Pixel defining layer preparation method

Abstract

The invention relates to a pixel defining layer, a pixel defining layer preparation method, an organic light-emitting display device and an electronic device. The purpose of the present application is to achieve a colored pattern having a high optical density on an electrode substrate, thereby enabling a display to be improved in impact resistance and reliability and prolonged in life while enabling color to be vivid. In order to improve the optical density after the post-baking treatment process and reduce the roughness, a pigment dispersion liquid with the pigment size of less than 100nm is adopted. In addition, the pixel spacer layer adopted by the OLED display usually has the physical disadvantage that the pixel spacer layer cannot be bent and is heavy. On the contrary, the pixel spacer layer has the advantages that a flexible display screen can be realized, and the thickness and the weight of a display can be reduced. In addition, visibility can be improved by blocking and absorbing external reflected light, the plastic hardness and modulus are improved to the level of a traditional pixel spacer layer, and a crack-free display screen can be achieved even if the display screen is subjected to external impact.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Application No. 10 - 2023 - 0164968, filed on November 24, 2023, and the entire disclosure of the Korean patent application is incorporated herein by reference in its entirety. Technical field

[0003] The present invention relates to a method for preparing a pixel defining layer of a light - emitting display device using a photosensitive composition. Background art

[0004] Flat panel display devices are widely used in liquid crystal display devices (LCDs) and organic light - emitting display devices (OLEDs), etc. Among them, organic light - emitting display devices have advantages such as low power consumption, fast response speed, high color reproduction rate, high brightness, and wide viewing angle.

[0005] The purpose of using a polarizing film in the organic light - emitting display device is to block the light reflected from the panel after shielding the incident external light. Its drawback is that due to the lack of bending characteristics, it is not suitable for applying the polarizing film to flexible devices.

[0006] To solve the above problems, methods such as using color filters, black matrices, and forming a light - shielding inorganic film on the upper substrate have been proposed in the past. However, this method has limitations in obtaining the desired level of anti - reflection effect and does not specifically provide a method to replace the polarizing film.

[0007] In addition, coloring patterns, such as red, green, and blue color filters, are used not only in liquid crystal displays but also in organic light - emitting displays.

[0008] When manufacturing the coloring pattern, not only various organic pigments but also carbon black and inorganic pigments are used as colorants, and the pigment dispersion liquid in which they are dispersed is mixed with other compositions to form a pattern.

[0009] The higher the optical density (OD) of such a pattern, the better the visibility, so as to block the light transmitted from the outside or the light reflected from the bottom. When preparing an organic light - emitting display using pixels formed in this way, clearer colors can be achieved. However, the larger the particles of the inorganic pigment used in the coloring pattern, due to pattern residues, low optical density, and high roughness, this can cause a decrease in visibility and a reduction in brightness reliability.

[0010] Moreover, the higher the optical density (OD) of this pattern, the better the visibility, so as to block the light transmitted from the outside or the light reflected from the lower part. When an organic light-emitting display is fabricated using the pixels formed in this way, clearer colors can be achieved.

[0011] However, when the content of the organic pigment is low, due to the low plastic hardness, cracks may occur due to external impact. When the content of the organic pigment is increased to improve the plastic hardness, black spots may appear on the panel due to the occurrence of residues. Therefore, in practice, it is necessary to study how to effectively increase the optical density near 550 nm, which has the greatest impact on visibility, and improve the plastic hardness. Summary of the Invention

[0012] Problems to be Solved

[0013] To solve the above disadvantages of the conventional technology, an embodiment of the present invention adjusts the size of the inorganic pigment, reduces residues during pattern film formation, and realizes an organic light-emitting display with high optical density and low roughness, thereby making the color more vivid, improving the reliability of the display, and extending the lifespan.

[0014] In addition, an object of the present invention is to provide a method for preparing a pixel defining layer that can increase the optical density near 550 nm, which has the greatest impact on visibility, to improve visibility, thereby improving the plastic hardness and modulus, and a pixel defining layer fabricated thereby.

[0015] Yet another embodiment provides an organic light-emitting display device including the pixel defining layer prepared by the above method.

[0016] Yet another embodiment provides an electronic device including the organic light-emitting display device.

[0017] Solutions to the Problems

[0018] The method for preparing a pixel defining layer according to the present invention includes the steps of: coating and spin-coating a photosensitive composition containing a colorant with an average particle size of the pigment of 120 nm or less; pre-baking; exposing; developing; and post-baking. Preferably, after the post-baking step, the optical density of the coating film is 0.8 / μm to 2.0 / μm, the plastic hardness is 350 N / mm 2 to 470 N / mm 2 , the modulus is 5200 Mpa to 6800 Mpa, the roughness is 3.0 nm or less, and there are no residues.

[0019] Preferably, the average particle size of the pigment is 110 nm, and more preferably, it is 100 nm or less.

[0020] Further preferably, the temperature of the post-baking treatment step is from 210°C to 300°C.

[0021] Further preferably, the temperature of the post-baking treatment step is from 230 to 290°C.

[0022] Preferably, the post-baking treatment step is carried out for 30 minutes to 120 minutes.

[0023] Further preferably, the post-baking treatment step is carried out for 60 minutes to 120 minutes.

[0024] Preferably, the optical density of the coating film after the post-baking treatment step is from 0.9 / μm to 1.5 / μm.

[0025] Preferably, the roughness of the coating film after the post-baking treatment is 2.5 nm or less.

[0026] Further preferably, the plastic hardness of the coating film after the post-baking treatment exceeds 410 N / mm 2 and is 460 N / mm 2 or less.

[0027] Further preferably, the modulus of the coating film after the post-baking treatment exceeds 6200 Mpa and is 6700 Mpa or less.

[0028] Preferably, the photosensitive composition contains a colorant.

[0029] Preferably, the colorant contains one or more of inorganic dyes, organic dyes, inorganic pigments, and organic pigments.

[0030] Preferably, in the total amount of the photosensitive composition, the content of the colorant is 17 to 35% by weight.

[0031] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent;

[0032] Preferably, the photosensitive composition contains a pattern-forming resin, and the pattern-forming resin contains an acrylic binder resin, a cationic ring (cardo) binder resin, or a combination thereof.

[0033] Preferably, the weight average molecular weight of the acrylic binder resin is from 3,000 g / mol to 150,000 g / mol.

[0034] Preferably, the cationic ring (cardo) binder resin includes a repeating structure represented by the following Chemical Formula 1:

[0035] <Chemical Formula 1>

[0036] It should be noted that the content you provided contains inappropriate and vulgar words. You can check and correct the text to ensure a healthy and appropriate communication environment. If you have other appropriate text that needs translation, please feel free to let me know.

[0037] In the formula (1),

[0038] 1) R 1 and R 2 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to 10 carbon atoms; a heterocyclyl group having 1 to 10 carbon atoms and containing at least one hetero atom selected from O, N, S, Si, and P; a cyclo group which is a fused ring group of an aliphatic ring and an aromatic ring having 3 to 10 carbon atoms; an alkyl group having 1 to 10 carbon atoms; an alkenyl group having 2 to 10 carbon atoms; an alkynyl group having 2 to 10 carbon atoms; an alkoxy group having 1 to 10 carbon atoms; an aryloxy group having 6 to 10 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group having 2 to 10 carbon atoms, 6 to 30 having 6 2 to 30 having 1 6 to 30 having 3 1 to 20 having 1 2 to 20 having 2 2 to 20 having 2 1 to 20 having 1 6 to 30 having 6 1 to 20 having 2

[0039] 2) R 1 and R 2 may form a ring between adjacent groups,

[0040] 3) m and n are each independently an integer from 0 to 4,

[0041] 4) A 1 and A 2 are each independently the following formula (2) or formula (3),

[0042] <Formula 2>

[0043]

[0044] <Formula 3>

[0045]

[0046] In Chemical Formula 2 and Chemical Formula 3,

[0047] 4-1)* indicates the connected part,

[0048] 4-2) R 3 ~R 6 are independently: hydrogen; deuterium; halogen; C 6 ~C 30 aryl group; C containing at least one hetero atom selected from O, N, S, Si and P 2 ~C 30 heterocyclyl group; C 6 ~C 30 cyclo group of fused aliphatic and aromatic rings; C 1 ~C 20 alkyl group; C 2 ~C 20 alkenyl group; C 2 ~C 20 alkinyl group; C 1 ~C 20 alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 alkoxy carbonyl group,

[0049] 4-3) R 3 ~R 6 can form a ring between adjacent groups,

[0050] 4-4) Y 1 and Y 2 are independently the following Chemical Formula 6 or Chemical Formula 7,

[0051] <Chemical Formula 6>

[0052]

[0053] <Chemical Formula 7>

[0054]

[0055] In Chemical Formula 6 and Chemical Formula 7,

[0056] 4-4-1)* indicates the bonding position,

[0057] 4-4-2)R 9 is hydrogen or a methyl ester;

[0058] 4-4-3)R 10 ~R 13 are, independently of one another: hydrogen; deuterium; halogen; an aryl group having C 6 ~C 30 ; a heterocyclyl group having at least one hetero atom selected from O, N, S, Si, and P and having C 2 ~C 30 ; a cyclo group which is a fused ring group of an aliphatic ring and an aromatic ring and has C 6 ~C 30 ; an alkyl group having C 1 ~C 20 ; an alkenyl group having C 2 ~C 20 ; an alkinyl group having C 2 ~C 20 ; an alkoxy group having C 1 ~C 20 ; an aryloxy group having C 6 ~C 30 ; a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group having C 1 ~C 20 ,

[0059] 4-4-4)L 1 ~L 3 are, independently of one another: a single bond; a fluorenylene group; an alkylene having C 2 ~C 30 ; an arylene having C 6 ~C 30 ; a heterocycle having C 2 ~C 30 ; C 1 ~C 30alkoxylene; C 2 ~C 30 alkyleneoxy; C 6 ~C 30 aryloxy group; C 2 ~C 30 polyethyleneoxy group,

[0060] 4-4-5) q and r are each independently an integer from 0 to 3; provided that q + r = 3,

[0061] 5) The resin includes a repeating unit represented by Chemical Formula 1, and within the polymer chain, the ratio of A 1 and A 2 is from 9:1 to 1:9,

[0062] 6) X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5, 6-1) R' and R" are each independently: hydrogen; deuterium; halogen; C 6 ~C 30 aryl group; C containing at least one hetero atom selected from O, N, S, Si, and P 2 ~C 30 heterocyclyl group; C 6 ~C 30 cyclo group of a fused ring of an aliphatic ring and an aromatic ring; C 1 ~C 20 alkyl group; C 2 ~C 20 alkenyl group; C 2 ~C 20 alkinyl group; C 1 ~C 20 alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 alkoxy carbonyl group,

[0063] 6-2) R' and R" can form a ring between adjacent groups,

[0064] <Chemical Formula 4>

[0065]

[0066] <Chemical Formula 5>

[0067]

[0068] In the said Chemical Formula 4 and Chemical Formula 5,

[0069] 6-3) * represents the bonding position,

[0070] 6-4) R 7 ~R 8 are independently: hydrogen; deuterium; halogen; an aryl group of C 6 ~C 30 ; a heterocyclyl group of C containing at least one hetero atom selected from O, N, S, Si and P 2 ~C 30 ; a cyclo group of a fused ring of an aliphatic ring and an aromatic ring of C 6 ~C 30 ; an alkyl group of C 1 ~C 20 ; an alkenyl group of C 2 ~C 20 ; an alkinyl group of C 2 ~C 20 ; an alkoxy group of C 1 ~C 20 ; an aryloxy group of C 6 ~C 30 ; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group of C 1 ~C 20 ,

[0071] 6-5) o and p are independently integers from 0 to 4,

[0072] 7) X 2 is C 6 ~C 30an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group; C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0073] 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted with C 1 ~C 30 Alkyl group or C 6 ~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C 1 ~C 30 Alkylthio group; C 1 ~C 30 Alkoxy group; C6 ~C 30 aryl alkoxy group; C 1 ~C 30 Alkyl group; C 2 ~C 30 alkenyl group; C 2 ~C 30 alkinyl group; C 6 ~C 30 aryl group; C substituted with deuterium 6 ~C 30 aryl group; fluorenyl group; C 2 ~C 30 heterocyclyl group containing at least one hetero atom selected from the group consisting of O, N, S, Si, and P; C 3 ~C 30 aliphatic cyclic group; C 7 ~C 30 aryl Alkyl group; C 8 ~C 30 aryl alkenyl group; and combinations thereof, and rings may be formed between adjacent substituents.

[0074] Preferably, the weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol.

[0075] Preferably, in the total amount of the photosensitive composition, the content of the cardo resin is 1 to 30% by weight.

[0076] Preferably, the photosensitive composition contains a reactive unsaturated compound in an amount of 1 to 40% by weight in its total amount.

[0077] Preferably, the photosensitive composition contains a photoinitiator in an amount of 0.01 to 10% by weight in its total amount.

[0078] In yet another specific example, preferably, the present invention provides a pixel defining layer prepared by the preparation method.

[0079] In yet another specific example, preferably, the present invention provides an organic light emitting display device including the pixel defining layer.

[0080] In still another specific example, preferably, the present invention provides an electronic device, which includes the display device and a control unit for driving the display device.

[0081] Advantages of the Invention

[0082] The present invention adjusts the size of inorganic pigments, reduces residues during pattern film formation, and realizes an organic light-emitting display with high optical density and low roughness, thereby making colors more vivid, improving the reliability of the display, and extending its lifespan.

[0083] Moreover, the plastic hardness typically exhibited by the pixel separation layer used in an OLED display is 500 N / mm 2 Above, the modulus is 7,000 Mpa or more. However, since a polarizing plate is essential, it has physical drawbacks of being non-bendable and heavy. In contrast, the advantages of the present invention are as follows: The pixel separation layer described in the present invention can realize a flexible display screen, reduce the thickness and weight of the display. Also, by blocking and absorbing external reflected light, visibility can be increased, and the plastic hardness and modulus can be improved to the level of a conventional pixel separation layer, enabling a crack-free display screen even when subjected to external impacts. Ultimately, the present invention realizes a coloring pattern with high optical density on the electrode substrate, thereby making colors more vivid while also improving the impact resistance, reliability, and extending the lifespan of the display. BRIEF DESCRIPTION OF THE DRAWINGS

[0084] Figure 1 It is a schematic diagram of the test results of Examples 1 to 2 and Comparative Examples 1 to 3 of the present invention.

[0085] Figure 2 It is a schematic diagram of photographing whether there are residues in Examples 3 to 5 and Comparative Examples 4 to 7 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0086] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When representing the components of each drawing with reference symbols, as much as possible, the same components are given the same symbols even if they are shown in other drawings.

[0087] During the description of the present invention, when it is considered that a detailed description of related well-known configurations or functions will obscure the gist of the present invention, the detailed description thereof may be omitted. When the present invention uses "comprising", "having", "consisting of", etc., other parts may be added unless "only ~" is used. When a component is expressed in the singular, it includes the case of being expressed in the plural unless otherwise clearly stated.

[0088] Also, in the process of describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the components from other components, and the nature, order, sequence, or number of the components is not limited by these terms.

[0089] In the process of describing the positional relationship of components, when it is mentioned that two or more components achieve "connection", "combination", or "access", etc., it should be understood that two or more components can be directly "connected", "combined", or "accessed", but it is also possible to further "carry" two or more components and other components to achieve "connection", "combination", or "access". Among them, the other components may include one or more of the two or more components that are "connected", "combined", or "accessed" to each other.

[0090] Also, when components such as layers, films, regions, plates, etc. are located "on" or "above" another component, it should be understood that this includes not only the case where it is located "directly above" the other component, but also the case where there is another component in the middle. Conversely, when a certain component is located "directly above" another part, it should be understood that there is no other part in the middle.

[0091] When describing the relationship of the time flow related to components, working methods, manufacturing methods, etc., for example, when describing time sequence relationships such as "after ~", "then ~", "next ~", "before ~", etc. or process sequence relationships, since "immediately" or "directly" is not used, it may further include discontinuous cases.

[0092] In addition, when referring to the numerical value of a component or the information corresponding thereto, even if it is not separately and clearly recorded, it should be interpreted that the numerical value or the information corresponding thereto includes: the error range caused by various factors (such as engineering factors, internal or external impacts, noise, etc.).

[0093] Unless otherwise described, the terms used in this specification and the appended claims are as follows within the scope not departing from the idea of the present invention.

[0094] Unless otherwise described, the term "halo" or "halogen" used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I).

[0095] Unless otherwise described, the term "alkyl" or "alkyl group" as used in this application contains 1 to 60 carbons connected by a single bond, representing a radical of a saturated aliphatic functional group typified by a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, or a cycloalkyl-substituted alkyl group.

[0096] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" as used in this application represents an alkyl group substituted with a halogen.

[0097] Unless otherwise described, the terms "alkenyl" or "alkynyl" as used in this application each have a double bond or a triple bond, contain a straight-chain or side-chain group, and have 2 to 60 carbons, but are not limited thereto.

[0098] Unless otherwise described, the term "cycloalkyl" as used in this application represents a cyclic alkane having 3 to 60 carbons, but is not limited thereto.

[0099] The term "Alkoxy group" or "alkyloxy group" as used in this application represents an alkyl group bonded to an oxygen radical and has 1 to 60 carbons unless otherwise described, but is not limited thereto.

[0100] The terms "alkenoxyl group", "alkenoxygroup", "alkenyloxyl group", or "alkenyloxy group" as used in this application represent an alkenyl group bonded to an oxygen radical and have 2 to 60 carbons unless otherwise described, but are not limited thereto.

[0101] Unless otherwise described, the terms "aryl group" and "arylene group" as used in this application each have 6 to 60 carbons, but are not limited thereto. In this application, an aryl group or an arylene group includes monocyclic, ring assemblies, fused polycyclic compounds, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group. The arylene group may include a fluorenylene group and a substituted fluorenylene group.

[0102] The term "ring assemblies" as used in this application refers to two or more ring systems (monocyclic or fused ring systems) directly connected by single bonds or double bonds, indicating that the number of direct connections between the rings is 1 less than the total number of ring systems contained in the compound. Ring assemblies may be directly connected by single bonds or double bonds from the same or different ring systems.

[0103] In this application, the aryl group includes ring assemblies. Therefore, the aryl group includes biphenyl and terphenyl in which benzene rings as monocyclic aromatics are directly connected by single bonds. Also, the aryl group further includes compounds in which aromatic ring systems fused to monocyclic aromatics are directly connected by single bonds. Thus, for example, it further includes compounds in which a fluorene, which is an aromatic ring system fused to a benzene ring as a monocyclic aromatic, is directly connected by a single bond.

[0104] The term "fused polycyclic system" as used in this application refers to a ring that is fused by sharing at least two atoms, including forms in which two or more hydrocarbon ring systems are fused and forms in which at least one heterocyclic system containing at least one hetero atom is fused, etc. The fused polycyclic system may be an aromatic ring, an aromatic heterocycle, an aliphatic ring, or a combination of such rings. For example, the aryl group may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0105] The term "spiro compound" used in this application has a'spiro union', and the spiro union means a connection formed by two rings sharing only one atom. At this time, the atom shared by the two rings is called the'spiro atom', and according to the number of spiro atoms contained in a compound, it is respectively called a'monospiro-', 'dispiro-', 'trispiro-' compound.

[0106] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group", and "fluorene-triyl group" used in this application respectively represent monovalent, divalent, or trivalent functional groups in the following structures where R, R', R", and R'" are all hydrogen. The "substituted fluorenyl group", "substituted fluorenylene group", or "substituted fluorene-triyl group" means that at least one of the substituents R, R', R", R'" is a substituent other than hydrogen, including the case where R and R' are bonded to each other and together with the carbon to which they are bonded form a spiro compound. In this specification, the fluorenyl group, fluorenylene group, and fluorene-triyl group can be named as the fluorene group regardless of the valence numbers such as monovalent, divalent, and trivalent.

[0107]

[0108] Moreover, R, R', R", and R'" can each independently be: an alkyl group having 1 to 20 carbons, an alkenyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, or a heterocyclyl group having 2 to 30 carbons. For example, the aryl group can be phenyl, biphenyl, naphthalene

[0109] (naphthalene), anthracene, or phenanthrene, and the heterocyclyl group

[0110] (heterocyclyl group) may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline

[0111] or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be monovalent or divalent functional groups of 9,9-dimethyl fluorene, 9,9-diphenyl fluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0112] The term "heterocyclyl group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings. Unless otherwise described, it respectively represents a ring containing one or more heteroatoms and having 2 to 60 carbon atoms, but is not limited thereto. Unless otherwise described, the term "hetero atom" used in this application represents N, O, S, P, or Si, and the heterocyclyl group represents a monocyclic type, cyclic polymer, fused polycyclic system, spiro compound, etc. containing heteroatoms.

[0113] For example, the "heterocyclyl group" may also include, instead of the cyclic carbon, compounds such as those containing heteroatom end groups such as SO 2 , P=O, etc.

[0114]

[0115] The term "ring" used in this application includes monocycles and polycycles. Of course, hydrocarbon rings include heterocycles, which contain at least one heteroatom and include aromatic and non-aromatic rings.

[0116] As used herein, the term "polycyclic" includes ring assemblies such as biphenyl and terphenyl, fused polycyclic systems, and spiro compounds, including not only aromatic but also non-aromatic compounds. Of course, hydrocarbon rings include heterocyclic rings containing at least one hetero atom.

[0117] As used herein, the term "cyclo group" refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic, ring assemblies, fused polycyclic systems, spiro compounds, etc., and unless otherwise described, refers to a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, when benzene, a fused aromatic ring, and cyclohexane, a non-aromatic compound, are fused, it also corresponds to an aliphatic ring.

[0118] Also, when naming with a prefix continuously, it means that substituents are arranged in the order of description. For example, an aryl alkoxy group means an alkoxy group substituted with an aryl group, an alkoxy carbonyl group means a carbonyl group substituted with an alkoxy group, and an arylcarbonyl alkenyl group means an alkenyl group substituted with an arylcarbonyl group, where the aryl carbonyl group is a carbonyl group substituted with an aryl group.

[0119] Also, unless otherwise explicitly described, in the term "substituted or unsubstituted" used herein, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C 1 ~C 30 alkyl group, C 1 ~C 30 alkoxy group, C 1 ~C 30 alkyl amine group, C 1 ~C30 alkyl thiophene group, C 6 to C 30 arylthiophene group, C 2 to C 30 alkenyl group, C 2 to C 30 alkinyl group, C 3 to C 30 cycloalkyl group, C 6 to C 30 aryl group, C substituted with deuterium 6 to C 30 aryl group, C 8 to C 30 arylalkenyl group, silane group, boron group, germanium group, and C 2 to C 30 heterocyclic group, the C 2 to C 20 heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si, and P. And, it is not limited by these substituents.

[0120] In this application, for the 'functional group names' corresponding to each label and its substituent examples such as aryl group, arylene group, heterocyclyl group, etc., 'functional group names reflecting valence' can be recorded, or it can also be recorded as 'the name of the parent compound'. For example, 'phenanthrene' as an aryl group can be classified by valence and record the name of the 'group'. For example, the monovalent 'group' is recorded as 'phenanthryl (group)', the divalent 'group' is recorded as 'phenanthrylene (group)', etc. However, it can also not consider valence and record the name of the parent compound 'phenanthrene'.

[0121] Similarly, pyrimidone can be recorded as 'pyrimidone' regardless of its valence, or when monovalent, it can be recorded as pyrimidinyl (group), and when divalent, it can be recorded as the 'group name' with the corresponding valence, such as pyrimidinylene (group), etc. Therefore, in this application, when recording the type of substituent as the name of the parent compound, it can represent an n-valent 'group' formed by the desorption of hydrogen atoms bonded to the carbon atoms and / or hetero atoms of the parent compound.

[0122] Moreover, in this specification, when recording the compound name or substituent name, the numbers or alphabets indicating the position can be omitted. For example, pyrido[4,3-d]pyrimidone

[0123] (pyrimidone) can be recorded as pyrido pyrimidone, benzo furan

[0124] (benzo furan)[2,3-d]pyrimidone can be recorded as benzofuran pyrimidone, 9,9-dimethyl-9H-fluorene can be recorded as dimethyl fluorene, etc. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline can be recorded as benzo quinoxaline.

[0125] Furthermore, unless otherwise clearly stated, the chemical formulas adopted in this application also apply to the definitions of substituents based on the following exponential definitions of chemical formulas.

[0126]

[0127] Among them, when a is an integer of 0, it means that the substituent R 1 does not exist, that is, when a is 0, all the carbons forming the benzene ring are bonded to hydrogen, and at this time, the label of the hydrogen bonded to carbon can be omitted, and the chemical formula or compound can be recorded. And when a is an integer of 1, one substituent R 1 is bonded to any one of the carbons forming the benzene ring. When a is an integer of 2 or 3, its bonding can be as follows. When a is an integer from 4 to 6, a similar method can also be used to bond with the carbons of the benzene ring. When a is an integer of 2 or more, R 1 can be the same or different.

[0128]

[0129] In the present application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused polycyclic ring. The single ring and the formed fused polycyclic ring include not only hydrocarbon rings but also heterocyclic rings, which contain at least one hetero atom and may include aromatic and non-aromatic rings.

[0130] Moreover, in this specification, unless otherwise described, when representing a condensed ring, in 'number-condensed ring', the number represents the number of condensed rings. For example, a form in which three rings are condensed with each other can be represented as 3-condensed ring, such as anthracene, phenanthrene, benzo quinozoline, etc.

[0131] In addition, unless otherwise described, the term "bridged bicyclic compound" used in the present application refers to a compound in which two rings share more than three atoms to form a ring. The shared atoms may include carbon or hetero atoms at this time.

[0132] In the present application, an organic electronic element means (several) components between an anode and a cathode, or means an organic light-emitting diode, which includes an anode, a cathode, and (several) components therebetween.

[0133] Moreover, depending on the situation, the display device of the present application means an organic electronic element, an organic light-emitting diode, and a panel including the same, or an electronic device including a panel and a circuit. Among them, for example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (such as smart phones, tablet computers, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but is not limited thereto, and any form of device can be used as long as it includes the said (several) components.

[0134] Hereinafter, embodiments of the present invention will be described in detail. However, this is for illustrative purposes only, and the present invention is not limited thereto. The present invention is only defined by the scope of the following claims.

[0135] According to an embodiment of the present invention, a composition containing a colorant can be used to prepare a red pattern, a green pattern, a blue pattern, or a black matrix, a pixel defining layer (PDL).

[0136] According to an implementation example of the present invention, the black pixel defining layer (PDL) may further include additional colorants in addition to the colorants included in the colorant, that is, organic black pigments or black dyes. For example, the organic pigment can be used alone or a mixture of organic pigment and coloring pigment can be used. The advantage at this time is that since the coloring pigment with insufficient light-shielding property is mixed, even if the amount of the colorant increases relatively, the strength of the film (layer) or the adhesion to the substrate will not decrease. According to an implementation example of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may include additional colorants, that is, black pigments or black dyes, instead of the colorants included in the colorant.

[0137] Hereinafter, each component will be described in detail.

[0138] 1. The preparation process of the negative pixel defining layer is as follows.

[0139] (1) Coating and coating step

[0140] The photosensitive composition is a low-viscosity liquid reagent. In order to form a coating with a certain thickness after coating on the substrate, a spin coater or a slot coater is used. The advantage of the spin coater is that the higher the rotation speed, the thinner the thickness, but the flatness deviation in the area is reduced. In order to form a coating on a large-area substrate, preferably, a slot coater is used compared to the spin coater. However, its disadvantage is that after the coating is formed, due to the residual solvent, the surface shows fluidity, resulting in a decrease in flatness. In order to overcome this disadvantage, VCD (vacuum chamber dry) is used to locally remove the solvent to reduce the surface fluidity.

[0141] (2) Pre-baking step

[0142] In this process, the substrate of the coating is heated using a hot plate or an oven at a certain temperature and time to locally remove the solvent contained in the coating film. If the surface or the depth of the coating film is not dry, it will cause photomask contamination during the exposure in the next process. When ultraviolet light is irradiated, the exposed part is not well cured. When it is not cured, it will cause the development process not to form and remove the pattern.

[0143] (3) Exposure step

[0144] In this process, when the pre-baking process is completed, actinic rays (ultraviolet rays) are irradiated using a patterned photomask to cure the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths are g-line (436nm), h-line (405nm), i-line (365nm), Deep UV (<260nm), which can be used separately or in combination.

[0145] (4) Development step

[0146] When the exposure step irradiates actinic rays, it is divided into an exposed portion and a non-exposed portion by a photomask. In the case of a positive type, the exposed portion is dissolved by the developer, while the non-exposed portion resists the developer and leaves a pattern. In the case of a negative type, the exposed portion is cured and resistant to the developer, while the non-exposed portion is developed. The black pixel defining layer (Black PDL) prepared using the composition containing the colorant described in the present invention is of the negative type and can be divided into an exposed portion (cured) and a non-exposed portion (developed) to form a pattern.

[0147] (5) Post-baking treatment step

[0148] This process heats the developed substrate at a high temperature above 210 °C to remove residual solvents and moisture. If the solvents and moisture are not completely removed, after the post-baking treatment, the residual solvents and moisture in the process will affect the components, and dark spots or pixel shrinkage caused thereby will affect the lifespan of the components.

[0149] Preferably, the temperature of the post-baking treatment step described in the present invention is 230 to 290 °C, and more preferably, it is 250 to 270 °C.

[0150] Also, preferably, the time of the post-baking treatment step is 30 minutes to 60 minutes, and more preferably, it is 60 minutes to 120 minutes.

[0151] According to the method for preparing a pixel defining layer described in the present invention, after implementing the post-baking treatment step, preferably, the optical density of the coating film is 0.80 / μm to 2.0 / μm, and the plastic hardness is 350 N / mm 2 to 470 N / mm 2 , and the modulus is 5200 Mpa to 6800 Mpa.

[0152] After implementing the post-baking treatment, more preferably, the plastic hardness of the coating film exceeds 410 N / mm 2 and is below 460 N / mm 2 .

[0153] After implementing the post-baking treatment, more preferably, the modulus of the coating film exceeds 6200 Mpa and is below 6700 Mpa.

[0154] After implementing the post-baking treatment, more preferably, the optical density of the coating film is 0.90 / μm to 1.50 / μm.

[0155] 2. The composition for forming a negative pixel defining layer containing a colorant is as follows.

[0156] (1) Resin for pattern formation

[0157] According to an embodiment of the present invention, the resin for pattern formation may include a cardo-based binder resin.

[0158] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0159] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include: acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. In the total amount of the acrylic binder resin, the content of the first ethylenically unsaturated monomer may be 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight.

[0160] The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate, etc.; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meth)acrylate, etc.; a vinyl cyanide compound such as (meth)acrylonitrile, etc.; an unsaturated amide compound such as (meth)acrylamide, etc., and these may be used alone or in combination of two or more.

[0161] Specific examples of the acrylic binder resin include: (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but are not limited thereto. These may also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, it may be 5,000 g / mol to 50,000 g / mol, for example, it may be 20,000 g / mol to 30,000 g / mol.

[0162] The resin of the phallobase ring (cardo) includes a repeating structure represented by the following Chemical Formula 1.

[0163] <Chemical Formula 1>

[0164]

[0165] In the said Chemical Formula 1,

[0166] 1) R 1 and R 2 are independently: hydrogen; deuterium; halogen; an aryl group of C 6 to C 30 ; a heterocyclyl group of C 2 to C 30 containing at least one hetero atom selected from O, N, S, Si and P; a cyclo group of a fused aliphatic ring and aromatic ring of C 6 to C 30 ; an alkyl group of C 1 to C 20 ; an alkenyl group of C 2 to C 20 ; an alkinyl group of C 2 to C 20 ; an alkoxy group of C 1 to C 20 ; an aryloxy group of C 6 to C 30 ; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group of C 1 to C 20 ,

[0167] 2) R 1 and R 2 can form a ring between adjacent groups,

[0168] 3) m or n is independently an integer from 0 to 4,

[0169] 4) A 1 and A 2 are independently the following Chemical Formula 2 or Chemical Formula 3,

[0170] <Chemical Formula 2>

[0171]

[0172] <Chemical Formula 3>

[0173]

[0174] In the above Chemical Formula 2 and Chemical Formula 3,

[0175] 4-1)* indicates the connected part,

[0176] 4-2) R 3 ~R 6 are independently: hydrogen; deuterium; halogen; aryl group of C 6 ~C 30 ; heterocyclyl group of C containing at least one hetero atom selected from O, N, S, Si and P 2 ~C 30 ; cyclo group of fused aliphatic ring and aromatic ring of C 6 ~C 30 ; Alkylgroup of C 1 ~C 20 ; alkenyl group of C 2 ~C 20 ; alkinyl group of C 2 ~C 20 ; alkoxy group of C 1 ~C 20 ; aryloxy group of C 6 ~C 30 ; fluorenyl group; carbonyl group; ether group; or alkoxy carbonyl group of C 1 ~C 20 ,

[0177] 4-3) R 3 ~R 6 can form a ring between adjacent groups,

[0178] 4-4) Y 1 and Y 2 are independently the following Chemical Formula 6 or Chemical Formula 7,

[0179] <Chemical Formula 6>

[0180]

[0181] <Chemical Formula 7>

[0182]

[0183] In the above Chemical Formula 6 and Chemical Formula 7,

[0184] 4-4-1)* indicates the bonding position,

[0185] 4-4-2) R 9 is hydrogen or a methyl ester;

[0186] 4-4-3) R 10 ~R 13 are independently: hydrogen; deuterium; halogen; an aryl group of C 6 ~C 30 ; a heterocyclyl group of C containing at least one hetero atom selected from O, N, S, Si, and P 2 ~C 30 ; a cyclo group of a fused ring of an aliphatic ring and an aromatic ring of C 6 ~C 30 ; an alkyl group of C 1 ~C 20 ; an alkenyl group of C 2 ~C 20 ; an alkinyl group of C 2 ~C 20 ; an alkoxy group of C 1 ~C 20 ; an aryloxy group of C 6 ~C 30 ; a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group of C 1 ~C 20 ,

[0187] 4-4-4) L 1 ~L 3 are independently: a single bond; a fluorenylene group; an alkylene of C 2 ~C 30 ;6 ~C 30 arylene of; C 2 ~C 30 heterocycle of; C 1 ~C 30 alkoxylene of; C 2 ~C 30 alkyleneoxy of; C 6 ~C 30 aryloxy group of; C 2 ~C 30 polyethyleneoxy group of,

[0188] 4-4-5) q and r are each independently an integer from 0 to 3; provided that, q + r = 3,

[0189] 5) The resin includes a repeating unit represented by Chemical Formula 1, and within the polymer chain, the ratio of A 1 and A 2 is from 9:1 to 1:9,

[0190] 6) X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5, 6-1) R' and R" are each independently: hydrogen; deuterium; halogen; C 6 ~C 30 aryl group of; containing at least one hetero atom selected from O, N, S, Si, and P in C 2 ~C 30 heterocyclyl group of; C 6 ~C 30 cyclo group of a fused ring of an aliphatic ring and an aromatic ring; C 1 ~C 20 alkyl group of; C 2 ~C 20 alkenyl group of; C 2 ~C 20 alkinyl group of; C 1 ~C 20 alkoxy group of; C 6 ~C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 alkoxy carbonyl group of

[0191] 6-2) R' and R" may form a ring between adjacent groups,

[0192] <Chemical Formula 4>

[0193]

[0194] <Chemical Formula 5>

[0195]

[0196] In the said Chemical Formula 4 and Chemical Formula 5,

[0197] 6-3) * indicates the bonding position,

[0198] 6-4) R 7 ~R 8 are independently: hydrogen; deuterium; halogen; C 6 ~C 30 aryl group; C containing at least one hetero atom among O, N, S, Si and P 2 ~C 30 heterocyclylgroup; C 6 ~C 30 fused ring group of aliphatic ring and aromatic ring; C 1 ~C 20 Alkylgroup; C 2 ~C 20 alkenyl group; C 2 ~C 20 alkinyl group; C 1 ~C 20 alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20an alkoxy carbonyl group

[0199] 6-5) o and p are each independently an integer from 0 to 4

[0200] 7) X 2 is a C 6 -C 30 aryl group; a C 2 -C 30 heterocyclyl group containing at least one heteroatom selected from O, N, S, Si, and P; a cyclo group of a fused aliphatic ring and an aromatic ring of C 6 -C 30 ; an Alkyl group of C 1 -C 20 ; an alkenyl group of C 2 -C 20 ; an alkinyl group of C 2 -C 20 ; an alkoxy group of C 1 -C 20 ; an aryloxygroup of C 6 -C 30 ; a fluorenylene group; a carbonyl group; an ether group; or an alkoxy carbonyl group of C 1 -C 20 an alkoxy carbonyl group

[0201] 8) The R', R", X 2 , L 1 -L 3 , R 1 -R 8 and R 10 -R 13 may each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; a substituted or unsubstituted Alkylgroup of C 1 -C 30 or a C 6 -C 30A silyl group of an aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; C 1 to C 30 of an alkylthio group; C 1 to C 30 of an alkoxy group; C 6 to C 30 of an aryl alkoxy group; C 1 to C 30 of an alkyl group; C 2 to C 30 of an alkenyl group; C 2 to C 30 of an alkinyl group; C 6 to C 30 of an aryl group; C substituted with deuterium 6 to C 30 of an aryl group; a fluorenyl group; C 2 to C 30 of a heterocyclyl group containing at least one hetero atom selected from the group consisting of O, N, S, Si, and P; C 3 to C 30 of an aliphatic cyclic group; C 7 to C 30 of an aryl alkyl group; C 8 to C 30 of an aryl alkenyl group; and combinations thereof, and rings may be formed between adjacent substituents.

[0202] When the R', R", X 2 , L 1 to L 3 , R 1 to R 8 and R 10 to R 13 are an aryl group, preferably, it may be C 6 to C 30The aryl group, more preferably, can be C 6 ~C 18 aryl group, for example, can be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0203] When the R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 is a heterocyclyl group, preferably, can be C 2 ~C 30 heterocyclyl group, more preferably, can be C 2 ~C 18 heterocyclyl group, for example, can be dibenzo furan, dibenzothiophen, naphtho benzo thiophen, naphtho benzofuran, etc.

[0204] The R', R", R 1 ~R 8 and R 10 ~R 13 is a fluorenyl group, preferably, can be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl group, 9,9'-spirobi fluorene, etc.

[0205] The L 1 ~L 3 is an arylene group, preferably, can be C 6 ~C 30 arylene group, more preferably, can be C 6 ~C 18 arylene group, for example, can be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0206] When R', R", and X 2 , R 1 ~R 8 and R 10 ~R 13 are an alkyl group, preferably, it can be an alkyl group of C 1 ~C 10 , for example, it can be a methyl group, t-butyl group, etc.

[0207] When R', R", and X 2 , R 1 ~R 8 and R 10 ~R 13 are an alkoxy group, preferably, it can be an alkoxy group of C 1 ~C 20 , more preferably, it can be an alkoxy group of C 1 ~C 10 , for example, it can be a methoxy group, t-butoxy group, etc.

[0208] The ring formed by bonding between adjacent groups of R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 can be an aromatic ring group of C 6 ~C 60 ; a fluorenyl group; a heterocyclyl group of C 2 ~C 60 containing at least one hetero atom among O, N, S, Si, and P; or an aliphatic ring group of C 3 ~C 60 , for example, when an aromatic ring is formed by bonding between adjacent groups, preferably, it can form an aromatic ring of C 6 ~C 20 , more preferably, it can form an aromatic ring of C 6 ~C 14 , for example, it can form benzene, naphthalene, phenanthrene, etc.

[0209] For example, the resin of the cardo system can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as pyromellitic dianhydride, naphthalene tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic dianhydride, perylene tetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride, tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate, N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, benzyltriethylammonium chloride.

[0210] The weight-average molecular weight of the resin of the cardo system is 1,000 to 100,000 g / mol. Preferably, it can be 1,000 to 50,000 g / mol. More preferably, it can be 1,000 to 30,000 g / mol. When the weight-average molecular weight of the resin is within the above range, no residue is generated during the preparation of the light-shielding layer, the pattern formation effect is good, and during development, there is no loss in film thickness, and a good pattern can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30% by weight. More preferably, the content can be 3 to 20% by weight. When the content of the resin is within the above range, excellent sensitivity, developability, and adhesion (tightness) can be obtained.

[0211] (2) Reactive unsaturated compound

[0212] The reactive unsaturated compound is an essential component for negative patterns and has ethylenic unsaturated double bonds. Therefore, during the exposure in the pattern formation process, sufficient polymerization can be initiated to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0213] Specific examples of the reactive unsaturated compound include: ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, etc.

[0214] Examples of commercially available products of the reactive unsaturated compound are as follows.

[0215] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. from Toagosei Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Kayaku Co., Ltd.; V-260, V-312, V-335HP, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0216] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nippon Kayaku Co., Ltd.; V-295, V-300, V-360, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0217] The above products can be used alone or two or more of them can be used together.

[0218] In order to have more excellent developability, the reactive unsaturated compound can be used after being treated with an acid anhydride. In the total amount of the photosensitive resin composition, the content of the reactive unsaturated compound can be 1 to 40% by weight, for example, it can be 1 to 20% by weight. When the content of the reactive unsaturated compound is included within the above range, sufficient curing is initiated during exposure in the pattern forming process. Therefore, the reliability is excellent, and the heat resistance, light resistance, and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent.

[0219] (3) Photoinitiator

[0220] In order to present a negative pattern through a lithography machine, a photo radical initiator needs to be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol·cm) or more in the region of 330 to 380 nm, and the temperature at which the photoinitiator undergoes a 5% weight loss is 280 °C or lower. Among them, the molar absorption coefficient can be calculated by the beer-Lambert Law. And, using TGA, the temperature was raised to 300 °C at a rate of 5 °C per minute in a nitrogen atmosphere, and the weight loss was detected.

[0221] The photopolymerization initiator is usually used in the photosensitive resin composition. For example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, etc. can be adopted.

[0222] For example, the acetophenone-based compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, etc.

[0223] For example, the benzophenone-based compounds include: benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0224] For example, the thioxanthone-based compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0225] For example, the benzoin-based compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

[0226] For example, the triazine-based compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0227] In addition to the compounds, the photoinitiator can also be a carbazole-based compound, a diketone compound, a borate sulfonium compound, a diazo compound, an imidazole compound, a non-imidazole compound, etc.

[0228] The photoinitiator, as a radical polymerization initiator, can be a peroxide-based compound, an azo-based compound, etc.

[0229] For example, the peroxide-based compounds include: peroxoketones such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, and acetylacetone peroxide; diperoxyacyls such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis(3,5,5-trimethylhexanoyl) peroxide; hydroperoxides such as 2,4,4-trimethylpentan-2-yl hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, 1,3-bis(t-butoxyisopropyl)benzene, and n-butyl t-butylperoxyvalerate; alkyl succinate esters such as 2,4,4-trimethylpentyl phenoxyacetate peroxide, α-cumyl neodecanoate peroxide, t-butyl peroxybenzoate, and di-t-butyl peroxide trimethyladipate; percarbonates such as bis(3-methoxybutyl) peroxydicarbonate, bis(2-ethylhexyl) peroxydicarbonate, bis(4-t-cyclohexyl) peroxydicarbonate butyl, diisopropyl peroxydicarbonate, acetyl cyclohexylsulfonyl peroxide, and t-aryl carbonate butyl peroxide.

[0230] For example, the azo-based compounds include: 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(isobutyronitrile methyl ester), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile), and 4,4'-azobis(4-cyanopentanoic acid), etc.

[0231] After the photoinitiator absorbs light and undergoes a transition to the excited state, it transfers its energy and is thus used together with a photosensitizer that undergoes a chemical reaction. For example, the photosensitizers include: triethylene glycol bis(3-mercaptopropionate), pentaerythritol tetra(3-mercaptopropionate), dipentaerythritol tetra(3-mercaptopropionate), etc.

[0232] In the total amount of the photosensitive composition, the content of the photoinitiator can be 0.01 to 10% by weight, for example, it can be 0.1 to 5% by weight. When the content of the photoinitiator is within the above range, sufficient curing is initiated during exposure in the pattern formation process. Therefore, the reliability is excellent, and the heat resistance, light resistance, and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent. In addition, a decrease in transmittance caused by unreacted initiator can be prevented.

[0233] (4) Colorant

[0234] Both organic pigments, inorganic pigments, and dyes can be used as the colorants.

[0235] The colorants can include red pigments, green pigments, blue pigments, yellow pigments, black pigments, etc.

[0236] For example, the red pigments include: C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Red 264, C.I. Pigment Red 270, C.I. Pigment Red 272, C.I. Pigment Red 177, C.I. Pigment Red 89, etc.

[0237] For example, the green pigments include: copper phthalocyanine pigments substituted with halogen, such as C.I. Pigment Green 36, C.I. Pigment Green 7, etc.

[0238] For example, the blue pigments include: copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, C.I. Pigment Blue 16, etc.

[0239] For example, the yellow pigments include: isoindoline-based pigments such as C.I. Pigment Yellow 139, quinophthalone-based pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, etc.

[0240] For example, the black pigments include: lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0241] Moreover, according to the examples, the colorants in the photosensitive resin composition can include pigments, dyes, or a combination thereof. For example, the dyes can include phthalocyanine-based compounds.

[0242] The above components can be used alone or in combination of two or more as the pigments and dyes, and are not limited herein.

[0243] The black pigment among the above components can be used to effectively implement light shielding for the light shielding layer. When using the black pigment, it can also be used together with color adjustment and repair agents such as anthraquinone-based pigments, perylene-based pigments, phthalocyanine-based pigments, azo-based pigments, etc.

[0244] In order to disperse the pigment in the photosensitive resin composition, a dispersant can be used together. Specifically, the pigment can be used after surface pretreatment with a dispersant, or a dispersant can be added together with the pigment when preparing the photosensitive resin composition and then used.

[0245] The dispersant can be a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. Specific examples of the dispersant include: polyalkylene glycol and its esters, polyoxyalkylene, polyoxyalkylene polyol ester adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, polyoxyalkylene alkylamide adducts, alkyl amines, etc., and these can be used alone or in combination of two or more.

[0246] Examples of commercially available products of the dispersant include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. of BYK Company; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. of EFKA Chemical Company; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc. of Zeneka Company; or PB711, PB821, etc. of Ajinomoto Company.

[0247] In the total amount of the photosensitive resin composition, the content of the dispersant can be 0.1% by weight to 15% by weight. When the content of the dispersant is within the above range, the dispersibility of the composition is excellent, and accordingly, when preparing the light-shielding layer, the stability, developability and patternability are excellent.

[0248] The pigment can also be pre-treated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is used after the pre-treatment, the average particle size of the pigment can be refined.

[0249] The pretreatment is achieved by kneading the pigment together with a water-soluble inorganic salt and a wetting agent; and then filtering and washing the pigment obtained in the kneading step.

[0250] The kneading may be performed at a temperature of 40° C. to 100° C., and the filtering and washing may be performed by washing the inorganic salt with water or the like and filtering.

[0251] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0252] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby playing the role of a medium that makes the pigment easy to crush. For example, the wetting agent includes: alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol, and the like. These can be used alone or in combination of two or more.

[0253] The pigment after the kneading step may have an average particle size of 120 nm or less. When the average particle size of the pigment is within the above range, not only heat resistance and light resistance are excellent, but also a fine pattern can be effectively formed.

[0254] The content of the pigment in the total amount of the photosensitive resin composition may be 1 to 40 wt %, more specifically, 17 to 35 wt %. When the pigment is included within the above range, color reproduction rate is excellent, and curability and adhesion of the pattern are also excellent.

[0255] (5) Solvent

[0256] The solvent is compatible with the cardo-based resin, the reactive unsaturated compound, the pigment, the cardo-based compound, and the initiator, and substances that do not react can be used.

[0257] For example, the solvents include: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisopentyl ether, anisole, and tetrahydrofuran; ethylene glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethylene glycol ethyl ether acetates such as methoxyethyl acetate, ethoxyethyl acetate, and diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-dipentyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; alkyl glycollate esters such as methyl glycollate, ethyl glycollate, methyl glycollate, and butyl glycollate; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate and ethyl 3-oxopropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, and propyl 2-oxopropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl glycolate, and methyl 2-hydroxy-3-methylbutyrate; keto acid esters such as ethyl pyruvate, etc.

[0258] Moreover, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, ethylene glycol phenyl ether acetate, etc. can be used.

[0259] In consideration of the compatibility and reactivity of the solvents, ethylene glycol ethers such as ethylene glycol monoethyl ether can be used; ethylene glycol alkoxyacetates such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate.

[0260] In the total amount of the photosensitive resin composition, the solvent can be included as the balance. Specifically, the content can be 40 to 90% by weight. When the content of the solvent is included within this range, the photosensitive resin composition can have an appropriate viscosity, thereby achieving excellent processability when preparing the pattern layer.

[0261] (6) Other additives

[0262] In order to prevent streaks or spots from appearing, improve the leveling performance, and prevent residues from being generated without development when coating the photosensitive composition, additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl or (meth)acryloxy group; a leveling agent; a fluorine-based surfactant; a radical polymerization initiator, etc. can be further included.

[0263] For example, in order to improve the adhesion to the substrate, etc., the photosensitive resin composition can further include a silane coupling agent having reactive substituents such as vinyl, carboxyl, methacryloxy, isocyanate, epoxy, etc.

[0264] For example, the silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc., and these can be used alone or in combination of two or more.

[0265] In 100 parts by weight of the photosensitive resin composition, the parts by weight of the silane coupling agent may be from 0.01 part by weight to 10 parts by weight. When the parts by weight of the silane coupling agent are within the said range, the adhesion and storage stability are excellent, etc.

[0266] Moreover, the photosensitive resin composition may further contain a surfactant as needed, for example, a fluorine-based surfactant, which has the effect of improving the coating property and preventing the appearance of defects.

[0267] As the fluorine-based surfactant, the following commercially available fluorine-based surfactants may be used: those of BM Chemie etc.; Armorhold F of Dainippon Ink and Chemicals, Inc. same model same model same model etc.; LUMIFLON of Sumitomo 3M Limited same model same model same model FC- etc.; Saffron of Asahi Glass Co., Ltd. same model same model same model same model etc.; those of Toray Silicone Co., Ltd. same model- same model- etc.

[0268] In 100 parts by weight of the photosensitive resin composition, the parts by weight of the surfactant may be from 0.001 part by weight to 5 parts by weight. When the parts by weight of the surfactant are within the said range, the coating uniformity can be ensured, no scars will occur, and the wettability of the glass substrate is excellent. Moreover, the photosensitive resin composition may add a certain amount of other additives such as antioxidants and stabilizers within the range that does not damage the physical properties.

[0269] Another implementation example may utilize the photosensitive resin composition to form a pattern at the pixel isolation part of the organic light-emitting element electrode.

[0270] Hereinafter, the synthesis examples and the examples of the present invention will be specifically described, however, the synthesis examples and the examples of the present invention are not limited thereto.

[0271] (Preparation of black photosensitive composition)

[0272] Synthesis Example 1: (Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene represented by Chemical Formula 8)

[0273] 20 g of 9,9'-biphenylenefluorene (Sigma Aldrich), 8.67 g of epichlorohydrin (Sigma Aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube. The temperature was raised to 80 °C and the reaction was carried out for 4 hours. Then, the temperature was lowered to 25 °C, and the reaction solution was filtered. Then, the filtrate was stirred and dropped into 1000 ml of water, and the precipitated powder was filtered. Then, it was washed with water, and vacuum dried at 40 °C to obtain 25 g of 9,9-bis[4-(glycidyloxy)phenyl]fluorene represented by the following Compound 8. The purity of the powder was analyzed by HPLC, and as a result, the purity was 98%.

[0274] <Chemical Formula 8>

[0275]

[0276] Synthesis Example 2: Preparation of a cardo-based binder resin

[0277] 25 g (54 mmol) of Compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Daiichi Kigenso Kagaku Kogyo Co., Ltd.), 0.2 g of benzyl triethylammonium chloride (Daiichi Kigenso Kagaku Kogyo Co., Ltd.), 0.2 g of hydroquinone (Daiichi Kigenso Kagaku Kogyo Co., Ltd.), and 52 g of propylene glycol monomethyl ether acetate (Sigma Aldrich) were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110 °C for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Inc.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich) were further poured in, and then stirred at 110 °C for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed. As a result, a cardo-based binder resin having a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0278] Preparation Example 1: Preparation of a black pigment dispersion

[0279] Using a paint shaker (Asada Co.), 15 g of Irgaphor Black S100CF (black pigment / BASF Co.), 8.5 g of Disperbyk 163 (BYK Co.), 6.5 g of SR-3613 (SMS Co.), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray Co.) were dispersed for 10 hours to obtain a dispersion. Using a particle size analyzer (SZ-100Z, HORIBA Co.), it was confirmed whether the average particle size (Mean) of the dispersion was 97 nm.

[0280] Preparation Example 2: Preparation of a black pigment dispersion

[0281] Using a paint shaker (Asada Co.), 15 g of Irgaphor Black S100CF (black pigment / BASF Co.), 8.5 g of Disperbyk 163 (BYK Co.), 6.5 g of SR-3613 (SMS Co.), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray Co.) were dispersed for 12 hours to obtain a dispersion. Using a particle size analyzer (SZ-100Z, HORIBA Co.), it was confirmed whether the average particle size (Mean) of the dispersion was 75.3 nm.

[0282] Preparation Example 3: Preparation of a black pigment dispersion

[0283] Using a paint shaker (Asada Co.), 15 g of Irgaphor Black S100CF (black pigment / BASF Co.), 8.5 g of Disperbyk 163 (BYK Co.), 6.5 g of SR-3613 (SMS Co.), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray Co.) were dispersed for 8 hours to obtain a dispersion. Using a particle size analyzer (SZ-100Z, HORIBA Co.), it was confirmed whether the average particle size (Mean) of the dispersion was 133.9 nm.

[0284] Preparation Example 4: Preparation of a black pigment dispersion

[0285] Using a paint shaker (Asada Co.), 15 g of Irgaphor Black S100CF (black pigment / BASF Co.), 8.5 g of Disperbyk 163 (BYK Co.), 6.5 g of SR-3613 (SMS Co.), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray Co.) were dispersed for 7 hours to obtain a dispersion. Using a particle size analyzer (SZ-100Z, HORIBA Co.), it was confirmed whether the average particle size (Mean) of the dispersion was 156.8 nm.

[0286] Preparation Example 5: Preparation of a black pigment dispersion

[0287] Using a paint shaker (Asada Co.), 15 g of Irgaphor Black S100CF (black pigment / BASF Co.), 8.5 g of Disperbyk 163 (BYK Co.), 6.5 g of SR-3613 (SMS Co.), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray Co.) were dispersed for 6 hours to obtain a dispersion. Using a particle size analyzer (SZ-100Z, HORIBA Co.), it was confirmed whether the average particle size (Mean) of the dispersion was 168.6 nm.

[0288] A photosensitive composition was prepared using the components in Table 1 below.

[0289] Specifically, an initiator was dissolved in a solvent, and then stirred at room temperature. A binder resin and a polymerizable compound were added thereto and stirred at room temperature. Then, a colorant and other additives were added to the obtained reaction product and stirred at room temperature. Then, the product was filtered three times to remove impurities, and a photosensitive resin composition was prepared.

[0290]

Table 1

[0291]

[0292]

[0293] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0294] (1) Coating and coating step

[0295] On a 10 cm * 10 cm substrate that has been cleaned and metal-evaporated, a photosensitive composition is coated with a constant thickness using a spin coater. Then, a part of the solvent is removed using a vacuum chamber dry (VCD) to form a coating film. The thickness of the film formed after the coating of the photosensitive composition passes through the VCD is 2.0 micrometers to 1.7 micrometers.

[0296] (2) Pre-baking step

[0297] On a hot plate, it is heated at 80 °C to 120 °C for 50 seconds to 200 seconds to remove the solvent contained in the obtained coating film. This process removes a certain amount of solvent to reduce the mask contamination of the pixel pattern when performing the next process (exposure) step and prepares a clean pattern.

[0298] (3) Exposure step

[0299] On the obtained coating film above, a mask with a given pattern is interposed to form a desired pattern and a certain thickness. Then, actinic rays of 190 nm to 600 nm are irradiated by an exposure machine. Preferably, a metal or LED light source with ghi-line can be irradiated to form a pattern. The exposure dose for forming the pattern is 20 to 150 mJ / cm 2 and a negative-type photosensitive resist material.

[0300] (4) Development step

[0301] After performing the exposure step, then, by the dipping method, a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer is used to develop for a certain time (minutes) at 23 ± 2 °C, and then rinsed with deionized water (DI water) to dissolve and remove the unexposed part, leaving only the exposed part to form an image pattern. The thickness of the coating film is 1.70 to 1.90 μm.

[0302] (5) Post-baking treatment step

[0303] To obtain the image pattern obtained by the development, post-baking is performed in an oven at 210 to 300 °C, and the post-baking time is 30 minutes to 120 minutes to completely remove the solvent and the deionized water (DI water, moisture) absorbed by the coating film in the development step, and cure the pattern to form a film.

[0304] The present invention realizes a coloring pattern with high optical density on an electrode substrate, which not only makes the color more vivid but also improves the reliability and extends the lifespan of the display. That is, the post-baking process temperature is from 210°C to 300°C, preferably from 250°C to 270°C. When it is lower than 210°C, the roughness increases, and when it exceeds 300°C, the patterned film is pyrolyzed and the roughness increases.

[0305] (6) Optical density detection

[0306] Using a photosensitive composition, a pattern was formed on the substrate through the above steps (1) to (5), and then the optical density was detected. The coating thickness was 1.45 to 1.55 μm after film formation by post-baking. The photosensitive composition was coated on a 10 cm x 10 cm bare glass substrate and post-baked, and then the optical density of the substrate was detected using a 361T Transmission Densitometer from X-Rite. The optical densities of the samples were compared according to the different average particle sizes of the inorganic pigments.

[0307] In the present invention, the optical density (OD) of the film after the post-baking step is 2.0 / μm or less, preferably 1.7 / μm or less, and more preferably 1.5 / μm or less.

[0308] (7) Particle size detection

[0309] Samples for detection were prepared by diluting the pigment dispersions described in Preparation Examples 1 to 5 3,000 times with PGMEA solvent. The particle sizes were detected using an SZ-100Z from HORIBA. When detecting, D10, D50, and D90 values were obtained, and the average pigment size was defined by the overall average value.

[0310] Regarding the particle sizes of the inorganic or organic pigments of the colorants used in the present invention, the average value of D10 to D90 is 100 nm or less, preferably 90 nm or less, and more preferably 80 nm or less.

[0311] The present invention realizes a coloring pattern with high optical density on an electrode substrate, thereby making the color vivid while improving the reliability and extending the lifespan of the display. That is, when the size of inorganic pigment particles exceeds 100 nm, residues will occur after the development process, which will become an inducement for pixel shrinkage, resulting in reduced brightness and shortened lifespan. When the optical density is lower than 0.8 / μm, the visibility and brightness decrease. Moreover, the larger the size of inorganic pigment particles, the higher the surface roughness. When the optical density exceeds 2.5 nm, the adhesion during the process will decline. Therefore, it is extremely important that the particle size of the pigment is below 100 nm.

[0312] (8) Surface roughness detection

[0313] The evaluation substrate containing the negative pixel defining layer was used as a sample for detecting roughness. The negative pixel defining layer was formed by coating, exposing, developing, and post-baking a composition containing a colorant on the glass surface. The physical properties of this evaluation substrate were detected using an atomic force microscope (AFM, parksystems / XE-100). Detection was performed on an area of 2 μm x 2 μm at a scan rate of 0.3 (Hz) and a set-point of (11.26 nm) in non-contact mode.

[0314] The surface roughness (Roughness, Ra) of the pixel defining layer forming the coating film in the present invention is 3.0 nm or less, preferably 2.7 nm or less, and more preferably 2.5 nm or less.

[0315] The above detection results were recorded in Table 2 and Table 3 below and shown in Figure 1 as follows.

[0316]

Table 2

[0317]

[0318]

Table 3

[0319]

[0320] The photosensitive composition coating film was formed using the pigment dispersions prepared in Preparation Examples 1 to 5 above. The substrates obtained by the subsequent process of the post-baking treatment were used to detect the optical density and roughness and make comparisons.

[0321] As can be seen from Comparative Examples 1 to 3 in Table 2 above, when the average particle size is above 120 nm, the optical density is below 0.8 / μm. It was confirmed that the increase in particle size leads to an increase in roughness. In addition, it was confirmed that when the average particle size increases and the same development process is carried out for the same time, residues are generated. As can be seen from Examples 1 to 2, when the average particle size is below 100 nm, the optical density is above 1.0 / μm, the roughness is below 2.5 nm, and there are no residues.

[0322] It was confirmed from Comparative Examples 4 to 8 in Table 3 above that when the temperature of the post-baking treatment step is reduced to 180 °C, compared with 250 °C, the optical density slightly decreases and the roughness increases.

[0323] In addition, a pixel defining layer was prepared from the photosensitive composition of the components in Table 4 below, and the optical density, plastic hardness and modulus were measured.

[0324]

Table 4

[0325]

[0326] (9) Optical density measurement

[0327] Using the photosensitive composition, a pattern was formed on the substrate through the above steps (1) to (5), and then the optical density was measured. The photosensitive composition was coated on a 10 cm x 10 cm bare glass substrate and post-baked, and then the optical density of the substrate was measured using a 361T Transmission Densitometer from X-Rite.

[0328] (10) Plastic hardness and modulus (nanoindenter) measurement

[0329] To measure the plastic hardness and modulus, a negative pixel defining layer was formed on the glass surface by coating, exposing, developing and post-baking a composition containing a colorant, and an evaluation substrate including the negative pixel defining layer was obtained. The physical properties of the evaluation substrate were measured using a nanoindenter (Fischer HM2000) under the conditions of Test force (0.2 mN), Loading time (8 sec), and Creeptime (5 sec).

[0330]

Table 5

[0331]

[0332] The pixel patterns of the photosensitive compositions prepared in Examples 3 to 5 and Comparative Examples 9 to 12 were detected using an optical microscope, and the residue levels were confirmed. In Examples 3 to 5 and Comparative Examples 9 to 12, the content of the black pigment dispersion liquid was 20% by weight or less, and it was confirmed that the residue levels were excellent at this time. In Comparative Examples 11 to 12, as the content of the pigment dispersion liquid became 20% by weight or more, the peripheral residue or the residue inside the pixel increased.

[0333] The coatings of the photosensitive compositions prepared in Examples 3 to 5 and Comparative Examples 9 to 12 were used to detect the plastic hardness and modulus of different optical densities and make a comparison.

[0334] As described in Table 5 above, in Comparative Examples 9 and 10, the optical density was 0.8 / μm or less or the plastic hardness was 400 N / mm 2 Below, and its mechanical and physical properties were weak. Also, the residue was extremely excellent, but the optical density was 0.8 / μm or less, the visibility was poor, and the plastic hardness was low. Therefore, cracks might occur due to external impact.

[0335] Also, in Comparative Examples 11 and 12, the optical density was 1.5 / μm or more and the plastic hardness was 460 N / mm 2 Above, but it was confirmed that residue occurred.

[0336] On the contrary, in Examples 3 to 5, the optical density was within the preferred range, that is, equivalent to 0.8 to 1.50 / μm, the plastic hardness was 400 to 467 N / mm 2 , and the modulus was within the range of 6200 to 6670 Mpa. The residue was excellent, the visibility of the display could be improved, and it met the conditions of the light-shielding layer and the pixel defining layer.

[0337] The above description merely illustrates the present invention. Those of ordinary skill in the technical field to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0338] Therefore, the embodiments disclosed in this specification are used to describe the present invention, rather than to limit the present invention. The idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be interpreted according to the appended claims, and it should be interpreted that all technologies within the equivalent scope thereof fall within the scope of the claims of the present invention.

Claims

1. A method for preparing a pixel defining layer, characterized in that: The method comprises the steps of: coating and coating a photosensitive composition, wherein the photosensitive composition comprises a colorant having a pigment average particle size of less than 120 nm; pre-baking; exposing; developing; and post-baking. After the post-baking step, the optical density of the coating film is 0.8 / μm to 2.0 / μm, and the plastic hardness is 350N / mm 2 Up to 470N / mm 2 , modulus is 5200Mpa to 6800Mpa, roughness is below 3.0nm, and there is no residue.

2. The method for preparing a pixel defining layer according to claim 1, wherein: The temperature of the post-baking step is 210 to 300°C.

3. The method for preparing a pixel defining layer according to claim 1, wherein: The temperature of the post-baking step is 230 to 290°C.

4. The method for preparing a pixel defining layer according to claim 1, wherein: The post-baking step is performed for 30 minutes to 120 minutes.

5. The method for preparing a pixel defining layer according to claim 1, wherein: The post-baking step is performed for 60 minutes to 120 minutes.

6. The method for preparing a pixel defining layer according to claim 1, characterized in that: After the post-baking step, the optical density of the coating film is 0.9 / μm to 1.5 / μm.

7. The method for preparing a pixel defining layer according to claim 1, characterized in that: After the post-baking treatment, the roughness of the coating film is 2.5 nm or less.

8. The method for preparing a pixel defining layer according to claim 1, characterized in that: The plastic hardness of the coating after the post-baking treatment exceeds 410N / mm 2 And 460N / mm 2 the following.

9. The method for preparing a pixel defining layer according to claim 1, characterized in that: After the post-baking treatment, the modulus of the coating film exceeds 6200 MPa and is less than 6700 MPa.

10. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes a colorant.

11. The method for preparing a pixel defining layer according to claim 10, characterized in that: The colorant includes one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

12. The method for preparing a pixel defining layer according to claim 10, characterized in that: The content of the colorant is 17 to 35 wt % in the total amount of the photosensitive composition.

13. The method for preparing a pixel defining layer according to claim 10, characterized in that: The colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

14. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes a pattern forming resin, and the pattern forming resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

15. The method for preparing a pixel defining layer according to claim 14, characterized in that: The acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

16. The method for preparing a pixel defining layer according to claim 14, wherein: The cardo-based binder resin includes a repeating structure represented by the following chemical formula 1: <Chemical Formula 1> In the chemical formula 1, 1) R 1 and R 2 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 2) R 1 and R 2 Rings can be formed between adjacent bases. 3) m or n is independently an integer from 0 to 4, 4) A1 and A2 are independently of each other represented by the following chemical formula 2 or chemical formula 3, <Chemical Formula 2> <Chemical formula 3> In the chemical formula 2 and the chemical formula 3, 4-1)* indicates the connected parts, 4-2) R 3 ~R 6 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 4-3) R 3 ~R 6 Rings can be formed between adjacent bases. 4-4)Y 1 and Y 2 Independently of each other, they are the following chemical formulas: Chemical formula 6 or Chemical formula 7, <Chemical Formula 6> <Chemical Formula 7> In the chemical formula 6 and the chemical formula 7, 4-4-1)* indicates the bonding position, 4-4-2)R 9 is hydrogen or methyl ester; 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 4-4-4)L 1 ~L 3 are independently: a single bond; a fluorenyl group; C2~C 30 Alkylene; C6~C 30 Arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group, 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3, 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein within the polymer chain, the ratio of A1 to A2 is 9:1 to 1:9, 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5, 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 6-2) R' and R" can form a ring between adjacent groups, <Chemical Formula 4> <Chemical Formula 5> In the chemical formula 4 and the chemical formula 5, 6-3)* indicates the bonding position, 6-4) R 7 ~R 8 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 6-5) o and p are independently integers from 0 to 4, 7)X 2 It is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; C6~C 30 Aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

17. The method for preparing a pixel defining layer according to claim 14, wherein: The cardo resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

18. The method for preparing a pixel defining layer according to claim 14, wherein: The content of the cardo resin in the total amount of the photosensitive composition is 1 to 30 weight %.

19. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition includes: a reactive unsaturated compound in an amount of 1 to 40 wt % based on the total amount thereof.

20. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition comprises: a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

21. A pixel defining layer prepared according to claim 1.

22. An organic light emitting display device comprising the pixel defining layer according to claim 21.

23. An electronic device, characterized in that: It comprises the display device as claimed in claim 22 and a control unit for driving the display device.

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