Condensation display device and display module thereof
By introducing Fresnel lenses, ultra-thin flexible cover layer and conductive buffer layer into the display device, the problems of poor contrast, uniformity and light concentration effects in the prior art are solved, and efficient light output and mechanical performance improvement are achieved, and suitable for outdoor decorative lighting and other fields.
Patent Information
- Application Number
- CN202510407600.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2025-05-30
AI Technical Summary
In the fields of exterior decorative lighting, existing display devices are difficult to meet the requirements of high contrast, luminous uniformity and excellent light-concentration effects.
A light-concentrating display device is designed, which includes a display module, which consists of a display frame, a display unit and a buffer layer. The display unit includes a Fresnel lens, an ultra-thin flexible cover layer and a bottom luminescent OLED display panel. The buffer layer is made of conductive material and is connected to the display panel and the display frame through a third adhesive layer.
While achieving high contrast and luminous uniformity, the light output and concentration effect of the display device is improved, mechanical strength and weather resistance are enhanced, and it is suitable for high-designed application scenarios such as exterior decorative lighting.
Smart Images
Figure CN120076595A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of display technologies, and more particularly, to a light - condensing display device and a display module thereof. Background Art
[0002] With the improvement of user requirements, the requirements for light output and light condensation of display devices are more stringent. Especially in fields such as vehicle exterior decorative lighting, such as vehicle lights, higher requirements are placed on the display performance and light - condensing performance of display devices.
[0003] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention
[0004] The purpose of the present disclosure is to overcome the above - mentioned deficiencies of the prior art, and provide a light - condensing display device and a display module thereof, which can have better light output and light - condensing effects while the display device has performance such as high contrast and uniform light emission.
[0005] According to one aspect of the present disclosure, a display module is provided, including:
[0006] A display frame;
[0007] A display unit located inside the display frame; the display unit includes a display panel, a cover plate layer, and a light - condensing lens; the cover plate layer is disposed on the light - output side of the display panel, and the light - condensing lens is disposed on the side of the cover plate layer away from the display panel, and the light - condensing lens is used for condensing the light output from the display panel.
[0008] In an embodiment of the present disclosure, the light - condensing lens is a Fresnel lens.
[0009] In an embodiment of the present disclosure, the material of the cover plate layer is ultra - thin flexible glass or colorless polyimide.
[0010] In an embodiment of the present disclosure, a buffer layer is disposed between the backlight side of the display panel and the display frame.
[0011] In an embodiment of the present disclosure, the buffer layer is prepared from a conductive material.
[0012] In an embodiment of the present disclosure, the buffer layer is connected to the backlight side of the display panel and the display frame through a third adhesive layer;
[0013] The third adhesive layer is prepared from a conductive material.
[0014] In an embodiment of the present disclosure, the orthographic projection of the display panel on the display frame is located within the orthographic projection of the condenser lens on the display frame, and the orthographic projection of the display panel on the display frame is smaller than the orthographic projection of the condenser lens on the display frame;
[0015] On the side of the condenser lens close to the display panel, at least a part of the non-overlapping area with the display panel is provided with buffer support columns connected to the display frame.
[0016] In an embodiment of the present disclosure, on the side of the condenser lens close to the display panel, at least a part of the non-overlapping area with the display panel is provided with a plurality of the buffer support columns.
[0017] In an embodiment of the present disclosure, a buffer layer is provided between the backlight side of the display panel and the display frame;
[0018] The height of the buffer support column is greater than the distance between the side of the buffer layer away from the condenser lens and the condenser lens.
[0019] In an embodiment of the present disclosure, the buffer support column is made of a conductive material.
[0020] In an embodiment of the present disclosure, the display panel is a bottom-emitting display panel.
[0021] According to another aspect of the present disclosure, a condenser display device is provided, which has the above-mentioned display module.
[0022] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.
[0024] Figure 1 It is a schematic structural diagram of a display panel in an embodiment of the present disclosure.
[0025] Figure 2 It is a schematic structural diagram of a display panel in an embodiment of the present disclosure.
[0026] Figure 3 It is a schematic structural diagram of a display panel in an embodiment of the present disclosure.
[0027] Figure 4 In an embodiment of the present disclosure, it is a schematic structural diagram of a display unit.
[0028] Figure 5 In an embodiment of the present disclosure, it is a schematic structural diagram of a display unit.
[0029] Figure 6 In an embodiment of the present disclosure, it is a schematic structural diagram of a display unit.
[0030] Figure 7 In an embodiment of the present disclosure, it is a schematic structural diagram of a display unit.
[0031] Figure 8 In an embodiment of the present disclosure, it is a schematic structural diagram of a display unit.
[0032] Figure 9 In an embodiment of the present disclosure, it is a schematic structural diagram of a display unit. Detailed implementation manners
[0033] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.
[0034] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the directions of the examples described in the accompanying drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.
[0035] The terms "a", "an", "the", and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", etc. are used only as labels and are not a limitation on the quantity of their objects.
[0036] In this application, unless otherwise clearly specified and defined, the term "connection" shall be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one; it can be directly connected or indirectly connected through an intermediate medium.
[0037] In an embodiment of the present disclosure, a thin film transistor (TFT) includes an active layer, a gate insulating layer, and a gate which are stacked. Among them, the active layer is located in the semiconductor layer, and the active layer includes a channel region and a source electrode and a drain electrode respectively located on both sides of the channel region. Among them, the channel region maintains semiconductor characteristics, and both the source electrode and the drain electrode are made conductive. In an embodiment of the present disclosure, in the case of using transistors with opposite polarities or in the case of a change in the current direction during the operation of the circuit, etc., the functions of the "source electrode" and the "drain electrode" sometimes swap with each other, that is, the "drain electrode" and the "source electrode" can swap with each other. In an embodiment of the present disclosure, for any one transistor, one of the "source electrode" and the "drain electrode" is referred to as the first pole of the transistor, and the other is referred to as the second pole of the transistor.
[0038] The present disclosure provides a condenser display device, which is an OLED display device applicable to spotlights, and the condenser display device can be applicable to application scenarios such as vehicle exterior decorative lighting (such as vehicle lights), industrial control, and medical treatment. Among them, the display device has a display module.
[0039] In one example, refer to Figures 4 - 9 , the display module has a display frame (not shown in the figure) and a display unit.
[0040] In one example, the display frame has a bottom plate and an annular side plate. The annular side plate is connected to one surface of the bottom plate (the annular side plate has a structure adapted to the bottom plate), so as to form an installation cavity between the bottom plate and the annular side plate, and the display unit is located in the installation cavity.
[0041] Refer to Figures 4 - 9 , the display unit includes a display panel PNL disposed on the bottom plate.
[0042] In an embodiment of the present disclosure, the display panel PNL can be an OLED (Organic Light-Emitting Diode) display panel PNL. Refer to Figure 1 , the display panel PNL includes a display area AA and a non-display area BB located outside the display area AA. The non-display area BB can be a continuous annular area surrounding the display area AA, or an area discontinuously surrounding the outside of the display area AA. The display area AA can be used for emitting light to display an image, while the non-display area BB does not emit light.
[0043] In this example, refer toFigure 2 With Figure 5 , the display panel PNL may include a display layer QP. Among them, the display layer QP includes a driving backplane DBP and a pixel layer PIXL that are sequentially stacked. Among them, the driving backplane DBP may include a substrate SBT and a driving layer DRL that are stacked, and the pixel layer PIXL is disposed on a side of the driving layer DRL away from the substrate SBT. In this example, a light-emitting element LD for display is provided in the pixel layer PIXL, and a pixel circuit PDC for driving each light-emitting element LD to emit light is provided in the driving layer DRL.
[0044] Optionally, the substrate SBT is a transparent substrate. The substrate SBT may be a substrate of an inorganic material, or a substrate of an organic material, or a substrate in which organic materials and inorganic materials are alternately stacked. For example, in an embodiment of the present disclosure, the material of the substrate SBT may be a glass material such as soda-lime glass, quartz glass, or sapphire glass. The above materials have high mechanical strength and weather resistance, and can protect the display panel PNL. In another embodiment of the present disclosure, the material of the substrate SBT may be a material such as Polymethyl methacrylate (PMMA), Polyvinylalcohol (PVA), or a combination thereof.
[0045] Optionally, refer to Figure 2 With Figure 3 , in the driving layer DRL, any one pixel circuit may include a thin film transistor TFT and a storage capacitor. Further, the thin film transistor may be selected from a top-gate thin film transistor, a bottom-gate thin film transistor, or a double-gate thin film transistor; the material of the active layer of the thin film transistor may be an amorphous silicon semiconductor material, a low-temperature polycrystalline silicon semiconductor material, a metal oxide semiconductor material, an organic semiconductor material, a carbon nanotube semiconductor material, or other types of semiconductor materials; the thin film transistor may be an N-type thin film transistor or a P-type thin film transistor.
[0046] It can be understood that, among the various transistors in the pixel circuit, the types of any two transistors can be the same or different. Exemplarily, in some embodiments, in a pixel circuit, some transistors can be N-type transistors and some transistors can be P-type transistors. As another example, in some other embodiments, in a pixel circuit, the material of the active layer of some transistors can be a low-temperature polysilicon semiconductor material, and the material of the active layer of some transistors can be a metal oxide semiconductor material. In some embodiments of the present disclosure, the thin-film transistor is a low-temperature polysilicon transistor. In some other embodiments of the present disclosure, some thin-film transistors are low-temperature polysilicon transistors and some thin-film transistors are metal oxide transistors.
[0047] In one embodiment of the present disclosure, referring to Figure 3 , the driving layer DRL may include a semiconductor layer SCL, a gate insulating layer GI, a gate layer GT, an interlayer dielectric layer ILD, a source-drain metal layer SD, a planarization layer PLN, etc., which are stacked between the substrate SBT and the pixel layer PIXL. Each thin-film transistor and storage capacitor can be formed by film layers such as the semiconductor layer SCL, the gate insulating layer GI, the gate layer GT, the interlayer dielectric layer ILD, and the source-drain metal layer SD. Among them, the positional relationship of each film layer can be determined according to the film layer structure of the thin-film transistor. Further, the semiconductor layer SCL can be used to form the channel region of the transistor, as well as the first pole and the second pole located on both sides of the channel region. When necessary, it can also be formed into partial traces or conductive structures through conductorization. The gate layer GT can be used to form one or more of the gate layer traces such as the scan trace, the reset control trace, and the light emission control trace, can also be used to form the gate of the transistor, and can also be used to form part or all of the electrode plates of the storage capacitor. The source-drain metal layer SD can be used to form the source-drain metal layer traces such as the data trace and the driving power supply voltage trace, and can also be used to form part of the electrode plates of the storage capacitor. Of course, in other embodiments of the present disclosure, the driving layer DRL can also include other film layers according to needs. For example, it can also include a light-shielding layer (not shown in the figure) and an inorganic panel buffer layer BUF located between the semiconductor layer SCL and the substrate SBT. According to needs, any one of the above film layers such as the semiconductor layer SCL, the gate layer GT, and the source-drain metal layer SD can also be a multi-layer. For example, the driving layer DRL can include two different semiconductor layers SCL, or include two or three source-drain metal layers SD, or include two or three gate layers GT; correspondingly, the insulating film layers (such as the gate insulating layer GI, the interlayer dielectric layer ILD, the planarization layer PLN, etc.) in the driving layer DRL can be increased or decreased adaptively, or new insulating film layers can be added according to needs.
[0048] As an example, referring to Figure 3, the driving layer DRL may include an inorganic panel buffer layer BUF, a semiconductor layer SCL, a gate insulating layer GI, a gate layer GT, an interlayer dielectric layer ILD, a source-drain metal layer SD, and a planarization layer PLN that are sequentially stacked on the surface of the substrate SBT. The thin-film transistor thus formed is a top-gate thin-film transistor. In other examples, the driving layer may include an inorganic buffer layer, a gate layer, a gate insulating layer, a semiconductor layer, a source-drain metal layer, and a planarization layer that are sequentially stacked on the surface of the substrate. The thin-film transistor thus formed is a bottom-gate thin-film transistor. In other examples, the driving layer may also have a double-gate thin-film transistor and so on.
[0049] It can be understood that the above examples of the driving backplane DBP are only one possible way of the driving backplane DBP of the embodiments of the present disclosure. In other embodiments of the present disclosure, the driving backplane DBP may also have other structures.
[0050] In one embodiment of the present disclosure, refer to Figure 2 and Figure 3 , the light-emitting element LD in the pixel layer PIXL is a thin-film light-emitting element, which may include two electrodes stacked and a light-emitting functional layer EFL sandwiched between the two electrodes. For example, refer to Figure 4 , the pixel layer PIXL may include a pixel electrode layer PEL, a light-emitting functional layer EFL, and a common electrode layer COML that are sequentially stacked on the side of the planarization layer PLN facing away from the substrate SBT. Among them, the pixel electrode layer PEL has a plurality of pixel electrodes; the part of the light-emitting functional layer EFL connected to the pixel electrode serves as the light-emitting functional unit of the light-emitting element LD, and the common electrode layer COML serves as a common electrode and is electrically connected to the light-emitting functional units of the respective light-emitting elements LD.
[0051] In this example, refer to Figure 3, the pixel layer PIXL may further include a pixel definition layer PDL located between the pixel electrode layer PEL and the light-emitting functional layer EFL. The pixel definition layer PDL has a plurality of through pixel openings respectively corresponding to a plurality of pixel electrodes, and at least a partial area of a corresponding pixel electrode is exposed by any one pixel opening. For example, the pixel definition layer PDL covers the edge of the pixel electrode and exposes at least a partial inner area of the pixel electrode, so that the pixel definition layer PDL can effectively define the actual effective area of the pixel electrode (the area directly connected to the light-emitting functional unit), and further define the light-emitting area and light-emitting area of the light-emitting element LD. The light-emitting functional layer EFL at least covers the pixel electrode exposed by the pixel definition layer PDL. The common electrode layer COML may cover the light-emitting functional layer EFL. The pixel electrode and the common electrode layer COML provide carriers such as electrons and holes to the light-emitting functional layer EFL, so that the light-emitting functional layer EFL emits light. The part of the light-emitting functional layer EFL located between the pixel electrode and the common electrode layer COML may serve as a light-emitting functional unit. The pixel electrode, the common electrode layer COML, and the light-emitting functional unit form a light-emitting element LD. Among them, one of the pixel electrode and the common electrode layer COML serves as the anode of the light-emitting element LD, and the other serves as the cathode of the light-emitting element LD.
[0052] In one example, the pixel electrode may serve as the anode of the light-emitting element LD, and the common electrode layer COML may serve as the cathode of the light-emitting element LD.
[0053] In some embodiments of the present disclosure, the types of the light-emitting elements LD are different, and the materials and film layers of the light-emitting functional units are different.
[0054] In this example, the light-emitting functional layer EFL may include an organic light-emitting layer, and may include one or more of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer. Further, the organic light-emitting layer may include a light-emitting layer host material and a light-emitting layer guest material, and the light-emitting layer guest material may be a fluorescent dopant or a phosphorescent dopant, especially a thermally activated delayed fluorescence material.
[0055] In one embodiment of the present disclosure, refer to Figure 2 And Figure 3, the thin film encapsulation layer TFE can be disposed on the surface of the pixel layer PIXL away from the substrate SBT, and it can include an inorganic encapsulation layer and an organic encapsulation layer arranged alternately in a stacked manner. The inorganic encapsulation layer can effectively block external moisture and oxygen, preventing water and oxygen from invading the pixel layer PIXL and causing the materials in the pixel layer PIXL to age. Optionally, the edge of the inorganic encapsulation layer can be located in the non-display area BB. The organic encapsulation layer is located between two adjacent inorganic encapsulation layers to achieve planarization and reduce the stress between the inorganic encapsulation layers. Among them, the edge of the organic encapsulation layer can be located between the edge of the display area and the edge of the inorganic encapsulation layer. Exemplarily, refer to Figure 3 , the thin film encapsulation layer TFE includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP, and a second inorganic encapsulation layer CVD2 that are sequentially stacked on the side of the pixel layer PIXL (common electrode layer COML) away from the substrate SBT. Of course, in other embodiments of the present disclosure, the display panel PNL may also not be provided with a thin film encapsulation layer, but other methods may be used to encapsulate and protect the pixel layer.
[0056] In an embodiment of the present disclosure, refer to Figures 4 - 9 , the non-display area BB of the display panel PNL has a bonding area, and one end of the flexible printed circuit FPC is bonded to the bonding area. After the flexible printed circuit FPC is bent (the bending 032 is not shown in the figure), the other end is located on the backlight side of the display panel PNL and is bonded to the driving circuit QD that drives the display panel PNL to display.
[0057] In an embodiment of the present disclosure, refer to Figures 4 - 9 , in the bonding area between the flexible printed circuit FPC and the display panel PNL, an auxiliary adhesive layer OCF is further provided. The auxiliary adhesive layer OCF can make the connection between the flexible printed circuit FPC and the display panel PNL more stable, and can be connected to the thin film encapsulation layer TFE to further improve the encapsulation effect.
[0058] In an embodiment of the present disclosure, refer to Figures 4 - 9 , the display panel PNL is a bottom-emitting display panel. The bottom-emitting display panel can provide a uniform light source distribution, and has cost-effectiveness and operational convenience during the manufacturing process. During transportation and processing, a protective film is attached to the outermost side of the display panel PNL for protection.
[0059] In this example, after the flexible printed circuit FPC is bent to the backlight side of the display panel PNL, it can be bonded to the backlight side of the display panel PNL. In this way, not only can the structural stability of the display panel PNL be enhanced, but also the flexible printed circuit FPC can accept a custom fixing solution by a third party or an end user according to the actual installation situation in a free-floating state, thereby improving the flexibility and adaptability of the design.
[0060] In an embodiment of the present disclosure, refer to Figures 4 - 9 , the display panel PNL is fixed on the display frame through the third adhesive layer OC3.
[0061] In an embodiment of the present disclosure, a black matrix (not shown in the figure) is provided on the substrate SBT. It can be understood that there is also a black matrix between the substrate SBT and the inorganic panel buffer layer BUF. The black matrix can block ambient light and avoid or reduce the reflection of each trace and the metal structure of the driving layer DRL to the human eye, improving the display performance of the display device and the image quality of the displayed image. In this example, the black matrix has a plurality of light-transmitting openings, and each light-transmitting opening is arranged in one-to-one correspondence with the pixel opening of each pixel definition layer PDL. In another example, the black matrix can also be located between the inorganic panel buffer layer BUF and the pixel layer PIXL. In another example, the black matrix can also be embedded inside the substrate SBT. Among them, the material of the black matrix includes but is not limited to metal (chromium; Cr), metal alloy, black resin or a combination thereof.
[0062] In an embodiment of the present disclosure, refer to Figures 4 - 9 , the display panel PNL further includes a color filter layer CF on the light-emitting side. In other words, in the bottom-emitting display panel PNL, the color filter layer CF is provided on the side of the substrate SBT away from the pixel layer PIXL. The color filter layer CF can make the light color emitted by the display panel PNL closer to the standard color coordinates. In one example, the color filter layer CF can be a color filter glass. In another example, the color filter layer CF can be a color filter film. Of course, in other examples, the color filter layer CF can also adopt other structures not shown.
[0063] In the related art, the vehicle technology field has put forward higher requirements for the light extraction and light concentration of display devices.
[0064] In order to meet the high requirements of high light extraction and light concentration, the present disclosure is optimized on the basis of the existing display device, and provides an OLED display device suitable for a spotlight.
[0065] In an embodiment of the present disclosure, refer to Figures 4 - 9, the display module further includes a condenser lens TJ, which is located on the light-emitting side of the display panel PNL and is used to condense the light emitted by the display panel PNL. Specifically, in the bottom-emitting display panel PNL, the condenser lens TJ is located on the side of the filter layer CF away from the substrate SBT. In one example, the condenser lens TJ is bonded to the filter layer CF through a first bonding layer OC1, and the light emitted by the light-emitting element LD of the display panel PNL passes through the filter layer CF and the condenser lens TJ in sequence and then exits. In the present disclosure, the condenser lens TJ is provided to achieve more efficient light output through the light-condensing characteristics of the condenser lens TJ while maintaining the high contrast and uniformity of the OLED display device. In one example, the condenser lens TJ can be a Fresnel lens, which is thinner and lighter, can reduce costs (transportation costs and installation costs), and has stronger light-condensing ability, and can provide a better light-condensing characteristic for the display device. Of course, in other examples, the condenser lens TJ can also adopt other structures not shown.
[0066] In this example, the material of the first bonding layer OC1 can be an optically transparent bonding material. For example, OCA (Optically Clear Adhesive), OCR (Optical Clear Resin), so as to ensure the stability and long-term reliability of the optical performance of the display device.
[0067] In an embodiment of the present disclosure, refer to Figure 5 , Figure 6 and Figure 9 , there is also a cover layer GB between the condenser lens TJ and the display panel PNL. Wherein, one side of the cover layer GB is connected to the condenser lens TJ through the first bonding layer OC1, and the other opposite side of the cover layer GB is bonded to the filter layer CF through the second bonding layer OC2.
[0068] In one example, the material of the second bonding layer OC2 can be an optically transparent bonding material. For example, OCA (Optically Clear Adhesive), OCR (Optical Clear Resin), so as to ensure the stability and long-term reliability of the optical performance of the display device.
[0069] In this example, the orthographic projection of the cover plate layer GB on the display frame is not less than the orthographic projection of the display panel PNL on the display frame, and the orthographic projection of the cover plate layer GB on the display frame is not greater than the orthographic projection of the condenser lens TJ on the display frame. In this way, the setting of the cover plate layer GB can not only improve the mechanical strength and overall encapsulation performance of the display device, but also protect the display panel PNL during the assembly process of the condenser lens TJ and the display panel PNL, avoiding damage to the display panel PNL during the bonding of the condenser lens TJ. In this example, the orthographic projection of the cover plate layer GB on the display frame is equal to the orthographic projection of the display panel PNL on the display frame, and the orthographic projection of the cover plate layer GB on the display frame completely covers the orthographic projection of the display panel PNL on the display frame, so that the display panel PNL can be comprehensively protected.
[0070] In an example of the present disclosure, the cover plate layer GB can be prepared from a transparent flexible material. In one example, the material of the cover plate layer GB can be ultra-thin flexible glass (UTG) or colorless polyimide (CPI), etc. While maintaining the ultra-thin characteristics, these materials significantly improve the mechanical strength and overall encapsulation performance of the structure, ensuring the durability and impact resistance of the product. Of course, in other examples, the cover plate layer GB can also be prepared from other flexible materials not shown.
[0071] In an embodiment of the present disclosure, refer to Figure 6 and Figure 9 , a buffer layer BU is provided between the backlight side of the display panel PNL and the display frame. The buffer layer BU can provide additional mechanical protection for the display device. The buffer layer BU provided in the present disclosure can further enhance the mechanical characteristics of the display device and meet the weather resistance requirements of application scenarios such as vehicle-mounted, industrial control, and medical. Specifically, the buffer layer BU is bonded to the backlight side of the display panel PNL, and the buffer layer BU is connected to the bottom plate of the display frame through a third adhesive layer OC3. The orthographic projection of the buffer layer BU on the display frame is not less than the orthographic projection of the display panel PNL on the display frame, and the orthographic projection of the display panel PNL on the display frame is located within the orthographic projection of the buffer layer BU on the display frame. In this way, the buffer layer BU can comprehensively protect the display panel PNL. In this example, the orthographic projection of the buffer layer BU on the display frame is equal to the orthographic projection of the display panel PNL on the display frame.
[0072] In one example, the material of the buffer layer BU can be a common flexible material, providing additional mechanical protection for the display device. For example, the material of the buffer layer BU can be silicone rubber, polyurethane, or other materials. In another example, the material of the buffer layer BU can be a conductive flexible material, providing both additional mechanical protection and electrical insulation protection for the display device while conducting away the static electricity on the display panel PNL. For example, the material of the buffer layer BU can be conductive adhesive, conductive rubber, or other materials.
[0073] In an embodiment of the present disclosure, the buffer layer BU can be connected to the backlight side of the display panel PNL using conductive adhesive, and the buffer layer BU can also be connected to the third adhesive layer OC3 using conductive adhesive. In this way, while providing additional mechanical protection for the display device, the buffer layer BU can also cooperate with the conductive adhesive to provide electrical insulation protection for the display device (the conductive flexible material can conduct away the static electricity on the display panel PNL).
[0074] In an embodiment of the present disclosure, in order to improve the assembly and working fault tolerance of the display unit, a redundant support structure is additionally provided in the present disclosure. In one example, referring to Figure 7 、 Figure 8 and Figure 9 , the orthographic projection of the display panel PNL on the display frame is located within the orthographic projection of the condenser lens TJ on the display frame, and the orthographic projection of the display panel PNL on the display frame is smaller than the orthographic projection of the condenser lens TJ on the display frame; the condenser lens TJ is provided with buffer support columns HZ connected to the display frame in at least part of the non-overlapping area with the display panel PNL. In other words, the condenser lens TJ has an overlapping area that coincides with the display panel PNL and a non-overlapping area that does not coincide with the display panel PNL (in the present disclosure, the overlapping area refers to the area where the orthographic projection of the condenser lens TJ on the display frame coincides with the orthographic projection of the display panel PNL on the display frame, and the non-overlapping area refers to the area where the orthographic projection of the condenser lens TJ on the display frame does not coincide with the orthographic projection of the display panel PNL on the display frame). In the non-overlapping area, the condenser lens TJ has buffer support columns HZ on the side close to the display panel PNL. It can be understood that one end of the buffer support column HZ is connected to the condenser lens TJ, and the other end is connected to the display frame. In this way, the buffer support column HZ can further improve the shock resistance of the display unit. In the present disclosure, the setting of the buffer support column HZ should avoid the relevant circuits of the display panel PNL, such as avoiding FPC, etc., and should not interfere with the display, layout, etc. of the display panel PNL.
[0075] In an embodiment of the present disclosure, in the non-overlapping region, the condenser lens TJ has a plurality of buffer support columns HZ on the side close to the display panel PNL. The setting of the plurality of buffer support columns HZ can further improve the impact resistance of the display unit (for example, improve the impact resistance of the condenser lens TJ). In one example, the plurality of buffer support columns HZ can be independently arranged, so that the setting positions of the buffer support columns HZ have greater flexibility. In another example, the plurality of buffer support columns HZ can be connected to form an integral structure, which is convenient for preparation.
[0076] In an embodiment of the present disclosure, the buffer support columns HZ can be evenly arranged. In this way, uniform impact resistance can be provided for the display unit, and the display unit will not be damaged due to uneven force. In other examples, the density of each buffer support column HZ can be flexibly set according to requirements to achieve key protection for key areas of the display panel PNL. Herein, the density in the present disclosure refers to the number of buffer support columns HZ per unit area.
[0077] In an embodiment of the present disclosure, the height of the buffer support column HZ is not less than the distance between the third adhesive layer OC3 and the condenser lens TJ. In other words, the distance between the side of the buffer support column HZ away from the condenser lens TJ and the condenser lens TJ is not less than the distance between the side of the third adhesive layer OC3 away from the condenser lens TJ and the condenser lens TJ. In this way, the buffer support column HZ can provide good impact resistance for the entire display unit. In the embodiments of the present disclosure, referring to Figure 8 and Figure 9 , the distance between the side of the buffer support column HZ away from the condenser lens TJ and the condenser lens TJ is greater than the distance between the side of the third adhesive layer OC3 away from the condenser lens TJ and the condenser lens TJ. In this way, when an external force impacts, the buffer support column HZ can first buffer the external force and provide greater protection for the display panel PNL. In addition, the risk of damage caused by assembly errors of the display unit (assembly errors between each film layer, such as the assembly error between the condenser lens TJ and the display panel PNL) or external impacts can be reduced.
[0078] In an embodiment of the present disclosure, the buffer support column HZ can be prepared from common flexible materials, such as silicone, rubber and other materials. In another example, the buffer support column HZ is prepared from a conductive material. In this way, while the buffer support column HZ provides additional mechanical protection for the display panel PNL, it can also provide electrical insulation protection for the display panel PNL (the conductive flexible material can conduct away the static electricity on the display panel PNL).
[0079] In one embodiment of the present disclosure, the heights of the respective buffer support columns HZ are the same. In another embodiment of the present disclosure, the heights of at least some of the buffer support columns HZ are different, so that targeted protection can be provided according to different regions of the display unit.
[0080] The display device proposed in the present disclosure combines the surface light source emitted by the rigid bottom-emitting display panel PNL and the technology of the condenser lens TJ (Fresnel lens). While achieving high contrast and uniform light emission, it can also improve the light-emitting performance (the light-emitting performance of the display device is improved, and more efficient light output is achieved through the light-condensing characteristics of the Fresnel lens); moreover, in the present disclosure, structures such as the flexible ultra-thin cover layer GB and the flexible buffer layer BU are adopted to enhance the weather resistance and mechanical properties of the display device (the mechanical strength and impact resistance of the display device are enhanced, and the service life of the product is extended); and through the setting of the buffer support columns HZ (redundant design), the moisture and heat resistance, seismic performance and impact strength of the module are improved (through redundant design, the weather resistance and moisture and heat resistance of the display device are further improved, making it more suitable for outdoor use). It can be said that the display device in the present disclosure, while maintaining the advantages of high contrast and uniform light emission of the OLED display panel, ensures the long-term stability of the display device through structural optimization, and is particularly suitable for application scenarios such as vehicle exterior decorative lighting (it can also be said that the present disclosure is a targeted design based on application scenarios such as vehicle exterior decorative lighting). Generally speaking, the condenser display device proposed in the present disclosure is a headlight module structure that combines the high response characteristics of OLEDs, the ultra-thin module thickness, and the light-emitting characteristics of the surface light source.
[0081] Those skilled in the art will readily conceive of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and examples are only to be considered as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.
Claims
1. A display module, characterized in that: include: Display frame; A display unit is located inside the display frame; the display unit includes a display panel, a cover layer and a focusing lens; the cover layer is arranged on the light-emitting side of the display panel, and the focusing lens is arranged on the side of the cover layer away from the display panel, and the focusing lens is used to focus the light emitted by the display panel.
2. The display module according to claim 1, characterized in that: The focusing lens is a Fresnel lens.
3. The display module according to claim 1, characterized in that: The material of the cover layer is ultra-thin flexible glass or colorless polyimide.
4. The display module according to claim 1, characterized in that: A buffer layer is arranged between the backlight side of the display panel and the display frame.
5. The display module according to claim 4, characterized in that: The buffer layer is made of conductive material.
6. The display module according to claim 4, characterized in that: The buffer layer is connected to the backlight side of the display panel and the display frame through a third adhesive layer; The third adhesive layer is made of conductive material.
7. The display module according to claim 1, characterized in that: The orthographic projection of the display panel on the display frame is located within the orthographic projection of the condenser lens on the display frame, and the orthographic projection of the display panel on the display frame is smaller than the orthographic projection of the condenser lens on the display frame; The condenser lens is close to one side of the display panel, and at least a portion of the non-overlapping area with the display panel is provided with a buffer support column connected to the display frame.
8. The display module according to claim 7, characterized in that: The condenser lens is close to one side of the display panel, and at least a portion of the non-overlapping area with the display panel is provided with a plurality of the buffer support columns.
9. The display module according to claim 7, characterized in that: A buffer layer is provided between the backlight side of the display panel and the display frame; The height of the buffer support column is greater than the distance between the side of the buffer layer away from the condenser lens and the condenser lens.
10. The display module according to claim 7, characterized in that: The buffer support column is made of conductive material.
11. The display module according to claim 1, characterized in that: The display panel is a bottom-emitting display panel.
12. A light-collecting display device, characterized in that: A display module according to any one of claims 1 to 11.