Display panel, display device and tiled display device

Abstract

The embodiment of the invention provides a display panel, a display device and a tiled display device. The display panel includes: a substrate; the control circuit board is positioned on one side of the second surface of the substrate; the buffer structure comprises a first buffer part in contact with the second selected side surface, and the first buffer part is located on the side, facing the first selected side surface, of the second selected side surface; the connecting lead extends from the first surface, passes through the first selected side surface, passes through the surface of the buffer structure on the second surface and faces the second electrode, and is connected with the second electrode; the second surface of the substrate is at least provided with a first groove, the first groove comprises a first groove section and a second groove section which are communicated with each other, and the first groove section is located outside the control circuit board and the buffer structure; at least one part of the second groove section is located between the control circuit board and the second surface, and / or at least one part of the second groove section is located between the first buffer part and the second surface. According to the invention, bubbles can be effectively eliminated, and the connection lead is prevented from being broken.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a display panel, a display device, and a tiled display device. Background Art

[0002] Mini LED (Mini Light Emitting Diode) and Micro LED (Micro Light Emitting Diode) have extremely high application prospects in the display field due to their unique design features. Compared with traditional LEDs, Mini LED and Micro LED display panels have advantages such as low power consumption, high brightness, high resolution, color saturation, fast response, long lifespan, and high efficiency, which can greatly meet people's demands for excellent picture quality of display panels.

[0003] For Mini LED and Micro LED display products, large-sized display panels are usually formed by tiling multiple small-sized display panels. How to reduce the frame width of the display panel and achieve seamless display when tiling large-sized display panels has become the development direction of the products. Summary of the Invention

[0004] Embodiments of the present disclosure provide a display panel, a display device, and a tiled display device to solve or alleviate one or more technical problems in the prior art.

[0005] As the first aspect of the embodiments of the present disclosure, embodiments of the present disclosure provide a display panel, including:

[0006] A substrate, including a first surface and a second surface disposed opposite to each other, and at least one first selected side surface connecting the first surface and the second surface;

[0007] A control circuit board, disposed on the second surface of the substrate. The control circuit board includes a third surface and a fourth surface disposed opposite to each other, and at least one second selected side surface connecting the third surface and the fourth surface. The third surface is closer to the second surface than the fourth surface, and the second selected side surface corresponds to the first selected side surface. The control circuit board further includes a second electrode disposed on the fourth surface;

[0008] A buffer structure, disposed on one side of the second surface of the substrate. The buffer structure at least includes a first buffer portion, and the first buffer portion is in contact with the second selected side surface and is located on the side of the second selected side surface facing the first selected side surface;

[0009] A connection lead, extending from one side of the first surface of the substrate, passing through the first selected side surface, and passing through the surface of the buffer structure on the second surface side of the substrate and extending toward the second electrode to be connected to the second electrode;

[0010] Wherein, a groove structure is provided on the second surface of the substrate. The groove structure at least includes a first groove, and the first groove includes a first groove segment and a second groove segment that communicate with each other. The first groove segment is located outside the orthographic projections of the control circuit board and the buffer structure on the second surface;

[0011] At least a part of the second groove segment is located between the control circuit board and the second surface, and / or at least a part of the second groove segment is located between the first buffer portion and the second surface.

[0012] In some embodiments, a part of the second groove segment is located between the control circuit board and the second surface, and a part is located between the first buffer portion and the second surface.

[0013] In some embodiments, the orthographic projection of the first buffer portion on the second surface has a first projection boundary, and the first projection boundary is located between the first common side line and the second projection boundary. The second projection boundary is the orthographic projection of the second common side line on the second surface, and the second common side line is the intersection side line of the third surface and the second selected side surface;

[0014] The first groove segment is located between the first common side line and the first projection boundary.

[0015] In some embodiments, there is a first preset distance between the first common side line and the first projection boundary. The dimension of the first groove segment in the first direction is less than or equal to the first preset distance, and the first direction is perpendicular to the extension direction of the first common side line.

[0016] In some embodiments, the range of the distance between the end of the first groove segment close to the first common side line and the first common side line is 600 μm to 800 μm.

[0017] In some embodiments, the first groove extends from the end of the first groove segment close to the first common side line along a third direction and at least extends to the inside of the first projection boundary, and the third direction intersects with the extension direction of the first common side line;

[0018] In the first direction, the range of the distance between the end of the first groove close to the first common side line and the second projection boundary is 450 μm to 600 μm, and the first direction is perpendicular to the extension direction of the first common side line.

[0019] In some embodiments, the third direction is perpendicular to the extension direction of the first common side line.

[0020] In some embodiments, the groove structure includes a plurality of first grooves, and the plurality of first grooves are arranged at intervals along the extension direction of the first projection boundary.

[0021] In some embodiments, the distance between two adjacent first groove segments is greater than the width of the connecting lead.

[0022] In some embodiments, the number of connection leads is multiple. The connection leads include third-segment leads located on one side of the second surface of the substrate, and the multiple third-segment leads are arranged at intervals along the extending direction of the first common side line.

[0023] The first groove segment satisfies at least one of the following:

[0024] The width of the first groove segment is less than the distance between two adjacent third-segment leads.

[0025] The width of the first groove segment is less than the width of the third-segment lead.

[0026] The first groove segment is located between two adjacent third-segment leads.

[0027] In some embodiments, the width of the first groove is less than 300 μm.

[0028] In some embodiments, the first buffer portion has a first projection boundary on the second surface. The first projection boundary is located between the first common side line and the second projection boundary, and the second projection boundary is the projection of the second common side line on the second surface. The second common side line is the intersection side line of the third surface and the second selected side surface.

[0029] The angle between the surface of the first buffer portion and the second surface is less than or equal to a first preset angle θ. The thickness of the control circuit board is T, and the distance d4 between the first projection boundary and the second projection boundary is greater than or equal to T / tanθ, and the first preset angle θ is less than or equal to 20°.

[0030] In some embodiments, the surface of the first buffer portion is an inclined plane; or, the surface of the first buffer portion is a curved surface protruding away from the second surface.

[0031] In some embodiments, the buffer structure further includes a second buffer portion. The second buffer portion is connected to the first buffer portion, the second buffer portion is located on the fourth surface, and the surface of the second buffer portion is smoothly connected to the surface of the first buffer portion.

[0032] In some embodiments, the range of the distance between the second projection boundary and the first common side line is greater than or equal to 1200 μm.

[0033] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, including the display panel in any embodiment of the present disclosure. A first electrode is provided on the first surface of the substrate in the display panel, and the connection lead is connected to the first electrode.

[0034] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a tiled display device, including a plurality of display devices as in the embodiments of the present disclosure.

[0035] In the technical solution of the embodiments of the present disclosure, by providing a groove structure on the second surface of the substrate, the groove structure at least includes a first groove, the first groove includes a first groove segment and a second groove segment that communicate with each other, the first groove segment is located outside the orthographic projections of the control circuit board and the buffer structure on the second surface, and at least a part of the second groove segment is located between the control circuit board and the second surface, and / or at least a part of the second groove segment is located between the first buffer portion and the second surface, so that the first groove can form a bubble discharge channel. Thus, the bubbles in the second control circuit board and the bubbles during the curing process of the buffer structure can be discharged through the first groove, avoiding the breakage of the connection leads caused by the bubbles and improving the product yield.

[0036] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will be readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In the drawings, unless otherwise specified, the same reference numerals throughout the several views denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments in accordance with the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0038] Figure 1 is a schematic cross-sectional structure diagram of a display panel in the related art;

[0039] Figure 2A is a schematic cross-sectional view of a display panel with dispersed bubbles in an embodiment;

[0040] Figure 2B is a schematic plan view of a product with dispersed bubbles in an actual product;

[0041] Figure 3A is a schematic cross-sectional view of a display panel with compact bubbles in an embodiment;

[0042] Figure 3B is a schematic diagram of the breakage of the connection leads caused by the bursting of bubbles in an actual product;

[0043] Figure 4A is a schematic plan view of a display panel in an embodiment of the present disclosure;

[0044] Figure 4B is a schematic plan view of a display panel in another embodiment of the present disclosure;

[0045] Figure 5 is Figure 4A a schematic diagram of the C-C cross-section in an embodiment;

[0046] Figure 6 Schematic diagram of the bulge detection result of a substrate in an actual product;

[0047] Figure 7 Planar schematic diagram of the second surface side of a display panel in another embodiment;

[0048] Figure 8 Partial cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure;

[0049] Figure 9 Schematic diagram of the positional relationship between the first projection boundary BX1 of the first buffer portion and the control circuit board;

[0050] Figure 10A 、 Figure 10B 、 Figure 10C Cross-sectional schematic diagrams of three different included angles between the surface of the first buffer portion and the second surface;

[0051] Figure 11 Cross-sectional schematic diagram of a display panel in another embodiment of the present disclosure;

[0052] Figure 12 Schematic diagram of a tiled display device in an embodiment of the present disclosure.

[0053] Explanation of reference numerals:

[0054] 1. Substrate; 2. Control circuit board; 3. Buffer structure; 31. First buffer portion; 32. Second buffer portion; 4. Connection lead; 41. First segment of lead; 42. Second segment of lead; 43. Third segment of lead; 51. First groove; 511. First groove segment; 512. Second groove segment;

[0055] BX1. First projection boundary; BX2. First common edge; BX3. Second projection boundary. Detailed implementation manners

[0056] In the following, only some exemplary embodiments are briefly described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present disclosure, and different embodiments can be arbitrarily combined without conflict. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0057] In order to achieve a smaller pitch between two adjacent light-emitting elements on a display panel and a higher pixel resolution, in related technologies, light-emitting elements are provided on the first surface 1a of a substrate 1 of the display panel, a control circuit board 2 is attached to the second surface 1b of the substrate 1, and the control circuit board 2 on the second surface 1b is connected to the circuit on the first surface 1a through connection leads 4. The second surface 1b of the substrate 1 is disposed opposite to the first surface 1a.

[0058] Figure 1 FIG. is a schematic cross-sectional structure diagram of a display panel in related technologies, as Figure 1 shown, the display panel includes a substrate 1, a control circuit board 2, and connection leads 4. The substrate 1 includes a first surface 1a and a second surface 1b disposed opposite to each other, and a plurality of first side surfaces 1c connecting the first surface 1a and the second surface 1b. A plurality of first electrodes 11 are provided on the first surface 1a. At least one of the plurality of first side surfaces 1c of the substrate 1 is a first selected side surface 1cc. The control circuit board 2 is disposed on the second surface 1b of the substrate 1. The control circuit board 2 includes a flexible printed circuit (FPC). The control circuit board 2 includes a third surface 2a and a fourth surface 2b disposed opposite to each other, and a plurality of second side surfaces connecting the third surface 2a and the fourth surface 2b. The third surface 2a is closer to the second surface 1b than the fourth surface 2b, and the third surface 2a is bonded to the second surface 1b of the substrate 1. At least one of the plurality of second side surfaces is a second selected side surface 2cc, and the second selected side surface 2cc corresponds to the first selected side surface 1cc. The control circuit board 2 further includes a plurality of second electrodes 21 provided on the fourth surface 2b.

[0059] A plurality of connection leads 4 are correspondingly provided on the first selected side surface 1cc, and the plurality of connection leads 4 can be arranged side by side and spaced apart along the extending direction of the first selected side surface 1cc. Each connection lead 4 extends from one side of the first surface 1a of the substrate 1, through the first selected side surface 1cc, to the other side of the second surface 1b. That is to say, each connection lead 4 includes a first segment lead 41 on one side of the first surface 1a, a second segment lead 42 on one side of the first selected side surface 1cc, and a third segment lead 43 on one side of the second surface 1b. The first segment lead 41 is connected to the first electrode 11, and the third segment lead 43 extends from a first common edge line BX2 on the side of the second surface 1b of the substrate 1 to the fourth surface 2b of the control circuit board 2 and is connected to the second electrode 21.

[0060] The control circuit board 2 is attached to the second surface 1b through the third surface 2a, and the second electrodes 21 are located on the fourth surface 2b of the control circuit board 2. There is a certain distance between the third surface 2a and the fourth surface 2b of the control circuit board 2. That is to say, the control circuit board 2 has a certain thickness. Therefore, after the control circuit board 2 is attached to the second surface 1b, there is a first step difference between the fourth surface 2b and the second surface 1b.

[0061] If the third segment 43 of the connection lead 4 directly extends from the second surface 1b to the second electrode 21 on the fourth surface 2b, due to the existence of the first step difference, the third segment 43 of the connection lead 4 is prone to breakage at the first step difference position. To prevent the third segment 43 of the connection lead 4 from breaking due to the first step difference, in the related art, a buffer structure 3 is provided on the second surface 1b, and the buffer structure 3 can extend from the first surface 1a to at least the second selected side surface 2cc of the control circuit board 2, so that the buffer structure 3 compensates for the first step difference. Thus, when forming the connection lead 4, the third segment 43 of the connection lead 4 extends from the first surface 1a, through the surface of the buffer structure 3, to the surface of the second electrode 21 on the fourth surface 2b and is connected to the second electrode 21, reducing the breakage risk of the third segment 43 of the connection lead 4.

[0062] It can be understood that the control circuit board 2 can be a flexible circuit board. To achieve the attachment of the flexible circuit board, the flexible circuit board can include a body and an adhesive layer provided on one side of the body, and the adhesive layer is located on the side of the body facing the substrate 1. The surface of the adhesive layer facing away from the body is the third surface 2a of the control circuit board 2, and the surface of the body facing away from the adhesive layer is the fourth surface 2b of the control circuit board 2. During the preparation of the flexible circuit board, there may be air bubbles between the body and the adhesive layer.

[0063] To achieve the high-precision and rapid preparation of the connection lead 4, in the related art, the connection lead 4 is prepared by a printing process. The printing process can include at least one of screen printing, pad printing, transfer printing, and 3D printing. The preparation process of the display panel can include the following steps:

[0064] S11: Provide the substrate 1, and a plurality of first electrodes 11 are provided on the first surface 1a of the substrate 1.

[0065] S12: Attach the control circuit board 2 to the second surface 1b of the substrate 1, and a second electrode 21 is provided on the fourth surface 2b of the control circuit board 2 facing away from the substrate 1. The control circuit board 2 is attached to the second surface 1b of the substrate 1. During the attachment of the control circuit board 2, there may be air bubbles between the adhesive layer in the control circuit board 2 and the second surface 1b of the substrate 1.

[0066] S13: Form an initial buffer structure 3 by a printing process. The material of the initial buffer structure 3 can include ink. The initial buffer structure 3 forms the buffer structure 3 after curing. Air bubbles will be generated during the curing process of the initial buffer structure 3.

[0067] S14: Using a printing process, conductive paste for forming the connection lead 4 is formed on the first surface 1a, the first selected side surface 1cc, the second surface 1b, the surface of the buffer structure 3, and the surface of the control circuit board 2 of the substrate 1. After the conductive paste is cured, the connection lead 4 is formed. The connection lead 4 extends from one side of the first surface 1a of the substrate 1, passes through the first selected side surface 1cc, the second surface 1b, and the surface of the buffer structure 3 to the fourth surface 2b of the control circuit board 2 and is lap-connected to the second electrode 21.

[0068] As can be seen from the above process, bubbles may exist in multiple steps before the formation of the connection lead 4. In the subsequent process after the formation of the connection lead 4, when the product is in a high-temperature environment, the unexpelled bubbles will expand and burst, resulting in the fracture of the connection lead 4 after reliability, leading to poor connection and reducing the product yield.

[0069] From the above analysis, it can be seen that in order to prevent the connection lead 4 from breaking, how to effectively expel bubbles before the formation of the connection lead 4 is an urgent problem to be solved.

[0070] In order to effectively expel bubbles, the inventors of this case found through research that when there are dispersed bubbles and the maximum size a of the bubbles is less than or equal to the maximum width of the connection lead 4, it usually does not cause the connection lead 4 to break after the product reliability, as Figure 2A and Figure 2B shown. Figure 2A FIG. is a schematic cross-sectional view of a display panel with dispersed bubbles in an embodiment. Figure 2B FIG. is a schematic plan view of a product with dispersed bubbles in an actual product. For dispersed bubbles, whether the bubbles are completely located in the buffer structure 3 or a part of the bubbles is in the buffer structure 3 and a part overlaps the control circuit board 2, it will not cause the connection lead 4 to break after reliability. This is because the dispersed bubbles can ensure that in the heating process, the dispersed bubbles generated by attaching the control circuit board 2 can be evenly discharged, achieving sufficient exhaust, thereby preventing the sudden overflow of bubbles during the reliability test and causing the connection lead 4 to break.

[0071] Another type of bubble is local compact bubbles. As Figure 3A shown, in Figure 3A , multiple bubbles with smaller sizes are connected to each other, so that multiple small bubbles merge into a large bubble, forming a bulging phenomenon on the control circuit board 2. The position of the bulge is uncertain. The bulge may occur between the control circuit board 2 and the second surface 1b, or it may occur between the body of the control circuit board 2 and the adhesive layer. When the bulge occurs, in the subsequent process after the formation of the connection lead 4, when the product is in a high-temperature environment, the bulging bubbles will be discharged, causing the connection lead 4 to break as Figure 3B shown. Figure 3B FIG. is a schematic diagram of a connection lead fracture caused by bubble rupture in an actual product.

[0072] As can be seen, if the air bubbles can be effectively discharged before the connection lead 4 is formed, so that there are no large air bubbles or bulges in the product, the breakage of the connection lead 4 caused by the air bubbles can be effectively prevented. For this reason, an embodiment of the present disclosure provides a display panel.

[0073] For the convenience of describing directions, hereinafter, the direction perpendicular to the extension direction of the first common side line is defined as the first direction, the extension direction of the first common side line is defined as the second direction, and the direction intersecting the extension direction of the first common side line is defined as the third direction. Exemplarily, the third direction may be parallel to the first direction.

[0074] Figure 4A It is a schematic plan view of the display panel in an embodiment of the present disclosure. Figure 4B It is a schematic plan view of the display panel in another embodiment of the present disclosure, wherein Figure 4A and Figure 4B The schematic diagrams in may be the schematic view in the A direction of the display panel shown in. In order to clearly show the first groove, Figure 1 only the boundary line of the control circuit board and the boundary line of the buffer structure are shown in. As shown in Figure 4B and Figure 1 and Figure 4A The display panel may include a substrate 1, a control circuit board 2, a buffer structure 3, and a connection lead 4. The control circuit board 2 is disposed on the second surface 1b of the substrate 1. The first surface 1a of the substrate 1 is provided with a first electrode 11, and the fourth surface 2b of the control circuit board 2 is provided with a second electrode 21.

[0075] The buffer structure 3 is disposed on one side of the second surface 1b of the substrate 1. The buffer structure 3 at least includes a first buffer portion 31. The first buffer portion 31 is in contact with the second selected side surface 2cc and is located on the side of the second selected side surface 2cc facing the first selected side surface 1cc. The connection lead 4 extends from one side of the first surface 1a of the substrate 1, passes through the first selected side surface 1cc, and extends on the side of the second surface 1b of the substrate 1 through the surface of the buffer structure 3 toward the second electrode 21 and is connected to the second electrode 21.

[0076] The second surface 1b of the substrate 1 is provided with a groove structure. The groove structure at least includes a first groove 51. The first groove 51 can be formed by removing materials on the second surface 1b. The first groove 51 includes a first groove segment 511 and a second groove segment 512 that communicate with each other. The first groove segment 511 is located outside the orthographic projections of the control circuit board 2 and the buffer structure 3 on the second surface 1b. That is to say, the first groove segment 511 is located outside the orthographic projection of the control circuit board 2 on the second surface 1b and is located outside the orthographic projection of the buffer structure 3 on the second surface 1b. Thus, the first groove segment 511 is not covered by the control circuit board 2 and the buffer structure 3.

[0077] In one embodiment, at least a part of the second groove section 512 is located between the control circuit board 2 and the second surface 1b, so that the first groove 51 can form a bubble discharge channel for the control circuit board 2. Thus, during the process of attaching the control circuit board 2 to the second surface 1b of the substrate 1, the bubbles between the control circuit board 2 and the second surface 1b can be discharged through the second groove section 512 and the first groove section 511 of the first groove 51, avoiding the generation of bulges or large bubbles between the control circuit board 2 and the second surface 1b. Moreover, in subsequent processes, the high-temperature environment can further enable the bubbles remaining between the control circuit board 2 and the second surface 1b to be effectively discharged through the interconnected second groove section 512 and first groove section 511, avoiding the formation of bulges between the control circuit board 2 and the second surface 1b and preventing the connection leads 4 from breaking due to bubbles.

[0078] In one embodiment, at least a part of the second groove section 512 is located between the first buffer portion 31 and the second surface 1b, so that the first groove 51 can form a bubble discharge channel for the buffer structure 3. Thus, after the initial buffer structure is formed, the bubbles generated during the curing process of the initial buffer structure can be effectively discharged through the interconnected second groove section 512 and first groove section 511, preventing the connection leads 4 from breaking due to bubbles.

[0079] In one embodiment, a part of the second groove section 512 is located between the control circuit board 2 and the second surface 1b, and a part is located between the first buffer portion 31 and the second surface 1b, so that the first groove 51 simultaneously forms a bubble discharge channel for the control circuit board 2 and a bubble discharge channel for the buffer structure 3. Thus, the bubbles between the control circuit board 2 and the second surface 1b and the bubbles during the curing process of the initial buffer structure can both be effectively discharged through the interconnected second groove section 512 and first groove section 511, preventing the connection leads 4 from breaking due to bubbles.

[0080] As Figure 4B shown, a part of the second groove section 512 is located between the control circuit board 2 and the second surface 1b, and a part is located between the first buffer portion 31 and the second surface 1b. That is to say, the second groove section 512 is not located outside the control circuit board 2 and the first buffer portion 31.

[0081] By providing the second groove section 512, the roughness of the second surface 1b can also be increased. When the second groove section 512 is located between the control circuit board 2 and the second surface 1b, the bonding strength between the control circuit board 2 and the second surface 1b can be increased; when the second groove section 512 is located between the first buffer portion 31 and the second surface 1b, the adhesion of the first buffer portion 31 on the second surface 1b can be increased, preventing the first buffer portion 31 from falling off.

[0082] The first slot section 511 is not covered by the control circuit board 2 and the buffer structure 3. The specific position of the first slot section 511 can be set as needed, as long as the first slot section 511 is outside the orthographic projections of the control circuit board 2 and the buffer structure 3 on the second surface 1b. For example, the first slot section 511 can be located at Figure 4B the B1 position shown in Figure 4B or the first slot section 511 can be located at

[0083] the B2 position shown in

[0084] In one embodiment, as shown in FIG. 4, the orthographic projection of the first buffer portion 31 on the second surface 1b has a first projection boundary BX1, and the first projection boundary BX1 is located between the first common side line BX2 and the second projection boundary BX3. Among them, the first common side line BX2 is the intersection side line of the second surface 1b and the first selected side surface 1cc, and the second projection boundary BX3 is the orthographic projection of the second common side line on the second surface 1b. The second common side line is the intersection side line of the third surface 2a and the second selected side surface 2cc. The first slot section 511 is located between the first common side line BX2 and the first projection boundary BX1.

[0085] Normally, before forming the initial buffer structure, it is necessary to perform laser cleaning on the second surface 1b between the second projection boundary BX3 and the first common side line BX2. By setting the first slot section 511 between the first common side line BX2 and the first projection boundary BX1, the first slot section 511 can be formed while performing laser cleaning, improving the cleaning efficiency.

[0085] In one embodiment, the extending direction of the first groove 51 can be parallel to the extending direction of the first projection boundary BX1, such as Figure 4B the first groove shown as B1 in Figure 4B or the extending direction of the first groove 51 can intersect with the extending direction of the first projection boundary BX1, such as

[0086] the first groove shown as B2 in

[0087] When the first slot section 511 is set between the first common side line BX2 and the first projection boundary BX1, since at least a part of the first groove 51 is located between the first buffer portion 31 and the second surface 1b, and the second slot section 512 is communicated with the first slot section 511, the extending direction of the first groove 51 is not parallel to the first projection boundary BX1. That is to say, the extending direction of the first groove 51 intersects with the first projection boundary BX1, and the first projection boundary BX1 is parallel to the first common side line BX2. Therefore, the extending direction of the first groove 51 intersects with the first common side line BX2, and one end of the two ends of the first slot section 511 is closer to the first common side line BX2 than the other end.

[0087] In one embodiment, the first groove 51 may extend from one end of the first groove segment 511 near the first common boundary line BX2 in the third direction and at least extend to the inside of the first projection boundary BX1. The inside of the first projection boundary BX1 is the side of the first projection boundary BX1 facing away from the first common boundary line BX2. In Figure 4A and Figure 4B , the inside of the first projection boundary BX1 is the lower side of the first projection boundary BX1. The third direction intersects with the extending direction of the first common boundary line BX2. Exemplarily, the third direction may be perpendicular to the extending direction of the first common boundary line BX2. The part of the first groove 51 located inside the first projection boundary BX1 is the second groove segment 512, and the part located on the side of the first projection boundary BX1 facing the first common boundary line BX2 is the first groove segment 511. For such a first groove 51, both the first groove segment 511 and the second groove segment 512 are located between the second projection boundary BX3 and the first common boundary line BX2. When laser cleaning the second surface 1b between the second projection boundary BX3 and the first common boundary line BX2, the first groove 51 can be formed simultaneously, further improving the cleaning efficiency.

[0088] The first groove 51 may also extend from one end of the first groove segment 511 near the first common boundary line BX2 in the third direction and at least extend to the second projection boundary BX3. With such a setting, the second groove segment 512 is not only located between the first buffer portion 31 and the second surface 1b, but also connected to the third surface 2a of the control circuit board 2. Thus, during the attachment of the control circuit board 2, the bubbles generated during the attachment process can be discharged through the first groove 51, and the bubbles generated during the curing process of the initial buffer structure can also be discharged through the first groove 51.

[0089] Exemplarily, the first groove 51 may extend in the third direction to the inside of the second projection boundary BX3. In Figure 4A and Figure 4B , the inside of the second projection boundary BX3 is the lower side of the second projection boundary BX3. Thus, a part of the second groove segment 512 is located between the first buffer portion 31 and the second surface 1b, and another part is located between the control circuit board 2 and the second surface 1b, which is more conducive to the bubbles generated during the attachment process of the control circuit board 2 being discharged through the first groove 51. Moreover, in the high-temperature environment before forming the connection lead 4, the bubbles between the control circuit board 2 and the second surface 1b or the bubbles between the body of the control circuit board 2 and the adhesive layer can also be effectively discharged through the first groove 51, avoiding the connection lead 4 from being broken due to bubbles.

[0090] In the first direction, the distance range d3 between one end of the first groove 51 close to the first common boundary line BX2 and the second projection boundary BX3 can be 450 μm to 600 μm. For example, d3 can be 450 μm, 500 μm, 550 μm, or 600 μm. Such a setting reserves sufficient margin for the first buffer portion 31 of the buffer structure 3 formed on the second surface 1b, so that after the buffer structure 3 is formed, a part of the first groove 51 can be not covered by the buffer structure 3 to form the first groove segment 511.

[0091] As Figure 4B shown, there is a first preset distance d1 between the first common boundary line BX2 and the first projection boundary BX1, and the dimension of the first groove segment 511 in the first direction is less than or equal to the first preset distance d1. It can be understood that when the third segment of the connection lead 4 is formed on the second surface 1b, due to the existence of the first groove segment 511, there may be a situation where the third segment of the connection lead 4 is located above the first groove segment 511, and there is a risk that the third segment of the connection lead 4 falls off due to being formed on an uneven surface. By setting the dimension of the first groove segment 511 in the first direction to be less than or equal to the first preset distance d1, an area without the first groove segment 511 can exist between the first common boundary line BX2 and the first projection boundary BX1. Thus, when the connection lead 4 is formed on one side of the second surface 1b of the substrate 1, at least a part of the third segment of the connection lead 4 can be in contact with the second surface 1b, reducing the risk of the third segment of the connection lead 4 falling off.

[0092] In one embodiment, the distance d2 between one end of the first groove segment 511 close to the first common boundary line BX2 and the first common boundary line BX2 ranges from 600 μm to 800 μm. This enables the third segment of the connection lead 4 to be in full contact with the second surface 1b, improving the adhesion firmness of the third segment of the connection lead 4 on the second surface 1b and preventing the third segment of the connection lead 4 from falling off. Exemplarily, d2 can be 600 μm, 650 μm, 700 μm, 750 μm, or 800 μm.

[0093] The first groove 51 extends in the third direction. When the third direction is perpendicular to the extending direction of the first common boundary line BX2, the third direction is parallel to the first direction X. Thus, the extending direction of the first groove 51 is perpendicular to the extending direction of the first common boundary line BX2.

[0094] Figure 4A and Figure 4B the shapes of the first grooves 51 shown in

[0095] In order to further improve the bubble discharge effect, the groove structure may include a plurality of first grooves 51, and the plurality of first grooves 51 may be arranged at intervals in the extending direction of the first projection boundary BX1. It can be understood that the buffer structure 3 is generally arranged along the extending direction of the second projection boundary BX3. Thus, the buffer structure 3 has a certain length in the extending direction of the second projection boundary BX3. By providing the first grooves 51 in plurality and arranging the plurality of first grooves 51 at intervals in the extending direction of the first projection boundary BX1, the bubbles generated by the buffer structure 3 can be evenly discharged through the corresponding first grooves 51, avoiding the problem that the bubbles cannot be discharged.

[0096] Figure 5 For Figure 4A a schematic diagram of the C-C cross-section in one embodiment, Figure 5 which shows three first slot segments 511, namely first slot segments 511a, 511b, and 511c, and two third segment leads 43, namely third segment leads 43a and 43b. As Figure 4A and Figure 5 shown, the distance d4 between two adjacent first slot segments 511 is greater than the width w2 of the connecting lead. Thus, when the third segment lead 43 is provided between two adjacent first slot segments 511a and 511b, it can be ensured that the orthographic projection of the first slot segment 511 on the second surface 1b does not overlap with the orthographic projection of the third segment lead 43 on the second surface 1b, enabling the third segment lead 43 to be in full contact with the second surface 1b and further improving the adhesion of the third segment lead 43 to the second surface 1b.

[0097] Exemplarily, the orthographic projection of the third segment lead 43 on the second surface 1b of the substrate 1 does not overlap with the orthographic projection of the first slot segment 511 on the second surface 1b. For example, the first slot segment 511 may be located between two adjacent third segment leads 43, that is to say, the orthographic projection of the first slot segment 511 on the second surface 1b is located between the orthographic projections of two adjacent third segment leads 43 on the second surface 1b.

[0098] In one embodiment, the number of the first electrodes 11 is plural, the number of the second electrodes 21 is plural, and the number of the connecting leads 4 is multiple. Each first electrode 11 is connected to the second electrode 21 through a corresponding connecting lead 4. Among them, the first segment lead 41 is connected to the first electrode 11, the third segment lead 43 is connected to the second electrode 21, and the multiple third segment leads 43 are arranged at intervals in the extending direction of the first common edge line BX2.

[0099] It can be understood that when forming the connection lead 4 by the printing process, the conductive paste of the connection lead 4 is first printed on one side of the second surface 1b, and the connection lead 4 is formed after the conductive paste is cured. During the curing process of the conductive paste, flow may occur. To avoid the short - circuit of the conductive paste of adjacent connection leads 4 due to flow, the width w1 of the first groove segment 511 can be less than the distance d5 between two adjacent third - segment leads 43. Thus, when the first groove segment 511 is located between two adjacent third - segment leads 43, even if there is a printing deviation, since the width w1 of the first groove segment 511 is less than the distance d5 between two adjacent third - segment leads 43, the situation where the conductive paste of two adjacent third - segment leads 43 is in contact with the same first groove segment 511 will not occur, and thus the problem of short - circuit of the conductive paste of two adjacent third - segment leads 43 due to flow can be avoided.

[0100] In another embodiment, the width w1 of the first groove segment 511 can also be set to be less than the width w2 of the third - segment lead 43. Thus, when the first groove segment 511 is completely located below the third - segment lead 43, the third - segment lead 43 can completely cover the first groove segment 511. In this way, the situation where the conductive paste of two adjacent third - segment leads 43 is in contact with the same first groove segment 511 will not occur, and thus the problem of short - circuit of the conductive paste of two adjacent third - segment leads 43 due to flow can be avoided.

[0101] As Figure 5 shown, the range of the depth h of the first groove 51 can be set as needed. For example, the depth h of the first groove 51 can be greater than the size of the large - size bubbles. With such a depth of the first groove 51, it can ensure that the first groove 51 effectively discharges the large - size bubbles, avoiding the large - size bubbles remaining in the control circuit board 2 or the buffer structure 3, and further avoiding the breakage of the connection lead 4 caused by the rupture of the large - size bubbles.

[0102] The width w2 of the first groove 51 can be less than or equal to 300 μm. Thus, when the third - segment groove 511 is provided between two adjacent third - segment leads 43a and 43b, it can be ensured that the orthographic projection of the first groove segment 511 on the second surface 1b does not overlap with the orthographic projection of the third - segment lead 43 on the second surface 1b.

[0103] Figure 5 The bottom cross - sectional shape of the first groove 51 shown in [[ ]] is circular arc. It can be understood that the bottom cross - sectional shape of the first groove 51 is not limited to circular arc. The bottom cross - sectional shape of the first groove 51 can also be triangular, broken - line - shaped, etc. The bottom cross - sectional shape of the first groove 51 is not limited here, and the specific shape can be set as needed.

[0104] As described above, when attaching the control circuit board 2, if a bulging phenomenon occurs, it will increase the risk of breakage of the connection lead 4. Regarding the bulge, an embodiment of the present disclosure proposes a manufacturing process of a display panel, referring to Figure 4A or Figure 4B , the following steps may be included:

[0105] S21: Before attaching the control circuit board 2, laser cleaning is performed on a first preset area of the second surface 1b of the substrate 1 to form a groove structure. The groove structure includes a first groove 51. The first groove 51 can extend along the third direction. The first groove 51 can extend from a preset second projection boundary BX3 towards the first common edge BX2. The dimension of the first groove 51 in the first direction X can be 500 μm.

[0106] S22: Attach the control circuit board 2 to a second preset area of the second surface 1b of the substrate 1, and the second common edge of the control circuit board 2 coincides with the second projection boundary BX3 in the orthographic projection on the second surface 1b;

[0107] S23: Perform bulge detection on the substrate 1 attached with the control circuit board 2. A height measurement sensor can be used for bulge detection. The detection schematic diagram is as shown in Figure 6 . Figure 6 is a schematic diagram of the bulge detection result of a substrate in an actual product. It can be seen from Figure 6 that there is a bulging area on the control circuit board 2 of the substrate 1, and the bulge size is greater than 20 μm. When the bulge size is less than or equal to 20 μm, the product can be considered qualified, and subsequent processes can be directly performed on the second surface 1b: forming the buffer structure 3, preparing the connection lead 4, etc. For products with a bulge size greater than 20 μm, the products can be considered unqualified. Here, 20 μm is used as the boundary for determining whether there is a bulge in the product. In other embodiments, other boundary sizes can be used. For example, the range of the boundary size d0 of the bulge can be 15 μm to 25 μm. When the bulge size is greater than d0, the product is unqualified, and when the bulge size is less than or equal to d0, the product is qualified.

[0108] S24: For unqualified products, before forming the buffer structure 3, the products can be placed in a high-temperature environment so that the bulging bubbles in the control circuit board 2 are discharged effectively through the first groove 51, reducing the bulge size to below d0 or eliminating the bulge; then the buffer structure 3 and the connection lead 4 are prepared. Thus, after the reliability test, the risk of breakage of the connection lead 4 due to bubbles can be avoided.

[0109] Figure 7 is a plan view of the second surface side of the display panel in another embodiment, as shown in Figure 7As shown, the display panel may include a first control circuit board 2-1 and a second control circuit board 2-2. The substrate 1 includes two relatively arranged first selected side surfaces 1cc. The second selected side surface 2cc of the first control circuit board 2-1 corresponds to the upper first selected side surface 1cc, and the second selected side surface 2cc of the second control circuit board 2-2 corresponds to the lower first selected side surface 1cc. The range of the distance L1 between the second projection boundary BX3 and the corresponding first common side line BX2 may be greater than or equal to 1200 μm, so as to reserve enough width for the third segment of the lead 43 to directly contact the second surface 1b, increasing the adhesion of the second surface 1b to the third segment of the lead 43. Exemplarily, the distance L1 between the second projection boundary BX3 and the corresponding first common side line BX2 may be 1200 μm, and the width L2 of the laser cleaning may be 500 μm. Therefore, the size of the first trench 51 in the first direction is 500 μm. The distance d6 between the first projection boundary BX1 and the second projection boundary BX3 is less than 500 μm. Thus, the part of the first trench 51 above the first projection boundary BX1 is the first trench segment 511.

[0110] Figure 8 FIG. is a partial cross-sectional schematic diagram of a display panel according to an embodiment of the present disclosure. Figure 8 It shows the second surface 1b, the control circuit board 2, the second electrode 21, and the buffer structure 3. As Figure 8 shown, the buffer structure 3 includes a first buffer portion 31. The included angle β between the surface of the first buffer portion 31 and the second surface 1b may be less than or equal to the first preset angle θ. That is to say, the climbing angle β of the surface of the first buffer portion 31 relative to the second surface 1b is less than or equal to the first preset angle θ. The thickness of the control circuit board 2 is T, that is, the distance between the third surface 2a and the fourth surface 2b is T. The distance d6 between the first projection boundary BX1 and the second projection boundary BX3 is greater than or equal to T / tanθ. Thus, the specific value of d6 is related to the first preset angle θ.

[0111] Exemplarily, the first preset angle θ may be less than or equal to 20°, so that d6 is greater than or equal to T / tan20°.

[0112] It is proved by experiments that when the first preset angle θ is set to be less than or equal to 20°, the third segment of the lead 43 climbs from the second surface 1b to the surface of the first buffer portion 31 relatively gently, and then extends to the second electrode 21 and is connected to the second electrode 21. Since the first preset angle θ is less than or equal to 20°, the step difference between the second surface 1b and the fourth surface 2b is greatly reduced, and a relatively gentle surface is formed between the second surface 1b and the fourth surface 2b, which is beneficial to forming a continuous third segment of the lead 43 and avoiding the third segment of the lead 43 from breaking due to the step difference.

[0113] Figure 9 Schematic diagram of the positional relationship between the first projection boundary BX1 of the first buffer portion and the control circuit board. As Figure 9 shown, when forming the buffer structure 3, the distance between the first projection boundary BX1 of the first buffer portion 31 and the second projection boundary BX3 of the control circuit board 2 has a great influence on the climbing angle β of the first buffer portion 31. When the first projection boundary BX1 is at position C1, the climbing angle of the first buffer portion 31 is β1; when the first projection boundary BX1 is at position C2, the climbing angle of the first buffer portion 31 is β2; when the first projection boundary BX1 is at position C3, the climbing angle of the first buffer portion 31 is β3, and β1 < β2 < β3. Therefore, how to set the position of the first projection boundary BX1 is very important for forming the climbing angle of the first buffer portion 31. The farther the first projection boundary BX1 of the first buffer portion 31 is from the second projection boundary BX3 of the control circuit board 2, the smaller the climbing angle of the formed first buffer portion 31, the gentler the climbing of the third section of the lead 43, and the more it can prevent the third section of the lead 43 from breaking due to the step difference; the closer the first projection boundary BX1 of the first buffer portion 31 is to the second projection boundary BX3 of the control circuit board 2, the larger the climbing angle of the formed first buffer portion 31, the steeper the climbing of the third section of the lead 43, and the more likely it is to cause the third section of the lead 43 to break due to the step difference.

[0114] In the embodiment of the present disclosure, the thickness of the control circuit board 2 is T, that is, the distance between the third surface 2a and the fourth surface 2b is T, and the distance d6 between the first projection boundary BX1 and the second projection boundary BX3 is greater than or equal to T / tanθ. Through experiments, it is proved that setting the distance d6 between the first projection boundary BX1 and the second projection boundary BX3 in this way can ensure that the climbing angle of the surface of the finally formed first buffer portion 31 satisfies less than or equal to the first preset angle θ, and can prevent the climbing angle of the surface of the first buffer portion 31 from being too large and causing the third section of the lead 43 to break.

[0115] Figure 10A 、 Figure 10B 、 Figure 10C Schematic cross-sectional views of three different included angles between the surface of the first buffer portion and the second surface. In Figure 10A , the included angle β1 between the surface of the first buffer portion 31 and the second surface 1b is about 26.2°, and the included angle β1 is greater than the first preset angle θ. Through experiments, it is proved that when using the first buffer portion 31 shown in Figure 10A , there is a problem of breakage of the third section of the lead 43 in the formed connection lead 4 due to the step difference.

[0116] Figure 10BIn this case, the included angle β2 between the surface of the first buffer portion 31 and the second surface 1b is approximately 36.4°, and the included angle β2 is greater than the first preset angle θ. It has been proven by experiments that there is a problem of breakage of the third segment of the connection lead 4 due to the step difference.

[0117] Figure 10C In this case, the included angle β2 between the surface of the first buffer portion 31 and the second surface 1b is approximately 69.7°, and the included angle β2 is greater than the first preset angle θ. It has been proven by experiments that there is a problem of breakage of the third segment of the connection lead 4 due to the step difference.

[0118] Thus, it can be seen that when the first preset angle θ is 20°, and the included angle β between the surface of the first buffer portion 31 and the second surface 1b can be less than or equal to 20°, it has been proven by experiments that the problem of breakage of the third segment of the connection lead 4 due to the step difference is eliminated.

[0119] The surface of the first buffer portion 31 can be an inclined surface, such as Figure 8 shown, so that the climbing angles of the surface of the first buffer portion 31 are equal, both being β.

[0120] Figure 11 This is a schematic cross-sectional view of a display panel in another embodiment of the present disclosure. In another embodiment, as Figure 11 shown, the surface of the first buffer portion 31 is a curved surface protruding away from the second surface 1b. Thus, the climbing angle at the position close to the first projection border line of the surface of the first buffer portion 31 is β, and then, the climbing angle of the surface of the first buffer portion 31 gradually decreases, which is more conducive to forming a continuous third segment of the lead 43 and further preventing the third lead from breaking.

[0121] As Figure 8 and Figure 11 shown, the buffer structure 3 may further include a second buffer portion 32, and the second buffer portion 32 is connected to the first buffer portion 31. The second buffer portion 32 and the first buffer portion 31 are connected into an integral buffer structure 3. The second buffer portion 32 is located on one side of the fourth surface 2b of the control circuit board 2, and the surface of the second buffer portion 32 is smoothly connected to the surface of the first buffer portion 31. Thus, the third segment of the lead 43 is connected to the second electrode 21 after passing through the second surface 1b, the surface of the first buffer portion 31, and the surface of the second buffer portion 32.

[0122] As Figure 4A shown, the buffer structure 3 may be a continuous structure in the extension direction of the second projection border BX3, or the buffer structure 3 includes a plurality of sub-structures, each sub-structure extends along the extension direction of the second projection border BX3, and the plurality of sub-structures are arranged along the extension direction of the second projection border BX3, and the third segment of the lead 43 passes through the surface of the corresponding sub-structure.

[0123] As shown Figure 1 in FIG. 1, on one side of the first surface 1a of the substrate 1 is the front side of the display panel. On one side of the first surface 1a of the substrate 1, a display area AA and a bonding area BB are provided. A driving circuit layer, a light-emitting element 12, etc. are provided in the display area AA. The light-emitting element 12 includes light-emitting elements of at least three colors, namely a first-color light-emitting element 12a, a second-color light-emitting element 12b, and a third-color light-emitting element 12c. The first color, the second color, and the third color are the three primary colors, such as red, green, and blue. The light-emitting element 12 can be a Micro LED or a Mini LED. The first electrode 11 is provided in the bonding area BB.

[0124] Another embodiment of the present disclosure provides a display device, and the display device includes the display panel in any embodiment of the present disclosure.

[0125] Figure 12 FIG. 2 is a schematic diagram of a tiled display device in an embodiment of the present disclosure. Another embodiment of the present disclosure further provides a tiled display device, and the tiled display device includes the display device of the present disclosure. The first selected side surface 1cc in each display device extends along the second direction Y. Since the control circuit board 2 is provided on the second surface 1b of the display panel, the control circuit board 2 no longer occupies the space of the first surface 1a, and the connection lead 4 connects the first electrode 11 and the second electrode 21 through the first selected side surface 1cc. Thus, the seam between two adjacent display devices in the first direction X is greatly reduced.

[0126] The display device of the present disclosure can be: an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, a wearable display device, or any product or component with a display function.

[0127] In the description of this specification, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present disclosure.

[0128] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more such features. In the description of the present disclosure, "a plurality of" means two or more unless otherwise specifically defined.

[0129] In the present disclosure, unless otherwise clearly specified and defined, terms such as "installed", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or a communication connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0130] In the present disclosure, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0131] The above disclosure provides many different embodiments or examples for implementing different structures of the present disclosure. To simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0132] The above are only the specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of various changes or substitutions. Different parts in different embodiments can be combined with each other without conflict, and all of these should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display panel, characterized in that: include: A substrate including a first surface and a second surface disposed opposite to each other, and at least one first selected side surface connecting the first surface and the second surface; a control circuit board, arranged on the second surface of the substrate, the control circuit board comprising a third surface and a fourth surface arranged opposite to each other, and at least one second selected side surface connecting the third surface and the fourth surface, the third surface being closer to the second surface relative to the fourth surface, the second selected side surface corresponding to the first selected side surface, and the control circuit board further comprising a second electrode arranged on the fourth surface; a buffer structure, disposed on one side of the second surface of the substrate, the buffer structure comprising at least a first buffer portion, the first buffer portion being in contact with the second selected side surface and being located on a side of the second selected side surface facing the first selected side surface; A connecting lead extends from the first surface side of the substrate, through the first selected side surface, and through the buffer structure surface on the second surface side of the substrate toward the second electrode, and is connected to the second electrode; The second surface of the substrate is provided with a groove structure, the groove structure at least comprising a first groove, the first groove comprising a first groove section and a second groove section connected to each other, the first groove section being located outside the orthographic projection of the control circuit board and the buffer structure on the second surface; At least a portion of the second slot section is located between the control circuit board and the second surface, and / or at least a portion of the second slot section is located between the first buffer portion and the second surface.

2. The display panel according to claim 1, characterized in that: A portion of the second groove section is located between the control circuit board and the second surface, and a portion of the second groove section is located between the first buffer portion and the second surface.

3. The display panel according to claim 1, characterized in that: The orthographic projection of the first buffer portion on the second surface has a first projection boundary, the first projection boundary is located between the first common edge line and a second projection boundary, the second projection boundary is the orthographic projection of the second common edge line on the second surface, and the second common edge line is the intersection edge line of the third surface and the second selected side surface; The first slot segment is located between the first common edge and the first projected boundary.

4. The display panel according to claim 3, characterized in that: There is a first preset distance between the first common sideline and the first projection boundary, a size of the first slot segment in a first direction is less than or equal to the first preset distance, and the first direction is perpendicular to an extension direction of the first common sideline.

5. The display panel according to claim 4, characterized in that: The distance between one end of the first groove segment close to the first common sideline and the first common sideline is in a range of 600 μm to 800 μm.

6. The display panel according to claim 3, characterized in that: The first groove extends from one end of the first groove segment close to the first common edge line along a third direction and at least extends to the inner side of the first projection boundary, and the third direction intersects with the extension direction of the first common edge line; In a first direction, a distance between an end of the first groove close to the first common edge and the second projection boundary is in a range of 450 μm to 600 μm, and the first direction is perpendicular to an extending direction of the first common edge.

7. The display panel according to claim 6, characterized in that: The third direction is perpendicular to the extending direction of the first common edge line.

8. The display panel according to claim 3, characterized in that: The groove structure includes a plurality of first grooves, and the plurality of first grooves are arranged at intervals along an extension direction of the first projection boundary.

9. The display panel according to claim 8, characterized in that: The distance between two adjacent first slot sections is greater than the width of the connecting lead.

10. The display panel according to claim 8, characterized in that: There are multiple connecting leads, and the connecting leads include a third section of leads located on one side of the second surface of the substrate, and the multiple third section of leads are arranged at intervals along the extension direction of the first common edge; The first slot section satisfies at least one of the following: The width of the first slot segment is smaller than the distance between two adjacent third segment leads; The width of the first slot section is smaller than the width of the third lead section; The first slot section is located between two adjacent third lead sections.

11. The display panel according to claim 1, characterized in that: The width of the first groove is less than or equal to 300 μm.

12. The display panel according to any one of claims 1 to 11, characterized in that: The orthographic projection of the first buffer portion on the second surface has a first projection boundary, the first projection boundary is located between the first common edge line and a second projection boundary, the second projection boundary is the orthographic projection of the second common edge line on the second surface, and the second common edge line is the intersection edge line of the third surface and the second selected side surface; The angle between the surface of the first buffer portion and the second surface is less than or equal to a first preset angle θ, the thickness of the control circuit board is T, the distance d4 between the first projection boundary and the second projection boundary is greater than or equal to T / tanθ, and the first preset angle θ is less than or equal to 20°.

13. The display panel according to claim 12, characterized in that: The surface of the first buffer portion is an inclined plane; or the surface of the first buffer portion is a curved surface convex toward a direction away from the second surface.

14. The display panel according to claim 12, characterized in that: The buffer structure further includes a second buffer portion, the second buffer portion is connected to the first buffer portion, the second buffer portion is located on the fourth surface, and a surface of the second buffer portion is smoothly connected to a surface of the first buffer portion.

15. The display panel according to claim 12, characterized in that: The distance between the second projection boundary and the first common edge line is greater than or equal to 1200 μm.

16. A display device, characterized in that: A display panel comprising any one of claims 1 to 15, wherein a substrate in the display panel is provided with a first electrode on a first surface, and the connecting lead is connected to the first electrode.

17. A spliced ​​display device, comprising a plurality of display devices according to claim 16.

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