Method for manufacturing display panel, display substrate and display device

Abstract

The application relates to a display panel manufacturing method, a display substrate and a display device. The display panel manufacturing method comprises the following steps: forming a mark and a first electrode on one side of a substrate; forming a pixel definition layer on the side, away from the substrate, of the mark and the first electrode, the pixel definition layer comprising a first covering part; forming an isolation layer on the side, away from the substrate, of the pixel definition layer, the isolation layer comprising a second covering part; patterning the isolation layer to form a plurality of first isolation openings and retaining the second covering part; patterning the pixel definition layer to form a plurality of first pixel openings and retaining the first covering part; forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device in the first isolation openings; patterning the isolation layer to form a plurality of second isolation openings and removing the second covering part; and patterning the pixel definition layer to form a plurality of second pixel openings. The application can avoid damage to the mark.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a manufacturing method of display panel, display substrate and display device. BACKGROUND

[0002] OLED (Organic Light Emitting Diode) display panel is one of the hotspots in the field of display panel research at present. The OLED display panel has the advantages of low energy consumption, low cost, self-luminous, wide viewing angle and fast response speed. In the preparation process of traditional display panel, the fine metal mask (FMM) is usually used to realize the patterning of light-emitting pixels. The FMM technology is mature and has rich mass production experience. However, the FMM technology also has the problems of limited precision, high development cost and long development cycle. The fine metal mask-free technology eliminates the limitations of traditional OLED process on the size, resolution and other performance of display screen, and has the advantages of high performance, full size and agile delivery. The patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A and CN118781966A disclose the related content of the fine metal mask-free technology, which are referred to.

[0003] However, there are still some problems in the display panel that need to be solved. SUMMARY

[0004] Therefore, it is necessary to provide a manufacturing method of display panel, display substrate and display device for solving the problem that the mark is easily damaged in the manufacturing process of OLED display panel.

[0005] According to a first aspect of the present application, a first manufacturing method of display panel is provided, comprising:

[0006] providing a substrate;

[0007] forming at least one mark and a plurality of first electrodes arranged in an array on one side of the substrate;

[0008] forming a pixel definition layer on the side of the at least one mark and the plurality of first electrodes away from the substrate, the pixel definition layer comprising at least one first covering portion, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding first covering portion on the substrate;

[0009] forming an isolation layer on the side of the pixel definition layer away from the substrate, the isolation layer comprising a second covering portion, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding second covering portion on the substrate;

[0010] patterning the isolation layer to form a plurality of first isolation openings and retaining the second covering portion;

[0011] Patterning the pixel definition layer to form a plurality of first pixel openings while retaining the first covering portion, wherein the first pixel openings are connected to corresponding first isolation openings, and the first pixel openings expose corresponding first electrodes;

[0012] forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device at least in the first isolation opening;

[0013] patterning the isolation layer to form a plurality of second isolation openings, and removing the second covering portion;

[0014] patterning the pixel definition layer to form a plurality of second pixel openings, wherein the second pixel openings are connected to the corresponding second isolation openings, and the second pixel openings expose the corresponding first electrodes;

[0015] A second light-emitting functional layer, a second electrode, and a second encapsulation layer of the second light-emitting device are formed at least in the second isolation opening.

[0016] In some embodiments, the step of patterning the pixel definition layer to form a plurality of second pixel openings includes: retaining the first covering portion;

[0017] Optionally, the second light emitting device is the last light emitting device manufactured;

[0018] Optionally, the pixel definition layer comprises an inorganic insulating material;

[0019] Optionally, the isolation layer comprises a conductive material;

[0020] Optionally, the material of the marker comprises metal;

[0021] Optionally, the marking includes an alignment mark;

[0022] Optionally, the step of forming a second light-emitting functional layer, a second electrode, and a second encapsulation layer of the second light-emitting device at least in the second isolation opening includes:

[0023] forming a second predetermined light-emitting functional layer, a predetermined second electrode and a predetermined second encapsulation layer of a second light-emitting device in sequence;

[0024] patterning the second preset light-emitting functional layer, the preset second electrode, and the preset second encapsulation layer of the second light-emitting device, removing the second preset light-emitting functional layer, the preset second electrode, and the preset second encapsulation layer of the first isolation opening, retaining the second preset light-emitting functional layer, the preset second electrode, and the preset second encapsulation layer of the second isolation opening, and forming the second light-emitting functional layer, the second electrode, and the second encapsulation layer of the second light-emitting device in the second isolation opening;

[0025] Optionally, the step of forming the first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device in the first isolation opening comprises:

[0026] forming the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device in sequence;

[0027] patterning the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device, removing at least part of the first preset light-emitting functional layer, at least part of the preset second electrode and at least part of the preset first encapsulation layer outside the first isolation opening, retaining the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer in the first isolation opening, and forming the first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device in the first isolation opening.

[0028] In some embodiments, the manufacturing method further comprises, simultaneously with the step of forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device in sequence:

[0029] forming a third covering part which is at least partially arranged in the same layer and made of the same material as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device;

[0030] the step of patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device comprises removing the third covering part to expose the first covering part.

[0031] In some embodiments, the manufacturing method further comprises, simultaneously with the step of forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device in sequence:

[0032] forming a third covering part which is at least partially arranged in the same layer as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device;

[0033] the step of patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device comprises retaining the third covering part.

[0034] In some embodiments, the manufacturing method further comprises, after the step of forming the first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device in the first isolation opening and before the step of patterning the isolation layer to form a plurality of second isolation openings and removing the second covering part:

[0035] patterning the isolation layer to form a plurality of third isolation openings and retaining the second covering part;

[0036] Patterning the pixel definition layer to form a plurality of third pixel openings while retaining the first covering portion, wherein the third pixel openings are connected to corresponding third isolation openings, and the third pixel openings expose corresponding first electrodes;

[0037] A third light-emitting functional layer, a second electrode and a third encapsulation layer of the third light-emitting device are formed at least in the third isolation opening.

[0038] In some embodiments, the step of forming a third light-emitting functional layer, a second electrode, and a third encapsulation layer of the third light-emitting device at least in the third isolation opening includes:

[0039] sequentially forming a third preset light-emitting functional layer, a preset second electrode, and a preset third encapsulation layer of a third light-emitting device;

[0040] The third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device are patterned, the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device of the first isolation opening are removed, the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device of the third isolation opening are retained, and the third light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device are formed in the third isolation opening.

[0041] In some embodiments, after patterning the isolation layer to form a plurality of second isolation openings and removing the second covering portion, the isolation layer includes an isolation structure disposed around the first isolation opening, the second isolation opening, and the third isolation opening;

[0042] Optionally, the isolation structure is in a grid shape;

[0043] Optionally, the isolation structure includes a conductive material, the second electrode of the first light-emitting device is electrically connected to the isolation structure, the second electrode of the second light-emitting device is electrically connected to the isolation structure; and the second electrode of the third light-emitting device is electrically connected to the isolation structure.

[0044] In some embodiments, at least after the step of forming the second light-emitting functional layer, the second electrode, and the second encapsulation layer of the second light-emitting device in the second isolation opening, the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer are spaced apart;

[0045] Optionally, the first encapsulation layer includes an inorganic material; the second encapsulation layer includes an inorganic material; and the third encapsulation layer includes an inorganic material.

[0046] In some embodiments, the isolation structure includes a support portion and a crown portion stacked sequentially on the substrate in a direction away from the substrate, wherein the orthographic projection of a side of the support portion away from the substrate on the substrate is within the range of the orthographic projection of the crown portion on the substrate;

[0047] Optionally, the support portion includes a conductive material, and the second electrode of the first light-emitting device overlaps a side wall of the support portion surrounding the first isolation opening; the second electrode of the second light-emitting device overlaps a side wall of the support portion surrounding the second isolation opening; and the second electrode of the third light-emitting device overlaps a side wall of the support portion surrounding the third isolation opening.

[0048] Optionally, the material of the support comprises aluminum, and / or the material of the crown comprises titanium.

[0049] In some embodiments, the isolation structure includes a support portion and a crown portion stacked sequentially on the substrate in a direction away from the substrate, and a pad portion located between the support portion and the substrate, wherein the orthographic projection of the side of the support portion away from the substrate on the substrate is within the range of the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is within the range of the orthographic projection of the pad portion on the substrate;

[0050] Optionally, the pad portion includes a conductive material, and the second electrode of the first light-emitting device overlaps the pad portion surrounding the first isolation opening; the second electrode of the second light-emitting device overlaps the pad portion surrounding the second isolation opening; and the second electrode of the third light-emitting device overlaps the pad portion surrounding the third isolation opening.

[0051] Optionally, the pad portion and the support portion both include a conductive material, the second electrode of the first light-emitting device overlaps the pad portion and the support portion surrounding the first isolation opening; the second electrode of the second light-emitting device overlaps the pad portion and the support portion surrounding the second isolation opening; the second electrode of the third light-emitting device overlaps the pad portion and the support portion surrounding the third isolation opening;

[0052] Optionally, the material of the support portion includes aluminum, and / or the material of the crown portion includes titanium, and / or the material of the pad portion includes molybdenum.

[0053] In some embodiments, the first light emitting device, the second light emitting device, and the third light emitting device emit different colors;

[0054] Optionally, the first light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, the second light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from the first light-emitting device, and the third light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from both the first light-emitting device and the second light-emitting device.

[0055] In some embodiments, the substrate includes a preset display area and a preset non-display area, the first light emitting device, the second light emitting device, and the third light emitting device are formed in the preset display area, and the mark is formed in the preset non-display area.

[0056] According to a second aspect of the present application, based on the same inventive concept, a second method for manufacturing a display panel is provided, comprising:

[0057] providing a substrate;

[0058] forming at least one mark on one side of the substrate;

[0059] forming at least a portion of a protective layer on a side of at least one mark away from the substrate, wherein an orthographic projection of the mark on the substrate overlaps an orthographic projection of the protective layer on the substrate;

[0060] forming an isolation layer on one side of the substrate;

[0061] patterning the isolation layer to form a first isolation opening;

[0062] forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of the first light-emitting device in the first isolation opening;

[0063] patterning the isolation layer to form a second isolation opening;

[0064] A second light-emitting functional layer, a second electrode, and a second encapsulation layer of the second light-emitting device are formed in the second isolation opening.

[0065] In some embodiments, the protective layer includes a first covering portion and a second covering portion stacked in sequence in a direction away from the substrate;

[0066] Before the step of forming the isolation layer on one side of the substrate, the method for manufacturing the display panel further includes: forming a pixel definition layer, the pixel definition layer including a first covering portion, an orthographic projection of the mark on the substrate overlapping with an orthographic projection of the first covering portion on the substrate;

[0067] At the same time as or after the step of patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion;

[0068] Optionally, the second covering portion and the isolation layer are made of at least partially different materials or are arranged in different layers, and the second covering portion includes a light-transmitting layer;

[0069] Optionally, the material of the light-transmitting layer includes semiconductor metal oxide;

[0070] Optionally, the semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide;

[0071] Alternatively, the corrosion resistance of the material of at least part of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer;

[0072] Optionally, the material of the second covering portion includes titanium;

[0073] Alternatively, the isolation layer includes a second covering portion, and an orthographic projection of the mark on the substrate overlaps with an orthographic projection of the second covering portion on the substrate;

[0074] While patterning the isolation layer to form the first isolation opening, the method for manufacturing the display panel further includes: retaining the second covering portion;

[0075] While patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion;

[0076] Optionally, the number of film layers of the second covering portion is less than or equal to the number of film layers of the isolation layer;

[0077] Optionally, the second covering portion is a single metal film layer or a multi-layer film layer stacked along the thickness direction of the substrate;

[0078] Optionally, an overlapping area of ​​an orthographic projection of the first covering portion on the substrate and an orthographic projection of the second covering portion on the substrate overlaps with an orthographic projection of the mark on the substrate;

[0079] Optionally, the orthographic projection of the mark on the substrate is located within the orthographic projection of the first covering portion on the substrate, and the orthographic projection of the mark on the substrate is located within the orthographic projection of the second covering portion on the substrate;

[0080] Optionally, the first light-emitting device further includes a first electrode located between the substrate and the first light-emitting functional layer, and the mark is provided in the same layer as the first electrode of the first light-emitting device.

[0081] According to a third aspect of the present application, based on the same inventive concept, a display substrate is provided, comprising:

[0082] substrate;

[0083] At least one mark and a plurality of first electrodes arranged in an array are located on one side of the substrate, and the mark and the first electrodes are made of the same layer and material;

[0084] a pixel definition layer located on a side of the at least one mark and the plurality of first electrodes away from the substrate, the pixel definition layer comprising at least one first covering portion, a plurality of first pixel openings, and a plurality of second pixel openings, wherein an orthographic projection of the mark on the substrate is located within an orthographic projection of the corresponding first covering portion on the substrate;

[0085] an isolation layer located on a side of the pixel definition layer away from the substrate, the isolation layer comprising a plurality of first isolation openings and a plurality of second isolation openings, wherein the first pixel openings are in communication with corresponding first isolation openings, the first pixel openings exposing corresponding first electrodes, and the second pixel openings are in communication with corresponding second isolation openings, the second pixel openings exposing corresponding first electrodes;

[0086] The first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device are at least located in the first isolation opening;

[0087] The second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device are located at least in the second isolation opening.

[0088] In some embodiments, the display substrate further comprises a second covering portion, the second covering portion is located on the side of the first covering portion away from the base, and the orthographic projection of the mark on the base is located in the orthographic projection range of the corresponding second covering portion on the base.

[0089] Optionally, the second covering portion is arranged in the same layer and with the same material as the isolation layer.

[0090] Alternatively, the material of the second covering portion comprises a light-transmitting layer.

[0091] Optionally, the material of the light-transmitting layer comprises a semiconductor metal oxide.

[0092] Optionally, the semiconductor metal oxide comprises at least one of indium zinc oxide, zinc aluminum oxide and indium gallium zinc oxide.

[0093] Alternatively, the corrosion resistance of the material of at least part of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer.

[0094] Optionally, the material of the second covering portion comprises titanium.

[0095] Optionally, the side of the mark away from the base is free of a material arranged in the same layer as the light-emitting functional layer and the second electrode of the light-emitting device and with the same material.

[0096] According to a fourth aspect of the present application, a display device is provided, the display device comprising a display panel manufactured by the first method for manufacturing a display panel according to any one of the above, or the display device comprising a display panel manufactured by the second method for manufacturing a display panel according to any one of the above, or the display device comprising a display substrate according to any one of the above.

[0097] In the embodiments of the present application, the pixel definition layer includes at least one first covering portion, i.e., the first covering portion is formed when the pixel definition layer is formed; the isolation layer includes at least one second covering portion, i.e., the second covering portion is formed when the isolation layer or isolation structure is formed; the isolation layer is patterned to form a plurality of second isolation openings, and the second covering portion is removed, i.e., the second covering portion is removed when the second isolation opening is formed; and the pixel definition layer is patterned to form a plurality of second pixel openings, the second pixel opening is in communication with the corresponding second isolation opening, and the second pixel opening exposes the corresponding first electrode, i.e., the first covering portion is retained when the second pixel opening is formed. The embodiments of the present application have many beneficial effects, 1) in the first aspect, the first covering portion can protect the mark, the second covering portion can protect the first covering portion before the second isolation opening is formed, the second covering portion can protect the first covering portion in the manufacturing process such as the wet etching process of etching the isolation layer to form the first isolation opening and / or the wet etching process of etching the electrode material layer to form the second electrode of the light emitting device, so as to avoid the first covering portion from being etched or damaged, thereby avoiding the damage of the mark caused by the etching or damage of the first covering portion; 2) in the second aspect, the second covering portion is removed when the second isolation opening is formed, so as to avoid the second covering portion from shielding the mark and avoiding the mark from being used for alignment in the subsequent process; 3) in the third aspect, the first covering portion is retained when the second pixel opening is formed, the pixel definition layer is a light-transmitting material, the first covering portion is a light-transmitting material, the first covering portion can continue to protect the mark, and the first covering portion does not shield the mark, so as to avoid the adverse effect on the identification and alignment of the mark. BRIEF DESCRIPTION OF DRAWINGS

[0098] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings needed to be used in the following embodiment or exemplary embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0099] Figure 1 The first flow step schematic diagram of the first display panel manufacturing method provided by some embodiments of the present application.

[0100] Figure 2 The second flow step schematic diagram of the first display panel manufacturing method provided by some embodiments of the present application.

[0101] Figure 3 The schematic diagram of the mother board of the first display panel manufacturing method provided by some embodiments of the present application.

[0102] Figure 4A schematic view of a small piece of the first display panel manufacturing method provided for some embodiments of the present application.

[0103] Figure 5 A schematic view of a first intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0104] Figure 6 A schematic view of a second intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0105] Figure 7 A schematic view of a third intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0106] Figure 8 A schematic view of a fourth intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0107] Figure 9 A schematic view of a fifth intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0108] Figure 10 A schematic view of a sixth intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0109] Figure 11 A schematic view of a seventh intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0110] Figure 12 A further schematic view of the seventh intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0111] Figure 13 Another schematic view of the seventh intermediate process of the first display panel manufacturing method provided for some embodiments of the present application.

[0112] Figure 14 A schematic view of a flow step of the second display panel manufacturing method provided for some embodiments of the present application.

[0113] Figure 15 A schematic view of a first intermediate process of the second display panel manufacturing method provided for some embodiments of the present application.

[0114] Figure 16 A schematic view of a second intermediate process of the second display panel manufacturing method provided for some embodiments of the present application.

[0115] Figure 17This is another schematic diagram of the second intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0116] Figure 18 This is a schematic diagram of the third intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0117] Figure 19 This is a schematic diagram of the fourth intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0118] Figure 20 This is a schematic diagram of the fifth intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0119] Figure 21 This is a schematic diagram of the sixth intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0120] Figure 22 This is a schematic diagram of the seventh intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0121] Figure 23 This is a schematic structural diagram of a display panel in a second method for manufacturing a display panel provided in some embodiments of the present application.

[0122] Figure 24 A schematic diagram of a display device provided in an embodiment of the present application.

[0123] Reference numerals: display panel 100; display device 200; display substrate 110; base 11; reference numeral 12m; first conductive layer 12; first electrode 121; motherboard 1000; pixel definition layer 13; first covering portion 13g; isolation layer 14; second covering portion 14g; first sub-isolation layer 141; second sub-isolation layer 142; first isolation opening 14k1; first pixel opening 13k1; first light-emitting device 2341; first light-emitting functional layer 21; second electrode 31; first encapsulation layer 41; second isolation opening 14k2; second pixel opening 13k2; second light-emitting device 2 342; second light-emitting functional layer 22; second encapsulation layer 42; third isolation opening 14k3; third pixel opening 13k3; third light-emitting device 2343; third light-emitting functional layer 23; third encapsulation layer 43; display area AA; non-display area BB; third covering portion 234g; first sub-electrode 121a; second sub-electrode 121b; third sub-electrode 121c; isolation structure 14f; pixel definition structure 131; supporting portion 14f1; crown portion 14f2; preset non-display area BB1; preset display area AA1; protective layer B10; third sub-isolation layer 143; pad portion 14f3. DETAILED DESCRIPTION

[0124] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0125] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0126] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly indicate the number or order of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0127] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0128] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0129] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0130] In the related art, there is a problem that the mark is easily damaged in the manufacturing process of the OLED display panel.

[0131] In order to solve the problem of how to prevent the mark from being easily damaged and improve the display quality of the display panel, the present application designs a display panel and its manufacturing method, a display substrate and a display device, aiming to improve the display quality of the display panel.

[0132] See also Figures 1 to 12 . Figure 1 A schematic diagram of a first process step of a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 2 A schematic diagram of the second process steps of the first method for manufacturing a display panel provided in some embodiments of the present application.

[0133] Figure 3 A schematic diagram of a motherboard in a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 4 Schematic diagram of small and medium pieces of the first display panel manufacturing method provided in some embodiments of the present application.

[0134] Figure 5 A schematic diagram of a first intermediate process of a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 6 A schematic diagram of the second intermediate process of the first display panel manufacturing method provided in some embodiments of the present application. Figure 7A schematic diagram of the third intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Figure 8 A schematic diagram of the fourth intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Figure 9 This is a schematic diagram of the fifth intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Figure 10 A schematic diagram of the sixth intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Figure 11 This is a schematic diagram of the seventh intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Figure 12 This is another schematic diagram of the seventh intermediate process of the first display panel manufacturing method provided in some embodiments of the present application. Figure 13 Another schematic diagram of the seventh intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0135] It should be noted that, in some implementations, in the method for manufacturing the display panel, after Figures 5 to 10 The manufacturing steps can be obtained Figure 11 In some other embodiments, in the method for manufacturing the display panel, after Figures 5 to 10 The manufacturing steps can be obtained Figure 12 The structure of the display substrate is shown.

[0136] It should be noted that Figure 6 A first isolation opening 14k1 and a first pixel opening 13k1 are schematically formed. Figure 7 It is illustrated that the first light emitting device 2341 and the first encapsulation layer 41 are formed. Figure 8 A third isolation opening 14k3 and a third pixel opening 13k3 are schematically formed. Figure 9 It is illustrated that the third light emitting device 2343 and the third encapsulation layer 43 are formed. Figure 10 A second isolation opening 14k2 and a second pixel opening 13k2 are schematically formed. Figure 11 and Figure 12 It is illustrated that a second light emitting device 2342 and a second encapsulation layer 42 are formed.

[0137] It should be noted that Figures 6 to 11 ,as well as Figure 12 During the display panel manufacturing process, Figure 4 Schematic diagram of the cross-sectional structure at the middle dotted line C1-C1.

[0138] First, see Figure 1The present application provides a first method for manufacturing a display panel, which includes: step S100, step S200, step S300, step S400, step S500, step S600, step S700, step S800, step S900, and step S1000.

[0139] Step S100: providing a substrate.

[0140] For example, Figure 5 As shown, a substrate 11 is provided.

[0141] In step S200 , at least one mark and a plurality of first electrodes arranged in an array are formed on one side of the substrate.

[0142] For example, Figure 5 As shown, at least one mark 12 m and a plurality of first electrodes 121 arranged in an array are formed on one side of the substrate 11 .

[0143] For example, Figure 5 The structure and film layers of the display substrate obtained from step S100 to step S400 are illustrated.

[0144] For example, before step S200, before forming at least one mark and a plurality of first electrodes arranged in an array, multiple drive circuits and multiple drive signal lines can be formed on one side of the substrate 11. For example, the multiple drive circuits include multiple pixel drive circuits and multiple gate drive circuits, and the multiple drive signal lines include multiple data signal lines and multiple scan signal lines. The multiple drive circuits can include thin film transistors and / or capacitors. After forming the multiple drive circuits and multiple drive signal lines, at least one mark 12m and a plurality of first electrodes 121 arranged in an array can be formed on a side of the multiple drive circuits and multiple drive signal lines away from the substrate 11.

[0145] For example, Figure 5 As shown, a first conductive layer 12 can be formed on one side of the substrate 11. The first conductive layer 12 is patterned to form at least one mark 12m and a plurality of first electrodes 121 arranged in an array, that is, the mark 12m and the first electrode 121 are made of the same material and process.

[0146] For example, the first electrode 121 may be an anode or a cathode. In the embodiment of the present application, the first electrode 121 is used as an anode.

[0147] For example, the mark 12m may be used for alignment during the manufacturing process of the display panel. For example, the mark 12m may be used for alignment during the manufacturing process of the touch layer of the display panel.

[0148] For example, Figure 3As shown, during the manufacturing process of the display panel, the manufacturing is usually carried out on a motherboard 1000 (large board), and multiple small pieces (ie, multiple display panels) can be manufactured on the motherboard 1000.

[0149] For example, Figure 4 for Figure 3 A schematic enlarged view of a small piece on the middle motherboard 1000 or a corresponding area of ​​the display panel. The display panel 100 may include a display area AA and a non-display area BB surrounding the display area AA.

[0150] For example, Figure 4 As shown, multiple light-emitting devices can be formed in the display area AA, and at least one mark 12m can be formed in the non-display area BB. For example, the mark 12m can be formed in the non-display area BB at the four corners of the display panel, but the mark 12m can also be formed at other positions.

[0151] In step S300, a pixel definition layer is formed on a side of at least one of the marks and the plurality of the first electrodes away from the substrate, wherein the pixel definition layer includes at least one first covering portion, and the orthographic projection of the mark on the substrate is within the orthographic projection range of the corresponding first covering portion on the substrate.

[0152] For example, Figure 5 As shown, a pixel definition layer 13 is formed on the side of at least one mark 12m and multiple first electrodes 121 away from the substrate 11, and the pixel definition layer 13 includes at least one first covering portion 13g, and the positive projection of the mark 12m on the substrate 11 is located within the positive projection range of the corresponding first covering portion 13g on the substrate 11.

[0153] For example, Figure 5 As shown, the first covering portion 13g is formed simultaneously with the formation of the pixel definition layer 13. In step S300 and subsequent steps, the first covering portion 13g may be connected to other portions of the pixel definition layer 13 in the display area AA.

[0154] For example, the first covering portion 13g is formed simultaneously with the pixel definition layer 13. In step S300 and subsequent steps, the first covering portion 13g can be spaced apart from other portions of the pixel definition layer 13 in the display area AA. For example, the first covering portion 13g can be island-shaped or block-shaped.

[0155] For example, the first covering portion 13g may function to protect the mark 12m.

[0156] For example, the material of the pixel definition layer 13 may include an organic material or an inorganic material, which is not limited here.

[0157] In step S400 , an isolation layer is formed on a side of the pixel definition layer away from the substrate, wherein the isolation layer includes a second covering portion, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding second covering portion on the substrate.

[0158] For example, Figure 5 As shown, an isolation layer 14 is formed on a side of the pixel definition layer 13 away from the substrate 11. The isolation layer 14 includes a second covering portion 14g. The orthographic projection of the mark 12m on the substrate 11 overlaps with the orthographic projection of the corresponding second covering portion 14g on the substrate 11. The orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection of the corresponding second covering portion 14g on the substrate 11.

[0159] For example, Figure 5 As shown, the second covering portion 14g is formed simultaneously with the formation of the isolation layer 14. In step S400 and subsequent steps, the second covering portion 14g can be connected to other portions of the isolation layer 14 in the display area AA.

[0160] For example, the second covering portion 14g is formed simultaneously with the formation of the isolation layer 14. In step S400 and subsequent steps, the second covering portion 14g can be spaced apart from other portions of the isolation layer 14 in the display area AA. For example, the second covering portion 14g can be island-shaped or block-shaped.

[0161] For example, the second covering portion 14g may play a role in protecting the first covering portion 13g.

[0162] For example, in some embodiments, the first covering portion 13g can be island-shaped or block-shaped, and the second covering portion 14g can be island-shaped or block-shaped. The orthographic projection of the first covering portion 13g on the substrate 11 is located within the range of the orthographic projection of the second covering portion 14g on the substrate 11. The second covering portion 14g can better protect the first covering portion 13g.

[0163] For example, Figure 5 The diagram shows that the isolation layer 14 includes a first sub-isolation layer 141 and a second sub-isolation layer 142 which are sequentially stacked on the pixel definition layer 13 in a direction away from the substrate. The first sub-isolation layer 141 can form a support portion 14f1 in subsequent embodiments, and the second sub-isolation layer 142 can form a crown portion 14f2 in subsequent embodiments.

[0164] For example, the step of forming the first isolation opening 14k1 includes: etching the second sub-isolation layer 142 and the first sub-isolation layer 141 by a dry etching process to form a first opening, and then etching the first sub-isolation layer 141 by a wet etching process to form the first opening into the first isolation opening 14k1. For example, the cross-section of the first opening perpendicular to the substrate can be rectangular, and the cross-section of the first isolation opening 14k1 perpendicular to the substrate can be T-shaped or I-shaped.

[0165] For example, in some other embodiments, the isolation layer 14 may include a third sub-isolation layer 143, a first sub-isolation layer 141, and a second sub-isolation layer 142, which are sequentially stacked on the pixel definition layer 13 in a direction away from the substrate. The third sub-isolation layer 143 can form a pad portion 14f3 in subsequent embodiments, the first sub-isolation layer 141 can form a support portion 14f1 in subsequent embodiments, and the second sub-isolation layer 142 can form a crown portion 14f2 in subsequent embodiments.

[0166] In step S500 , the isolation layer is patterned to form a plurality of first isolation openings, and the second covering portion is retained.

[0167] For example, Figure 6 As shown, the isolation layer 14 is patterned to form a plurality of first isolation openings 14k1 , and the second covering portion 14g is retained.

[0168] In step S600 , the pixel definition layer is patterned to form a plurality of first pixel openings, and the first covering portion is retained. The first pixel openings are connected to the corresponding first isolation openings, and the first pixel openings expose the corresponding first electrodes.

[0169] For example, Figure 6 As shown, the pixel definition layer 13 is patterned to form a plurality of first pixel openings 13k1, while retaining the first covering portion 13g. The first pixel openings 13k1 are connected to the corresponding first isolation openings 14k1, and the first pixel openings 13k1 expose the corresponding first electrodes 121. For example, the orthographic projection of the first pixel openings 13k1 on the substrate 11 overlaps with the orthographic projection of the corresponding first isolation openings 14k1 on the substrate 11.

[0170] For example, Figure 6 As shown, during the manufacturing process of the display panel, the first isolation opening 14k1 may be formed by an etching process (eg, dry etching and wet etching), and then the first pixel opening 13k1 may be formed by an etching process, but the present invention is not limited thereto.

[0171] For example, Figure 6 As shown, in some embodiments, the orthographic projection of the area of ​​the first pixel opening 13k1 on the substrate 11 is located within the range of the orthographic projection of the area of ​​the first isolation opening 14k1 on the substrate 11 .

[0172] Step S700 : forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device at least in the first isolation opening.

[0173] For example, Figure 7 As shown, the first light emitting functional layer 21 , the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 are formed at least in the first isolation opening 14 k 1 .

[0174] For example, the first light emitting device 2341 includes a corresponding first electrode 121 ( Figure 7 The first sub-electrode 121a in the first light-emitting device 2341 is disposed in a manner similar to that of the first sub-electrode 121a in the first light-emitting device 2341), the first light-emitting functional layer 21, and the corresponding second electrode 31. The first encapsulation layer 41 may comprise an inorganic material. For example, the first encapsulation layers 41 corresponding to the plurality of first light-emitting devices 2341 are arranged in an alternating pattern. For example, the inorganic material may comprise one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0175] In step S800 , the isolation layer is patterned to form a plurality of second isolation openings, and the second covering portion is removed.

[0176] For example, Figure 10 As shown, the isolation layer 14 is patterned to form a plurality of second isolation openings 14k2, and the second covering portion 14g is removed.

[0177] In step S900 , the pixel definition layer is patterned to form a plurality of second pixel openings, wherein the second pixel openings are connected to the corresponding second isolation openings, and the second pixel openings expose the corresponding first electrodes.

[0178] For example, Figure 10 As shown, the pixel definition layer 13 is patterned to form a plurality of second pixel openings 13k2. The second pixel openings 13k2 communicate with the corresponding second isolation openings 14k2, and the second pixel openings 13k2 expose the corresponding first electrodes 121. For example, the orthographic projections of the second pixel openings 13k2 on the substrate 11 overlap with the orthographic projections of the corresponding second isolation openings 14k2 on the substrate 11.

[0179] For example, Figure 10 As shown, during the manufacturing process of the display panel, the second isolation opening 14k2 may be formed by an etching process (eg, dry etching and wet etching), and then the second pixel opening 13k2 may be formed by an etching process, but the present invention is not limited thereto.

[0180] For example, Figure 10 As shown, in some embodiments, the orthographic projection of the area of ​​the second pixel opening 13k2 on the substrate 11 is located within the range of the orthographic projection of the area of ​​the second isolation opening 14k2 on the substrate 11 .

[0181] For example, the inventors have found that after the formation of the mark 12m, the first cover portion 13g is easily etched or damaged in subsequent manufacturing processes, thereby easily leading to the exposure and damage of the mark 12m. For example, in the related art, the first cover portion 13g is easily etched or damaged when the second pixel opening 13k2 is formed. Therefore, in the embodiments of the present application, the second cover portion 14g is arranged on the side of the first cover portion 13g away from the substrate 11. The second cover portion 14g can protect the first cover portion 13g in multiple manufacturing processes such as etching the isolation layer to form the first isolation opening 14k1 and etching the pixel definition layer 13 to form the first pixel opening 13k1, thereby avoiding the first cover portion 13g from being etched or damaged, and avoiding the damage of the mark 12m caused by the etching or damage of the first cover portion 13g.

[0182] In step S1000, at least the second isolation opening is used to form a second light-emitting functional layer, a second electrode and a second encapsulation layer of a second light-emitting device.

[0183] For example, as shown in Figure 11 or Figure 12 , at least the second isolation opening 14k2 is used to form a second light-emitting functional layer 22, a second electrode 31 and a second encapsulation layer 42 of a second light-emitting device 2342. The second encapsulation layer 42 can include an inorganic material. For example, the second encapsulation layers 42 corresponding to the plurality of second light-emitting devices 2342 are arranged at intervals. For example, the second encapsulation layer 42 corresponding to the second light-emitting device 2342 and the first encapsulation layer 41 corresponding to the first light-emitting device 2341 are arranged at intervals.

[0184] For example, the second light-emitting device 2342 includes a corresponding first electrode 121 (second sub-electrode 121b in Figure 11 ), a second light-emitting functional layer 22 and a corresponding second electrode 31. For example, the light-emitting colors of the first light-emitting device 2341 and the second light-emitting device 2342 are different.

[0185] For example, when performing the steps S800, S900 and S1000, a photoresist layer or a photoresist layer can be formed first to protect the first light-emitting device 2341.

[0186] In an embodiment of the present application, in step S300, the pixel definition layer 13 includes at least one first covering portion 13g, that is, the first covering portion 13g is formed when the pixel definition layer 13 is formed; in step S400, the isolation layer 14 includes at least one second covering portion 14g, that is, the second covering portion 14g is formed when the isolation layer 14 is formed; in step S800, the isolation layer 14 is patterned to form a plurality of second isolation openings 14k2, and the second covering portion 14g is removed, that is, when the second isolation openings 14k2 are formed, the second covering portion 14g is removed at the same time; in step S900, the pixel definition layer 13 is patterned to form a plurality of second pixel openings 13k2, the second pixel openings 13k2 are connected to the corresponding second isolation openings 14k2, and the second pixel openings 13k2 expose the corresponding first electrodes 121, that is, the first covering portion 13g is retained when the second pixel openings 13k2 are formed. The embodiment of the present application has many beneficial effects. 1) In the first aspect, the first covering portion 13g can play a role in protecting the mark 12m. The second covering portion 14g can play a role in protecting the first covering portion 13g before forming the second isolation opening 14k2. The second covering portion 14g can protect the first covering portion 13g in multiple manufacturing processes such as etching the isolation layer to form the first isolation opening 14k1 and etching the pixel definition layer 13 to form the first pixel opening 13k1, thereby preventing the first covering portion 13g from being etched or damaged, thereby preventing the mark 12m from being etched or damaged. 12m is damaged; 2) On the second hand, when the second isolation opening 14k2 is formed, the second covering portion 14g is removed at the same time to prevent the second covering portion 14g from blocking the mark 12m, thereby preventing the mark 12m from being used for alignment in subsequent processes; 3) On the third hand, when the second pixel opening 13k2 is formed, the first covering portion 13g is retained at the same time. The pixel definition layer 13 is a light-transmitting material, and the first covering portion 13g is a light-transmitting material. The first covering portion 13g can continue to protect the mark 12m without blocking the mark 12m and causing no adverse effects on the recognition and alignment of the mark.

[0187] In some embodiments, as Figure 11 As shown in FIG. 12 , the step of patterning the pixel definition layer 13 to form a plurality of second pixel openings 13 k 2 (step S900 ) includes: retaining the first covering portion 13 g , so that the first covering portion 13 g continues to protect the mark.

[0188] Optionally, in some embodiments, the second light-emitting device 2342 is the last light-emitting device manufactured.

[0189] For example, the manufacturing method of the display panel 100 includes manufacturing light-emitting devices of multiple colors. The second light-emitting device 2342 is the light-emitting device of the last color manufactured. The number of steps in the protection process of the second covering portion 14g can be increased.

[0190] Optionally, in some embodiments, the pixel definition layer 13 includes an inorganic insulating material, for example, one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0191] Optionally, in some embodiments, the isolation layer 14 includes a conductive material, for example, the isolation layer 14 is electrically connected to the second electrode 31 .

[0192] Optionally, in some embodiments, the material of the marker 12m includes metal.

[0193] Optionally, in some embodiments, the mark 12m includes an alignment mark, which can be used for alignment during the display panel manufacturing process.

[0194] Alternatively, in some embodiments, Figure 11 Or as shown in Figure 12, the step of forming the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 at least in the second isolation opening 14k2 (step S1000) includes: step S1001, sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; step S1002, patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342, removing the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the first isolation opening 14k1, retaining the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second isolation opening 14k2, and forming the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 in the second isolation opening 14k2.

[0195] For example, in step S1001, a second predetermined light-emitting functional layer, a predetermined second electrode, and a predetermined second encapsulation layer are formed on the entire surface of the second light-emitting device 2342. Then, in step S1002, the second light-emitting functional layer 22, the second electrode 31, and the second encapsulation layer 42 of the second light-emitting device 2342 are patterned. The second predetermined light-emitting functional layer of the second light-emitting device 2342 is patterned to form the second light-emitting functional layer 22 of the second light-emitting device 2342; the predetermined second electrode of the second light-emitting device 2342 is patterned to form the second electrode 31 of the second light-emitting device 2342; and the predetermined second encapsulation layer of the second light-emitting device 2342 is patterned to form the second encapsulation layer 42 of the second light-emitting device 2342.

[0196] Alternatively, in some embodiments, Figure 7As shown, at least in the step (step S700) of forming the first light emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 from the first isolation opening 14k1, the manufacturing method of the display panel further comprises: step S701, sequentially forming a first preset light emitting functional layer, a preset second electrode and a preset first encapsulation layer of the first light emitting device 2341; step S702, patterning the first preset light emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light emitting device 2341, removing at least part of the first preset light emitting functional layer, at least part of the preset second electrode and at least part of the preset first encapsulation layer outside the first isolation opening 14k1, retaining the first preset light emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first isolation opening 14k1, and forming the first light emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 in the first isolation opening 14k1.

[0197] For example, in step S701, the first preset light emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light emitting device 2341 are formed as a whole, and then in step S702, the first light emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 are patterned. The first preset light emitting functional layer of the first light emitting device 2341 is patterned to form the first light emitting functional layer 21 of the first light emitting device 2341; the preset second electrode of the first light emitting device 2341 is patterned to form the second electrode 31 of the first light emitting device 2341; and the preset first encapsulation layer of the first light emitting device 2341 is patterned to form the first encapsulation layer 41 of the first light emitting device 2341.

[0198] In some embodiments, as shown, Figure 11 As shown, the step (step S1001) of sequentially forming the second preset light emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light emitting device 2342 further comprises: forming a third cover portion 234g, the third cover portion 234g is at least partially disposed in the same layer as the second preset light emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light emitting device 2342; and the step (step S1002) of patterning the second preset light emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light emitting device 2342 further comprises: removing the third cover portion 234g to expose the first cover portion 13g.

[0199] For example, in some embodiments, in step S1001, when the second preset light emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light emitting device 2342 are formed as a whole, the third cover portion (not shown in the figure) is also formed at the same time, i.e. the third cover portion is composed of the second preset light emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light emitting device 2342. In step S1002, asFigure 11 As shown, the third covering portion is removed to expose the first covering portion 13g, so that the first covering portion 13g continues to protect the mark 12m.

[0200] For example, in some other embodiments, in step S701, when forming the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device 2341 on the entire surface, a partial film layer of the third covering portion (not shown in the figure) is formed at the same time; in step S1001, when forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 on the entire surface, a partial film layer of the third covering portion (not shown in the figure) is formed at the same time, that is, the third covering portion is composed of the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device 2341, and the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; in step S1002, as Figure 11 As shown, the third covering portion is removed to expose the first covering portion 13g, so that the first covering portion 13g continues to protect the mark 12m.

[0201] In some embodiments, as Figure 12 As shown, while the steps of sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 (step S1001) are performed, the manufacturing method of the display panel also includes: forming a third covering portion, the third covering portion is at least partially arranged in the same layer and made of the same material as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; and patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 (step S1002), including: retaining the third covering portion 234g.

[0202] For example, Figure 12 As shown, in some other embodiments, in step S1001, when forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 on the entire surface, the third covering portion 234g is formed at the same time. The third covering portion 234g is composed of the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342. In step S1002, as Figure 12 As shown, the third covering portion 234g is retained so that the third covering portion 234g and the first covering portion 13g together protect the mark 12m. At the same time, the third covering portion 234g also has light-transmitting properties and will not block the mark 12m. The mark 12m can be used for alignment in subsequent manufacturing processes.

[0203] For example, combined with Figure 12As shown, in some other embodiments, in step S701, when forming the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device 2341 on the entire surface, a partial film layer of the third covering portion 234g is formed at the same time (not shown in the figure); in step S1001, when forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 on the entire surface, a partial film layer of the third covering portion 234g is formed at the same time, and the third covering portion 234g is composed of the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device 2341, and the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; in step S1002, combined with Figure 12 As shown, the third covering portion 234g is retained, so that the third covering portion 234g and the first covering portion 13g together protect the mark 12m. At the same time, the third covering portion 234g also has light-transmitting properties and will not block the mark 12m. The mark 12m can be used for alignment in subsequent manufacturing processes.

[0204] In some embodiments, as Figure 2 As shown, at least after the step (step S700) of forming the first light-emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light-emitting device 2341 in the first isolation opening 14k1, and before the step (step S800) of patterning the isolation layer 14 to form a plurality of second isolation openings 14k2 and removing the second covering portion 14g, it also includes: step S1100, step S1200, and step S1300.

[0205] In step S1100 , the isolation layer is patterned to form a plurality of third isolation openings, while retaining the second covering portion.

[0206] For example, Figure 8 As shown, the isolation layer 14 is patterned to form a plurality of third isolation openings 14k3, and the second covering portion 14g is retained.

[0207] In step S1200 , the pixel definition layer is patterned to form a plurality of third pixel openings while retaining the first covering portion. The third pixel openings are connected to the corresponding third isolation openings, and the third pixel openings expose the corresponding first electrodes.

[0208] For example, Figure 8As shown, the pixel defining layer 13 is patterned to form a plurality of third pixel openings 13k3 and retain the first cover portion 13g, the third pixel openings 13k3 are in communication with corresponding third isolation openings 14k3, and the third pixel openings 13k3 expose corresponding first electrodes 121. For example, the orthographic projection of the third pixel openings 13k3 on the substrate 11 overlaps the orthographic projection of the corresponding third isolation openings 14k3 on the substrate 11.

[0209] For example, as shown in FIG. 1A, the third pixel openings 13k3 are formed by etching the pixel defining layer 13, but the present disclosure is not limited thereto. Figure 8 As shown, in the manufacturing process of the display panel, the third isolation openings 14k3 can be formed by an etching process (for example, including dry etching and wet etching), and then the third pixel openings 13k3 are formed by an etching process, but the present disclosure is not limited thereto.

[0210] For example, as shown in FIG. 1A, the third pixel openings 13k3 are formed by etching the pixel defining layer 13, but the present disclosure is not limited thereto. Figure 8 As shown, in some embodiments, the orthographic projection of the area of the third pixel openings 13k3 on the substrate 11 is located within the orthographic projection of the area of the third isolation openings 14k3 on the substrate 11.

[0211] At step S1300, a third light emitting functional layer, a second electrode, and a third encapsulation layer of a third light emitting device are formed at least in the third isolation openings.

[0212] For example, as shown in FIG. 1A, the third pixel openings 13k3 are formed by etching the pixel defining layer 13, but the present disclosure is not limited thereto. Figure 9 As shown, the third light emitting functional layer 23, the second electrode 31, and the third encapsulation layer 43 of the third light emitting device 2343 are formed at least in the third isolation openings 14k3. The third encapsulation layer 43 can include an inorganic material. For example, the third encapsulation layers 43 corresponding to the plurality of third light emitting devices 2343 are spaced apart. For example, the second encapsulation layer 42 corresponding to the second light emitting device 2342 and the third encapsulation layer 43 corresponding to the third light emitting device 2343 are spaced apart. For example, the third encapsulation layer 43 corresponding to the third light emitting device 2343 and the first encapsulation layer 41 corresponding to the first light emitting device 2341 are spaced apart.

[0213] For example, in some embodiments, as shown in FIG. 1A, the third light emitting functional layer 23, the second electrode 31, and the third encapsulation layer 43 of the third light emitting device 2343 are formed at least in the third isolation openings 14k3. Figure 2As shown, the method for manufacturing a display panel includes steps S100, S200, S300, S400, S500, S600, S700, S1100, S1200, S1300, S800, S900, and S1000. Specifically, the method for manufacturing a display panel includes, in sequence, forming a plurality of first light-emitting devices 2341, a plurality of third light-emitting devices 2343, and a plurality of second light-emitting devices 2342. In the method for manufacturing a display panel, the plurality of first light-emitting devices 2341, the plurality of third light-emitting devices 2343, and the plurality of second light-emitting devices 2342 are sequentially manufactured. The first covering portion 13g and the second protecting portion 14g are formed during the manufacturing process of the first light-emitting devices 2341. During the multiple manufacturing processes of the third light-emitting devices 2343, the second covering portion 14g can also protect the first covering portion 13g.

[0214] For example, the first light-emitting functional layer 21 of the first light-emitting device 2341, the second light-emitting functional layer 22 of the second light-emitting device 2342 and the third light-emitting functional layer 23 of the third light-emitting device 2343 are light-emitting functional layers that emit light of different colors. The light-emitting functional layer may include a light-emitting layer (Emission layer, EML). The light-emitting functional layer may also include other film layers other than the light-emitting layer (Emission layer, EML), for example, it may also include one or more of a hole injection layer (Hole Injection Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), an electron injection layer (Electron Injection Layer, EIL), an electron transport layer (Electron Transport Layer, ETL), a hole blocking layer (Hole Block Layer, HBL) and an electron blocking layer (Electron Block Layer, EBL).

[0215] In some embodiments, as Figure 9As shown, the step of forming the third light-emitting functional layer 23, the second electrode 31 and the third encapsulation layer 43 of the third light-emitting device 2343 at least in the third isolation opening 14k3 (step S1300) includes: step S1301, sequentially forming the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343; step S1302, patterning the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343, removing the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343 in the first isolation opening 14k1, retaining the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343 in the third isolation opening 14k3, and forming the third light-emitting functional layer 23, the second electrode 31 and the third encapsulation layer 43 of the third light-emitting device 2343 in the third isolation opening.

[0216] For example, in step S1301, a third predetermined light-emitting functional layer, a predetermined second electrode, and a predetermined third encapsulation layer are formed on the entire surface of the third light-emitting device 2343. Then, in step S1302, the third light-emitting functional layer 23, the second electrode 31, and the third encapsulation layer 43 of the third light-emitting device 2343 are patterned. The third predetermined light-emitting functional layer of the third light-emitting device 2343 is patterned to form the third light-emitting functional layer 23 of the third light-emitting device 2343; the predetermined second electrode of the third light-emitting device 2343 is patterned to form the second electrode 31 of the third light-emitting device 2343; and the predetermined third encapsulation layer of the third light-emitting device 2343 is patterned to form the third encapsulation layer 43 of the third light-emitting device 2343.

[0217] For example, the third light emitting device 2343 includes a corresponding first electrode 121 ( Figure 9 a third sub-electrode 121c in the middle), a third light-emitting functional layer 23 and a corresponding second electrode 31.

[0218] In some embodiments, combined Figures 10 to 12 As shown, after patterning the isolation layer 14 to form a plurality of second isolation openings 14k2 and removing the second covering portion 14g (step S800), the isolation layer 14 includes an isolation structure 14f. The isolation structure 14f is disposed around the first isolation opening 14k1 and the second isolation opening 14k2. For example, the isolation structure 14f is disposed around the first isolation opening 14k1, the second isolation opening 14k2, and the third isolation opening 14k3. The isolation structure 14f is electrically connected to the second electrode 31.

[0219] For example, Figure 11As shown, after the isolation layer 14 is patterned, or after the first isolation opening 14k1, the third isolation opening 14k3, and the second isolation opening 14k2 are patterned, the isolation layer 14 includes an isolation structure 14f. The formation processes of the first isolation opening 14k1, the third isolation opening 14k3, and the second isolation opening 14k2 are the same or similar and will not be repeated here.

[0220] For example, after the isolation layer 14 is patterned, in a top view, the isolation layer 14 includes a plurality of first isolation openings 14k1 and a plurality of second isolation openings 14k2, for example, the isolation layer 14 includes a plurality of first isolation openings 14k1, a plurality of third isolation openings 14k3 and a plurality of second isolation openings 14k2, and an isolation structure 14f surrounding the plurality of first isolation openings 14k1, the plurality of third isolation openings 14k3 and the plurality of second isolation openings 14k2.

[0221] For example, combined with Figures 10 to 12 As shown, the pixel definition layer 13 includes a pixel definition structure 131, and the pixel definition structure 131 is enclosed into a plurality of pixel openings, and the plurality of pixel openings include a first pixel opening 13k1 and a second pixel opening 13k2, for example, the plurality of pixel openings include a first pixel opening 13k1, a second pixel opening 13k2 and a third pixel opening 13k3.

[0222] Optionally, in some embodiments, the isolation structure 14f is in a grid shape.

[0223] Optionally, the isolation structure 14f includes a conductive material, the second electrode 31 of the first light-emitting device 2341 is electrically connected to the isolation structure 14f, the second electrode 31 of the second light-emitting device 2342 is electrically connected to the isolation structure 14f; the second electrode 31 of the third light-emitting device 2343 is electrically connected to the isolation structure 14f.

[0224] In some embodiments, as Figure 11 and Figure 12 As shown, at least after the step of forming the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 in the second isolation opening 14k2 (step S1000), the first encapsulation layer 41, the second encapsulation layer 42 and the third encapsulation layer 43 are arranged at intervals.

[0225] Optionally, in some embodiments, the first encapsulation layer 41 includes an inorganic material; the second encapsulation layer 42 includes an inorganic material; and the third encapsulation layer 43 includes an inorganic material.

[0226] In some embodiments, as Figure 11As shown, the isolation structure 14f includes a support portion 14f1 and a crown portion 14f2 which are sequentially stacked on the substrate 11 in a direction away from the substrate 11, and a side of the support portion 14f1 away from the substrate 11 is projected onto a range of the crown portion 14f2 on the substrate 11.

[0227] For example, an area of the side of the support portion 14f1 away from the substrate 11 on the substrate 11 is less than an area of the crown portion 14f2 on the substrate 11. Alternatively, in some embodiments, as shown in FIG. 14, the support portion 14f1 and the crown portion 14f2 are integrally formed. Figure 11 As shown, the support portion 14f1 includes a conductive material, the second electrode 31 of the first light emitting device 2341 is overlapped with a sidewall of the support portion 14f1 around the first isolation opening 14k1, the second electrode 31 of the second light emitting device 2342 is overlapped with a sidewall of the support portion 14f1 around the second isolation opening 14k2, and the second electrode 31 of the third light emitting device 2343 is overlapped with a sidewall of the support portion 14f1 around the third isolation opening 14k3.

[0228] For example, as shown in FIG. 14, the support portion 14f1 includes a conductive material, and the second electrode 31 of the first light emitting device 2341 is overlapped with a sidewall of the support portion 14f1 around the first isolation opening 14k1. Figure 11 As shown, the isolation structure 14f includes a support portion 14f1 and a crown portion 14f2 which are sequentially stacked on the substrate 11 in a direction away from the substrate 11, and a side of the support portion 14f1 away from the substrate 11 is projected onto a range of the crown portion 14f2 on the substrate 11. Thus, at least a part of the isolation structure 14f away from the substrate 11 is configured to have a shape of wide at the top and narrow at the bottom between the adjacent two light emitting devices around the isolation openings (including the first isolation opening 14k1, the second isolation opening 14k2 and the third isolation opening 14k3), so that the isolation structure 14f can block the light emitting layer EML or the hole transport layer HTL and other film layers of the adjacent light emitting devices, and the expensive fine metal mask (FMM) can be saved, thereby reducing the manufacturing cost of the display panel. At the same time, after the fine metal mask (FMM) is not used, the light emitting area of the sub-pixel is not limited by the opening of the fine metal mask, and the light emitting area of the sub-pixel can be made smaller, and a larger number of sub-pixels can be formed in the display panel, thereby improving the resolution of the display panel.

[0229] Alternatively, in some embodiments, as shown in FIG. 14, the material of the support portion 14f1 includes aluminum, and / or the material of the crown portion 14f2 includes titanium. Figure 11 As shown, the support portion 14f1 includes a conductive material, the second electrode 31 of the first light emitting device 2341 is overlapped with a sidewall of the support portion 14f1 around the first isolation opening 14k1, the second electrode 31 of the second light emitting device 2342 is overlapped with a sidewall of the support portion 14f1 around the second isolation opening 14k2, and the second electrode 31 of the third light emitting device 2343 is overlapped with a sidewall of the support portion 14f1 around the third isolation opening 14k3.

[0230] In some embodiments, as shown in FIG. 14, the material of the support portion 14f1 includes aluminum, and / or the material of the crown portion 14f2 includes titanium. Figure 13As shown, the isolation structure 14f includes, in the direction Z away from the substrate 11, a support portion 14f1 and a crown portion 14f2 which are sequentially stacked on the substrate 11, and a pad portion 14f3 between the support portion 14f1 and the substrate 11, a projection of the side of the support portion 14f1 away from the substrate 11 on the substrate 11 is located within a projection of the crown portion 14f2 on the substrate 11, and a projection of the support portion 14f1 on the substrate 11 is located within a projection of the pad portion 14f3 on the substrate 11.

[0231] It should be noted that, in the isolation layer 14, Figure 12 different from the isolation layer 14, Figure 13 the isolation layer 14 includes, in the direction away from the substrate 11, a first sub-isolation layer 141, a second sub-isolation layer 142, and a third sub-isolation layer 143 which are sequentially stacked, and the isolation structure 14f includes, in the direction away from the substrate 11, the pad portion 14f3, the support portion 14f1, and the crown portion 14f2 which are sequentially stacked.

[0232] For example, the projection area of the support portion 14f1 on the substrate 11 is less than the projection area of the pad portion 14f3 on the substrate 11.

[0233] Optionally, in some embodiments, in combination with Figure 11 As shown, the pad portion 14f3 includes a conductive material, the second electrode 31 of the first light emitting device 2341 is overlapped with the pad portion 14f3 around the first isolation opening 14k1; the second electrode 31 of the second light emitting device 2342 is overlapped with the pad portion 14f3 around the second isolation opening 14k2; and the second electrode 31 of the third light emitting device 2343 is overlapped with the pad portion 14f3 around the third isolation opening 14k3.

[0234] Optionally, in some embodiments, in combination with Figure 11 As shown, the pad portion 14f3 and the support portion 14f1 both include a conductive material, the second electrode 31 of the first light emitting device 2341 is overlapped with the pad portion 14f3 and the support portion 14f1 around the first isolation opening 14k1; the second electrode 31 of the second light emitting device 2342 is overlapped with the pad portion 14f3 and the support portion 14f1 around the second isolation opening 14k2; and the second electrode 31 of the third light emitting device 2343 is overlapped with the pad portion 14f3 and the support portion 14f1 around the third isolation opening 14k3.

[0235] Optionally, in some embodiments, in combination with Figure 11 As shown, the material of the support portion 14f1 includes aluminum, and / or the material of the crown portion 14f2 includes titanium, and / or the material of the pad portion 14f3 includes molybdenum.

[0236] In some embodiments, in combination with Figure 11 and Figure 12As shown, the first light emitting device 2341, the second light emitting device 2342 and the third light emitting device 2343 emit different colors;

[0237] Optionally, in some embodiments, the first light-emitting device 2341 is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, the second light-emitting device 2342 is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from the first light-emitting device 2341, and the third light-emitting device 2343 is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from both the first light-emitting device 2341 and the second light-emitting device 2342.

[0238] For example, in some embodiments, the first light-emitting device 2341 is a red light-emitting device, the second light-emitting device 2342 is a green light-emitting device, and the third light-emitting device 2343 is a blue light-emitting device. In some embodiments, the first light-emitting device 2341 is a green light-emitting device, the second light-emitting device 2342 is a red light-emitting device, and the third light-emitting device 2343 is a blue light-emitting device. In some embodiments, the first light-emitting device 2341 is a blue light-emitting device, the second light-emitting device 2342 is a green light-emitting device, and the third light-emitting device 2343 is a red light-emitting device, but is not limited thereto.

[0239] In some embodiments, as Figure 3 and Figure 4 As shown, the substrate 11 includes a preset display area AA1 and a preset non-display area BB1, the first light emitting device 2341, the second light emitting device 2342 and the third light emitting device 2343 are formed in the preset display area AA1, and the mark 12m is formed in the preset non-display area BB1.

[0240] For example, combined with Figure 3 and Figure 4 As shown, after the display panel is manufactured, the preset display area AA1 is the display area AA of the display panel, the preset non-display area BB1 is the non-display area BB of the display panel, and the mark 12m is located in the preset non-display area BB1 or the non-display area BB.

[0241] In some embodiments, the first isolation opening 14k1 may be formed after the third isolation opening 14k3 is formed. The first pixel opening 13k1 may be formed after the third pixel opening 13k3 is formed. For example, the light-emitting functional layer of the first light-emitting device 2341 is formed after the light-emitting functional layer of the third light-emitting device 2343 is formed.

[0242] In some embodiments, the first isolation opening 14k1 and the third isolation opening 14k3 are formed simultaneously. The first pixel opening 13k1 and the third pixel opening 13k3 are formed simultaneously. For example, the light-emitting functional layer of the first light-emitting device 2341 is formed before the light-emitting functional layer of the third light-emitting device 2343. Alternatively, the light-emitting functional layer of the first light-emitting device 2341 is formed after the light-emitting functional layer of the third light-emitting device 2343 is formed.

[0243] Figure 11 、 Figure 12 、 Figure 13 It can be the final state of the display panel.

[0244] It should be noted that in the second method for manufacturing a display panel, in some implementations, for example, in the implementation where the second covering portion 14g and at least a portion of the isolation layer 14 are formed in the same layer and made of the same material, Figures 5 to 13 The example may also be a schematic diagram of an intermediate process of the second method for manufacturing the display panel.

[0245] Second, see Figures 14 to 23 ,or Figures 5 to 13 Based on the same inventive concept, the present application provides a second method for manufacturing a display panel, such as Figure 14 As shown, the second method for manufacturing a display panel includes: step T100 , step T200 , step T300 , step T400 , step T500 , step T600 , step T700 , and step T800 .

[0246] Step T100 , providing a substrate 11 .

[0247] Step T200 , forming at least one mark 12 m on one side of the substrate 11 .

[0248] In step T300 , at least a portion of a protective layer B10 is formed on a side of at least one mark 12 m away from the substrate 11 , and an orthographic projection of the mark 12 m on the substrate 11 overlaps with an orthographic projection of the protective layer B10 on the substrate 11 .

[0249] Step T400 , forming an isolation layer 14 on one side of the substrate 11 .

[0250] Step T500 , patterning the isolation layer 14 to form a first isolation opening 14k1 .

[0251] In step T600 , the first light emitting functional layer 21 , the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 are formed in the first isolation opening 14 k 1 .

[0252] Step T700 , patterning the isolation layer 14 to form a second isolation opening 14k2 .

[0253] Step T800 : forming the second light-emitting functional layer 22 , the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 in the second isolation opening 14k2 .

[0254] Step T300 may be performed before, after, or simultaneously with step T400. The protective layer B10 can protect the mark 12m, protecting it from being etched or damaged during manufacturing processes such as the wet etching process for etching the isolation layer 14 using a wet etching solution to form the first isolation opening 14k1 and the wet etching process for etching the electrode material layer using a wet etching solution to form the second electrode of the light-emitting device.

[0255] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0256] For example, in some embodiments, after step T600 and before step T700, the second method for manufacturing a display panel further includes: patterning the isolation layer 14 to form a third isolation opening 14k3; and forming a third light-emitting functional layer 23, a second electrode 31, and a third encapsulation layer 43 of a third light-emitting device 2343 in the third isolation opening 14k3.

[0257] In some embodiments, the protective layer B10 includes a first covering portion 13 g and a second covering portion 14 g sequentially stacked in a direction away from the substrate 11 .

[0258] In some embodiments, before the step of forming the isolation layer 14 on one side of the substrate 11 (step T400), the method for manufacturing the display panel further includes: forming a pixel definition layer 13, the pixel definition layer 13 includes a first covering portion 13g, and the orthographic projection of the mark 12m on the substrate 11 overlaps with the orthographic projection of the first covering portion 13g on the substrate 11.

[0259] In some embodiments, simultaneously with or after patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the display panel manufacturing method further includes removing the second covering portion 14g. This arrangement prevents the second covering portion 14g from obstructing the mark 12m and affecting the accuracy of identification and alignment of the mark 12m.

[0260] In some embodiments, as Figure 15 The second covering portion 14g and the isolation layer 14 are made of at least partially different materials or are arranged in separate layers. For example, the second covering portion 14g includes a light-transmitting layer. For example, the light-transmitting layer of the second covering portion 14g is formed before or after the isolation layer 14 is formed, and the orthographic projection of the isolation layer 14 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11. The orthographic projection of the isolation layer 14 on the substrate 11 does not overlap with the orthographic projection of the light-transmitting layer in the second covering portion 14g on the substrate 11.

[0261] Multiple structures arranged on the same layer can be obtained by patterning the same film layer to simplify the process. Multiple structures arranged on different layers can be formed by using different film layers.

[0262] In some embodiments, as Figure 15 , the material of the light-transmitting layer includes semiconductor metal oxide.

[0263] like Figure 15 , the semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide and indium gallium zinc oxide.

[0264] and Figures 5 to 13 The example is different. Figure 15 and Figure 16 In the example shown, after forming the pixel definition layer 13, a second covering portion 14g is formed on the side of the first covering portion 13g away from the substrate 11, the second covering portion 14g includes a light-transmitting layer, and then an isolation layer 14 is formed on the side of the second covering portion 14g away from the substrate 11.

[0265] For example, in some embodiments, Figures 15 to 18 In the example shown, when forming the first isolation opening 14k1, the film layer of the isolation layer 14 on the surface of the second covering portion 14g can be removed. At this time, the mark 12m can be used for subsequent manufacturing processes. For example, the mark 12m can be used for the alignment process during the subsequent formation of the second isolation opening 14k2 or the third isolation opening 14k3.

[0266] In other embodiments, a second covering portion 14g is formed on a side of the first covering portion 13g away from the substrate 11, and an isolation layer 14 is formed on one side of the substrate 11. The orthographic projection of the isolation layer 14 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11. When the first isolation opening 14k1 is formed, the second covering portion 14g can protect the first covering portion 13g and the mark 12m from being damaged by etching.

[0267] For example, simultaneously with or after the step of patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the method for manufacturing a display panel further includes removing the second covering portion 14g. Before removing the second covering portion 14g, the second covering portion 14g can protect the first covering portion 13g, thereby protecting the mark 12m.

[0268] In some embodiments, as Figure 15As shown, the corrosion resistance of the material of at least a portion of the film layer of the second covering portion 14g is greater than the corrosion resistance of the material of at least a portion of the film layer in the isolation layer 14. For example, the corrosion resistance of the material of the light-transmitting layer in the second covering portion 14g is greater than the corrosion resistance of the material (e.g., aluminum) of at least a portion of the film layer in the isolation layer 14. The light-transmitting layer in the second covering portion 14g can protect the mark 12m and protect the mark from being etched or damaged during manufacturing processes such as the wet etching process of etching the isolation layer 14 using a wet etching solution to form the first isolation opening 14k1 and the wet etching process of etching the electrode material layer using a wet etching solution to form the second electrode of the light-emitting device. With respect to the wet etching solution, the corrosion resistance of the material of at least a portion of the film layer of the second covering portion 14g is greater than the corrosion resistance of the material of at least a portion of the film layer in the isolation layer 14.

[0269] Alternatively, in some embodiments, Figure 15 As shown, the material of the second covering portion 14g includes titanium. For example, titanium has a higher corrosion resistance than the material (e.g., aluminum) of at least a portion of the film layer in the isolation layer 14. The titanium layer in the second covering portion 14g can protect the mark 12m, protecting it from etching or damage during manufacturing processes such as the wet etching process for etching the isolation layer 14 using a wet etching solution to form the first isolation opening 14k1 and the wet etching process for etching the electrode material layer using a wet etching solution to form the second electrode of the light-emitting device.

[0270] For example, in some embodiments, Figures 15 to 23 As shown, the corrosion resistance of the material of at least part of the film layer of the second covering part 14g is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer 14, so that when the isolation layer 14 is etched, the second covering part 14g will not be etched away, and the second covering part 14g can protect the first covering part 13g.

[0271] For example, in some embodiments, Figure 16 As shown, the manufacturing method of the display panel further includes forming an isolation layer 14 on a side of the second covering portion 14 g away from the substrate 11 , and the second covering portion 14 g is a film layer different from the isolation layer 14 .

[0272] For example, in some embodiments, simultaneously with or after the step of patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the method for manufacturing a display panel further includes removing the second covering portion 14g (e.g., comprising a light-transmitting layer or a titanium layer). Before removing the second covering portion 14g, the second covering portion 14g can protect the first covering portion 13g, thereby protecting the mark 12m.

[0273] In some embodiments, the final state of the display substrate or display panel: the light-transmitting layer in the second covering portion 14g may remain.

[0274] In some embodiments, as Figures 5 to 13 The isolation layer 14 includes a second covering portion 14g, and the orthographic projection of the mark 12m on the substrate 11 overlaps with the orthographic projection of the second covering portion 14g on the substrate 11; while patterning the isolation layer 14 to form the first isolation opening 14k1 (step T500), the method for manufacturing the display panel further includes: retaining the second covering portion 14g; while patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the method for manufacturing the display panel further includes: removing the second covering portion 14g.

[0275] In some embodiments, as Figures 5 to 13 As shown, the second covering portion 14g is provided in the same layer and material as part of the film layer of the isolation layer 14, that is, the second covering portion 14g is manufactured simultaneously with the isolation layer 14. For example, the second sub-isolating layer 142 includes the second covering portion 14g. For example, the second covering portion 14g does not include the first sub-isolating layer 141. For example, the orthographic projection of the first sub-isolating layer 141 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11. For example, the second covering portion 14g does not include the third sub-isolating layer 143. For example, the orthographic projection of the third sub-isolating layer 143 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11.

[0276] In some embodiments, as Figures 5 to 13 As shown, the second covering portion 14g is formed of the same material as the isolation layer 14, that is, the second covering portion 14g is manufactured simultaneously with the isolation layer 14. At this time, the manufacturing process of the second display panel is the same or similar to the manufacturing process of the first display panel.

[0277] In some embodiments, the number of film layers in the second cover portion 14g is less than or equal to the number of film layers in the isolation layer 14. The second cover portion 14g includes only the second isolation sub-layer 142, such as a titanium layer. Alternatively, the second cover portion 14g includes the first isolation sub-layer 141 and the second isolation sub-layer 142. Alternatively, the second cover portion 14g includes the first isolation sub-layer 141, the second isolation sub-layer 142, and the third isolation sub-layer 143.

[0278] In some embodiments, the second covering portion 14 g is a single metal film layer (eg, a titanium layer) or a multi-layer film layer stacked along the thickness direction (parallel to the direction Z) of the substrate 11 .

[0279] In some embodiments, an overlapping area of ​​the orthographic projection of the first covering portion 13 g on the substrate 11 and the orthographic projection of the second covering portion 14 g on the substrate 11 overlaps with the orthographic projection of the mark 12 m on the substrate 11 .

[0280] Optionally, in some embodiments, the orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection of the first covering portion 13g on the substrate 11 , and the orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection of the second covering portion 14g on the substrate 11 .

[0281] Optionally, in some embodiments, the first light-emitting device 2341 further includes a first electrode 121 located between the substrate 11 and the first light-emitting functional layer 21 , and the marker 12 m is disposed on the same layer as the first electrode 121 of the first light-emitting device 2341 .

[0282] For example, the second method for manufacturing a display panel has the same or similar beneficial effects as the first method for manufacturing a display panel, and details thereof will not be repeated here. Figure 11 、 Figure 12 、 Figure 13 、 Figure 23 It can be an intermediate state or a final state of a display panel or a display substrate.

[0283] In a third aspect, based on the same inventive concept, the present application provides a display substrate 110. Display substrate 110 can be obtained using any of the above-described display panel manufacturing methods (the first display panel manufacturing method and / or the second display panel manufacturing method). Display substrate 110 includes a base 11, at least one marking 12m, a plurality of first electrodes 121 arranged in an array, a pixel definition layer 13, an isolation layer 14, a first light-emitting device 2341, a first encapsulation layer 41, a second light-emitting device 2342, and a second encapsulation layer 42. At least one mark 12m and a plurality of first electrodes 121 arranged in an array are located on one side of the substrate 11, and the mark 12m and the first electrode 121 are made of the same layer and the same material; the pixel definition layer 13 is located on the side of the at least one mark 12m and the plurality of first electrodes 121 away from the substrate 11, and the pixel definition layer 13 includes at least one first covering portion 13g, and a plurality of first pixel openings 13k1 and a plurality of second pixel openings, and the positive projection of the mark 12m on the substrate 11 is located within the positive projection range of the corresponding first covering portion 13g on the substrate 11; the isolation layer 14 is located on the side of the pixel definition layer 13 away from the substrate 11, and the isolation layer 14 includes a plurality of A first isolation opening 14k1 and multiple second isolation openings 14k2, the first pixel opening 13k1 is connected to the corresponding first isolation opening 14k1, the first pixel opening 13k1 exposes the corresponding first electrode 121, the second pixel opening is connected to the corresponding second isolation opening 14k2, the second pixel opening exposes the corresponding first electrode 121; the first light-emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light-emitting device 2341 are at least located in the first isolation opening 14k1; the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device are at least located in the second isolation opening 14k2.

[0284] For example, the display substrate 110 may be an intermediate state or a final state obtained during the manufacturing process of the first display panel or the second display panel. This embodiment may be combined with some or all of the features of the above embodiments, and will not be described in detail here. The display substrate may be a display panel.

[0285] For example, in the first light-emitting device 2341, the second light-emitting device 2342 and the third light-emitting device 2343, one of the first electrode 121 and the second electrode 31 is an anode, and the other of the first electrode 121 and the second electrode 31 is a cathode. The embodiment of the present application is illustrated by taking the first electrode 121 as the anode and the second electrode 31 as the cathode.

[0286] For example, the display substrate 110 of the embodiment of the present application can be obtained using any of the above-mentioned display panel manufacturing methods. The display substrate 110 of the embodiment of the present application can have various implementations. The display substrate 110 of the embodiment of the present application can have a structure and film layer obtained using any of the above-mentioned display panel manufacturing methods. For example, the display substrate 110 can further include a third light-emitting device 2343 and a third encapsulation layer 43. The display substrate 110 of the embodiment of the present application has the same beneficial effects as the above-mentioned display panel manufacturing methods, and will not be further described here.

[0287] In some embodiments, the display substrate 110 further includes a second covering portion 14g, which is located on a side of the first covering portion 13g away from the base 11, and the orthographic projection of the mark 12m on the base 11 is located within the corresponding orthographic projection range of the second covering portion 14g on the base 11.

[0288] In some embodiments, the second covering portion 14 g is provided in the same layer and made of the same material as the isolation layer 14 .

[0289] In some embodiments, as Figures 15 to 23 As shown, the material of the second covering portion 14g includes a light-transmitting layer.

[0290] In some embodiments, the material of the light-transmitting layer includes a semiconductor metal oxide.

[0291] In some embodiments, the semiconducting metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide.

[0292] In some embodiments, the corrosion resistance of the material of at least a portion of the film layer of the second covering portion 14 g is greater than the corrosion resistance of the material of at least a portion of the film layer of the isolation layer 14 .

[0293] In some embodiments, the material of the second covering portion 14g includes titanium.

[0294] In some embodiments, the side of the mark 12m away from the substrate 11 does not have the same material as the light-emitting functional layer of the light-emitting device (for example, including the first light-emitting device 2341, the second light-emitting device 2342 and the third light-emitting device 2343) and the second electrode 31.

[0295] See also Figure 24 , Figure 24 A schematic diagram of a display device provided in an embodiment of the present application.

[0296] For the fourth aspect, please refer to Figure 24 Based on the same inventive concept, the present application also provides a display device 200, which includes a display panel manufactured by any one of the first display panel manufacturing methods described above, or the display device 200 includes a display panel manufactured by any one of the second display panel manufacturing methods described above, or the display device 200 includes a display substrate described in any one of the above.

[0297] For example, the display device 200 may be a mobile phone, a laptop computer, a television, a tablet computer, a wearable device, a vehicle-mounted display device, etc., but is not limited thereto.

[0298] The technical features of the above-mentioned embodiments can be arbitrarily combined or sub-combined. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0299] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming at least one mark on one side of the substrate; forming at least a portion of a protective layer on a side of at least one of the marks away from the substrate, wherein an orthographic projection of the mark on the substrate overlaps with an orthographic projection of the protective layer on the substrate, and the protective layer comprises a first covering portion and a second covering portion sequentially stacked in a direction away from the substrate; forming an isolation layer on one side of the substrate; The isolation layer is patterned to form a first isolation opening, wherein the corrosion resistance of the material of at least a portion of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least a portion of the film layer in the isolation layer, so as to ensure that the second covering portion is not etched away when the isolation layer is etched; forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device in the first isolation opening; patterning the isolation layer to form a second isolation opening; forming a second light-emitting functional layer, a second electrode and a second encapsulation layer of a second light-emitting device in the second isolation opening; Wherein, simultaneously with or after the step of patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion and retaining the first covering portion.

2. The method for manufacturing a display panel according to claim 1, wherein: Before the step of forming an isolation layer on one side of the substrate, the method for manufacturing the display panel further includes: forming a pixel definition layer, the pixel definition layer including the first covering portion, and the orthographic projection of the mark on the substrate overlaps with the orthographic projection of the first covering portion on the substrate.

3. The method for manufacturing a display panel according to claim 2, wherein: The second covering portion and the isolation layer are made of at least partially different materials or are arranged in different layers, and the second covering portion includes a light-transmitting layer, and the light-transmitting layer is made of a semiconductor metal oxide; The semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide.

4. The method for manufacturing a display panel according to claim 2, wherein: The material of the second covering portion includes titanium.

5. The method for manufacturing a display panel according to claim 2, wherein: The orthographic projection of the mark on the substrate overlaps with the orthographic projection of the second covering portion on the substrate; While patterning the isolation layer to form the first isolation opening, the method for manufacturing the display panel further includes: retaining the second covering portion; and / or, the number of film layers of the second covering portion is less than or equal to the number of film layers of the isolation layer; And / or, the second covering portion is a single metal film layer or a multi-layer film layer stacked along the thickness direction of the substrate; and / or, an overlapping area of ​​an orthographic projection of the first covering portion on the substrate and an orthographic projection of the second covering portion on the substrate overlaps with an orthographic projection of the mark on the substrate; And / or, the orthographic projection of the mark on the substrate is located within the orthographic projection of the first covering portion on the substrate, and the orthographic projection of the mark on the substrate is located within the orthographic projection of the second covering portion on the substrate; And / or, the first light-emitting device further includes a first electrode located between the substrate and the first light-emitting functional layer, and the mark is provided in the same layer as the first electrode of the first light-emitting device.

6. The method for manufacturing a display panel according to claim 1, wherein: The second light-emitting device is the light-emitting device manufactured last.

7. The method for manufacturing a display panel according to claim 1, wherein: After the step of forming the first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device in the first isolation opening and before the step of patterning the isolation layer to form the second isolation opening, the method further includes: The isolation layer is patterned to form a third isolation opening. Meanwhile, the method for manufacturing the display panel further includes: retaining the second covering portion and retaining the first covering portion; A third light-emitting functional layer, a second electrode and a third encapsulation layer of the third light-emitting device are formed in the third isolation opening.

8. The method for manufacturing a display panel according to claim 7, wherein: After the step of patterning the isolation layer to form the second isolation opening, the isolation layer includes an isolation structure, and the isolation structure is arranged around the first isolation opening, the second isolation opening, and the third isolation opening; The isolation structure is in a grid shape; The isolation structure includes a conductive material, the second electrode of the first light emitting device is electrically connected to the isolation structure, the second electrode of the second light emitting device is electrically connected to the isolation structure; and the second electrode of the third light emitting device is electrically connected to the isolation structure.

9. The method for manufacturing a display panel according to claim 8, wherein: The isolation structure includes a support portion and a crown portion stacked in sequence on the base in a direction away from the base, wherein the orthographic projection of the side of the support portion away from the base on the base is within the range of the orthographic projection of the crown portion on the base; The support portion includes a conductive material, and the second electrode of the first light-emitting device overlaps with a sidewall of the support portion surrounding the first isolation opening; The second electrode of the second light emitting device overlaps the side wall of the support portion surrounding the second isolation opening; The second electrode of the third light emitting device overlaps the side wall of the support portion surrounding the third isolation opening; The material of the support portion includes aluminum, and / or the material of the crown portion includes titanium.

10. The method for manufacturing a display panel according to claim 8, wherein: The isolation structure includes a support portion and a crown portion stacked in sequence on the substrate in a direction away from the substrate, and a pad portion located between the support portion and the substrate, wherein the orthographic projection of the side of the support portion away from the substrate on the substrate is located within the range of the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is located within the range of the orthographic projection of the pad portion on the substrate; The pad portion includes a conductive material, and the second electrode of the first light emitting device overlaps the pad portion surrounding the first isolation opening; The second electrode of the second light emitting device overlaps the pad portion surrounding the second isolation opening; The second electrode of the third light emitting device overlaps the pad portion surrounding the third isolation opening; And / or, the support portion includes a conductive material, and the second electrode of the first light-emitting device overlaps the pad portion surrounding the first isolation opening and the support portion; The second electrode of the second light emitting device overlaps the pad portion and the support portion surrounding the second isolation opening; The second electrode of the third light emitting device overlaps the pad portion and the support portion surrounding the third isolation opening; And / or, the material of the support portion includes aluminum, and / or, the material of the crown portion includes titanium, and / or, the material of the pad portion includes molybdenum.

11. The method for manufacturing a display panel according to claim 7, wherein: The first light emitting device, the second light emitting device and the third light emitting device emit different colors; The first light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, the second light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from the first light-emitting device, and the third light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from both the first light-emitting device and the second light-emitting device.

12. The method for manufacturing a display panel according to claim 7, wherein: The substrate includes a preset display area and a preset non-display area. The first light emitting device, the second light emitting device, and the third light emitting device are formed in the preset display area. The mark is formed in the preset non-display area.

13. A display device, characterized in that: A display panel manufactured by the method for manufacturing a display panel according to any one of claims 1 to 12.

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