High-strength memory card and manufacturing method

Abstract

The invention provides a high-strength memory card and a manufacturing method. The high-strength memory card comprises a metal shell, a memory body and a plastic upper cover. The metal shell is provided with a groove. The memory body is placed in the groove and comprises a control part and an electronic connection part. And the plastic upper cover covers the control part, so that the electric connection part is exposed outside. Therefore, as the structure of the metal shell has the characteristics of high strength, high hardness, high temperature resistance, reduction of signal interference, improvement of heat dissipation and the like, the metal shell cannot be cracked and deformed even if a user accidentally falls the memory card onto the ground or bends the memory card forcibly. Therefore, the metal shell can provide good protection for the control part, and the control part cannot be broken, so that the control part can be prevented from being damaged to lose functions.

Description

Technical Field

[0001] The present invention relates to a memory card, and particularly to a high-strength memory card and a manufacturing method thereof. Background Art

[0002] A Secure Digital Memory Card (SD) is a type of memory card that is widely used in portable electronic devices, such as digital cameras, digital video cameras, multimedia players, and aerial drones. The technology of memory cards is based on the format of the Multi-Media Card (MMC). Memory cards have relatively high data transfer speeds and are constantly updated with standards. Most memory cards are provided with a write protection control on the side to prevent accidental writing of some data, and a small number of memory cards even support digital rights management technology.

[0003] However, the outer shell of the memory card in the prior art is made by ultrasonic pressing of two pieces of plastic, and the plastic outer shell has the problem of being easily broken. When the user accidentally drops the memory card of the prior art on the ground, or bends it forcefully, or the aerial drone drops to the ground, it will cause the plastic outer shell to break, resulting in damage to the control part of the memory body and loss of function. Summary of the Invention

[0004] The main object of the present invention is to provide a high-strength memory card and a manufacturing method thereof, the outer shell of which will not break and can protect the control part of the memory body.

[0005] To achieve the foregoing object, the present invention provides a high-strength memory card, including a metal outer shell, a memory body, and a plastic upper cover. The metal outer shell has a groove. The memory body is placed in the groove and includes a control part and an electrical connection part. The plastic upper cover covers the control part, so that the electrical connection part is exposed.

[0006] In some embodiments, the material of the metal outer shell is stainless steel.

[0007] In some embodiments, the surface of the metal outer shell is smooth.

[0008] To achieve the aforementioned objectives, the present invention provides a method for manufacturing a high-strength memory card, comprising the following steps: mixing a metal powder and a binder through kneading to obtain a composite material; pelletizing the composite material to obtain a raw material; injection molding the raw material to obtain a green body; subjecting the green body to nitric acid-catalyzed debinding to obtain a brown body; sintering the brown body to obtain a silver body, the silver body being a metal shell; placing a memory body in a groove of the metal shell; and putting the assembled metal shell and the memory body together into a mold, and performing insert injection molding so that a plastic upper cover covers a control part of the memory body, and an electrical connection part of the memory body is exposed outside to obtain a high-strength memory card.

[0009] In some embodiments, the metal powder is stainless steel powder, and the material of the metal shell is stainless steel.

[0010] In some embodiments, after the step of obtaining the silver body, the following steps are further included: subjecting the silver body to surface treatment to obtain the metal shell with a smooth surface.

[0011] The efficacy of the present invention lies in that since the structure of the metal shell has characteristics such as high strength, high hardness, high temperature resistance, reduced signal interference, and improved heat dissipation, even if the user accidentally drops the memory card of the present invention on the ground or bends it forcefully, the metal shell will not crack or deform. Therefore, the metal shell can provide good protection for the control part of the memory body, and the control part of the memory body will not have the problem of cracking, thereby being able to avoid the damage and loss of function of the control part of the memory body.

[0012] Furthermore, stainless steel has good corrosion resistance, good structural strength, and high hardness and will not crack, making it suitable as the material of the metal shell, so that the metal shell provides better protection for the control part of the memory body, perfectly solving the shortcoming that the memory card in the prior art is easily damaged. Description of the Drawings

[0013] Figure 1 is a perspective view of the high-strength memory card of the present invention.

[0014] Figure 2 is an exploded view of the high-strength memory card of the present invention.

[0015] Figure 3 is a flowchart of the method for manufacturing the high-strength memory card of the present invention.

[0016] Figure 4 is a schematic diagram of the method for manufacturing the high-strength memory card of the present invention.

[0017] Description of the Reference Numerals:

[0018] 1: High-strength memory card;

[0019] 10: Metal housing;

[0020] 11: Groove;

[0021] 20: Memory body;

[0022] 21: Control unit;

[0023] 22: Electrical connection part;

[0024] 30: Plastic upper cover;

[0025] 100: Metal powder;

[0026] 110: Binder;

[0027] 120: Raw material;

[0028] 130: Green compact;

[0029] 140: Brown compact;

[0030] 200: Kneader;

[0031] 210: Pelletizer;

[0032] 220: Injection molding machine;

[0033] 230: Nitric acid catalytic debinding furnace;

[0034] 240: Sintering furnace;

[0035] S10~S80: Steps. Detailed implementation manners

[0036] The following will make a more detailed description of the implementation manners of the present invention in conjunction with the drawings and component symbols, so that those skilled in the art can implement it after studying this specification.

[0037] Figure 1 It is a perspective view of the high-strength memory card 1 of the present invention. Figure 2 It is an exploded view of the high-strength memory card 1 of the present invention. As Figure 1 and Figure 2 shown, the present invention provides a high-strength memory card 1 (Secure Digital Memory Card, SD), including a metal housing 10, a memory body 20 (substrate), and a plastic upper cover 30. The metal housing 10 has a groove 11. The memory body 20 is placed in the groove 11 and includes a control unit 21 and an electrical connection part 22. The plastic upper cover 30 covers the control unit 21, so that the electrical connection part 22 is exposed.

[0038] Specifically, the internal structure of the control unit 21 of the memory body 20 includes a card controller, a memory controller, and a memory chip, and its functions are those of the prior art. The electrical connection portion 22 of the memory body 20 can be electrically connected to the electrical connection portion of a portable electronic device (e.g., a digital camera, a digital video camera, or a multimedia player) and is used for transmitting data, and its functions are also those of the prior art.

[0039] In a preferred embodiment, the material of the metal shell 10 is stainless steel.

[0040] In a preferred embodiment, the surface of the metal shell 10 is smooth.

[0041] Figure 3 is a flowchart of the manufacturing method of the high-strength memory card of the present invention. Figure 4 is a schematic diagram of the manufacturing method of the high-strength memory card of the present invention. As Figure 3 and Figure 4 shown, the present invention provides a manufacturing method of a high-strength memory card, including the following steps:

[0042] Step S10, mixing a metal powder 100 and a binder 110 to obtain a composite material (not shown in the figure). Specifically, the mixing is to add the metal powder 100 and the binder 110 into a mixer 200, and the mixer 200 will mix the metal powder 100 and the binder 110 into a composite material.

[0043] Step S20, pelletizing the composite material to obtain a raw material 120. More specifically, the pelletizing is to add the composite material into a pelletizer 210, and the pelletizer 210 will manufacture the composite material into granular raw material 120.

[0044] Step S30, injection molding the raw material 120 to obtain a green body 130. More specifically, the injection molding is to add the raw material 120 into an injection molding machine 220, and the injection molding machine 220 will injection mold the raw material 120 into a green body 130.

[0045] Step S40, performing nitric acid catalytic debinding on the green body 130 to obtain a brown body 140. More clearly, because the green body 130 contains a binder, the binder of the green body 130 must be removed. Therefore, the nitric acid catalytic debinding is to place the green body 130 in a nitric acid catalytic debinding furnace 230, and the nitric acid catalytic debinding furnace 230 will remove the binder of the green body 130 to obtain a brown body 140.

[0046] Step S50: Sinter the brown embryo 140 to obtain a silver embryo, which is a metal casing 10. Further, since the brown embryo 140 is prone to cracking, it is necessary to strengthen the structural strength and hardness of the brown embryo. Therefore, sintering is to place the brown embryo 140 in a sintering furnace 240, and the sintering furnace 240 will sinter the brown embryo 140 into a silver embryo using high temperature. The silver embryo has characteristics such as high structural strength, high hardness, etc., and will not crack, making it suitable as the metal casing 10.

[0047] Step S60: Place a memory body 20 in a groove 11 of the metal casing 10.

[0048] Step S70: Put the assembled metal casing 10 and memory body 20 together into a mold (not shown in the figure), and through insert injection molding, so that a plastic upper cover 30 covers a control part 21 of the memory body 20, and an electrical connection part 22 of the memory body 20 is exposed outside to obtain a high-strength memory card 1.

[0049] In a preferred embodiment, the metal powder 100 is stainless steel powder, and the material of the metal casing 10 is stainless steel. However, the present invention is not limited thereto, and any metal powder that can be sintered into a silver embryo with high strength and high hardness can be used as the material of the metal casing 10.

[0050] In a preferred embodiment, after step S50, the following steps are further included: Step S80: Perform surface treatment on the silver embryo to obtain a metal casing 10 with a smooth surface.

[0051] In summary, because the structure of the metal casing 10 has characteristics such as high strength, high hardness, high temperature resistance, reduced signal interference, and improved heat dissipation, even if the user accidentally drops the high-strength memory card 1 of the present invention on the ground or bends it forcefully, the metal casing 10 will not crack or deform. Therefore, the metal casing 10 can provide good protection for the control part 21 of the memory body 20, and the control part 21 of the memory body 20 will not have a cracking problem, thereby avoiding damage to the control part 21 of the memory body 20 and loss of function.

[0052] Furthermore, stainless steel has good corrosion resistance, good structural strength, and hard hardness, and will not crack, making it suitable as the material of the metal casing 10, enabling the metal casing 10 to provide better protection for the control part 21 of the memory body 20, and perfectly solving the shortcoming that the memory card in the prior art is easily damaged.

[0053] In addition, the metal casing 10 can provide good dust-proof and waterproof effects.

[0054] Also, the surface of the metal casing 10 is smooth, which can increase practicality, aesthetics, and touch.

[0055] The above are only preferred embodiments for explaining the present invention and are not intended to limit the present invention in any form. Therefore, any modifications or changes made to the present invention under the same creative spirit should still be included within the scope intended to be protected by the present invention.

Claims

1. A high-strength memory card, characterized in that, it includes: a metal housing having a groove; a memory body placed in the groove and including a control part and an electrical connection part; and a plastic upper cover covering the control part so that the electrical connection part is exposed.

2. The high-strength memory card according to claim 1, characterized in that, the material of the metal housing is stainless steel.

3. The high-strength memory card according to claim 1, characterized in that, the surface of the metal housing is smooth.

4. A manufacturing method of a high-strength memory card, characterized in that, it includes the following steps: mixing a metal powder and a binder through kneading to obtain a composite material; granulating the composite material to obtain a raw material; injecting the raw material through injection molding to obtain a green body; subjecting the green body to catalytic debinding with nitric acid to obtain a brown body; sintering the brown body to obtain a silver body, and the silver body is a metal housing; placing a memory body in a groove of the metal housing; and putting the assembled metal housing and the memory body together into a mold and performing in-mold injection molding so that a plastic upper cover covers a control part of the memory body and an electrical connection part of the memory body is exposed to obtain a high-strength memory card.

5. The manufacturing method of the high-strength memory card according to claim 4, characterized in that, the metal powder is stainless steel powder and the material of the metal housing is stainless steel.

6. The manufacturing method of the high-strength memory card according to claim 4, characterized in that, after the step of obtaining the silver body, the following steps are further included: subjecting the silver body to surface treatment to obtain the metal housing with a smooth surface.

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