A resistive conductive material, its preparation method and use

By introducing a dispersed reinforcing phase and a transition layer into the resistive material, the problems of low resistivity and poor etch resistance are solved, resulting in a resistive material with high resistivity and good etch resistance, suitable for the manufacture of printed circuit boards.

CN120076170BActive Publication Date: 2026-06-16JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
Filing Date
2025-01-14
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

Existing resistive materials have low resistivity and are not resistant to chemical etching, resulting in insufficient stability and reliability of embedded resistive devices during the manufacturing process.

⚗Method used

The structure consists of a copper foil layer, a transition layer, and a resistive layer. The resistive layer contains a dispersed reinforcing phase and a homogeneous phase, which are prepared by electroplating. The dispersed reinforcing phase is distributed in the resistive layer in the form of particles or clusters, which increases the resistivity and improves the etching resistance.

🎯Benefits of technology

A resistive material with a resistivity higher than 3×10-3Ω·cm has been achieved, which has excellent etching resistance, ensuring that the resistive layer is not damaged during the etching process and maintaining the stability and reliability of the resistive device.

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Abstract

The application relates to a resistance conductive material and a preparation method and application thereof, wherein the resistance conductive material comprises, from bottom to top, a copper foil layer, a transition layer and a resistance layer; the resistance layer comprises a dispersion reinforcing phase and a homogeneous phase; the dispersion reinforcing phase is subjected to surface pretreatment before being added into an electroplating solution. Through the introduction of the transition layer and the dispersion reinforcing phase, the diffusion of copper into the resistance layer is inhibited, the high resistivity of the resistance layer is maintained, and the application prospect is good.
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