing angle, bendability and flexibility. Due to the requirements for the aesthetics and display effects of display products, the pursuit of narrow-frame design of display products is the current development trend. Flexible screen packaging (Chip On Plastic, COP) technology directly bends a part of the flexible display device so that the COP area, i.e., the area bound to the driver device, is located on the non-display side of the device, so that the driver chip can be set on the non-display side of the device, which greatly saves the wiring space around the display area and realizes an extremely narrow frame design.

[0003] At present, the routing in the COP area can usually be made synchronously with the driving circuit routing, and then the light-emitting device is made above the routing. When etching other film layers in subsequent steps, the COP routing may react with the etching solution, affecting its reliability. Summary of the invention

[0004] The present invention provides a display substrate, a manufacturing method thereof and a display device, wherein the display substrate has a protection structure to protect the wiring of the COP area, prevent the COP wiring from contacting and reacting with etching liquid, thereby ensuring that the display substrate can have good conductive performance.

[0005] A first aspect of the present invention provides a display substrate, comprising:

[0006] substrate substrate;

[0007] A wiring structure is located on the substrate; the wiring structure includes a driving part and a binding part, the driving part is used to connect the light emitting device, and the binding part is used to connect the driving device;

[0008] The protection structure is located on the surface of the binding portion which is away from the substrate; the protection structure is made of inorganic material.

[0009] In some embodiments of the present invention, the material used for the routing structure includes a first metal material; the inorganic material includes a conductive material, the conductive material includes a second metal material, and the reducing property of the first metal material is stronger than that of the second metal material.

[0010] In some embodiments of the present invention, the light emitting device is located on a side of the driving part away from the base substrate, and the light emitting device includes a first electrode layer, a light emitting layer, and a second electrode layer which are sequentially away from the driving part;

[0011] The material used for the first electrode layer includes a third metal material, the reducing property of the third metal material is stronger than that of the second metal material, or the second metal material and the third metal material are the same.

[0012] In some embodiments of the present invention, the material used for the first electrode layer is the same as the material used for the protection structure; the first electrode layer and the protection structure are arranged on the same layer.

[0013] In some embodiments of the present invention, the routing structure includes a first metal layer, a second metal layer, and a third metal layer that are sequentially away from the base substrate; the orthographic projection of the third metal layer on the base substrate falls within the range of the orthographic projection of the second metal layer on the base substrate;

[0014] The reducing property of the material of the second metal layer is stronger than that of the material of the first metal layer and the material of the third metal layer.

[0015] In some embodiments of the present invention, the second metal layer is made of the first metal material, and the first metal layer and the third metal layer are made of a third metal material.

[0016] In some embodiments of the present invention, the third metal material is titanium.

[0017] In some embodiments of the present invention, the wiring in the binding portion includes a pad and a connecting wire, and the driving device is connected to the connecting wire through the pad;

[0018] The protection structure covers the area of ​​the second metal layer at the pad that is not in contact with the first metal layer and the third metal layer;

[0019] Alternatively, the orthographic projection of the protection structure on the substrate completely covers the orthographic projection of the pad on the substrate.

[0020] In some embodiments of the present invention, the protection structure also covers an area of ​​the second metal layer at the connection line that is not in contact with the first metal layer and the third metal layer;

[0021] Alternatively, the orthographic projection of the protection structure on the base substrate completely covers the orthographic projection of the connection line on the base substrate.

[0022] In some embodiments of the present invention, the protection structure includes a first conductive layer, a second conductive layer, and a third conductive layer which are sequentially away from the base substrate; and the second conductive layer is made of the second metal material.

[0023] In some embodiments of the present invention, the material of the first conductive layer and the third conductive layer includes indium tin oxide.

[0024] In some embodiments of the present invention, the first metal material includes aluminum.

[0025] In some embodiments of the present invention, the second metal material includes one or more of silver, platinum, and gold.

[0026] In some embodiments of the present invention, the inorganic material includes silicon nitride or silicon oxide.

[0027] A second aspect of the present invention provides a display device, comprising any one of the above-mentioned display substrates.

[0028] A third aspect of the present invention provides a method for manufacturing a display substrate, comprising:

[0029] A wiring structure is formed on the substrate; the wiring structure includes a driving part and a binding part, and the material used by the wiring structure includes a first metal material;

[0030] forming a conductive material layer on the wiring structure; the conductive material layer comprises a second metal material, and the reducibility of the second metal material is weaker than that of the first metal material;

[0031] coating a photoresist on the conductive material layer;

[0032] The conductive material layer is wet-etched to form a first electrode layer and a protection structure; the first electrode layer is located on a side of the driving portion away from the base substrate, and the protection structure is located on a side of the binding portion away from the base substrate.

[0033] The beneficial effects of the present invention are as follows:

[0034] The present invention provides a display substrate, a manufacturing method thereof and a display device, wherein the display substrate comprises: a base substrate; a wiring structure located on the base substrate; the wiring structure comprises a driving part and a binding part, the driving part is used to connect a light-emitting device, and the binding part is used to connect a driving device; a protective structure is located on the surface of the binding part away from the base substrate; the protective structure is made of inorganic materials. The protective structure is provided on the binding part, so that the exposed wiring of the binding part can be prevented from contacting with the etching liquid when etching other film layers in the display substrate, thereby preventing the conductive performance of the display substrate from being affected, and the display substrate can have better reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings introduced below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0036] Figure 1 A schematic diagram of the structure of the wiring structure provided by an embodiment of the present invention;

[0037] Figure 2 A schematic diagram of the overall structure of a display substrate provided by an embodiment of the present invention;

[0038] Figure 3 A schematic diagram of the cross-sectional structure of a display substrate provided by an embodiment of the present invention;

[0039] Figure 4 It is a top view of the local structure of the binding part wiring in the related art;

[0040] Figure 5 for Figure 4 Schematic diagram of the structure of the C-C' section;

[0041] Figure 6 for Figure 1 One of the structural diagrams of the D-D' section or the E-E' section;

[0042] Figure 7 for Figure 1 The second structural diagram of the D-D' section or the E-E' section;

[0043] Figure 8 for Figure 1 The third structural diagram of the D-D' section or the E-E' section;

[0044] Fig. 9 A schematic diagram of a manufacturing process of a display substrate provided by an embodiment of the present invention;

[0045] Fig.10 One of the schematic diagrams of the manufacturing process of the display substrate provided by the embodiment of the present invention;

[0046] Fig.11 A second schematic diagram of a manufacturing process of a display substrate provided by an embodiment of the present invention;

[0047] Description of reference numerals:

[0048] 100-substrate, 200-wiring structure, 210-driving part, 220-binding part, 22-binding part wiring, 230-first fan-out area, 240-bending area, 250-second fan-out area, 221-pad, 222-connecting line, 223-driving chip, 201-first metal layer, 202-second metal layer, 203-third metal layer, 300-light-emitting device, 310-first electrode layer, 320-light-emitting layer, 330-second electrode layer, 400-packaging layer, 500-protection structure, 501-first conductive layer, 502-second conductive layer, 503-third conductive layer, 600-conductive material layer, 700-photoresist. DETAILED DESCRIPTION

[0049] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below with reference to the accompanying drawings and examples. However, the exemplary embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the exemplary embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained using the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship and do not represent the true proportions.

[0050] The display device includes a display substrate for realizing the display function, and a light-emitting device and a driver device are arranged on the display substrate. The driver device is electrically connected to the light-emitting device through a wiring structure in the display substrate, and transmits a driving signal to the light-emitting device to drive the light-emitting device to emit light. Usually, the wiring structure on the display substrate needs to be gathered at the edge of the display substrate in order to bind devices such as the driver chip (IC) and the control circuit board. Therefore, a certain amount of wiring space is usually required around the display area of ​​the display substrate, resulting in a larger frame of the display substrate and the display device, affecting the product appearance and display effect.

[0051] By using the flexible screen packaging (COP) technology to directly bend a part of the flexible display device and bind the driving devices such as the driving chip to the back of the device, the wiring space in the edge area of ​​the display device can be greatly saved and an extremely narrow frame design can be achieved.

[0052] Figure 1 A schematic diagram of the structure of a wiring structure provided in an embodiment of the present invention.

[0053] like Figure 1 As shown, the display substrate provided by the embodiment of the present invention includes a base substrate 100 and a wiring structure 200 located on the base substrate 100 .

[0054] The substrate 100 may be a flexible substrate, for example, a flexible material such as polyimide (PI), polyethylene terephthalate (PET), etc.

[0055] The wiring structure 200 includes a driving part 210 and a binding part 220, wherein the driving part 210 is used to connect the light-emitting device to realize the display function. The driving part 210 may include a plurality of different types of signal lines, such as a power signal line, a common potential signal line, a scanning signal line, a data signal line, etc. Each signal line is used to transmit a driving signal to the light-emitting device. The type and wiring method of the signal line in the driving part 210 can be designed according to specific needs, and the embodiment of the present invention is not limited here. The binding part 220 is used to connect a driving device, such as a driving chip and a control circuit board. The wiring in the binding part 220 (hereinafter referred to as the binding part wiring 22) includes a pad 221 and a connecting line 222, wherein the pad 221 can be used to connect the driving chip, and the connecting line 222 is used to transmit the driving signal. The driving device is connected to the connecting line 222 through the pad 221.

[0056] In a specific implementation, a plurality of functional modules may be included between the driving part 210 and the binding part 220, and each driving part wiring 222 is connected to the signal line in the driving part 210 through the wiring in each functional module, so that the driving signal provided by the driving device can be transmitted to the light-emitting device. Figure 1 A possible implementation is shown as an example. Figure 1 As shown, the driving part 210 and the binding part 220 may include a first fan-out area 230, a bending area 240 and a second fan-out area 250. Among them, the first fan-out area 230 is located on the display side surface of the display substrate, and is used to gather the wiring in the driving part 210. The bending area 240 can be bent to bend the binding part 220 to the non-display side of the display substrate, thereby reducing the space in the edge area of ​​the display side surface, which is conducive to realizing an extremely narrow frame design. In the second fan-out area 250, the wiring can be further gathered to connect with the connecting wire 222 and the pad 221 in the binding part 220. In a specific implementation, the wiring method between the driving part 210 and the binding part 220 can also be designed according to requirements, and the embodiment of the present invention is not limited here.

[0057] Figure 2 A schematic diagram of the overall structure of a display substrate provided by an embodiment of the present invention; Figure 3 A schematic diagram of the cross-sectional structure of a display substrate provided by an embodiment of the present invention.

[0058] like Figure 2 and Figure 3As shown, in the embodiment of the present invention, the display substrate further includes a light emitting device 300 and a driving chip 223, wherein the light emitting device 300 is located on the side of the driving part 210 away from the base substrate 100, and the driving chip 223 is located on the side of the binding part 220 away from the base substrate 100. In addition, the display substrate can be made by using COP packaging technology, the driving part 210 and the light emitting device 300 are located on the display side of the display substrate, and the binding part 220 and the driving chip 223 are located on the non-display side of the display substrate.

[0059] Specifically, refer to Figure 3 The light emitting device 300 includes a first electrode layer 310, a light emitting layer 320, and a second electrode layer 330 which are sequentially away from the driving unit 210, wherein the first electrode layer 310 can be used as an anode layer of the light emitting device 300, and the second electrode layer 330 can be used as a cathode layer of the light emitting device 300. In the display substrate of the COP package, the light emitting layer 320 can be made of an organic light emitting material, and the light emitting device 300 is an organic light emitting device. The light emitting layer 320 of the light emitting device 300 is usually divided into a plurality of light emitting pixels arranged in an array, and correspondingly, the first electrode layer 310 also needs to be pixelated to drive each light emitting pixel to emit light, and the second electrode layer 330 can adopt a whole layer structure or can be pixelated.

[0060] When manufacturing a display substrate, firstly, a wiring structure 200 is formed on the base substrate 100, and then the first electrode layer 310, the light-emitting layer 320 and the second electrode layer 330 of the light-emitting device 300 are sequentially formed on the driving part 210 of the wiring structure 200, and the driving chip 223 is bound to form a display substrate. Figure 2 The structure shown will be Figure 2 The display substrate shown in FIG. 1 can be bent to form a Figure 3 The structure shown.

[0061] Among them, the driving part 210 routing may include multiple conductive layers, and the binding part routing 22 is usually arranged and manufactured in the same layer as the metal layer in the driving part 210 close to the light-emitting device 300. In the completed binding part routing 22, at least part of the pads 221 need to be exposed. In this way, when the first electrode layer 310 of the light-emitting device 300 is subsequently manufactured by a wet etching process, the etching solution may react with the exposed part of the binding part routing 22, affecting its reliability.

[0062] Figure 4 It is a top view of the local structure of the binding part wiring in the related art; Figure 5 for Figure 4 Schematic diagram of the structure of the C-C' section.

[0063] Figure 4 and Figure 5 The structure of the pad 221 in the binding portion trace 22 is shown. Figure 4 and Figure 5 As shown, in the related art, the pad 221 can generally adopt a structure formed by stacking three layers of metal, which are respectively a first metal layer 201, a second metal layer 202 and a third metal layer 203 in a direction gradually away from the base substrate 100. The three layers of metal materials are titanium (Ti), aluminum (Al), and titanium (Ti) respectively, and the pad 221 is also covered with a packaging layer 400.

[0064] The first electrode layer 310 is usually formed by stacking three layers of conductive materials. In the direction away from the driving unit 210, the three layers of conductive materials of the first electrode layer 310 are indium tin oxide (ITO), silver (Ag), and indium tin oxide (ITO) in sequence. When the first electrode layer 310 is wet-etched, the etching solution will contain silver ions (Ag). + ), the Al in the pad 221 is exposed to the outside and in contact with the etching solution, which will react with the Ag + A substitution reaction occurs to form silver particles. The chemical reaction formula is as follows: AL+3Ag + →AL 3+ +3Ag.

[0065] Reference Figure 4 In the related art, the replaced silver particles may be adsorbed between adjacent pads 221, and the silver particles overlap each other, resulting in a short circuit problem. If the connecting wire 222 is also exposed, the above problem will also occur. Figure 5 The replaced silver particles may also be adsorbed on the pad 221, causing the silver particles to pierce the encapsulation layer 400 when the encapsulation layer 400 is subsequently formed, resulting in water vapor invading the interior of the display substrate and corroding the wiring. The silver particles may also flow with the etching solution to other wirings of the display substrate, which will also cause damage to the encapsulation layer 400.

[0066] Figure 6 for Figure 1 One of the structural diagrams of the D-D' section or the E-E' section; Figure 7 for Figure 1 The second structural diagram of the D-D' section or the E-E' section.

[0067] like Figure 6 and Figure 7 As shown, in the embodiment of the present invention, a protective structure 500 is arranged on the surface of the binding part away from the base substrate 100, and the protective structure 500 at least covers the part of the binding part wiring 22 that can undergo a replacement reaction with the metal ions in the etching solution, and the protective structure 500 itself cannot react with the metal ions in the etching solution, thereby avoiding the short circuit problem caused by the overlapping of the above-mentioned metal particles and the problem of damaging the packaging layer 400, thereby ensuring the performance of the display substrate.

[0068] In the embodiment of the present invention, the material used for the protection structure 500 is an inorganic material, which may be silicon nitride or silicon oxide, or the inorganic material may include a conductive material, which may be one or more of a metal or a metal oxide. Figure 6 As shown in the structure, the protection structure 500 can be made of conductive material or non-conductive inorganic material; Figure 7 In the structure shown, the protection structure 500 is made of conductive material to ensure that the driving device can be electrically connected to the binding portion wiring 22 through the protection structure 500.

[0069] In some embodiments, the material used in the routing structure 200 includes a first metal material, and the material used in the protection structure 500 includes a second metal material, and the reducing property of the first metal material is stronger than that of the second metal material, so the second metal material is more difficult to undergo a replacement reaction with the metal ions in the etching solution, and the second metal material is covered on the first metal material to protect the first metal material. Exemplarily, the first metal material can be aluminum (Al), copper (Cu), etc., and the second metal material can be silver (Ag), platinum (Pt), gold (Au), etc.

[0070] In some embodiments, the material used for the wiring structure 200 includes the first metal material mentioned above, the material used for the protection structure 500 includes the second metal material mentioned above, and the material used for the first electrode layer 310 located on the wiring structure driving part 210 includes a third metal material, and the reducing property of the third metal material is stronger than that of the second metal material, or the second metal material can be the same as the third metal material. In this way, when etching the first electrode layer 310, the etching solution will include the third metal material in ionic form, but because the reducing property of the second metal material is relatively weak, the third metal material in the etching solution cannot be replaced, thereby avoiding the short circuit problem caused by the overlap of the above-mentioned metal particles and the problem of damaging the packaging layer 400. Exemplarily, the third metal material can be silver (Ag), platinum (Pt), gold (Au), etc.

[0071] In some embodiments, the material used for the first electrode layer 310 can be exactly the same as the material used for the protective structure 500. In this case, the first electrode layer 310 can be set on the same layer as the protective structure 500, and the first electrode layer 310 and the protective structure 500 can be manufactured through a single patterning process, thereby simplifying the process flow and reducing production costs.

[0072] like Figure 6 and Figure 7As shown, the routing structure may include a first metal layer 201, a second metal layer 202 and a third metal layer 203 which are sequentially away from the base substrate 100, wherein the orthographic projection of the third metal layer 203 on the base substrate 100 falls within the range of the orthographic projection of the second metal layer 202 on the base substrate 100, the orthographic projection of the second metal layer 202 on the base substrate 100 falls within the range of the orthographic projection of the first metal layer 201 on the base substrate 100, and the reducibility of the material of the second metal layer 202 is stronger than that of the material of the first metal layer 201 and the material of the third metal layer 203.

[0073] In some embodiments, the second metal layer 202 can be made of a first metal material, the first metal layer 201 and the third metal layer 203 can be made of a fourth metal material, and the reducing property of the first metal material is stronger than that of the fourth metal material, that is, the first metal material is more active than the fourth metal material. The fourth metal material is arranged on the surface of the first metal material to play a certain protective role. At the same time, the structure of stacking multiple layers of metal materials is conducive to improving the conductive performance of the routing structure 200.

[0074] In a specific implementation, the metal materials used by the first metal layer 201 and the third metal layer 203 can be the same or different, and the number of metal layers of the routing structure 200 can also be adjusted according to needs, which is not limited in the embodiment of the present invention. For example, the first metal material can be aluminum (Al), and the fourth metal material can be titanium (Ti).

[0075] In this way, part of the second metal layer 202 will be exposed. When the first electrode layer 310 is wet-etched, if the reducing property of the second metal layer material is stronger than that of the first electrode layer material, a replacement reaction will occur with the first electrode layer material in ionic form in the etching solution, resulting in the above-mentioned short circuit problem caused by the overlapping of metal particles and damage to the packaging layer 400.

[0076] In some embodiments, it is only necessary to expose the pad 221 for connecting the driver chip. Figure 6 and Figure 7 Corresponds to Figure 1 D-D' section, refer to Figure 6 In some embodiments, the protection structure 500 covers at least the area where the second metal layer 202 at the pad 221 is not in contact with the first metal layer 201 and the third metal layer 203, or, referring to Figure 7 In some embodiments, the protection structure 500 may cover each pad 221 , that is, the orthographic projection of the protection structure 500 on the base substrate 100 completely covers the orthographic projection of the pad 221 on the base substrate 100 .

[0077] In some embodiments, the connecting wire 222 may also be exposed. Figure 6 and Figure 7 It can also correspond to Figure 1 The E-E' section in Figure 6 In some embodiments, the protection structure 500 covers at least the area where the second metal layer 202 at the connection line 222 is not in contact with the first metal layer 201 and the third metal layer 203, or, referring to Figure 7 In some embodiments, the protection structure 500 can cover each connecting line 222, that is, the orthographic projection of the protection structure 500 on the base substrate 100 completely covers the orthographic projections of the first metal layer 201, the second metal layer 202 and the third metal layer 203 on the base substrate 100 at the connecting line 222.

[0078] In the embodiment of the present invention, a protective structure 500 is provided on the pad 221 and / or the connecting wire 222 of the binding portion wiring 22, so that when the first electrode layer 310 is wet-etched, the protective structure 500 can isolate the binding portion wiring 22 from the etching solution, so that the two cannot contact each other, thereby avoiding the two from reacting. In specific implementation, when the reducing property of the metal on the top layer of the binding portion wiring 22 is stronger than the reducing property of the first electrode layer material, it is also necessary to adopt the following method: Figure 7 A protective structure 500 is shown.

[0079] Figure 8 for Figure 1 The third structural diagram of the D-D' section or the E-E' section.

[0080] like Figure 8 As shown, in the embodiment of the present invention, the protection structure 500 may include a first conductive layer 501, a second conductive layer 502, and a third conductive layer 503 that are sequentially away from the base substrate 100, and the orthographic projection of the protection structure 500 on the base substrate 100 completely covers the orthographic projections of the first metal layer 201, the second metal layer 202, and the third metal layer 203 in the binding portion 220 on the base substrate 100. The protection structure 500 covers the binding portion wiring 22 and is made of conductive material, so that the driving device 221 can be electrically connected to the binding portion wiring 22 through the protection structure 500.

[0081] In some embodiments, the second conductive layer 502 can be made of a second metal material, and the materials of the first conductive layer 501 and the third conductive layer 503 can be made of conductive materials such as metals or metal oxides, and the reducibility of the materials of the first conductive layer 501 and the third conductive layer is weaker than that of the materials of the second conductive layer. Since the second metal material is relatively more active, the first conductive layer 501 and the third conductive layer 503 can also play a certain protective role on the second metal material. At the same time, the structure of stacking multiple layers of metal materials is conducive to improving the conductive performance of the protective structure 500. For example, Figure 6As shown in the structure, the protection structure 500 may also be formed by stacking a plurality of conductive layers, which will not be described in detail here.

[0082] In a specific implementation, the materials used for the first conductive layer 501 and the third conductive layer 503 can be the same or different, and the number of conductive layers in the protective structure 500 can also be adjusted according to needs, which is not limited in the embodiment of the present invention. Exemplarily, the second metal material used for the second conductive layer 502 can be silver (Ag), and the first conductive layer 501 and the third conductive layer 503 can be indium tin oxide (ITO).

[0083] It can be understood that, based on the inventive concept of the present invention, for a non-COP packaged display substrate, a protective structure can also be set around the more active metal layer in the routing structure to avoid the metal in the routing structure and the ions in the etching solution from undergoing a replacement reaction when etching the subsequent film layer, thereby ensuring the stable performance of the display substrate and improving its reliability.

[0084] Based on the same inventive concept, an embodiment of the present invention further provides a display device, which includes any one of the above-mentioned display substrates. The display device can have better reliability.

[0085] Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display substrate.

[0086] Fig. 9 A schematic diagram of the manufacturing process of a display substrate provided by an embodiment of the present invention.

[0087] like Fig. 9 As shown, the manufacturing process of the display substrate provided by the embodiment of the present invention may include the following steps:

[0088] S1, forming a wiring structure on a substrate;

[0089] S2, forming a conductive material layer on the wiring structure;

[0090] S3, coating a photoresist on the conductive material layer;

[0091] S4, wet-etching the conductive material layer to form a first electrode layer and a protective structure;

[0092] S5, removing the photoresist;

[0093] S6, forming a light-emitting layer on the first electrode layer;

[0094] S7, forming a second electrode layer on the light-emitting layer;

[0095] S8. Forming a packaging layer on the second electrode layer and the protection structure.

[0096] Fig.10One of the schematic diagrams of the manufacturing process of the display substrate provided by the embodiment of the present invention; Fig.11 The second schematic diagram of the manufacturing process of the display substrate provided by the embodiment of the present invention.

[0097] Fig.10 and Fig.11 The manufacturing process from step S1 to step S5 is illustrated by the structural changes in the area corresponding to the binding portion.

[0098] Reference Figure 1 to Figure 3 , Fig.10 and Fig.11 In step S1, the base substrate 100 may be a flexible substrate, the material used by the wiring structure 200 includes at least a first metal material, and the wiring structure 200 formed after completing step S1 includes a driving part 210 and a binding part 220, and the binding part wiring 22 includes a pad 221 and a connecting line 22, which are arranged in the same layer. In a specific implementation, the driving part 210 may include multiple conductive layers, and the binding part wiring 22 may be made in the same layer as the conductive layer in the upper layer of the driving part 210.

[0099] In step S2 , the conductive material layer 600 at least includes a second metal material, and the reducibility of the second metal material is weaker than that of the first metal material.

[0100] In step S3 and step S4, the first electrode layer 310 is located on the side of the driving part 210 away from the base substrate 100, the protective structure 500 is located on the side of the binding part 220 away from the base substrate 100, and the orthographic projection of the protective structure 500 on the base substrate 100 coincides with the orthographic projection of the photoresist 700 covering the binding part wiring 22 on the base substrate 100.

[0101] Taking the case where the wiring structure includes the first metal layer 201, the second metal layer 202 and the third metal layer 203, and the second metal layer 202 is made of the first metal material as an example, Fig.10 The protective structure 500 and the photoresist 700 may cover the exposed second metal layer 202, or, referring to Fig.11 The orthographic projections of the protection structure 500 and the photoresist 700 on the base substrate 100 can completely cover the orthographic projections of each metal layer of the routing structure 200 on the base substrate 100 .

[0102] When the conductive material layer 600 is wet-etched, the second metal material in ionic form will exist in the etching solution, and the first metal material can undergo a replacement reaction with the second metal material. The embodiment of the present invention covers the exposed first metal material with a protective structure 500 and a photoresist 700, which can isolate the first metal material and the etching solution, thereby preventing the metal particles replaced by the reaction between the two from affecting the conductive performance and stability of the display substrate.

[0103] Moreover, in the embodiment of the present invention, the first electrode layer 310 and the protection structure 500 can be formed through a single patterning process. The protection structure 500 can be formed under the original process flow to protect the wiring structure 200, which is beneficial to improving the reliability of the display substrate, simplifying the manufacturing process and saving manufacturing costs.

[0104] Reference Figure 1 to Figure 3 , Figure 6 and Figure 7 In step S6, the light-emitting layer 320 can be made of organic light-emitting materials and formed on the first electrode layer 310 by an evaporation process. In step S7, the second electrode layer 330 can be provided as a whole layer and formed on the light-emitting layer 320 by an evaporation process, or it can also be etched so that the second electrode layer 330 has a pixelated structure. After completing step S7, the first electrode layer 310, the light-emitting layer 320 and the second electrode layer 330 constitute the light-emitting device 300, wherein the first electrode layer 310 can be used as the anode layer of the light-emitting device 300, and the second electrode layer 330 can be used as the cathode layer of the light-emitting device 300. The encapsulation layer 400 formed in step S8 covers the light-emitting device 300, the binding part wiring 22 and the protective structure 500, which can prevent water and oxygen from entering the interior of the display substrate and affecting its performance. Before step S8, it also includes connecting the driving chip 223 to the pad 221 of the binding part 220, and after step S8, it also includes bending the display substrate to form a structure as shown in FIG. Figure 3 The structure shown.

[0105] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0106] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display substrate, It is characterized in that include: substrate substrate; A wiring structure is located on the substrate; the wiring structure includes a driving part and a binding part, the driving part is used to connect the light emitting device, and the binding part is used to connect the driving device; The protection structure is located on the surface of the binding portion which is away from the substrate; the protection structure is made of inorganic material.

2. The display substrate according to claim 1, It is characterized in that The material used in the wiring structure includes a first metal material; the inorganic material includes a conductive material, the conductive material includes a second metal material, and the reducing property of the first metal material is stronger than that of the second metal material.

3. The display substrate according to claim 2, It is characterized in that The light emitting device is located at a side of the driving part away from the base substrate, and the light emitting device comprises a first electrode layer, a light emitting layer and a second electrode layer which are sequentially away from the driving part; The material used for the first electrode layer includes a third metal material, the reducing property of the third metal material is stronger than that of the second metal material, or the second metal material and the third metal material are the same.

4. The display substrate according to claim 3, It is characterized in that The material used for the first electrode layer is the same as the material used for the protection structure; the first electrode layer and the protection structure are arranged on the same layer.

5. The display substrate according to claim 2, It is characterized in that The routing structure comprises a first metal layer, a second metal layer and a third metal layer which are sequentially away from the base substrate; the orthographic projection of the third metal layer on the base substrate falls within the range of the orthographic projection of the second metal layer on the base substrate; The reducing property of the material of the second metal layer is stronger than that of the material of the first metal layer and the material of the third metal layer.

6. The display substrate according to claim 5, It is characterized in that The second metal layer is made of the first metal material, and the first metal layer and the third metal layer are made of a fourth metal material.

7. The display substrate according to claim 6, It is characterized in that The fourth metal material is titanium.

8. The display substrate according to claim 5, It is characterized in that The wiring in the binding portion includes a pad and a connecting wire, and the driving device is connected to the connecting wire through the pad; The protection structure covers the area of ​​the second metal layer at the pad that is not in contact with the first metal layer and the third metal layer; Alternatively, the orthographic projection of the protection structure on the substrate completely covers the orthographic projection of the pad on the substrate.

9. The display substrate according to claim 8, It is characterized in that The protection structure also covers the area where the second metal layer at the connection line is not in contact with the first metal layer and the third metal layer; Alternatively, the orthographic projection of the protection structure on the base substrate completely covers the orthographic projection of the connection line on the base substrate.

10. The display substrate according to claim 2, It is characterized in that The protection structure comprises a first conductive layer, a second conductive layer and a third conductive layer which are sequentially away from the base substrate; the second conductive layer is made of the second metal material.

11. The display substrate according to claim 10, It is characterized in that The materials of the first conductive layer and the third conductive layer include indium tin oxide.

12. The display substrate according to any one of claims 2 to 11, It is characterized in that The first metal material includes aluminum.

13. The display substrate according to claim 12, It is characterized in that The second metal material includes one or more of silver, platinum and gold.

14. The display substrate according to claim 1, It is characterized in that The inorganic material includes silicon nitride or silicon oxide.

15. A display device, It is characterized in that It comprises the display substrate as claimed in any one of claims 1 to 14.

16. A method for manufacturing a display substrate, It is characterized in that include: A wiring structure is formed on the substrate; the wiring structure includes a driving part and a binding part, and the material used by the wiring structure includes a first metal material; forming a conductive material layer on the wiring structure; The conductive material layer includes a second metal material, and the reducibility of the second metal material is weaker than that of the first metal material; coating a photoresist on the conductive material layer; The conductive material layer is wet-etched to form a first electrode layer and a protection structure; the first electrode layer is located on a side of the driving portion away from the base substrate, and the protection structure is located on a side of the binding portion away from the base substrate.

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