CCGA reworking tool

Abstract

The invention discloses a CCGA reworking tool which comprises an inner heat insulation cover, the periphery of the inner heat insulation cover is sleeved with an outer heat insulation cover, a hot runner is reserved between the periphery of the inner heat insulation cover and the inner surface of the outer heat insulation cover, and a butt joint pipe is fixedly connected between the top of the inner heat insulation cover and the top of an inner cavity of the outer heat insulation cover. The top of the outer heat insulation cover communicates with a hot air inlet pipe, and the bottom of the outer heat insulation cover is further provided with a heat flow guide piece. According to the CCGA reworking tool, the CCGA device is shielded through the inner heat insulation cover, direct heating of the CCGA device is avoided, under cooperation of the outer heat insulation cover and the heat flow guiding piece, the environment where a welding spot is located is surrounded, the welding spot is directly heated, and therefore the damage risk caused by long-time heating of the CCGA device can be avoided, and the service life of the CCGA device is prolonged. In addition, disturbance to the PCB and other devices on the PCB can be effectively reduced, operation is simple, and meanwhile safe and convenient support is provided for reworking processing of the CCGA device.

Description

Technical Field

[0001] The present invention relates to the technical field of CCGA processing, and specifically to a CCGA rework tooling fixture. Background Art

[0002] Ceramic Column Grid Array, abbreviated as CCGA, is a ceramic column grid array packaging technology, which is usually used in fields such as military equipment and aerospace, because this packaging form can adapt to the thermal stress mismatch caused by different thermal expansion coefficients between the PCB and the ceramic housing / substrate. CCGA packaging can achieve high density, high reliability, and large-size packaging and assembly. This technology uses slender solder columns to replace traditional solder balls, and the solder columns have good creep resistance, thereby improving the reliability of the packaging.

[0003] With the wide application of CCGA, its related assembly and rework technologies are also constantly developing. When reworking CCGA, it is necessary to remove it from the loaded printed circuit board. Since the solder joints between its solder columns and the printed circuit board are fixed, a heating tool or device needs to be used to blow hot air on the device. When the conventional nozzle tooling fixture is heating, the hot air is directly blown on the device body rather than the solder joints after being introduced through the air inlet. It takes a long time to heat up before the solder joints can be melted and desoldered through the conduction of the device and the temperature rise inside the cavity. There is a risk that the device may be damaged due to excessive heating time, and it is easy to cause damage to the PCB and other devices on it. For this reason, a CCGA rework tooling fixture is specifically proposed to avoid the possibility of heat damage to CCGA devices due to excessive heating time, and at the same time reduce the disturbance to the PCB and other devices on it. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a CCGA rework tooling fixture, which solves the problems that when traditional CCGA devices are reworked, there is a risk of CCGA device damage due to excessive heating time, and it is easy to cause damage to the PCB and other devices on it.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A CCGA rework tooling fixture includes an inner heat insulation cover, an outer heat insulation cover is sleeved on the outer periphery of the inner heat insulation cover, and a heat flow channel is provided between the outer periphery of the inner heat insulation cover and the inner surface of the outer heat insulation cover. A docking pipe is fixedly connected between the top of the inner heat insulation cover and the top of the inner cavity of the outer heat insulation cover. A hot air inlet pipe is communicated with the top of the outer heat insulation cover, and a heat flow guiding member is further provided at the bottom of the outer heat insulation cover.

[0006] The present invention is further configured as: The heat flow guiding member includes an expansion frame, a square groove is opened at the bottom of the expansion frame, a telescopic square frame is slidably installed inside the square groove, and a rectangular guiding cushion frame is fixedly connected to the bottom of the telescopic square frame; A gasket is also fixedly installed on the top of the telescopic square box, and the gasket is arranged inside the square groove. The gasket is made of fluororubber material.

[0007] The present invention is further configured as: the extension frame is sleeved on the outer periphery of the inner heat insulation cover and fixedly installed at the bottom of the outer heat insulation cover.

[0008] The present invention is further configured as: height adjusting members are arranged on both sides of the extension frame. The height adjusting member includes a fixed plate and a sliding plate. A lead screw is rotatably installed at the top of the sliding plate through a bearing. The top end of the lead screw penetrates through the fixed plate and is threadedly connected to the fixed plate, and the top end of the lead screw is fixedly connected to a knob.

[0009] The present invention is further configured as: the two fixed plates are respectively fixedly installed on both sides of the extension frame, the two sliding plates are respectively fixedly installed on both sides of the telescopic square box, and sliding grooves for cooperating with the sliding plates are respectively opened at the bottoms of both sides of the extension frame.

[0010] The present invention is further configured as: a diffusion cone is fixedly installed on the top of the inner heat insulation cover, and the diffusion cone is arranged directly below the hot gas inlet pipe.

[0011] The present invention is further configured as: a workpiece picking and placing member is arranged on the top of the outer heat insulation cover. The workpiece picking and placing member includes a square air hood, and a connecting flange pipe is communicated with the top of the square air hood; The square air hood is fixedly installed on the top of the outer heat insulation cover, and the square air hood is arranged on the outer periphery of the hot gas inlet pipe.

[0012] The present invention is further configured as: four first air guide holes communicated with the docking pipe are opened on the top of the outer heat insulation cover, and the four first air guide holes are all arranged inside the square air hood. Four second air guide holes communicated with the docking pipe are opened on the top of the inner heat insulation cover.

[0013] The present invention provides a CCGA rework tooling. It has the following beneficial effects: (1) In the present invention, the inner heat insulation cover shields the CCGA device to avoid directly heating the CCGA device. With the cooperation of the outer heat insulation cover and the heat flow guiding member, the environment where the solder joints are located is surrounded, and the solder joints are directly heated. This can not only avoid the damage risk caused by long-term heating of the CCGA device, but also effectively reduce the disturbance to the PCB and other devices thereon. While the operation is simple, it provides safe and convenient support for the rework treatment of the CCGA device.

[0014] (2) Through the setting of the height adjusting member, the present invention provides support for the effective enclosure of the CCGA device by the inner heat insulation cover. At the same time, it can also adapt to the height difference caused by solder columns of different heights, providing convenient conditions for the heat flow to heat the solder joints.

[0015] (3) Through the provision of the workpiece pick-up and placement member, and in conjunction with the first air guide hole and the second air guide hole, the present invention enables the convenient pick-up and placement of CCGA devices, making it more convenient to use. Description of the Drawings

[0016] Figure 1 is a schematic diagram of the external structure of the present invention; Figure 2 is a schematic diagram of the internal structure of the present invention; Figure 3 is a schematic diagram of the internal structure in the working state in the embodiment of the present invention; Figure 4 is a schematic diagram of the structure of the heat flow guiding member of the present invention.

[0017] In the figure: 1, inner heat insulation cover; 101, diffusion cone; 102, second air guide hole; 2, outer heat insulation cover; 201, first air guide hole; 3, hot runner; 4, docking pipe; 5, hot gas inlet pipe 6, heat flow guiding member; 601, expansion frame; 602, square groove; 603, telescopic square frame; 604, rectangular guiding gasket frame; 605, sealing gasket; 606, sliding groove; 7, height adjusting member; 701, fixing plate; 702, sliding plate; 703, lead screw; 704, knob; 8, workpiece pick-up and placement member; 801, square air hood; 802, connecting flange pipe. Detailed Embodiment

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention.

[0019] Please refer to Figures 1-4 , the embodiment of the present invention provides the following technical solutions: A CCGA rework tooling includes an inner heat insulation cover 1, an outer heat insulation cover 2 is sleeved on the outer periphery of the inner heat insulation cover 1, and a hot runner 3 is provided between the outer periphery of the inner heat insulation cover 1 and the inner surface of the outer heat insulation cover 2. A docking pipe 4 is fixedly connected between the top of the inner heat insulation cover 1 and the top of the inner cavity of the outer heat insulation cover 2, and a hot gas inlet pipe 5 is communicated with the top of the outer heat insulation cover 2. Among them, the inner heat insulation cover 1 is used to provide top isolation protection for the CCGA device. After the hot gas enters through the hot gas inlet pipe 5, it heats the solder joints through the hot runner 3, facilitating the rework of the CCGA device. Further, in order to reduce the thermal shock of the hot gas on the inner heat insulation cover 1, a diffusion cone 101 is fixedly installed on the top of the inner heat insulation cover 1, and the diffusion cone 101 is arranged directly below the hot gas inlet pipe 5.

[0020] As a preferred solution, in order to ensure that the heat flow can effectively contact the solder joints, a heat flow guide 6 is further provided at the bottom of the outer heat shield 2. Specifically, the heat flow guide 6 includes an expansion frame 601. The expansion frame 601 is sleeved on the outer periphery of the inner heat shield 1 and is fixedly installed at the bottom of the outer heat shield 2. A square groove 602 is opened at the bottom of the expansion frame 601. A telescopic square frame 603 is slidably installed inside the square groove 602. A rectangular guide gasket frame 604 is fixedly connected to the bottom of the telescopic square frame 603. A sealing gasket 605 is fixedly installed at the top of the telescopic square frame 603, and the sealing gasket 605 is arranged inside the square groove 602. The sealing gasket 605 is made of fluororubber material.

[0021] Further explanation, the maximum thickness dimension of the rectangular guide gasket frame 604 is 0.5 mm.

[0022] As a preferred solution, in order to adapt to the rework of CCGA devices corresponding to solder columns of different heights, height adjusters 7 are provided on both sides of the expansion frame 601. The height adjusters 7 include fixing plates 701 and sliding plates 702. The two fixing plates 701 are respectively fixedly installed on both sides of the expansion frame 601. The two sliding plates 702 are respectively fixedly installed on both sides of the telescopic square frame 603. And sliding grooves 606 that cooperate with the sliding plates 702 are opened at the bottoms of both sides of the expansion frame 601. A lead screw 703 is rotatably installed at the top of the sliding plate 702 through a bearing. The top end of the lead screw 703 penetrates through the fixing plate 701 and is threadedly connected to the fixing plate 701. And a knob 704 is fixedly connected to the top end of the lead screw 703.

[0023] It should be noted that the telescopic adjustment of the telescopic square frame 603 can only be achieved by synchronously rotating the two knobs 704 to ensure the stability of the telescopic square frame 603 after height adjustment.

[0024] As a preferred solution, in order to facilitate the convenient picking and placing of CCGA devices, a workpiece picking and placing member 8 is provided at the top of the outer heat shield 2. The workpiece picking and placing member 8 includes a square air hood 801. A connecting flange pipe 802 is communicated with the top of the square air hood 801. The square air hood 801 is fixedly installed at the top of the outer heat shield 2. And the square air hood 801 is arranged on the outer periphery of the hot air inlet pipe 5. Four first air guide holes 201 communicated with the docking pipe 4 are opened at the top of the outer heat shield 2. All four first air guide holes 201 are arranged inside the square air hood 801. Four second air guide holes 102 communicated with the docking pipe 4 are opened at the top of the inner heat shield 1.

[0025] During use, as shown in the appendix Figure 3As shown, place the CCGA device B inside the inner heat insulation cover 1. Then, synchronously rotate the two knobs 704. The knobs 704 drive the lead screw 703 to rotate. With the cooperation of the fixed plate 701, the lead screw 703 pushes the slide plate 702 to slide downward along the chute 606. The two slide plates 702 drive the telescopic square frame 603 to move the rectangular guide pad frame 604 downward until it contacts the printed circuit board A. After the error between the distance between the lower edge of the inner heat insulation cover 1 and the printed circuit board A and the height of the solder column C is within 0 - 0.1 mm, the height adjustment is completed. Hot air enters between the outer heat insulation cover 2 and the inner heat insulation cover 1 through the hot air inlet pipe 5, falls on the diffusion cone 101 and is dispersed into the hot runner 3. Under the guidance of the rectangular guide pad frame 604, the hot air flows to the solder joint D. After the solder joint D melts, the external air nozzle sucks air through the connecting flange pipe 802 to create a negative pressure environment inside the inner heat insulation cover 1, sucking the CCGA device B and the solder column C. Remove the tooling, and the separation of the CCGA device B from the printed circuit board A is completed. When the external air nozzle supplies air through the connecting flange pipe 802, the separation of the CCGA device B from the tooling can be achieved.

[0026] For further explanation, apply solder on the pads of the printed circuit board A, mount the CCGA device B to be replaced, and repeat the above operations to perform heating and soldering.

[0027] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non - exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not explicitly listed, or elements inherent to such process, method, article or device.

[0028] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A CCGA rework tool, characterized by: The invention comprises an inner heat insulation cover (1), wherein an outer heat insulation cover (2) is sleeved on the outer periphery of the inner heat insulation cover (1), and a hot flow channel (3) is provided between the outer periphery of the inner heat insulation cover (1) and the inner surface of the outer heat insulation cover (2), a butt joint pipe (4) is fixedly connected between the top of the inner heat insulation cover (1) and the top of the inner cavity of the outer heat insulation cover (2), a hot air inlet pipe (5) is connected to the top of the outer heat insulation cover (2), and a heat flow guide (6) is also provided at the bottom of the outer heat insulation cover (2).

2. A CCGA rework tool according to claim 1, characterized in that: The heat flow guide (6) comprises an expansion frame (601), a square groove (602) is provided at the bottom of the expansion frame (601), a telescopic square frame (603) is slidably mounted inside the square groove (602), and a rectangular guide pad frame (604) is fixedly connected to the bottom of the telescopic square frame (603); A sealing gasket (605) is also fixedly mounted on the top of the telescopic square frame (603), and the sealing gasket (605) is arranged inside the square groove (602). The sealing gasket (605) is made of fluororubber material.

3. A CCGA rework tool according to claim 2, characterized in that: The expansion frame (601) is sleeved on the outer periphery of the inner heat insulation cover (1) and is fixedly mounted on the bottom of the outer heat insulation cover (2).

4. A CCGA rework tool according to claim 2, characterized in that: Both sides of the expansion frame (601) are provided with height adjustment members (7), the height adjustment members (7) comprising a fixed plate (701) and a slide plate (702), a screw rod (703) being rotatably mounted on the top of the slide plate (702) via a bearing, the top end of the screw rod (703) passing through the fixed plate (701) and being threadedly connected to the fixed plate (701), and a knob (704) being fixedly connected to the top end of the screw rod (703).

5. A CCGA rework tool according to claim 4, characterized in that: The two fixing plates (701) are respectively fixedly mounted on the two sides of the expansion frame (601), the two sliding plates (702) are respectively fixedly mounted on the two sides of the telescopic square frame (603), and the bottoms of the two sides of the expansion frame (601) are provided with sliding grooves (606) for use with the sliding plates (702).

6. The CCGA rework tool according to claim 1, characterized in that: A diffusion cone (101) is fixedly mounted on the top of the inner heat insulation cover (1), and the diffusion cone (101) is arranged directly below the hot air inlet pipe (5).

7. The CCGA rework tool according to claim 1, characterized in that: A workpiece picking and placing component (8) is provided on the top of the outer heat insulation cover (2), wherein the workpiece picking and placing component (8) comprises a square air cover (801), and the top of the square air cover (801) is connected to a connecting flange pipe (802); The square air hood (801) is fixedly mounted on the top of the outer heat insulation hood (2), and the square air hood (801) is arranged on the outer periphery of the hot air inlet pipe (5).

8. A CCGA rework tool according to claim 7, characterized in that: The top of the outer heat insulation cover (2) is provided with four first air guide holes (201) in communication with the butt joint tube (4); the four first air guide holes (201) are all arranged inside the square air cover (801); the top of the inner heat insulation cover (1) is provided with four second air guide holes (102) in communication with the butt joint tube (4).

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